JPH0774466A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To provide a method for manufacturing a reliable printed wiring board where ligh density wiring and packaging can be achieved in a simple process with a high yield. CONSTITUTION:This method is provided with a process for performing lamination layout by including synthetic resin sheet 3 between the surfaces for forming a group of conductor bump 2 of a support substrate provided while allowing the group of conductor bump 2 to correspond each other at a specific position and a process for forming a feedthrough-type conductor wiring part 3 by pressing a lamination body at a glass transformation temperature or plasticization temperature of the resin of the synthetic resin sheet 3 by heating the lamination body, inserting each conductor bump 2 into the thickness direction of the synthetic resin sheet 3, and then connecting the tip parts of mutually corresponding conductor bumps with plastic deformation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly, it has a structure in which wiring layers are connected by a through-type conductor wiring portion, and high-density wiring and mounting are highly reliable. The present invention relates to a method capable of manufacturing a printed wiring board with a good yield while reducing the number of steps.

[0002]

2. Description of the Related Art For example, in a double-sided printed wiring board or a multi-layered printed wiring board, electrical connection between wiring layers such as double-sided conductive patterns is made as follows. For example, in the case of a double-sided printed wiring board, perforation processing (perforation processing) is performed at a predetermined position on the double-sided copper foil-clad board, and chemical plating is performed on the entire surface, including the inner wall surface of the perforated hole,
The metal layer on the inner wall surface of the hole is thickened by electroplating to improve reliability and electrically connect the wiring layers. Also, in the case of a multilayer printed wiring board, after patterning the copper foils stretched on both sides of the substrate respectively, stacking and arranging the copper foils on the patterned surfaces via an insulating sheet (eg prepreg), and applying heat and pressure. After the integration, as in the case of the double-sided printed wiring board described above, a multilayer printed wiring board is obtained by electrical connection between wiring layers by punching and plating, and patterning of the surface copper foil. In the case of a multilayer printed wiring board having more wiring layers, it can be manufactured by a method of increasing the number of double-sided printed wiring boards inserted in the middle.

In the method of manufacturing a printed wiring board, as a method of electrically connecting wiring layers without using a plating method, a hole is made at a predetermined position on a double-sided copper foil-clad substrate, and a conductive paste is printed in the hole. There is also a method in which the resin component of the conductive paste poured into the holes is cured by a method or the like to electrically connect the wiring layers.

[0004]

As described above, in a method of manufacturing a printed wiring board that uses a plating method for electrical connection between wiring layers, holes for electrical connection between wiring layers are formed in a substrate. It has the disadvantages that it requires a drilling (drilling) process, a plating process including the inner wall surface of the drilled hole, the manufacturing process of the printed wiring board is redundant, and the process control is complicated. In addition, in the case of this plating method, when the thickness is increased in consideration of reliability, there is a problem that a short circuit easily occurs between the narrow pitch patterns. On the other hand, the method of embedding a conductive paste in the holes for electrical connection between the wiring layers by printing or the like also requires a drilling step as in the case of the plating method. Moreover, it is difficult to evenly (uniformly) pour and embed the conductive paste into the bored holes, and there is a problem in reliability of electrical connection. In any case, the need for the perforating step is reflected in the cost and yield of the printed wiring board, and there is a drawback that it cannot meet the demand for cost reduction.

Further, in the case of the electrical connection configuration between the wiring layers, since the conductor holes for connecting the wiring layers are provided on the front and back surfaces of the printed wiring board, the wiring is provided in the region of the conductor holes. Since it cannot be formed / arranged and an electronic component cannot be mounted, there is a problem that the improvement of the wiring density is restricted and the improvement of the mounting density of the electronic component is hindered. In other words, the printed wiring board obtained by the conventional manufacturing method is required to reduce the size of circuit devices by high-density wiring and high-density mounting, and thus the size of electronic devices.
There is a demand for a more practically effective method for producing a printed wiring board, which cannot be said to be sufficiently satisfactory, including the aforementioned cost aspect.

