JPH0485912A - Manufacture of electromagnetic machinery and apparatus - Google Patents

Abstract

PURPOSE:To enable facilitating wiring of a lead wire and filling of a compound with small noise and good heat dissipation properties by housing an electromagnetic apparatus body from an opening face, by filling a compound to embed the apparatus body, and by sealing an opening through a cover body and holding a case body in the direction for the opening to form a vertical face while hardening the compound. CONSTITUTION:An electromagnetic apparatus body 26 is housed from an opening 21 made in a face with the largest area of a case body 20 and a lead wire 24 is connected with the terminal 32 of the electromagnetic apparatus body 26. Then, a compound 36 is filled from the opening 21 of the case body 20 so that the electromagnetic apparatus body 26 housed in the case body 20 is embedded in the compound 36. Subsequently, the opening 21 of the case body 20 is closed by a cover body 34 and sealed by a sealant 35 while the compound 36 has fluidity. Then, the compound 36 is hardened while the case body 20 is kept in the state where it is raised in the direction for the opening 21 to form a vertical face.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing electromagnetic equipment, for example, a method of manufacturing an electromagnetic equipment by embedding the main body of the electromagnetic equipment in a compound in a case body such as a discharge lamp ballast. This invention relates to a manufacturing method for storing and fixing.

(Prior Art) As shown in FIG. 4, a conventional electromagnetic device of this type holds a case body 1 formed into a boat shape by drawing a metal plate so that the top opening 2 faces upward. In this state, the electromagnetic device body 3 is housed in the case body 1, and then compound 4 is filled from the opening 2 of the case body 1, the electromagnetic device body 3 is buried in this compound 4, and the case body A manufacturing method has been employed in which the opening 2 of the compound 4 is closed with a lid 5, the lid 5 is sealed with a sealing material 6, and the compound 4 is cured.

Further, as shown in FIG. 5, a cylindrical case body 7 with an open end face in the longitudinal direction is held so that the opening of the one end face faces upward, and the opening 8 of the one end face of the case body 7 is held so that the opening of the one end face faces upward. Then, the case body 7 is filled with compound 4, the electromagnetic device body 3 is buried in the compound 4, and in this state, the opening 8 of the case body 7 is filled with the end plate 10. A manufacturing method was adopted in which the compound 4 was closed and hardened.

(Problem to be Solved by the Invention) In the manufacturing method shown in FIG.
Since the opening is on the widest side, it is easy to store the electromagnetic device main body 3, and the lead wire 11 and the terminal 12 of the electromagnetic device main body 3 can be easily stored.
Although it has advantages such as easy connection wiring, easy positioning for filling the compound 4, and good wraparound of the compound 4 to the bottom side, on the other hand, shrinkage of the lid body 5 when the compound 4 hardens occurs. A gap 13 is created between the electromagnetic device main body 3 and the compound 4, and when the electromagnetic device main body 3 is energized, the magnetic attraction force caused by the electromagnetic device main body 3 acts on the lid body 5, or magnetic vibration is transmitted through the case body 1. When the lid 5 is reached, the middle part of the lid 5 faces the gap 13 and is not mechanically fixed, causing resonance at the natural frequency of the lid 5 and generating noise. was there.

Further, in the manufacturing method shown in FIG. 5, a gap 13 is formed between the end plate 10 and the compound 4, but the end plate lO
and the electromagnetic device body 3 is long, making it difficult for the magnetic attraction force of the electromagnetic device body 3 to reach, and even if the magnetic attraction force is transmitted to the end plate 10, the area of the end plate 10 is small and the resonance of the end plate 10 Although it has the advantage that the amplitude is small and does not easily cause noise, the opening area of the opening 8 of the case body 7 is narrow, and the electromagnetic device main body 3 is longer in the direction of insertion of the case body 7, making it difficult to insert the electromagnetic device main body 3. Furthermore, it is difficult to solder the Riet wire 11 that passes through the end plate 10 and leads out of the case body 7 to the terminal 12 of the electromagnetic device body 3 in advance, while inserting the electromagnetic device body 3 into the case body 7. In addition, since the opening 8 is narrow, precision is required for positioning the filling position of the compound 4, and the case body 7
Since the length in the insertion direction is long, there is a problem in that time is wasted for the compound 4 to wrap around, and it takes time to fill the compound 4.

The present invention was made in view of the above problems, and it reduces the gap between the lid body that closes the opening of the case body and the compound, thereby reducing noise, good heat dissipation, and reducing the wiring of lead wires and the compound. The present invention provides a method for manufacturing electromagnetic equipment that allows easy filling.

[Structure of the invention]

(Means for Solving the Problems) The method for manufacturing an electromagnetic device of the present invention includes the steps of storing the electromagnetic device from the opening surface of the case body with the widest area, and discharging the compound from the opening of the case body. burying the electromagnetic device main body housed in the case body with this compound, and sealing the rMc7 part of the case body with a lid body and opening it while the compound has fluidity. This process consists of a step of curing the compound while holding the case body in a direction in which the parts thereof are perpendicular to each other.

(Function) The electromagnetic device manufacturing method of the present invention stores the electromagnetic device from the opening that is the widest surface of the case body, making it easy to store the electromagnetic device and wiring the lead wires. This makes it easy to position the filling position of the compound to be filled from the opening of the case body.Furthermore, the compound wraps around easily, making it possible to securely bury the electromagnetic equipment body housed inside the case body in the compound. Furthermore, by sealing the opening of the case body with the lid body while the compound has fluidity and holding the case body in a direction where the opening is in a vertical plane, the hardening of the compound creates a gap between the lid body and the compound. The air gap created in the upper part is narrower, and the resonance vibration due to the natural frequency of the electromagnetic equipment body is also lower, reducing noise and improving heat dissipation.

