JPH02101714A - Chip type inductance element and manufacture thereof - Google Patents
Chip type inductance element and manufacture thereofInfo
- Publication number
- JPH02101714A JPH02101714A JP25454188A JP25454188A JPH02101714A JP H02101714 A JPH02101714 A JP H02101714A JP 25454188 A JP25454188 A JP 25454188A JP 25454188 A JP25454188 A JP 25454188A JP H02101714 A JPH02101714 A JP H02101714A
- Authority
- JP
- Japan
- Prior art keywords
- conductor line
- coil
- laminate
- shaped conductor
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- 238000000605 extraction Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000000569 greater omentum Anatomy 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、各種の電子回路に用いるチップ型インダク
タンス素子及びその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a chip-type inductance element used in various electronic circuits and a method for manufacturing the same.
〈従来の技術〉
近年、電子回路の小型化、高集積化及び高周波化にとも
ない、小型で表面実装可能なチップ型のインダクタンス
素子の需要が高まっている。<Prior Art> In recent years, with the miniaturization, higher integration, and higher frequency of electronic circuits, there has been an increasing demand for small, surface-mountable chip-type inductance elements.
従来、この種のインダクタンス素子としては、磁性体コ
アを保持する基板に電極を形成し、磁性体コア部に導体
を巻き付けてこの導体の端部を基板上の電極に接続する
ことにより形成される巻線型インダクタンス素子、ある
いは特公昭57−39521号公報に記載されているよ
うに磁性体グリーンシートと導体とを交互に印刷し、各
層の導体を接続することにより形成される積層型インダ
クタンス素子などが一般的に用いられている。Conventionally, this type of inductance element is formed by forming electrodes on a substrate that holds a magnetic core, wrapping a conductor around the magnetic core, and connecting the ends of this conductor to electrodes on the substrate. Wire-wound inductance elements, or laminated inductance elements formed by alternately printing magnetic green sheets and conductors and connecting the conductors of each layer as described in Japanese Patent Publication No. 57-39521, etc. Commonly used.
〈発明が解決しようとする課題〉
上記のような従来のインダクタンス素子は、巻線型及び
積層型の何れにおいても、その構造及び製造工程が複雑
で量産性に劣り、製造コストが高くつくという問題点が
ある。<Problems to be Solved by the Invention> Conventional inductance elements as described above, both of wire-wound type and laminated type, have a problem that their structure and manufacturing process are complicated, making them less suitable for mass production, and resulting in high manufacturing costs. There is.
この発明は上記の問題点に鑑みて、従来のチップ型イン
ダクタンス素子の欠点を改良すべくなされたもので、構
造が簡単で量産性に優れ、しかもその製造コストが安価
なチップ型インダクタンス素子とその製造方法を提供す
ることを課題とする。In view of the above-mentioned problems, this invention was made to improve the shortcomings of conventional chip-type inductance elements. The objective is to provide a manufacturing method.
く課題を解決するための手段〉
この発明は上記のような課題を解決するために成された
もので、磁性体グリーンシートにU字形の導体線路を形
成したものを重ね、焼成後、U字形導体線路を電気的に
接続することによりコイルを形成したチップ型インダク
タンス素子である。Means for Solving the Problems> This invention was made to solve the above problems, and consists of overlapping a magnetic green sheet with a U-shaped conductor line formed thereon, and after firing, forming a U-shaped conductor line. This is a chip-type inductance element in which a coil is formed by electrically connecting conductor lines.
また、グリーンシートにU字形の導体線路を印刷し、こ
のグリーンシートの複数を重ね合わせて焼成した後、外
部に露出したU字形の導体線路の端部を上下の層の間で
電気的に接続されるように導体を印刷することにより導
体線路からなるコイルを形成し、このコイルの両端を外
部電極に接続するチップ型インダクタンス素子の製造方
法を提供する。In addition, U-shaped conductor lines are printed on green sheets, and after multiple green sheets are stacked and fired, the ends of the U-shaped conductor lines exposed to the outside are electrically connected between the upper and lower layers. The present invention provides a method for manufacturing a chip-type inductance element in which a coil made of a conductor line is formed by printing a conductor as shown in the figure, and both ends of the coil are connected to external electrodes.
