JPH04196239A - Semiconductor probe device - Google Patents

Abstract

PURPOSE:To manufacture an insulating substrate for probe installation use at low costs and to easily repair and replace a probe by a method wherein a probe installation face for power-supply use and a probe installation face for GND use are constituted as common conductive patterns on the insulating substrate for probe installation use and, after probes have been installed, respectively independent regions are constituted. CONSTITUTION:An electric signal from an inspection apparatus is guided to a probe installation region via an interconnection pattern on an insulating substrate 1 for probe installation use. Interconnection patterns for power-supply feed use and for GND feed use are connected to common conductive patterns for power-supply feed use and for GND feed use via through holes 7-b, 7-d and patterns 7-a, 7-c for connection use. A probe 4 for power-supply feed use and a probe for GND feed use which have been installed on the common conductive patterns 7 constitute, by means of working regions 8, a probe installation face for power-supply use and a probe installation face for GND use which are respectively independent. Thereby, a power supply and a GND are fed via the through holes and the patterns 7-a to 7-d. The power supply and the GND are fed to electrodes on a semiconductor element via the probes. Thereby, a cutting and working process to manufacture the insulating substrate for probe installation use is not required, a process to install the probes for power-supply use and for GND use is simplified and the probes can be replaced and repaired.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor probe device that inspects a semiconductor element by placing a probe thereon.

[Conventional technology]

FIG. 3 is a plan view showing a conventional semiconductor probe device. In the figure, (1) is an insulating substrate for installing a probe, and (2) is an inspection device provided on this insulating substrate for installing a probe (1). Wiring pattern for electrical connection with the device, (3) is a group of probes provided corresponding to the electrodes on the semiconductor element, (4) is a probe for power supply, and (5) is for GND supply. There is a probe, (2+
-b and (2) -c are respectively a power supply probe installation surface 1 and a GND probe installation surface provided on the probe installation insulating substrate (1). Further, (6) is a normal signal probe.

Next, the operation will be explained. Insulating substrate for probe installation (1)
is attached to semiconductor inspection equipment. Electrical signals from the inspection device are transmitted to the probe installation portion via a wiring pattern provided on the probe installation insulating substrate (1). A group of probes provided corresponding to electrodes on the semiconductor element is connected to the probe installation portion by soldering or other processing. Among the probes, the power supply probe (4) and the GND probe (5) are different from other signal probes (6) in that they are equipped with a power supply provided on the insulating substrate for probe installation (1). probe installation surface (2+-b, G
It is provided on the ND probe installation surface (2) -c. The electrical signal transmitted to the probe installation portion is electrically connected to the electrode on the semiconductor element via the probe, and the element is inspected.

[Invention or problem to be solved]

Conventional semiconductor probe devices are configured as described above, so a power source is installed inside the insulating substrate for installing the probe.

And for the purpose of installing a GND probe (in order to configure the turn surface, the process of cutting the insulating substrate is essential,
The processing cost will only increase compared to normal board production (the process of installing the probe is technically difficult due to the multi-stage structure of the probe, so there is no need to replace or repair the probe). There were some problems such as not being able to do so.

This invention was made in order to solve the above-mentioned problems, and eliminates the need for the cutting process for producing the probe mounting surface for power supply and GND supply in the production of an insulating substrate for probe installation. Another object of the present invention is to provide a semiconductor probe device that simplifies the process of installing a power supply GND probe and enables replacement and repair.

[Means to solve the problem]

In the semiconductor probe device according to the present invention, in the wiring pattern for transmitting electrical signals, the power supply and GND supply patterns are configured as common conductive turns in the probe installation processing area on the insulating substrate. When a probe is provided, the conductive no-turns can be separated into a power supply terminal part and a GND supply terminal part and processed into independent patterns.

[For production]

The power supply and GND supply patterns in this invention are configured as a common conductive pattern in the processing area for probe installation, and can also be formed as independent power supply and GND supply terminals by processing after the probe installation. Function.

〔Example〕

Hereinafter, this invention will be explained based on the drawings. FIG. 1 is a plan view showing a semiconductor probe device according to an embodiment of the present invention. In the figure, (7) is a common conductive pattern (7) for power supply and GND supply, and (7)-a is a common conductive pattern (7). Turn part for connecting with power supply wiring pattern, (7) −
b is a through hole, (7) -c is a common conductive pattern (7
) and the pattern part connecting the GND wiring pattern, (7
1-d is a through hole. (8) shows a probe installation area where the common conductive pattern (7) is processed and separated after the probe installation.

Note that the same parts as those in the conventional example are given the same reference numerals and explanations are omitted.

Next, the effect will be explained.

Electrical signals from the inspection installation are sent to the insulating substrate for probe installation (1)
is guided to the probe installation area via the wiring pattern. The wiring pattern for power supply and GND supply is through hole (7) -
b, (7) -d, and connection pattern (7)
-a.

(7) Connected to the common conductive pattern for power supply and GND supply via -c. The power supply probe (4) and the GND supply probe installed on the common conductive pattern (7) have independent power supply probe installation surfaces and GND probe installation surfaces depending on the processing area (8). By configuring (
7) -a, (7) -b, (7) -c, (7)
-d is supplied with power and GND, and the power and GND are supplied to the electrode on the semiconductor element through the probe.

In addition, in the above embodiment, the case where a power supply pattern and a GND supply pattern are configured as a common conductive pattern is shown, or the common conductive pattern is used as a common conductive pattern for a plurality of power supply and GND supply patterns.
It may be configured for D.

〔Effect of the invention〕

As described above, according to the present invention, the power supply probe installation surface and the GND probe installation surface are configured as a common conductive pattern on the insulating substrate for probe installation, and after the probe installation, separate areas are formed. Since the structure is configurable, the insulating substrate for installing the probe can be manufactured at low cost, and the probe can be easily repaired or replaced.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a semiconductor probe device according to an embodiment of the present invention, FIG. 2 is a sectional view of FIG. 1, FIG. 3 is a plan view showing a conventional semiconductor probe device, and FIG. 4 is a plan view showing a semiconductor probe device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a conventional semiconductor probe device. In the figure, (4) is the power supply probe, (5) is the GND
A supply probe, (7) is a common conductive pattern for power supply and GND supply, and (8) is an independent probe installation area after processing. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Agent: Masuo Oiwa Figure 1, 7-b, Electrolysis hole

Claims (1)

[Claims] In a semiconductor probe device provided with a probe for making an electrical connection with an electrode part of a semiconductor element and an electrode pattern for making an electrical connection with an inspection device, a power supply and a GND potential are supplied to the semiconductor element. The configuration of the probe section is such that it has a continuous and shared pattern on the probe installation surface of the probe device, and the continuous and shared pattern can be processed into independent patterns depending on the probe installation situation. A semiconductor probe device characterized by: