JP6430170B2 - Cutting apparatus, cutting method, adsorption mechanism and apparatus using the same - Google Patents

Description

  The present invention relates to a cutting apparatus and a cutting method for manufacturing a plurality of products separated by cutting an object to be cut, an adsorption mechanism for adsorbing a plurality of products, and an apparatus using the same.

  A substrate composed of a printed circuit board, a lead frame, etc. is virtually divided into a plurality of grid-like areas, and chip-like elements (for example, semiconductor chips) are attached to the respective areas, and then the entire board is sealed with resin. This is called a sealed substrate. A product obtained by cutting a sealed substrate by a cutting mechanism using a rotary blade or the like and dividing it into individual region units becomes a product.

  Conventionally, a predetermined region of a sealed substrate is cut by a cutting mechanism such as a rotary blade using a cutting device. For example, a BGA (Ball Grid Array Package) product is cut as follows. First, the sealed substrate is placed on a cutting table. Next, the sealed substrate is aligned (positioned). By aligning, the position of a virtual cutting line that divides a plurality of regions is set. Next, the cutting table that adsorbs the sealed substrate and the cutting mechanism are relatively moved. The cutting water is sprayed onto the cut portion of the sealed substrate, and the sealed substrate is cut along the cutting line set on the sealed substrate by the cutting mechanism. An individualized product is manufactured by cutting the sealed substrate.

  The cutting table is included in the suction mechanism. The cutting table has a base and a suction jig attached to the base. The suction jig is provided with a plurality of suction holes for sucking the sealed substrate or the separated product. A suction passage connected to each suction hole of the suction jig is provided inside the base. Each suction passage is connected to an external suction mechanism, for example, a vacuum pump, through a space provided inside the base. By sucking the sealed substrate or product by the vacuum pump, the sealed substrate or product is sucked by the suction jig.

  In recent years, with the progress of semiconductor miniaturization, products manufactured tend to become smaller and smaller. For example, in analog products and discrete products, there are many products having a size of 2 mm or less on one side. Therefore, the diameter of the suction hole for sucking the reduced product is also reduced. When the diameter of the suction hole is reduced, the pipe friction resistance (pipe resistance) is increased, and the suction force for sucking the product is reduced. When the suction force is reduced, for example, when a sealed substrate with warpage is separated into pieces, the product may be displaced from a predetermined position of the cutting table at the moment of being separated into pieces due to the influence of warpage. In addition, by spraying the cutting water while cutting the sealed substrate, there occurs a phenomenon that the separated product is displaced or flies from a predetermined position of the cutting table. These phenomena occur because the adsorbing force that adsorbs the singulated product to a predetermined position of the cutting table is reduced, and the inflow of air due to warping and the hydraulic pressure of the cutting water are higher than the adsorbing force. When such a phenomenon occurs, the product is chipped or cracked, and the quality of the product is significantly reduced. Further, if the product is a small product having a side of 2 mm or less, about 4000 to 6000 products are manufactured from one sealed substrate, which greatly deteriorates the product yield. Therefore, when the sealed substrate is separated into individual pieces, it is important to reliably suck the separated products so as not to move from a predetermined position of the cutting table.

  As a workpiece holding jig that can maintain the shape of the workpiece without breaking apart even if the workpiece is cut along a predetermined division line, “a plurality of workpieces formed on the workpiece” A plurality of through grooves corresponding to the first division planned line or the plurality of second division planned lines, and a plurality of first division planned lines and a plurality of second division planned lines of the workpiece. A plurality of suction holes formed at positions corresponding to the plurality of regions and opened on the upper surface, and suction paths formed at positions not intersecting with the plurality of through grooves and communicating with the plurality of suction holes. A workpiece holding jig has been proposed (see, for example, paragraph [0008] of Patent Document 1 and FIGS. 5 to 9).

JP 2005-305573 A

  However, the following problems occur in the first workpiece holding jig 9a disclosed in Patent Document 1. As shown in FIGS. 5 to 9 of Patent Document 1, the first workpiece holding jig 9a is composed of a first jig plate 91a, a second jig plate 92a, and a first flexible sheet 93a. Composed.

  On the upper surface of the first jig plate 91a, a first through groove 911a corresponding to the first planned dividing line 101 of the CSP substrate 10 and the first through groove 911a adjacent to one end and the other end of the first through groove 911a. A second through groove 912a that alternately communicates one through groove 911a is formed. Suction grooves 913a and 914a that open upward are alternately formed between the first through grooves 911a and the first through grooves 911a adjacent to each other, and the upper and lower sides of the suction grooves 913a and 914a. Suction passages 915a and 915a extending in the longitudinal direction are provided.

  The second jig plate 92a includes a first through groove 921a and a second through groove corresponding to the first through groove 911a and the second through groove 912a formed in the first jig plate 91a. 922a is formed. The second jig plate 92a communicates with the suction groove 914a provided in the first jig plate 91a between the first through groove 921a and the first through groove 921a adjacent to each other. A plurality of suction holes 923a are provided.

  The first flexible sheet 93a has a first through groove 931a and a second through groove 932a corresponding to the first through groove 921a and the second through groove 922a formed in the second jig plate 92a. Is formed. The first flexible sheet 93a corresponds to a plurality of suction holes 923a formed in the second jig plate 92a between the first through groove 931a and the first through groove 931a adjacent to each other. A plurality of suction holes 933a are provided.

  In such a first workpiece holding jig 9a, through grooves corresponding to the first jig plate 91a, the second jig plate 92a, and the first flexible sheet 93a are formed. Further, suction holes communicating with the suction grooves of the first jig plate 91a are formed in the second jig plate 92a and the first flexible sheet 93a, respectively. Therefore, the configuration of the first workpiece holding jig 9a is very complicated, and it is difficult to produce the holding jig, and the cost for producing it is high.

  The present invention solves the above-mentioned problems, and even when the product becomes small in the cutting device, the product can be stably separated into pieces without shifting or flying off the suction jig. It is an object of the present invention to provide a cutting device, a cutting method, an adsorption mechanism, and a device using the same.

