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JPH09246228A - Draining device of substrate - Google Patents

Draining device of substrate

Info

Publication number
JPH09246228A
JPH09246228A JP4521896A JP4521896A JPH09246228A JP H09246228 A JPH09246228 A JP H09246228A JP 4521896 A JP4521896 A JP 4521896A JP 4521896 A JP4521896 A JP 4521896A JP H09246228 A JPH09246228 A JP H09246228A
Authority
JP
Japan
Prior art keywords
substrate
spot
air knife
transport
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4521896A
Other languages
Japanese (ja)
Other versions
JP3659526B2 (en
Inventor
Yoshihiko Matsushita
佳彦 松下
Mitsuaki Yoshitani
光明 芳谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP4521896A priority Critical patent/JP3659526B2/en
Publication of JPH09246228A publication Critical patent/JPH09246228A/en
Application granted granted Critical
Publication of JP3659526B2 publication Critical patent/JP3659526B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To blow off treatment liquid attaching to a substrate completely by permitting a device to be short and compact, minimizing increase of a use amount of gas and a manufacturing cost and making an adjustment operation easy. SOLUTION: A draining tank 2 is provided with a carrier roller 6 forming a carrier surface P which tilts at an angle ω to one side toward a carrier traveling direction, an air knife 11 provided up and down the carrier surface P and a spot jet means 21 at the downstream side in a carrier traveling direction of the air knife 11. The air knife 11 tilts to a width direction of the carrier surface P by an angle θ1 so that a lower end is in clined closer to the downstream side in a carrier traveling direction than an upper end. A spot jet means 21 has a slit-like jet port 21a facing the carrier surface P and tilts to a width direction of the carrier surface P by an angle θ2 so that a lower end thereof is inclined closer to the downstream side in a carrier direction than an upper end.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、例えば液晶表示器
用のガラス基板、半導体ウエハ基板等を対象とし、処理
液が付着したこれら基板の表面に向けて気体を噴射する
ようにした基板の液切り装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is directed to, for example, a glass substrate for a liquid crystal display, a semiconductor wafer substrate, etc., and drains a substrate by injecting a gas toward the surface of the substrate to which a treatment liquid is attached. Regarding the device.

【0002】[0002]

【従来の技術】従来、例えば液晶表示器を製造する場
合、板状のガラス基板の表面に種々の処理液を順次供給
する、いわゆる湿式表面処理が施される。この湿式表面
処理は、ガラス基板の表面を洗浄した後に、現像、エッ
チング、剥膜等の薬液処理を施すもので、各薬液処理毎
に純水による水洗処理が行われる。これらの水洗処理が
施された基板上には水洗に使用された処理液が基板表面
に付着しているが、この付着液は各水洗処理工程毎に除
去しておく必要がある。そのために用いられる液切り装
置としては従来、例えば図9に示すように、搬送ローラ
51,…を搬送方向に並列軸支してなる搬送機構に対し
て、この搬送面の上下に、搬送面の幅方向に延びるスリ
ット状の噴射口52aを有したエアーナイフ52を、噴
射口52aの一端が他端よりも搬送方向下流側へずれる
ように平面視で搬送方向と直交する方向に対して角度θ
だけ傾斜させて設け、水平状態で搬送される基板53の
表面に向けてエアーナイフ52の噴射口52aから気体
を噴射し、この噴流によって基板53に付着した処理液
を角部53aへ押し流し、吹き飛ばすようにしたものが
知られている(例えば特開平7ー302779号公報を
参照)。
2. Description of the Related Art Conventionally, in the case of manufacturing a liquid crystal display, for example, a so-called wet surface treatment is performed in which various treatment liquids are sequentially supplied onto the surface of a plate-shaped glass substrate. In this wet surface treatment, after cleaning the surface of the glass substrate, a chemical treatment such as development, etching, and film removal is performed, and a washing treatment with pure water is performed for each chemical treatment. The treatment liquid used for water washing adheres to the surface of the substrate on the substrate subjected to the water washing treatment, but the attached liquid needs to be removed in each water washing treatment step. Conventionally, as a liquid draining device used for that purpose, as shown in FIG. 9, for example, as shown in FIG. 9, a transport mechanism including support rollers 51, ... The air knife 52 having the slit-shaped ejection port 52a extending in the width direction is formed so that one end of the ejection port 52a is displaced to the downstream side in the transport direction from the other end with respect to a direction orthogonal to the transport direction in plan view.
The gas is jetted from the jet port 52a of the air knife 52 toward the surface of the substrate 53 conveyed in a horizontal state, and the jetting jet pushes the processing liquid adhering to the substrate 53 to the corner 53a and blows it away. Such a method is known (see, for example, Japanese Patent Application Laid-Open No. 7-302779).

