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JP6560116B2 - RTD - Google Patents

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JP6560116B2
JP6560116B2 JP2015251760A JP2015251760A JP6560116B2 JP 6560116 B2 JP6560116 B2 JP 6560116B2 JP 2015251760 A JP2015251760 A JP 2015251760A JP 2015251760 A JP2015251760 A JP 2015251760A JP 6560116 B2 JP6560116 B2 JP 6560116B2
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covering member
electrode
lead
expansion coefficient
thermal expansion
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JP2017116394A (en
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勉 菅原
勉 菅原
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Kyocera Corp
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Description

本発明は、セラミック焼結体からなる絶縁基体の内部に、内部抵抗配線が設けられてなる測温体に関するものである。   The present invention relates to a temperature measuring body in which an internal resistance wiring is provided inside an insulating base made of a ceramic sintered body.

排気ガス等の高温(例えば数百〜一千℃程度)の流体等における温度検知用のセンサとして、絶縁基体の内部に抵抗配線を設け、抵抗配線の電気抵抗の温度による変化を利用した多層配線基板が知られている。抵抗配線を構成する金属材料としては、高温における耐酸化性等の観点から、白金(Pt)または白金を主成分とするものが用いられている。   Multilayer wiring that uses resistance wiring inside the insulating substrate as a sensor for temperature detection in high-temperature fluids such as exhaust gas (for example, several hundred to 1,000 degrees Celsius), and uses changes in the resistance of the resistance wiring due to temperature Substrates are known. As a metal material constituting the resistance wiring, platinum (Pt) or a material containing platinum as a main component is used from the viewpoint of oxidation resistance at a high temperature.

前記金属材料を含む温度検知用のセンサ素子(以下、「測温体」という)を構成する部品としては、例えば、セラミック焼結体等からなり、互いに積層された複数の絶縁層の層間に白金等のメタライズ層または薄膜層からなる線状の導体が設けられた配線基板を、複数枚積層したもの等が知られている。   As a component constituting a temperature detecting sensor element (hereinafter referred to as “temperature measuring element”) containing the metal material, for example, platinum is formed between a plurality of insulating layers made of a ceramic sintered body or the like and stacked on each other. A laminate of a plurality of wiring boards provided with a linear conductor made of a metallized layer or a thin film layer is known.

また、測温体と、温度監視および記録システム等の制御手段との間の電気的な接続は、絶縁基体の主面に配置された電極に接続されたリードを介して行われる。なお、これら電極とリードとの接続部位は、その接続を補強して熱等による剥離(断線)等を予防するために、ガラス材料等からなる被覆部材により覆われている。   Further, the electrical connection between the temperature measuring element and the control means such as the temperature monitoring and recording system is made through leads connected to electrodes arranged on the main surface of the insulating base. In addition, the connection part of these electrodes and leads is covered with a covering member made of a glass material or the like in order to reinforce the connection and prevent peeling (disconnection) due to heat or the like.

特開平8−201131号公報JP-A-8-201113 特開平11−121214号公報JP-A-11-121214

ところで、前記測温体を製造する工程では、前述のような補強用被覆部材のガラス材料を、電極とリードの端部全体を覆うように供給し、これを焼き付け(焼結)等により固化させることが行われる。その際、測温体製品を冷却する過程で、前記ガラス製の被覆部材にひびが入ったり、前記リードが前記電極から浮き上がってしまう(離間する)等の不具合が発生する場合があった。   By the way, in the step of manufacturing the temperature measuring element, the glass material of the reinforcing covering member as described above is supplied so as to cover the entire end portion of the electrode and the lead, and is solidified by baking (sintering) or the like. Is done. At that time, in the process of cooling the temperature measuring product, there are cases where the glass covering member is cracked or the lead is lifted (separated) from the electrode.

また、これらの不具合は、目視で発見可能な範囲のものであれば、検査等によって簡単に取り除くことができるが、微細なものは発見が難しいため、使用に供されると、センサ使用中の加熱および冷却の繰り返しによって前記ひびや亀裂等が拡大し、検知精度の低下やセンサの断線等を招いてしまうおそれがある。   In addition, these defects can be easily removed by inspection etc. if they are in a range that can be found visually, but fine ones are difficult to find. The cracks, cracks, and the like are enlarged by repeated heating and cooling, which may lead to a decrease in detection accuracy and a disconnection of the sensor.

