JPH07326306A - Image forming device - Google Patents
Image forming deviceInfo
- Publication number
- JPH07326306A JPH07326306A JP11985794A JP11985794A JPH07326306A JP H07326306 A JPH07326306 A JP H07326306A JP 11985794 A JP11985794 A JP 11985794A JP 11985794 A JP11985794 A JP 11985794A JP H07326306 A JPH07326306 A JP H07326306A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- plate
- front plate
- image forming
- forming apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子源を応用して画像
を形成する薄型の画像形成装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin image forming apparatus which forms an image by applying an electron source.
【０００２】[0002]
【従来の技術】従来、電子放出素子として熱電子源と冷
陰極電子源の２種類が知られている。このうち冷陰極電
子源には電界放出型（以下、「ＦＥ型」と略す）、金属
／絶縁層／金属型（以下、「ＭＩＭ型」と略す）や表面
伝導型電子放出素子等がある。ＦＥ型の例としては、W.
P.Dyke & W.W.Dolan,"Field emission",Advance in Ele
ctron Physics,8,89(1956)やC.A.Spindt,"Physical pro
perties of thin-film field emission cathodes with
molybdenum cones",J.Appl.Phys.,47,5248(1976)等が知
られている。2. Description of the Related Art Conventionally, two types of electron emitters, a thermoelectron source and a cold cathode electron source, are known. Among them, the cold cathode electron source includes a field emission type (hereinafter abbreviated as “FE type”), a metal / insulating layer / metal type (hereinafter abbreviated as “MIM type”), a surface conduction type electron emitting device, and the like. As an example of the FE type, W.
P. Dyke & WWDolan, "Field emission", Advance in Ele
ctron Physics, 8,89 (1956) and CASpindt, "Physical pro
perties of thin-film field emission cathodes with
molybdenum cones ", J. Appl. Phys., 47, 5248 (1976) are known.
【０００３】ＭＩＭ型の例としては、C.A.Mead,"The tu
nnel-emission amplifier",J.Appl.Phys.,32,646(1961)
等が知られている。As an example of the MIM type, CAMead, "The tu
nnel-emission amplifier ", J.Appl.Phys., 32,646 (1961)
Etc. are known.
【０００４】表面伝導型電子放出素子の例としては、E.
I.Elinson,Radio Eng.Electron Phys.,10,1290(1965)等
がある。Examples of surface conduction electron-emitting devices include E.
I. Elinson, Radio Eng. Electron Phys., 10, 1290 (1965).
【０００５】表面伝導型電子放出素子は基板上に形成さ
れた小面積の薄膜に、膜面に平行に電流を流すことによ
り、電子放出が生じる現象を利用するものである。The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current is passed through a thin film having a small area formed on a substrate in parallel with the film surface.
【０００６】このＳＣＥとしては、前記エリンソン等に
よるＳｎＯ2薄膜を用いたもの、Ａｕ薄膜によるもの
［G.Dittmer:"Thin Solid Films",9,317，(1972)］、Ｉ
ｎ2Ｏ3／ＳｎＯ2薄膜によるもの［M.Hartwell and C.G.
Fonstad:"IEEE Trans. ED Conf.",519,(1975)］、カー
ボン薄膜によるもの［荒木 久：”真空”，第２６巻，
第１号，２２頁（１９８３年）］等が報告されている。This SCE uses the SnO 2 thin film by Erinson et al., And the Au thin film [G. Dittmer: "Thin Solid Films", 9, 317, (1972)], I.
n 2 O 3 / SnO 2 thin film [M.Hartwell and CG
Fonstad: "IEEE Trans. ED Conf.", 519, (1975)], by carbon thin film [Haraki Araki: "Vacuum", Volume 26,
No. 1, p. 22 (1983)] and the like are reported.
【０００７】上述したような電子放出素子は１０ー6Ｔｏ
ｒｒ程度以上の真空中で動作させていることから、前記
電子放出素子を用いて画像形成装置を形成する場合、耐
大気圧構造が必要になる。特に大面積の背面板および前
面板を用いて大気圧支持を行う平面型画像形成装置の場
合、各板厚が非常に厚くなってしまうので、重量、コス
トなどの面で実現性が乏しくなる。この問題を回避する
ために、スペーサーを前面板と背面板との間に配置し
て、大気圧支持部材とすることで、画像形成装置の軽量
化を図っている。The electron-emitting device as described above has 10 −6 To
Since it is operated in a vacuum of about rr or higher, an atmospheric pressure resistant structure is required when forming an image forming apparatus using the electron-emitting device. In particular, in the case of a planar image forming apparatus that uses a large-area back plate and front plate to support atmospheric pressure, the plate thickness of each plate becomes very large, so that the feasibility becomes poor in terms of weight and cost. In order to avoid this problem, the weight of the image forming apparatus is reduced by disposing a spacer between the front plate and the rear plate to form an atmospheric pressure supporting member.