【0003】[0003]

【発明が解決しようとする課題】上記従来のものでは、
基板53の後部が前工程の湿式表面処理のエリアから未
だ出きっていないときには、処理液が基板53の表面を
伝って前部へと流れ込むから、この状態でエアーナイフ
52から気体を吹き付けると、処理液が跳ねて却って水
切りを阻害する。そこで、エアーナイフ52よりも搬送
方向上流側にほぼ基板53の全長分に相当する長さのニ
ュートラルゾーンNを設けておき、このニュートラルゾ
ーンNでは単に基板53を搬送するだけにし、これを過
ぎて基板53が完全に液切り装置の中に入ってから、エ
アーナイフ52からの気体を吹き付けるようにしてい
た。このため、液切り装置の全長が長くなるという問題
があった。
SUMMARY OF THE INVENTION In the above prior art,
When the rear portion of the substrate 53 has not yet come out of the area of the wet surface treatment of the previous step, the treatment liquid flows along the surface of the substrate 53 and flows into the front portion. Therefore, if gas is blown from the air knife 52 in this state, The treatment liquid bounces off and hinders drainage. Therefore, a neutral zone N having a length substantially corresponding to the entire length of the substrate 53 is provided on the upstream side of the air knife 52 in the transporting direction, and the substrate 53 is simply transported in this neutral zone N, and past this. The gas from the air knife 52 was blown after the substrate 53 completely entered the liquid draining device. Therefore, there is a problem that the total length of the liquid draining device becomes long.

【0004】また基板53の角部53aへ押し流された
処理液は角部53aを構成する基板の表裏面および基板
端面に亘って付着するが、基板の端面部はエアーナイフ
の噴流の力を受けにくいため、噴流によって完全に吹き
飛ばすことができないことがあり、そのときに水滴状に
残留した処理液により基板表面にシミが発生し基板汚染
の原因となったり、乾燥して基板表面に残留した固形物
がパーティクル発生の原因となるなどの問題が発生す
る。そのための対策として、エアーナイフ52の搬送方
向下流側に更にエアーナイフ52を追設し、2段構えに
したものが採用されているが、この追設のためにスペー
スを要して装置が大型化するし、気体の使用量が倍増
し、製造コストも増す。しかも噴流の流量などを両エア
ーナイフ52,52の噴射口52a,52aの全長に亘
って均一に調整する作業は困難である。更に近年、処理
される基板が大型化されており、エアーナイフ自体も大
型化するため、益々不利な条件となっている。またエア
ーナイフを2段構えにしても基板角部の水滴は充分に除
去しきれないといった問題があった。
Further, the processing liquid pushed to the corner portion 53a of the substrate 53 adheres to the front and back surfaces of the substrate forming the corner portion 53a and the substrate end surface, but the end surface portion of the substrate receives the force of the jet flow of the air knife. Since it is difficult, it may not be able to be completely blown off by a jet flow, and at that time, the treatment liquid that remains in the form of water droplets may cause stains on the substrate surface and cause substrate contamination, or dry solids that remain on the substrate surface. Problems such as things causing particles will occur. As a countermeasure for this, an air knife 52 is additionally installed on the downstream side of the air knife 52 in the conveying direction to have a two-stage structure. However, this additional space requires a large size device. And the amount of gas used will double and the manufacturing cost will increase. Moreover, it is difficult to uniformly adjust the flow rate of the jet flow and the like over the entire length of the jet ports 52a, 52a of both air knives 52, 52. Further, in recent years, the substrates to be processed have been increased in size, and the air knife itself has also been increased in size, which is an increasingly disadvantageous condition. There is also a problem that even if the air knife is held in two stages, the water droplets at the corners of the substrate cannot be removed sufficiently.

【0005】本発明は、上記のような問題点を解決する
ためになされたものであり、搬送面を幅方向に傾斜させ
て基板表面に流れ込む処理液が溜まらないようにしつつ
エアーナイフで処理液を効果的に吹き飛ばし、さらに角
部に残留する処理液に気体のスポット流を当てることに
より、装置を短くコンパクトに収め、気体の使用量及び
製造コストの増加を最小に抑え、しかも調整作業を容易
にして、基板に付着した処理液を完全に吹き飛ばすこと
ができる基板の液切り装置を提供することを目的として
いる。
The present invention has been made to solve the above-mentioned problems, and the processing liquid is tilted in the width direction so that the processing liquid flowing into the surface of the substrate is not accumulated and is treated by an air knife. By effectively blowing away the gas, and by applying a gas spot flow to the treatment liquid remaining at the corners, the device can be stored in a short and compact form, minimizing the increase in gas usage and manufacturing costs and facilitating adjustment work. Another object of the present invention is to provide a substrate drainer capable of completely blowing off the processing liquid adhering to the substrate.

