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JPS6419756A - Electronic component having copper alloy lead - Google Patents

Electronic component having copper alloy lead

Info

Publication number
JPS6419756A
JPS6419756A JP62174964A JP17496487A JPS6419756A JP S6419756 A JPS6419756 A JP S6419756A JP 62174964 A JP62174964 A JP 62174964A JP 17496487 A JP17496487 A JP 17496487A JP S6419756 A JPS6419756 A JP S6419756A
Authority
JP
Japan
Prior art keywords
lead
solder
electronic component
copper alloy
wetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62174964A
Other languages
Japanese (ja)
Inventor
Isao Sato
Koji Serizawa
Aizo Kaneda
Hiroyuki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62174964A priority Critical patent/JPS6419756A/en
Publication of JPS6419756A publication Critical patent/JPS6419756A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent fused solder from sticking up through wetting and to improve the reliability of connection by a method wherein a solder resist layer is provided on the surface of a lead adjacent to the solder connecting part of the lead. CONSTITUTION:A solder resist layer 7 for preventing fused solder from sticking up through wetting is formed in a strip from on the surface of a lead 4 adjacent to a lead connecting part 5 of the copper alloy IC lead 4 projected from both side surfaces of an IC component 1. In this case, if a solder paste is ready- formed in advance on a land pattern 3, the fused solder is prevented from excessive sticking up through wetting to a shoulder part 8 of the lead 4 by the layer 7 even though there is a difference between the speeds of temperature rise of the lead 4 and the pattern 3 at the time of reflow of the solder and a sufficient fillet consisting of a solder 6b can be formed between the connecting part 5 of the lead 4 and the pattern 3. Accordingly, even though a copper alloy is used for the lead frame of an electronic component, the occurrence of defective soldering can be prevented. Thereby, the reliability of the connection between the electronic component and a wiring board can be remarkably improved.
JP62174964A 1987-07-15 1987-07-15 Electronic component having copper alloy lead Pending JPS6419756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62174964A JPS6419756A (en) 1987-07-15 1987-07-15 Electronic component having copper alloy lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62174964A JPS6419756A (en) 1987-07-15 1987-07-15 Electronic component having copper alloy lead

Publications (1)

Publication Number Publication Date
JPS6419756A true JPS6419756A (en) 1989-01-23

Family

ID=15987816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62174964A Pending JPS6419756A (en) 1987-07-15 1987-07-15 Electronic component having copper alloy lead

Country Status (1)

Country Link
JP (1) JPS6419756A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185754A (en) * 1989-12-14 1991-08-13 Nec Corp Semiconductor device
JPH04142765A (en) * 1990-10-04 1992-05-15 Nec Corp Lsi package
US5134368A (en) * 1987-09-21 1992-07-28 Hitachi, Ltd. Apparatus for magnetically detecting degradation of metal material using superconductor sensor system and reference material data comparison
JPH05343586A (en) * 1991-03-22 1993-12-24 Akira Kitahara Surface mounting component and manufacture thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219946A (en) * 1983-05-30 1984-12-11 Hitachi Ltd Solder overflow preventing device for flat pack part
JPS60249354A (en) * 1984-05-25 1985-12-10 Hitachi Ltd Lead frame structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219946A (en) * 1983-05-30 1984-12-11 Hitachi Ltd Solder overflow preventing device for flat pack part
JPS60249354A (en) * 1984-05-25 1985-12-10 Hitachi Ltd Lead frame structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5134368A (en) * 1987-09-21 1992-07-28 Hitachi, Ltd. Apparatus for magnetically detecting degradation of metal material using superconductor sensor system and reference material data comparison
JPH03185754A (en) * 1989-12-14 1991-08-13 Nec Corp Semiconductor device
JPH04142765A (en) * 1990-10-04 1992-05-15 Nec Corp Lsi package
JPH05343586A (en) * 1991-03-22 1993-12-24 Akira Kitahara Surface mounting component and manufacture thereof

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