上記課題について検討した結果、本発明者は、前記のようなガラス製の被覆部材におけるひび等の発生は、測温体の加熱および冷却時に生じる、被覆部材と他の部材との間の熱伸縮率の違いに起因していることを突き止め、本発明を完成させた。   As a result of examining the above problems, the present inventor has found that the occurrence of cracks or the like in the glass covering member as described above occurs during heating and cooling of the temperature measuring element, and thermal expansion and contraction between the covering member and other members. The present invention was completed by ascertaining that it was caused by the difference in rate.

すなわち、本発明の一つの態様の測温体は、複数の絶縁層が積層された絶縁基体と、該絶縁基体の内部に設けられた内部抵抗配線と、前記絶縁基体の主面に設けられた電極と、前記絶縁基体を厚み方向に貫通して前記内部抵抗配線と前記電極とを導通させるビア導体と、前記電極に接続されたリードと、前記電極と前記リードの電極側端部とを覆う、ガラ
ス材料からなる第1の被覆部材とを備えており、該第1の被覆部材は、その熱膨張係数が、前記リードの熱膨張係数よりも大きい。
In other words, the temperature measuring element according to one aspect of the present invention is provided on an insulating base in which a plurality of insulating layers are laminated, an internal resistance wiring provided inside the insulating base, and a main surface of the insulating base. Covering an electrode, a via conductor that penetrates the insulating base in the thickness direction and electrically connects the internal resistance wiring and the electrode, a lead connected to the electrode, and an electrode side end of the electrode and the lead And a first covering member made of a glass material, and the first covering member has a thermal expansion coefficient larger than that of the lead.

なお、本発明における「熱膨張係数」とは、JIS R 1618「ファインセラミックスの熱機械分析による熱膨張の測定方法」を準用して求めた、固体の「線膨張率」(線膨張係数ともいう)のことをいい、その大小は、原材料ではなく、その部材の最終形態における「線膨張率」の値〔単位:1/K(K−1)〕で比較した。 The “thermal expansion coefficient” in the present invention refers to a solid “linear expansion coefficient” (also referred to as a linear expansion coefficient) obtained by applying JIS R 1618 “Method for measuring thermal expansion by thermomechanical analysis of fine ceramics”. ), And the magnitude was compared with the value of “linear expansion coefficient” (unit: 1 / K (K −1 )) in the final form of the member, not the raw material.

本発明の一つの態様による測温体は、上記構成を有していることから、製造時に、電極およびリードの電極側端部を覆う、ガラス材料からなる第1の被覆部材を作製して冷却する際も、この第1の被覆部材に割れやびび等の発生がなく、上記リードが電極にしっかりと固定された状態を、維持することができる。このため、製品個々の性能が安定するとともに、その製品歩留まりを向上させることができる。   Since the temperature sensing element according to one aspect of the present invention has the above-described configuration, a first covering member made of a glass material that covers the electrode side ends of the electrode and the lead is manufactured and cooled during manufacturing. In this case, the first covering member is free from cracks and vibrations, and the lead can be maintained firmly fixed to the electrode. For this reason, the performance of each product can be stabilized and the product yield can be improved.

また、使用時に継続的に熱等を受けても、前記電極とリードとの接続固定が、長期にわたり安定して確実に維持される。したがって、信頼性が高く、寿命の長い測温体を提供することができる。   In addition, even when receiving heat or the like continuously during use, the connection and fixing between the electrode and the lead can be stably and reliably maintained over a long period of time. Therefore, it is possible to provide a temperature sensor with high reliability and a long lifetime.

(a)は本発明の第1の実施形態の測温体を示す斜視図であり、(b)は(a)の分解斜視図である。(A) is a perspective view which shows the temperature sensing element of the 1st Embodiment of this invention, (b) is a disassembled perspective view of (a). (a)は本発明の第2の実施形態の測温体を示す斜視図であり、(b)は(a)の分解斜視図である。(A) is a perspective view which shows the temperature sensing element of the 2nd Embodiment of this invention, (b) is a disassembled perspective view of (a).

本発明の実施形態の測温体を、添付の図面を参照して説明する。以下の説明における上下の区別は便宜的なものであり、実際に配線基板等が使用される際の上下を限定するものではない。   A temperature sensor according to an embodiment of the present invention will be described with reference to the accompanying drawings. The distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when a wiring board or the like is actually used.

図1は本発明の第1の実施形態の測温体10を示す図であり、(a)は斜視図、(b)は(a)の分解斜視図である。   1A and 1B are views showing a temperature sensing element 10 according to a first embodiment of the present invention, in which FIG. 1A is a perspective view and FIG. 1B is an exploded perspective view of FIG.

