JPS59200444A - Epoxy resin sealed type semiconductor device - Google Patents
Epoxy resin sealed type semiconductor deviceInfo
- Publication number
- JPS59200444A JPS59200444A JP58075601A JP7560183A JPS59200444A JP S59200444 A JPS59200444 A JP S59200444A JP 58075601 A JP58075601 A JP 58075601A JP 7560183 A JP7560183 A JP 7560183A JP S59200444 A JPS59200444 A JP S59200444A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- resol type
- type phenol
- phenol group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明に硬化剤としてレゾール型フェノール系街脂に用
いたエポキシ樹脂封止型半導体装直に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin-sealed semiconductor device using a resol-type phenolic street resin as a curing agent.
C′nまでエポキシ樹脂と硬化剤としてノボラフ、り拗
フェノール系樹脂と葡無触媒あるいに硬化促進剤として
第5級アミン類、イミダゾール類、第4敏アンモニウム
垣めるいに儒慎金#4壕葡用いて封止した牛導体装置が
知らfている。crL覆過牛尋体装置には1百租性特に
耐湿性炉資求ざnてこγLまでに封止用材料としてにl
1ffi湿注の点でエポキシ樹脂の硬化剤とじてはノボ
ラック型ンエノール糸樹脂が一蝦゛に便用でnてきに0
この理由に、取焦水物殴化に比べて吸湿劣化が小さくし
ても製造Y「菓任、成形性に優几ているためである。Up to C'n, epoxy resin and novolaf as a curing agent, resin phenolic resin and no catalyst, and tertiary amines, imidazoles, and quaternary ammonium as curing accelerator. Cattle conductor devices sealed using trenches are known. CrL-covered cow body equipment requires 100% especially moisture-resistant furnace material and can be used as a sealing material up to γL.
1ffi In terms of wet injection, novolak-type enol thread resin is most convenient for epoxy resin hardening agents, and n times 0.
The reason for this is that even though the deterioration due to moisture absorption is smaller than that of the conventional method, it has better moldability.
しかしながらより信頼性の尚い側脂耐止型千導体装置が
要求さrしている昨今でに、従来のノボラック型2エノ
ール糸イ酊脂tでの萱ま用いるここができず洗伊等の工
程ン力幻χに数便用しているのが現状である。こnに側
崩材料甲すイオン性不純物葡できるかぎゃ抑えるためで
りジ、ノボラック系フェノール樹脂のせ成中に便用筋扛
る塩酸、硫酸もしくrI修敵等の触媒残留物に除去する
ためである。このためノボンックルノエノール系樹脂の
使用にコストの点でも非常に不利になってきている。However, in recent years, as more reliable side grease-resistant conductor devices are required, it is no longer possible to use the conventional novolac type 2-enol thread with a thick conductor. Currently, it is used several times in the process. In order to suppress any ionic impurities that may be present in the sidewall material, the residues of catalysts such as hydrochloric acid, sulfuric acid, or RI additives that are removed during the formation of the novolak phenolic resin are removed. It's for a reason. For this reason, the use of novonkurnoenol resins has become extremely disadvantageous in terms of cost.
本発明に以上の点に鑑みな芒Iしたものであり。The present invention has been developed in view of the above points.
レゾール型2エノール糸1(11i*で硬化剤とするエ
ポキシ樹脂組成物で半導俸索子葡納止した0と′3c特
徴とするエポキシ悄脂封止型牛専体装置に関し、信頼性
の^い牛専体装置に提供する。Resol type 2 enol yarn 1 (11i*) is an epoxy resin sealing type cattle-only device featuring semi-conducting cords sheathed with an epoxy resin composition using 11i* as a hardening agent. ^Provided with equipment exclusively for cattle.
レゾール型フェノール糸4B鹿の台j戊には、アイモニ
ア、消石灰などのアルカリ触媒孕用いるため佃脂組成?
!Iを製造しL場合、ノボラック型フェノール系側脂葡
使用した樹脂組成物が酸性となるのに比べて、中性〜弱
アルカリ性となり、牛導体装置のアルミニウム配線の腐
食に対して有利になる。The resol type phenolic yarn 4B Shikanodaijō uses alkali catalysts such as aimonia and slaked lime, so it has a tsukudai composition?