  In order to solve the above problems, a cutting apparatus according to the present invention includes a table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is placed, a suction mechanism that sucks the workpiece, When manufacturing a plurality of products corresponding to each of a plurality of regions by providing a cutting means for cutting the object to be cut and a moving mechanism for relatively moving the table and the cutting means. A cutting base used in the table, a suction base mounted on the base, a plurality of protrusions provided on the suction base, each corresponding to a plurality of areas, and a plurality of protrusions. A plurality of suction holes penetrating from the upper surface of each of the protrusions to the bottom surface of the suction jig, a first support portion provided below the suction jig on the base, and a plurality of suction holes provided on the first support portion A plurality of first through holes communicating with the holes; A second support portion provided below the first support portion in the table; a plurality of second through holes provided in the second support portion and communicating with the plurality of first through holes; Provided with at least one or a plurality of spaces connected to the plurality of second through holes and the suction mechanism, the plane area of the plurality of first through holes being larger than the plane area of the plurality of suction holes, The plane area of the two through holes is larger than the plane area of the plurality of first through holes, and includes at least one or a plurality of spaces, a plurality of second through holes, a plurality of first through holes, and a plurality of suction holes. The workpiece or the plurality of products are sucked by the suction jig by the suction mechanism sucking the workpiece or the plurality of products through the above.

  The cutting device according to the present invention is characterized in that, in the above-described cutting device, a plurality of first through holes each have a smaller flat area than a plurality of products.

  Further, the cutting device according to the present invention is the above-described cutting device, wherein the second support portion is provided on a side wall that constitutes each of the plurality of second through holes, and communicates with the plurality of second through holes. It has a hole.

  Moreover, the cutting device according to the present invention is the above-described cutting device, wherein the third support portion provided between the first support portion and the second support portion on the base and the third support portion are provided. Provided with a plurality of third through holes that communicate with the plurality of first through holes and the plurality of second through holes, and the planar area of the plurality of third through holes is the plurality of first through holes. It is larger than this plane area, and smaller than the plane area of a some 2nd through-hole.

  Moreover, the cutting device according to the present invention is characterized in that, in the above-described cutting device, the first support portion has a honeycomb structure.

  The cutting device according to the present invention is characterized in that, in the above-described cutting device, the suction jig is detachable from the base.

  In order to solve the above problems, a cutting method according to the present invention includes a step of placing a workpiece having a plurality of regions surrounded by a plurality of cutting lines on a table, and a step of sucking the workpiece to the table And a step of relatively moving the table and the cutting means, and a step of cutting the workpiece using the cutting means by relatively moving the table and the cutting means. Mounting a suction jig having a plurality of protrusions corresponding to a plurality of regions on a base to prepare a table, and a plurality of bases connected to one or a plurality of spaces provided on the base Providing a second support part having a second through hole, providing a first support part having a plurality of first through holes on the second support part in the base, and a first That of multiple protrusions on the support part And a step of arranging a suction jig in which a plurality of suction holes penetrating from the top surface to the bottom surface are provided, and the step of providing the first support portion is larger than the plane area of the plurality of first through holes. In the step of arranging the suction jig with the plurality of second through holes having a planar area communicating with the plurality of first through holes, the plurality of first holes having a planar area larger than the planar area of the plurality of suction holes. In the step of communicating and sucking the through holes and the plurality of suction holes, at least one or a plurality of spaces, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes are sequentially passed through. The object to be cut or the plurality of products is sucked to suck the object to be cut or the plurality of products to the suction jig.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the plurality of first through holes each have a smaller planar area than a plurality of products.

  Further, in the cutting method according to the present invention, in the above-described cutting method, the second support portion is provided on a side wall that configures each of the plurality of second through holes, and communicates with the plurality of second through holes. It has a hole.

  Further, the cutting method according to the present invention includes the step of providing a third support portion having a plurality of third through holes on the second support portion in the base in the above-described cutting method, In the step of providing the support portion, a plurality of third through holes having a plane area larger than the plane area of the plurality of first through holes and smaller than the plane area of the plurality of second through holes are the plurality of first through holes. One through hole and a plurality of second through holes communicate with each other.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the first support portion has a honeycomb structure.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the suction jig is detachable from the base.

  In order to solve the above-described problems, an adsorption mechanism according to the present invention is an adsorption mechanism including a table that adsorbs a plurality of objects, and includes a base that the table has, and an adsorption that is attached on the base A jig, a plurality of protrusions provided on the suction jig, each corresponding to a plurality of objects, a plurality of suction holes penetrating from the upper surface of each of the plurality of protrusions to the bottom surface of the suction jig, and an adsorption treatment at the base A first support portion provided under the tool, a plurality of first through holes provided in the first support portion and communicating with the plurality of suction holes, and provided on the base under the first support portion Connected to the plurality of second through holes provided in the second support portion, the plurality of second through holes provided in the second support portion and communicating with the plurality of first through holes, and the plurality of second through holes provided in the base. And at least one or more spaces that can be connected to the suction mechanism The plane area of the plurality of first through holes is larger than the plane area of the plurality of suction holes, and the plane area of the plurality of second through holes is larger than the plane area of the plurality of first through holes. Alternatively, the plurality of objects are sucked sequentially through the plurality of spaces, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes, so that the plurality of objects are sucked. It is characterized by being adsorbed on the surface.

  Further, the suction mechanism according to the present invention is characterized in that, in the above-described suction mechanism, each of the plurality of first through holes has a smaller flat area than each of the plurality of objects.

  In order to solve the above problems, an apparatus according to the present invention is an apparatus that includes a table that sucks a plurality of objects, a suction mechanism that includes the table, and a suction mechanism that sucks the plurality of objects. The table is sucked from the upper surface of the base, the suction jig mounted on the base, the plurality of protrusions provided on the suction jig respectively corresponding to the plurality of objects, and the plurality of protrusions. A plurality of suction holes penetrating to the bottom surface of the jig, a first support portion provided below the suction jig in the base, and a plurality of first holes provided in the first support portion and communicating with the plurality of suction holes. One through hole, a second support portion provided below the first support portion in the base, and a plurality of second holes provided in the second support portion and communicating with the plurality of first through holes. One or more through holes, connected to a plurality of second through holes and a suction mechanism provided in the base A plurality of first through holes having a plane area larger than that of the plurality of suction holes, and a plurality of second through holes having a plane area equal to that of the plurality of first through holes. The plurality of objects are sucked through the at least one or more spaces, the plurality of second through-holes, the plurality of first through-holes, and the plurality of suction holes in order, which are larger than the area. The object is adsorbed by an adsorption jig.