The present invention has been made in view of the above circumstances, and provides a method capable of manufacturing a highly reliable printed wiring board with a high yield, which enables wiring and mounting at a higher density by a simple process. To aim.

[0007]

According to a first method of manufacturing a printed wiring board of the present invention, a conductor bump group is formed between corresponding surfaces of a supporting substrate having conductor bump groups formed at predetermined positions so as to correspond to each other. A step of stacking and placing a resin sheet,
The laminated body is heated to press the laminated body at the glass transition temperature or the plasticizing temperature of the resin component of the synthetic resin sheet, and the conductor bumps are respectively inserted in the thickness direction of the synthetic resin sheet to correspond to each other. Connecting the tip end portions of the conductor bumps by plastic deformation to form a through-type conductor wiring portion.

Further, in the second method for manufacturing a printed wiring board according to the present invention, at least at a part of a predetermined position, the conductor bump groups provided with the connecting solder layer as the underlying layer are formed corresponding to each other. A step of laminating and placing a synthetic resin sheet between the surfaces of the support base on which the conductor bump group is formed,
The laminated body is heated to press the laminated body at the glass transition temperature or the plasticizing temperature of the resin component of the synthetic resin sheet, and the conductor bumps are respectively inserted in the thickness direction of the synthetic resin sheet to correspond to each other. And a step of forming a through-type conductor wiring portion by connecting the tip end portions of the conductor bumps by plastic deformation. Further, the third printed wiring board manufacturing method according to the present invention is , A step of laminating a synthetic resin sheet between the conductor bump group formation surfaces of a conductive metal foil formed by correspondingly forming conductor bump groups at predetermined positions, and heating the laminate to produce a synthetic resin The laminated body is pressed at the glass transition temperature or plasticization temperature of the resin component of the system sheet, each conductor bump is inserted in the thickness direction of the synthetic resin system sheet, and the tips of the corresponding conductor bumps undergo plastic deformation. Yo The step of connecting and forming a through-type conductor wiring part, and performing an etching process on the conductive metal foil of the laminate in which the through-type conductor wiring part is formed, and connecting to the through-type conductor wiring part And a step of forming a wiring pattern.

In the present invention, examples of the support substrate on which the conductor bump group is formed include synthetic resin sheets having good peelability, conductive sheets (foil), and the like.
This supporting substrate may be a single sheet or may be patterned, and its shape is not particularly limited. Further, the use of the inserted conductor wiring portion may be, for example, connecting the exposed end surface as a connection terminal of a component or between wiring patterns formed by printing a conductive paste or selective plating. Further, in the case where the supporting base is patterned in advance, the conductor wiring group is formed not only on one main surface but also on both main surfaces to form a conductor wiring portion which is multi-layeredly inserted. You may take a structure.

In the present invention, the conductor bumps (group of conductor bumps) are made of, for example, conductive powder such as silver, gold, copper, solder powder, alloy powder or composite (mixed) metal powder of these, and polycarbonate resin, polysulfone resin, for example. , A conductive composition prepared by mixing with a binder component such as polyester resin, phenoxy resin, phenol resin, polyimide resin, or a conductive metal. When the bump group is formed of a conductive composition, a conductive bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask. Is generally 1
00 to 400 μm is desirable. Furthermore, if a solder layer is provided as a base layer for the conductive bump group, the exposed surface of the insertion-type conductor wiring portion formed by joining the tips of the corresponding conductive bumps is provided with the solder layer in advance. Since it takes a different form, solder coating and the like can be omitted. And
Such a configuration can be said to be an effective means because it is possible to easily avoid a short circuit between solder pads when forming a wiring board having a small pitch of solder pads.

