JP6367817B2 - 樹脂移送成形プロセスのためのポリエチレンテトラアミン含有エポキシ樹脂系 - Google Patents
樹脂移送成形プロセスのためのポリエチレンテトラアミン含有エポキシ樹脂系 Download PDFInfo
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- JP6367817B2 JP6367817B2 JP2015541975A JP2015541975A JP6367817B2 JP 6367817 B2 JP6367817 B2 JP 6367817B2 JP 2015541975 A JP2015541975 A JP 2015541975A JP 2015541975 A JP2015541975 A JP 2015541975A JP 6367817 B2 JP6367817 B2 JP 6367817B2
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- Prior art keywords
- epoxy resin
- curing agent
- reaction mixture
- amine curing
- mold
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- 238000000034 method Methods 0.000 title claims description 65
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- 239000011347 resin Substances 0.000 title claims description 26
- 238000001721 transfer moulding Methods 0.000 title claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 79
- -1 polyethylene Polymers 0.000 claims description 60
- 239000011541 reaction mixture Substances 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 53
- 239000000835 fiber Substances 0.000 claims description 51
- 239000003054 catalyst Substances 0.000 claims description 48
- 150000001412 amines Chemical class 0.000 claims description 44
- 239000002131 composite material Substances 0.000 claims description 35
- 239000004593 Epoxy Substances 0.000 claims description 30
- 239000004698 Polyethylene Substances 0.000 claims description 30
- 229920000573 polyethylene Polymers 0.000 claims description 30
- 230000009477 glass transition Effects 0.000 claims description 29
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 claims description 25
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- GQWWGRUJOCIUKI-UHFFFAOYSA-N 2-[3-(2-methyl-1-oxopyrrolo[1,2-a]pyrazin-3-yl)propyl]guanidine Chemical compound O=C1N(C)C(CCCN=C(N)N)=CN2C=CC=C21 GQWWGRUJOCIUKI-UHFFFAOYSA-N 0.000 claims description 16
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 16
- 235000013824 polyphenols Nutrition 0.000 claims description 14
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- 229940024606 amino acid Drugs 0.000 claims description 12
- 150000001413 amino acids Chemical class 0.000 claims description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical group [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 claims description 12
- OSWPMRLSEDHDFF-UHFFFAOYSA-N methyl salicylate Chemical compound COC(=O)C1=CC=CC=C1O OSWPMRLSEDHDFF-UHFFFAOYSA-N 0.000 claims description 12
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical group OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 12
- 229910052783 alkali metal Inorganic materials 0.000 claims description 11