さらに、磁性体グリーンシートにU字形の導体線路を印
刷し、このグリーンシートの複数を重ね合わせ、外部に
露出したU字形の導体線路の端部を上下の層の間で電気
的に接続されるように導体を印刷することにより導体線
路からなるコイルを形成し、つぎに、この積層体の導体
を印刷した方の端面に、磁性体板または絶縁体板からな
る当て板を重ね、この当て板に設けたスルーホール内の
導体により該コイルの一方の端部に導通する端子を設け
、もう一方の端子は当て板を重ねた面と反対側の面から
、積層体の内部を貫通する導体を介して取り出すように
したものを焼成し、この焼成した積層体の両端に導体か
らなるキャップを被せて該各端子とキャップとを電気的
に接続するチップ型インダクタンス素子の製造方法を提
供する。Furthermore, a U-shaped conductor line is printed on a magnetic green sheet, a plurality of these green sheets are overlapped, and the ends of the U-shaped conductor line exposed to the outside are electrically connected between the upper and lower layers. A coil consisting of a conductor line is formed by printing a conductor as shown in FIG. A terminal is provided at one end of the coil for conduction using a conductor in a through hole provided in the laminate, and the other terminal is connected to a conductor passing through the inside of the laminate from the side opposite to the side where the backing plate is stacked. To provide a method for manufacturing a chip-type inductance element, in which a chip-type inductance element is fired, which is taken out through a laminate, and caps made of a conductor are placed on both ends of the fired laminate, and each terminal and the cap are electrically connected.
〈実施例〉
以下、この発明の実施例を添付図面の第1図乃至第8図
に基づいて説明する。<Embodiments> Hereinafter, embodiments of the present invention will be described based on FIGS. 1 to 8 of the accompanying drawings.
まず、第1図のように磁性体グリーンシート1上に銀ペ
ーストなどを用いて、U字形の導体線路2をスクリーン
印刷等の方法で形成する。First, as shown in FIG. 1, a U-shaped conductor line 2 is formed on a magnetic green sheet 1 by a method such as screen printing using silver paste or the like.
このようなグリーンシート1の複数枚を積層するが、第
2図、第3図の第1の実施例では、上面に積層体の反対
側に電極を取り出すための導体線路3′を印刷したグリ
ーンシート3を載せ、他はU字形導体線路2を有するグ
リーンシート1のみを積層するものである。A plurality of such green sheets 1 are laminated, and in the first embodiment shown in FIGS. 2 and 3, a green sheet is printed with a conductor line 3' printed on the top surface for taking out an electrode on the opposite side of the laminate. A sheet 3 is placed thereon, and only the green sheets 1 having U-shaped conductor lines 2 are laminated.
そして、上記積層体の上面のみ、または上面と下面には
導体線路のないグリーンシート4を重ねて絶縁の目的に
供する。Then, green sheets 4 having no conductor lines are stacked on only the upper surface of the laminate, or on the upper and lower surfaces, for the purpose of insulation.
また、第4図、第5図に示す第2の実施例では、上面に
積層体の反対側に電極を取り出すための導体線路3′を
印刷したグリーンシート3を載せ、その下に導体線路の
ないグリーンシート4とU字形導体線路2を有するグリ
ーンシート1を交互に積層したものである。In addition, in the second embodiment shown in FIGS. 4 and 5, a green sheet 3 with a conductor line 3' printed on the top surface for taking out the electrode on the opposite side of the laminate is placed, and a conductor line is placed below it. Green sheets 4 with no U-shaped conductor lines 2 and green sheets 1 with U-shaped conductor lines 2 are alternately laminated.
この場合も積層体の上面のみ、または、上面と下面には
導体線路のないグリーンシート4を重ね絶縁の目的に供
する。これらの各実施例において、前記の導体線路3′
は積層体の内部を貫通する。In this case as well, a green sheet 4 without conductor lines is placed only on the upper surface of the laminate, or on both the upper and lower surfaces, for the purpose of insulation. In each of these embodiments, the conductor line 3'
penetrates the inside of the laminate.
上記の第1及び第2の実施例のように積層したグリーン
シートを加圧して各グリーンシートを圧着せしめたもの
を焼成炉に装入して焼成し、焼結体Aとする。As in the first and second embodiments described above, the stacked green sheets are pressurized so that each green sheet is crimped and then charged into a firing furnace and fired to form a sintered body A.
第6図は、前記第2実施例の焼結体Aの片端面、即ち、
U字形導体線路2の端部が露出している面に、銀ペース
トなどによる印刷で導体線路5を形成して導体線路2.
5及びグリーンシート3上の導体線路3′をコイル状に
連続させた状態を示し、その下部のU字形導体線路2の
一端部には、同じく銀ペーストなどによる取出し用の電
極6を設ける。FIG. 6 shows one end surface of the sintered body A of the second embodiment, that is,
A conductor line 5 is formed by printing with silver paste or the like on the surface where the end of the U-shaped conductor line 2 is exposed, and the conductor line 2.