On the other hand, as means for forming a bump group with a conductive metal, (a) fine metal particles having a certain shape or size are dispersed on a surface of a supporting substrate provided with an adhesive layer in advance, and selected. Or (b) if copper foil or the like is used as the supporting substrate, the plating resist is printed and patterned to form copper,
Tin, gold, silver, solder, etc. are plated to selectively form minute metal pillars (bumps), (c) Solder resist is applied / patterned on the supporting substrate surface, and then immersed in a solder bath to selectively For example, formation of minute metal pillars (bumps) can be mentioned. Here, a small metal pillar without a small metal soul corresponding to a bump is
A multi-layer structure or a multi-layer shell structure formed by combining different metals may be used. For example, copper may be used as a core and the surface may be coated with a gold or silver layer to impart oxidation resistance, or copper may be used as a core and the surface may be coated with a solder layer so as to have solder bondability. In the present invention, when the bump group is formed of a conductive composition,
Compared with the case of using a plating method or the like, the process can be further simplified, which is effective in terms of cost reduction.

In the present invention, a thermoplastic resin film (sheet), for example, may be mentioned as a synthetic resin sheet for forming the through-hole type conductor wiring portion through which the conductor bump group is inserted, and the thickness thereof is a conductor. Determined by bump height. In other words, since the tips of the conductor bumps arranged to face each other need to be plastically deformed to form a sufficient electrical connection, they are selected and set thinner than the sum of the heights of the conductor bumps forming the pair. It is preferably about 50 to 800 μm.
Here, examples of the thermoplastic resin sheet include sheets of polycarbonate resin, polysulfone resin, thermoplastic polyimide resin, tetrafluoropolyethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin, and the like. Further, as the thermosetting resin sheet to be kept in the pre-curing state, epoxy resin, bismaleimide triazine resin, polyimide resin, phenol resin, polyester resin, melamine resin, or butadiene rubber, butyl rubber, natural rubber, neoprene rubber, silicone rubber Sheets of raw rubber such as. These synthetic resins may be used alone or may contain an insulating inorganic or organic filler, and are a sheet formed by combining with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. It may be. further,
In the present invention, when a laminated body formed by stacking the synthetic resin sheet main surfaces in contact with each other on the main surface of a support base having a bump group formed thereon is heated and pressed, the synthetic resin sheet is placed. As a base (abutting plate) to be used, a metal plate or a heat-resistant resin plate with a small size or deformation, such as a stainless plate,
A brass plate, a polyimide resin plate (sheet), a polytetrafluoroethylene resin plate (sheet), etc. are used. Also,
In this laminated integration, if an elastic layer such as a rubber layer is interposed between the integrated body and the surface to be pressed,
The conductor bumps are more smoothly inserted into the synthetic resin sheet, and the reliability of the connection due to the plastic deformation of the corresponding tip portion is also improved.

[0013]

According to the method of manufacturing a printed wiring board according to the present invention,
The conductor wiring portion between the layers for electrically connecting the wiring layers is softened or plasticized in the synthetic resin sheet forming the interlayer insulating layer by heating and pressurizing in the so-called laminated integration process, and the supporting substrate surface is By press-fitting the conductor bump group, reliable electrical connection between the conductor bumps and even between the wiring layers can be reliably achieved. In other words, while simplifying the process, it is possible to form a highly accurate and reliable electrical connection at an arbitrary position (location) between fine wiring pattern layers, etc., so that a printed wiring board with a high wiring density can be formed. Can be manufactured at low cost. In addition, since it is not necessary to form a connection hole when electrically connecting the wiring pattern layers, a printed wiring board capable of high-density wiring and high-density mounting can be obtained.

[0014]

EXAMPLES Examples 1 (a), 1 (b), 1 (c), 2 (a),
Embodiments of the present invention will be described with reference to (b), (c) and FIGS. 3 (a), (b), (c), respectively.

Example 1 FIGS. 1 (a), 1 (b) and 1 (c) schematically show an embodiment of this example.