- 150000002170 ethers Chemical class 0.000 claims description 11
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 11
- BCEQKAQCUWUNML-UHFFFAOYSA-N 4-hydroxybenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=C(O)C(C(O)=O)=C1 BCEQKAQCUWUNML-UHFFFAOYSA-N 0.000 claims description 10
- 239000003733 fiber-reinforced composite Substances 0.000 claims description 10
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- NUVBSKCKDOMJSU-UHFFFAOYSA-N ethylparaben Chemical compound CCOC(=O)C1=CC=C(O)C=C1 NUVBSKCKDOMJSU-UHFFFAOYSA-N 0.000 claims description 6
- 229960001047 methyl salicylate Drugs 0.000 claims description 6
- LXCFILQKKLGQFO-UHFFFAOYSA-N methylparaben Chemical compound COC(=O)C1=CC=C(O)C=C1 LXCFILQKKLGQFO-UHFFFAOYSA-N 0.000 claims description 6
- 239000006082 mold release agent Substances 0.000 claims description 6
- 229960002429 proline Drugs 0.000 claims description 6
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 5
- GYCKQBWUSACYIF-UHFFFAOYSA-N Ethyl salicylate Chemical compound CCOC(=O)C1=CC=CC=C1O GYCKQBWUSACYIF-UHFFFAOYSA-N 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 229940005667 ethyl salicylate Drugs 0.000 claims description 5
- 229960004889 salicylic acid Drugs 0.000 claims description 5
- 229930182821 L-proline Natural products 0.000 claims description 4
- LIQLYTSJSBMCAH-UHFFFAOYSA-N 2-hydroxy-5-methoxycarbonylbenzoic acid Chemical compound COC(=O)C1=CC=C(O)C(C(O)=O)=C1 LIQLYTSJSBMCAH-UHFFFAOYSA-N 0.000 claims description 3
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical group OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 claims description 3
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 claims description 3
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims description 3
- 238000000748 compression moulding Methods 0.000 claims description 3
- 235000010228 ethyl p-hydroxybenzoate Nutrition 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 235000010270 methyl p-hydroxybenzoate Nutrition 0.000 claims description 3
- DTQQMULENZFWGF-UHFFFAOYSA-N 2-ethyl-4-hydroxybenzoic acid Chemical compound CCC1=CC(O)=CC=C1C(O)=O DTQQMULENZFWGF-UHFFFAOYSA-N 0.000 claims description 2
- PXRRDJDVHDSPTC-UHFFFAOYSA-N 4-hydroxy-2-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=C(C(O)=O)C=CC(O)=C1C(O)=O PXRRDJDVHDSPTC-UHFFFAOYSA-N 0.000 claims description 2
- BBMFSGOFUHEVNP-UHFFFAOYSA-N 4-hydroxy-2-methylbenzoic acid Chemical compound CC1=CC(O)=CC=C1C(O)=O BBMFSGOFUHEVNP-UHFFFAOYSA-N 0.000 claims description 2
- OACFGKVJQOTJEY-UHFFFAOYSA-N 2-ethyl-4-hydroxybenzene-1,3-dicarboxylic acid Chemical compound CCc1c(ccc(O)c1C(O)=O)C(O)=O OACFGKVJQOTJEY-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