図1(b)に示すように、最上層の絶縁層1aと、複数の絶縁層1b(図1の例では5層)とが積層されて、絶縁基体1が形成されている。また、絶縁基体1の主面(図1の例では上面)に配置された電極2には、図示しない制御手段等に繋がるリード3が接続されている。そして、電極2と、接続されたリード3(図1の例では2本)の端部との上側には、これら電極2−リード3間の接続を保護して補強するための被覆部材(第1の被覆部材4)が設けられて、測温体10が形成されている。   As shown in FIG. 1B, an insulating base 1 is formed by laminating an uppermost insulating layer 1a and a plurality of insulating layers 1b (five layers in the example of FIG. 1). A lead 3 connected to a control means (not shown) is connected to the electrode 2 arranged on the main surface (upper surface in the example of FIG. 1) of the insulating substrate 1. A covering member (first member) for protecting and reinforcing the connection between the electrode 2 and the lead 3 is provided above the electrodes 2 and the ends of the connected leads 3 (two in the example of FIG. 1). 1 is provided to form a temperature measuring body 10.

絶縁基体1は、例えば四角板状等の平板状(層状)の絶縁層1a,1bを積層して形成されており、各絶縁層1a,1bは、例えば酸化アルミニウム質焼結体や窒化アルミニウム質焼結体、ムライト質焼結体、ガラスセラミック焼結体等のセラミック焼結体によって形成されている。   The insulating base 1 is formed by laminating flat (layered) insulating layers 1a and 1b such as a square plate, and each of the insulating layers 1a and 1b is made of, for example, an aluminum oxide sintered body or aluminum nitride. It is formed of a ceramic sintered body such as a sintered body, a mullite sintered body, or a glass ceramic sintered body.

絶縁基体1の内部で、かつ、下側の各絶縁層1bの上面には、例えばミアンダ状パターンの内部抵抗配線5が設けられている。これら各絶縁層1bの内部抵抗配線5は、絶縁基体1の厚み方向に形成されたビア導体6(いわゆる、貫通導体)により、接続されている。   Inside the insulating substrate 1 and on the upper surface of each lower insulating layer 1b, an internal resistance wiring 5 having a meandering pattern, for example, is provided. The internal resistance wirings 5 of these insulating layers 1b are connected by via conductors 6 (so-called through conductors) formed in the thickness direction of the insulating base 1.

ビア導体6は、例えば内部抵抗配線5と同様の金属材料(白金等)を主成分とする導体材料(金属材料)によって形成されており、絶縁基体1内を上下方向に貫通して、その上側の一端が、絶縁基体1の最上層の絶縁層1aの上面(主面)に露出している。   The via conductor 6 is formed of, for example, a conductor material (metal material) whose main component is the same metal material (platinum or the like) as that of the internal resistance wiring 5, and penetrates the insulating base 1 in the vertical direction, and the upper side thereof. Is exposed on the upper surface (main surface) of the uppermost insulating layer 1 a of the insulating substrate 1.

電極2は、前記絶縁基体1の上面に露出する、ビア導体6の上側端面(頂部6a)の上に設けられており、内部抵抗配線5と同様の金属材料(白金等)を主成分とする金属材料を用いて、方形状、円形状等に形成される。   The electrode 2 is provided on the upper end surface (top 6a) of the via conductor 6 exposed on the upper surface of the insulating base 1, and has the same metal material (platinum or the like) as that of the internal resistance wiring 5 as a main component. A metal material is used to form a square shape, a circular shape, or the like.

電極2に接続されるリード3は、例えば内部抵抗配線5等と同様に、白金を含む金属材料からなり、純白金からなる場合もある。リード3の電極2に対する接続(接合)は、例えば抵抗溶接や、金を含むろう材を用いたろう付け法等の接合手段によって行なわれる。なお、リード3が白金を含む合金である場合、その代表的な熱膨張係数(線膨張率)は、8.8×10−6/Kである。 The lead 3 connected to the electrode 2 is made of a metal material containing platinum, for example, like the internal resistance wiring 5, and may be made of pure platinum. The connection (joining) of the lead 3 to the electrode 2 is performed by joining means such as resistance welding or a brazing method using a brazing material containing gold. In addition, when the lead 3 is an alloy containing platinum, a typical thermal expansion coefficient (linear expansion coefficient) is 8.8 × 10 −6 / K.

また、本発明の第1の実施形態の測温体10は、絶縁基体1の主面上に、前記電極2と前記リード3との接続(接合)部位を覆う、接続部保護用の第1の被覆部材4が設けられている。   In addition, the temperature sensing element 10 according to the first embodiment of the present invention covers the connection (joining) portion between the electrode 2 and the lead 3 on the main surface of the insulating base 1 and is a first for protecting a connection portion. The covering member 4 is provided.

