JPH1174147A - Ceramic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lessen a ceramic capacitor in thermal and mechanical stress by a method, wherein metal terminals which are each possessed of a turn-up part located at an intermediate point and a terminal which is located at the tip of the turn-up part and connected to the outside, and the one ends of the metal terminals are each connected to terminal electrodes provided in the opposing edge faces of the ceramic capacitor. SOLUTION: Metal terminals 2 and 3 are possessed of turn-up parts 22 and 32 at intermediate points respectively, and terminals 23 and 33 connected to the outside are provided in the tips of the turn-up parts 22 and 32. The ends 21 and 31 of the metal terminals 2 and 3 are connected to the terminal electrodes 11 and 12 of a ceramic capacitor device 1. At this point, a distance from the terminals 23 and 33 connected to an external conductor, such as a board or the like to the one ends 21 and 31 of the metal terminals 2 and 3 connected to the terminal electrodes 11 and 12 of the ceramic capacitor device 1, is expanded by the turn-up parts 22 and 32 provided to the intermediate points respectively. Furthermore, the turn-up parts 22 and 32 act as a spring respectively. As a result of this setup, the distortion and thermal expansion of a board are absorbed by the turn-up parts 22 and 32, so that thermal and mechanical stresses generated in the ceramic capacitor device 1 are reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a ceramic capacitor. The present invention relates mainly to a multilayer chip type ceramic capacitor suitable for use as a smoothing capacitor for a switching power supply.

[0002]

2. Description of the Related Art Heretofore, as a smoothing capacitor for a switching power supply, an aluminum electrolytic capacitor has been mainly used. However, market demands for miniaturization, improved reliability, and the like have increased, and in response to this, there has been an increasing demand for small, highly reliable ceramic capacitors.

In general, since heat is generated around the power supply, an aluminum substrate having good heat dissipation is used as the substrate. However, a temperature change around the power supply due to turning on / off of the power supply is large, and a large thermal stress is generated in the ceramic capacitor mounted on the aluminum substrate having a high coefficient of thermal expansion. This thermal stress causes cracks in the ceramic capacitor and causes problems such as short-circuit failure and ignition.

In order to eliminate troubles such as ignition, it is important to reduce thermal stress generated in a ceramic capacitor. As a means to reduce thermal stress,
No. 258, JP-A-4-171911 and JP-A-4-25920
No. 5 discloses a structure that prevents a ceramic capacitor from being directly soldered to an aluminum substrate by soldering a metal plate to a terminal electrode of the ceramic capacitor and mounting the metal plate on an aluminum substrate. I have.

Usually, in order to sufficiently absorb the thermal stress caused by expansion and contraction of the aluminum substrate, the leg portion of the metal plate from the terminal portion soldered to the aluminum substrate to the connection portion with the ceramic capacitor should be as small as possible. It needs to be longer. However, in the conventional product, when the length of the metal plate is lengthened, the height of the ceramic capacitor is inevitably increased. Therefore, the length of the metal plate leg is set to a size within the allowable height of the substrate. Need to be restricted to

For this reason, in the conventional product, the length of the legs of the metal plate cannot be increased, and if the product is used for a long time in an environment (-55 to 125.degree. In addition, cracks are generated near the ends of the ceramic capacitor, and there is a high risk of fire. There is a serious problem with respect to reliability.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a ceramic capacitor which can surely prevent cracks, breakage and the like from occurring in a ceramic capacitor element.

Another object of the present invention is to provide a ceramic capacitor capable of reducing thermal stress and mechanical stress in a ceramic capacitor element.

Another object of the present invention is to provide a ceramic capacitor in which the length of a metal terminal from a substrate side terminal portion to a ceramic capacitor element mounting portion is increased without increasing the height. .

[0010]

To solve the above-mentioned problems, a ceramic capacitor according to the present invention includes at least one ceramic capacitor element and at least one pair of metal terminals. The ceramic capacitor element has terminal electrodes on opposite side end faces.

Each of the metal terminals has one end connected to one of the terminal electrodes, and has a folded portion at an intermediate portion.
A terminal portion connected to the outside is provided at the end of the folded portion.

[0012] In the ceramic capacitor according to the present invention, each of at least one pair of metal terminals includes:
One end is connected to one of the terminal electrodes of the capacitor element,
A folded portion is provided at the intermediate portion, and a terminal portion connected to the outside is provided at the end of the folded portion. In the metal terminal having such a structure, the length from the terminal portion connected to the external conductor such as the substrate to one end connected to the terminal electrode of the ceramic capacitor element is provided in the intermediate portion by the folded portion provided in the intermediate portion. It is enlarged by the turned back part. In addition, the folded portion has a kind of spring action. Therefore, it is possible to reliably absorb the deflection and thermal expansion of the substrate, reduce the mechanical stress and the thermal stress generated in the ceramic capacitor element, and prevent the ceramic capacitor element from cracking. Therefore, even when used as a smoothing capacitor for a switching power supply, which is often mounted on an aluminum substrate, it is possible to avoid the occurrence of cracks and the danger of ignition caused by the cracks.

Further, the bending and thermal expansion of the substrate are absorbed by the folded portion provided on the metal terminal so as to prevent mechanical stress and thermal stress from being generated in the ceramic capacitor element. Can be avoided. For this reason, for the metal terminals, the length from the substrate side terminal portion to the ceramic capacitor element mounting portion is increased without increasing the height, the absorbing effect on the bending and thermal expansion of the substrate is improved, and the ceramic capacitor element is used. The generated mechanical stress and thermal stress can be reduced.

Other objects, configurations and advantages of the present invention will be more specifically described with reference to the accompanying drawings. The accompanying drawings merely show examples.

[0015]

FIG. 1 is a front view of a ceramic capacitor according to the present invention, and FIG. 2 is a front sectional view of the ceramic capacitor shown in FIG. The illustrated ceramic capacitor includes one ceramic capacitor element 1 and a pair of metal terminals 2 and 3. The ceramic capacitor element 1 has terminal electrodes 11 and 12 on both end surfaces facing each other in the direction of the length L.

Referring to FIG. 2, the ceramic capacitor element 1 has a large number (for example, 100 layers) of internal electrodes 101 and 102 inside a ceramic dielectric substrate 100. One end of the internal electrode 101 is connected to the terminal electrode 11,
The other end is an open end, one end of the internal electrode 102 is connected to the terminal electrode 12, and the other end is an open end. The constituent materials of the terminal electrodes 11 and 12, the internal electrodes 101 and 102, and the ceramic dielectric substrate 100, the manufacturing method thereof, and the like are well known.