【０００８】従来、前面板とスペーサー、および背面板
とスペーサーは、例えばフリットガラスにて固定され、
前面板と、背面板と、これらの間に配置される支持枠と
によって真空容器を形成していた。Conventionally, the front plate and the spacer, and the back plate and the spacer are fixed by, for example, frit glass,
The vacuum container is formed by the front plate, the back plate, and the support frame arranged between them.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、前面板
とスペーサー、および背面板とスペーサーを、フリット
ガラスで固定し、容器内を真空にすると、スペーサーに
大気圧支持される前面板表面および背面板表面に応力集
中が生じて、そこから前面板および背面板が破損するこ
とがあった。However, when the front plate and the spacer, and the back plate and the spacer are fixed with frit glass and the inside of the container is evacuated, the front plate surface and the back plate surface which are supported by the spacer at atmospheric pressure are provided. In some cases, stress concentration occurred on the front plate and the front plate and the back plate were damaged.
【００１０】本発明は、上記従来技術の実情に鑑みてな
されたものであって、画像形成装置の破損防止、すなわ
ち安全性と歩留りの向上を図った画像形成装置を提供す
ることを目的としている。The present invention has been made in view of the above-mentioned conventional circumstances, and an object of the present invention is to provide an image forming apparatus in which damage to the image forming apparatus is prevented, that is, safety and yield are improved. .
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するため
の本発明は、電子放出素子群を搭載した背面板と、該背
面板と対向して配置されると共に前記電子放出素子群か
ら放出される電子線の照射により画像が形成される画像
形成部材を搭載した前面板と、前記前面板と前記背面板
の間に配置されたスペーサーとを少なくとも有し、前記
前面板、前記背面板をフリットガラスにより互いに接合
して気密構造にされた画像形成装置において、前記スペ
ーサーと前記前面板、および前記スペーサと前記背面板
の間に弾性体が配置されていることを特徴とし、前記弾
性体としては、前記スペーサーのヤング率よりも低ヤン
グ率のものを用いることを特徴とするものである。SUMMARY OF THE INVENTION To achieve the above object, the present invention provides a back plate having an electron-emitting device group mounted thereon, a back plate disposed opposite to the back plate and emitted from the electron-emitting device group. A front plate on which an image forming member on which an image is formed by irradiation of an electron beam is mounted, and a spacer arranged between the front plate and the back plate, and the front plate and the back plate are made of frit glass. In the image forming apparatus joined to each other to have an airtight structure, an elastic body is arranged between the spacer and the front plate, and between the spacer and the back plate. It is characterized by using a material having a Young's modulus lower than the Young's modulus.
【００１２】また、上記画像形成装置において、前記気
密接合した容器内が真空であることを特徴とするもの
や、前記スペーサーを前記前面板と前記背面板の大気圧
支持部材として用いることを特徴とするものや、前記ス
ペーサーを前記前面板と前記背面板の間隔設定部材とし
て用いることを特徴とするものや、前記電子放出素子と
して表面伝導型電子放出素子を用いることを特徴とする
ものも本発明に属する。In the above image forming apparatus, the inside of the airtightly joined container is vacuum, and the spacer is used as an atmospheric pressure supporting member for the front plate and the rear plate. The present invention also relates to the present invention, characterized in that the spacer is used as a space setting member between the front plate and the back plate, and that characterized in that a surface conduction electron-emitting device is used as the electron-emitting device. Belong to.
【００１３】[0013]
【作用】上記のとおりに構成された本発明では、前面
板、背面板およびスペーサー同士を気密接合して容器構
造とした画像形成装置の内部を真空にすると、背面板と
前面板には大気圧が加わり、背面板表面および前面板表
面にスペーサーを支点とする引張応力が作用するが、ス
ペーサーと背面板、およびスペーサーと前面板の間に弾
性体を配置することにより、真空排気時に前面板および
背面板が沈み込むため、スペーサー上の前面板表面およ
び背面板表面に作用する引張応力値が減少する。According to the present invention configured as described above, when the inside of the image forming apparatus having the container structure is formed by air-tightly joining the front plate, the rear plate and the spacers to each other, the atmospheric pressure is applied to the rear plate and the front plate. The tensile stress with the spacer as a fulcrum acts on the back plate surface and the front plate surface, but by arranging the elastic body between the spacer and the back plate and between the spacer and the front plate, the front plate and the back plate are evacuated during vacuum exhaust Is reduced, the tensile stress value acting on the front plate surface and the rear plate surface on the spacer is reduced.
【００１４】このため、真空排気時の前面板および背面
板の破損を防止することが可能となり、安全性および歩
留りが向上する。Therefore, it is possible to prevent the front plate and the rear plate from being damaged during vacuum exhaust, and safety and yield are improved.