  Moreover, the device according to the present invention is characterized in that, in the above-described device, each of the plurality of first through holes has a smaller flat area than each of the plurality of objects.

  According to the present invention, in a cutting device, a table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is placed, a suction mechanism that sucks the workpiece, and a cutting that cuts the workpiece. Means, and a moving mechanism for relatively moving the table and the cutting means. The table includes a base and a suction jig attached on the base. In the table, a plurality of suction holes provided in the suction jig, a plurality of first through holes provided in the first support portion, a plurality of second through holes provided in the second support portion, and a base And one or a plurality of spaces provided in. By the suction mechanism, the object to be cut or the plurality of products is sucked through the one or more spaces, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes sequentially. By configuring such a suction passage, the pipe resistance in the table is reduced and the suction force is increased. Therefore, it is possible to prevent the product from being displaced or flying from the suction jig.

It is a general-view figure which shows the sealed board | substrate used in Example 1 of the cutting device which concerns on this invention, Fig.1 (a) is the top view seen from the board | substrate side, FIG.1 (b) is a front view. It is a general-view figure which shows the table for cutting | disconnection corresponding to the sealed substrate shown by FIG. 1, FIG. 2 (a) is a top view, FIG.2 (b) is from the AA line of FIG. 2 (a). FIG. FIG. 3 is a plan view showing the honeycomb plate shown in FIG. 2, FIG. 3 (a) is a plan view of the honeycomb plate 21, and FIG. 3 (b) is a plan view of the honeycomb plate 19. 4 is a perspective view showing the honeycomb plate shown in FIG. 2, FIG. 4 (a) is a perspective view of the honeycomb plate 21, FIG. 4 (b) is a perspective view of the honeycomb plate 19, and FIG. 4 (c) is the honeycomb plate 19. It is a perspective view which shows the modification of this. It is a schematic sectional drawing which shows the state which adsorb | sucks the sealed board | substrate to the adsorption | suction jig | tool of the cutting table shown by FIG. In Example 2 of the cutting device concerning the present invention, it is a schematic diagram showing a cutting table, and Drawing 6 (a) is a schematic sectional view seen from an AA line of Drawing 2 (a), and Drawing 6 (b) ) Is a plan view showing a support member provided on the base, and FIG. 6C is a perspective view of the support member shown in FIG. 6B. In Example 3 of the cutting device which concerns on this invention, it is a top view which shows the outline | summary of a cutting device.

  As shown in FIG. 2, a cutting table 7 is configured by attaching a suction jig 9 on a base 8 in the cutting apparatus. The suction jig 9 is provided with a suction hole 11 for sucking each region 6 of the sealed substrate 1 or a separated product. The suction jig 9 is made thinner and the suction hole 11 is made shorter. The base 8 is provided with a laminated honeycomb plate 19 having a plurality of through holes 18 and a honeycomb plate 21 having a plurality of through holes 20. As a suction passage in the cutting table 7, the suction hole 11, the through hole 20, the through hole 18, and the space 16 are sequentially communicated. By providing the honeycomb plates 21 and 19 on the base 8, the pipe resistance in the base 8 can be extremely reduced. Therefore, since the piping resistance in the cutting table 7 can be reduced, it is possible to increase the adsorption force for adsorbing the separated products. Therefore, when the sealed substrate 1 is separated into pieces, it is possible to prevent the separated product from being displaced or flying from the suction jig 9 by the cutting water being jetted.

  Example 1 of the cutting device according to the present invention will be described with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  As shown in FIG. 1, a sealed substrate 1 includes a substrate 2 made of a printed circuit board, a lead frame, etc., a plurality of chip-like components (not shown) mounted in a plurality of regions of the substrate 2, and a plurality of The sealing resin 3 is formed so as to be covered together. The sealed substrate 1 is an object to be cut that is finally cut into pieces.

  As shown in FIG. 1A, a plurality of first cutting lines 4 along the short direction and a plurality of second cutting lines 5 along the longitudinal direction are virtually provided on the sealed substrate 1 respectively. Set to A plurality of regions 6 surrounded by the plurality of first cutting lines 4 and the plurality of second cutting lines 5 are separated into individual products. In FIG. 1A, for example, six first cutting lines 4 are set, and three second cutting lines 5 are set. Therefore, two regions 6 are formed along the short direction and five regions 6 are formed along the longitudinal direction, and a total of ten regions 6 are formed in a lattice shape. Each region 6 corresponds to a product. The region 6 formed on the sealed substrate 1 is arbitrarily set depending on the size and number of products to be separated. In FIG. 1, a square region 6 having a length of one side L1 is shown. In other words, the distance between the first cutting lines 4 along the short direction and the distance between the second cutting lines 5 along the longitudinal direction are both set to the length L1.

  As shown in FIG. 2, the cutting table 7 is a table for cutting the sealed substrate 1 into pieces by a cutting device. The cutting table 7 includes, for example, a base 8 made of metal and a suction jig 9 attached on the base 8. The suction jig 9 is preferably formed of, for example, a silicone resin or a fluorine resin. The suction jig 9 is provided with a plurality of plate-like projections 10 that suck and hold the plurality of regions 6 (see FIG. 1) in the sealed substrate 1. The plurality of protrusions 10 are provided with suction holes 11 penetrating from the upper surface of each protrusion 10 to the bottom surface of the suction jig 9. In order to reduce the piping resistance of the suction hole 11, it is desirable to increase the diameter of the suction hole 11 and shorten the length of the suction hole 11.

  As shown in FIG. 2 (a), a plurality of first cutting lines 4 and a central second cutting line 5 are formed except for the cutting line at the end of the sealed substrate 1 shown in FIG. Correspondingly, a plurality of first cutting grooves 12 and second cutting grooves 13 are provided between the protrusions 10. Four first cutting grooves 12 are formed along the short direction of the suction jig 9, and one second cutting groove 13 is formed along the longitudinal direction of the suction jig 9. For the first cutting line 4 and the second cutting line 5 set at the end of the sealed substrate 1, the space outside the protrusion 10 formed at the end of the suction jig 9 is a cutting groove. Has the same effect.