Preferably, the internal electrode 101 is formed such that a gap ΔL 1 is generated between the open end thereof and the terminal electrode 12. The internal electrode 102 has an open end and a terminal electrode 1.
1 so that an interval ΔL2 is generated. The intervals ΔL1 and ΔL2 are given by the shortest distance between the open ends and the terminal electrodes 11 and 12. Specifically, the interval △ L1
The line segment S11 drawn in the thickness direction of the ceramic dielectric substrate 100 from the tip of the hanging portion 121 attached to the front and back surfaces of the ceramic dielectric substrate 100 in the terminal electrode 12, and the line segment S11 It is given as an interval between the ceramic dielectric substrate 100 and a line segment S12 drawn in the thickness direction. The interval ΔL2 is a line segment S21 drawn in the thickness direction of the ceramic dielectric substrate 100 from the tip of the hanging portion 111 attached to the front and back surfaces of the ceramic dielectric substrate 100, among the terminal electrodes 11, and the open end. From the tip of the ceramic dielectric substrate 100 in the thickness direction of the ceramic dielectric substrate 100.

In FIG. 2, the ceramic capacitor element 1 has a horizontal arrangement in which the electrode surfaces of the internal electrodes 101 and 102 are parallel to the horizontal plane. The ceramic capacitor element 1 is rotated by about 90 degrees from the position shown in FIG. And internal electrode 1
The vertical arrangement may be such that the electrode surfaces of 01 and 102 are perpendicular to the horizontal plane.

The metal terminal 2 has one end 21 connected to the terminal electrode 11, a folded portion 22 at an intermediate portion, and a terminal portion 23 connected to the outside beyond the folded portion 22. The metal terminal 3 also has one end 31 connected to the terminal electrode 12, a folded portion 32 at an intermediate portion, and a terminal portion 33 connected to the outside beyond the folded portion 32. The metal terminals 2 and 3 are made of a material having low electric resistance and excellent spring properties. A representative example is a phosphor bronze plate material. The thickness is not limited, but is typically about 0.1 mm.

One ends 21 and 31 of the metal terminals 2 and 3 are connected to terminal electrodes 11 and 12 by bonding materials 4 and 5.

FIG. 3 is a partial sectional view showing a state when the ceramic capacitor shown in FIGS. 1 and 2 is mounted on a circuit board. The ceramic capacitor is mounted on the circuit board 70. Conductive patterns 71 and 72 are provided on the surface of the circuit board 70. The terminal portion 23 of the metal terminal 2 provided on the ceramic capacitor is
The terminal portion 33 of the metal terminal 3 is soldered to the conductor pattern 71 by solder 82.
Soldered to.

Here, in the ceramic capacitor according to the present invention, at least one pair of metal terminals 2, 3
Are connected to the terminal electrodes 11 and 12 of the ceramic capacitor element 1 at one ends 21, 31 and have folded portions 22 and 32 at an intermediate portion, and a terminal connected to the outside beyond the folded portions 22 and 32. Parts 23 and 33 are provided. The metal terminals 2 and 3 having such a structure are connected to the terminal electrodes 11 of the ceramic capacitor element 1 from the terminal portions connected to the external conductor such as the substrate by the folded portions 22 and 32 provided at the intermediate portion.
The length (height) to one end connected to 12 is enlarged by the folded portions 22 and 32 provided at the intermediate portion.

For example, with reference to the terminal portions 23 and 33,
The height to the connection position of the metal terminals 2 and 3 by the joining materials 4 and 5 is the component height H in the conventional case without the folded portions 22 and 32, but in the present invention, the folded portion 2 is
The path length h to the top of 2, 32 becomes the length, and the height dimension is greatly increased. By adjusting the positions of the tops of the folded portions 22 and 32, the path length h can be suppressed to be lower than the component height H allowed for the ceramic capacitor having the entire length L.

Moreover, the folded portions 22, 32 have a kind of spring action. Therefore, the bending and thermal expansion of the circuit board 70 are absorbed by the spring action of the folded portions 22 and 32, and the mechanical stress and the thermal stress generated in the ceramic capacitor element 1 can be reduced. By selecting the structure and shape of the folded portions 22 and 32,
The distance between the terminal portions 23 and 33 attached to the circuit board 70 and the attachment portions to the terminal electrodes 11 and 12 of the ceramic capacitor element 1 is set to be two to five times longer than in the past, and cracks occur in the ceramic capacitor element 1. Can be prevented. For this reason, even when used as a smoothing capacitor for a switching power supply, which is often mounted on the aluminum circuit board 70, it is possible to avoid the occurrence of cracks and the danger of fire resulting from the cracks.

The bending and thermal expansion of the circuit board 70 are absorbed by the folded portions 22 and 32 provided on the metal terminals 2 and 3, and the folded portions 22 and 32 prevent the height from being increased. it can. In the case of the embodiment,
The path length h that exerts the spring action is determined by the folded portion 22,
By adjusting the position of the top of the ceramic capacitor 32, it is possible to keep the overall length L lower than the component height H of the ceramic capacitor. For this reason, with respect to the metal terminals 2 and 3, without increasing the component height H, the terminal portion 23 on the circuit board 70 side
33, the path length h from the mounting portion of the ceramic capacitor element is increased.
Of the ceramic capacitor element 1 can be reduced, and the mechanical stress and the thermal stress generated in the ceramic capacitor element 1 can be reduced.

The folded portions 22 and 33 are located at positions where the tops are lower than the tops of the ceramic capacitor element 1. That is, h <H. With such a structure, the component height H can be kept low.

Metal terminals 2 and 3 and terminal electrodes 11 and 12
As the joining materials 4 and 5 for joining the conductive materials, a resin-containing conductive adhesive or solder can be used. According to the connection structure in which the metal terminals 2 and 3 and the terminal electrodes 11 and 12 are connected by the bonding members 4 and 5 made of a conductive adhesive containing a resin, since almost no thermal shock is applied, the ceramic capacitor before use is used. There is no danger that the element 1 has a crack. Therefore, the reliability is improved.

The conductive adhesive desirably contains silver particles as a conductive component. When the particles are silver particles, the conductivity can be improved. In particular, flat silver particles having a particle diameter of 3 μm or more are preferable. With silver particles having such a particle size and shape, the filling amount of silver particles in the resin can be increased, and good conductivity can be secured. However, if the particle size of the silver particles is too large, the dispersibility in the resin becomes worse and the adhesive strength is reduced. Therefore, it is necessary to determine the maximum particle size of the silver particles to be used in consideration of the adhesive strength.

