JP6696521B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present disclosure relates to a light emitting device and a method for manufacturing the light emitting device.

  As a light emitting device, for example, Patent Documents 1 and 2 disclose configurations in which a covering member is provided around a light emitting element.

JP, 2013-219397, A JP, 2016-219743, A

  However, the light emitting devices disclosed in Patent Documents 1 and 2 are required to have higher light extraction efficiency.

  Therefore, it is an object of an embodiment according to the present disclosure to provide a light emitting device with high light extraction efficiency and a method for manufacturing the light emitting device.

  A light emitting device according to an embodiment of the present disclosure includes a rectangular substrate, a light emitting element mounted on the substrate, a reflecting member provided so as to surround the light emitting element with a space, and the inside of the reflecting member. A light guide member filled inside the reflection member so as to cover the light emitting element, and a translucent member provided on the light guide member, wherein the reflection member is provided on a side surface of the light emitting element. The first reflecting member is provided opposite to the first reflecting member, and the second reflecting member is provided outside the first reflecting member so as to surround the light emitting element. The first reflecting member includes the transparent member. The second reflecting member has an inner surface of an inclined surface or a curved surface that is inclined so as to widen the interval facing the light-transmitting member, and the second reflecting member has a side surface of the light-transmitting member and an outer surface of the first reflecting member. And the upper surface of the second reflecting member is flush with the upper surface of the translucent member.

  Further, a method for manufacturing a light emitting device according to another embodiment of the present disclosure includes a step of arranging a plurality of light emitting elements on a substrate, and a first reflecting member provided between the light emitting elements and separated from the light emitting elements. A step of providing a light guide member that covers the light emitting element and is in contact with the first reflection member, a step of providing a light transmissive member on the light guide member and the first reflection member, and the light transmissive member And a step of removing a part of the first reflective member to form a first groove, and a step of providing a second reflective member in contact with the translucent member and the first reflective member in the first groove, And a step of cutting the second reflecting member into individual pieces.

According to the light emitting device according to the embodiment of the present disclosure, the region surrounded by the reflective member and the translucent member is filled with the light guide member, so that the light extraction efficiency is high and the interval between the first reflective members is large. Due to the sloping inner surface that spreads, more light can be propagated over a wide range.
According to the method for manufacturing a light emitting device according to the embodiment of the present disclosure, the inner surface of the first reflective member is inclined, the outer wall of the device is formed by the second reflective member, and the light guide member is used for forming the light emitting element. A light emitting device that fills the surroundings can be easily manufactured.

It is the perspective view which looked at the light-emitting device concerning a 1st embodiment from the light-emitting side. It is the perspective view which looked at the light-emitting device concerning a 1st embodiment from the electrode side. FIG. 3 is a perspective view showing a cross section of the light emitting device according to the first embodiment taken along a plane parallel to the longitudinal direction thereof and perpendicular to the light emitting surface. It is sectional drawing which cut | disconnects and shows the light-emitting device which concerns on 1st Embodiment in the surface parallel to the longitudinal direction and the light-emitting surface. It is sectional drawing which cuts and shows the light-emitting device which concerns on 1st Embodiment by the surface parallel to the lateral direction and perpendicular | vertical to a light-emitting surface. 6 is a flowchart showing an example of a method for manufacturing the light emitting device according to the first embodiment of the invention. FIG. 5 is a plan view of the substrate with a part omitted for explaining the step of arranging the light emitting elements in the flowchart of FIG. 4. FIG. 5 is a cross-sectional view for explaining a step of providing a first reflecting member in the flowchart of FIG. 4. FIG. 5 is a cross-sectional view for explaining a step of providing a light guide member in the flowchart of FIG. 4. It is sectional drawing for demonstrating the removal process in the flowchart of FIG. FIG. 5 is a cross-sectional view for explaining a step of providing a translucent member in the flowchart of FIG. 4. FIG. 5 is a cross-sectional view for explaining a step of forming a first groove and a step of forming a second groove in the flowchart of FIG. 4. FIG. 5 is a cross-sectional view for explaining a step of providing a second reflecting member in the flowchart of FIG. 4. It is sectional drawing for demonstrating the process of dividing into pieces in the flowchart of FIG. FIG. 6 is a plan view for explaining a step of forming a first groove and a step of forming a second groove in the flowchart of FIG. 4. FIG. 5 is a plan view for explaining a step of providing a second reflecting member in the flowchart of FIG. 4. FIG. 5 is a plan view for explaining a step of dividing into pieces in the flowchart of FIG. 4. It is sectional drawing which shows the light-emitting device which concerns on 2nd Embodiment typically. FIG. 6 is a cross-sectional view for explaining a manufacturing process of the light emitting device according to the second embodiment. It is sectional drawing which shows the light-emitting device which concerns on 3rd Embodiment typically. It is sectional drawing which shows the light-emitting device concerning 4th Embodiment typically. It is sectional drawing which shows the light-emitting device which concerns on 5th Embodiment typically. It is sectional drawing which shows the light-emitting device which concerns on 6th Embodiment typically. It is sectional drawing which shows partially the 1st reflective member of the light-emitting device which shows the modification of embodiment which concerns on this invention. It is sectional drawing which shows partially the 1st reflective member of the light-emitting device which shows the other modification of embodiment which concerns on this invention.

