Nothing Special   »   [go: up one dir, main page]

JPS5490083A - Method of evaluating single crystal - Google Patents

Method of evaluating single crystal

Info

Publication number
JPS5490083A
JPS5490083A JP15903677A JP15903677A JPS5490083A JP S5490083 A JPS5490083 A JP S5490083A JP 15903677 A JP15903677 A JP 15903677A JP 15903677 A JP15903677 A JP 15903677A JP S5490083 A JPS5490083 A JP S5490083A
Authority
JP
Japan
Prior art keywords
wafer
single crystal
dislocation
mum
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15903677A
Other languages
Japanese (ja)
Inventor
Kazutaka Terajima
Hitoshi Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15903677A priority Critical patent/JPS5490083A/en
Publication of JPS5490083A publication Critical patent/JPS5490083A/en
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To accomplish accurate evaluation of single crysals through an easy, definite detection of dislocation and compound dislocation in an InSb single crystal by selectvely applying an etching electrolyte composed of HF, H2O2 and H2O with a specified mixing ratio. CONSTITUTION:The surface of an InSb single crystal (III) is sliced into a wafer. The wafer thus obtained is polished and then smoothly etched to remove the material by about 80 mum. The wafer thus polished is etched at a room temperature by about 30 mum with an electrolyte composed of 49% HF, 30% H2O2 and H2O within a traingular region made by three points, (1:9:0), (9:1:0:) and (1:3:9:) in the illustrated ternary system. for example at a ratio of 1:2:2. Herein, the etching speed is about 1mum/sec. Then, the surface of the wafer thus treated is observed by an electron microscope. In this manner, compound dislocation can be easily and definitely detected. The composition of the electrolyte lies in the region made by three points, X, Y and Z in the drawing.
JP15903677A 1977-12-28 1977-12-28 Method of evaluating single crystal Pending JPS5490083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15903677A JPS5490083A (en) 1977-12-28 1977-12-28 Method of evaluating single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15903677A JPS5490083A (en) 1977-12-28 1977-12-28 Method of evaluating single crystal

Publications (1)

Publication Number Publication Date
JPS5490083A true JPS5490083A (en) 1979-07-17

Family

ID=15684838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15903677A Pending JPS5490083A (en) 1977-12-28 1977-12-28 Method of evaluating single crystal

Country Status (1)

Country Link
JP (1) JPS5490083A (en)

Similar Documents

Publication Publication Date Title
Duffy et al. Effects of high phosphorus concentration on diffusion into silicon
JPS5490083A (en) Method of evaluating single crystal
BYKOVSKII et al. Deposition of metal, semiconductor, and oxide films with a periodically pulsed CO 2 laser
JPS6468932A (en) Dry etching
JPS5650515A (en) Endpoint detecting method
JPS5645031A (en) Etching method
JPS5687339A (en) Manufacture of semiconductor device
JPS53125769A (en) Sputter etching method and container used for it
JPS57120672A (en) Plasma etching method
JPS5660017A (en) Control device for sample transference
JPS5387258A (en) Measuring device
JPS57202786A (en) Manufacture of zener diode
JPS57128943A (en) Insulation isolated semiconductor integrated device and manufacture thereof
JPS5651577A (en) Chemical etching method
JPS53106571A (en) Testing method of galllium aresenide semi-insulating substrate
JPS57100719A (en) Manufacture of semiconductor device
JPS56114330A (en) Etching method
JPS5325350A (en) Dicing method of semiconductor substrates
JPS57118644A (en) Manufacture of semiconductor device
JPS57100734A (en) Etching method for semiconductor substrate
JPS5286376A (en) Method of contact inspection for electric parts or like
JPS52100873A (en) Measurement of damage distribution by ion implantation
JPS5673443A (en) Induction type finding method for silicon wafer
JPS5352139A (en) Specimen supporting device
JPS561540A (en) Manufacture of semiconductor device