The ceramic capacitor according to the present invention comprises:
Since it is used in a wide temperature range of 55 to 125 ° C., a thermosetting resin having stable temperature resistance characteristics in such a temperature range is suitable as a resin constituting the conductive adhesive. ing. Specifically, epoxy resin type,
Examples include urethane resin-based, polyimide resin-based, or acrylic resin-based thermosetting resins.

Metal terminals 2 and 3 and terminal electrodes 11 and 12
May be used as the bonding materials 4 and 5 for connecting the above, in addition to the conductive adhesive described above. A solder having a melting point of 200 ° C. or more and 400 ° C. or less is particularly suitable.

As shown in FIG. 3, when the ceramic capacitor is soldered to the circuit board 70, a soldering process is performed at a temperature of about 200.degree. In this soldering process, the metal terminals 2, 3 and the terminal electrodes 11, 12
The joining materials 4, 5 connecting the two must not melt. Therefore, it is necessary to use solder having a melting point of 250 ° C. or more as the bonding materials 4 and 5.

However, when solder having a melting point of 400 ° C. or more is used as the joining materials 4 and 5, when the metal terminals 2 and 3 are soldered to the terminal electrodes 11 and 12, the ceramic capacitor element 1 is heated to 400 ° C. or more. Is applied, and a thermal crack occurs in the ceramic capacitor element 1. Therefore, a solder having a melting point of 400 ° C. or less is used.

When solder is used as the joining materials 4 and 5, the metal terminals 2 and 3 have non-adhesiveness to the solder at least on the surface opposite to the external connection surfaces of the terminal portions 23 and 33. It is preferable to have a coating film. This will be described with reference to FIG.

In the embodiment shown in FIG. 4, the base 200 is made of a plate made of phosphor bronze or an iron-nickel alloy or the like, and the external connection surface side (outside) to be soldered to the outside is: A metal film 201 having good solderability is provided, and a coating film 202 to which no solder adheres or which is difficult to adhere is adhered to the inside on the opposite side. When such metal terminals 2 and 3 are used, solder does not adhere to the surfaces of the terminal portions 23 and 33 as shown in FIG. The space is not filled with solder. Therefore, the spring properties of the metal terminals 2 and 3 are not impaired.

The coating film 202 to which the solder does not adhere or hardly adheres may be applied over the entire length of the metal terminals 2 and 3 or may be applied partially including the terminal portions 23 and 33. Good. The coating film 202 may be formed of a metal oxide film or one selected from wax, resin, or silicone oil. As a means for forming the metal oxide film, a metal film which is easily oxidized on the surface of the base 200, for example, Ni
Alternatively, a method in which Cu or the like is adhered by plating and oxidized by natural leaving or the like can be adopted. The metal film 201
It can be configured as a plating film of Sn or Pb-Sn.

The description will be continued with reference to FIGS. 1 and 2 again.
The terminal portions 23 and 33 are arranged at intervals below the ceramic capacitor element 1. With such a structure, an increase in the area occupied by the substrate due to the terminal portions 23 and 33 can be suppressed, and a capacitor with a minimum mounting area can be obtained.

In the ceramic capacitor shown in FIGS. 1 and 2, the folded portion 22 of the metal terminal 2 includes a first bent portion 221 and a second bent portion 222.
The first bent portion 221 is bent in a direction away from the terminal electrode 11, and the second bent portion 222 is bent at a distance from the first bent portion 221 in a direction parallel to the end face. The portion of the metal terminal 2 from the tip to the first bent portion 221 is connected to the terminal electrode 11.

Similarly, the folded portion 32 of the metal terminal 3 is
It includes a first bent portion 321 and a second bent portion 322. The first bent portion 321 is bent in a direction away from the terminal electrode 12, and the second bent portion 322 is bent at a distance from the first bent portion 321 in a direction parallel to the end face. The metal terminal 3 is first
The portion reaching the bent portion 321 is connected to the terminal electrode 12.

According to the above structure, the first bent portion 221,
321, the second bent portions 222 and 322 to the terminal portion 23,
The part that reaches 33 has a spring action,
The spring action can absorb the deflection and thermal expansion of the substrate.

The metal terminal 2 has a third bent portion 223. The third bent portion 223 includes the folded portion 22 and the terminal portion 23.
And partition. In addition, the metal terminal 3 has a third bent portion 32.
3 The third bent part 323 partitions the folded part 32 and the terminal part 33. Therefore, the first bent portion 221,
The portion from 321 to the third bent portions 223 and 323 is
It comes to have a spring action, and the deflection and thermal expansion of the substrate can be absorbed by the spring action.

The metal terminals 2 and 3 are bent at the third bent portions 223 and 323 in a direction in which the terminal portions 23 and 33 approach the ceramic capacitor element 1. The terminal portions 23 and 33 of the metal terminals 2 and 3 are arranged at intervals G01 and G02 below the ceramic capacitor element 1, thereby suppressing an increase in the area occupied by the substrate due to the terminal portions 23 and 33. The mounting area is minimized.

Further, a gap ΔL1 is generated between the open end of the internal electrode 101 and the terminal electrode 12, and the internal electrode 102
In the case of the structure in which the gap ΔL2 is generated between the open end of the metal terminal and the terminal electrode 11, the interface between the metal terminal and the conductive adhesive, which is liable to crack, break, etc., and the conductive adhesive There is no overlap between the internal electrodes 101 and 102 near the application area. For this reason, the risk of a short circuit due to a crack and the occurrence of ignition or the like due to the short circuit is drastically reduced.

In FIGS. 1 and 2, the first bent portion 2
The first and second bent portions 222 and 322 are bent at substantially 90 degrees, but may be formed at angles other than 90 degrees. Further, the first bent portions 221 and 321 and the second bent portions 222 and 322 may be bent into a shape having no definite angle, for example, an arc shape.

FIG. 5 is a front view showing another embodiment of the ceramic capacitor according to the present invention. In the drawings, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, the joining materials 4 and 5 containing a resin are partially attached to the terminal electrodes 11 and 12. With such a structure, the path length h causing the spring action is determined by the path length h1 from the terminal portions 23 and 33 to the second bent portions 222 and 322 and the first bent portion 22.
A value (h = h1 + h2) obtained by adding the path length h2 from 1, 321 to the attachment portion. This path length h is larger than the dimension of the component height H. Therefore, the metal terminals 2, 3
For the board-side terminal portion 2 without increasing the component height H.
The path length h from 3, 33 to the ceramic capacitor element mounting portion can be increased, and the effect of absorbing substrate flexure and thermal expansion can be improved.