  Hereinafter, the light emitting device according to the embodiment and the method for manufacturing the same will be described. It should be noted that the drawings referred to in the following description schematically show the present embodiment, and therefore scales, intervals, positional relationships, etc. of each member are exaggerated, or a part of the members is not shown. There is a case. Further, in the following description, the same name and reference numeral basically indicate the same or the same member, and detailed description thereof will be appropriately omitted. Further, in FIG. 5A to FIG. 5H and FIG. 6A to FIG. 6C or FIG. 8, only a part of the whole is partially extracted and shown. In each drawing, the irradiation direction Br of the central light emitted from the light emitting device 10 is indicated by an arrow. In the following description, the irradiation direction Br of the light emitted from the light emitting device 10 will be described as the upper direction and the opposite direction as the lower direction.

<Light emitting device>
As shown in FIGS. 1 and 3A to 3C, the light emitting device 10 includes a rectangular substrate 22, a light emitting element 16 mounted on the substrate 22, a light guide member 24 that covers the light emitting element 16, and a light guide member. 24, a translucent member 25 provided on the reflective member 24, a reflective member 17 provided around the translucent member 25 and the light guide member 24 so as to surround the light emitting element 16, an element electrode 15, and a wiring 14. ing. The light emitting device 10 irradiates light through the light transmissive member 25 which is the light emitting surface 12. In the example shown in the figure, the translucent member 25 includes a phosphor layer 26 and a translucent layer 28 laminated thereon. The phosphor layer 26 is not always essential in the present invention. In the following description, the case where the translucent member 25 includes the phosphor layer 26 will be described as an example. Further, the reflecting member 17 is provided with a first reflecting member 18 provided to face the side surface of the light emitting element 16, and a second reflecting member provided outside the first reflecting member 18 and surrounding the light emitting element 16. 20 and 20.
Hereinafter, each configuration will be sequentially described.

  As shown in FIGS. 3A to 3C, the light emitting element 16 includes a translucent substrate, a semiconductor layer, and an element electrode 15. It is preferable that the light emitting element 16 has a rectangular shape in a top view, particularly a rectangular shape having a long side and a short side. Further, the light emitting element 16 may have other shapes, for example, a hexagonal shape can enhance the light emission efficiency. The light emitting element 16 preferably has positive and negative (p, n) electrodes on the same surface side. Further, one light emitting device 16 may be provided in one light emitting device 10, or a plurality of light emitting devices 16 may be included. When a plurality of light emitting elements 16 are included, they can be connected in series or in parallel.

Note that the translucent substrate may be any one that is usually used when manufacturing a semiconductor light emitting device, and specifically, a sapphire substrate is used. Further, it is preferable that the semiconductor layer includes a stacked body of semiconductor layers, that is, at least an n-type semiconductor layer and a p-type semiconductor layer, and an active layer interposed therebetween. As the semiconductor material of the semiconductor layer, it is preferable to use a nitride semiconductor, which is a material capable of emitting short-wavelength light capable of efficiently exciting the wavelength conversion substance. Nitride semiconductor is represented by mainly general formula _{In x Al y Ga 1-x} -y N (0 ≦ x, 0 ≦ y, x + y ≦ 1). Further, the device electrodes 15 are formed on the same surface side. The element electrode 15 needs to be a mountable metal material, but the kind of metal is not particularly limited as long as it is a conductive member that enables electrical connection. The element electrode 15 is joined to the substrate 22 described later via a joining member.

  The joining member may be provided so as to be interposed between the element electrode 15 of the light emitting element 16 and the wiring 14 of the substrate 22. For example, the wiring 14 of the substrate 22 may be provided in a region where the light emitting element 16 is mounted, or may be provided on the element electrode 15 side of the light emitting element 16, or both of them. The joining member is a conductive liquid or paste and can be appropriately selected from methods such as a potting method, a printing method and a transfer method depending on the viscosity and the like.

The substrate 22 includes at least the wiring 14 and a base body that holds the wiring.
The wiring 14 is formed on at least the upper surface (front surface) of the base, and may also be formed inside and / or on the side surface and / or on the lower surface (rear surface) of the base. The wiring 14 can be formed of, for example, copper or a copper alloy. Further, the base can be made of resin or fiber reinforced resin, ceramics, glass, metal, paper or the like as long as it is a rigid substrate. As the base material, it is particularly preferable to use a base material having physical properties close to the linear expansion coefficient of the light emitting element.

  The light guide member 24 is a member that is provided so as to fill the region surrounded by the reflection member 17 and seals the light emitting element 16 mounted on the substrate 22. As the light guide member 24, it is preferable to use a material having a good light-transmitting property with respect to the wavelength of the light emitted by the light emitting element 16 and a sealing member having a good weather resistance, light resistance and heat resistance. By providing the light guide member 24 on the side surface of the light emitting element 16, the light from the side surface of the light emitting element 16 is guided to the translucent member 25 more efficiently. As a result, the loss of light can be suppressed and the light extraction efficiency of the light emitting device 10 can be improved.

Examples of the material of the light guide member 24 include thermoplastic resin and thermosetting resin. As the thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester and the like can be used. As the thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.

The reflection member 17 constitutes a side wall of the light emitting device, reflects the light from the light emitting element 16 and takes it out from the light emitting surface 12. The reflecting member 17 includes a first reflecting member 18 and a second reflecting member 20. The reflecting member 17 enhances the light extraction efficiency by the first reflecting member 18 and the second reflecting member 20.
From the viewpoint of forward light extraction efficiency, the reflecting member 17 preferably has a light reflectance at the emission peak wavelength of the light emitting element of 70% or more, more preferably 80% or more, and 90% or more. It is even more preferred to be present. Furthermore, the reflecting member 17 is preferably white. Therefore, the reflecting member 17 preferably contains the white pigment in the base material.