  As shown in FIG. 2B, in the cutting table 7, the base 8 has an opening provided on the upper surface and a space 16 surrounded by the side wall 14 and the bottom surface 15. The side wall 14 of the base 8 is provided with an overhanging portion 17 protruding inward along the inner wall. On the overhang portion 17, for example, a honeycomb plate 19 having a plurality of through holes 18 formed in a honeycomb shape is provided as a support portion for supporting the cutting table 7. A honeycomb has a honeycomb structure in which regular hexagonal columns having regular hexagonal through holes are arranged without gaps. On the honeycomb plate 19, a honeycomb plate 21 having a plurality of through holes 20 formed in a honeycomb shape is provided as a support portion for supporting the cutting table 7. In this case, the honeycomb plate 19 and the honeycomb plate 21 are stacked in order from the bottom inside the base 8. The openings of the plurality of through holes 20 formed in the honeycomb plate 21 are formed smaller than the openings of the plurality of through holes 18 formed in the honeycomb plate 19. A space 16 surrounded by the side wall 14 and the bottom surface 15 remains under the honeycomb plate 19. Therefore, in the base 8, the plurality of through holes 20 of the honeycomb plate 21, the plurality of through holes 18 of the honeycomb plate 19, and the space 16 under the honeycomb plate 19 communicate with each other in order from the top.

  The position of the upper end of the honeycomb plate 21 is arranged so as to coincide with the position of the upper surface of the base 8. Accordingly, the position where the overhanging portion 17 is provided is determined in accordance with the height of the honeycomb plate 21 and the honeycomb plate 19. The honeycomb plate 19 and the honeycomb plate 21 can be held on the base 8 by the overhanging portion 17.

An adsorption jig 9 is attached on the base 8 and the honeycomb plate 21. The cutting table 7 is configured by attaching the suction jig 9 on the base 8 and the honeycomb plate 21. In this state, the plurality of suction holes 11 provided in the suction jig 9, the plurality of through holes 20 provided in the honeycomb plate 21, the plurality of through holes 18 provided in the honeycomb plate 19, and the base 8 are provided. The space 16 communicates in order from the top. The suction jig 9 can be attached to and detached from the base 8.

  A suction port 22 is provided near the center of the bottom surface 15 of the base 8. The suction port 22 is connected via a pipe 23 to a vacuum pump 24 that is a suction mechanism. For the piping 23, for example, a flexible nylon tube or the like is preferably used. By sucking the sealed substrate 1 using the vacuum pump 24, the sealed substrate 1 placed on the cutting table 7 is sucked to the suction jig 9. Specifically, the vacuum pump 24 passes the pipe 23, the suction port 22, the space 16, the plurality of through holes 18, the plurality of through holes 20, and the plurality of suction holes 11 in order, The sealed substrate 1 placed on is sucked by the suction jig 9. Instead of the vacuum pump 24, a large-capacity decompression tank may be used.

  The diameter of each suction hole 11 formed in the plurality of protrusions 10 of the suction jig 9 is determined according to the size of the product. If the product becomes smaller, the diameter of the suction hole 11 also becomes smaller. For example, if the product has a size having a side of about 1.5 mm to 2.0 mm, the suction hole 11 has a diameter of about 0.6 mm to 1.2 mm. When the diameter of the suction hole 11 is reduced, the pipe resistance in the suction hole 11 is increased, so that the suction force for sucking the product is reduced. In the present embodiment, it is possible to prevent the suction force from being reduced by reducing the diameter of the suction hole 11 by shortening the length of the suction hole 11. In other words, by reducing the thickness of the suction jig 9, it is possible to suppress an increase in pipe resistance in the suction hole 11.

  3A and 3B show a state in which the honeycomb plate 21 and the honeycomb plate 19 are provided on the base 8. As described above, the honeycomb is a honeycomb structure in which regular hexagonal columns having regular hexagonal through holes are arranged without gaps. For example, if a regular hexagonal through hole is formed in a plate-like member, a honeycomb plate can be formed without significantly reducing the strength. If the number of regular hexagonal through holes is increased more and more, finally, a collection of regular hexagonal through holes having side walls remains. If the opening of the regular hexagonal through hole in the honeycomb structure is reduced, the strength of the honeycomb plate can be increased.

  As shown in FIG. 3, a plurality of through holes 20 in the honeycomb plate 21 and a plurality of through holes 18 in the honeycomb plate 19 are formed so as to fill the opening of the base 8. When the honeycomb plates 21 and 19 are viewed in plan, most of the plane area of the honeycomb plates 21 and 19 is occupied by a set of plane areas of the plurality of through holes 20 and 18. Therefore, in the honeycomb plates 21 and 19, since most of the area is occupied by the space, the pipe resistance can be extremely reduced.

  In FIG. 3, the distance between the centers of the through holes 20 of the honeycomb plate 21 is set to L2, and the distance between the centers of the through holes 18 of the honeycomb plate 19 is set to L3. In this case, the distance between the centers of the through hole 20 and the through hole 18 is determined so that L2 <L3. For example, L2 is set to a distance of about 1.0 mm to 2.0 mm, and L3 is set to a distance of about 8.0 mm to 12.0 mm. The plane area of the through hole 20 formed in the honeycomb plate 21 is smaller than the area 6 (see FIG. 1A) set in the sealed substrate 1, that is, the plane area of the product. Therefore, the size of the through hole 20 is determined so that L2 <L1 corresponding to the length L1 of one side of the product. The strength of the honeycomb plate 21 is increased by reducing the size of the through holes 20 formed in the honeycomb plate 21.

  The plane area of the through hole 20 of the honeycomb plate 21 provided in the base 8 is formed to be smaller than the plane area of the product and larger than the plane area of the suction hole 11. The plane area of the through hole 18 of the honeycomb plate 19 is formed larger than the plane area of the through hole 20 of the honeycomb plate 21. The space 16 under the honeycomb plate 19 is the same size as the opening of the base 8 itself. Therefore, in the cutting table 7, the opening becomes larger in the order of the suction hole 11 for sucking the sealed substrate 1, the through hole 20 of the honeycomb plate 21 in the base 8, the through hole 18 of the honeycomb plate 19, and the space 16. . Compared to the diameter of the suction hole 11, the opening of the through hole 20, the through hole 18, and the space 16 is large. Therefore, most of the pipe resistance in the cutting table 7 is occupied by the pipe resistance in the suction hole 11. In this embodiment, the length of the suction hole 11 is shortened to reduce the pipe resistance in the suction jig 9. By providing the honeycomb plates 21 and 19 on the base 8 in this order from the top, the pipe resistance in the base 8 is extremely reduced. Therefore, since the piping resistance in the cutting table 7 can be reduced, the adsorption force for adsorbing the sealed substrate 1 or the separated product can be increased.