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- 230000003068 static effect Effects 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 150000001733 carboxylic acid esters Chemical group 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 230000002787 reinforcement Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 4
- 239000004609 Impact Modifier Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
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- 238000011049 filling Methods 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 241000894007 species Species 0.000 description 4
- 239000004971 Cross linker Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 150000003141 primary amines Chemical class 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- HENCWCJNJROXTA-UHFFFAOYSA-N 5-ethoxycarbonyl-2-hydroxybenzoic acid Chemical compound CCOC(=O)C1=CC=C(O)C(C(O)=O)=C1 HENCWCJNJROXTA-UHFFFAOYSA-N 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
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- 239000003963 antioxidant agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
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- 238000000576 coating method Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical group NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
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- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
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- PAOXFRSJRCGJLV-UHFFFAOYSA-N 2-[4-(2-aminoethyl)piperazin-1-yl]ethanamine Chemical compound NCCN1CCN(CCN)CC1 PAOXFRSJRCGJLV-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Description
1)1つ以上のエポキシ樹脂を含むエポキシ樹脂成分であって、エポキシ樹脂の少なくとも80重量%が、最大約250のエポキシ等価重量を有するポリフェノールの1つ以上のポリグリシジルエーテルである、エポキシ樹脂成分と
2)アミン硬化剤であり、アミン硬化剤が、少なくとも95重量%のポリエチレンテトラアミンを含むポリエチレンテトラアミン混合物であり、混合物が少なくとも40重量%の直鎖状トリエチレンテトラアミンを含み、アミン硬化剤によって提供されるアミン水素当量当たり少なくとも0.8のエポキシ当量が、エポキシ樹脂成分によって反応混合物に提供される、アミン硬化剤と、
3)i)アルカリ金属塩、ii)カルボン酸、カルボン酸無水物、またはカルボン酸エステル置換フェノール化合物、iii)アミノ酸からなる群から選択される触媒的に有効な量の少なくとも1つの触媒であり、触媒が、エポキシ樹脂成分、アミン硬化剤、または両方中に存在している触媒と、を含む硬化性エポキシ樹脂系である。
a)衝突混合によってエポキシ樹脂成分をアミン硬化剤と混合して、その結果生じた反応混合物を、強化用繊維を含む金型に移送することと、
b)金型中の反応混合物を高温で硬化して、強化用繊維が反応混合物を硬化することによって形成されるポリマーマトリックス中に埋め込まれる、繊維強化複合体を形成することと、
c)繊維強化複合体を離型することであり、
1)エポキシ樹脂成分が、1つ以上のエポキシ樹脂を含み、エポキシ樹脂の少なくとも80重量%が最大約250のエポキシ等価重量を有するポリフェノールの1つ以上のポリグリシジルエーテルであり、
2)アミン硬化剤が、少なくとも95重量%のポリエチレンテトラアミンを含むポリエチレンテトラアミン混合物であり、混合物が少なくとも40重量%の直鎖状トリエチレンテトラアミンを含み、
3)ステップa)において、エポキシ樹脂成分およびアミン硬化剤が、反応前にアミン水素の当量当たり0.8〜1.25のエポキシ当量を提供する比率で混合され、
4)i)アルカリ金属塩、ii)カルボン酸、カルボン酸無水物、またはカルボン酸エステル置換フェノール化合物、iii)アミノ酸からなる群から選択される触媒的に有効な量の少なくとも1つの触媒がアミン硬化剤に提供される、離型することと、を含む、繊維強化エポキシ複合体を形成するためのプロセスである。