First, a 50 μm thick polyimide resin film (trade name, Kapton film, manufacturer: Toray KK) is used as a supporting substrate sheet 1, and a polymer type silver-based conductive paste (trade name, thermosetting conductive paste) is used. DW-250H-
5 、 Manufacturer: Toyobo KK), also with a plate thickness of 300μ
A metal mask having a hole of 0.3 to 0.4 mm in diameter was prepared at a predetermined position of a stainless steel plate of m. Then, the metal mask is positioned and arranged on the surface of the polyimide resin film to print a conductive paste, and after the printed conductive paste is dried, it is printed again at the same position using the same mask three times. The printing was repeated to form (form) a chevron-shaped pumb 2 having a height of about 200 to 350 μm. Figure 1 (a) shows
The shape of the conductive bump 2 thus formed is shown in a side view.

On the other hand, a 100 μm thick polyetherimide resin film (trade name, Sumilite FS-1400, manufacturer:
Sumitomo Bakelite KK) is prepared as a synthetic resin sheet 3, and as shown in a sectional view in FIG. 1 (b), the supporting substrate sheet 1 on which the conductive bumps 2 group is formed (formed), the synthetic resin sheet 3, and the conductive sheet The supporting substrate sheet 1 on which the groups of the sex bumps 2 are formed (formed) is positioned and arranged so that the conductive bumps 2 face each other, and laminated. After that, on the surface of the laminated support sheet 1, a polyimide resin film or aluminum foil of the same type as the support sheet 1 is laminated and arranged as a backing plate 4, and is arranged between hot plates of a hot press kept at 120 ° C. (Not shown), when the temperature is higher than the glass point transfer of the synthetic resin sheet 3, preferably in a thermoplasticized state, the resin pressure is 1 MPa and the sheet is cooled and taken out, and the front and back sheets 1 and 4 are peeled off. Then, as shown in a sectional view in FIG. 1C, the conductive bumps 2 facing each other are formed.
Is pressed into the synthetic resin sheet 3, and the conductive bumps 2 facing each other are, as shown in a side view in FIG. 1 (b),
A printed wiring board provided with a conductor wiring portion 5 that penetrates in the thickness direction of the synthetic resin sheet 3 by making its tip end contact with each other and plastically deforming to make an electrical connection was obtained. With respect to the through-type conductor wiring portions 5 formed as described above, a continuity test was conducted on each conductor wiring portion 5 from the front and back surfaces with a tester.
It was the following resistance.

Example 2 FIGS. 2 (a), 2 (b) and 2 (c) schematically show an embodiment of this example.

First, a polymer type silver-based conductive paste (trade name, thermosetting conductive paste) is used as a supporting substrate sheet 1 using a polyimide resin film (trade name, Kapton film, manufactured by Toray KK) having a thickness of 50 μm. DW-250H-
5 、 Manufacturer: Toyobo Co., Ltd.), and the thickness of 200μ
0.4 mm diameter or 0.3
Two metal masks with holes of mm diameter were prepared. The 0.4 mm diameter perforated metal mask is positioned and arranged on the surface of the polyimide resin film 1, and a solder paste is printed as a conductor layer for connection to form a fine island-shaped solder layer 6
Was selectively deposited and formed. Then, the perforated metal mask having a diameter of 0.3 mm is positioned and arranged on the surface on which the solder layer 6 is adhered and formed, and a conductive paste is printed, and the printed conductive paste is dried and then the same. Printing was repeated three times by a method of printing again at the same position using a mask, to form (form) a chevron-shaped hump 2 having a height of about 200 to 350 μm on the solder layer 6. FIG. 2A is a side view showing the shapes of the solder layer 6 and the conductive bump 2 thus formed.