! When manufacturing I and L, the resin composition using novolac type phenolic side fat is acidic, whereas it is neutral to weakly alkaline, which is advantageous against corrosion of aluminum wiring of the conductor device.
しかもレゾール型フェノール系樹脂にその構造に水咳基
、メチロール基葡有しているπめエポキシ樹脂の硬化剤
であると同時に、樹脂そn目!が自硬化する。そn故ノ
ボラック型アエノール糸樹脂を便用しfc場合に比べて
、未反応物が極端に少l(lる。そしてcnらの理由に
よシ劇湿性、侶租性が向上する。What's more, it is a hardening agent for epoxy resins, which have a hydrophilic group and a methylol group in their structure, and is also a resin-type phenolic resin! is self-hardening. Therefore, compared to the case of using novolac type aenol thread resin, the amount of unreacted substances is extremely small.And, due to the reason of CN et al., the dryness and sludge properties are improved.
また不発明にひいてにレゾール型フェノール系a3脂の
分子量に800以上のもの忙5%〜25爪お%含むもの
が好ましい。こrし以下の揚会硬化性、耐熱性が低下す
る。In addition, it is preferable that the resol type phenolic A3 fat has a molecular weight of 800 or more in an amount of 5% to 25%. The hardening properties and heat resistance of the product decrease after being crushed.
本発明に通用でさるレゾール型フェノール系樹脂とじて
に、フェノール、クレゾール、キシレノール等のフェノ
ール類とホルムアルデヒドと孕アルカリ性触媒下で反尾
、丁ωごとQこより侍らnる縮合生成物であり、得ら7
Lるレゾール型樹脂の分子量′+c調整する方法に1上
記21ノール類とホルムアルデヒドのモル比と便用する
触媒ねと友によシコントロールがaJ打にでめる0−ま
た便用でさる触媒としては、アンモニア、消石灰、苛性
カリなどの御飯アルカリもしく儒こγしらの金属塩もし
くtacnら二線以上ンυF用することができる。合成
条件に、触媒種、触si。The resol-type phenolic resin that can be used in the present invention is a condensation product of phenols such as phenol, cresol, and xylenol, formaldehyde, and esters under an alkaline catalyst. et al7
To adjust the molecular weight '+c of the resol type resin, use the molar ratio of the 21-nors and formaldehyde mentioned above and the catalyst that is conveniently used. For example, ammonia, slaked lime, caustic potash, or other metal salts such as ammonia, slaked lime, caustic potash, etc. can be used. Synthesis conditions include catalyst species and catalysts.
モル比等により異なるため一概に決定できないが、縮合
生成物の判定に液体クロマドグ2フイにより容易に竹わ
n所望のレゾール型フェノール系樹脂か侍らnる〇
レソ゛−ル型フェノール@脂Cエポキシ4411it7
に対して0.6〜1.6当童配台するのが好ましい0不
発明に2いて適用できるエポキシ樹脂としてに1分子円
に2ヶ以上のエポキシ購孕苫む耽に公仰のエポキシ樹脂
全般孕意味するものでわL例えはビス2.cノールAと
エピクロルヒドリンとから得らnるビスフェノール糸エ
ホキシ樹脂、ノボ2ンク樹脂にエピクロルヒドリンを反
応させて侍らnるノボラック系エポキシ樹脂シクロヘキ
セン、シクロペンタジェン、ジシクロペンタジェンのよ
うな脂環式化合物から得らrLるエポキシ(MJ脂、ビ
ニルポリマーから倚らnるエポキシ樹脂、グリセリンの
ような多価アルコールから侍らnるエポキシ樹脂などか
めり。Although it cannot be definitively determined as it varies depending on the molar ratio, etc., it is easy to determine the condensation product using a liquid chroma dog.
It is preferable to use 0.6 to 1.6 epoxy resins for 0.6 to 1.6 epoxy resins. It means pregnancy in general.The analogy is screw 2. Bisphenol thread epoxy resin obtained from c-Nor A and epichlorohydrin, novolac epoxy resin obtained by reacting epichlorohydrin with Novo 2-ink resin, alicyclic compound such as cyclohexene, cyclopentadiene, and dicyclopentadiene. Epoxy resins obtained from polyhydric alcohols such as MJ resins, epoxy resins derived from vinyl polymers, and epoxy resins derived from polyhydric alcohols such as glycerin.