この第1の被覆部材4は、例えばバリウム珪酸系ガラスやホウ珪酸ガラス等、ガラス材料でもって形成されており、以下の方法で製作することができる。   The first covering member 4 is formed of a glass material such as barium silicate glass or borosilicate glass, and can be manufactured by the following method.

まず、バリウム珪酸系ガラスやホウ珪酸ガラス等の原料粉末に、適当な有機バインダーおよび溶剤等を添加混合して作製したスラリーを、ディスペンサ等を用いて、電極2とリード3との接続部の上に、これらを完全に覆う山状に過剰に供給する。ついで、このスラリー含む絶縁基体1を、高温(約800〜1200℃)で焼成し、常温まで冷却(放冷)することによって、上記接続部を完全に覆う第1の被覆部材4が作製される。   First, a slurry prepared by adding and mixing an appropriate organic binder and a solvent to raw powders such as barium silicate glass and borosilicate glass is applied on the connecting portion between the electrode 2 and the lead 3 using a dispenser or the like. In addition, an excessive supply is made in a mountain shape that completely covers these. Next, the insulating substrate 1 containing the slurry is fired at a high temperature (about 800 to 1200 ° C.) and cooled to room temperature (cooled), thereby producing the first covering member 4 that completely covers the connecting portion. .

ここで、前記第1の被覆部材4は、焼結後の熱膨張係数(線膨張率)が、前記リード3の熱膨張係数より大きくなっている。具体的には、リード3が白金を含む合金である場合の熱膨張係数(8.8×10−6/K)より大きな、通常9〜16×10−6/K、好ましくは9〜14×10−6/K、より好ましくは 9〜11×10−6/Kになっている。 Here, the first covering member 4 has a thermal expansion coefficient (linear expansion coefficient) after sintering larger than the thermal expansion coefficient of the lead 3. Specifically, it is larger than the thermal expansion coefficient (8.8 × 10 −6 / K) when the lead 3 is an alloy containing platinum, usually 9 to 16 × 10 −6 / K, preferably 9 to 14 ×. 10 −6 / K, more preferably 9 to 11 × 10 −6 / K.

そのため、例えば前述のように上記ガラスの焼成のために高温を加え、その後常温まで冷却した場合でも、前記第1の被覆部材4に割れやびび等が発生することがなく、前記リード3が電極2にしっかりと固定された状態を、維持することができる。   Therefore, for example, even when a high temperature is applied for firing the glass as described above and then cooled to room temperature, the first covering member 4 is not cracked or shattered, and the lead 3 is an electrode. The state firmly fixed to 2 can be maintained.

また、このような構成の測温体10によれば、製品として出荷され、使用時に繰り返し加熱および冷却を受けた場合でも、前記第1の被覆部材4に、ひびの発生や亀裂の拡大等がなく、前記電極2とリード3との接続固定(溶接やろう付け等による接合)が、長期にわたり安定して維持される。したがって、本実施形態の測温体10は、温度検知精度の低下やセンサの断線等の不具合の発生が少なく、信頼性の高い、長寿命な測温体とすることができる。   Further, according to the temperature measuring element 10 having such a configuration, even when the product is shipped as a product and repeatedly subjected to heating and cooling during use, the first covering member 4 is not cracked or cracked. In addition, the connection and fixing of the electrode 2 and the lead 3 (joining by welding, brazing, or the like) is stably maintained for a long time. Therefore, the temperature sensing element 10 of the present embodiment can be a highly reliable and long-life temperature sensing element with less occurrence of problems such as a decrease in temperature detection accuracy and disconnection of the sensor.

なお、リード3等に用いられる、白金を主成分とする金属材料における白金以外の成分については、温度抵抗係数(TCR)の調整や、耐熱性の向上等を目的に、適宜、その成分(種類)や添加量が選択される。白金以外の成分としては、例えばパラジウム、ロジウム、イリジウム等の白金族元素の金属材料および金等が挙げられる。   In addition, components other than platinum in the metal material mainly composed of platinum used for the lead 3 and the like are appropriately selected for the purpose of adjusting the temperature resistance coefficient (TCR) and improving heat resistance. ) And the addition amount are selected. Examples of components other than platinum include metal materials of platinum group elements such as palladium, rhodium and iridium, and gold.