【００１５】[0015]
【実施例】以下、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１６】（第１の実施例）図１は、本発明の画像形
成装置の第１の実施例を示す断面図である。(First Embodiment) FIG. 1 is a sectional view showing a first embodiment of the image forming apparatus of the present invention.
【００１７】本実施例の画像形成装置は、図１に示すよ
うに、電子放出素子群（不図示）を搭載した背面板２
と、背面板２と対向して配置されると共に電子放出素子
群（不図示）から放出される電子線の照射により画像が
形成される画像形成部材（不図示）を搭載した前面板１
と、背面板２と前面板１の間にあって背面板２および前
面板１の周縁を支持する支持枠３と、前面板１と背面板
２の間に支柱として配置されるスペーサー４とを少なく
とも備えている。As shown in FIG. 1, the image forming apparatus of this embodiment has a back plate 2 on which an electron-emitting device group (not shown) is mounted.
And a front plate 1 provided with an image forming member (not shown) arranged to face the back plate 2 and on which an image is formed by irradiation of electron beams emitted from an electron-emitting device group (not shown).
A support frame 3 between the rear plate 2 and the front plate 1 for supporting the peripheral edges of the rear plate 2 and the front plate 1, and a spacer 4 arranged as a support between the front plate 1 and the rear plate 2. ing.
【００１８】ここで、前面板１および背面板２上には、
後述するスペーサーが配置される位置を考慮して、弾性
体５が予め設置されており、前面板１と背面板２の間に
は、弾性体５の位置でスペーサー固定用フリットガラス
７を介して大気圧支持部材としてのスペーサー４が配設
され、かつ、背面板２および前面板１の周縁にて支持枠
固定用フリットガラス６を介して支持枠３が配設されて
いる。Here, on the front plate 1 and the rear plate 2,
An elastic body 5 is installed in advance in consideration of a position where a spacer described later is arranged, and a spacer fixing frit glass 7 is interposed between the front plate 1 and the rear plate 2 at the position of the elastic body 5. A spacer 4 as an atmospheric pressure support member is provided, and a support frame 3 is provided at the peripheral edges of the back plate 2 and the front plate 1 via a support frame fixing frit glass 6.
【００１９】そして、前面板１、背面板２、支持枠３お
よびスペーサー４同士が接合されることで、本実施例の
画像形成装置は気密容器となっている。The front plate 1, the rear plate 2, the support frame 3 and the spacers 4 are joined together, so that the image forming apparatus of this embodiment is an airtight container.
【００２０】なお、弾性体５としては、スペーサー４の
ヤング率よりも小さいヤング率を有するものを用いてい
る。また、スペーサー４の形状、個数、配置などは特に
限定されるものではない。さらに、スペーサー４は、大
気圧支持部材の他に、前面板１と背面板２との間隔設定
部材として用いられる。The elastic body 5 has a Young's modulus smaller than that of the spacer 4. Further, the shape, number, arrangement, etc. of the spacers 4 are not particularly limited. Further, the spacer 4 is used as a space setting member between the front plate 1 and the back plate 2 in addition to the atmospheric pressure supporting member.
【００２１】上記のように気密接合した容器内を真空に
すると、背面板２と前面板１には大気圧が加わり、背面
板２表面および前面板１表面にスペーサー４を支点とす
る引張応力が作用するが、スペーサー４と背面板２、お
よびスペーサー４と前面板１の間に弾性体５を配置する
ことによって、真空時に前面板１および背面板２が沈み
込むため、スペーサー４上の前面板１表面および背面板
２表面に作用する引張応力値を減少させることができ
る。When the inside of the container airtightly joined as described above is evacuated, atmospheric pressure is applied to the back plate 2 and the front plate 1, and tensile stress with the spacer 4 as a fulcrum is applied to the surfaces of the back plate 2 and the front plate 1. Although it works, by disposing the elastic body 5 between the spacer 4 and the back plate 2 and between the spacer 4 and the front plate 1, the front plate 1 and the back plate 2 sink in a vacuum, so that the front plate on the spacer 4 It is possible to reduce the tensile stress value acting on the first surface and the rear plate 2 surface.
【００２２】その際の応力値を図２に示す。この図は、
スペーサー４に大気圧支持される平面板表面に作用する
応力値と気密接合した容器内外の圧力差との関係を示し
ている。The stress value at that time is shown in FIG. This figure is
The relationship between the stress value acting on the surface of the flat plate supported by the spacer 4 at atmospheric pressure and the pressure difference between the inside and outside of the airtightly joined container is shown.