5 and the conductor line 3' on the green sheet 3 are shown in a continuous coiled state, and one end of the U-shaped conductor line 2 at the bottom thereof is provided with a lead-out electrode 6 made of silver paste or the like.
また、焼結体Aの他方には第7図の用に、グリーンシー
ト3に設けられ、焼結体A内を貫通した導体線路3′の
端部のみが露出しており、この導体線路3′の端部にも
銀ペーストなどにっより取出し用の電極7を設ける。Further, on the other side of the sintered body A, as shown in FIG. An electrode 7 for extraction is also provided at the end of the electrode 7 using silver paste or the like.
一方、別の磁性体または絶縁体からなる当て板8の隅の
部分にスルーホール9を設けたものを用意して、これを
前記焼結体Aの導体線路5を有する面に当てがい、スル
ーホール9がコイルの一方の端の電極6に電気的に接触
するように焼結体Aに重ねて圧着し、接着剤等で固定し
、スルーホール9を介してコイルの一方の端を外部に取
り出す。On the other hand, a patch plate 8 made of another magnetic material or an insulator with through holes 9 provided in the corners is prepared, and this is applied to the surface of the sintered body A having the conductor line 5. The coil is stacked and crimped onto the sintered body A so that the hole 9 is in electrical contact with the electrode 6 at one end of the coil, fixed with adhesive, etc., and one end of the coil is exposed to the outside through the through hole 9. Take it out.
第1の実施例の場合の焼結体の端部の導体線路や取出し
用の電極の形成については、説明を省略するが、第6図
、第7図に示したものと何等かわるところはない。Regarding the formation of conductor lines and extraction electrodes at the ends of the sintered body in the case of the first embodiment, explanations will be omitted, but there is no difference from that shown in Figs. 6 and 7. .
そして、最後に金属キャップ10を第8図のように焼結
体Aの両端に被せて半田などによりスルーホール9及び
それと反対側にある電極7をそれぞれ金属キャップ10
と電気的に接続される。Finally, metal caps 10 are placed over both ends of the sintered body A as shown in FIG.
electrically connected to.
上記の工程において、各グリーンシートが焼結される前
に当て板8を当てがってグリーンシートと共に焼成して
もよい。In the above process, before each green sheet is sintered, a caul plate 8 may be applied and fired together with the green sheet.
〈発明の効果〉
この発明は上記の用にU字形の導体線路を有する磁性体
グリーンシートを重ね合わせ、焼成した後、あるいは焼
成前に外部より各層の導体線路を電気的に接続してコイ
ルを形成するので、従来のインダクタンス素子に比較し
て構造が簡単で量産性に優れる。従って、チップ型イン
ダクタンス素子を安価に提供できる。<Effects of the Invention> For the above purpose, the present invention overlaps magnetic green sheets having U-shaped conductor lines, and after or before firing, electrically connects the conductor lines of each layer from the outside to form a coil. The structure is simpler and easier to mass produce than conventional inductance elements. Therefore, a chip-type inductance element can be provided at low cost.
また、磁性体グリーンシートを重ね合わせ、各層の導体
線路を電気的に接続して焼成した焼結体に金属等のキャ
ップを被せたものはプリント基板上にそのまま面実装が
行なえるものである。Further, a sintered body obtained by stacking magnetic green sheets, electrically connecting the conductor lines of each layer, and then covering the sintered body with a cap made of metal or the like can be directly surface-mounted on a printed circuit board.
第1図は磁性体グリーンシートの斜視図、第2図は第1
の実施例の積層前の各グリーンシートの斜視図、第3図
は同上の積層状態の斜視図、第4図は第2の実施例の積
層前の各グリーンシートの斜視図、第5図は同上の積層
状態の斜視図、第6図は第2の実施例による積層体の一
端面の導体線路の形成状態を端部用の当て板を示す一部
切欠斜視図、第7図は第6図に示した積層体の反対方向
からの一部切欠斜視図、第8図は完成品の断面図である
。
1.3.4・・・磁性体グリーンシート2.3′、5・
・・導体線路
6.7・・・取出し用の電極
8・・・当て板 9・・・スルーホール
10・・・キャップFigure 1 is a perspective view of a magnetic green sheet, and Figure 2 is a perspective view of a magnetic green sheet.
