JPH0447976B2 - - Google Patents
Info
- Publication number
- JPH0447976B2 JPH0447976B2 JP58050806A JP5080683A JPH0447976B2 JP H0447976 B2 JPH0447976 B2 JP H0447976B2 JP 58050806 A JP58050806 A JP 58050806A JP 5080683 A JP5080683 A JP 5080683A JP H0447976 B2 JPH0447976 B2 JP H0447976B2
- Authority
- JP
- Japan
- Prior art keywords
- storage box
- wafer
- light beam
- wafers
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 79
- 238000001514 detection method Methods 0.000 claims description 26
- 238000005259 measurement Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
この発明は、収納箱内のウエハの検出等に用い
られるウエハ検出装置に関する。
The present invention relates to a wafer detection device used for detecting wafers in a storage box.
、ウエハの測定においては、検査すべきウエハ
従来を収納した収納箱の下側にベルト駆動装置を
設置してベルトによつて下段からウエハを１枚ず
つ順に取り出すことが行われている。このような
ベルト駆動装置によるウエハの取出しは、収納箱
から必要に応じて任意の位置のウエハを選択的に
取り出すことができない。即ち、収納箱に測定し
たウエハを一旦戻すと、そのウエハが最下端にな
る場合は別として、収納箱から任意のウエハを選
択的に取り出すことができず、収納箱の中間に位
置しているウエハの再測定を困難にしていた。
In the measurement of wafers, a belt drive device is installed below a storage box containing conventional wafers to be inspected, and the wafers are sequentially taken out one by one from the lower stage using the belt. When taking out wafers using such a belt drive device, it is not possible to selectively take out wafers at arbitrary positions from the storage box as needed. That is, once the measured wafer is returned to the storage box, it is not possible to selectively take out any wafer from the storage box, except when the wafer is at the bottom, and it is located in the middle of the storage box. This made it difficult to re-measure the wafer.
ところで、収納箱からウエハを取り出して測定
する場合、収納箱に対する任意のウエハの選択的
な取り出し又は収納の自動化には、その前提とし
て収納箱内のウエハの有無、即ち、ウエハ位置の
検出の自動化が不可欠であり、しかも、その高精
度化が要請される。
そこで、この発明は、収納箱内でウエハの検出
を非接触で行い、その検出の高精度化を実現した
ウエハ検出装置の提供を目的とする。
By the way, when taking out wafers from a storage box for measurement, the automation of selective removal or storage of any wafer from the storage box requires automation of the detection of the presence or absence of wafers in the storage box, that is, the wafer position. is essential, and high precision is required. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a wafer detection device that detects wafers in a storage box in a non-contact manner and achieves high accuracy in the detection.
即ち、この発明のウエハ検出装置は、前面側及
び背面側を開放して任意の間隔で複数枚のウエハ
４を収納する収納箱５と、この収納箱の前面側か
ら前記ウエハに平行に光ビームを照射する光ビー
ム照射手段（発光素子７）と、前記収納箱内を通
過した前記光ビームを前記収納箱の背面側で受
け、その反射光ビームを前記収納箱の背面側から
前記収納箱を通過させる反射鏡３と、前記反射光
ビームを受光し、前記ウエハの有無を表す検出信
号を発生する受光手段（受光素子８）と、この受
光手段及び前記光ビーム照射手段と前記収納箱と
の相対的な位置を変更させ、前記光ビームを前記
収納箱内の前記ウエハに順次に照射することを可
能にする位置変更手段（エレベータ２）とを備え
たことを特徴とする。
That is, the wafer detection device of the present invention includes a storage box 5 that stores a plurality of wafers 4 at arbitrary intervals with the front and back sides open, and a light beam that is directed from the front side of the storage box in parallel to the wafers. a light beam irradiation means (light emitting element 7) that irradiates the inside of the storage box, receives the light beam that has passed through the storage box on the back side of the storage box, and directs the reflected light beam to the storage box from the back side of the storage box. A reflecting mirror 3 for passing through, a light receiving means (light receiving element 8) that receives the reflected light beam and generates a detection signal indicating the presence or absence of the wafer, this light receiving means, the light beam irradiation means, and the storage box. The present invention is characterized in that it includes a position changing means (elevator 2) that changes the relative position and makes it possible to sequentially irradiate the wafers in the storage box with the light beam.
