JPH0376013A - Thin-film magnetic head - Google Patents

Abstract

PURPOSE:To improve the production yield of the thin-film magnetic head by providing coils which consist of plural layers and in which the thin body pitch of the upper layer coil is larger than the conductor pitch of the lower layer coil. CONSTITUTION:The conductor pitch PL of the lower layer coil 6 is set at 5mum of 2.5mum line/2.5mum space and a photoresist of 4mum film thickness is patterned by photolithography to form a frame; thereafter, copper is plated to about 3.5mum to form the lower layer coil 6. Further, the photoresist is subjected to a heat treatment to form an insulating layer 7 and the upper layer coil 8 is formed thereon. The conductor pitch PU of the upper layer coil 8 is set at 3mum line/3mum space larger than the conductor pitch PL of the lower layer coil 6. The production yield of the thin-film magnetic head is greatly improved in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film magnetic head, and particularly to a coil for a thin film magnetic head.

[Conventional technology]

Conventionally, this type of thin film magnetic head has a lower insulating film 2 on a substrate 1, as shown in FIG. Lower magnetic film 3, gap film 4
．． Insulating film 5. Lower layer coil 12° insulation film 7. Upper layer coil 1
3. Insulating film 9. The structure was such that the upper magnetic film 10 and the protective film 11 were sequentially laminated.

[Problem to be solved by the invention]

As the performance of thin film magnetic heads increases, there is an increasing demand for narrow track width and high density coils. In the conventional thin film magnetic head described above, since the conductor pitch PL of the lower layer coil 12 and the conductor pitch Pu of the upper layer coil 13 are the same, there are the following drawbacks. In other words, when forming coils using the frame plating method, photoresist patterning is performed using photolithography, but as mentioned above, in order to realize high-density coils, conventional photolithography is close to its limit. High aspect ratio patterning is required. Therefore, even if the lower layer coil 12 can be patterned, it is very difficult to pattern the upper layer coil 13 with the same conductor pitch as the lower layer coil 12 because of the unevenness of the lower layer coil 12 in the upper layer coil 13. Disappearance, thinning, etc. occur, which causes a significant deterioration in the manufacturing yield of thin-film magnetic heads.

[Means to solve the problem]

The present invention provides an insulating film, a magnetic film, and a coil on a substrate.

A thin film magnetic head formed by laminating a gap film and a protective film is characterized in that the coil is made of a plurality of layers, and the coil conductor pitch in the upper layer is larger than the coil conductor pitch in the bottom layer.

〔Example〕

Next, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the thin film magnetic head of the present invention. In FIG. 1, the thin film magnetic head of the present invention includes a lower insulating film 2 formed by sputtering alumina (AjlzOs) on a substrate 1 made of alumina-titanium carbide (Ar1O3-Tic). Then, permalloy (N i Fe) is plated to form the lower magnetic film 3 . AJ203 is sputtered thereon to form a gap film 4, and the photoresist is further heat-treated to form an insulating film 5. Copper (C) is then coated using the frame plating method.
u) is formed into a film to form the lower layer coil 6.

At this time, the conductor pitch PL of the lower layer coil 6 is 2.5 μm.
Line/2.5μm space 5μm, film thickness 4μm
photoresist by photolithography (Photol)
The lower layer coil 6 is formed by patterning it into a frame using lithography (photographic etching technique) and plating copper to a thickness of approximately 3.5 μm. Then, the photoresist is further subjected to heat treatment to form an insulating layer 7, and an upper layer coil 8 is formed thereon.

The conductor pitch Pυ of the upper layer coil 8 is, for example, 3 μm line/20% larger than the conductor pitch PL of the lower layer coil 6.
The space is 3 μm. Then, an insulating film 9 made of photoresist and an upper magnetic film 10 made of NiFe are sequentially laminated, and finally AJ20s is sputtered to form a protective film 11.

〔Effect of the invention〕

As explained above, in a thin film magnetic head having multiple layers of coils, the present invention makes the conductor pitch of the upper layer coil larger than the conductor pitch of the lowest layer coil, so that the upper layer coil is influenced by the shape of the lower layer coil. This makes it possible to apply the photolithography patterning of the upper layer coils to the same conditions as the bottom layer coil patterning, making it possible to always provide a stable pattern regardless of the unevenness of the lower layer coils. Therefore, the manufacturing yield of thin film magnetic heads can be significantly improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a thin film magnetic head of the present invention, and FIG. 2 is a sectional view of a conventional thin film magnetic head. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Lower insulating film, 3... Lower magnetic film, 4... Gap film, 5, 7, 9... Insulating film, 6
・12...Lower layer coil, 8.13...Upper layer coil,
10... Upper magnetic film, 11... Protective film.

Claims (1)

[Claims] In a thin film magnetic head formed by laminating an insulating film, a magnetic film, a coil, a gap film, and a protective film on a substrate, the coil is composed of multiple layers, and the coil conductor pitch in the upper layer is larger than the coil conductor pitch in the bottom layer. A thin film magnetic head characterized by being equipped with.