【0006】[0006]

【課題を解決するための手段】請求項1記載の発明は、
搬送される基板の表面に向けてエアーナイフのスリット
状の噴射口から気体を噴射するようにした基板の液切り
装置において、搬送面を搬送方向に向かって片側へ傾斜
させて設定すると共に、上記エアーナイフを、噴射口の
下端が上端よりも搬送方向下流側へずれるように搬送面
の幅方向に対して傾斜させて設け、上記噴射口下端の下
流側に、基板の角部に向けて気体のスポット流を噴射す
るスポット噴射手段を設けたことを特徴とするものであ
る。
According to the first aspect of the present invention,
In a substrate drainer configured to inject a gas from a slit-shaped ejection port of an air knife toward the surface of a substrate to be transported, the transport surface is set to be inclined to one side in the transport direction, and The air knife is provided so as to be inclined with respect to the width direction of the transport surface so that the lower end of the jet port is displaced to the downstream side in the transport direction from the upper end, and the gas is directed toward the corner of the substrate on the downstream side of the lower end of the jet port. It is characterized in that a spot injection means for injecting the spot flow is provided.

【0007】この発明によれば、搬送面が搬送方向に向
かって片側へ傾斜するから、前工程から流れ込む処理液
が基板の側方へ流れ落ち、基板表面に溜まらない。した
がってニュートラルゾーンが不要となると共に、エアー
ナイフの液切りに対する負荷が軽減される。そして、エ
アーナイフの噴射口から噴射される噴流により基板上の
大部分の処理液は液切りされ、基板の端面に付着した処
理液は角部へ押し流される。次いでスポット噴射手段か
ら噴射される気体のスポット流により上記角部に残留す
る処理液が完全に吹き飛ばされる。その場合、エアーナ
イフを2段構えにすることに較べれば、装置がコンパク
トであり、気体の使用量は少なく、製造コストは安くつ
き、スポット噴射手段の流量調整が容易となる。
According to the present invention, since the transfer surface is inclined to one side in the transfer direction, the processing liquid flowing from the previous step flows down to the side of the substrate and does not collect on the substrate surface. Therefore, the neutral zone is not necessary and the load on the drainage of the air knife is reduced. Then, most of the processing liquid on the substrate is drained by the jet flow ejected from the ejection port of the air knife, and the processing liquid adhering to the end surface of the substrate is pushed to the corners. Then, the treatment liquid remaining at the corners is completely blown off by the spot flow of the gas jetted from the spot jetting means. In that case, compared to the two-stage air knife, the device is compact, the amount of gas used is small, the manufacturing cost is low, and the flow rate adjustment of the spot injection means is easy.

【0008】請求項2記載の発明は、請求項1記載の発
明において、上記スポット噴射手段の噴射口がスリット
状に形成され、このスポット噴射手段が、上記エアーナ
イフとほぼ同じ方向に搬送面の幅方向に対して傾斜させ
て設けられていることを特徴とするものである。この発
明によれば、スポット噴射手段からの噴流が、ある程度
の幅をもつ均一な流れとなるから、上記角部に残留する
処理液が確実に吹き飛ばされる。
According to a second aspect of the present invention, in the first aspect of the present invention, the jet port of the spot jetting means is formed in a slit shape, and the spot jetting means forms a slit on the conveying surface in substantially the same direction as the air knife. It is characterized in that it is provided so as to be inclined with respect to the width direction. According to this invention, the jet flow from the spot jetting means becomes a uniform flow having a certain width, so that the treatment liquid remaining at the corners is surely blown off.

【0009】請求項3記載の発明は、請求項1又は2記
載の発明において、上記エアーナイフが、噴射口からの
噴流が直下よりも搬送方向上流側へ向くように搬送面に
垂直な方向に対して傾斜して設けられていることを特徴
とするものである。この発明によれば、エアーナイフの
噴射口から噴射される噴流が搬送方向上流側へと方向づ
けられるから、基板に付着する処理液が確実に角部へ押
し流される。
According to a third aspect of the present invention, in the first or second aspect of the invention, the air knife is arranged in a direction perpendicular to the conveying surface so that the jet flow from the jet port is directed to the upstream side in the conveying direction rather than directly below. It is characterized in that it is provided so as to be inclined. According to this aspect of the invention, since the jet flow jetted from the jet port of the air knife is directed to the upstream side in the transport direction, the processing liquid adhering to the substrate is surely swept to the corner portion.

【0010】請求項4記載の発明は、請求項1〜3記載
の発明において、上記エアーナイフ及びスポット噴射手
段が、搬送面の上下にそれぞれ一対ずつ設けられている
ことを特徴とするものである。この発明によれば、基板
の上面及び下面の両方に付着した処理液が、共に完全に
吹き飛ばされる。
A fourth aspect of the invention is characterized in that, in the first to third aspects of the invention, the air knife and the spot injection means are provided in pairs, one above and one below the conveying surface. . According to the present invention, the processing liquid attached to both the upper surface and the lower surface of the substrate is completely blown off.