On the other hand, a 100 μm thick polyetherimide resin film (trade name, Sumilite FS-1400, manufacturer:
Sumitomo Bakelite KK) is prepared as a synthetic resin sheet 3, and as shown in a sectional view in FIG. 2 (b), a support substrate sheet 1 on which the conductive bumps 2 group is formed (formed), a synthetic resin sheet 3, and a conductive resin sheet The supporting substrate sheet 1 on which the groups of the conductive bumps 2 were formed (formed) was positioned and arranged with the conductive bumps 2 facing each other, and laminated. Thereafter, a polyimide resin film, aluminum foil, or the like of the same type as the supporting sheet 1 is applied to the surface of the supporting sheet 1 which has been made into a laminated body, with a backing plate 4
As a resin pressure when the synthetic resin sheet 3 has a glass point transfer temperature or higher, preferably in a thermoplasticized state. After pressurizing at 1 MPa and cooling as it was, it was taken out, and the front and back sheets 1 and 4 were peeled off. As shown in a sectional view in FIG.
However, the conductive bumps 2 press-fitted into the synthetic resin sheet 3 and the conductive bumps 2 facing each other are plastically deformed and electrically connected to each other at the tips of the conductive bumps 2 in contact with each other in the thickness direction of the synthetic resin sheet 3. A printed wiring board having the conductor wiring portion 5 penetrating therethrough and having the solderable solder layer 6 on the end surface portion of the conductor wiring portion 5 was obtained.

In the above description, the solder layer 6 may be formed by a selective plating method instead of the printing method. Further, the solder layer 6 may be formed by applying the conductive bumps 2 to the second group. On the other hand, it is not necessary to deal with it as a whole. Also,
If a copper layer or the like is interposed between the solder layer 6 and the conductive bump 2 by, for example, a plating method, soldering work or the like becomes easy.

Embodiment 3 FIGS. 3 to 6 are sectional views schematically showing an embodiment of this embodiment. In this example, instead of the polyimide resin film as the supporting base sheet 1 in the case of the above example 1, a thickness of 35 μm which is usually used for manufacturing a printed wiring board is used.
As in the case of Example 1 except that the electrolytic copper foil 1'of m was used, the layers were stacked as shown in FIG. 3 and placed between hot plates of a hot press maintained at 120 ° C. (not shown). ), When the temperature is higher than the glass point transfer of the synthetic resin sheet 3, preferably in a thermoplasticized state, the resin pressure is 1 MPa and the sheet is cooled and then taken out.
The conductive bumps 2 facing each other are formed by the synthetic resin sheet 3
As shown in a side view in FIG. 4, the conductive bumps 2 facing each other press-fit into the inside thereof, and the tips of the conductive bumps 2 are in contact with each other and are plastically deformed to form an electrical connection. A double-sided copper clad plate having a conductor wiring portion 5 penetrating in the vertical direction and connecting between both copper foils 1'was produced.

A normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) was screen-printed on both sides of the double-sided copper clad plate prepared above, and the conductive pattern portion was masked, followed by chlorination. After etching with 2 copper as an etching solution, the resist mask was peeled off to obtain a printed wiring board in which the double-sided patterns were electrically connected by the conductor wiring portion 5. Regarding the double-sided printed wiring board manufactured in this way,
When the electrical check that was usually performed was performed, no problems such as defects or reliability were found in all connections, and all had a resistance value of 7 mΩ or less.

In the above manufacturing process, double-sided printing in which required wiring patterns are formed on both sides and the double-sided wiring patterns are connected by conductive bumps 2 at predetermined positions, as shown in a sectional view in FIG. A polyimide resin film (support substrate) having conductive bumps 2 and connecting conductor layers 8 corresponding to the conductor wiring portions 5 of the double-sided printed wiring board 7 on both sides of the wiring board 7 with a synthetic resin sheet 3 interposed therebetween. The sheet) 1 "and the backing plate 4 were positioned and laminated, and after heat and pressure molding, the polyimide resin film 1" was peeled off. Figure 6
A multi-layered printed wiring board having a multi-layered structure, in which the connecting conductor layer 8 was press-fitted into the three layers of the synthetic resin sheet and the surface was flattened was obtained.

In this multilayer printed wiring board, the connecting conductor layer 8 can be formed by selective plating of copper or the like or printing of a conductive paste. The presence of the connecting conductor layer 8 forming the flat surface is effective for soldering in the case of a fine pattern, for example, in which generation of a solder bridge during soldering is prevented.

By patterning the circuit by etching, a wiring board having a further multilayer structure can be obtained.