このような構成によれば、光ビーム照射手段に
よつて光ビームを収納箱内のウエハに照射し、収
納箱を通過した光ビームを収納箱の背面側の反射
鏡で受け、この反射鏡で反射させた反射光ビーム
を受光手段で受光する。その結果、受光手段に収
納箱内のウエハの有無を表す反射光ビームが受光
されると、受光手段にはウエハの有無を表す検出
信号が得られるのである。
そして、位置変更手段は、光ビームを収納箱内
のウエハ位置に順次に照射するため、受光手段及
び光ビーム照射手段と収納箱との相対的な位置を
変更させるものであり、その位置の変更によつて
収納箱内のウエハの有無が受光手段に確実に検出
されることになる。
According to such a configuration, the light beam irradiation means irradiates the wafer in the storage box with a light beam, and the light beam that has passed through the storage box is received by the reflecting mirror on the back side of the storage box. The reflected light beam is received by a light receiving means. As a result, when the light receiving means receives a reflected light beam indicating the presence or absence of a wafer in the storage box, the light receiving means obtains a detection signal indicating the presence or absence of a wafer. The position changing means changes the relative position of the light receiving means, the light beam irradiation means, and the storage box in order to sequentially irradiate the light beam to the wafer positions in the storage box. This allows the light receiving means to reliably detect the presence or absence of wafers in the storage box.
以下、この発明を図面に示した実施例を参照し
て詳細に説明する。
第１図及び第２図は、この発明のウエハ検出装
置の実施例を示す。
装置本体１にはエレベータ２が取り付けられ、
装置本体１の上面には検出すべきウエハ４を収納
した収納箱５が配置され、また、装置本体１の背
面側には反射鏡３が固定されている。エレベータ
２のステージには、ハーフミラー６が設置されて
いるとともに、このハーフミラー６を介して光ビ
ームLiを収納箱５側に照射する光ビーム照射手段
として発光素子７が設置され、反射鏡３から得ら
れる反射光ビームLrを受光する受光手段として
受光素子８が設置されている。即ち、エレベータ
２は、第２図に示すように、発光素子７及び受光
素子８を上下方向（Ｙ：up及び−Ｙ：down）に
移送することにより、発光素子７及び受光素子８
と収納箱５との相対的な位置を変更させ、光ビー
ムLiを収納箱５内のウエハ４に順次に照射するこ
とを可能にした位置変更手段を構成しているので
ある。
このような構成によれば、発光素子７から発射
された光ビームLiはハーフミラー６を通過し、反
射鏡３で反射した反射光ビームLrがもとの光軸
を通つて、ハーフミラー６に戻り受光素子８に入
射される。そこで、装置本体１に対して下から上
にエレベータ２をスキヤンすることにより、収納
箱５内のウエハ４で通過後の光ビームLiに強弱が
生じ、受光素子８には、ウエハ４の有無を表す反
射光ビームLrが受光され、ウエハ４の検出信号
として微電流の変化が得られる。
この実施例では、ハーフミラー６を用いている
ので、光ビームLiと反射光ビームLrとの干渉を
抑えることができ、精度の高いウエハ検出を行う
ことができる。
次に、第３図及び第４図は、第１図及び第２図
に示したウエハ検出装置にウエハ取出・収納装置
を並設したウエハ検出・取出・収納装置の実施例
を示し、第１図に第２図と同一部分には同一符号
を付してある。
発光素子７及び受光素子８等が設置されたエレ
ベータ２は、パルスモータ１１によつて駆動され
るボールスクリユー１２に取り付けられるととも
に２本のガイドシヤフト１６によつて摺動可能に
支持されている。
そして、ウエハ取出・収納装置ｈは、収納箱５
からウエハ４を取出し又はウエハ４を収納箱５に
収納するウエハ移送手段であつて上下方向の位置
変更手段としてのエレベータ２を兼用している。
このウエハ取出・収納装置ｈには、収納箱５の内
部に挿入してウエハ４を載せて取り出すために平
板状を成すウエハ取出し及び収納手段として取出
しアーム９が設けられており、この取出しアーム
９の一端にはベルト１５が固定されている。ベル
ト１５は、取出しアーム９の移動に対応した間隔