A resin can be used for the base material of the reflecting member 17, and examples thereof include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, and modified resins thereof. Among them, the silicone resin and the modified silicone resin are preferable because they are excellent in heat resistance and light resistance. Specific silicone resins include dimethyl silicone resin, phenyl-methyl silicone resin, and diphenyl silicone resin. Further, the base material of the reflecting member may contain various fillers in the resin. Examples of the filler include silicon oxide, aluminum oxide, zirconium oxide, zinc oxide and the like. The filler may be used alone or in combination of two or more. In particular, silicon oxide having a small coefficient of thermal expansion is preferable. Further, by using nanoparticles as the filler, it is possible to increase scattering including blue Rayleigh scattering of the light emitting element and reduce the amount of the wavelength conversion substance used. Note that the nanoparticles are particles having a particle size of 1 nm or more and 100 nm or less. Further, the “particle size” in the present specification is defined by, for example, D ₅₀ .

  White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide and zirconium oxide. One of them can be used, or two or more of these can be used in combination. The shape of the white pigment is not particularly limited, and may be indefinite or crushed, and spherical is preferable from the viewpoint of fluidity. Further, the particle size of the white pigment is, for example, about 0.1 μm or more and 0.5 μm or less, and the smaller the better in order to enhance the effect of light reflection and coating. The content of the white pigment in the reflecting member can be appropriately selected, and from the viewpoint of light reflectivity and viscosity in a liquid state, for example, 10 wt% or more and 80 wt% or less is preferable, 20 wt% or more and 70 wt% or less is more preferable, and 30 wt% Above 60 wt% is even more preferable. In addition, "wt%" is a weight percentage and represents the ratio of the weight of the material to the total weight of the first reflecting member 18 or the second reflecting member 20.

  When using the light emitting element 16 having a long side and a short side in a top view, the first reflecting member 18 is provided at a position facing the short side of the light emitting element 16. The first reflecting member 18 has an inner surface 19 that is an inclined surface or a curved surface that is inclined so as to widen the interval facing the translucent member 25. In other words, each of the pair of first reflecting members 18 has an inner surface 19 that is an inclined surface or a curved surface that is inclined so that the distance between them gradually increases in the irradiation direction Br. The outer side surface of the first reflecting member 18 is provided in contact with the inner side surface of the second reflecting member 20. The upper end of the first reflecting member 18 is provided in contact with the lower surface of the phosphor layer 26. Further, the first reflecting member 18 is provided so as to abut on a side surface of the substrate 22 facing the short side of the substrate 22, and the lower surface of the first reflecting member 18 is flush with the lower surface of the substrate 22. At the position where the second reflecting member 20 is provided, a part of the first reflecting member 18 enters the lower end of the second reflecting member 20, and the lower end of the second reflecting member 20 is the lower end of the first reflecting member 18. It is in a higher position than. The first reflecting member 18 uses, for example, the same light reflecting material as that of the second reflecting member 20 described later.

The second reflecting member 20 is provided so as to surround the first reflecting member 18 and the light emitting element 16. The second reflecting member 20 forms a side wall of the light emitting device 10. The second reflection member 20 is provided such that its upper end portion is flush with the upper surface of the translucent member 25 and covers the side surface of the translucent member 25. Further, as shown in FIG. 3C, the second reflecting member 20 is provided so as to contact the upper surface of the peripheral edge of the substrate 22 in the longitudinal direction. The thickness of the second reflective member 20 may be any, but in FIG. 3A and the like, the thickness of the second reflective member 20 is set to be half or less than that of the first reflective member 18. It is more preferable that the thickness of the second reflecting member 20 is equal to or smaller than that of the first reflecting member 18. By making the second reflecting member 20 thin, the light emitting surface 12 can be made wide, and the extracted light can be propagated in a wide range.
The second reflecting member 20 is manufactured by first installing the first reflecting member 18 and then filling the groove provided in the first reflecting member 18 by the procedure of the manufacturing method described below. The material of the second reflecting member 20 and the material of the first reflecting member 18 that are set to be thinner than the thickness of the first reflecting member 18 may be the same or different. Since one example is described here as the same material, it is preferable to use the reflecting member described above, for example.

  With such a configuration, the first reflecting member 18 and the second reflecting member 20 can suppress absorption of light from the light emitting element 16 and the phosphor. Further, the first reflecting member 18 and the second reflecting member 20 play a role of reflecting the light from the light emitting element 16 and the phosphor and guiding it to the light emitting surface 12. By reducing the thickness of the second reflecting member 20, the light emitting surface 12 can be made as wide as possible on the upper surface of the light emitting device 10, and the light extraction efficiency is improved.

  The phosphor layer 26 is provided on the upper surfaces of the first reflecting member 18 and the light guide member 24. The phosphor layer 26 converts the wavelength of light from the light emitting element 16. For example, the light emitting element 16 emits blue light, and the phosphor layer 26 converts a part of blue light into, for example, yellow light by the wavelength conversion substance which is a phosphor. Thereby, light (for example, white light) obtained by mixing these lights can be emitted from the light emitting device 10. A plurality of types of wavelength conversion substances may be contained in the phosphor layer 26, and instead of or in addition to the wavelength conversion substance, a filler similar to the base material of the above-mentioned reflection member may be contained.