【0011】[0011]

【発明の実施の形態】図1は、本発明に係る基板Bの液
切り装置1の一実施形態を示す一部切欠き斜視図であ
る。同図において、2は箱形の液切り槽であって、この
液切り槽2の側板には基板受入口3が開口し、液切り槽
2の内部がこの基板受入口3を介して隣接する水洗装置
4の内部に連通している。液切り槽2の内部には基板B
の搬送機構5を設けている。
1 is a partially cutaway perspective view showing an embodiment of a liquid draining device 1 for a substrate B according to the present invention. In the figure, 2 is a box-shaped liquid draining tank, a substrate receiving port 3 is opened in a side plate of the liquid draining tank 2, and the inside of the liquid draining tank 2 is adjacent via the substrate receiving port 3. It communicates with the inside of the water washing device 4. The substrate B is placed inside the draining tank 2.
The transport mechanism 5 is provided.

【0012】上記搬送機構5は、搬送方向に並列軸支さ
れた搬送ローラ6,…と、これらの搬送ローラ6,…を
同期して回転させる駆動機構7とを備え、水洗装置4で
水洗処理された基板Bを基板受入口3で受取り、これを
搬送ローラ6,…上に仮想的に設定された搬送面Pに沿
って搬送し、次行程へと送るようにしている。そして、
図3に示すように、搬送ローラ6,…の回転軸を水平軸
に対して角度ωだけ傾斜させて設けており、これによっ
て上記搬送機構5は、搬送面Pを搬送方向に向かって片
側へ角度ωだけ傾斜して設定されている。この角度ω
は、本実施形態では約4〜6度程度に設定されている。
これは傾斜が緩過ぎると処理液が流れ落ちにくくなって
液切れ性が悪いからであり、傾斜がきつ過ぎると処理液
が流れ過ぎて直水洗後の部分的なシミが発生する可能性
があるからである。しかし、本発明は上記の角度に限定
されるものではない。なお、8はドレンパンである。
The transport mechanism 5 comprises transport rollers 6, ..., Which are rotatably supported in parallel in the transport direction, and a drive mechanism 7 which rotates these transport rollers 6 ,. The substrate B thus received is received by the substrate receiving port 3, and is transported along a transport surface P virtually set on the transport rollers 6, ... And sent to the next step. And
As shown in FIG. 3, the rotation axes of the transport rollers 6, ... Are inclined with respect to the horizontal axis by an angle ω, whereby the transport mechanism 5 moves the transport surface P to one side in the transport direction. It is set to be inclined by an angle ω. This angle ω
Is set to about 4 to 6 degrees in this embodiment.
This is because if the slope is too gentle, the treatment liquid will not flow down easily and the liquid drainage is poor, and if the slope is too tight, the treatment liquid will flow too much and partial stains may occur after direct water washing. Is. However, the present invention is not limited to the above angles. In addition, 8 is a drain pan.

【0013】11、12は搬送面Pの上下に設けられた
エアーナイフであって、ほぼ搬送面Pの幅方向に延び、
且つ搬送面Pに向いたスリット状の噴射口11a、12
aを有している。図2に示すように、これらのエアーナ
イフ11、12は、噴射口11a、12aの下端が上端
よりも搬送方向下流側へずれるように搬送面Pの幅方向
に対して角度θ1だけ傾斜して設けられている。この角
度θ1は、45度前後が好ましいが、搬送ローラ6など
の周辺部材の取付作業性を確保する理由から、約7度程
度に設定されているが、これに限定されるものではな
い。エアーナイフ11、12はエア管路13を介して清
浄エアー源14に接続されていて、清浄エアー源14か
ら供給される高圧エアーを、噴射口11a、12aから
搬送面Pに向けて噴射するようにしている。15はエア
管路13に設けられた流量調整用の制御弁である。ま
た、清浄エアー源14から供給される気体は清浄エアー
に限定されるものではなく、N2ガスなどの不活性ガス
を用いてもよい。
Reference numerals 11 and 12 denote air knives provided above and below the carrying surface P, and extend substantially in the width direction of the carrying surface P.
In addition, the slit-shaped injection ports 11a and 12 facing the transport surface P
a. As shown in FIG. 2, these air knives 11 and 12 are inclined by an angle θ1 with respect to the width direction of the conveyance surface P so that the lower ends of the ejection ports 11a and 12a are displaced toward the downstream side in the conveyance direction from the upper ends. It is provided. The angle θ1 is preferably about 45 degrees, but is set to about 7 degrees for the purpose of ensuring workability in mounting peripheral members such as the transport roller 6, but the angle θ1 is not limited to this. The air knives 11 and 12 are connected to a clean air source 14 via an air conduit 13 so that the high pressure air supplied from the clean air source 14 is jetted from the jet ports 11a and 12a toward the transport surface P. I have to. Reference numeral 15 is a control valve provided in the air pipeline 13 for adjusting the flow rate. The gas supplied from the clean air source 14 is not limited to clean air, and an inert gas such as N 2 gas may be used.