3 is a perspective view of the same laminated state as above, FIG. 4 is a perspective view of each green sheet of the second embodiment before lamination, and FIG. 5 is a perspective view of each green sheet before lamination in the second embodiment. FIG. 6 is a perspective view of the laminated state of the same as above, FIG. FIG. 8 is a partially cutaway perspective view of the laminate shown in the figure from the opposite direction, and FIG. 8 is a sectional view of the completed product. 1.3.4...Magnetic green sheet 2.3', 5.
・・Conductor line 6.7・・Electrode for extraction 8・・Backing plate 9・・Through hole 10・・Cap
Claims (3)
したものを重ね、焼成後、U字形導体線路の各末端を電
気的に接続することによりコイルを形成したチップ型イ
ンダクタンス素子。(1) A chip-type inductance element in which a U-shaped conductor line formed on a magnetic green sheet is stacked, and after firing, a coil is formed by electrically connecting each end of the U-shaped conductor line.
し、このグリーンシートの複数を重ね合わせて焼成した
後、外部に露出したU字形導体線路の端部を上下の層の
間で電気的に接続されるように導体を印刷することによ
り導体線路からなるコイルを形成し、このコイルの両端
を外部電極に接続するチップ型インダクタンス素子の製
造方法。(2) After printing a U-shaped conductor line on a magnetic green sheet, stacking multiple green sheets and firing them, the ends of the U-shaped conductor line exposed to the outside are electrically connected between the upper and lower layers. A method for manufacturing a chip-type inductance element, in which a coil is formed from a conductor line by printing a conductor so as to be connected to the coil, and both ends of the coil are connected to external electrodes.
し、このグリーンシートの複数を重ね合わせ、外部に露
出したU字形導体線路の端部を上下の層の間で電気的に
接続されるように導体を印刷することにより導体線路か
らなるコイルを形成し、つぎに、この積層体の導体を印
刷した方の端面に、磁性体板または絶縁体板からなる当
て板を重ね、この当て板に設けたスルーホール内の導体
により該コイルの一方の端部に導通する端子を設け、も
う一方の端子は当て板を重ねた面と反対側の面から、積
層体の内部を貫通する導体を介して取り出すようにした
ものを焼成し、この焼成した積層体の両端に導体からな
るキャップを被せて該各端子とキャップとを電気的に接
続するチップ型インダクタンス素子の製造方法。(3) Print a U-shaped conductor line on a magnetic green sheet, overlap multiple green sheets, and connect the ends of the U-shaped conductor line exposed to the outside electrically between the upper and lower layers. A coil consisting of a conductor line is formed by printing a conductor as shown in FIG. A terminal is connected to one end of the coil by means of a conductor in a through hole provided in the laminate, and the other terminal is connected to a conductor passing through the inside of the laminate from the side opposite to the side where the backing plate is stacked. A method for manufacturing a chip-type inductance element, which comprises firing a laminate that is taken out through the laminate, covering both ends of the fired laminate with a cap made of a conductor, and electrically connecting each terminal with the cap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25454188A JPH02101714A (en) | 1988-10-07 | 1988-10-07 | Chip type inductance element and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25454188A JPH02101714A (en) | 1988-10-07 | 1988-10-07 | Chip type inductance element and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02101714A true JPH02101714A (en) | 1990-04-13 |
Family
ID=17266475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25454188A Pending JPH02101714A (en) | 1988-10-07 | 1988-10-07 | Chip type inductance element and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02101714A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5501519A (en) * | 1994-02-24 | 1996-03-26 | Toshiba Machine Co., Ltd. | Screw head for injection molding machine |
JP2007076147A (en) * | 2005-09-14 | 2007-03-29 | Toshiba Mach Co Ltd | Tool for twisting/fixing screw chip |
US7479862B2 (en) | 2005-03-29 | 2009-01-20 | Kyocera Corporation | Ferrite material and ceramic substrate |
JP2010147351A (en) * | 2008-12-20 | 2010-07-01 | Videocon Global Ltd | Liquid crystal display device and manufacturing method therefor |
-
1988
- 1988-10-07 JP JP25454188A patent/JPH02101714A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5501519A (en) * | 1994-02-24 | 1996-03-26 | Toshiba Machine Co., Ltd. | Screw head for injection molding machine |
US7479862B2 (en) | 2005-03-29 | 2009-01-20 | Kyocera Corporation | Ferrite material and ceramic substrate |
JP2007076147A (en) * | 2005-09-14 | 2007-03-29 | Toshiba Mach Co Ltd | Tool for twisting/fixing screw chip |
JP2010147351A (en) * | 2008-12-20 | 2010-07-01 | Videocon Global Ltd | Liquid crystal display device and manufacturing method therefor |
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