こnらの少l(とも一様が用いら扛る。A few of these people are not used.
不発明に用いらnるエポキシ樹脂組&すVこに、t4T
J述したエポキシ樹脂、レゾール型フェノール系樹脂の
他に心機に応じて無機光横剤、触媒、離型沖j、顔料、
六面処理剤、 ifJ撓化剤なとに配合すること+or
wヒである。有効なものとしてσ無機充填剤であるシリ
カ、ガラス繊維、アルミナ、触媒としてにベンジルジメ
チルアミンなどの6級アミン、イミダゾール、表面処理
剤としてはエポキシシランが好ましい〇
本発明に用いらILるエポキシ#脂組成物の製造法は該
エポキシ側脂訃よびレゾール型フェノール系樹脂と心安
に応じて上記元項剤触媒など飽加物を混廿しμmルニー
タ′−49がい做、−軸もしく儒二軸の混練押出機に用
いて従せする0便用する樹脂の軟化点におうして刀I]
隔加m<行なうが、その淵度に1oo″Cン超えないこ
とが望lしい。Uninvented epoxy resin set & t4T
In addition to the epoxy resins and resol-type phenolic resins mentioned above, inorganic light additives, catalysts, mold release agents, pigments,
Combine with hexagonal treatment agent, ifJ flexibility agent +or
It's lol. Effective ones include σ inorganic fillers such as silica, glass fiber, and alumina, catalysts such as 6-class amines such as benzyldimethylamine, imidazole, and surface treatment agents such as epoxy silane. 〇 IL epoxy used in the present invention The method for producing the fat composition is to mix the epoxy side fat and resol type phenolic resin with a saturate such as the above-mentioned agent catalyst according to the need for safety. Depending on the softening point of the resin used in the kneading extruder on the shaft,
It is preferable that the depth does not exceed 10''C.
不発明の牛導体装置Itrr、上呂cエポキシ悄脂示組
放物孕トランス21成形もしくに蚤イIJもしくacI
E、型噂)シくに圧縮成形法忙用いて封止きrシfこも
のであり、加#I硬化によp服終目的の凋止型牛専体装
置Jk葡侍ることができる。級化り米作としてf180
℃〜9 o’crz O〜50分、 11) 0〜1
20℃で20〜60分、150′C〜18U℃で60分
〜50分かもしくは15o〜180℃で直ちに級化して
もよい。Uninvented conductor device Itrr, Uro C epoxy resin display assembly parabolic transformer 21 molded or flea IJ or acI
E, model rumor) The compression molding method is often used to seal the product, and by adding curing, it is possible to use a stopper type dedicated device for the final purpose of clothing. f180 as graded rice crop
℃~9 o'crz O~50 minutes, 11) 0~1
Grading may be carried out at 20° C. for 20 to 60 minutes, at 150° C. to 18 U° C. for 60 minutes to 50 minutes, or immediately at 15° C. to 180° C.
本発明でのべる牛尋体装置とv、 s jθの1c。1c of the cow fat body device and v, s, jθ in the present invention.
LSI、トランジスタ、タイオート、+/イリスタ、ハ
イフリットICなとでりって、瞥ttC眠ださnるもの
でにない。When it comes to LSIs, transistors, tie autos, +/Iristors, and high frit ICs, it's hard to fall asleep at a glance.
以下本発明について実施例VC従い直切するか。The present invention will now be described directly in accordance with Example VC.
本@明七何ら制限するtのでr[ない。向、以ト
1谷例中に部とあるのに重重部葡意床する。Book @ Meishi There are no restrictions, so there is no. Toward, below
Even though it says ``part in one case'', it is a heavy duty part.
〔実施例1および比較例1〕
ホルムアルデヒド、フェノールをモル比1.08゜25
%アンモニアに溶液全触媒としフラスコでか@まぜなが
ら温度?11−めげ1M流しながら90℃で120分反
応させ、その後液温葡70℃に下けて減圧濃縮?I:1
20分行なった。その後常圧に炭し、105℃で15分
凝縮させてレノ−A[フェノール樹脂^孕得7co得ら
nたレゾール讃フェノール樹脂(4)の分子量分布の判
定にr[。[Example 1 and Comparative Example 1] Formaldehyde and phenol at a molar ratio of 1.08°25
% ammonia and the entire catalyst solution in a flask @ temperature while stirring? 11 - React at 90°C for 120 minutes while flowing 1M of Mege, then lower the temperature of the liquid to 70°C and concentrate under reduced pressure? I:1
It lasted 20 minutes. Thereafter, it was charcoalized to normal pressure and condensed at 105°C for 15 minutes to obtain Reno-A [phenolic resin].
東洋ンーダ社製の液体クロマドグ2アイ(H,L、C)
を開用し、カラムG5000HとG2p 00H葡組み
台わぜてその存在童葡御]足した0上記レゾール型フエ
ノール街脂(4)に対して比較としてホルムアルデヒド
、フェノールにモル比1.2、苛性ソーダヶ触媒として
94℃で110分反応させその後液温’に65℃に下け
て秋圧誕縮葡110分行なっり。その後常圧に戻し、1
05℃で20分濃縮してレゾール型フェノール樹脂の)
上寿た。得らfしたフェノール佃脂囚、(6)の分子量
?f−1111べると樹脂(8)にに分子量800以上
のものがほぼ7〜10%含まrして2す、樹脂(B)に
800以上が2〜6%であったO
得うt′した各レゾール型フェノール樹脂(8)、(B
)50部ticエピコート1011(シェル裂ビスフェ
ノール型エポキシ佃脂曲品名)100都、イミダゾール
C11Z(四国化成社製)1都、メタノール80部を加
えビー力で攪拌して、完全に溶解させて樹脂組成物(D
[11)にrl=成した0樹脂組成物(1)にレゾー
ル型フヱノール樹脂(5)に(*M例1 )、 (I
I)Hレゾール型フーノール衛脂(B)’r(比較例1
)便用している0こγしら樹脂組成物(1) (n)の
特性上表−1に示す0衣−1においてゲルタイムトニ、
J I S −C2104に規定さnている熱板ケ用い
150℃で流動性がなくなる時間で判定した。剰り二次
転移点の試料に、85℃で60分、110℃で20分乾
燥し、こR’に150℃で加圧成形(圧カフ0kg/a
11′)して硬化物を作成したO硬度の利足げシ冒アD
k用い、二次転移点1”I ’l’、M、A(Ther
malMechanical Analgsis) k
用いり。抽出液の作成に、上記硬化物上粉砕し121℃
、2気圧下で蒸留水によシ抽出した。Liquid Chroma Dog 2 Eye (H, L, C) manufactured by Toyoonda Co., Ltd.
Columns G5000H and G2p 00H were combined and their presence was added 0. For comparison with the above resol type phenol street resin (4), the molar ratio of formaldehyde to phenol was 1.2, caustic The reaction was carried out for 110 minutes at 94℃ as a soda catalyst, and then the temperature of the liquid was lowered to 65℃, and the autumn pressing was carried out for 110 minutes. After that, return to normal pressure,
Concentrate at 05℃ for 20 minutes to obtain resol type phenolic resin)
Jojuta. What is the molecular weight of the obtained phenol soybean paste (6)? When looking at f-1111, the resin (8) contained approximately 7 to 10% of molecules with a molecular weight of 800 or higher, and the resin (B) contained 2 to 6% of molecules with a molecular weight of 800 or higher. Each resol type phenolic resin (8), (B
) 50 parts of tic Epicoat 1011 (shell split bisphenol type epoxy Tsukuda) 100 parts, imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) 1 part, methanol 80 parts were added and stirred with bee force to completely dissolve the resin composition. Things (D
[11), rl = 0 resin composition (1), resol type phenol resin (5) (*M Example 1), (I
I) H-resol type Funol Sanitizer (B)'r (Comparative Example 1
) Gel Time Toni,
Judgment was made based on the time required for fluidity to disappear at 150°C using a hot plate as specified in JIS-C2104. A sample with a secondary transition point was dried at 85°C for 60 minutes and at 110°C for 20 minutes, and this R' was pressure molded at 150°C (pressure cuff 0 kg/a).