白金を主成分とする金属材料は、白金を約80質量%以上の割合で含有している。白金
を主成分とする金属材料において、白金と他の成分とは合金を形成していていもよく、互いに独立した結晶粒子として存在していてもよい。内部抵抗配線5の場合は、金属成分以外の添加材を含有していてもよく、添加材としては、例えば酸化アルミニウム等の、絶縁層1a,1bに含まれているのと同様の無機物の粒子等が挙げられる。添加材は、内部抵抗配線5と絶縁層1a,1bとの焼成収縮率の整合等のために添加される。
The metal material mainly composed of platinum contains platinum in a proportion of about 80% by mass or more. In a metal material containing platinum as a main component, platinum and other components may form an alloy or may exist as independent crystal particles. In the case of the internal resistance wiring 5, an additive other than the metal component may be contained, and as the additive, for example, inorganic particles similar to those contained in the insulating layers 1 a and 1 b such as aluminum oxide. Etc. The additive is added to match the firing shrinkage rate between the internal resistance wiring 5 and the insulating layers 1a and 1b.

前記絶縁基体1の絶縁層1a,1bは、先にも述べたように、例えば酸化アルミニウム質焼結体や窒化アルミニウム質焼結体、ムライト質焼結体、ガラスセラミック焼結体等のセラミック焼結体によって形成されており、酸化アルミニウム質焼結体からなる場合であれば、以下の方法で製作することができる。まず、酸化アルミニウム、酸化珪素、酸化マグネシウムおよび酸化カルシウム等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して作製したスラリーを、ドクターブレード法等によってシート状に成形してセラミックグリーンシートを作製する。次に、これらのセラミックグリーンシートを適当な寸法に切断加工した後、これらを複数枚積層して積層体を作製する。その後、この積層体を高温(約1600℃)で焼成することによって、絶縁層1a,1bが製作される。複数のセラミックグリーンシートがそれぞれ、絶縁層1a,1bになる。   As described above, the insulating layers 1a and 1b of the insulating base 1 are made of ceramic ceramics such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. If it is formed by a ligation and is made of an aluminum oxide sintered body, it can be manufactured by the following method. First, a slurry prepared by adding and mixing an appropriate organic binder and solvent to raw powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is formed into a sheet by a doctor blade method or the like to form a ceramic green sheet. Make it. Next, after cutting these ceramic green sheets into appropriate dimensions, a plurality of these are laminated to produce a laminate. Thereafter, the laminated body is fired at a high temperature (about 1600 ° C.), whereby the insulating layers 1a and 1b are manufactured. The plurality of ceramic green sheets become the insulating layers 1a and 1b, respectively.

上記のようにして作製された各絶縁層1a,1bが酸化アルミニウム質焼結体からなる場合は、焼結後の熱膨張係数(線膨張率)が、前記リード3の熱膨張係数より小さくなっている。具体的には、リード3が白金を含む合金である場合の熱膨張係数(8.8×10−6/K)より小さな、6〜8×10−6/Kに設定されている。 When each insulating layer 1a, 1b produced as described above is made of an aluminum oxide sintered body, the thermal expansion coefficient (linear expansion coefficient) after sintering becomes smaller than the thermal expansion coefficient of the lead 3. ing. Specifically, it is set to 6 to 8 × 10 −6 / K, which is smaller than the thermal expansion coefficient (8.8 × 10 −6 / K) when the lead 3 is an alloy containing platinum.

また、前記第1の被覆部材4の熱膨張係数を考慮すると、これらの間には、(第1の被覆部材の熱膨張係数>リードの熱膨張係数>絶縁基体の熱膨張係数)の関係が成り立つようになっている。これにより、前記測温体10の主面において、電極2よりはみ出すようにして絶縁層1a上に塗布された第1の被覆部材4〔(図1(a)参照〕の部分も、電極2上の部位と同様、焼成−冷却後に被覆部材にひびや浮き等の発生がなく、該第1の被覆部材4が測温体10の主面に密着した状態が維持される。したがって、前記リード3が電極2にしっかりと接合固定された状態を、補強することができる。   In consideration of the thermal expansion coefficient of the first covering member 4, there is a relationship between them (thermal expansion coefficient of the first covering member> thermal expansion coefficient of the lead> thermal expansion coefficient of the insulating base). It comes to hold. As a result, the portion of the first covering member 4 [see FIG. 1 (a)] applied on the insulating layer 1a so as to protrude from the electrode 2 on the main surface of the temperature sensing element 10 is also on the electrode 2. As in the case of No. 1, the covering member does not crack or float after firing and cooling, and the first covering member 4 is kept in close contact with the main surface of the temperature sensing element 10. Therefore, the lead 3 is maintained. It is possible to reinforce the state in which is firmly bonded and fixed to the electrode 2.