【0014】上記エアーナイフ噴射口11a、12aの
両端部のうち、上記搬送方向下流側へずれている下端の
下流側には、スポット噴射手段21、22が設けられて
いる。このスポット噴射手段21、22は上記エアーナ
イフ11、12とほぼ同様の構造であり、ほぼ搬送面P
の幅方向に延び、且つ搬送面Pに向いたスリット状の噴
射口21a、22aを有している。図2に示すように、
これらのスポット噴射手段21、22は、噴射口21
a、22aの下端が上端よりも搬送方向下流側へずれる
ように搬送面Pの幅方向に対して角度θ2だけ傾斜して
設けられている。この角度θ2は、本実施形態では約1
0度程度に設定されているが、これに限定されるもので
はない。スポット噴射手段21、22は上記エア管路1
3を介して清浄エアー源14に接続されていて、清浄エ
アー源14から供給される高圧エアーを、噴射口21
a、22aから搬送面Pに向けてスポット流にして噴射
するようにしている。
Spot ejecting means 21 and 22 are provided on the downstream side of the lower ends of the air knife jetting openings 11a and 12a, which are offset toward the downstream side in the conveying direction. The spot jetting means 21 and 22 have a structure similar to that of the air knives 11 and 12, and are almost the same as the conveying surface P.
It has slit-shaped injection ports 21a, 22a extending in the width direction of and facing the transport surface P. As shown in FIG.
These spot ejecting means 21, 22 are
The lower ends of the a and 22a are inclined with respect to the width direction of the conveying surface P by an angle θ2 so that the lower ends of the a and 22a are shifted toward the downstream side in the conveying direction. This angle θ2 is about 1 in this embodiment.
Although it is set to about 0 degrees, it is not limited to this. The spot injection means 21 and 22 are the above-mentioned air pipelines 1.
3, which is connected to the clean air source 14 via high pressure air supplied from the clean air source 14.
A spot flow is ejected from a and 22a toward the transport surface P.

【0015】図4に示すように、上記エアーナイフ1
1、12及びスポット噴射手段21、22は、いずれも
噴射口11a、12a及び21a、22aからの噴流が
直下よりも搬送方向上流側へ向くように側面視で角度φ
1、φ2だけそれぞれ傾斜して設けられている。この角度
φ1、φ2は、本実施形態では約30度程度に等しく設定
されているが、これに限定されるものではなく、また一
致させなくてもよい。それぞれの角度φ1、φ2は、処理
液の種類や噴射液圧、噴射エア圧、搬送速度などを勘案
して所要の角度が設定される。
As shown in FIG. 4, the air knife 1 is used.
1 and 12 and the spot injection means 21 and 22 are angle φ in a side view so that the jets from the injection ports 11a, 12a and 21a, 22a may be directed to the upstream side in the transport direction rather than directly below.
It is provided with an inclination of 1 and φ2 respectively. The angles φ1 and φ2 are set equal to about 30 degrees in the present embodiment, but they are not limited to this and may not be the same. The respective angles φ1 and φ2 are set to desired angles in consideration of the type of processing liquid, the injection liquid pressure, the injection air pressure, the transport speed, and the like.

【0016】上記実施形態では、図2に示すように水洗
装置4から基板Bを搬入すると、基板Bの後部が水洗装
置4から未だ出きっていないときには、純水などの処理
液Lが基板Bの表面を伝わって前部へと流れ込むが、搬
送面Pが搬送方向に向かって片側へ傾斜するから、基板
へ供給された処理液Lは基板Bの側方へ流れ落ち、基板
表面に溜らない。したがってエアーナイフ11,12の
液切りに対する負荷が軽減されるので、ニュートラルゾ
ーンが不要となり、その分だけ装置の全長を短くするこ
とができる。そして、この基板Bが更に下流へ搬送され
ると、エアーナイフ11、12の噴射口11a、12a
から噴射される噴流により基板B上の処理液Lの大部分
は除去され、端面部の処理液Lは角部bへ押し流される
(図5の状態)。次いでスポット噴射手段21、22の
噴射口21a、22aから噴射されるエアのスポット流
により上記角部bに水滴状に残留する処理液Lが完全に
吹き飛ばされ(図6の状態)、これにより基板B上に残
留液のシミができることがなくなる。その場合、エアー
ナイフを2段構えにすることに較べれば、エアーナイフ
11、12よりも小さなスポット噴射手段21、22を
設けるに過ぎないから装置がコンパクトであり、またス
ポット流であるために気体の使用量は少なく、製造コス
トは安くつき、しかもスポット噴射手段21、22の流
量調整も容易となり、手間がかからない。
In the above embodiment, when the substrate B is carried in from the water washing device 4 as shown in FIG. 2, when the rear part of the substrate B is not yet out of the water washing device 4, the processing liquid L such as pure water is added to the substrate B. However, since the transport surface P is inclined to one side in the transport direction, the processing liquid L supplied to the substrate flows to the side of the substrate B and does not collect on the substrate surface. Therefore, the load on the liquid cutting of the air knives 11 and 12 is reduced, so that the neutral zone becomes unnecessary and the total length of the device can be shortened accordingly. When the substrate B is transported further downstream, the air knives 11 and 12 have the ejection ports 11a and 12a.
Most of the processing liquid L on the substrate B is removed by the jet flow ejected from the substrate B, and the processing liquid L on the end face portion is pushed to the corner portion b (state in FIG. 5). Next, the treatment liquid L remaining in the form of water droplets on the corner b is completely blown off by the spot flow of air jetted from the jetting ports 21a and 22a of the spot jetting means 21 and 22 (state of FIG. 6). The stain of the residual liquid is not formed on B. In that case, as compared with the case where the air knife is set in two stages, the apparatus is compact because only the spot injection means 21 and 22 smaller than the air knives 11 and 12 are provided, and the gas flow because of the spot flow. Is small in amount, the manufacturing cost is low, and the flow rate adjustment of the spot spraying means 21 and 22 is easy.

【0017】また、スポット噴射手段21、22の噴射
口21a、22aがスリット状に形成され、しかもエア
ーナイフ11、12とほぼ同じ方向に角度θ2だけ傾斜
しているから、スポット噴射手段21、22からの噴流
が、ある程度の幅をもつ均一な流れとなり、基板Bの角
部bに残留する処理液Lを確実に吹き飛ばすことができ
る。
Further, since the jetting ports 21a, 22a of the spot jetting means 21, 22 are formed in a slit shape and are inclined in the same direction as the air knives 11, 12 by an angle θ2, the spot jetting means 21, 22 are formed. The jet from the above becomes a uniform flow having a certain width, and the processing liquid L remaining on the corner portion b of the substrate B can be surely blown off.

【0018】さらに、エアーナイフ11、12が、噴射
口11a、12aからの噴流が直下よりも搬送方向上流
側へ向くように傾斜しているから、エアーナイフ11、
12の噴射口11a、12aから噴射される噴流が搬送
方向上流側へと方向付けられ、基板Bに付着する処理液
Lを確実に基板Bの角部bへ押し流すことができる。
Further, since the air knives 11 and 12 are inclined so that the jet flows from the jet ports 11a and 12a are directed to the upstream side in the transport direction rather than immediately below, the air knives 11 and 12 are
The jets ejected from the 12 ejection ports 11a and 12a are directed to the upstream side in the transport direction, and the processing liquid L adhering to the substrate B can be surely pushed to the corner portion b of the substrate B.

【0019】また、エアーナイフ11、12及びスポッ
ト噴射手段21、22が、搬送面Pの上下にそれぞれ一
対ずつ設けられているから、基板Bの上面及び下面の両
方に付着した処理液Lを、一挙に完全に吹き飛ばすこと
ができる。
Further, since the air knives 11 and 12 and the spot spraying means 21 and 22 are provided in pairs on the upper and lower sides of the transfer surface P, respectively, the processing liquid L attached to both the upper surface and the lower surface of the substrate B is It can be completely blown away at once.

【0020】上記実施形態ではスポット噴射手段21、
22をスリット状の噴射口21a、22aを有するエア
ーナイフ11、12とほぼ同様の構造のものとしたが、
図7に示すように開口21′aが搬送面Pに向くキャピ
ラリーチューブによりスポット噴射手段21′を構成し
てもよい。また図8に示すように開口21″aが搬送面
Pに向く複数の管を並設することによりスポット噴射手
段21″を構成してもよい。
In the above embodiment, the spot injection means 21,
22 has a structure similar to that of the air knives 11 and 12 having the slit-shaped injection ports 21a and 22a,
As shown in FIG. 7, the spot injection means 21 'may be configured by a capillary tube whose opening 21'a faces the transport surface P. Further, as shown in FIG. 8, the spot injection unit 21 ″ may be configured by arranging a plurality of pipes whose openings 21 ″ a face the transport surface P in parallel.

