JPS5889942U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS5889942U JPS5889942U JP18477581U JP18477581U JPS5889942U JP S5889942 U JPS5889942 U JP S5889942U JP 18477581 U JP18477581 U JP 18477581U JP 18477581 U JP18477581 U JP 18477581U JP S5889942 U JPS5889942 U JP S5889942U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- case
- hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例における斜視図、第２図はそ
の平面図、第３図はその実施状態を示す断面図、第４図
は本考案の他の実施例における斜視図である。
１はケース、２は凸部、６は樹脂、７は凹部。Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view showing its implementation state, and Fig. 4 is a perspective view of another embodiment of the present invention. . 1 is a case, 2 is a convex portion, 6 is a resin, and 7 is a concave portion.
Claims (1)
ケース内に樹脂を注入して封止する混成集積回路装置に
おいて、前記ケースの内面にケース形成時深さ方向の凸
部あるいは凹部を少な（とも１つ一体成形して設けたこ
とを特徴とする混成集積回路装置。In a hybrid integrated circuit device in which a board on which electronic components are mounted is fixed to the inside bottom of the case and sealed by injecting resin into the case, a protrusion or a recess in the depth direction is formed on the inner surface of the case when forming the case. A hybrid integrated circuit device characterized by having a small number of integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18477581U JPS5889942U (en) | 1981-12-11 | 1981-12-11 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18477581U JPS5889942U (en) | 1981-12-11 | 1981-12-11 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5889942U true JPS5889942U (en) | 1983-06-17 |
Family
ID=29985229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18477581U Pending JPS5889942U (en) | 1981-12-11 | 1981-12-11 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5889942U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106876U (en) * | 1989-02-13 | 1990-08-24 | ||
| WO2014167820A1 (en) * | 2013-04-11 | 2014-10-16 | アンデン株式会社 | Electrical equipment device |
| WO2014171101A1 (en) * | 2013-04-15 | 2014-10-23 | アンデン株式会社 | Electrical device |
| JP2015162649A (en) * | 2014-02-28 | 2015-09-07 | 三菱電機株式会社 | semiconductor device |
| US10959333B2 (en) | 2018-12-19 | 2021-03-23 | Fuji Electric Co., Ltd. | Semiconductor device |
-
1981
- 1981-12-11 JP JP18477581U patent/JPS5889942U/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106876U (en) * | 1989-02-13 | 1990-08-24 | ||
| WO2014167820A1 (en) * | 2013-04-11 | 2014-10-16 | アンデン株式会社 | Electrical equipment device |
| JP2014207278A (en) * | 2013-04-11 | 2014-10-30 | アンデン株式会社 | Electric apparatus device |
| WO2014171101A1 (en) * | 2013-04-15 | 2014-10-23 | アンデン株式会社 | Electrical device |
| JP2014207360A (en) * | 2013-04-15 | 2014-10-30 | アンデン株式会社 | Electric apparatus device |
| JP2015162649A (en) * | 2014-02-28 | 2015-09-07 | 三菱電機株式会社 | semiconductor device |
| US10959333B2 (en) | 2018-12-19 | 2021-03-23 | Fuji Electric Co., Ltd. | Semiconductor device |
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