なお、前記第1の被覆部材4の測温体10の主面に対する密着を、より確実なものとするために、先に述べた第1の被覆部材4の作製時における材料(スラリー)の塗布の際には、この材料を、図1(b)に示す絶縁基体1(絶縁層1a)のリード3側の両角部1c,1cを覆うように、絶縁層1aの縁部まで塗布することが望ましい。これにより、両角部1c,1cを起点とする、冷却後の被覆部材の浮きや剥がれ等を、防止することができる。   In addition, in order to make the adhesion of the first covering member 4 to the main surface of the temperature measuring body 10 more reliable, the application of the material (slurry) at the time of manufacturing the first covering member 4 described above is performed. In this case, this material may be applied to the edge of the insulating layer 1a so as to cover both corners 1c, 1c on the lead 3 side of the insulating base 1 (insulating layer 1a) shown in FIG. desirable. Thereby, the float and peeling of the coating | coated member after cooling which started from both corner | angular parts 1c and 1c can be prevented.

また、測温体10の主面(絶縁層1aの上面)に、第1の被覆部材4または電極2や金属製配線等との密着性を向上させる、プラズマ処理、ブラスト加工等の処理を予め行っておいてもよい。   In addition, the main surface of the temperature measuring body 10 (the upper surface of the insulating layer 1a) is previously subjected to a treatment such as plasma treatment or blasting for improving adhesion with the first covering member 4 or the electrode 2 or metal wiring. You can go there.

前記絶縁層1aの上面に配置される電極2は、高温時の安定性を考慮して、白金等を主成分とする金属材料から形成されている。なお、下側の絶縁層1a(ビア導体6)および上側のリード3への密着性を考慮すると、電極2は、ガラス成分を含有していないことが好ましい。ガラス成分を含有していないと、焼成時に、電極2の金属材料と電極2に接続されるビア導体6の金属材料とが、良好に接続されるものとなり、好ましい。また、ガラス成分を含有していないと、リード3を抵抗溶接やろう付け法等により接続する際、これを良好に接合でき、好ましい。   The electrode 2 disposed on the upper surface of the insulating layer 1a is made of a metal material mainly composed of platinum or the like in consideration of stability at a high temperature. In consideration of adhesion to the lower insulating layer 1a (via conductor 6) and the upper lead 3, the electrode 2 preferably does not contain a glass component. When the glass component is not contained, the metal material of the electrode 2 and the metal material of the via conductor 6 connected to the electrode 2 are favorably connected during firing, which is preferable. Moreover, when it does not contain a glass component, when connecting the lead | read | reed 3 by resistance welding, the brazing method, etc., this can be joined favorably and it is preferable.

図2は本発明の第2の実施形態の測温体20を示す図であり、(a)は斜視図、(b)
は(a)の分解斜視図である。図2において、図1に記載の第1の実施形態と同様の機能を有する構成部材には、同じ符号を付して、その詳細な説明を省略する。
FIG. 2 is a view showing a temperature measuring body 20 according to the second embodiment of the present invention, in which (a) is a perspective view and (b).
FIG. 2 is an exploded perspective view of (a). In FIG. 2, constituent members having the same functions as those of the first embodiment described in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

図2の例では、絶縁基体1の主面(上面)における電極2が設けられた領域以外の領域(図示左方の表面領域1d)に、測温体20の抵抗調整手段となる配線(抵抗調整用配線1e)が設けられており、図2(b)のように、この抵抗調整用配線1eの上側に、前記電極2と重ならないようにして、抵抗調整用配線1eを保護する被覆部材(第2の被覆部材7)が設けられている。   In the example of FIG. 2, wiring (resistor) serving as resistance adjusting means of the temperature sensing element 20 is provided in a region (surface region 1 d on the left side in the drawing) other than the region where the electrode 2 is provided on the main surface (upper surface) of the insulating substrate 1. Adjustment wiring 1e) is provided, and as shown in FIG. 2 (b), a covering member that protects the resistance adjustment wiring 1e so as not to overlap the electrode 2 above the resistance adjustment wiring 1e. (Second covering member 7) is provided.