【００２３】図２に示すとおり、弾性体がある場合には
圧力差が小さい時に応力値が負となる、すなわち圧縮応
力が作用するため、真空排気時の引張応力値を減少させ
ることができる。As shown in FIG. 2, when there is an elastic body, the stress value becomes negative when the pressure difference is small, that is, the compressive stress acts, so that the tensile stress value during vacuum evacuation can be reduced.
【００２４】次に、本実施例の画像形成装置の製造方法
について説明する。Next, a method of manufacturing the image forming apparatus of this embodiment will be described.
【００２５】本実施例においては、前面板１、背面板
２、支持枠３は青板ガラスを切削加工したものを用い
た。また、スペーサー４は青板ガラスを研磨することに
より作製した。弾性体５は前記スペーサーのヤング率よ
りも低いヤング率のものを使用し、具体的にはＡｇを主
成分とするペースト状の材料を塗布・焼成し、弾性体と
して使用した。また、表面伝導型電子放出素子を背面板
２上に作製した。In the present embodiment, the front plate 1, the rear plate 2 and the support frame 3 were made by cutting soda lime glass. The spacer 4 was produced by polishing soda lime glass. The elastic body 5 has a Young's modulus lower than the Young's modulus of the spacer. Specifically, a paste-like material containing Ag as a main component is applied and baked to be used as an elastic body. Further, a surface conduction electron-emitting device was produced on the back plate 2.
【００２６】このような前面板１、背面板２、支持枠３
およびスペーサー４を用い、先ず、前面板１上に画像形
成部材（不図示）を搭載し、後工程で前面板１と背面板
２の間に配置されるスペーサー４の位置を考慮して弾性
体５を予め設置した。そして、この前面板１上支持枠固
定用フリットガラス６をディスペンサーで塗布し、仮焼
成を行った。その後、支持枠３を前面板２上に位置合わ
せした後、本焼成した。The front plate 1, the rear plate 2 and the support frame 3 as described above
Using the spacer 4 and the spacer 4, first, an image forming member (not shown) is mounted on the front plate 1, and an elastic body is considered in consideration of the position of the spacer 4 arranged between the front plate 1 and the rear plate 2 in a later step. 5 was installed beforehand. Then, the frit glass 6 for fixing the support frame on the front plate 1 was applied by a dispenser and calcined. After that, the support frame 3 was positioned on the front plate 2 and then fired.
【００２７】次に、背面板２上に表面伝導型電子放出素
子（不図示）を形成し、後工程で前面板１と背面板２の
間に配置されるスペーサー４の位置を考慮して弾性体５
を予め設置した。そして、この背面板２上に、支持枠固
定用フリットガラス６をディスペンサーで塗布し、仮焼
成を行った。Next, a surface conduction electron-emitting device (not shown) is formed on the rear plate 2 and is elastic in consideration of the position of the spacer 4 arranged between the front plate 1 and the rear plate 2 in a later step. Body 5
Was installed in advance. Then, the frit glass 6 for fixing the support frame was applied on the back plate 2 with a dispenser and pre-baked.
【００２８】その後、上記の前面板１および背面板２の
スペーサー設置位置にスペーサー固定用フリットガラス
７を塗布した後、前面板１上にスペーサー４を搭載し
て、焼成、固定した。最後に、上記の前面板１と背面板
２を位置合わせした後に、焼成し、固定した。After the spacer fixing frit glass 7 was applied to the spacer installation positions on the front plate 1 and the rear plate 2, the spacers 4 were mounted on the front plate 1 and baked and fixed. Finally, after aligning the front plate 1 and the rear plate 2 with each other, they were baked and fixed.
【００２９】組立工程終了後、上記工程で作製された容
器内を真空状態にするために、支持枠に設けられた排気
管（不図示）を通じて容器内を真空に引き、その後、排
気管を封止した。After the assembly process is completed, in order to bring the inside of the container manufactured in the above process into a vacuum state, the inside of the container is evacuated through an exhaust pipe (not shown) provided in the support frame, and then the exhaust pipe is sealed. I stopped.
【００３０】その結果、弾性体５を用いることによっ
て、スペーサー４に大気圧支持される前面板１表面およ
び背面板２表面に作用する引張り応力値を１０％程度減
少させることができ、前面板１および背面板２の破損防
止が可能となった。As a result, by using the elastic body 5, the tensile stress value acting on the surface of the front plate 1 and the surface of the rear plate 2 which are supported by the spacer 4 at atmospheric pressure can be reduced by about 10%, and the front plate 1 can be reduced. Also, the back plate 2 can be prevented from being damaged.
【００３１】（第２の実施例）図３は、本発明の画像形
成装置の第２の実施例を示す断面図である。(Second Embodiment) FIG. 3 is a sectional view showing a second embodiment of the image forming apparatus of the present invention.