  4A, 4B, and 4C are perspective views showing modifications of the honeycomb plate 21, the honeycomb plate 19, and the honeycomb plate 19, respectively. For example, as shown in FIG. 4B, each side wall 25 constituting one through hole 18 of the honeycomb plate 19 is connected to the side wall 25 of each adjacent through hole 18. The size of the through hole 18, the depth of the through hole 18, and the thickness of each side wall 25 constituting the through hole 18 can be arbitrarily determined according to required strength and the like.

  FIG. 4C shows a modification of the honeycomb plate 19. As shown in FIG. 4C, a communication hole 26 that allows the through holes 18 to communicate with each other can be provided in the lower part of each side wall 25 that constitutes the through hole 18. Each communication hole 26 is preferably provided at the lowermost portion of the side wall 25. By providing each communication hole 26, the flow of air sucked in the through hole 18 of the honeycomb plate 19 can be made more uniform.

  With reference to FIG. 5, the operation of adsorbing the sealed substrate 1 to the cutting table 7 will be described. First, the sealed substrate 1 is placed on the suction jig 9 so that each region 6 (see FIG. 1A) of the sealed substrate 1 corresponds to each projection 10 of the suction jig 9. Place. In this state, the plurality of cutting lines 4 and the cutting lines 5 of the sealed substrate 1 are respectively positioned on the plurality of cutting grooves 12 and the cutting grooves 13 of the suction jig 9.

  Next, the sealed substrate 1 is sucked using the vacuum pump 24. By sucking the sealed substrate 1, the air in the space sealed by the cutting table 7 and the sealed substrate 1 is sucked by the vacuum pump 24. In FIG. 5, the air to be sucked in is virtually indicated by a thick dashed arrow. For example, as shown in FIG. 5, the air 27a staying in the suction hole 11a of the suction jig 9 passes from the suction hole 11a through the lower through hole 20 and the lower through hole 18 respectively. To the space 16. Similarly, the air 27b staying in the suction hole 11b is transferred from the suction hole 11b to the space 16 via the lower through hole 20 and the lower through hole 18 respectively. Similarly, the air 27c staying in the suction hole 11c is transferred from the suction hole 11c to the space 16 through the lower through hole 20 and the lower through hole 18 respectively. The air staying in the plurality of suction holes 11 is transferred to the space 16 from the respective suction holes 11 through the through holes 20 disposed below and the through holes 18 disposed below the through holes 20. The

  By sucking the sealed substrate 1, the air staying in the plurality of through holes 20 of the honeycomb plate 21 and the air staying in the plurality of through holes 18 of the honeycomb plate 19 are also transferred to the space 16. The The air transferred to the space 16 is sucked and discharged from the suction port 22 provided on the bottom surface 15 of the base 8 by the vacuum pump 24 via the pipe 23. The sealed substrate 1 is sucked to the suction jig 9 attached to the cutting table 7.

  According to this embodiment, the cutting table 7 is configured by attaching the suction jig 9 on the base 8 in the cutting apparatus. The suction jig 9 is provided with a suction hole 11 for sucking each region 6 of the sealed substrate 1 or a separated product. By reducing the thickness of the suction jig 9 and shortening the length of the suction hole 11, the pipe resistance in the suction jig 9 can be reduced. The base 8 is provided with a laminated honeycomb plate 19 having a plurality of through holes 18 and a honeycomb plate 21 having a plurality of through holes 20. Therefore, the suction hole 11, the through hole 20, the through hole 18, and the space 16 are sequentially communicated as a suction passage in the cutting table 7. The openings of the suction hole 11, the through hole 20, and the through hole 18 are larger in the order of the suction hole 11, the through hole 20, and the through hole 18. By providing the honeycomb plates 21 and 19 on the base 8, the pipe resistance in the base 8 can be extremely reduced. Therefore, most of the piping resistance in the cutting table 7 is occupied by the piping resistance in the suction jig 9, so that the piping resistance in the entire cutting table 7 can be reduced. Since the piping resistance in the cutting table 7 can be reduced, the adsorption force for adsorbing the separated product can be increased. Therefore, when the product is manufactured by separating the sealed substrate 1 into pieces, it is possible to prevent the product from being displaced from the suction jig 9 or flying due to the spraying of the cutting water. it can.

  Further, according to the present embodiment, the pipe resistance in the cutting table 7 is reduced, and the adsorption force for adsorbing the sealed substrate 1 or the separated product is increased. For example, when the sealed substrate 1 with warpage is separated into pieces, a slight gap is formed between the suction hole 11 of the suction jig 9 and the product due to the influence of warpage at the moment of being separated. Air may flow into the suction hole 11. When air flows in, the position of the separated product is shifted. In this embodiment, since the adsorption force for adsorbing the product is increased, even if air flows in, the product can be adsorbed instantaneously and the inflow of air can be prevented. Accordingly, even when the warped sealed substrate 1 is separated into pieces, it is possible to prevent the separated product from being displaced.

  Further, according to this embodiment, in order to reduce the pipe resistance in the cutting table 7, the thickness of the suction jig 9 is reduced to reduce the pipe resistance in the suction hole 11. When the thickness of the suction jig 9 is reduced, a downward convex deformation is likely to occur near the center of the suction jig 9 by sucking the sealed substrate 1. In this embodiment, a honeycomb plate 21 having a plurality of through holes 20 with small openings is provided under the suction jig 9. Since the honeycomb plate 21 is an assembly of regular hexagonal columns having through holes 20 with small openings, the honeycomb plate 21 has high strength. Therefore, by providing the honeycomb plate 21 in contact with the suction jig 9 immediately below the suction jig 9, it is possible to prevent the suction jig 9 from being deformed even when the sealed substrate 1 is sucked. .