抵抗調整用配線1eは、内部抵抗配線5と同様の金属材料(白金等)を主成分とする金属材料によって形成されており、トリミング用の補助配線を含むその全てが、絶縁基体1の主面(絶縁層1a上)に形成されている場合と、抵抗調整用配線の主幹部分が、内部抵抗配線5と同様に絶縁基体1の内部に形成され、絶縁基体1の主面には、トリミング用の補助配線部位だけが配置されて、この補助配線と内部の主幹配線とが、絶縁基体1内を上下方向に貫通する抵抗調整配線用ビア導体で接続される場合と、がある。   The resistance adjustment wiring 1e is formed of a metal material mainly composed of the same metal material (platinum or the like) as the internal resistance wiring 5, and all of them including the auxiliary wiring for trimming are the main surface of the insulating substrate 1. When formed on the insulating layer 1a, the main portion of the resistance adjustment wiring is formed inside the insulating base 1 similarly to the internal resistance wiring 5, and the main surface of the insulating base 1 is used for trimming. There is a case where only the auxiliary wiring portion is disposed, and the auxiliary wiring and the main trunk wiring inside are connected by a via conductor for resistance adjustment wiring penetrating the insulating substrate 1 in the vertical direction.

上記抵抗調整用配線1eの上側に形成される第2の被覆部材7は、先に述べた第1の被覆部材4と近似または同様の材料が使用されるが異なっていてもよい、例えばバリウム珪酸系ガラスやホウ珪酸ガラス等、ガラス材料でもって形成されており、前記第1の被覆部材4と同様の方法で製作することができる。   The second covering member 7 formed on the upper side of the resistance adjusting wiring 1e is made of a material similar to or similar to the first covering member 4 described above, but may be different. For example, barium silicate It is made of a glass material such as a system glass or borosilicate glass, and can be manufactured by the same method as the first covering member 4.

また、第2の被覆部材7は、前記電極2に重ならない範囲で該電極2に近い主面領域〔図2(b)において、絶縁基体1の主面における電極2が設けられた領域以外の領域〕に配置されており、前記第1の被覆部材4の作製後には、図2(a)に示すように、その電極2側の端部7aが、該第1の被覆部材4の下に潜り込むようになっている。すなわち、前記第1の被覆部材4は、第2の被覆部材7の電極2側の端部7aを覆うように形成されている。   Further, the second covering member 7 has a principal surface region close to the electrode 2 in a range not overlapping the electrode 2 [in FIG. 2B, the region other than the region where the electrode 2 is provided on the principal surface of the insulating substrate 1. After the first covering member 4 is manufactured, the end portion 7a on the electrode 2 side is under the first covering member 4 as shown in FIG. 2 (a). It has come to dive. That is, the first covering member 4 is formed so as to cover the end portion 7 a on the electrode 2 side of the second covering member 7.

なお、上記第2の被覆部材7は、その熱膨張係数(線膨張率)が、前記第1の被覆部材4の熱膨張係数と同等、または小さく、かつ、前記絶縁層1aの熱膨張係数と同等、または大きい。具体的には、第2の被覆部材7の熱膨張係数は、通常2〜16×10−6/K、好ましくは4〜14×10−6/K、より好ましくは 6〜11×10−6/Kになっている。 The second covering member 7 has a thermal expansion coefficient (linear expansion coefficient) equal to or smaller than the thermal expansion coefficient of the first covering member 4 and the thermal expansion coefficient of the insulating layer 1a. Equal or larger. Specifically, the thermal expansion coefficient of the second covering member 7 is usually 2 to 16 × 10 −6 / K, preferably 4 to 14 × 10 −6 / K, more preferably 6 to 11 × 10 −6. / K.

そのため、前記第1の被覆部材4と同様の効果を奏することができる。すなわち、例えばガラスの焼成のために高温を加え、その後常温まで冷却した場合でも、この第2の被覆部材7に割れやびび等の発生がなく、前記リード3と前記電極2との接続を固定する第1の被覆部材4のリード側とは反対側の端部を、ガラス同士の接合により、しっかりと接合することができる。また、前記絶縁層1a側も、同様に確実に接合される。   Therefore, the same effect as the first covering member 4 can be obtained. That is, for example, even when a high temperature is applied for baking the glass and then cooled to room temperature, the second covering member 7 is free from cracks and vibrations, and the connection between the lead 3 and the electrode 2 is fixed. The end of the first covering member 4 opposite to the lead side can be firmly joined by joining the glasses. Further, the insulating layer 1a side is also reliably bonded in the same manner.

したがって、上記測温体20も、製品として出荷され、使用時に繰り返し加熱および冷却を受けた場合でも、第1の被覆部材4および第2の被覆部材7に、ひびの発生や亀裂の拡大等がなく、これら第1の被覆部材4および第2の被覆部材7による、前記電極2とリード3との接続固定の補強が、長期にわたり安定して維持される。これにより、本実施形態の測温体20は、温度検知精度の低下やセンサの断線等の不具合の発生が少なく、信頼性の高い、長寿命な測温体とすることができる。   Therefore, even when the temperature measuring element 20 is shipped as a product and repeatedly heated and cooled at the time of use, the first covering member 4 and the second covering member 7 are not cracked or expanded. In addition, the reinforcement of the connection between the electrode 2 and the lead 3 by the first covering member 4 and the second covering member 7 is stably maintained over a long period of time. Thereby, the temperature sensing element 20 of the present embodiment can be a highly reliable and long-life temperature sensing element with less occurrence of problems such as a decrease in temperature detection accuracy and disconnection of the sensor.