【0021】上記実施形態ではエアーナイフ11、12
及びスポット噴射手段21、22へエアを供給したが、
他の気体を供給したものについても本発明を用いること
ができる。また実施形態ではスポット噴射手段21、2
2を側面視で角度φ2だけ傾斜させたが、スポット噴射
手段21、22はスポット流により角部bに残留する処
理液Lを吹き飛ばすものであるから、スポット噴射手段
21、22を搬送面Pに対して垂直に設けてもよい。
In the above embodiment, the air knives 11 and 12 are used.
And air was supplied to the spot injection means 21 and 22,
The present invention can be applied to the case where another gas is supplied. Further, in the embodiment, the spot injection means 21, 2
Although 2 is tilted by an angle φ2 in a side view, the spot jetting means 21, 22 blow the treatment liquid L remaining at the corner portion b by the spot flow. Alternatively, it may be provided vertically.

【0022】また、上記実施形態では、水洗装置で水洗
処理された基板表面の処理液を除去する場合について記
載したが、水洗装置ではなく、現像、エッチング、剥離
などの薬液処理後の液切り装置として用いることもでき
る。
In the above embodiment, the case where the treatment liquid on the surface of the substrate which has been subjected to the washing treatment with the washing device is removed has been described. However, not the washing device but the draining device after the chemical treatment such as development, etching and peeling is performed. Can also be used as

【0023】[0023]

【発明の効果】上記請求項1記載の発明によれば、前工
程から流れ込む処理液を基板の側方へ流れ落とすから、
ニュートラルゾーンが不要となり、装置を短くすること
ができる。さらに処理液を流れ落とした状態でエアーナ
イフの噴流により基板に付着する処理液を角部へ押し流
し、スポット噴射手段のスポット流を上記角部に噴射す
るので、エアーナイフを2段構えにすること等に較べて
装置をコンパクト化し、気体の使用量を少なくし、製造
コストを安くし、且つ流量調整作業を容易としながら、
基板に付着した処理液を完全に吹き飛ばすことができ、
基板上に残留液のシミが現れることを確実に防止でき
る。
According to the first aspect of the present invention, since the processing liquid flowing from the previous process flows down to the side of the substrate,
The neutral zone is no longer required and the device can be shortened. Further, with the processing liquid flowing down, the processing liquid adhering to the substrate is pushed to the corners by the jet flow of the air knife, and the spot flow of the spot injection means is jetted to the corners. While making the device more compact, reducing the amount of gas used, reducing the manufacturing cost, and facilitating the flow adjustment work,
You can completely blow off the processing liquid adhering to the substrate,
It is possible to surely prevent the stain of the residual liquid from appearing on the substrate.

【0024】上記請求項2記載の発明によれば、ある程
度の幅をもつ均一な噴流によって角部に残留する処理液
を確実に吹き飛ばすことができる。
According to the second aspect of the present invention, the treatment liquid remaining at the corners can be reliably blown off by a uniform jet having a certain width.

【0025】上記請求項3記載の発明によれば、エアー
ナイフの噴流が搬送方向上流側へと方向づけられるか
ら、基板に付着する処理液を確実に角部へ押し流すこと
ができ、スポット流による残留処理液の吹き飛ばしを確
実に行うことができる。
According to the third aspect of the present invention, since the jet flow of the air knife is directed to the upstream side in the transport direction, the processing liquid adhering to the substrate can be surely pushed to the corners, and the spot flow causes the residual liquid. The treatment liquid can be surely blown off.

【0026】上記請求項4記載の発明によれば、基板の
上面及び下面の両方に付着した処理液を、共に完全に吹
き飛ばすことができる。
According to the fourth aspect of the present invention, the processing liquid adhered to both the upper surface and the lower surface of the substrate can be completely blown off.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施形態を示す一部切り欠き斜視図
である。
FIG. 1 is a partially cutaway perspective view showing an embodiment of the present invention.

【図2】上記実施形態の要部平面図である。FIG. 2 is a plan view of an essential part of the above embodiment.

【図3】上記実施形態の搬送機構を搬送方向に向かって
みた図である。
FIG. 3 is a diagram of the transport mechanism of the above embodiment as viewed in the transport direction.

【図4】図2におけるX方向矢視図である。FIG. 4 is a view taken in the direction of the arrow X in FIG.

【図5】基板がエアーナイフの付近を通過するときの図
2相当図である。
FIG. 5 is a view corresponding to FIG. 2 when a substrate passes near an air knife.

【図6】基板がスポット噴射手段の付近を通過するとき
の図2相当図である。
FIG. 6 is a view corresponding to FIG. 2 when the substrate passes near the spot ejection unit.

【図7】別の実施形態を示す図2相当図である。FIG. 7 is a view corresponding to FIG. 2 showing another embodiment.

【図8】更に別の実施形態を示す図2相当図である。FIG. 8 is a view corresponding to FIG. 2 showing still another embodiment.

【図9】従来例を説明する図2相当図である。FIG. 9 is a view for explaining a conventional example, which corresponds to FIG. 2.

