JPS5629338A - Resin sealing of semiconductor element - Google Patents
Resin sealing of semiconductor elementInfo
- Publication number
- JPS5629338A JPS5629338A JP10537179A JP10537179A JPS5629338A JP S5629338 A JPS5629338 A JP S5629338A JP 10537179 A JP10537179 A JP 10537179A JP 10537179 A JP10537179 A JP 10537179A JP S5629338 A JPS5629338 A JP S5629338A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- cavities
- burr
- knock
- projecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C2045/4057—Removing or ejecting moulded articles the ejecting surface being large with regard to the surface of the article
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To eliminate retention of deformation of a semiconductor element and of projected burr and pin burr thereof by using the entire bottom surface of a cavity as a knock-out unit. CONSTITUTION:The semiconductor element of a lead frame is retained between cavities 2, upper and lower dies are clamped, are heated, molten resin is introduced into the cavities 2 to be filled therein. After the resin is cured, knock-out unit 7 is projected from the entire bottom surface of the cavities 2 to thus urge out externally the semiconductor element sealed with resin from the cavities 2. Since the semiconductor element is thus urged out upon reception of projecting strses to the entire surface making contact with the knock-out unit 7, locan projecting stress may not be applied to the molded product. Accordingly, the molded product will not be deformed, nor retain projecting burr and pin burr.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10537179A JPS5629338A (en) | 1979-08-18 | 1979-08-18 | Resin sealing of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10537179A JPS5629338A (en) | 1979-08-18 | 1979-08-18 | Resin sealing of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5629338A true JPS5629338A (en) | 1981-03-24 |
Family
ID=14405834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10537179A Pending JPS5629338A (en) | 1979-08-18 | 1979-08-18 | Resin sealing of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5629338A (en) |
-
1979
- 1979-08-18 JP JP10537179A patent/JPS5629338A/en active Pending
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