【００３２】本実施例の画像形成装置は、図３に示すよ
うに、電子放出素子群（不図示）を搭載した背面板１２
と、背面板１２と対向して配置されると共に電子放出素
子群（不図示）から放出される電子線の照射により画像
が形成される画像形成部材（不図示）を搭載した前面板
１１と、背面板１２と前面板１１の間にあって背面板１
２および前面板１１の周縁を支持する支持枠１３と、前
面板１１と背面板１２の間に支柱として配置されるスペ
ーサー１４とを少なくとも備えている。As shown in FIG. 3, the image forming apparatus of the present embodiment has a back plate 12 having an electron-emitting device group (not shown) mounted thereon.
And a front plate 11 which is arranged so as to face the rear plate 12 and which is provided with an image forming member (not shown) on which an image is formed by irradiation of electron beams emitted from an electron-emitting device group (not shown), Between the rear plate 12 and the front plate 11, the rear plate 1
2 and at least a support frame 13 that supports the peripheral edges of the front plate 11, and a spacer 14 that is arranged as a support between the front plate 11 and the rear plate 12.
【００３３】ここで、前面板１１および背面板１２上に
は、後述するスペーサーが配置される位置を考慮して、
弾性体１５が予め設置されており、前面板１１と背面板
１２の間には、弾性体１５の位置で大気圧支持部材とし
てのスペーサー１４が配設され、かつ、背面板２および
前面板１の周縁にて支持枠固定用フリットガラス１６を
介して支持枠３が配設されている。Here, in consideration of the positions where spacers, which will be described later, are arranged on the front plate 11 and the rear plate 12,
An elastic body 15 is installed in advance, a spacer 14 as an atmospheric pressure supporting member is arranged between the front plate 11 and the rear plate 12 at the position of the elastic body 15, and the rear plate 2 and the front plate 1 are arranged. The support frame 3 is disposed on the periphery of the support frame 3 with the support frame fixing frit glass 16 interposed therebetween.
【００３４】そして、前面板１１、背面板１２、支持枠
１３およびスペーサー１４同士が接合されることで、本
実施例の画像形成装置は気密容器となっている。The front plate 11, the rear plate 12, the support frame 13, and the spacers 14 are joined together, so that the image forming apparatus of this embodiment is an airtight container.
【００３５】なお、スペーサー４の形状、個数、配置な
どは特に限定されるものではない。さらに、スペーサー
４は、大気圧支持部材の他に、前面板１と背面板２との
間隔設定部材として用いられる。The shape, number and arrangement of the spacers 4 are not particularly limited. Further, the spacer 4 is used as a space setting member between the front plate 1 and the back plate 2 in addition to the atmospheric pressure supporting member.
【００３６】本実施例においては前面板１１、背面板１
２、支持枠１３は青板ガラスを切削加工したものを用い
ている。また、スペーサー１４は青板ガラスを研磨する
ことにより作製した。弾性体１５としてはスペーサー１
４のヤング率よりも低いヤング率の無機接着剤（本実施
例では東亜合成化学社製アロンセラミック）を用いた。In this embodiment, the front plate 11 and the rear plate 1
2. The support frame 13 is made by cutting soda-lime glass. The spacer 14 was produced by polishing soda lime glass. Spacer 1 as elastic body 15
An inorganic adhesive having a Young's modulus lower than that of No. 4 (Aron ceramic manufactured by Toagosei Co., Ltd. in this example) was used.
【００３７】そして、第１の実施例と同様の方法により
画像形成装置を作製した。Then, an image forming apparatus was produced by the same method as in the first embodiment.
【００３８】組立工程終了後、上記工程で作製された容
器内を真空状態にするために、支持枠に設けられた（図
示せず）排気管を介して容器内を真空に引き、その後、
排気管を封止した。After the assembly process is completed, in order to make the inside of the container produced in the above process a vacuum state, the inside of the container is evacuated through an exhaust pipe (not shown) provided in the support frame, and then,
The exhaust pipe was sealed.
【００３９】その結果、弾性体１５を設置することによ
って、スペーサー１４に大気圧支持される前面板１１表
面および背面板１２表面に作用する引張応力値を１０％
程度減少させることができ、前面板１１および背面板１
２の破損防止が可能となった。As a result, by installing the elastic body 15, the tensile stress value acting on the surface of the front plate 11 and the surface of the rear plate 12 which are supported by the spacer 14 at atmospheric pressure is 10%.
The front plate 11 and the back plate 1 can be reduced to some extent.
It became possible to prevent the damage of 2.