FIG. 6 is a front view showing another embodiment of the ceramic capacitor according to the present invention. In the drawings, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

The metal terminal 2 is connected to the first bent portion 2
21 has another bent portion 224, and the portion extending from the other bent portion 224 to the first bent portion 221 is opposed to the side end surface of the ceramic capacitor element 1 with a gap G1 therebetween. And another bent portion 224 is connected to the terminal electrode 11. The metal terminal 3 has another bent portion 324 at a portion from the tip portion to the first bent portion 321, and a portion from another bent portion 324 to the first bent portion 221 has an interval G2 with the side end face. The distal end portion and another bent portion 32 facing each other at a distance
4 is connected to the terminal electrode 12.

According to this structure, another bent portion 224, 3
The portion from 24 to the third bent portions 223 and 323 has a spring action, and the length of the spring action is increased, so that the action of absorbing the deflection and thermal expansion of the substrate is further increased. In the case of the embodiment, the path length h at which the spring action occurs is determined by the path length h1 ≦ H from the terminal portions 23 and 33 to the second bent portions 222 and 322 and the path length h1 from the first bent portions 221 and 321 to the mounting portion. Path length h2
(H = h1 + h2). This path length h
Is larger than the dimension of the component height H. Therefore, for the metal terminals 2 and 3, the path length h from the board-side terminal portions 23 and 33 to the ceramic capacitor element mounting portion is increased without increasing the component height H, and the bending and thermal expansion of the board are absorbed. Can be improved.

FIG. 7 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention, and FIG. 8 is a front view of the ceramic capacitor shown in FIG. The ceramic capacitor shown in this embodiment includes two ceramic capacitor elements 110 and 120. The ceramic capacitor elements 110 and 120 are sequentially laminated, and the terminal electrode 1
1 and 12 are connected in parallel by bonding materials 4 and 5. The terminal portions 23 and 33 of the metal terminals 2 and 3 are spaced apart from each other by a distance G0 below the lowermost ceramic capacitor element 120 of the ceramic capacitor elements 110 and 120.
1 and G02, so that an increase in the area occupied by the terminals 23 and 33 on the substrate is suppressed, and the mounting area is minimized.

Folded portions 22, 32 of metal terminals 2, 3
Are the first bent portions 221 and 321 and the second bent portion 22
2, 322. The first bent portions 221 and 321 are bent in a direction away from the terminal electrodes 11 and 12, and the second bent portions 222 and 322 are bent in the first bent portion 2.
21 and 321, and are bent in a direction parallel to the side end surfaces of the ceramic capacitor elements 110 and 120.

In each of the metal terminals 2, 3, a portion extending from the tip to the first bent portion 221, 321 is connected to terminal electrodes 11, 12 formed on the side end surfaces of the ceramic capacitor elements 110, 120. I have. For the connection between the metal terminals 2 and 3 and the terminal electrodes 11 and 12 and the interconnection between the ceramic capacitor elements 110 and 120, bonding materials 4 and 5 made of a conductive adhesive containing solder or resin are used.

According to the embodiment shown in FIGS. 7 and 8,
In addition to the functions and effects described with reference to FIGS.
A large capacitance obtained by adding the capacitance values of the two ceramic capacitor elements 110 and 120 can be obtained.

FIG. 9 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention, and FIG. 10 is a front view of the ceramic capacitor shown in FIG. In the figure, the same components as those in FIGS. 7 and 8 are denoted by the same reference numerals. In this embodiment, each of the metal terminals 2 and 3 has a portion from the tip to the first bent portion 221 or 321 connected to only the terminal electrodes 11 and 12 formed on the side end surfaces of the ceramic capacitor element 110. ing. According to this embodiment, the same operation and effect as those of the embodiment shown in FIGS. 7 and 8 can be obtained.

FIG. 11 is a front view showing still another embodiment of the ceramic capacitor according to the present invention. In the figure,
The same components as those in FIGS. 7 to 10 are denoted by the same reference numerals. In this embodiment, each of the metal terminals 2 and 3 has a portion from the tip to the first bent portion 221 or 321 connected to only the terminal electrodes 11 and 12 formed on the side end surfaces of the ceramic capacitor element 120. ing.

In this embodiment, the path length h for generating the spring action is determined by the second bent portion 2 from the terminal portions 23 and 33.
22, the path length h1 to the first bent portion 22
A value (h = h1 + h2) obtained by adding the path length h2 from 1, 321 to the attachment portion. Therefore, the metal terminals 2, 3
With respect to the above, the path length h from the substrate side terminal portions 23, 33 to the ceramic capacitor element mounting portion is increased, the bending action of the substrate and the action of absorbing thermal expansion are improved, and the mechanical stress generated in the ceramic capacitor elements 110, 120 is reduced. And thermal stress can be reduced.

FIG. 12 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention. In the figure,
8 to 11 are denoted by the same reference numerals. In this embodiment, the metal terminals 2 and 3 are provided at the middle portions in the width direction of the folded portions 22 and 32 by the cutout portions 22.
5, 325. Such cutouts 225, 3
When there is 25, the heat conduction from the metal terminals 2 and 3 to the ceramic capacitor elements 110 and 120 decreases, so that the thermal stress in the ceramic capacitor elements 110 and 120 can be reduced. In addition, since the rigidity of the metal terminals 2 and 3 is reduced, a spring action suitable for absorbing the bending and thermal expansion of the substrate can be obtained.

FIG. 13 is a front view showing still another embodiment of the ceramic capacitor according to the present invention. In the figure,
8 to 12 are denoted by the same reference numerals. In this embodiment, each of the metal terminals 2 and 3 has a portion from the tip to the first bent portion 221 or 321 connected to only the terminal electrodes 11 and 12 formed on the side end surfaces of the ceramic capacitor element 110. ing. The path length h that causes the spring action is the length from the terminal portions 23 and 33 to the second bent portions 222 and 322. Therefore, when the terminal portions 23 and 33 are used as a reference, the bonding materials 4 and 5
Is a path length h larger than the conventional height h0 (see FIG. 1 and the like) having no folded portions 22 and 32. For this reason, the bending action of the substrate and the action of absorbing the thermal expansion are improved, and the mechanical stress generated in the ceramic capacitor elements 110 to 140, and
Thermal stress can be reduced.