を以て設置された一対のプーリ１４間に懸け回さ
れている。即ち、ベルト１５は、回転によつて取
出しアーム９を収納箱５に向かつて前後方向、図
中Ｘ方向に移動させる手段であつて、パルスモー
タ１３からベルト１５を介して加えられる回転力
を受けて回転する。
そして、取出しアーム９のウエハ４の載置部
分、即ち、ウエハ４の吸着面には、ウエハ４を吸
着するためのバキユームをウエハ４に作用させる
バキユーム穴が設けられている。
このような構成によれば、ウエハ４の有無を検
出した後、第４図に示すように、パルスモータ１
３によつてベルト１０を駆動して取出しアーム９
を前方に移動させて取り出すべきウエハ４の下面
側に挿入する。パルスモータ１３を停止させ、次
に、エレベータ２を僅かに上昇させた後、バキユ
ームを動作して取出しアーム９の上面にウエハ４
を吸着する。この状態でパルスモータ１３を逆転
させると、ベルト１０とともに取出しアーム９が
後方に移動し、取出しアーム９によつてウエハ４
が収納箱５から取り出されることになる。
次に、第５図は、第３図及び第４図に示したウ
エハ検出・取出・収納装置のシステム構成を示
す。
スタートスイツチａは、ウエハ４の検出、取出
し又は収納の開始を指令する手段である。記憶手
段ｇには、アドレスとともに位置決め情報が記憶
されている。スタートスイツチａが操作される
と、選択手段ｂを介してアドレス指定手段ｆに指
定開始命令が与えられ、ウエハ検出装置ｅからの
位置情報をもとに収納箱５内にあるウエハ４の位
置が決定される。
取出し制御手段ｃは、収納箱５からウエハ４の
取出しを制御し、収納制御手段ｄは取出しアーム
９を通してウエハ４の収納箱５への収納を制御す
る手段である。これらの制御手段ｃ，ｄからの制
御出力はエレベータ２を駆動するエレベータ駆動
装置ｉに加えられてウエハ取出、収納装置ｈに加
えられる。即ち、ウエハ取出・収納装置ｈのパル
スモータ１３及びエレベータ駆動装置ｉは取出し
制御装置手段ｃ、又は収納制御手段ｄからの情報
に基づいて位置決め制御が行われ、収納箱５から
のウエハ４の取出し又は収納箱５へウエハ４の収
納が行われる。
検出手段ｊは、検査の度にウエハ４が何処に置
かれているかの情報を検出する手段であつて、そ
の検出出力は選択手段ｂに供給され、それにより
ウエハ４の取出し、又はウエハ４の収納が選択さ
れる。
そして、第６図はこのウエハ検出・取出・収納
装置の構成を示す。即ち、このウエハ検出・取
出・収納装置には、１ボードのマイクロコンピユ
ータからなる制御部２０が設置され、この制御部
２０には、ウエハ４の検出・取出・収納制御プロ
グラムを実行するCPU２１、検出・取出・収納
制御プログラムを記憶した記憶手段としての
ROM２２、CPU２１の演算途上のデータや検出
信号を格納する記憶手段としてのRAM２３とと
もに入力ポート２４が設置されている。入力ポー
ト２４にはウエハ検出装置ｅ、バキユーム検出器
３１及びリミツト検出器３２からの検出信号が加
えられている。CPU２１から得られる制御出力
はエレベータ駆動回路３３、ウエハ取出・収納駆
動回路３４及び固定ピン回路３５に加えられてい
る。エレベータ駆動回路３３の駆動出力はパルス
モータ１１、ウエハ取出・収納駆動回路３４の駆
動出力はパルスモータ１３に加えられている。
そして、RAM２３に記憶されるアドレス及び
ウエハ位置は第１表の通りである。
Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. 1 and 2 show an embodiment of the wafer detection apparatus of the present invention. An elevator 2 is attached to the device main body 1,
A storage box 5 containing wafers 4 to be detected is arranged on the upper surface of the apparatus main body 1, and a reflecting mirror 3 is fixed to the back side of the apparatus main body 1. A half mirror 6 is installed on the stage of the elevator 2, and a light emitting element 7 is installed as a light beam irradiation means for irradiating a light beam Li to the storage box 5 side through the half mirror 6. A light-receiving element 8 is installed as a light-receiving means for receiving the reflected light beam Lr obtained from the light beam Lr. That is, as shown in FIG. 2, the elevator 2 transports the light emitting element 7 and the light receiving element 8 in the vertical direction (Y: up and -Y: down).
