JPH01211939A - Ion-implantation device - Google Patents

Abstract

PURPOSE:To make it possible to shorten the treating time for ion-implantation by a method wherein 4 sheets of stages for ion-implantation targets are fixed on a rotating shaft and an ion-implantation into a wafer and the replacement of an ion-implantation finished wafer are executed simultaneously. CONSTITUTION:4 sheets of stages 1A-1D are fixed on a rotating shaft 3 coupled with a motor 2, the surface of each stage is positioned almost rectangularly to one another and each stage 1A-1D is provided with a conveying belt 4 and a wafer presser foot 5. An ion-implantation is performed in a wafer on the vertically positioned stage 1B. At this time, an ion-implantation finished wafer is on the horizontally positioned stage 1A, the wafer presser foot 5 on the stage 1A is thrusted up by a cylinder and the ion-implantation finished wafer is carried by the belt 4 and so on and is replaced with an ion-unimplanted wafer. At a point of time when actuation on the stages 1B and 1A end, the shaft 3 is rotated at 90 deg., the stage 1B is moved to the position of the stage 1A and the stage 1C holding the ion-unimplanted wafer is moved to the position of the stage 1B. Thereby, the treating time for ion-implantation can be significantly shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ion implantation apparatus used in the manufacture of ICs.

[Conventional technology]

Conventionally, in this type of ion implanter, the implantation target stage is fixed to a rotating shaft and rotated 90" from horizontal to vertical, and the wafer is repositioned as follows. was.

That is, the wafer is transported from the carrier onto a stage placed horizontally by a transport belt, placed at a predetermined position by a transport belt provided on the stage, and then held down by a wafer presser. Next, after the stage moves vertically, ions are implanted into the wafer. After the ion implantation is completed, the stage becomes horizontal again, the wafer holder is lifted by the cylinder, and the implanted wafer is stored on the storage stage by the conveyor belt.

[Problem to be solved by the invention]

In the conventional ion implanter mentioned above, only one stage is fixed to the rotating shaft, so after the implantation is completed,
Implanted and unimplanted wafers must be exchanged. Therefore, there is a drawback that the ion implantation process requires a lot of time.

An object of the present invention is to provide an ion implantation device with short processing time.

[Means to solve the problem]

The ion implantation apparatus of the present invention includes a rotating shaft connected to a motor, an implantation target stage having one side fixed to the rotating shaft, and a conveyor belt 7 and a wafer holder provided on the stage. Four stages are fixed to the rotating shaft, and the surfaces of each stage are positioned at approximately right angles.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a stage according to an embodiment of the present invention.

In FIG. 1, the rotating shaft 3 connected to the motor 2 has four
The stages IA to ID are fixed, and the surfaces of each stage are positioned at approximately right angles. Each of the four stages IA to ID is provided with a conveyor belt 4 and a wafer presser 5 as in the conventional stage.

In the ion implantation apparatus having the stage configured as described above, the wafer is repositioned as follows.

Ion implantation is performed on a wafer on a vertically positioned stage IB. At this time, the ion-implanted wafer is
It is on stage IA which has been moved to a horizontal position. and,
The wafer holder 5 on the stage IA is pushed up by a cylinder, and the injected wafers are carried by the conveyor belt 4 or the like and replaced with uninjected wafers.

When the ion implantation into the wafer on stage IB and the repositioning of the wafer on stage IA are completed, the rotary shaft 3 is rotated by 90 degrees by the motor 2, and the stage IB returns to the position of stage IA, and the unimplanted wafer is returned to the position of stage IA. The held stage IC is moved to the position of stage IB, and ion implantation and wafer replacement are performed again.

As described above, according to this embodiment, since the wafer can be repositioned during ion implantation, the processing time for ion implantation can be significantly shortened.

〔Effect of the invention〕

As explained above, in the present invention, by fixing stages for four implantation targets to the rotating shaft of the ion implanter, ions can be implanted into a wafer and the implanted wafer can be repositioned at the same time. This has the effect of shortening the processing time for ion implantation.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a stage according to an embodiment of the present invention. ■A~ID...Stage, 2...Motor, 3...
Rotating shaft, 4... Conveyor belt, 5... Wafer holder.

Claims (1)

[Claims] In an ion implantation apparatus having a rotating shaft connected to a motor, a stage for an implantation target having one side fixed to the rotating shaft, and a conveyor belt and a wafer holder provided on the stage, the rotating shaft has four plates. An ion implantation apparatus characterized in that the stages are fixed and the surfaces of each stage are positioned at substantially right angles.