Further, in these manufacturing steps, the conductive bumps 2 or the corresponding ones are formed in a line shape at positions corresponding to the outer shape processing portion (outer shape processing line) of the multilayer wiring board to be manufactured. Since it can be easily separated by bending or the like at this portion, the outer shape processing can be simplified.

Example 4 In this example, instead of the polyimide resin film as the supporting substrate sheet 1 in the case of Example 1 above, an electrolytic copper foil having a thickness of 35 μm, which is usually used in the production of printed wiring boards, is used. 1 ', and synthetic resin sheet 3 with glass cloth impregnated with epoxy resin and having a thickness of 200 μm
Using the above prepreg, as shown in FIG. 3 above, the laminate is arranged, and the laminate is pressed under the following conditions, and as shown in FIG. A double-sided copper clad plate having the conductor wiring portion 5 thus prepared was prepared. In the pressing process, after the laminated body is set, when heating starts and 120 ° C is reached, a resin pressure of 2 MPa is applied, further heating is performed in this state, and when it reaches 170 ° C, it is held for 1 hour as it is. After cooling, it was taken out.

A normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) was screen-printed on both sides of this double-sided copper clad board, and the conductor pattern portion was masked, followed by cupric chloride. After the etching treatment with the above as an etching solution, the resist mask was peeled off to obtain a double-sided printed wiring board. Regarding the double-sided printed wiring board manufactured in this way,
When the electrical check that was normally performed was performed, no problems such as defects or reliability were found in all the connections. In addition, in order to evaluate the reliability of the connection between the double-sided conductive patterns, a hot oil test (a cycle of immersion in oil at 260 ° C for 10 seconds and immersion in oil at 20 ° C for 20 seconds 1
As a cycle), no defect was observed even after 500 times, and the connection reliability between the conductive (wiring) pattern layers was remarkably excellent as compared with the case of the conventional copper plating method.

Example 5 In this example, as the supporting base sheet 1, an electrolytic copper foil 1'having a thickness of 35 μm, which is usually used in the production of printed wiring boards, is used, and the roughened surface of this copper foil 1'is used. After printing a plating resist on the side and performing patterning that leaves an exposed surface group with a diameter of 0.3 mm at a predetermined position (location), copper plating is applied to form a copper layer with a height of about 100 μm on the exposed surface area. Further, a nickel layer having a height of about 10 μm was laid on it to form a conductor bump group having a total thickness of about 110 μm. As in Example 3, except that the copper foil 1'where the bump group was formed by plating was used, the bumps were stacked as shown in FIG. 3, and the laminate was pressed under the same conditions. As shown in FIG. 4, the conductor wiring part 5 in which both copper foils 1'are connected in a through type
A double-sided copper clad plate having

A normal etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK) was screen-printed on both sides of this double-sided copper clad board, and after masking the conductor pattern portion, cupric chloride was used. After the etching treatment with the above as an etching solution, the resist mask was peeled off to obtain a double-sided printed wiring board. Regarding the double-sided printed wiring board manufactured in this way,
When the electrical check that was normally performed was performed, no problems such as defects or reliability were found in all the connections.

Similar results were obtained even when the bump group formation in this embodiment was carried out by the solder dipping method using a solder resist mask. Even if the bump group was formed of the conductive composition in another example by the plating method, it was possible to obtain a printed wiring board in which wiring layers were connected.

[0033]

According to the present invention, the steps of forming conductive bumps for connecting pattern layers, arranging synthetic resin sheets in a laminated manner and hot pressing, and patterning outer layers are simplified. In other words, it is possible to easily manufacture a double-sided printed wiring board or a multilayer printed wiring board while reducing the number of manufacturing steps to a significantly smaller number of steps as compared with the conventional manufacturing method. Particularly in the production of a multilayer printed wiring board in which many steps are repeated, the number of steps is significantly reduced, which is effective in improving productivity or mass productivity.
Further, in the manufacturing process of the conventional multilayer printed wiring board and the like, since the drilling process and the plating process, which are indispensable, are no longer necessary, the defects occurring in the manufacturing process are significantly suppressed, and the yield is improved. Not only that, a highly reliable printed wiring board can be obtained. Further, since the printed wiring board manufactured does not have holes for interlayer connection on the surface, the wiring density can be significantly improved, and the mounting area for electronic components can be set regardless of the positions of the holes. As a result, the packaging density can be remarkably improved, and the distance between the mounted electronic components can be shortened, so that the circuit performance can be improved. That is, it can be said that the present invention not only contributes to the reduction of the cost of the printed wiring board, but also contributes to the downsizing of the mounted circuit device and the high performance thereof.