  Further, according to the present embodiment, the cutting jig 7 is configured by attaching the suction jig 9 on the base 8. The suction jig 9 can be attached to and detached from the cutting table 7, and the suction jig 9 can be exchanged according to the size and number of products. On the base 8, a honeycomb plate 21 having a through hole 20 having a small opening is stacked on a honeycomb plate 19 having a through hole 18 having a large opening. A suction passage is formed by combining the through holes 20 and 18 provided in the two layers of the honeycomb plates 21 and 19, respectively. Therefore, the base 8 provided with the honeycomb plates 19 and 21 can be made common to all products having a size larger than the through hole 20 of the honeycomb plate 21 regardless of the size and number of products. In the cutting table 7, the base 8 may be shared and only the suction jig 9 corresponding to the product may be produced.

  If the product has a size of 2 mm or less on one side, 4000 to 6000 products are manufactured from one sealed substrate. Therefore, in the conventional cutting table 7, the suction jig 9 must be provided with 4000 to 6000 suction holes 11, and the base 8 must be provided with 4000 to 6000 suction passages. In the present embodiment, honeycomb plates 19 and 21 are provided to share the base 8. Therefore, it is not necessary to provide the base 8 with the same number of suction passages as the product. Since it is not necessary to produce the base 8 of the cutting table 7 corresponding to the product in the cutting apparatus, the cost for producing the cutting table 7 can be reduced. Moreover, since it can respond to the product of a different size only by replacing | exchanging the adsorption jig 9, the working efficiency and productivity of a cutting device can be improved.

  With reference to FIG. 6, Example 2 of the cutting device based on this invention is demonstrated. The difference from the first embodiment is that a support member 28 is provided on the base 8 of the cutting table 7 instead of the overhanging portion 17 that holds the honeycomb plate 19 and the honeycomb plate 21. The base 8 is configured by holding the honeycomb plate 19 and the honeycomb plate 21 on the support member 28. Since the other configuration is the same as that of the first embodiment, description thereof is omitted. The operation for adsorbing the sealed substrate 1 is the same as that in the first embodiment.

  As shown in FIG. 6, the support member 28 includes one or more (two in the drawing) intermediate body 28 b, the outer peripheral frame 28 a, and the intermediate body that connect the outer frame 28 a and two long sides of the outer frame 28 a. And a plurality of (eight in the figure) struts 28c for supporting 28b. The outer peripheral frame 28a, the intermediate body 28b, and the support column 28c each have a square or plate shape. The support member 28 is fixed in the space 16 of the base 8. The honeycomb plate 19 and the honeycomb plate 21 are held on the support member 28. As shown in FIG. 6B, the space 16 is divided into three spaces 16a, 16b, and 16c by the outer peripheral frame 28a and the two intermediate bodies 28b in plan view. By providing the support member 28, the honeycomb plate 19 and the honeycomb plate 21 can be stably supported on the support member 28 even when the cutting table 7 becomes large.

  In FIG. 6, two intermediate bodies 28b that connect two long sides of the outer peripheral frame 28a are provided, and the space 16 is divided into three spaces 16a, 16b, and 16c. Not limited to this, the space 16 can be divided into four or more spaces by providing three or more intermediate bodies 28b that connect the two long sides of the outer peripheral frame 28a. Moreover, the intermediate body 28b in the support member 28 may be provided in a lattice shape, and the space 16 may be divided into a lattice-like space.

  According to this embodiment, the support member 28 is provided on the base 8 of the cutting table 7. By disposing the honeycomb plate 19 and the honeycomb plate 21 on the support member 28, the honeycomb plate 19 and the honeycomb plate 21 can be supported more firmly. Therefore, even when the sealed substrate 1 has a large area, the cutting table 7 can be stably supported by the honeycomb plates 19 and 21.

  A third embodiment of the cutting device according to the present invention will be described with reference to FIG. The cutting device 29 shown in FIG. 7 divides the object to be cut into a plurality of products. The cutting device 29 includes a substrate supply unit A, a substrate cutting unit B, an inspection unit C, and a housing unit D as components (modules). Each component (each unit A to D) is detachable and replaceable with respect to other components.

  A substrate supply mechanism 30 is provided in the substrate supply unit A. The sealed substrate 1 corresponding to the object to be cut is unloaded from the substrate supply mechanism 30 and transferred to the substrate cutting unit B by a transfer mechanism (not shown). The sealed substrate 1 (for example, a BGA-type sealed substrate) is conveyed to the substrate cutting unit B with the substrate 2 side surface (see FIG. 1) facing up.

  The cutting device 29 is a single-cut table type cutting device. Therefore, the substrate cutting unit B is provided with one cutting table 7 to which the present invention is applied. The cutting table 7 can be moved in the Y direction in the figure by the moving mechanism 31, and can be rotated in the θ direction by the rotating mechanism 32. On the cutting table 7, the sealed substrate 1 is placed and adsorbed. The substrate cutting unit B includes a substrate placement unit 33 and a substrate cutting unit 34.

  The substrate placement unit 33 is provided with an alignment camera 35. The camera 35 can move independently in the X direction in the substrate platform 33. In the sealed substrate 1, the alignment mark is detected by the camera 35, and a plurality of first cutting lines 4 and a plurality of second cutting lines 5 are set (see FIG. 1A).

  The substrate cutting unit 34 is provided with two spindles 36A and 36B as cutting means. The cutting device 29 is a twin spindle configuration cutting device. The two spindles 36A and 36B are independently movable in the X direction. The two spindles 36A and 36B are provided with rotary blades 37A and 37B, respectively. These rotary blades 37A and 37B cut the sealed substrate 1 by rotating in a plane including the Y direction and the Z direction, respectively.

  Each spindle 36A, 36B is provided with a cutting water supply nozzle (not shown) for injecting cutting water to suppress frictional heat generated by the rotating blades 37A, 37B rotating at high speed. The cutting water is sprayed toward the processing point where the rotary blades 37 </ b> A and 37 </ b> B cut the sealed substrate 1. The sealed substrate 1 is cut by relatively moving the cutting table 7 and the spindles 36A and 36B.

  The inspection unit C is provided with an inspection stage 38. The assembly 39 made up of a plurality of products P cut into pieces by cutting the sealed substrate 1 is collectively transferred to the inspection stage 38. The inspection stage 38 is configured to be movable in the X direction and to be rotatable about the Y direction. The assembly 39 composed of a plurality of separated products P is inspected by the inspection camera 40 on the surface on the sealing resin 3 side and the surface on the substrate 2 side (see FIG. 1). Sorted out. The assembly 39 composed of the inspected products P is transferred to the index table 41. The inspection unit C is provided with a plurality of transfer mechanisms 42 for transferring the products P arranged on the index table 41 to the tray.

