JP6953246B2 - 半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ - Google Patents
半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 385
- 238000004519 manufacturing process Methods 0.000 title claims description 44
- 238000001514 detection method Methods 0.000 title claims description 39
- 239000012535 impurity Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000005468 ion implantation Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000001312 dry etching Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 32
- 238000002161 passivation Methods 0.000 description 14
- 238000002834 transmittance Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/242—Stacked detectors, e.g. for depth information
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- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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Description
Claims (6)
- 互いに対向する第1主面及び第2主面を含む第1導電型の第1半導体領域を有する半導体ウエハを準備する工程と、
前記第1半導体領域の前記第1主面側に、該第1半導体領域とでエネルギー線感応領域を構成する第2導電型の第2半導体領域を設ける工程と、
前記第1半導体領域の前記第2主面側に、前記第1半導体領域よりも不純物濃度が高い第1導電型の第3半導体領域を設ける工程と、
前記第1主面に直交する方向から見て、前記エネルギー線感応領域を含むチップ部を画成している、第1仮想切断線と該第1仮想切断線よりも前記第2半導体領域の縁までの最短距離が小さい第2仮想切断線とのうち、該第2仮想切断線に沿って前記半導体ウエハを厚さ方向に貫通する貫通スリットを設けることで、前記第1半導体領域が露出する側面を前記チップ部に形成する工程と、
前記側面に不純物を添加して、当該側面側に前記第1導電型の第4半導体領域を設ける工程と、を備える、半導体ウエハの製造方法。 - 前記貫通スリットは、ドライエッチングによって設けられる、請求項1に記載の半導体ウエハの製造方法。
- 前記第1主面及び前記第2主面にメタル層を設ける工程を更に備え、
前記不純物は、前記メタル層を設けた後に、イオン注入によって前記チップ部の側面に添加される、請求項1又は2に記載の半導体ウエハの製造方法。 - 前記第3半導体領域は、該第3半導体領域の厚さ方向における長さが前記第2半導体領域の厚さ方向における長さよりも小さくなるように設けられる、請求項1〜3のいずれか1項に記載の半導体ウエハの製造方法。
- 請求項1〜4のいずれか1項に記載の半導体ウエハの製造方法によって製造された半導体ウエハを準備する工程と、
前記第1仮想切断線に沿ってチップ部を切り離す工程と、を備える、半導体エネルギー線検出素子の製造方法。 - 互いに対向する第1主面及び第2主面を有する半導体ウエハであって、
前記第1主面に直交する方向から見て、厚さ方向に貫通している貫通スリットと仮想切断線とによって画成されていると共に、エネルギー線感応領域を含むチップ部を備え、
前記チップ部は、
前記第1主面側に位置している第1導電型の第1半導体領域と、
前記第1主面側に位置していると共に、前記第1半導体領域とで前記エネルギー線感応領域を構成する第2導電型の第2半導体領域と、
前記第2主面側に位置していると共に、前記第1半導体領域よりも不純物濃度が高い第1導電型の第3半導体領域と、
前記第1主面及び前記第2主面に接続されている側面側に位置していると共に、前記第1半導体領域よりも不純物濃度が高い第1導電型の第4半導体領域と、を有し、
前記チップ部は、前記第1主面に直交する方向から見て、前記チップ部の縁として複数の辺を含む多角形状を呈しており、
前記仮想切断線は、前記第1主面に直交する方向から見て、前記複数の辺のうち、1辺に沿って設定されており、
前記貫通スリットは、前記第1主面に直交する方向から見て、前記複数の辺のうち、少なくとも前記1辺以外の辺に沿って設けられており、
前記チップ部の前記側面と前記第2半導体領域の縁との最短距離は、前記仮想切断線と前記第2半導体領域の縁との最短距離よりも小さい、半導体ウエハ。
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JP2017173049A JP6953246B2 (ja) | 2017-09-08 | 2017-09-08 | 半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ |
CN201880057592.7A CN111066156B (zh) | 2017-09-08 | 2018-09-05 | 半导体晶片的制造方法、半导体能量线检测元件的制造方法及半导体晶片 |
US16/643,961 US11398572B2 (en) | 2017-09-08 | 2018-09-05 | Semiconductor wafer manufacturing method, method of manufacturing semiconductor energy beam detecting element, and semiconductor wafer |
EP18854988.5A EP3680940A4 (en) | 2017-09-08 | 2018-09-05 | SEMICONDUCTOR WAFER MANUFACTURING METHOD, METHOD FOR MANUFACTURING A SEMICONDUCTOR ENERGY RAY DETECTING ELEMENT, AND SEMICONDUCTOR WAFER |
PCT/JP2018/032912 WO2019049900A1 (ja) | 2017-09-08 | 2018-09-05 | 半導体ウエハの製造方法、半導体エネルギー線検出素子の製造方法、及び半導体ウエハ |
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CA2119176C (en) * | 1993-03-19 | 1998-06-23 | Masahiro Kobayashi | Semiconductor light detecting device |
JPH09260709A (ja) * | 1996-03-22 | 1997-10-03 | Fuji Electric Co Ltd | 半導体放射線検出素子 |
US6333457B1 (en) * | 2000-08-29 | 2001-12-25 | Sunpower Corporation | Edge passivated silicon solar/photo cell and method of manufacture |
GB2392307B8 (en) | 2002-07-26 | 2006-09-20 | Detection Technology Oy | Semiconductor structure for imaging detectors |
JP5358960B2 (ja) * | 2008-01-28 | 2013-12-04 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP2010239005A (ja) * | 2009-03-31 | 2010-10-21 | Kinki Univ | 裏面照射型撮像素子の製造方法、その製造方法により製造された裏面照射型撮像素子及びそれを備えた撮像装置 |
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JP6084401B2 (ja) * | 2012-08-30 | 2017-02-22 | 浜松ホトニクス株式会社 | 側面入射型のフォトダイオードの製造方法 |
JP2014220403A (ja) * | 2013-05-09 | 2014-11-20 | 浜松ホトニクス株式会社 | 半導体エネルギー線検出素子及び半導体エネルギー線検出素子の製造方法 |
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US20160148875A1 (en) | 2013-08-08 | 2016-05-26 | Sharp Kabushiki Kaisha | Semiconductor element substrate, and method for producing same |
JP6170379B2 (ja) * | 2013-08-30 | 2017-07-26 | 浜松ホトニクス株式会社 | 半導体エネルギー線検出素子 |
JP6235383B2 (ja) * | 2014-03-10 | 2017-11-22 | 東芝メモリ株式会社 | 半導体装置の製造方法および半導体集積回路ウェハ |
CN107112315B (zh) * | 2015-01-16 | 2019-03-29 | 雫石诚 | 半导体器件及其制造方法 |
WO2017002747A1 (ja) * | 2015-06-30 | 2017-01-05 | シャープ株式会社 | 光電変換素子 |
JP6397460B2 (ja) * | 2016-11-04 | 2018-09-26 | 浜松ホトニクス株式会社 | 半導体ウエハ |
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US20200411702A1 (en) | 2020-12-31 |
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US11398572B2 (en) | 2022-07-26 |
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