なお、前記リード3の熱膨張係数を考慮すると、これらの部材の間には、(第1の被覆部材の熱膨張係数>リードの熱膨張係数>第2の被覆部材の熱膨張係数>絶縁基体の熱膨張係数)の関係が成り立つようになっている。このように構成することにより、前記電極
2と前記リード3との接続固定の補強を、最適な状態で、長期にわたり安定して維持することができる。
When the thermal expansion coefficient of the lead 3 is taken into consideration, there is a gap between these members (thermal expansion coefficient of the first covering member> thermal expansion coefficient of the lead> thermal expansion coefficient of the second covering member> insulating substrate. The thermal expansion coefficient) relationship is established. By comprising in this way, reinforcement of connection fixation of the said electrode 2 and the said lead | read | reed 3 can be stably maintained over a long term in the optimal state.

また、本発明は以上の実施形態の例に限定されるものではく、本発明の要旨の範囲内であれば種々の変更は可能である。例えば、セラミックスを材料とする被覆部材がある。   Further, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, there is a covering member made of ceramics.

1・・・絶縁基体
1a・・絶縁層
1b・・絶縁層
1c・・角部
1d・・表面領域
1e・・抵抗調整用配線
2・・・電極
3・・・リード
4・・・第1の被覆部材
5・・・内部抵抗配線
6・・・ビア導体
6a・・頂部
7・・・第2の被覆部材
7a・・端部
10・・測温体
20・・測温装置
DESCRIPTION OF SYMBOLS 1 ... Insulating base | substrate 1a .. Insulating layer 1b .. Insulating layer 1c .. Corner | angular part 1d .. Surface area 1e .. Resistance adjustment wiring 2 ... Electrode 3 ... Lead 4 ... 1st Cover member 5... Internal resistance wiring 6... Via conductor 6 a .. Top portion 7... Second cover member 7 a.

Claims (4)

複数の絶縁層が積層された絶縁基体と、該絶縁基体の内部に設けられた内部抵抗配線と、前記絶縁基体の主面に設けられた電極と、前記絶縁基体を厚み方向に貫通して前記内部抵抗配線と前記電極とを導通させるビア導体と、前記電極に接続されたリードと、前記電極と前記リードの電極側端部とを覆う、ガラス材料からなる第1の被覆部材とを備えており、
該第1の被覆部材は、その熱膨張係数が、前記リードの熱膨張係数よりも大きいことを特徴とする測温体。
An insulating substrate in which a plurality of insulating layers are laminated; an internal resistance wiring provided in the insulating substrate; an electrode provided on a main surface of the insulating substrate; A via conductor that connects the internal resistance wiring and the electrode; a lead connected to the electrode; and a first covering member made of a glass material that covers the electrode and the electrode side end of the lead. And
The temperature measuring element, wherein the first covering member has a thermal expansion coefficient larger than that of the lead.
前記絶縁基体の主面における電極が設けられた領域以外の領域に配置された抵抗調整手段と、該抵抗調整手段を覆う、ガラス材料からなる第2の被覆部材とを備えており、
前記第1の被覆部材が、該第2の被覆部材の端部と、前記電極と、前記リードの電極側端部とを覆うように配設されていることを特徴とする請求項1記載の測温体。
A resistance adjusting means disposed in a region other than the region where the electrode is provided on the main surface of the insulating base; and a second covering member made of a glass material covering the resistance adjusting means.
2. The first covering member is disposed so as to cover an end portion of the second covering member, the electrode, and an electrode side end portion of the lead. RTD.
前記第2の被覆部材の熱膨張係数が、前記第1の被覆部材の熱膨張係数より小さく、かつ、前記絶縁基体の熱膨張係数より大きいことを特徴とする請求項1または請求項2記載の測温体。   The thermal expansion coefficient of the second covering member is smaller than the thermal expansion coefficient of the first covering member and larger than the thermal expansion coefficient of the insulating substrate. RTD. 前記リードが、白金または白金を主成分とする金属材料からなることを特徴とする請求項1〜請求項3のいずれかに記載の測温体。   The temperature measuring body according to claim 1, wherein the lead is made of platinum or a metal material containing platinum as a main component.
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