H2N−CH2−CH2−NH−CH2−CH2−NH−CH2−CH2−NH2
である。
直鎖状トリエチレンテトラアミンは、少なくとも60%、少なくとも90%、少なくとも95%、最大100%の重量のポリエチレンテトラアミン混合物を構成し得る。
硬化性エポキシ樹脂系実施例1および比較サンプルAの硬化特性は、以下のように評価される。エポキシ樹脂A(約180のエポキシ等価重量および約350の分子量を有するビスフェノールAのジグリシジルエーテル)を市販のトリエチレンテトラアミンアミン硬化剤(Dow Chemical CompanyからのD.E.H.24)および触媒と30秒間混合する。トリエチレンテトラアミン硬化剤は、約68重量%が直鎖状トリエチレンテトラアミン(H2N−CH2−CH2−NH−CH2−CH2−NH−CH2−CH2−NH2)である約99重量%のトリエチレンテトラアミンを含む。
硬化性エポキシ樹脂系実施例2〜7および比較サンプルBの硬化特性を実施例1で記載された同様の方式で評価する。エポキシ樹脂系の配合を下の表2に示す。ゲル化および離型時間およびガラス転移温度は表2に報告するとおりである。便宜上、比較サンプルAの配合および結果を表2に繰り返す。
硬化性エポキシ樹脂系実施例8〜10の硬化特性を実施例1で記載された同様の方式で評価する。エポキシ樹脂系の配合を下の表3に示す。ゲル化および離型時間およびガラス転移温度は表3に報告するとおりである。便宜上、比較サンプルAおよびBの配合および結果を表3に繰り返す。
本願は以下の発明に係るものである。
(1) 硬化性エポキシ樹脂系であって、
1)1つ以上のエポキシ樹脂を含むエポキシ樹脂成分であって、その少なくとも80重量%が、最大約250のエポキシ等価重量を有するポリフェノールの1つ以上のポリグリシジルエーテルである、エポキシ樹脂成分と、
2)アミン硬化剤であって、前記アミン硬化剤が、少なくとも95重量%のポリエチレンテトラアミンを含むポリエチレンテトラアミン混合物であり、前記混合物が少なくとも40重量%の直鎖状トリエチレンテトラアミンを含み、前記アミン硬化剤によって提供される前記アミン水素当量当たり少なくとも0.8のエポキシ当量が、前記エポキシ樹脂成分によって前記反応混合物に提供される、アミン硬化剤と、
3)i)アルカリ金属塩、ii)カルボン酸、カルボン酸無水物、またはカルボン酸エステル置換フェノール化合物、iii)アミノ酸からなる群から選択される触媒的に有効な量の少なくとも1つの触媒であって、前記エポキシ樹脂成分、前記アミン硬化剤、または両方中に存在する、触媒と、を含む、硬化性エポキシ樹脂系。
(2) 前記触媒が臭化リチウムである、前記(1)に記載の硬化性エポキシ樹脂系。
(3) 前記触媒が、サリチル酸、サリチル酸メチル、サリチル酸エチル、4−ヒドロキシ安息香酸、メチル4−ヒドロキシ安息香酸塩、エチル4−ヒドロキシ安息香酸塩、4ヒドロキシイソフタル酸、メチル4−ヒドロキシイソフタル酸塩、およびエチル4−ヒドロキシイソフタル酸塩のうちの1つ以上である、前記(1)または(2)に記載の硬化性エポキシ樹脂系。
(4) 前記触媒がL−プロリンである、前記(3)に記載の硬化性エポキシ樹脂系。
(5) 繊維強化エポキシ複合体を形成するためのプロセスであって、
a)衝突混合によってエポキシ樹脂成分をアミン硬化剤と混合して、その結果生じた反応混合物を、強化用繊維を含む金型に移送することと、
b)前記金型中の前記反応混合物を高温で硬化して、前記強化用繊維が前記反応混合物を硬化することによって形成されるポリマーマトリックス中に埋め込まれる、繊維強化複合体を形成することと、
c)前記繊維強化複合体を離型することであって、
1)前記エポキシ樹脂成分が、1つ以上のエポキシ樹脂を含み、前記エポキシ樹脂の少なくとも80重量%が、最大約250のエポキシ等価重量を有するポリフェノールの1つ以上のポリグリシジルエーテルであり、
2)前記アミン硬化剤が、少なくとも95重量%のポリエチレンテトラアミンを含むポリエチレンテトラアミン混合物であり、前記混合物が少なくとも40重量%の直鎖状トリエチレンテトラアミンを含み、
3)ステップa)において、前記エポキシ樹脂成分および前記アミン硬化剤が、反応前にアミン水素の当量当たり0.8〜1.25のエポキシ当量を提供する比率で混合され、
4)i)アルカリ金属塩、ii)カルボン酸、カルボン酸無水物、またはカルボン酸エステル置換フェノール化合物、iii)アミノ酸からなる群から選択される触媒的に有効な量の少なくとも1つの触媒が、前記アミン硬化剤に提供されることと、を含む、プロセス。
(6) 前記触媒が臭化リチウムである、前記(5)に記載のプロセス。
(7) 前記触媒が、サリチル酸、サリチル酸メチル、サリチル酸エチル、4−ヒドロキシ安息香酸、メチル4−ヒドロキシ安息香酸、エチル4−ヒドロキシ安息香酸、4ヒドロキシイソフタル酸、メチル4−ヒドロキシイソフタル酸、およびエチル4−ヒドロキシイソフタル酸のうちの1つ以上である、前記(5)に記載のプロセス。
(8) 前記触媒がL−プロリンである、前記(7)に記載のプロセス。
(9) 前記反応混合物の硬化性エポキシ樹脂系が、少なくとも1つの硬化温度100および120℃で、少なくとも60秒のゲル化時間および350秒以下のガラス化時間を示す、前記(5)〜(8)のいずれかに記載のプロセス。
(10) 前記反応混合物の硬化性エポキシ樹脂系が、少なくとも1つの硬化温度100および120℃で、少なくとも10秒のゲル化時間および120秒以下のガラス化時間を示す、前記(5)〜(8)のいずれかに記載のプロセス。
(11) 前記高温が、80〜140℃である、前記(5)〜(9)のいずれかに記載のプロセス。
(12) 離型時間が300秒以下である、前記(5)〜(10)のいずれかに記載のプロセス。
(13) 離型時間が240秒以下である、前記(5)〜(11)のいずれかに記載のプロセス。
(14) 前記硬化エポキシ樹脂相が、離型するときに少なくとも110℃のガラス転移温度を有する、前記(5)〜(12)のいずれかに記載のプロセス。