  The storage unit D is provided with a non-defective product tray 43 for storing non-defective products and a defective product tray 44 for storing defective products. The products P sorted into non-defective products and defective products by the transfer mechanism 42 are accommodated in the respective trays 43 and 44. Although only one tray 43, 44 is shown in FIG. 7, a plurality of trays 43, 44 are provided in the storage unit D.

  In this embodiment, the substrate supply unit A is provided with a control unit CTL for setting and controlling the operation of the cutting device 29, cutting conditions, and the like. Not limited to this, the control unit CTL may be provided in another unit.

  In the present embodiment, the single-cut table type cutting apparatus 29 having a twin spindle configuration has been described. The present invention is not limited to this, and can be applied to a twin-cut table type cutting apparatus having a twin spindle configuration or a single-cut table type cutting apparatus having a single spindle configuration.

  In each embodiment, the base 8 of the cutting table 7 is provided by laminating a honeycomb plate 19 having a through hole 18 having a large opening and a honeycomb plate 21 having a through hole 20 having a small opening in two layers. It was. Not limited to this, a honeycomb plate having an opening smaller than the through hole 18 and larger than the through hole 20 may be further provided between the honeycomb plate 19 and the honeycomb plate 21 to be laminated in three layers. The cutting table 7 can be configured by stacking honeycomb plates on the base 8 in two or three layers. Further, the lowermost honeycomb plate can be provided with communication holes communicating with the through holes at the lower part of the side walls.

  In each example, the base plate 8 of the cutting table 7 was provided with the honeycomb plates 19 and 21 having regular hexagonal through holes 18 and 20 stacked as support portions. Not limited to this, a plate having a plurality of through holes that are triangular, quadrangular, pentagonal, heptagonal or more polygonal, or circular can be provided on the base 8 as a support portion.

  Moreover, in each Example, the case where the suction jig 9 which has the some protrusion 10 in the cutting table 7 was used was demonstrated. For example, the base 8 of the present invention can be applied to a case where a suction jig having a plurality of recesses is used as the accommodation table or a suction jig having a flat surface is used as the inspection table. . In either case, the base 8 provided with the honeycomb plates 19 and 21 can be used in common, and there is no need to provide the same number of suction passages as the product in the base 8. Therefore, it is only necessary to replace the suction jig corresponding to the product.

  Moreover, in each Example, the case where the sealed board | substrate 1 containing a chip-shaped element as a to-be-cut | disconnected object was shown was shown. However, the present invention is not limited to this, and the present invention can be applied to a case where the next object to be cut is cut into pieces as the object to be cut other than the sealed substrate 1. First, a semiconductor wafer made of silicon or a compound semiconductor is singulated. Secondly, a product such as a chip resistor, a chip capacitor, or a chip-type sensor is manufactured by dividing a ceramic substrate on which circuit elements such as a resistor, a capacitor, and a sensor are built. In these two cases, a semiconductor wafer, a ceramic substrate, or the like corresponds to a substrate on which circuit elements corresponding to a plurality of regions are formed. Third, the resin molded product is singulated to produce optical components such as lenses, optical modules, and light guide plates. Fourth, it is a case where a general molded product is manufactured by dividing a resin molded product into individual pieces. The contents described so far can be applied to various cases including the above four cases.

  Even when a wire saw or a band saw is used as the cutting means instead of the rotary blade, the contents described so far can be applied. In these cases, the wire saw or the band saw is run in parallel with the workpiece.

  In addition, an adsorption mechanism including a component (with or without the cutting grooves 12 and 13) corresponding to the cutting table 7 shown in FIGS. The present invention can be applied to a target. Examples of the apparatus in which the suction mechanism according to the present invention is used include an assembling apparatus, a conveying apparatus, a measuring apparatus, and an inspection apparatus in addition to the cutting apparatus. In these devices, the object to be adsorbed includes semi-finished products.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

1 Sealed substrate (object to be cut)
2 Substrate 3 Sealing resin 4 First cutting line (cutting line)
5 Second cutting line (cutting line)
6 Area 7 Cutting table (table)
8 Base 9 Adsorption jig 10 Protrusion 11, 11a, 11b, 11c Adsorption hole 12 First cutting groove 13 Second cutting groove 14 Side wall 15 Bottom surface 16, 16a, 16b, 16c Space 17 Overhang portion 18 Through hole (first hole) 2 through holes)
19 Honeycomb plate (second support part)
20 Through hole (first through hole)
21 Honeycomb plate (first support)
22 Suction port 23 Piping 24 Vacuum pump (suction mechanism)
25 Side wall 26 Communication hole 27a, 27b, 27c Air 28 Support member 28a Outer frame 28b Intermediate body 28c Strut 29 Cutting device 30 Substrate supply mechanism 31 Moving mechanism 32 Rotating mechanism 33 Substrate placing portion 34 Substrate cutting portion 35 Alignment camera 36A 36B Spindle (cutting means)
37A, 37B Rotating blade 38 Inspection stage 39 Assembly made up of a plurality of products P 40 Inspection camera 41 Index table 42 Transfer mechanism 43 Non-defective product tray 44 Defective product tray L1 Length of one side L2 Center of through hole Distance L3 Distance between centers of through holes A Substrate supply unit B Substrate cutting unit C Inspection unit D Storage unit P Product CTL control unit

Claims (16)

