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JPS5626457A - Connecting method for conductive terminal - Google Patents

Connecting method for conductive terminal

Info

Publication number
JPS5626457A
JPS5626457A JP10265579A JP10265579A JPS5626457A JP S5626457 A JPS5626457 A JP S5626457A JP 10265579 A JP10265579 A JP 10265579A JP 10265579 A JP10265579 A JP 10265579A JP S5626457 A JPS5626457 A JP S5626457A
Authority
JP
Japan
Prior art keywords
terminals
bent
wax material
wax
side edges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10265579A
Other languages
Japanese (ja)
Inventor
Teruo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP10265579A priority Critical patent/JPS5626457A/en
Publication of JPS5626457A publication Critical patent/JPS5626457A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To faciliate connection with ceramic packages by providing a belt-shaped wax material at the center of a metallic plate with fixed width and performing a punching process wherein pectinated terminals having the formed surface of the wax material are provided and bent in -shape at bridge sections. CONSTITUTION:A two-streak and belt-shaped wax material 2' is provided on a metallic plate 1' with fixed width in a longitudinal direction at equal intervals from a center. Side edges 9 and bridge sections 10 are left as they are and pectinated terminals 4' are formed at the side edges 9 by punching. The bridge sections 10 are bent in -shape. The middle part is bent in both side directions and rack sections 11 are provided. Ceramic packages 8 are racked on the rack sections 11 and a conductive section exposed to the both side faces and the wax material at the tips 3' of the terminals 4' are contacted and they are passed in a furnace for wax connection. It will be advantage if the space between both side edges 9 is a little narrower than the package width L'. In this composition, wax connection is easily performed and the occurrence of inferiority will also be reduced.
JP10265579A 1979-08-11 1979-08-11 Connecting method for conductive terminal Pending JPS5626457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10265579A JPS5626457A (en) 1979-08-11 1979-08-11 Connecting method for conductive terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10265579A JPS5626457A (en) 1979-08-11 1979-08-11 Connecting method for conductive terminal

Publications (1)

Publication Number Publication Date
JPS5626457A true JPS5626457A (en) 1981-03-14

Family

ID=14333245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10265579A Pending JPS5626457A (en) 1979-08-11 1979-08-11 Connecting method for conductive terminal

Country Status (1)

Country Link
JP (1) JPS5626457A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628644U (en) * 1985-06-27 1987-01-19
US5005282A (en) * 1988-05-25 1991-04-09 Schlumberger Industries Method of making an electronic memory card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628644U (en) * 1985-06-27 1987-01-19
JPH0546281Y2 (en) * 1985-06-27 1993-12-03
US5005282A (en) * 1988-05-25 1991-04-09 Schlumberger Industries Method of making an electronic memory card

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