This constitutes a position changing means that changes the relative position of the storage box 5 and the storage box 5, and makes it possible to sequentially irradiate the wafers 4 in the storage box 5 with the light beam Li. According to such a configuration, the light beam Li emitted from the light emitting element 7 passes through the half mirror 6, and the reflected light beam Lr reflected by the reflector 3 passes through the original optical axis and returns to the half mirror 6. The returned light is incident on the light receiving element 8. Therefore, by scanning the elevator 2 from bottom to top with respect to the main body 1 of the apparatus, the strength of the light beam Li after passing through the wafer 4 in the storage box 5 varies, and the light receiving element 8 detects the presence or absence of the wafer 4. The reflected light beam Lr is received, and a slight change in current is obtained as a detection signal for the wafer 4. In this embodiment, since the half mirror 6 is used, interference between the light beam Li and the reflected light beam Lr can be suppressed, and highly accurate wafer detection can be performed. Next, FIGS. 3 and 4 show an embodiment of a wafer detection/take-out/storage device in which a wafer pick-up/storage device is installed in parallel with the wafer detection device shown in FIGS. 1 and 2. In the figure, the same parts as in FIG. 2 are given the same reference numerals. The elevator 2 in which the light emitting element 7, the light receiving element 8, etc. are installed is attached to a ball screw 12 driven by a pulse motor 11 and is slidably supported by two guide shafts 16. . The wafer unloading/storing device h has a storage box 5.
The elevator 2 is a wafer transfer means for taking out the wafers 4 from the storage box 5 or storing the wafers 4 in the storage box 5, and also serves as an elevator 2 as a means for changing the position in the vertical direction.
This wafer take-out/storage device h is provided with a take-out arm 9 as a flat plate-shaped wafer take-out and storage means for inserting into the storage box 5 to place and take out the wafer 4. A belt 15 is fixed to one end of the belt. The belt 15 is passed around between a pair of pulleys 14 installed at an interval corresponding to the movement of the take-out arm 9. That is, the belt 15 is a means for moving the take-out arm 9 toward the storage box 5 in the front-back direction, in the X direction in the figure, by rotation, and receives the rotational force applied from the pulse motor 13 via the belt 15. and rotate. A vacuum hole is provided on the wafer 4 mounting portion of the take-out arm 9, that is, on the wafer 4 suction surface, through which a vacuum for suctioning the wafer 4 is applied to the wafer 4. According to such a configuration, after detecting the presence or absence of the wafer 4, as shown in FIG.
3 drives the belt 10 to remove the take-out arm 9.
is moved forward and inserted into the lower surface side of the wafer 4 to be taken out. After stopping the pulse motor 13 and raising the elevator 2 slightly, the vacuum is operated to place the wafer 4 on the upper surface of the take-out arm 9.
adsorbs. When the pulse motor 13 is reversed in this state, the take-out arm 9 moves backward together with the belt 10, and the take-out arm 9 picks up the wafer 4.
will be taken out from the storage box 5. Next, FIG. 5 shows the system configuration of the wafer detection/takeout/storage apparatus shown in FIGS. 3 and 4. The start switch a is means for instructing the start of detection, unloading, or storage of the wafer 4. The storage means g stores positioning information along with addresses. When the start switch a is operated, a designation start command is given to the address designation device f via the selection device b, and the position of the wafer 4 in the storage box 5 is determined based on the position information from the wafer detection device e. It is determined. The take-out control means c controls the take-out of the wafers 4 from the storage box 5, and the storage control means d controls the storage of the wafers 4 into the storage box 5 through the take-out arm 9. Control outputs from these control means c and d are applied to an elevator drive device i that drives the elevator 2, and then to a wafer take-out and storage device h. That is, the pulse motor 13 and the elevator drive device i of the wafer takeout/storage device h are controlled for positioning based on information from the takeout control device means c or the storage control means d, and the wafers 4 are taken out from the storage box 5. Alternatively, the wafer 4 is stored in the storage box 5. The detection means j is a means for detecting information on where the wafer 4 is placed each time an inspection is performed, and its detection output is supplied to the selection means b, thereby determining whether the wafer 4 is taken out or the wafer 4 is placed. Storage is selected. FIG. 6 shows the configuration of this wafer detection/takeout/storage device. That is, this wafer detection/take-out/storage device is equipped with a control unit 20 consisting of a one-board microcomputer, and this control unit 20 includes a CPU 21 that executes a detection/take-out/storage control program for the wafer 4,・As a storage means for storing the retrieval/storage control program
An input port 24 is installed together with a ROM 22 and a RAM 23 as a storage means for storing data and detection signals being processed by the CPU 21. Detection signals from a wafer detection device e, a vacuum detector 31, and a limit detector 32 are applied to the input port 24. The control output obtained from the CPU 21 is applied to an elevator drive circuit 33, a wafer removal/storage drive circuit 34, and a fixing pin circuit 35. The drive output of the elevator drive circuit 33 is applied to the pulse motor 11, and the drive output of the wafer removal/storage drive circuit 34 is applied to the pulse motor 13. The addresses and wafer positions stored in the RAM 23 are as shown in Table 1.