(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1 to 3 of the drawings.

Reference numeral 20 denotes a case body formed by drawing a metal plate material, and the case body 20 has an opening at its widest surface. Mounting pieces 23 having mounting holes 22 are integrally formed on both ends of the opening 21 of the case body 20. Further, lead wires 24 are led out from both end surfaces of the case body 20 via rubber bushes 38, respectively. Furthermore, a ground terminal 25 is provided on one end surface of the case body 20.

In addition, 26 is the electromagnetic equipment main body, which includes an iron core 27 and this iron core 27.
It is composed of a secondary coil 28 and a secondary coil 29 attached to the coil bobbin 30 and 31 around which the secondary coil 28 and the secondary coil 29 are wound, respectively, each terminal 32 for connecting the lead wire 24 is provided. It is being A capacitor 33 is connected to the terminal 32 of the electromagnetic device body 26.

Furthermore, 34 is a lid, and the opening 21 of the case body 20
and the opening 21 of the case body 20 is sealed with the sealing material 35.

Further, 36 is an insulating compound that is filled into the case body 20 from the opening 21 and embeds the electromagnetic device body 26 therein.

First, in the first step, the electromagnetic device main body 26 is housed through the opening 21 opened on the widest surface of the case body 20 . Then, the lead wire 2 is connected to the terminal 32 of the electromagnetic device main body 26.
Connect 4.

In the next step, a compound 36 is filled through the opening 21 of the case body 20, and the electromagnetic device main body 26 housed in the case body 20 is buried in the compound 36 using the compound 3G.

In the subsequent step, the opening 21 of the case body 20 is closed with the lid 34 and sealed with a sealing material 35 while the compound 36 has fluidity. Then, the compound 36 is cured by holding the case body 20 in an upright position in a direction in which the opening 21 is a vertical plane.

Next, the operation of this embodiment will be explained.

Since the electromagnetic device main body 26 is stored through the opening 21 which is opened on the widest surface of the case body 20, the electromagnetic device main body 26 can be easily stored, and the wiring connection between the lead wire 24 and the terminal 32 can be made through the wide opening. The lead wire 24 can be wired more easily than the method in which the electromagnetic device main body 26 is housed in the case body 20 with the lead wire 24 connected to the electromagnetic device main body 26 in advance. Moreover, the opening 2 of this case body 20
Since the opening 21 is wide, positioning of the filling position of the compound 36 to be filled from the beginning becomes easy. Further, since the compound 36 is filled from the wide opening 21 of the case body 20, the compound 36 can wrap around well, and the electromagnetic device main body 26 housed in the case body 20 can be reliably buried in the compound 36. Further, while the compound 36 has fluidity, the opening 21 of the case body 20 is sealed with the lid 34 and the case body 20 is held in a direction in which the opening 21 is a vertical plane.
The gap created between the lid body 34 and the compound 36 by the hardening is narrow only in the upper part of the case body 20, and most of the lid body 34 is in close contact with the compound 36. Since most of the lid body 34 is in close contact with the compound 36, the lid body 34 does not vibrate due to the magnetic attraction force of the electromagnetic device body 26 when the electromagnetic device body 26 is energized, and the natural vibration of the electromagnetic device body 26 is suppressed. Resonant vibration due to the number of parts is also low, reducing noise and improving heat dissipation.

Note that by forming the case body 20 from a metal plate material by drawing, the corner portions 37 have curved surfaces, which increases mechanical strength and prevents vibrations even when vibrations from the electromagnetic device main body 26 are transmitted to the case body 20. The amplitude can be kept small. Further, since the corner portions 37 of the case body 20 have curved surfaces, the compound 36 can wrap around easily.

〔Effect of the invention〕

According to the present invention, since the electromagnetic device body is stored from the opening surface that is opened on the widest surface of the case body, the electromagnetic device body can be easily stored, and the wire can be easily wired. It is easy to position the filling position of the compound to be filled from the opening of the case, and the compound wraps around well, so the electromagnetic equipment body housed inside this case body can be reliably buried in the compound, and as the compound hardens, the lid body The gap created between the electromagnetic device and the compound is narrow only in the upper part, and the resonant vibration due to the natural frequency of the electromagnetic device body is also low, reducing noise and improving heat dissipation.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway side view of an electromagnetic device showing an embodiment of the present invention, and FIG. 2 is a partially cutaway front view of the same.
Figure 3 is a front view showing the process of assembling the electromagnetic device as above;
4 and 5 are partially cutaway side views of electromagnetic equipment manufactured by different conventional manufacturing processes, respectively. 20. Case body, 21. Opening, 26. Electromagnetic device body, 34. Lid body, 36. Compound. July 1990 Inventor Takashi Umehara

Claims (1)

[Claims] (1) The step of housing the electromagnetic device from the opening surface that opens the widest area of the case body, filling the compound from the opening of the case body, and storing the electromagnetic device inside the case body with this compound. a step of burying the electromagnetic device main body; and, while the compound has fluidity, sealing the opening of the case body with a lid body and holding the case body in a direction where the opening becomes a vertical plane, and burying the compound; A method of manufacturing an electromagnetic device, comprising the step of curing the .