11') to create a cured product with a hardness of O
k, second-order transition point 1"I 'l', M, A (Ther
malMechanical Analgsis) k
Usage. To create an extract, grind the above cured product at 121°C.
, and extracted with distilled water under 2 atm.
樹脂組成物(1)に、硬度、二次転移点が(II)に比
べて晶(しかも抽出水浴液の粕果も良好である。The resin composition (1) has a crystalline hardness and a secondary transition point (in addition, the lees of the extracted water bath liquid is also good) compared to the resin composition (II).
〔比較例2〕
ホルマリン、フェノールにモル比a79. 塩酸、#:
酸忙触媒としフラスコで攪拌しながら80℃で90分、
100℃で60分谷還流下で反応させその俊減圧下で加
熱脱水して内容物の温度が160℃に達した時とQ出し
て、ノボ2ツク型フエノール側脂(Qに得た。このフェ
ノール樹脂(025都に実施例1および比較例1と同じ
くエポキシ樹脂エピコート1001に100都。[Comparative Example 2] Formalin to phenol molar ratio a79. hydrochloric acid,#:
Using an acidic catalyst and stirring in a flask at 80℃ for 90 minutes,
The reaction was carried out at 100°C for 60 minutes under reflux, then heated and dehydrated under reduced pressure. When the temperature of the contents reached 160°C, Q was removed to obtain a Novo 2-type phenol fat (Q). Phenol resin (025 to 100 to epoxy resin Epicoat 1001 as in Example 1 and Comparative Example 1).
イミダゾールC11Z11fi、)fi/−b150部
、忙〃口えて完全溶解し、樹脂組成物(ill)・・・
比較例2ヤr[成しfcOこの樹脂a放物(1)の特性
を表−1に併記する。比較9IJ2の樹脂組成gJ印〕
に実施例1に比べてゲルタイムに短かく、硬度。Imidazole C11Z11fi,) fi/-b 150 parts, completely dissolved in the mouth, and the resin composition (ill)...
Comparative Example 2 Characteristics of this resin a paraboloid (1) are also listed in Table 1. Comparison 9IJ2 resin composition gJ mark]
Compared to Example 1, the gel time was shorter and the hardness was lower.
二次転移点に同等であるが、抽出水の田が酸性で電気伝
導度も本発明に係わる樹脂組成物(*流側1)の約2倍
となっている。Although it is equivalent to the second-order transition point, the field of the extracted water is acidic and the electrical conductivity is about twice that of the resin composition according to the present invention (*flow side 1).
実施例1および比較例1〜2の倒瓶#!i放物(1)〜
(lit) k用いて、テストテッズ(アルミ配線パタ
ーン葡形成しfcもの)會封止し、その16頼性を評価
した。成形にあkってに、テストテッグの上に直接滴下
し、1m[11の厚みにI’l=成して85℃で50分
、110℃で20分Yf1.床俊、常圧150℃で50
分硬化した。crtらイ121℃、2気圧水蒸気下で放
直し配線の脳酬しベル葡試験した0記来を表−2に不丁
〇
表−2の結果よp%不発明による千4坏衾直(実施例1
)に耐湿性試験に対しても1夕めて強いことがわかる。# of fallen bottles in Example 1 and Comparative Examples 1 and 2! i parabola (1) ~
(Lit) K was used to seal Test Teds (FC type with aluminum wiring pattern formed), and its reliability was evaluated. After molding, drop it directly onto the testeg to a thickness of 1 m [11] and heat it at 85°C for 50 minutes and at 110°C for 20 minutes Yf1. Shun Toko, 50 at normal pressure 150℃
It was hardened. Table 2 shows the results of the wiring tests conducted at 121°C and 2 atmospheres of steam under 2 atmospheres of water vapor. Example 1
), it can be seen that it is resistant to moisture resistance tests even after one night.
〔実施例2及び比較例6〕
実施例1に2いて作成したレゾール型フェノール樹脂(
4)45部にEOCN102(日本化楽社製ノボラック
型エポキシ衛脂曲品名)100部触媒イミダゾールCl
72(四国化M、社製)1.5部、シリカ粉末600部
、カルナバワックス2部にクロえ、力ロ圧ニーダで60
℃20分間混練葡行ない半固型のエポキシ背脂組成物(
IV)(実施例2)忙作成した。比較例2でl’Fi成
しにノボ2ツク型フ工ノール1M脂(C)45部に、
夾m例2で用いた同−谷累材葡添りロした後60〜80
℃ノアIl′l熱ロールで6〜7分況練し冷却・粉砕し
てエポキシ樹脂m酸物〔■〕(比較例6)に作JRL
7Coこnらエポキシ樹脂組成物(IV) (V)に1
170℃〜180℃で2分、圧カフ0kg/an’で成
形し、その信頼性に実施例1と同しくテストチップで評
価した。縮釆欠表−6にボテ。試験方法に121℃2気
圧水蒸気下での放置である〇辰−6の柚来より本発明に
係わるエポキシ樹脂組成物によって封止さnた半導体装
TItに表−2の結果と同様耐湿試験に極めて良好でめ
ることがわ刀・る0
表−2
表−6
※2 分子は不良発生数1分母は全個数を示す。[Example 2 and Comparative Example 6] The resol type phenolic resin (2) prepared in Example 1
4) 45 parts to 100 parts of EOCN102 (product name of Novolac type epoxy resin manufactured by Nippon Kagakusha) catalyst imidazole Cl
72 (Shikokuka M, manufactured by Co., Ltd.) 1.5 parts, 600 parts of silica powder, 2 parts of carnauba wax, and mixed with a pressure kneader for 60 parts.
A semi-solid epoxy backfat composition (
IV) (Example 2) A busy work was done. In Comparative Example 2, 45 parts of Novo 2-type phenol 1M fat (C) was added to l'Fi,
60 to 80 after applying the same material used in Example 2
Kneaded for 6 to 7 minutes with a hot roll, cooled and crushed to make epoxy resin m-acid [■] (Comparative Example 6).
7 Cocon et al. Epoxy resin composition (IV) (V) to 1
It was molded at 170° C. to 180° C. for 2 minutes at a pressure cuff of 0 kg/an′, and its reliability was evaluated using a test chip as in Example 1. Reduced size table - 6 is voted. The test method was to leave it under water vapor at 121°C and 2 atm. Semiconductor devices TIt sealed with the epoxy resin composition according to the present invention from Tatsu-6 were subjected to a moisture resistance test similar to the results in Table 2. Extremely good quality Merugawa Sword 0 Table 2 Table 6 *2 The numerator is the number of defects and the denominator is the total number.
以上に示−Jeするように本発明の牛専体装置tは側温
性、信頼性に優nたものでおる。As shown above, the cattle-dedicated device t of the present invention has excellent side heat properties and reliability.
Claims (1)
キシ樹脂組成物で牛導体累子を封止したこと葡萄畝とす
るエポキシ衝脂封止型半導体装匝。1. An epoxy resin-sealed semiconductor package with a resol-type phenolic side fat and an epoxy resin composition as a hardening agent, which is used to seal conductor elements and grape ridges.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58075601A JPS59200444A (en) | 1983-04-27 | 1983-04-27 | Epoxy resin sealed type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58075601A JPS59200444A (en) | 1983-04-27 | 1983-04-27 | Epoxy resin sealed type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59200444A true JPS59200444A (en) | 1984-11-13 |
Family
ID=13580882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58075601A Pending JPS59200444A (en) | 1983-04-27 | 1983-04-27 | Epoxy resin sealed type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59200444A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH021754A (en) * | 1988-06-10 | 1990-01-08 | Hitachi Ltd | Phenol resin composition for molding and production thereof and semiconductor device sealed with the same composition |
JPH02245011A (en) * | 1989-03-17 | 1990-09-28 | Hitachi Ltd | Highly pure phenolic resin, composition containing same, its production, and electronic device made from the same resin |
-
1983
- 1983-04-27 JP JP58075601A patent/JPS59200444A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH021754A (en) * | 1988-06-10 | 1990-01-08 | Hitachi Ltd | Phenol resin composition for molding and production thereof and semiconductor device sealed with the same composition |
JPH02245011A (en) * | 1989-03-17 | 1990-09-28 | Hitachi Ltd | Highly pure phenolic resin, composition containing same, its production, and electronic device made from the same resin |
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