Further, as the wavelength conversion substance (phosphor) contained in the phosphor layer 26, one known in the art can be used. For example, cerium-activated yttrium-aluminum-garnet (YAG) -based phosphor that emits green to yellow, cerium-activated lutetium-aluminum-garnet (LAG) -based phosphor that emits green, and green to red. europium and / or chromium activated nitrogen containing calcium aluminosilicate _{(CaO-Al 2 O 3 -SiO} 2) based phosphor emits light, activated with europium emits blue to red silicate ((Sr, _{Ba) 2} SiO ₄ ) -based phosphors, β-sialon phosphors that emit green light, CASN-based phosphors that emit red, CaAlSiN ₃ : Eu, or SCASN-based phosphors that represent (Sr, Ca) AlSiN ₃ : Eu. Examples thereof include a nitride-based phosphor, a K ₂ SiF ₆ : Mn (KSF) -based phosphor that emits red light, and a sulfide-based phosphor that emits red light.

  The light transmitting layer 28 transmits the light from the phosphor layer 26, the light from the light emitting element 16 and the light from the reflecting member 17, and takes them out to the outside. In addition, the upper surface of the transparent layer 28 is the light emitting surface 12. The translucent layer 28 is provided in contact with the phosphor layer 26 and its peripheral side surface in contact with the second reflecting member 20. The upper surface of the light transmitting layer 28 and the upper surface of the second reflecting member 20 are formed so as to be flush with each other. It is preferable that the light-transmitting layer 28 has a light-transmitting property and that the sealing member is made of a material having good weather resistance, light resistance, and heat resistance.

The term "translucency" as used herein means that the light transmittance of the light emitting element at the emission peak wavelength is preferably 60% or more, more preferably 70% or more, and even more preferably 80%. Say that is above. As the base material of the translucent layer 28, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin thereof can be used. The base material of the transparent layer 28 may be glass. Among them, the base material of the light-transmitting layer 28 is preferably a silicone resin or a modified silicone resin, which is excellent in heat resistance and light resistance. Specific silicone resins include dimethyl silicone resin, phenyl-methyl silicone resin, and diphenyl silicone resin. The translucent member 25 can be configured by one of these base materials or by laminating two or more of these base materials. The base material of the translucent layer 28 may contain the same filler as the base material of the first reflecting member 18 and the second reflecting member 20 in the resin or glass.

  Since the light emitting device 10 is configured as described above, when the light is emitted from the light emitting element 16, the light transmitting member 25 transmits the light transmitting member 25 (the phosphor layer 26 and the light transmitting layer 28). And is taken out from the light emitting surface 12. In addition, a part of the light from the light emitting element 16 is easily extracted to the light emitting surface 12 side by the inclined surface or the curved inner side surface 19 of the first reflecting member 18. Further, since the second reflecting member 20 covers the side surfaces of the phosphor layer 26 and the light transmitting layer 28, the light is reflected by the second reflecting member 20 and the light is extracted from the light emitting surface 12.

  The first reflecting member 18 has a required thickness (for example, equal to or more than the substrate 22), and forms the frame of the light emitting device 10 together with the substrate 22 to maintain the strength of the entire light emitting device. There is. By disposing the phosphor layer 26 and the translucent layer 28 above the upper end portion of the first reflecting member 18, the light emitting surface 12 can be as wide as possible on the upper surface of the light emitting device 10. Further, since the inclined surface or the curved inner side surface 19 is formed on the upper portion of the first reflecting member 18, the light from the light emitting element 16 can be easily extracted from the light emitting surface 12. Therefore, in the light emitting device 10, the light extraction efficiency is improved and the unevenness of color tone is alleviated.

<Method of manufacturing light emitting device>
Next, a method for manufacturing the light emitting device according to the first embodiment will be described below.
As shown in FIG. 4, in the method for manufacturing the light emitting device, the step S101 of arranging the light emitting elements 16, the step S102 of providing the first reflecting member 18, the step S103 of providing the light guide member 24, and the translucent member 25. Is performed in a procedure including a step S105 of providing the first groove 32, a step S106 of forming the first groove 32, a step S108 of providing the second reflecting member 20, and a step S109 of dividing into individual pieces. In the method for manufacturing the light emitting device, the removing step S104 may be performed after the step S103 of providing the light guide member 24, and the second groove 34 is formed after the step S106 of forming the first groove 32. The step S107 of performing may be performed. Each step will be described below.

  First, as shown in FIGS. 4 and 5A, in step S101 of arranging the light emitting elements 16, the plurality of light emitting elements 16 are arranged on the substrate 22 on which the wiring 14 is formed. When the light emitting elements 16 are arranged, it is preferable that the light emitting elements 16 are mounted by flip chip mounting via a joining member. A plurality of the light emitting elements 16 are arranged at predetermined intervals in the row direction and the column direction. The arrayed light emitting elements 16 are arranged such that the spacing on the column side is larger than the spacing on the row side. Further, the substrate 22 has through holes 22a formed on the row side. The through holes 22 a are continuously formed in the row direction, specifically, at a position facing the short side of the light emitting element 16, and are not formed in the peripheral edge of the substrate 22. In addition, the work is performed with the adhesive sheet 30 attached to the back surface of the substrate 22.