FIG. 14 is a front view showing another embodiment of the ceramic capacitor according to the present invention. Each of the metal terminals 2, 3 has another bent portion 224, 324 in a portion extending from the tip end portion to the first bent portion 221.
4 and 324 to the first bent portion 221 are spaced from the side end surfaces of the ceramic capacitor elements 110 and 120 by a distance G.
1, opposite to G2, the tip and another bent portion 224,
324 is connected to the terminal electrodes 11 and 12.
More specifically, in the metal terminal 2, a portion between the tip portion and another bent portion 224 is arranged between the terminal electrode 11 of the ceramic capacitor element 110 and the terminal electrode 11 of the ceramic capacitor element 120, Terminal electrode 1 by a bonding material 4 made of a conductive adhesive containing
1 and 11 are connected and fixed. In the metal terminal 3,
A portion between the tip portion and another bent portion 324 is disposed between the terminal electrode 12 of the ceramic capacitor element 110 and the terminal electrode 12 of the ceramic capacitor element 120, and is made of a conductive adhesive containing solder or resin. The bonding material 5 is connected and fixed to the terminal electrodes 12, 12.

The path length h causing the spring action is determined by the path length h1 from the terminal portions 23 and 33 to the second bent portions 222 and 322 and the path length h1 from the first bent portions 221 and 321 to the other bent portions 224 and 324. (H = h)
h1 + h2). Therefore, for the metal terminals 2 and 3, the path length h from the substrate side terminal portions 23 and 33 to the ceramic capacitor element mounting portion is increased, the bending and thermal expansion of the substrate are improved, and the ceramic capacitor elements 110 and 120 are improved. Mechanical stress and thermal stress generated in the substrate.

FIG. 15 is a front view showing another embodiment of the ceramic capacitor according to the present invention. In this example,
In the metal terminal 2, a joining material made of a conductive adhesive containing solder or resin is arranged so as to receive a terminal electrode 11 of the lowermost ceramic capacitor element 110 between a tip portion and another bent portion 224. 4 is connected and fixed to the terminal electrode 11. In the metal terminal 3, a portion between the tip portion and another bent portion 324 is arranged to receive the terminal electrode 12 of the ceramic capacitor element 110,
Material 5 made of conductive adhesive containing solder or resin
Thus, it is connected and fixed to the terminal electrode 12.

The path length h causing the spring action is determined by the path length h1 from the terminal portions 23 and 33 to the second bent portions 222 and 322, and the path length h from the first bent portions 221 and 321 to the other bent portions 224 and 324. (H = h)
h1 + h2). Therefore, for the metal terminals 2 and 3, the path length h from the substrate side terminal portions 23 and 33 to the ceramic capacitor element mounting portion is increased, the bending and thermal expansion of the substrate are improved, and the ceramic capacitor elements 110 and 120 are improved. Mechanical stress and thermal stress generated in the substrate.

FIG. 16 is a front view showing another embodiment of the ceramic capacitor according to the present invention. In this example,
Four ceramic capacitor elements 110 to 140 are sequentially laminated, and a bonding material 4 made of a conductive adhesive containing solder or resin is provided between the terminal electrodes 11-11 and 12-12,
Adhere with 5. Further, in the metal terminal 2, a portion between the front end portion and the first bent portion 221 is connected and fixed to the terminal electrode 11 by a bonding material 4 made of a conductive adhesive containing solder or resin. In the metal terminal 3, the terminal electrode 1 is connected between the tip portion and the first bent portion 321 by a bonding material 5 made of a conductive adhesive containing solder or resin.
2 and fixed.

According to the embodiment shown in FIG.
A larger capacitance can be obtained than in the embodiment shown in FIG. The number of ceramic capacitor elements 110 to 140 can be further increased according to the required capacitance.

The path length h causing the spring action is determined by the path length h1 from the terminal portions 23 and 33 to the second bent portions 222 and 322 and the path length h1 from the first bent portions 221 and 321 to the other bent portions 224 and 324. (H = h)
h1 + h2). Therefore, for the metal terminals 2 and 3, the path length h from the substrate side terminal portions 23 and 33 to the ceramic capacitor element mounting portion is increased, the bending and thermal expansion of the substrate are improved, and the ceramic capacitor elements 110 to 140 are improved. Mechanical stress and thermal stress generated in the substrate.

FIG. 17 is a front sectional view showing another embodiment of the ceramic capacitor according to the present invention. In the figure,
1 and 2 are denoted by the same reference numerals, and description thereof is omitted. In this embodiment, the terminal electrode 1
1 and 12 are formed only on the side end surfaces. With such a structure, the distance ΔL1 between the internal electrode 101 and the terminal electrode 12 and the distance ΔL2 between the internal electrode 102 and the terminal electrode 11 are set with reference to the side end surface of the ceramic dielectric substrate 100. Therefore, the overlapping area between the internal electrode 101 and the internal electrode 102 can be increased, and a larger acquisition capacity can be secured.

FIG. 18 is a front sectional view showing another embodiment of the ceramic capacitor according to the present invention. In the figure,
The same components as those in FIG. 17 are denoted by the same reference numerals,
Description is omitted. In the embodiment shown in FIG. 18, two ceramic capacitor elements 110 and 120 are provided. The ceramic capacitor elements 110 and 120 are sequentially laminated,
The terminal electrodes 11 and 12 are connected in parallel by bonding materials 4 and 5. The terminal electrodes 11 and 12 are formed only on the side end surfaces of the ceramic dielectric substrate 100. According to this embodiment, a larger capacitance can be obtained as compared with FIG.

FIG. 19 is a perspective view showing another embodiment of the ceramic capacitor according to the present invention. In the figure, FIG.
The same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, the metal terminal 2 is
It has a punched portion 24. The cutout portion faces the mounting portion to which the terminal electrode 11 is mounted. Although not shown, the metal terminal 3 also has a cutout 34. Punching part 34
Faces the mounting portion to which the terminal electrode 12 is mounted.

With the above structure, in the operation of connecting the metal terminals 2 and 3 to the terminal electrodes 11 and 12,
The mounting portions of the metal terminals 2 and 3 are pressed through the cutout portions 24 and 34 of the third terminal 3 and brought into contact with the terminal electrodes 11 and 12, so that the connection operation can be easily performed. Also, the punched portion 24,
34, the mounting portion is connected to the terminal electrode 11 with a uniform force.
12 can be glued.

