JPH0291510U - - Google Patents
Info
- Publication number
- JPH0291510U JPH0291510U JP16939488U JP16939488U JPH0291510U JP H0291510 U JPH0291510 U JP H0291510U JP 16939488 U JP16939488 U JP 16939488U JP 16939488 U JP16939488 U JP 16939488U JP H0291510 U JPH0291510 U JP H0291510U
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- heat
- ultrasound signals
- heat dissipation
- dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 13
- 238000002604 ultrasonography Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 5
- 230000000694 effects Effects 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
第１図は第１の考案の一実施例による超音波探
触子の断面構成図、第２図は第２の考案の一実施
例による超音波探触子の断面構成図、第３図は第
２の考案の他の実施例による超音波探触子の断面
構成図、第４図は第３の考案の一実施例による超
音波探触子の断面構成図、第５図は第４図の―
断面の概略構成図、第６図は第１ないし第３の
考案による超音波探触子が装着された超音波プロ
ーブの一部断面構成図、第７図は超音波探触子の
概略構成を示す斜視図である。
５…超音波探触子、１０，２０，３０，４０…
圧電セラミツクス、１１，２２，３２，４２…バ
ツキング部材、１３，２１，３１，４１…整合層
、１２，４４，４５…放熱接着剤、２３，４３…
放熱部材。
FIG. 1 is a cross-sectional diagram of an ultrasonic probe according to an embodiment of the first invention, FIG. 2 is a cross-sectional diagram of an ultrasound probe according to an embodiment of the second invention, and FIG. FIG. 4 is a cross-sectional diagram of an ultrasonic probe according to another embodiment of the second invention, FIG. 5 is a cross-sectional diagram of an ultrasound probe according to an embodiment of the third invention, of-
FIG. 6 is a partial cross-sectional configuration diagram of an ultrasound probe equipped with ultrasound probes according to the first to third inventions, and FIG. 7 is a schematic diagram of the configuration of the ultrasound probe. FIG. 5... Ultrasonic probe, 10, 20, 30, 40...
Piezoelectric ceramics, 11, 22, 32, 42... Backing member, 13, 21, 31, 41... Matching layer, 12, 44, 45... Heat dissipation adhesive, 23, 43...
Heat dissipation member.
Claims (1)
音波信号を生体内に送信するとともに、生体内で
反射した超音波信号を受信する超音波探触子であ
つて、 前記圧電体を各素子に分割するためのカツテイ
ング溝に、前記圧電体に発生した熱を放散するた
めの放熱接着剤を封入した、 超音波探触子。 (2) 圧電体を有し、その圧電効果を利用して超
音波信号を生体内に送信するとともに、生体内で
反射した超音波信号を受信する超音波探触子であ
つて、 前記圧電体の背面に装着されたバツキング部材
と、 前記バツキング部材に装着され、前記圧電体に
発生した熱を放散するための放熱部材とを備えた
、 超音波探触子。 (3) 圧電体を有し、その圧電効果を利用して超
音波信号を生体内に送信するとともに、生体内で
反射した超音波信号を受信する超音波探触子であ
つて、 前記圧電体を各素子に分割するためのカツテイ
ング溝に封入され、前記圧電体に発生した熱を放
散するための第１の放熱接着剤と、 前記圧電体の背面に装着されたバツキング部材
と、 前記バツキング部材に装着され、前記圧電体の
熱を放散するための放熱部材と、 前記第１の放熱接着剤と放熱部材とを接続し、
前記圧電体の熱を、前記第１の放熱接着剤を介し
て前記放熱部材から放散するための第２の放熱接
着剤とを備えた、 超音波探触子。[Claims for Utility Model Registration] (1) An ultrasonic probe that has a piezoelectric material and utilizes the piezoelectric effect to transmit ultrasound signals into a living body and to receive ultrasound signals reflected within a living body. An ultrasonic probe, wherein a cutting groove for dividing the piezoelectric body into each element is filled with a heat dissipating adhesive for dissipating heat generated in the piezoelectric body. (2) An ultrasonic probe that includes a piezoelectric material and utilizes the piezoelectric effect to transmit ultrasound signals into a living body and to receive ultrasound signals reflected within the living body, wherein the piezoelectric material An ultrasonic probe, comprising: a bucking member attached to the back surface of the piezoelectric body; and a heat radiating member attached to the bucking member for dissipating heat generated in the piezoelectric body. (3) An ultrasonic probe that includes a piezoelectric material and uses the piezoelectric effect to transmit ultrasound signals into a living body and to receive ultrasound signals reflected within the living body, wherein the piezoelectric material a first heat dissipating adhesive sealed in a cutting groove for dividing the piezoelectric body into each element and for dissipating heat generated in the piezoelectric body; a bucking member attached to a back surface of the piezoelectric body; and a bucking member. a heat dissipation member attached to the piezoelectric body for dissipating heat of the piezoelectric body; connecting the first heat dissipation adhesive and the heat dissipation member;
and a second heat dissipation adhesive for dissipating heat of the piezoelectric body from the heat dissipation member via the first heat dissipation adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16939488U JPH0291510U (en) | 1988-12-29 | 1988-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16939488U JPH0291510U (en) | 1988-12-29 | 1988-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291510U true JPH0291510U (en) | 1990-07-20 |
Family
ID=31459412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16939488U Pending JPH0291510U (en) | 1988-12-29 | 1988-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291510U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005030055A1 (en) * | 2003-09-30 | 2005-04-07 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic probe |
| JP2015181541A (en) * | 2014-03-20 | 2015-10-22 | 富士フイルム株式会社 | ultrasonic probe |
-
1988
- 1988-12-29 JP JP16939488U patent/JPH0291510U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005030055A1 (en) * | 2003-09-30 | 2005-04-07 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic probe |
| JP2005103078A (en) * | 2003-09-30 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
| JP4624659B2 (en) * | 2003-09-30 | 2011-02-02 | パナソニック株式会社 | Ultrasonic probe |
| JP2015181541A (en) * | 2014-03-20 | 2015-10-22 | 富士フイルム株式会社 | ultrasonic probe |
| US9799818B2 (en) | 2014-03-20 | 2017-10-24 | Fujifilm Corporation | Ultrasound probe with heat collecting portion |
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