In the step S102 of providing the first reflecting member 18, in the light emitting elements 16 arranged in the row direction and the column direction on the substrate 22, the first reflecting member 18 is provided between the columns of the light emitting elements 16 arranged in the column direction. In other words, in FIG. 5A, the first reflecting member 18 is provided in the through hole 22a formed in the column direction. Specifically, as shown in FIG. 5B, the first reflecting member 18 is provided on both sides of the light emitting element 16 mounted on the substrate 22 so as to face the short side.
The first reflecting member 18 has a viscosity adjusted in advance, and is provided separately from the light emitting element 16 so as to maintain the height of the upper surface of the substrate 22 or higher while being in the through hole 22a. Be done. The substrate 22 is provided with a through hole 22a in advance along a region where the first reflecting member 18 is provided, and the lower surface of the substrate 22 is covered with an adhesive sheet 30 so as to close the opening of the through hole 22a. .. Therefore, the lower surface of the first reflecting member 18 is formed so as to be flush with the lower surface of the substrate 22. Further, on the upper part of the first reflecting member 18, a portion which becomes an inclined surface or a curved surface due to surface tension and viscosity is formed. The first reflecting member 18 is provided so as to be higher than the upper end of the light emitting element 16. In addition, when the first reflecting member 18 is provided, the guide may be placed on the substrate so as to have a predetermined shape and height, and the placed guide may be removed when the first reflecting member 18 is cured. The first reflecting member 18 can be formed by transfer molding, injection molding, compression molding, potting, or the like.

  Next, as shown in FIGS. 4 and 5C, in the step S103 of providing the light guide member, the space between the first reflecting member 18 and the light emitting element 16 and the space between the light emitting elements 16 are the light guide member 24. Is filled so that it is filled with. Here, the light guide member 24 is filled and cured to a height at which the first reflecting member 18 and the light emitting element 16 are filled. When the light guide member 24 is cured, it is preferable to positively perform heating when it is a thermosetting resin and irradiation of ultraviolet rays when it is an ultraviolet curing resin. Examples of the filling method include transfer molding, injection molding, compression molding, potting and the like.

  As shown in FIGS. 4 and 5D, in the removing step S104, the light guide member 24 is left above the light emitting element 16 and is guided to a height at which a part of the upper portion of the first reflecting member 18 is removed. The light member 24 and the first reflecting member 18 are removed so as to be flat. In addition, when removing, the light guide member 24 and the first reflecting member 18 may be removed by polishing with a grindstone, a disk-shaped rotary blade, a plane, or the like.

  Thereafter, as shown in FIG. 4 and FIG. 5E, in the step S105 of providing the translucent member, the sheet member which becomes the phosphor layer 26 containing the phosphor in advance and the sheet member which becomes the translucent layer 28 are superposed. The sheet member that is the translucent member 25 is provided on the upper surfaces of the light guide member 24 and the first reflecting member 18 via the translucent joining member. 5E, the sheet member of the phosphor layer 26 is formed thicker than the sheet member of the translucent layer 28, but the present invention is not limited to this. The phosphor layer 26 and the translucent layer 28 may have the same thickness, or the translucent layer 28 may be formed thicker than the phosphor layer 26. Further, although the sheet-shaped translucent member 25 is used in the above, the present invention is not limited to this. The liquid translucent member 25 may be sprayed or formed, or may be formed by printing or the like.

  Subsequently, as shown in FIG. 4, FIG. 5F, and FIG. 6A, in step S106 of forming the first groove 32, the translucent member 25 (the phosphor layer 26 and By removing a part of the transparent layer 28) and the first reflecting member 18 laminated thereon, the first groove 32 having a predetermined groove width is formed by dicing with a disc-shaped rotary blade or the like. Here, the depth of the first groove 32 is preferably such that it penetrates the transparent member 25 and the tip of the first groove 32 is inside the first reflecting member 18. In step S108 of providing the second reflecting member 20 in the first groove 32, which is the next step, all the side surfaces of the translucent member 25 can be covered with the second reflecting member 20. This prevents color leakage from the side surface of the translucent member 25 when individualized in the step S109 of individualizing.

The first groove 32 is formed by a processing device that uses a blade that rotates while moving along the center of the first reflecting member 18. When forming the first groove 32, the table on which the substrate 22 is placed is moved in the X direction and the Y direction orthogonal to the X direction, and the processing device is fixed to perform the processing operation. The table may be fixed and the processing device may be moved to perform the processing operation. Further, here, the step S107 of forming the second groove is performed in the row direction which is a direction orthogonal to the first groove 32. The second groove 34 is formed between rows of the plurality of light emitting elements 16 arranged two-dimensionally. The second groove 34 is preferably formed so as to penetrate the translucent member 25 and the light guide member 24 and reach the substrate 22. As a result, in the next step of providing the second reflecting member S108, the entire light guide member 24 on the inter-row side is covered with the second reflecting member 20, and color loss from the light guide member 24 to the outside can be prevented.

  Then, as shown in FIGS. 4, 5G, and 6B, in the step S108 of providing the second reflecting member, the second reflecting member 20 is transferred into the first groove 32 and the second groove 34 by transfer molding, injection molding, Filled by compression molding, potting, etc. The second reflecting member 20 is formed of the same material as the first reflecting member 18, for example. In addition, here, after the second reflective member 20 is cured, a removal process is performed in order to adjust the thickness of the sheet member of the translucent layer 28 and the second reflective member 20. Here, the removal processing is performed so that the light transmitting layer 28 is flat and has a predetermined thickness.

Lastly, as shown in FIGS. 4, 5H, and 6C, in the step S109 of dividing into pieces, the center of the second reflecting member 20 is rotated in a disk shape by a processing device until the adhesive sheet 30 is reached. A cutting groove 38 is formed by dicing with a blade, a cutting blade of an ultrasonic cutter, a push-cut type cutter, or the like. In the step S109 of dividing into individual pieces, a working operation is performed by using a blade having a width narrower than that when the first groove 32 and the second groove 34 are formed. The individual light emitting devices 10 are bonded to the adhesive sheet 30 by being separated into individual pieces. Then, the adhesive sheet 30 is peeled off to form the individual light emitting devices 10.
In the light emitting device 10, the first reflecting member 18 is configured such that the lower surface is located at the same position as the substrate 22. Therefore, in such a configuration of the light emitting device 10, the portion of the reflection member 17 is diced by a disk-shaped rotary blade, a cutting blade of an ultrasonic cutter, a push-cut type cutter, or the like to be diced into individual pieces. It is possible to facilitate individualization without cutting.