FIG. 20 is a bottom view showing another embodiment of the ceramic capacitor according to the present invention. In the figure, FIG.
The same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, the terminal portion 23 of the metal terminal 2 has two holes 231 and 232. Similarly, the terminal portion 33 of the metal terminal 3 has two holes 331, 33
2 The number of holes is arbitrary.

FIG. 21 is a partial sectional view showing a state where the ceramic capacitor shown in FIG. As shown in FIG. 21, when the ceramic capacitor shown in FIG. 20 is soldered to the conductor patterns 71 and 72 provided on the circuit board 70, the terminal portions 23 and 33 are soldered.
Holes 821, 232, 331, and 332
1, 811 so that the ceramic capacitor can be securely soldered to the circuit board 70.

FIG. 22 is a front view showing another embodiment of the ceramic capacitor according to the present invention. In the figure, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, the folded portion 22 of the metal terminal 2 includes an acute-angle bent portion 221, and the acute-angle bent portion 221 is bent at an acute angle in a direction substantially facing the end face of the ceramic capacitor element 1. Similarly, the folded portion 32 of the metal terminal 3 also includes an acute angle bent portion 321, and the acute angle bent portion 321 is bent at an acute angle in a direction substantially opposite to the end face of the ceramic capacitor element 1.

According to the above-described structure, the bending positions 221 and 32 are similar to those of the ceramic capacitors shown in FIGS.
A portion from 1 to the terminal portions 23 and 33 has a spring action, and the deflection and thermal expansion of the substrate can be absorbed by the spring action.

It is preferable that the maximum gap d between the two opposing portions of the metal terminals 2 and 3 caused by bending is 300 μm or less. As the gap d is smaller, the metal terminal 2
The resonance point 3 moves to the high frequency side. With a normal power supply,
Because vibration of 20 to 200 Hz may occur,
It is desirable to reduce the gap d so that the resonance point is 200 Hz or higher. If the gap d is 300 μm or less, such a condition can be satisfied. Table 1 is FIG.
In the ceramic capacitor having the structure shown in FIG.
It is test data which shows the crack generation rate (%) when the interval d is changed and a vibration is applied at a frequency of 10 to 500 Hz for 2 hours. The ceramic capacitors subjected to the test have a distance d
There are 100 for each.

As shown in Table 1, the distance d was 300 μm.
At 370 μm exceeding 300 m, the crack occurrence rate was 85
Reaches ~ 100%. On the other hand, when the distance d (μm) is 70 μm or 90 μm, which is 300 μm or less, no crack occurs.

FIG. 23 is a front view showing another embodiment of the ceramic capacitor according to the present invention. In the figure, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. Folded part 2 of metal terminals 2 and 3
2, 32 are bent in an arc shape. In this embodiment, the same operation and effect as those of the embodiment of FIGS.

Although illustration is omitted in order to avoid redundant description, even when the metal terminals 2 and 3 shown in FIGS. 22 and 23 are used, the usage modes and embodiments shown in FIGS. It is obvious that can be adopted. Although not shown, it goes without saying that there are many combinations of the embodiments.

Next, crack occurrence rate test data of specific examples and comparative examples will be shown.

Example 1 A 5.6 × 5.0 × 2.3 mm ceramic capacitor element having a rated voltage of 25 V, an electrostatic capacity of 22 μF, and a temperature characteristic E was used.
I prepared them.

The above ceramic capacitor element is composed of a lead-based composite perovskite having a Ag-P
and an internal electrode made of Ag paste, which is an electrode baked with an Ag paste containing glass bullets, on both opposite ends of the ceramic dielectric.

Two of the above ceramic capacitor elements are
The terminal electrodes were aligned and overlaid, and the terminal electrodes were fixed by applying a conductive adhesive in which silver powder was dispersed. Next, the lower part of the ceramic capacitor in which only the portion bent inside the metal plate (made of phosphor bronze) having a thickness of 0.1 mm and subjected to silver plating (the intermediate layer is nickel, Ni-Ag) is stacked in two stages is provided. A predetermined pressure was applied to the side surface of the end electrode. In this state, the conductive adhesive was thermally cured by heating at 150 ° C. for 1 hour to produce a composite ceramic capacitor in which two ceramic capacitor elements and metal terminals were fixed at the ends. The shape of the metal terminal and the structure for attaching the metal terminal to the ceramic capacitor element were as shown in FIG.

Example 2 The shapes of the metal terminals and the structure for attaching the metal terminals to the ceramic capacitor element were as shown in FIGS. 7 and 8. Others were the same as in Example 1 to produce a ceramic capacitor.

Example 3 The shape of the metal terminal and the structure for attaching the metal terminal to the ceramic capacitor element were as shown in FIG. Others were the same as in Example 1 to produce a ceramic capacitor.

Example 4 FIGS. 12 and 13 show the shape of the metal terminal and the structure for attaching the metal terminal to the ceramic capacitor element.
The embodiment shown in FIG. Others were the same as in Example 1 to produce a ceramic capacitor.

Comparative Example 1 The shape of the metal terminal and the structure for attaching the metal terminal to the ceramic capacitor element were the same as those of the prior art shown in FIG. Others were the same as in Example 1 to produce a ceramic capacitor. 24, the same components as those in FIG. 1 are denoted by the same reference numerals.

Comparative Example 2 A ceramic capacitor was prepared according to the means described in Examples 1 to 4 without using a metal terminal.

Table 2 shows the occurrence of cracks after the heat cycle test in Examples 1 to 4 and Comparative Examples 1 and 2.

As shown in Table 2, Example 1 according to the present invention
In Nos. To 4, no crack was observed. In Comparative Example 1, the crack occurrence rate was 30% after 40 cycles and 100% after 100 cycles. In Comparative Example 2 having no metal terminal, the crack occurrence rate was 100% both after 40 cycles and after 100 cycles.

Examples 5 to 7 Four 3.2 × 2.5 × 1.0 mm ceramic capacitors having a rated voltage of 16 V, a capacitance of 6.8 μF, and a temperature characteristic E were prepared.

The ceramic capacitor element has a terminal electrode formed by burying an Ag-Pd internal electrode in a ceramic dielectric material of a lead-based composite perovskite, and baking electrodes of an Ag paste containing glass bullets on opposite end surfaces.

