JPS5760090A - Supplying method for palladium to palladium-nickel alloy plating solution - Google Patents
Supplying method for palladium to palladium-nickel alloy plating solutionInfo
- Publication number
- JPS5760090A JPS5760090A JP55135623A JP13562380A JPS5760090A JP S5760090 A JPS5760090 A JP S5760090A JP 55135623 A JP55135623 A JP 55135623A JP 13562380 A JP13562380 A JP 13562380A JP S5760090 A JPS5760090 A JP S5760090A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- plating
- palladium
- crystalline
- aqueous ammonia
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 8
- 229910000990 Ni alloy Inorganic materials 0.000 title abstract 3
- 229910052763 palladium Inorganic materials 0.000 title abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 9
- 229910000069 nitrogen hydride Inorganic materials 0.000 abstract 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 3
- 238000009713 electroplating Methods 0.000 abstract 2
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
PURPOSE: To supply Pd to an aqueous ammonia soln. contg. a prescribed amount each of Pd and Ni as a plating soln. without interruption of the plating by directly addting crystalline Pd(NH3)4Cl2 to the soln. and carrying out the electroplating of a Pd-Ni alloy.
CONSTITUTION: Crystalline Pd(NH3)4Cl2 or Pd(NH3)4Cl2.H2 Ois added to a relating soln, plating soln. consist of an aqueous ammonia soln. contg. 5W30g/l Ni and the electroplating of a Pd-Ni alloy is carried out. The crystalline Pd salt is easily soluble in the plating soln. itself as well as in water and an aqueous ammonia soln. Accordingly, it is directly added even to a plating soln. with low ammonia concn., whereby the soln. can be reproduced without interrupting plating and increasing the amount of the soln. For example, where 5g Pd(NH3)4Cl2.H2O (2g as Pd) is charged into 1l plating soln. and agitated, it is throughly dissolved in 0.5W1min.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55135623A JPS5760090A (en) | 1980-09-29 | 1980-09-29 | Supplying method for palladium to palladium-nickel alloy plating solution |
IT49097/81A IT1171457B (en) | 1980-09-29 | 1981-08-12 | METHOD FOR REFURBISHING A PALLADIUM SOLUTION WITH PALLADIUM / NICKEL ALLOY |
GB8126690A GB2084192B (en) | 1980-09-19 | 1981-09-03 | A method of making a plating solution for electrodeposition of a palladium-nickel alloy |
DE3135597A DE3135597C2 (en) | 1980-09-29 | 1981-09-09 | Method of replenishing a palladium / nickel alloy plating solution with palladium |
FR8117487A FR2491093B1 (en) | 1980-09-29 | 1981-09-16 | PROCESS FOR RECHARGING A PALLADIUM ALLOY OF PALLADIUM AND NICKEL INTO PALLADIUM |
CH6108/81A CH647270A5 (en) | 1980-09-29 | 1981-09-22 | METHOD FOR SUPPLEMENTING OF BATH FOR electrolytic plating WITH A PALLADIUM / NICKEL ALLOY WITH PALLADIUM. |
SG22485A SG22485G (en) | 1980-09-19 | 1985-03-26 | A method of replenishing with palladium a plating solution for electrodeposition of a palladium-nickel alloy |
HK57485A HK57485A (en) | 1980-09-19 | 1985-08-01 | A method of replenishing with palladium a plating solution for electrodeposition of a palladium-nickel alloy |
MY8700009A MY8700009A (en) | 1980-09-19 | 1987-12-30 | A method of replenishing with palladium a plating solution for electrodeposition of a palladium-nickel alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55135623A JPS5760090A (en) | 1980-09-29 | 1980-09-29 | Supplying method for palladium to palladium-nickel alloy plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5760090A true JPS5760090A (en) | 1982-04-10 |
Family
ID=15156128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55135623A Pending JPS5760090A (en) | 1980-09-19 | 1980-09-29 | Supplying method for palladium to palladium-nickel alloy plating solution |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5760090A (en) |
CH (1) | CH647270A5 (en) |
DE (1) | DE3135597C2 (en) |
FR (1) | FR2491093B1 (en) |
IT (1) | IT1171457B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6192731A (en) * | 1984-10-12 | 1986-05-10 | Masanobu Nakamura | Manufacture of grooved rotating body |
US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
JPH02133595A (en) * | 1988-11-15 | 1990-05-22 | Fujitsu Ltd | Palladium plating method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB381931A (en) * | 1931-07-11 | 1932-10-11 | Mond Nickel Co Ltd | Improvements relating to electro-plating and the electrodeposition of metals |
JPS4733176B1 (en) * | 1967-01-11 | 1972-08-23 | ||
CH572989A5 (en) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp |
-
1980
- 1980-09-29 JP JP55135623A patent/JPS5760090A/en active Pending
-
1981
- 1981-08-12 IT IT49097/81A patent/IT1171457B/en active
- 1981-09-09 DE DE3135597A patent/DE3135597C2/en not_active Expired
- 1981-09-16 FR FR8117487A patent/FR2491093B1/en not_active Expired
- 1981-09-22 CH CH6108/81A patent/CH647270A5/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
JPS6192731A (en) * | 1984-10-12 | 1986-05-10 | Masanobu Nakamura | Manufacture of grooved rotating body |
JPH02133595A (en) * | 1988-11-15 | 1990-05-22 | Fujitsu Ltd | Palladium plating method |
Also Published As
Publication number | Publication date |
---|---|
CH647270A5 (en) | 1985-01-15 |
FR2491093B1 (en) | 1985-11-15 |
FR2491093A1 (en) | 1982-04-02 |
DE3135597A1 (en) | 1982-05-13 |
IT8149097A0 (en) | 1981-08-12 |
IT1171457B (en) | 1987-06-10 |
DE3135597C2 (en) | 1986-02-13 |
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