<Second Embodiment>
Next, a second embodiment of the light emitting device will be described focusing on FIGS. 7 and 8. The same components as those in the first embodiment are designated by the same reference numerals and description thereof will be omitted as appropriate.
As shown in FIG. 7, in the light emitting device 10A, the third reflecting member 36 is provided on the substrate 22 in a region between the first reflecting member 18 and the light emitting element 16 so as to face the long side and / or the short side of the light emitting element 16. Are provided. The third reflecting member 36 has an inclined or curved inner surface that is in contact with the inner surface of the first reflecting member 18 and widens the interval facing the translucent member 25. In other words, each of the third reflecting members 36 has an inclined surface or an inner surface of a curved surface that is in contact with the inner surface of the first reflecting member 18 and is inclined so that the distance between the third reflecting members 36 gradually increases in the irradiation direction Br. is doing.
The third reflecting member 36 is provided so as to be lower than the height of the light emitting element 16. The third reflecting member 36 is provided so as to be separated from the light emitting element 16. The third reflecting member 36 may be made of the same material as the first reflecting member 18 and the second reflecting member 20, or may be made of a different material. By providing the third reflecting member 36, the absorption of light on the upper surface of the substrate 22 is reduced and the light is appropriately guided to the light emitting surface 12, so that the light extraction efficiency can be further improved.

  Among the steps shown in FIG. 4, the light emitting device 10A performs the step of providing the third reflecting member after performing the step S102 of providing the first reflecting member and before performing the step S103 of providing the light guide member. Manufactured by. That is, as shown in FIG. 8, in the step of providing the third reflecting member, the third reflecting member 36 is provided inside the first reflecting member 18 along the column direction. The third reflecting member 36 is adjusted to have a preset viscosity and forms an inclined surface or a curved surface toward the light emitting surface 12. After performing the step of providing the third reflecting member, step S103 of providing the light guide member is performed, and the subsequent steps are as shown in FIG.

Next, the third to sixth embodiments will be described with reference to FIGS. 9 to 12. In addition, the same reference numerals are given to the same components that have already been described, and description thereof will be appropriately omitted.
<Third Embodiment>
As shown in FIG. 9, in the light emitting device 10B, the lower surface of the first reflecting member and the lower surface of the substrate 2 are formed so as to be flush with each other. Specifically, the lower end of the wiring 14, which is the lower surface of the substrate 22, is formed so as to be flush with the first reflecting member 18. In addition, also in the other embodiments already described, it is preferable that the lower surface of the substrate 22 is formed on the same plane as the first reflecting member 18. Thus, the light emitting device is stable during mounting, it is possible to increase the actual SoTadashi degree hardly slope.
The wiring 14 may be set on the lower surface side of the substrate 22 by changing the lengths of one side and the other side. Since the length of the wiring 14 indicates the polarity, it becomes easy to prevent an error when the light emitting device 10B is connected to an external device.

<Fourth Embodiment>
As shown in FIG. 10, in the light emitting device 10C, the wiring 14 may be configured to include a via 114 formed by forming a through hole in the substrate 22. The via 114 includes a cylindrical inner wall surface wiring 114a provided on the inner peripheral surface of a through hole formed in the thickness direction of the substrate 22 and a filling member 114b provided in the inner wall surface wiring 114a. For the inner wall surface wiring 114a of the via 114, the same member as the wiring 14 already described can be used. Then, the inner wall surface wiring 114 a is electrically connected to the element electrode 15 via the wiring 14 on the upper surface of the substrate 22 and connected to the wiring 14 formed on the lower surface of the substrate 22. The filling member 114b of the via 114 is formed by filling an insulating member such as epoxy resin. The filling member 114b is formed to have a dimension longer than the thickness of the substrate 22. The wiring 14 is provided in a predetermined range on the upper surface and the lower surface of the substrate 22 in advance and is located around the upper and lower ends of the filling member 114b and is electrically connected to the inner wall surface wiring 114a. It is formed by the connection wiring 14b which covers the member 114b and is electrically connected to the element electrode 15. The wirings 14 are provided independently on the upper surface side and the lower surface side of the substrate 22 corresponding to the element electrodes 15, and are formed such that the upper and lower wirings 14 facing each other are electrically connected by the inner wall surface wiring 114a. There is.
In the light emitting device 10C, the lower surface of the first reflecting member 18 is installed so as to contact the upper surface of the substrate 22. The upper surface of the first reflecting member 18 is formed so as to be higher than the upper surface of the light emitting element 16. Further, in the light emitting device 10C, the second reflecting member 20 is formed in a range from the center side in the thickness direction of the substrate 22 to the upper surface of the translucent member 25.