A table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is placed, a suction mechanism for sucking the workpiece, a cutting means for cutting the workpiece, the table, and the cutting A cutting mechanism for use in manufacturing a plurality of products corresponding to each of the plurality of regions by dividing the object to be cut into pieces,
A base of the table;
A suction jig mounted on the base;
A plurality of protrusions provided on the suction jig and corresponding to the plurality of regions,
A plurality of suction holes penetrating from the top surface of each of the plurality of protrusions to the bottom surface of the suction jig;
A first support portion provided under the suction jig in the base;
A plurality of first through holes provided in the first support portion and communicating with the plurality of suction holes;
A second support portion provided below the first support portion in the base;
A plurality of second through holes provided in the second support portion and communicating with the plurality of first through holes;
At least one or a plurality of spaces provided in the base and connected to the plurality of second through holes and the suction mechanism;
The plane area of the plurality of first through holes is larger than the plane area of the plurality of suction holes,
The plane area of the plurality of second through holes is larger than the plane area of the plurality of first through holes,
The first support portion and the second support portion are stacked so that a plurality of the first through holes communicate with one of the second through holes in a plan view. Are arranged so that
The suction mechanism passes through the at least one space, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes in order, so that the suction mechanism is the workpiece or the plurality of products. The cutting apparatus characterized in that the object to be cut or the plurality of products are sucked by the suction jig by sucking. The cutting device according to claim 1, wherein
The cutting device characterized in that a plane area of each of the plurality of first through holes is smaller than a plane area of the plurality of products. The cutting device according to claim 1 or 2,
The said 2nd support part is provided in the side wall which each comprises these 2nd through-holes, and has a communicating hole which connects these 2nd through-holes, The cutting device characterized by the above-mentioned. In the cutting device according to any one of claims 1 to 3,
A third support provided between the first support and the second support in the base;
A plurality of third through holes provided in the third support portion and communicating with the plurality of first through holes and the plurality of second through holes;
The cutting device characterized in that a plane area of the plurality of third through holes is larger than a plane area of the plurality of first through holes and smaller than a plane area of the plurality of second through holes. . In the cutting device according to any one of claims 1 to 4,
The cutting apparatus according to claim 1, wherein the first support portion has a honeycomb structure. In the cutting device according to any one of claims 1 to 5,
The cutting device according to claim 1, wherein the suction jig is detachable from the base. Placing a workpiece having a plurality of regions surrounded by a plurality of cutting lines on a table, sucking the workpiece to the table, and relatively moving the table and the cutting means And a step of cutting the object to be cut using the cutting means by relatively moving the table and the cutting means,
Attaching the suction jig having a plurality of protrusions respectively corresponding to the plurality of regions on a base, and preparing the table;
Providing a second support portion having a plurality of second through holes connected to one or a plurality of spaces provided in the base in the base;
Providing a first support part having a plurality of first through holes on the second support part in the base;
Placing the suction jig formed with a plurality of suction holes penetrating from the top surface to the bottom surface of each of the plurality of protrusions on the first support portion,
In the step of providing the first support portion, the plurality of second through holes having a plane area larger than the plane area of the plurality of first through holes communicates with the plurality of first through holes. The first support portion and the second support portion are stacked so that a plurality of the first through holes communicate with one of the second through holes in a plan view. Arranged so that
In the step of arranging the suction jig, the plurality of first through holes having a plane area larger than the plane area of the plurality of suction holes communicate with the plurality of suction holes,
In the sucking step, the object to be cut or the plurality are sequentially passed through at least the one or more spaces, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes. A cutting method comprising sucking the object to be cut or the plurality of products to the suction jig by sucking the product. The cutting method according to claim 7, wherein
The cutting method according to claim 1, wherein each of the plurality of first through holes has a smaller flat area than each of the plurality of products. The cutting method according to claim 7 or 8,
The said 2nd support part has a communicating hole which is provided in the side wall which each comprises these 2nd through-holes, and connects these 2nd through-holes, The cutting method characterized by the above-mentioned. In the cutting method according to any one of claims 7 to 9,
Providing a third support portion having a plurality of third through holes on the second support portion in the base;
In the step of providing the third support portion, the plurality of second areas having a plane area larger than a plane area of the plurality of first through holes and smaller than a plane area of the plurality of second through holes. 3. A cutting method, wherein three through holes communicate with the plurality of first through holes and the plurality of second through holes. In the cutting method according to any one of claims 7 to 10,
The cutting method according to claim 1, wherein the first support portion has a honeycomb structure. In the cutting method according to any one of claims 7 to 11,
The cutting method, wherein the suction jig is detachable from the base. A suction mechanism having a table for sucking a plurality of objects,
A base of the table;
A suction jig mounted on the base;
A plurality of protrusions provided on the suction jig and respectively corresponding to the plurality of objects;
A plurality of suction holes penetrating from the top surface of each of the plurality of protrusions to the bottom surface of the suction jig;
A first support portion provided under the suction jig in the base;
A plurality of first through holes provided in the first support portion and communicating with the plurality of suction holes;
A second support portion provided below the first support portion in the base;
A plurality of second through holes provided in the second support portion and communicating with the plurality of first through holes;
Including at least one or a plurality of spaces provided in the base, connected to the plurality of second through holes, and connected to a suction mechanism;
The plane area of the plurality of first through holes is larger than the plane area of the plurality of suction holes,
The plane area of the plurality of second through holes is larger than the plane area of the plurality of first through holes,
The first support portion and the second support portion are stacked so that a plurality of the first through holes communicate with one of the second through holes in a plan view. Are arranged so that
By sucking the plurality of objects through the at least one or more spaces, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes sequentially, A suction mechanism in which a plurality of objects are sucked by the suction jig. The adsorption mechanism according to claim 13,
The suction mechanism according to claim 1, wherein each of the plurality of first through holes has a smaller flat area than each of the plurality of objects. An apparatus comprising a table for sucking a plurality of objects, a suction mechanism having the table, and a suction mechanism for sucking the plurality of objects,
The table is
The base,
A suction jig mounted on the base;
A plurality of protrusions provided on the suction jig and respectively corresponding to the plurality of objects;
A plurality of suction holes penetrating from the top surface of each of the plurality of protrusions to the bottom surface of the suction jig;
A first support portion provided under the suction jig in the base;
A plurality of first through holes provided in the first support portion and communicating with the plurality of suction holes;
A second support portion provided below the first support portion in the base;
A plurality of second through holes provided in the second support portion and communicating with the plurality of first through holes;
At least one or a plurality of spaces provided in the base and connected to the plurality of second through holes and the suction mechanism;
The plane area of the plurality of first through holes is larger than the plane area of the plurality of suction holes,
The plane area of the plurality of second through holes is larger than the plane area of the plurality of first through holes,
The first support portion and the second support portion are stacked so that a plurality of the first through holes communicate with one of the second through holes in a plan view. Are arranged so that
By sucking the plurality of objects through the at least one or more spaces, the plurality of second through holes, the plurality of first through holes, and the plurality of suction holes sequentially, A device characterized in that a plurality of objects are sucked by the suction jig. The apparatus of claim 15, wherein
The flat area each of the plurality of first through holes has is smaller than the flat area each of the plurality of objects has.

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