【表】【table】
Claims (1)
数枚のウエハを収納する収納箱と、 この収納箱の前面側から前記ウエハに平行に光
ビームを照射する光ビーム照射手段と、 前記収納箱内を通過した前記光ビームを前記収
納箱の背面側で受け、その反射光ビームを前記収
納箱の背面側から前記収納箱を通過させる反射鏡
と、 前記反射光ビームを受光し、前記ウエハの有無
を表す検出信号を発生する受光手段と、 この受光手段及び前記光ビーム照射手段と前記
収納箱との相対的な位置を変更させ、前記光ビー
ムを前記収納箱内の前記ウエハに順次に照射する
ことを可能にする位置変更手段と、 を備えたことを特徴とするウエハ検出装置。 ２ 前記ウエハ側の前記光ビームの照射、前記反
射鏡からの前記反射光ビームの受光はハーフミラ
ーを通して行うことを特徴とする特許請求の範囲
第１項に記載のウエハ検出装置。[Scope of Claims] 1. A storage box that stores a plurality of wafers at arbitrary intervals with its front and back sides open, and a light beam that irradiates a light beam parallel to the wafers from the front side of the storage box. irradiation means; a reflecting mirror that receives the light beam that has passed through the storage box on the back side of the storage box and causes the reflected light beam to pass through the storage box from the back side of the storage box; and the reflected light beam. a light receiving means for receiving light and generating a detection signal indicating the presence or absence of the wafer; and changing the relative positions of the light receiving means, the light beam irradiation means, and the storage box to direct the light beam into the storage box. A wafer detection device comprising: a position changing means that makes it possible to sequentially irradiate the wafer. 2. The wafer detection device according to claim 1, wherein irradiation of the light beam on the wafer side and reception of the reflected light beam from the reflecting mirror are performed through a half mirror.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5080683A JPS59175740A (en) | 1983-03-25 | 1983-03-25 | Extractor for wafer in measuring device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5080683A JPS59175740A (en) | 1983-03-25 | 1983-03-25 | Extractor for wafer in measuring device for semiconductor |
Related Child Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1071184A Division JPH01280332A (en) | 1989-03-23 | 1989-03-23 | Detector for semiconductor wafer arrangement |
| JP1071185A Division JPH02333A (en) | 1989-03-23 | 1989-03-23 | Measuring method for semiconductor wafer |
| JP8359991A Division JP2500205B2 (en) | 1991-03-23 | 1991-03-23 | Wafer transfer device |
| JP8359891A Division JP2537310B2 (en) | 1991-03-23 | 1991-03-23 | Wafer detector |
| JP3083600A Division JPH0817199B2 (en) | 1991-03-23 | 1991-03-23 | Wafer transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59175740A JPS59175740A (en) | 1984-10-04 |
| JPH0447976B2 true JPH0447976B2 (en) | 1992-08-05 |
Family
ID=12869010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5080683A Granted JPS59175740A (en) | 1983-03-25 | 1983-03-25 | Extractor for wafer in measuring device for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59175740A (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61188331A (en) * | 1985-02-15 | 1986-08-22 | Nippon Texas Instr Kk | Wafer slice takeout device |
| JPH0652753B2 (en) * | 1985-05-13 | 1994-07-06 | キヤノン株式会社 | Substrate loading / unloading device |
| JPH0641323B2 (en) * | 1985-07-17 | 1994-06-01 | キヤノン株式会社 | Wafer position detector |
| JPH0642506B2 (en) * | 1985-08-30 | 1994-06-01 | キヤノン株式会社 | Wafer processing system |
| JPS62263647A (en) * | 1986-05-12 | 1987-11-16 | Tokyo Electron Ltd | Prober for wafer |
| JPH0333062Y2 (en) * | 1986-07-28 | 1991-07-12 | ||
| JPS63308928A (en) * | 1987-06-11 | 1988-12-16 | Fuji Electric Co Ltd | Wafer conveying equipment |