【００４０】上述した第１および第２の実施例における
電子放出素子としては、従来技術の説明で述べた冷陰極
電子源を用いることができる。冷陰極電子源のうち例と
して表面伝導型電子放出素子を挙げてその構成を簡単に
説明する。図４は、表面伝導型電子放出素子の基本的な
構成の一例を示すものであり、（ａ）はその平面図、
（ｂ）は縦断面図である。As the electron-emitting device in the above-mentioned first and second embodiments, the cold cathode electron source described in the description of the prior art can be used. A surface conduction electron-emitting device will be taken as an example of the cold cathode electron source and its configuration will be briefly described. FIG. 4 shows an example of the basic structure of a surface conduction electron-emitting device, (a) is a plan view thereof,
(B) is a longitudinal sectional view.
【００４１】表面伝導型電子放出素子は図４に示すよう
に、絶縁性基板２１を備えており、絶縁性基板２１上に
は、素子電極２５，２６が一定間隔Ｌ１でそれぞれ配置
されている。この絶縁性基板上２１の各素子電極２５，
２６の間には、薄膜導電体２４が形成されている。薄膜
導電体２４には、電子を放出する電子放出部２３が薄膜
導電体２４に通電加熱を施すことにより形成されている
（特開平２−５６８２２号公報、特開平４−２８１３９
号公報参照）。As shown in FIG. 4, the surface conduction electron-emitting device is provided with an insulating substrate 21, and device electrodes 25 and 26 are arranged on the insulating substrate 21 at regular intervals L1. Each device electrode 25 on this insulating substrate 21,
A thin-film conductor 24 is formed between 26. The thin-film conductor 24 is formed with an electron-emitting portion 23 that emits electrons by heating the thin-film conductor 24 with electricity (Japanese Patent Application Laid-Open Nos. 2-56822 and 4-28139).
(See the official gazette).
【００４２】電子放出部２３としては粒径が数十オング
ストローム程度の導電性微粒子からなり、電子放出部２
３以外の薄膜２４は微粒子膜からなる。The electron emitting portion 23 is made of conductive fine particles having a particle diameter of several tens of angstroms.
The thin films 24 other than 3 are fine particle films.
【００４３】なおここで述べる微粒子膜とは、複数の微
粒子が集合した膜であり、その微細構造として、微粒子
が個々に分散配置した状態のみならず、微粒子が互いに
隣接、あるいは重なり合った状態（島状も含む）の膜を
さす。The fine particle film described here is a film in which a plurality of fine particles are aggregated, and its fine structure is not only a state in which the fine particles are dispersed and arranged but also a state in which the fine particles are adjacent to each other or overlap each other (islands). (Including the shape).
【００４４】またこれとは別に薄膜２４には、導電性微
粒子が分散されたカーボン薄膜等の場合がある。Separately from this, the thin film 24 may be a carbon thin film in which conductive fine particles are dispersed.
【００４５】薄膜導電体２４の具体例を挙げるならば、
Ｐｂ、Ｒｕ、Ａｇ、Ｔｉ、Ｉｎ、Ｃｕ、Ｃｒ、Ｆｅ、Ｚ
ｎ、Ｓｎ、Ｔａ、Ｗ、Ｐｂなどの金属、ＰｂＯ、ＳｎＯ
2、Ｉｎ2Ｏ3、ＰｂＯ、Ｓｂ2Ｏ3などの酸化物、ＨｆＢ
2、ＺｒＢ2、ＬａＢ6、ＣｅＢ6、ＹＢ4、ＧｄＢ4などの
硼化物、ＴｉＣ、ＺｒＣ、ＨｆＣ、ＴａＣ、ＳｉＣ、Ｗ
Ｃなどの炭化物、ＴｉＮ、ＺｒＮ、ＨｆＮなどの窒化
物、Ｓｉ、Ｇｅなどの半導体、カーボン、ＡｇＭｇ、Ｎ
ｉＣｕなどである。To give a specific example of the thin film conductor 24,
Pb, Ru, Ag, Ti, In, Cu, Cr, Fe, Z
n, Sn, Ta, W, Pb and other metals, PbO, SnO
Oxides such as 2 , In 2 O 3 , PbO and Sb 2 O 3 , HfB
2, boride such as ZrB2, LaB6, CeB6, YB4, GdB4, TiC, ZrC, HfC, TaC, SiC, W
Carbides such as C, nitrides such as TiN, ZrN and HfN, semiconductors such as Si and Ge, carbon, AgMg, N
iCu and the like.
【００４６】そして、薄膜導電体２４は、真空蒸着法、
スパッタ法、化学的気相堆積法、分散塗布法、ディッピ
ング法、スピナー法などによって形成される。The thin film conductor 24 is formed by vacuum vapor deposition,
It is formed by a sputtering method, a chemical vapor deposition method, a dispersion coating method, a dipping method, a spinner method, or the like.
【００４７】この表面伝導型電子放出素子の製造方法の
一例について説明すると、図４において、まず、絶縁性
基板２１として青板ガラスを用い、絶縁性基板２１上に
Ｎｉを用いて素子電極２５，２６を形成した。この時、
素子電極間隔Ｌ１を３μｍ、素子電極幅Ｗ１を５００μ
ｍ、素子電極の厚さｄを１０００Åとした。An example of the method of manufacturing the surface conduction electron-emitting device will be described. In FIG. 4, soda lime glass is used as the insulating substrate 21, and Ni is used on the insulating substrate 21 to form the device electrodes 25 and 26. Was formed. At this time,
Element electrode interval L1 is 3 μm, element electrode width W1 is 500 μm
m, and the thickness d of the device electrode was 1000Å.
【００４８】次に、素子電極上を含む所望の位置に有機
パラジウム（ｃｃｐ−４２３０：奥野製薬株式会社製）
含有溶液を塗布した後、３００℃で１０分間の加熱処理
をして、酸化パラジウム（ＰｄＯ）微粒子（平均粒径：
７０Å）からなる薄膜導電体２４を形成した。この時、
薄膜導電体２４の幅Ｗ２は３００μｍとした。Next, organopalladium (ccp-4230: manufactured by Okuno Chemical Industries Co., Ltd.) is placed at desired positions including on the device electrodes.
After applying the containing solution, heat treatment is performed at 300 ° C. for 10 minutes to obtain palladium oxide (PdO) fine particles (average particle diameter:
A thin film conductor 24 made of 70Å) was formed. At this time,
The width W2 of the thin film conductor 24 was 300 μm.
【００４９】なお本発明は、このような表面伝導型電子
放出素子に限られず、従来技術の説明で述べたようなＦ
Ｅ型、ＭＩＭ型等を用いても良い。The present invention is not limited to such a surface conduction electron-emitting device, but the F type as described in the description of the prior art.
You may use E type, MIM type, etc.
【００５０】[0050]
【発明の効果】以上説明したように本発明は、スペーサ
ーと背面板、およびスペーサーと前面板の間に弾性体を
配置した構成であるので、スペーサー上の前面板表面お
よび背面板表面に作用する引張応力値を減少させ、前面
板および背面板の破損を防止することができる。As described above, since the present invention has a structure in which the spacer and the back plate and the elastic body are arranged between the spacer and the front plate, the tensile stress acting on the front plate surface and the back plate surface on the spacer is increased. It is possible to reduce the value and prevent damage to the front plate and the back plate.
【００５１】したがって、画像形成装置の安全性が増す
と共に、歩留りが向上する。Therefore, the safety of the image forming apparatus is increased and the yield is improved.
【図１】本発明の画像形成装置の第１の実施例を示す断
面図である。FIG. 1 is a cross-sectional view showing a first embodiment of an image forming apparatus of the present invention.
【図２】スペーサーに大気圧支持される平面板表面に作
用する応力値と気密接合した容器内外の圧力差との関係
を示した図である。FIG. 2 is a diagram showing the relationship between the stress value acting on the surface of a flat plate that is supported by a spacer at atmospheric pressure and the pressure difference between the inside and outside of the airtightly joined container.
【図３】本発明の画像形成装置の第２の実施例を示す断
面図である。FIG. 3 is a cross-sectional view showing a second embodiment of the image forming apparatus of the invention.
【図４】表面伝導型電子放出素子の基本的な構成の一例
を示すものであり、（ａ）はその平面図、（ｂ）は縦断
面図である。FIG. 4 shows an example of a basic configuration of a surface conduction electron-emitting device, (a) is a plan view and (b) is a longitudinal sectional view.
１，１１ 前面板 ２，１２ 背面板 ３，１３ 支持枠 ４，１４ スペーサー ５，１５ 弾性体 ６，１６ 支持枠固定用フリットガラス ７ スペーサー固定用フリットガラス ２１ 絶縁性基板 ２３ 電子放出部 ２４ 薄膜導電体 ２５，２６ 素子電極 1, 11 Front plate 2, 12 Back plate 3, 13 Support frame 4, 14 Spacer 5, 15 Elastic body 6, 16 Support frame fixing frit glass 7 Spacer fixing frit glass 21 Insulating substrate 23 Electron emitting part 24 Thin film conductive Body 25,26 Element electrode
Claims (6)
背面板と対向して配置されると共に前記電子放出素子群
から放出される電子線の照射により画像が形成される画
像形成部材を搭載した前面板と、前記前面板と前記背面
板の間に配置されたスペーサーとを少なくとも有し、前
記前面板、前記背面板をフリットガラスにより互いに接
合して気密構造にされた画像形成装置において、 前記スペーサーと前記前面板、および前記スペーサと前
記背面板の間に弾性体が配置されていることを特徴とす
る画像形成装置。1. A back plate on which an electron-emitting device group is mounted, an image forming member which is disposed so as to face the back plate and which forms an image by irradiation of an electron beam emitted from the electron-emitting device group. An image forming apparatus having at least a mounted front plate and a spacer arranged between the front plate and the back plate, wherein the front plate and the back plate are joined to each other by frit glass to form an airtight structure, An image forming apparatus, wherein an elastic body is arranged between a spacer and the front plate, and between the spacer and the back plate.