(15) 樹脂移送成形プロセス、湿式圧縮成形プロセスまたは隙間射出成形プロセスである、前記(5)〜(13)のいずれかに記載のプロセス。
(16) 前記ポリエチレンテトラアミン混合物が、0.3重量%以下のアミノエチルエタノールアミンを含む、前記(5)〜(15)のいずれかに記載のプロセス。
(17) 前記反応混合物が、内部離型剤を含む、前記(5)〜(16)のいずれかに記載のプロセス。
(18) 前記(5)〜(17)のいずれかに記載のプロセスによって作製された、硬化繊維強化複合体。
Claims (17)
- 硬化性エポキシ樹脂系であって、
1)1つ以上のエポキシ樹脂を含むエポキシ樹脂成分であって、その少なくとも80重量%が、最大250のエポキシ等価重量を有するポリフェノールの1つ以上のポリグリシジルエーテルである、エポキシ樹脂成分と、
2)アミン硬化剤であって、前記アミン硬化剤が、少なくとも95重量%のポリエチレンテトラアミンを含むポリエチレンテトラアミン混合物であり、前記混合物が少なくとも40重量%の直鎖状トリエチレンテトラアミンを含み、前記アミン硬化剤によって提供される前記アミン水素当量当たり少なくとも0.8のエポキシ当量が、前記エポキシ樹脂成分によって前記反応混合物に提供される、アミン硬化剤と、
3)i)前記アミン硬化剤の1モルあたり0.01〜0.05モルのアルカリ金属塩、ii)前記アミン硬化剤の1モルあたり0.025〜0.25モルのカルボン酸、カルボン酸無水物、またはカルボン酸エステル置換フェノール化合物、iii)前記アミン硬化剤の1モルあたり0.025〜0.25モルのアミノ酸からなる群から選択される触媒的に有効な量の少なくとも1つの触媒であって、前記エポキシ樹脂成分、前記アミン硬化剤、または両方中に存在する、触媒と、を含み、前記反応混合物の硬化性エポキシ樹脂系が、100℃の測定で、少なくとも30秒のゲル化時間および350秒以下のガラス化時間を示す、硬化性エポキシ樹脂系。 - 前記触媒が臭化リチウムである、請求項1に記載の硬化性エポキシ樹脂系。
- 前記触媒が、サリチル酸、サリチル酸メチル、サリチル酸エチル、4−ヒドロキシ安息香酸、メチル4−ヒドロキシ安息香酸塩、エチル4−ヒドロキシ安息香酸塩、4ヒドロキシイソフタル酸、メチル4−ヒドロキシイソフタル酸塩、およびエチル4−ヒドロキシイソフタル酸塩のうちの1つ以上である、請求項1に記載の硬化性エポキシ樹脂系。
- 前記触媒がL−プロリンである、請求項1に記載の硬化性エポキシ樹脂系。
- 繊維強化エポキシ複合体を形成するためのプロセスであって、
a)衝突混合によってエポキシ樹脂成分をアミン硬化剤と混合して、その結果生じた反応混合物を、強化用繊維を含む金型に移送することと、
b)前記金型中の前記反応混合物を高温で硬化して、前記強化用繊維が前記反応混合物を硬化することによって形成されるポリマーマトリックス中に埋め込まれる、繊維強化複合体を形成することと、
c)前記繊維強化複合体を離型することであって、
1)前記エポキシ樹脂成分が、1つ以上のエポキシ樹脂を含み、前記エポキシ樹脂の少なくとも80重量%が、最大250のエポキシ等価重量を有するポリフェノールの1つ以上のポリグリシジルエーテルであり、
2)前記アミン硬化剤が、少なくとも95重量%のポリエチレンテトラアミンを含むポリエチレンテトラアミン混合物であり、前記混合物が少なくとも40重量%の直鎖状トリエチレンテトラアミンを含み、
3)ステップa)において、前記エポキシ樹脂成分および前記アミン硬化剤が、反応前にアミン水素の当量当たり0.8〜1.25のエポキシ当量を提供する比率で混合され、
4)i)前記アミン硬化剤の1モルあたり0.01〜0.05モルのアルカリ金属塩、
ii)前記アミン硬化剤の1モルあたり0.025〜0.25モルのカルボン酸、カルボン酸無水物、またはカルボン酸エステル置換フェノール化合物、
iii)前記アミン硬化剤の1モルあたり0.025〜0.25モルのアミノ酸からなる群から選択される触媒的に有効な量の少なくとも1つの触媒が、前記アミン硬化剤に提供されることと、を含み、
前記反応混合物の硬化性エポキシ樹脂系が、100℃の測定で、少なくとも30秒のゲル化時間および350秒以下のガラス化時間を示す、プロセス。 - 前記触媒が臭化リチウムである、請求項5に記載のプロセス。
- 前記触媒が、サリチル酸、サリチル酸メチル、サリチル酸エチル、4−ヒドロキシ安息香酸、メチル4−ヒドロキシ安息香酸、エチル4−ヒドロキシ安息香酸、4ヒドロキシイソフタル酸、メチル4−ヒドロキシイソフタル酸、およびエチル4−ヒドロキシイソフタル酸のうちの1つ以上である、請求項5に記載のプロセス。
- 前記触媒がL−プロリンである、請求項5に記載のプロセス。
- 前記反応混合物の硬化性エポキシ樹脂系が、少なくとも1つの硬化温度100および120℃で、少なくとも60秒のゲル化時間および350秒以下のガラス化時間を示す、請求項5〜8のいずれかに記載のプロセス。
- 前記反応混合物の硬化性エポキシ樹脂系が、少なくとも1つの硬化温度100および120℃で、少なくとも10秒のゲル化時間および120秒以下のガラス化時間を示す、請求項5〜8のいずれかに記載のプロセス。
- 前記高温が、80〜140℃である、請求項5〜9のいずれかに記載のプロセス。
- 離型時間が300秒以下である、請求項5〜10のいずれかに記載のプロセス。
- 離型時間が240秒以下である、請求項5〜11のいずれかに記載のプロセス。
- 前記硬化エポキシ樹脂相が、離型するときに少なくとも110℃のガラス転移温度を有する、請求項5〜12のいずれかに記載のプロセス。
- 樹脂移送成形プロセス、湿式圧縮成形プロセスまたは隙間射出成形プロセスである、請求項5〜13のいずれかに記載のプロセス。
- 前記ポリエチレンテトラアミン混合物が、0.3重量%以下のアミノエチルエタノールアミンを含む、請求項5〜15のいずれかに記載のプロセス。
- 前記反応混合物が、内部離型剤を含む、請求項5〜16のいずれかに記載のプロセス。
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