<Fifth Embodiment>
As shown in FIG. 11, the light emitting device 10D is formed so as to have an inclined surface 20d that is inclined so that the interval at which the second reflecting member 20D faces the translucent member 25D becomes narrow. The second reflecting member 20D has, for example, a triangular cross-sectional shape from the middle step in the height direction of the first reflecting member 18D to the upper surface of the translucent member 25D. By forming the second reflecting member 20D, the first reflecting member 18D has an inclined surface at a portion facing the second reflecting member 20D. Further, the fluorescent material layer 26D and the translucent layer 28D have a trapezoidal cross-sectional shape due to the formation of the second reflecting member 20D. Since the second reflecting member 20D can have the upper side surface of the translucent member 25D formed to have a predetermined thickness, damage to the translucent member 25D due to contact of the light emitting device 10D with another component or the like can be prevented. The suppression can be further improved.
When manufacturing the light emitting device 10D, referring to FIG. 5F, the first groove 32 for providing the second reflecting member 20D can be formed by forming the V-shaped cross section. The second reflecting member 20D has a trapezoidal shape, a triangular shape, or a step shape in cross section as long as the second reflecting member 20D is set to have a large thickness on the transparent member 25D side and a thickness that decreases toward the substrate 22 side. May be.

<Sixth Embodiment>
As shown in FIG. 12, the light emitting device 10E is formed so as to include a plurality of light emitting elements 16 (two in the drawing) in the light emitting device 10C shown in the fourth embodiment. In the light emitting device 10E, one base wiring 14a of the wiring 14 is connected by the conduction wiring 14c so as to be electrically connected to each other in order to simultaneously turn on and off the two light emitting elements 16 provided. Is formed in. Note that the light emitting device of another embodiment may have a configuration including a plurality of light emitting elements 16 as in the light emitting device 10E.

  Further, in the first to sixth embodiments described above, the second reflecting members 20 and 20D increase the strength of the members or increase the hardness of the members as compared with the first reflecting members 18 and 18D. It is more preferable to increase the size. In other words, since the second reflecting members 20 and 20D easily come into contact with other external components, for example, the light guide plate, even if an excessive load is applied, the member strength or the member hardness is large, which may cause deformation or deformation. It is possible to suppress breakage of the chip. Here, when increasing the hardness of the member, even if the base resin of the first reflecting member and the second reflecting member are the same, for example, the hardness can be changed by changing the addition amount of the contained material such as titanium oxide. Can be increased. Even when the same silicone resin is used, those having different hardnesses are selected and the silicone resin having high hardness is used as the second reflecting members 20 and 20D. Further, the hardness can be changed by using different resins for the second reflecting members 20 and 20D and the first reflecting members 18 and 18D. For example, a silicone resin is used for the first reflecting members 18 and 18D, and an epoxy resin that is generally harder than the silicone resin is used for the second reflecting members 20 and 20D.

Further, when the strength of the member is high, for example, in the case where the base resin is the same silicone resin, the tensile strength is compared and the tensile strength is high. Further, when the strength of the member is high, for example, when the base resin is the same epoxy resin, the bending strength is compared and the epoxy resin having a large bending strength is referred to. When the types of resin are different, for example, when one is a silicone resin and the other is an epoxy resin, it is possible to determine the magnitude of the strength by converting and comparing one of the bending strength and the tensile strength. And
The hardness of the member or the strength of the member can be determined by a known measurement method such as JIS. Further, the strength of a member refers to the resistance to deformation and breakage.

<About modification>
In each of the embodiments, the through hole 22a is formed in the substrate 22 so that the lower surface of the first reflecting member 18 and the lower surface of the substrate 22 are flush with each other. However, as shown in FIG. The lower surface of a part of the member 18 may be formed so as to be flush with the lower surface of the substrate 22. Here, the left and right ends of the first reflecting member 18 are in contact with the upper surface of the substrate 22, and the central end of the first reflecting member 18 is provided so as to be flush with the lower surface of the substrate 22. ing. By thus setting the lower surface of the first reflecting member 18 inside and outside the through hole 22a of the substrate 22, the bonding area between the substrate 22 and the first reflecting member 18 can be increased and the adhesion can be improved.

  Further, as shown in FIG. 13B, the first reflecting member 18 may be installed on the upper surface of the substrate 22 without forming the through hole 22 a in the substrate 22. By providing the first reflecting member 18 on the upper surface of the substrate 22 as described above, the amount of the material of the first reflecting member 18 used can be reduced as compared with the case where the through hole 22 a is formed in the substrate 22.

  Further, the materials of the first reflecting member 18 and the second reflecting member 20 may be changed. Further, the first reflecting member 18, the second reflecting member 20, and the third reflecting member 36 may be made of different reflecting materials. By changing the reflective material, for example, it becomes easy to adjust the light extraction efficiency.

Further, although the translucent member 25 has been described as having a structure including the phosphor layer 26 and the translucent layer 28, it may be used only in the translucent layer 28 or as a structure used in the phosphor layer 26. Good.
Further, as the wavelength conversion substance (phosphor) used for the phosphor layer 26, other than those described above, those known in the art can be used. Further, the phosphor layer 26 may be provided not only as a single layer but also as a plurality of layers. When the phosphor layers are provided as a plurality of layers, the wavelength conversion substance may be changed for each phosphor layer.

The first reflecting member 18 may be provided so as to surround the light emitting element. In other words, it may be provided on all side surfaces of the light emitting element 16 with a certain distance. The first reflecting member 18 has an inclined surface or an inner surface of a curved surface that is inclined so as to widen the interval facing the translucent member 25. Thereby, the light from the light emitting element 16 is more easily extracted from the light emitting surface by the first reflecting member 18, and the light extraction efficiency is improved.
In this case, it can be realized by preparing a substrate having through holes formed in the column direction as well as the through holes 22a in the row direction.