ヤング率よりも低ヤング率のものを用いることを特徴と
する、請求項１に記載の画像形成装置。2. The image forming apparatus according to claim 1, wherein the elastic body has a Young's modulus lower than that of the spacer.
とを特徴とする、請求項１または２に記載の画像形成装
置。3. The image forming apparatus according to claim 1, wherein the inside of the airtightly joined container is evacuated.
板の大気圧支持部材として用いることを特徴とする、請
求項１または２に記載の画像形成装置。4. The image forming apparatus according to claim 1, wherein the spacer is used as an atmospheric pressure supporting member for the front plate and the rear plate.
板の間隔設定部材として用いることを特徴とする、請求
項１または２に記載の画像形成装置。5. The image forming apparatus according to claim 1, wherein the spacer is used as a gap setting member between the front plate and the back plate.
放出素子を用いることを特徴とする、請求項１乃至５の
いづれか１項に記載の画像形成装置。6. The image forming apparatus according to claim 1, wherein a surface conduction electron-emitting device is used as the electron-emitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11985794A JP3285703B2 (en) | 1994-06-01 | 1994-06-01 | Image forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11985794A JP3285703B2 (en) | 1994-06-01 | 1994-06-01 | Image forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07326306A true JPH07326306A (en) | 1995-12-12 |
| JP3285703B2 JP3285703B2 (en) | 2002-05-27 |
Family
ID=14771998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11985794A Expired - Fee Related JP3285703B2 (en) | 1994-06-01 | 1994-06-01 | Image forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3285703B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0903768A2 (en) * | 1997-09-19 | 1999-03-24 | Matsushita Electronics Corporation | Image display apparatus |
| US6512329B1 (en) | 1997-03-31 | 2003-01-28 | Canon Kabushiki Kaisha | Image forming apparatus having spacers joined with a soft member and method of manufacturing the same |
| WO2003028064A1 (en) * | 2001-09-19 | 2003-04-03 | Kabushiki Kaisha Toshiba | Image display unit |
| WO2003030205A1 (en) * | 2001-09-27 | 2003-04-10 | Kabushiki Kaisha Toshiba | Image display apparatus |
| US6630782B1 (en) | 1997-12-01 | 2003-10-07 | Matsushita Electric Industrial Co., Ltd. | Image display apparatus having electrodes comprised of a frame and wires |
| US7221086B2 (en) | 2002-09-20 | 2007-05-22 | Hitachi Displays, Ltd. | Display device including a shield member |
| US7385343B2 (en) | 2002-07-09 | 2008-06-10 | Hitachi Displays, Ltd. | Display device |
-
1994
- 1994-06-01 JP JP11985794A patent/JP3285703B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6512329B1 (en) | 1997-03-31 | 2003-01-28 | Canon Kabushiki Kaisha | Image forming apparatus having spacers joined with a soft member and method of manufacturing the same |
| US6700321B2 (en) | 1997-03-31 | 2004-03-02 | Canon Kabushiki Kaisha | Image forming apparatus and method of manufacturing the same |
| EP0903768A2 (en) * | 1997-09-19 | 1999-03-24 | Matsushita Electronics Corporation | Image display apparatus |
| EP0903768A3 (en) * | 1997-09-19 | 2001-04-04 | Matsushita Electronics Corporation | Spacer structure for a flat image display apparatus |
| EP1763059A2 (en) * | 1997-09-19 | 2007-03-14 | Matsushita Electric Industrial Co., Ltd. | Image display apparatus |
| EP1763059A3 (en) * | 1997-09-19 | 2007-06-06 | Matsushita Electric Industrial Co., Ltd. | Image display apparatus |
| US6630782B1 (en) | 1997-12-01 | 2003-10-07 | Matsushita Electric Industrial Co., Ltd. | Image display apparatus having electrodes comprised of a frame and wires |
| WO2003028064A1 (en) * | 2001-09-19 | 2003-04-03 | Kabushiki Kaisha Toshiba | Image display unit |
| WO2003030205A1 (en) * | 2001-09-27 | 2003-04-10 | Kabushiki Kaisha Toshiba | Image display apparatus |
| US7385343B2 (en) | 2002-07-09 | 2008-06-10 | Hitachi Displays, Ltd. | Display device |
| US7221086B2 (en) | 2002-09-20 | 2007-05-22 | Hitachi Displays, Ltd. | Display device including a shield member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3285703B2 (en) | 2002-05-27 |
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