| JP2519096B2 (en) * | 1988-02-12 | 1996-07-31 | 東京エレクトロン株式会社 | Processing apparatus, resist processing apparatus, processing method, and resist processing method |
| JPH01244634A (en) * | 1988-03-25 | 1989-09-29 | Teru Barian Kk | Production device for semiconductor wafer |
| US4941800A (en) * | 1988-10-21 | 1990-07-17 | Tokyo Electron Limited | Transfer apparatus for plate-like member |
| JPH02142157A (en) * | 1988-11-22 | 1990-05-31 | Nippon M R C Kk | Wafer conveying and treating apparatus |
| JP2615171B2 (en) * | 1988-12-19 | 1997-05-28 | 東京エレクトロン株式会社 | Semiconductor manufacturing equipment |
| JP2859655B2 (en) * | 1989-09-19 | 1999-02-17 | 株式会社ニデック | Wafer detector |
| JPH0642505B2 (en) * | 1992-05-22 | 1994-06-01 | 株式会社東京精密 | Wafer extraction method |
| JPH1067428A (en) * | 1997-03-28 | 1998-03-10 | Texas Instr Japan Ltd | Wafer slice housing/extracting method |
| JP3936030B2 (en) * | 1997-06-23 | 2007-06-27 | 東京エレクトロン株式会社 | Recovery method of workpieces |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5764928A (en) * | 1980-10-07 | 1982-04-20 | Nippon Kogaku Kk <Nikon> | Carrying apparatus for photo mask or reticle |
-
1983
- 1983-03-25 JP JP5080683A patent/JPS59175740A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5764928A (en) * | 1980-10-07 | 1982-04-20 | Nippon Kogaku Kk <Nikon> | Carrying apparatus for photo mask or reticle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59175740A (en) | 1984-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0447976B2 (en) | ||
| US5466945A (en) | Apparatus for detecting proper positioning of objects in a holder | |
| JP2868645B2 (en) | Wafer transfer device, wafer inclination detecting method, and wafer detecting method | |
| JPS62175365A (en) | Semiconductor substrate conveying arm device | |
| JPH06239404A (en) | Method and apparatus for holding and carrying plate-shaped base | |
| JP2010219209A (en) | Substrate detecting device, and substrate conveying device with the same | |
| US4986729A (en) | Wafer transfer apparatus | |
| US20220317058A1 (en) | Defect Inspection Device and Defect Inspection Method | |
| JPH11150172A (en) | Transfer equipment | |
| JP5383365B2 (en) | Laser processing method, laser processing apparatus, and solar panel manufacturing method | |
| JP2002350283A (en) | Inspection device | |
| US4506158A (en) | Dual mode spectrometer test station | |
| JPH0244738B2 (en) | HAKUBANJOBUTSUTAINOTORIDASHISOCHI | |
| JPH04340245A (en) | Wafer transfer apparatus | |
| JP2005064463A (en) | Mapping device and method of controlling the same | |
| JPH04218942A (en) | Water detection device | |
| JPH07118502B2 (en) | Wafer handling method and device in cassette | |
| GB2349205A (en) | Detecting that two moveable members are correctly positioned relative to one another | |
| JPH06300541A (en) | Lead pin inspection device and position control device | |
| JPH0652753B2 (en) | Substrate loading / unloading device | |
| JPH05243347A (en) | Controlling method for movement and detecting device for position of processed object | |
| JP2988594B2 (en) | Wafer center detection device | |
| JPH10308438A (en) | Method of detecting carrier and wafer in carrier | |
| JPH07151589A (en) | Light projecting position control device and quantity measuring device for material in transparent container | |
| JPS6241129A (en) | Wafer position detecting device and method |