[Brief description of drawings]

FIG. 1 schematically shows a first embodiment of the present invention, in which (a) is a side view showing conductive bumps formed on the surface of a supporting substrate, and (b) shows positioning of respective materials. Sectional view showing a state in which they are stacked and arranged, (c) is a sectional view showing a state in which conductive bumps are press-fitted into a synthetic resin sheet by hot pressing.

2A and 2B schematically show a second embodiment of the present invention, in which FIG. 2A is a side view showing conductive bumps formed on the surface of a supporting substrate, and FIG. Sectional view showing a state in which they are stacked and arranged, (c) is a sectional view showing a state in which conductive bumps are press-fitted into a synthetic resin sheet by hot pressing.

FIG. 3 is a cross-sectional view schematically showing a third embodiment of the present invention, showing a state in which each material is positioned and stacked.

FIG. 4 is a sectional view schematically showing a third embodiment of the present invention, showing a state in which conductive bumps are press-fitted into a synthetic resin sheet by hot pressing.

FIG. 5 is a cross-sectional view schematically showing a third embodiment of the present invention, showing a state in which each material is positioned and laminated for multi-layering.

FIG. 6 is a sectional view schematically showing a third embodiment of the present invention and showing a sectional structure of a manufactured multilayer printed wiring board.

[Explanation of symbols]

1, 1 '... Support base sheet 2 ... Conductor bump 3 ...
Synthetic resin sheet 4 ... Patch plate (back sheet) 5 ... Interlayer penetration type conductor wiring part 6 ... Solder layer 7 ... Double-sided printed wiring board 8 ... Connection conductor layer

Claims (3)

[Claims] 1. A step of placing a synthetic resin sheet between the conductor bump group forming surfaces of a support substrate having conductor bump groups formed at predetermined positions so as to correspond to each other, and heating the laminate. The laminated body is pressed at the glass transition temperature or plasticization temperature of the resin component of the synthetic resin sheet, and each conductor bump is inserted in the thickness direction of the synthetic resin sheet,
And a step of forming through-type conductor wiring portions by connecting the tip ends of the corresponding conductor bumps by plastic deformation. 2. A synthetic resin sheet between at least a part of a predetermined position between conductor bump group formation surfaces of a support base in which conductor bump groups provided with a conductor layer for connection as a base layer are formed corresponding to each other. And a step of arranging them in a laminated manner, and heating the laminated body to press the laminated body at a glass transition temperature or a plasticizing temperature of the resin component of the synthetic resin sheet, and each conductor bump is formed in the thickness direction of the synthetic resin sheet. And connecting the respective tip ends of the corresponding conductor bumps by plastic deformation to form a through-type conductor wiring portion, the method for manufacturing a printed wiring board. 3. A conductor bump group forming surface of a conductive metal foil in which conductor bump groups are formed at predetermined positions so as to correspond to each other,
A step of laminating and placing a synthetic resin sheet, and heating the laminate to press the laminate at a glass transition temperature or a plasticizing temperature of a resin component of the synthetic resin sheet to form each conductor bump on the synthetic resin sheet. Of the conductor bumps corresponding to each other, and the tip end portions of the corresponding conductor bumps are connected by plastic deformation to form a through-type conductor wiring portion, and a laminated body on which the through-type conductor wiring portion is formed. A step of performing an etching process on the conductive metal foil to form a wiring pattern connected to the through-type conductive wiring portion.