JPS6412503A - Electronic component and manufacture thereof - Google Patents
Electronic component and manufacture thereofInfo
- Publication number
- JPS6412503A JPS6412503A JP62169031A JP16903187A JPS6412503A JP S6412503 A JPS6412503 A JP S6412503A JP 62169031 A JP62169031 A JP 62169031A JP 16903187 A JP16903187 A JP 16903187A JP S6412503 A JPS6412503 A JP S6412503A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- etching
- conducted
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To improve the dimensional accuracy of a film pattern by a method wherein a surface-roughing treatment is conducted only on the part where a grown film will be adhered on the surface of a substrate. CONSTITUTION:For example, a resist film 2 is formed on the region other than the film-forming part on the surface of the glass substrate 1 which is polished to the degree of approximate to mirror face by conducting a lithographic method, and the exposed part of the substrate is roughened by etching using fluoric acid. Then, a plating process is conducted in the state wherein the film 2 is left, a prescribed platinum film 3 is coated on the roughened region, and another prescribed film 3' is coated on the film 2 while the latter is being separated from the former. Subsequently, said film 3 is removed together with the film 3', and the required film 3 only is left on the substrate 1. Through these procedures, the required film pattern of a temperature sensor, for example, is obtained, the linearity of the etching for the remaining pattern becomes excellent in this case, the dimensional accuracy of the electronic part can be improved, and the generation of irregularity end the like of the value of resistance can also be prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62169031A JPS6412503A (en) | 1987-07-07 | 1987-07-07 | Electronic component and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62169031A JPS6412503A (en) | 1987-07-07 | 1987-07-07 | Electronic component and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6412503A true JPS6412503A (en) | 1989-01-17 |
Family
ID=15879038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62169031A Pending JPS6412503A (en) | 1987-07-07 | 1987-07-07 | Electronic component and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6412503A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009014264A1 (en) | 2007-07-25 | 2009-01-29 | Nippon Shokubai Co., Ltd. | Light-shielding film |
-
1987
- 1987-07-07 JP JP62169031A patent/JPS6412503A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009014264A1 (en) | 2007-07-25 | 2009-01-29 | Nippon Shokubai Co., Ltd. | Light-shielding film |
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