【符号の説明】[Explanation of symbols]

1 液切り装置 B 基板 b 角部 5 搬送機構 P 搬送面 11 エアーナイフ 11a 噴射口 12 エアーナイフ 12a 噴射口 21 スポット噴射手段 21a 噴射口 22 スポット噴射手段 22a 噴射口 DESCRIPTION OF SYMBOLS 1 Draining device B Substrate b Corner 5 Transport mechanism P Transport surface 11 Air knife 11a Jet port 12 Air knife 12a Jet port 21 Spot jet means 21a Jet port 22 Spot jet means 22a Jet port

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 搬送される基板の表面に向けてエアーナ
イフのスリット状の噴射口から気体を噴射するようにし
た基板の液切り装置において、搬送面を搬送方向に向か
って片側へ傾斜させて設定すると共に、上記エアーナイ
フを、噴射口の下端が上端よりも搬送方向下流側へずれ
るように搬送面の幅方向に対して傾斜させて設け、上記
噴射口下端の下流側に、基板の角部に向けて気体のスポ
ット流を噴射するスポット噴射手段を設けたことを特徴
とする基板の液切り装置。
1. A substrate draining device in which gas is jetted from a slit-shaped jet port of an air knife toward the surface of a substrate to be transported, in which the transport surface is inclined to one side in the transport direction. In addition to setting, the air knife is provided so as to be inclined with respect to the width direction of the transport surface so that the lower end of the jet port is shifted to the downstream side in the transport direction from the upper end, and the corner of the substrate is provided on the downstream side of the lower end of the jet port. A device for draining a substrate, characterized in that spot ejecting means for ejecting a gas spot flow toward the portion is provided.
【請求項2】 上記スポット噴射手段の噴射口がスリッ
ト状に形成され、このスポット噴射手段が、上記エアー
ナイフとほぼ同じ方向に搬送面の幅方向に対して傾斜さ
せて設けられている請求項1記載の基板の液切り装置。
2. The injection port of the spot ejecting means is formed in a slit shape, and the spot ejecting means is provided so as to be inclined with respect to the width direction of the conveying surface in substantially the same direction as the air knife. 1. The substrate drainer according to 1.
【請求項3】 上記エアーナイフが、噴射口からの噴流
が直下よりも搬送方向上流側へ向くように搬送面に垂直
な方向に対して傾斜して設けられている請求項1又は2
記載の基板の液切り装置。
3. The air knife is provided so as to be inclined with respect to a direction perpendicular to the transport surface so that the jet flow from the jet port is directed to the upstream side in the transport direction rather than directly below.
The substrate drainer described.
【請求項4】 上記エアーナイフ及び上記スポット噴射
手段が、搬送面の上下にそれぞれ一対ずつ設けられてい
る請求項1〜3のいずれかに記載の基板の液切り装置。
4. The apparatus for draining a substrate according to claim 1, wherein the air knife and the spot ejecting means are provided in pairs one above and one below the carrying surface.
JP4521896A 1996-03-01 1996-03-01 Substrate drainer Expired - Fee Related JP3659526B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4521896A JP3659526B2 (en) 1996-03-01 1996-03-01 Substrate drainer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4521896A JP3659526B2 (en) 1996-03-01 1996-03-01 Substrate drainer

Publications (2)

Publication Number Publication Date
JPH09246228A true JPH09246228A (en) 1997-09-19
JP3659526B2 JP3659526B2 (en) 2005-06-15

Family

ID=12713138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4521896A Expired - Fee Related JP3659526B2 (en) 1996-03-01 1996-03-01 Substrate drainer

Country Status (1)

Country Link
JP (1) JP3659526B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003050601A1 (en) * 2001-12-13 2003-06-19 Sumitomo Precision Products Co., Ltd System for treating substrate and substrate dryer
WO2003050600A1 (en) * 2001-12-13 2003-06-19 Sumitomo Precision Products Co., Ltd System for treating substrate and substrate dryer
JP2009135508A (en) * 2008-12-22 2009-06-18 Shibaura Mechatronics Corp Apparatus for processing substrate
JP2010131485A (en) * 2008-12-03 2010-06-17 Dainippon Screen Mfg Co Ltd Device and method for draining liquid on substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003050601A1 (en) * 2001-12-13 2003-06-19 Sumitomo Precision Products Co., Ltd System for treating substrate and substrate dryer
WO2003050600A1 (en) * 2001-12-13 2003-06-19 Sumitomo Precision Products Co., Ltd System for treating substrate and substrate dryer
JP2010131485A (en) * 2008-12-03 2010-06-17 Dainippon Screen Mfg Co Ltd Device and method for draining liquid on substrate
JP2009135508A (en) * 2008-12-22 2009-06-18 Shibaura Mechatronics Corp Apparatus for processing substrate

Also Published As

Publication number Publication date
JP3659526B2 (en) 2005-06-15

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