In the method for manufacturing a light emitting device, the following step S105 of providing a light transmissive member is performed without performing step S104 of removing a part of the first reflecting member 18 and a part of the light guide member 24. You can go. When the removing step S104 is not performed, it is preferable that the light guide member 24 is filled to a height up to the upper end of the first reflecting member 18.
Then, without performing the step S107 of forming the second groove, the work may be performed up to the step S109 of singulating only the first groove 32. In that case, reflectors capable of reflecting light from the light emitting element 16 later may be provided on the front and back side surfaces in the portion where the second groove 34 is formed.

10, 10A to 10D Light emitting device 12 Light emitting surface 14 Wiring 14a Base wiring 14b Connection wiring 14c Conductive wiring 15 Element electrode 16 Light emitting element 17 Reflective member 18 First reflective member 19 Inner side surface 20 Second reflective member 22 Substrate 24 Light guide member 25 Light transmissive member 26 Fluorescent material layer 28 Light transmissive layer 30 Adhesive sheet 32 First groove 34 Second groove 36 Third reflective member 38 Cut groove S101 Step of arranging light emitting elements S102 Step of providing first reflective member S103 Light guide member Step of providing S104 Step of removing S105 Step of providing a transparent member S106 Step of forming a first groove S107 Step of forming a second groove S108 Step of providing a second reflecting member S109 Step of separating into pieces Br Irradiation direction

Claims (17)

A rectangular substrate having a long side and a short side in a top view,
A light emitting device mounted on the substrate,
A reflecting member provided so as to surround the light emitting element with a space therebetween,
A light guide member filled inside the reflective member so as to cover the light emitting element in the reflective member,
A translucent member provided on the light guide member,
The reflecting member is disposed on the short side of the substrate so as to face the side surface of the light emitting device, and is positioned outside the first reflecting member via the interface with the first reflecting member. A second reflective member surrounding the light emitting element,
The first reflecting member covers the side surface of the light guide member and the side surface on the short side of the substrate, and has an inner surface of an inclined surface or a curved surface that is inclined so as to widen the interval facing the translucent member. Have,
The second reflective member covers the side surface of the translucent member and the outer surface of the first reflective member on the short side of the substrate, and the translucent member on the long side of the substrate. Is provided so as to cover the side surface of the substrate and the side surface of the substrate, and the upper surface of the second reflecting member is flush with the upper surface of the translucent member.
The light emitting device in which the second reflecting member is formed thinner than the thickness of the first reflecting member at a position facing the light guide member.   The light emitting device according to claim 1, wherein the lower surface of the first reflecting member and the lower surface of the substrate are flush with each other.   The light emitting device according to claim 1, wherein at least a part of the first reflecting member is disposed on the upper surface of the substrate.   The light-emitting device according to claim 1, wherein the translucent member is located above an upper end portion of the first reflective member.   The light emitting device according to claim 1, wherein the second reflecting member has an inclined surface that is inclined so that a space facing the translucent member is narrowed.   The light emitting device according to claim 1, wherein the material of the first reflecting member and the material of the second reflecting member are the same.   The light emitting device according to claim 1, wherein a material of the first reflecting member and a material of the second reflecting member are different from each other.   The light emitting device according to claim 1, wherein the intensity of the second reflective member is higher than the intensity of the first reflective member.   The light emitting device according to claim 1, wherein the hardness of the second reflecting member is higher than the hardness of the first reflecting member.   The light-emitting device according to claim 1, wherein the translucent member includes a phosphor layer and a translucent layer stacked on the phosphor layer.   The reflection member further comprises a third reflection member having an inner surface of an inclined surface or a curved surface which is in contact with the inner surface of the first reflection member and inclines so as to widen a gap facing the translucent member. The light emitting device according to any one of claims 1 to 10. Arranging a plurality of light emitting elements on the substrate,
A step of providing a first reflecting member separated from the light emitting element between the light emitting elements;
Providing a light guide member that covers the light emitting element and is in contact with the first reflecting member;
Providing a translucent member on the light guide member and the first reflecting member,
Removing a part of the translucent member and the first reflective member to form a first groove;
Providing a second reflective member in contact with the translucent member and the first reflective member in the first groove;
And a step of cutting the second reflective member into individual pieces, and manufacturing the light emitting device.   The manufacturing of the light emitting device according to claim 12, wherein the light emitting elements are arranged in a row direction and a column direction, and the step of providing the first reflecting member is a step of providing only between the columns of the light emitting elements arranged in the column direction. Method. Before the step of providing the second reflecting member, a step of removing a part of the light guide member and the translucent member between rows of the light emitting elements arranged in a row direction to form a second groove,
The method of manufacturing a light emitting device according to claim 13, wherein the step of providing the second reflecting member includes the step of providing the second reflecting member in contact with the light transmissive member and the light guide member in the second groove.   The step of providing the light transmissive member is a step of providing the light guide member so as to cover an upper surface of the first reflective member, and the step of providing the light transmissive member is performed before the step of providing the translucent member. 15. The method for manufacturing a light emitting device according to claim 12, further comprising a step of removing a portion of the light guide member and the light guide member, and leaving the light guide member above the light emitting element.   The method for manufacturing a light emitting device according to claim 12, further comprising a step of forming a part of the first reflective member in the through hole, the substrate having a through hole.   Prior to the step of providing the light guide member, an inner surface of an inclined surface or a curved surface that is in contact with the inner surface of the first reflecting member and inclines so as to widen an interval facing toward the translucent member is formed on the substrate. 17. The method for manufacturing a light emitting device according to claim 12, further comprising the step of providing the third reflecting member having.

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