The above-mentioned four ceramic capacitor elements were stacked with their terminal electrodes aligned, and a conductive adhesive in which silver powder was dispersed was applied to the terminal electrodes to fix the ceramic capacitor elements. Next, metal terminals were attached in the structure and arrangement shown in FIG. As the metal terminal, a metal plate (made of phosphor bronze) having a thickness of 0.1 mm and having been subjected to silver plating (the intermediate layer was nickel, Ni-Ag) was used. The terminal portion located at the tip of the metal terminal was pressed with a predetermined pressure against the side surface of the terminal electrode of the ceramic capacitor element located at the lowermost layer of the ceramic capacitor elements stacked in four stages. In this state, the conductive adhesive was thermally cured by heating at 150 ° C. for 1 hour to produce a composite ceramic capacitor in which four ceramic capacitor elements and metal terminals were fixed at terminal electrode portions.

The sample obtained as described above was
The path length h that causes the spring action was changed. The samples thus obtained are referred to as Examples 5 to 7.

Comparative Example 3 The shape of the metal terminal and the structure for attaching the metal terminal to the ceramic capacitor element were the same as those of the prior art shown in FIG. Others were the same as Examples 5-7.

Comparative Example 4 A ceramic capacitor was prepared according to the means described in Examples 5 to 7 without using metal terminals.

Table 3 shows the occurrence of cracks after the heat cycle test in Examples 5 to 7 and Comparative Examples 3 and 4.

As shown in Table 3, Example 5 according to the present invention
In Nos. To 7, no crack was observed. In Comparative Example 3, the crack occurrence rate was 15% after 40 cycles and 100% after 100 cycles. In Comparative Example 2 having no metal terminal, the crack occurrence rate was 100% both after 40 cycles and after 100 cycles.

Example 8 Four ceramic capacitor elements of 5.6 × 5.0 × 2.3 mm having a rated voltage of 25 V, a capacitance of 22 μF, and a temperature characteristic E were prepared. Four ceramic capacitor elements were prepared.
The ceramic capacitor element has a terminal electrode formed by burying an Ag-Pd internal electrode in a ceramic dielectric of a lead-based composite perovskite, and being a baked electrode of an Ag paste containing glass bullets on opposite side end surfaces.

The above-mentioned four ceramic capacitor elements were laminated with their terminal electrodes aligned, and a conductive adhesive in which silver powder was dispersed was applied to the terminal electrodes to fix the ceramic capacitor elements. Next, metal terminals were attached in the structure and arrangement shown in FIG. As the metal terminal, a metal plate (made of phosphor bronze) having a thickness of 0.1 mm and having been subjected to silver plating (the intermediate layer was nickel, Ni-Ag) was used. The terminal portion located at the tip of the metal terminal was pressed with a predetermined pressure against the side surface of the terminal electrode of the ceramic capacitor element located at the lowermost layer of the ceramic capacitor elements stacked in four stages. In this state, the conductive adhesive was thermally cured by heating at 150 ° C. for 1 hour to produce a composite ceramic capacitor in which four ceramic capacitor elements and metal terminals were fixed at terminal electrode portions.

Comparative Example 5 Two 5.6 × 5.0 × 2.3 mm ceramic capacitor elements having a rated voltage of 25 V, a capacitance of 22 μF, and a temperature characteristic E were prepared. The ceramic capacitor element has an internal electrode made of Ag-Pd on a ceramic dielectric material of a lead-based composite perovskite, and a terminal electrode made of a baked electrode of Ag paste containing glass bullets on both opposite end surfaces of the ceramic dielectric material. Have.

The above-mentioned two ceramic capacitor elements are overlapped with their terminal electrodes aligned, and
A 0.1 mm-thick metal plate (made of phosphor bronze) coated with a conductive adhesive in which silver powder was dispersed and plated was pressed with a predetermined pressure in the conventional structure shown in FIG. In this state, the conductive adhesive was heated and cured at 150 ° C. for 1 hour to produce a composite ceramic capacitor in which two ceramic capacitor elements and metal terminals were fixed with terminal electrodes.

Comparative Example 6 Four 3.2 × 2.5 × 1.0 mm ceramic capacitor elements having a rated voltage of 16 V, a capacitance of 6.8 μF, and a temperature characteristic E were prepared. The ceramic capacitor element contains Ag-Pd inside the ceramic dielectric of the lead-based composite perovskite.
, And a terminal electrode which is a baked electrode of an Ag paste containing a glass frit.

The above-mentioned four ceramic capacitor elements are overlapped with the terminal electrodes aligned, and a conductive adhesive in which silver powder is dispersed is applied to the terminal electrodes. They were arranged in the manner shown in the conventional example and pressed at a predetermined pressure. The metal terminals have a plating thickness of 0.1 mm.
It is a 1 mm metal plate (made of phosphor bronze).

In this state, the conductive adhesive was thermally cured by heating at 150 ° C. for 1 hour to produce a composite ceramic capacitor in which four ceramic capacitor elements and metal terminals were fixed at terminal electrode portions. did.

Using the samples obtained according to Example 8 and Comparative Examples 5 and 6, the terminal portions of the metal terminals were soldered to an aluminum substrate and placed in a thermal shock test tank to conduct a thermal shock test. . Thermal shock test is 125 ° C ~
(-55 ° C.) to 125 ° C. as one cycle, each cycle of 40 cycles and 100 cycles. Then, before and after the test, the presence or absence of cracks present inside the ceramic capacitor element was examined.

In Example 8 according to the present invention, no cracks were found, but in Comparative Examples 5 and 6, breakage due to cracks was found. All the breaking positions were at the interface between the metal terminal and the conductive adhesive and near the area where the conductive adhesive was applied.

[0104]

As described above, according to the present invention, the following effects can be obtained. (A) It is possible to provide a ceramic capacitor that can reliably prevent cracks, breakage, and the like from occurring in the ceramic capacitor element. (B) A ceramic capacitor capable of reducing thermal stress and mechanical stress in a ceramic capacitor element can be provided. (C) It is possible to provide a ceramic capacitor in which the length from the substrate-side terminal portion to the ceramic capacitor element mounting portion is increased without increasing the height of the metal terminal.

[Brief description of the drawings]

FIG. 1 is a front view of a ceramic capacitor according to the present invention.

FIG. 2 is a front sectional view of the ceramic capacitor shown in FIG. 1;

FIG. 3 is a partial cross-sectional view showing a state when the ceramic capacitor shown in FIGS. 1 and 2 is mounted on a circuit board.

FIG. 4 is an enlarged sectional view showing an example of a metal terminal used in the ceramic capacitor according to the present invention.

FIG. 5 is a front view showing another embodiment of the ceramic capacitor according to the present invention.

FIG. 6 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 7 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 8 is a front view showing still another embodiment of the ceramic capacitor shown in FIG. 7;

FIG. 9 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 10 is a front view of the ceramic capacitor shown in FIG. 9;

FIG. 11 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 12 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 13 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 14 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 15 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 16 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 17 is a front sectional view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 18 is a front sectional view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 19 is a perspective view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 20 is a bottom view showing still another embodiment of the ceramic capacitor according to the present invention.

21 is a partial cross-sectional view showing a mounting example of the ceramic capacitor shown in FIG.

FIG. 22 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 23 is a front view showing still another embodiment of the ceramic capacitor according to the present invention.

FIG. 24 is a front view showing a conventional ceramic capacitor.

[Explanation of symbols]

1, 110-140 Ceramic capacitor element 2, 3 Metal terminal 21, 31 One end 22, 32 Folded part 23, 33 Terminal part

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shunji Itakura TDK Corporation, 1-13-1 Nihonbashi, Chuo-ku, Tokyo

Claims (29)

[Claims] 1. A ceramic capacitor comprising at least one ceramic capacitor element and at least one pair of metal terminals, wherein said ceramic capacitor element has terminal electrodes on opposite side end faces, Each of the ceramic capacitors has a tip portion connected to one of the terminal electrodes, a folded portion at an intermediate portion, and a terminal portion connected to the outside behind the folded portion. 2. The ceramic capacitor according to claim 1, wherein the metal terminal and the terminal electrode are connected by a conductive adhesive containing a resin. 3. The ceramic capacitor according to claim 2, wherein the conductive adhesive contains silver particles having a particle diameter of 3 μm or more as a conductive component. 4. The ceramic capacitor according to claim 2, wherein said resin of said conductive adhesive is thermosetting epoxy resin, urethane resin, polyimide resin or acrylic resin. Ceramic capacitor mainly composed of at least one selected from conductive resins. 5. The ceramic capacitor according to claim 1, wherein the metal terminal and the terminal electrode are connected by solder. 6. The ceramic capacitor according to claim 5, wherein the solder has a melting point in a range of 200 ° C. or more and 400 ° C. or less. 7. The ceramic capacitor according to claim 5, wherein the metal terminal does not adhere to solder at least on a surface of the terminal portion opposite to an external connection surface. A ceramic capacitor having a coating film that exhibits properties. 8. The ceramic capacitor according to claim 7, wherein the coating film is made of a metal oxide film. 9. The ceramic capacitor according to claim 7, wherein the coating film is made of one of wax, resin, and silicone oil. 10. The ceramic capacitor according to claim 1, wherein the folded part of the metal terminal includes at least one bent part, and each of the metal terminals is formed by the folded part. A portion between the first bent portion and the tip portion is connected to the terminal electrode. 11. The ceramic capacitor according to claim 10, wherein the folded portion of the metal terminal has two bent portions. 12. The ceramic capacitor according to claim 11, wherein the folded portion of the metal terminal includes a first bent portion and a second bent portion, wherein the first bent portion includes a first bent portion and a second bent portion. A ceramic capacitor that is bent in a direction away from the terminal electrode, and is bent in a second bent portion in a direction facing the end face at an interval from the first bent portion. 13. The ceramic capacitor according to claim 10, wherein the folded portion of the metal terminal is formed of a single bent portion and is bent at an acute angle. 14. The ceramic capacitor according to claim 13, wherein the metal terminal has a maximum gap between two opposing portions caused by the bending of 300 μm or less. 15. The ceramic capacitor according to claim 10, wherein the folded portion of the metal terminal is bent in an arc shape. 16. The ceramic capacitor according to claim 1, wherein the terminal is spaced below a ceramic capacitor element located at a lowermost layer among the ceramic capacitor elements. The ceramic capacitor that is placed. 17. The ceramic capacitor according to claim 1, wherein a path length of the metal terminal from the terminal portion to a mounting portion to which the terminal electrode is mounted is the terminal portion. Ceramic capacitors larger than the component height dimensions based on 18. The ceramic capacitor according to claim 1, wherein a top of the folded portion is lower than a top of the ceramic capacitor element. 19. The ceramic capacitor according to claim 1, wherein each of said metal terminals has a bent portion between said folded portion and said terminal portion. 20. The ceramic capacitor according to claim 19, wherein each of the metal terminals is such that the terminal portion is connected to the ceramic capacitor element in the bent portion between the folded portion and the terminal portion. A ceramic capacitor that is bent in the direction of approach. 21. The ceramic capacitor according to claim 1, wherein each of the metal terminals has a different bent portion from a tip portion to a first bent portion of the folded portion. A portion from the another bent portion to the first bent portion faces the side end face at an interval, and a portion between the tip portion and the another bent portion is connected to the terminal electrode. Are ceramic capacitors. 22. The ceramic capacitor according to claim 1, wherein the plurality of ceramic capacitor elements are stacked one after another, and the terminal electrodes are connected in parallel. Capacitors. 23. The ceramic capacitor according to claim 22, wherein each of said metal terminals is connected to at least one of said terminal electrodes of said plurality of ceramic capacitor elements. 24. The ceramic capacitor according to claim 23, wherein a portion between the tip portion and the another bent portion is disposed between terminal electrodes of two ceramic capacitor elements, and both terminal electrodes are provided. Ceramic capacitor connected to. 25. The ceramic capacitor according to claim 23, wherein a terminal electrode of a lowermost ceramic capacitor element of the plurality of ceramic capacitor elements is provided between the tip portion and the another bent portion. A ceramic capacitor that is arranged to support and that is connected to its terminal electrode. 26. The ceramic capacitor according to claim 1, wherein the ceramic capacitor has a plurality of internal electrodes inside a ceramic dielectric substrate, wherein the internal electrodes are: One end is connected to one of the terminal electrodes, the other end has an interval between the other end of the terminal electrode, and the interval is a perpendicular line drawn from the other end in the thickness direction of the ceramic dielectric substrate. Ceramic capacitors set to dimensions that do not cross the terminal electrodes. 27. The ceramic capacitor according to claim 1, wherein the terminal electrode is formed only on the side end surface. 28. The ceramic capacitor according to claim 1, wherein the metal terminal has at least one cutout, and the cutout is a mounting portion to which the terminal electrode is mounted. Facing ceramic capacitors. 29. The ceramic capacitor according to claim 1, wherein the terminal has at least one hole.