JP6089557B2 - Electronic component module - Google Patents

Description

  The present invention relates to an electronic component module including a substrate for fixing and wiring an IC chip.

  As a conventional electronic component module (hereinafter simply referred to as a module), there is an electronic device in which an IC chip (package) is mounted on a circuit board with solder (see, for example, Patent Document 1).

  In recent years, miniaturization and high functionality of this type of module have been promoted. In order to advance miniaturization and the like, in particular, it is necessary to increase the number of terminals of an IC chip and to reduce the pitch between terminals. In this case, the area of the bonding portion between the IC chip terminal and the land electrode on the substrate becomes small, and it has become difficult to obtain sufficient bonding strength between them.

In addition, since the size of a single module is small, the module is generally manufactured by the following steps (1) and (2).
(1) A large number of electronic components (including IC chips and other passive elements) are mounted on a single assembly board.
(2) A collective board on which electronic components are mounted is divided into individual modules.

JP 2003-92312 A

  However, since a load is applied to the joining portion due to a crack or the like generated in the substrate due to an impact at the time of division, the conventional module has a problem of causing a joining failure. In addition, there is a problem that it is difficult to obtain a sufficient bonding strength against a drop impact or the like.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component module capable of protecting a joint portion from an externally applied force.

To achieve the above object, one aspect of the present invention includes a proximity terminal formed close to one side of a predetermined surface and a non-proximity terminal formed at a position different from the proximity terminal on the predetermined surface. An IC chip, a mounting surface, a proximity land formed along one side of the mounting surface, and the proximity terminal to which the proximity terminal is joined, and the non-proximity terminal is formed at a position different from the proximity land on the mounting surface. A non-proximity land to be joined; a flexible substrate including the proximity land and a planar conductor formed at a position different from the non-proximity land; and the proximity land in plan view from the normal direction of the mounting surface. A wiring / protective conductor formed on the mounting surface so as to extend between one side of the mounting surface, and one end of the wiring / protective conductor includes the adjacent land or the non-adjacent land. Through Connected to the proximity terminal or the non-proximity terminal, the other end of the wiring / protective conductor is connected to the planar conductor, and in plan view from the normal direction, one side of the predetermined surface and one side of the mounting surface between the electronic component is not mounted, and between one side of the mounting surface and the proximity lands Orazu formed conductor other than the wiring / protective conductor, one side of the IC chip, It overlaps with the wiring / protective conductor in a plan view from the normal direction .

  One end of the wiring / protection conductor is connected to the proximity terminal or the non-proximity terminal via the proximity land or the non-proximity land, and the other end of the wiring / protection conductor is connected to the planar conductor. The

  Further, in a plan view from the normal direction, no electronic component is mounted between one side of the predetermined surface and one side of the mounting surface, and between the adjacent land and one side of the mounting surface. No conductor other than the wiring / protective conductor is formed.

  According to the above aspect, by providing the wiring / protective conductor, it is possible to protect the junction between the proximity terminal and the proximity land and the junction between the non-proximity terminal and the non-proximity land from the force applied to the substrate from the outside. A component module can be provided.

  Further, since the wiring / protective conductor is used not only for the protection of each joint portion but also for signal transmission as a wiring, the space on the mounting surface can be used efficiently.

It is a front view of the electronic component module which concerns on 1st embodiment. It is a top view of the electronic component module of FIG. 1A. It is a bottom view of the IC chip shown in FIG. 1A. It is a top view of a board | substrate when each electronic component shown to FIG. 1B is removed. It is a front view of the electronic component module which concerns on a 1st modification. It is a top view of the electronic component module of FIG. 2A. FIG. 2B is a cross-sectional view showing a wiring / protective conductor formed on the inner layer of the substrate of FIG. 2A. It is a top view which shows the mounting surface of the electronic component module which concerns on a 2nd modification. It is a top view which shows the inner layer of the electronic component module which concerns on a 2nd modification.

(Introduction)
First, the X axis, Y axis, and Z axis shown in each figure will be described. The X axis, the Y axis, and the Z axis are orthogonal to each other. The Z axis indicates the normal direction of the mounting surface 4 a of the substrate 4. For convenience, the negative direction side of the Z axis is defined as the lower side (D), and the positive direction side of the Z axis is defined as the upper side (U). The X axis indicates the left-right direction. In particular, the positive direction side of the X axis is the right side (R), and the negative direction side is the left side (L). The Y axis indicates the front-rear direction. In particular, the positive direction side of the Y axis is the back direction (F), and the negative direction side is the front direction (N).

(Configuration of module according to the first embodiment)
1A and 1B are a front view and a top view of an electronic component module (hereinafter simply referred to as a module) 1 according to a first embodiment of the present invention. FIG. 1C is a bottom view of the IC chip 2 shown in FIG. 1A and the like. FIG. 1D is a top view of the substrate 4 when the IC chip 2 and other electronic components 3 shown in FIG. 1B are removed.

  In each of the above drawings, the module 1 is configured to be mountable on a mother substrate, and includes an IC chip 2, another electronic component 3, a substrate 4, a plurality of external electrodes 5, a plurality of lands 6, and a planar conductor. 7, a wiring conductor 8, and a wiring / protection conductor 9.

  The IC chip 2 is an RFIC chip, for example. The IC chip 2 is mounted on a corner of a mounting surface 4a (described later) of the substrate 4 by flip chip mounting. For this mounting, a plurality of lands 6 (see FIG. 1D) formed in a matrix (or grid) on the mounting surface 4a are used. Here, in the example of FIG. 1D, the lands 6 for the IC chip 2 are arranged in a matrix of four in the left-right direction and the front-rear direction.

  More specifically, the IC chip 2 has a rectangular bottom surface 2a as illustrated in FIG. 1C. A plurality of protruding terminals (so-called bumps) 21 are provided at different positions on the bottom surface 2a. More specifically, the plurality of protruding terminals 21 are arranged in a matrix (or lattice) corresponding to the plurality of lands 6. Here, out of the plurality of protruding terminals 21, the one closest to the first side 2b of the bottom surface 2a and along the first side 2b is referred to as a first proximity terminal 21a. Of the plurality of protruding terminals 21, the one closest to the second side 2c of the bottom surface 2a and along the second side 2c is referred to as a second proximity terminal 21b. Of the plurality of protruding terminals 21, one that is neither the first proximity terminal 21a nor the second proximity terminal 21b is referred to as a non-proximity terminal 21c. Here, the first side 2b is a side closer to the outer edge of the substrate 4 out of two sides parallel to the left-right direction of the bottom surface 2a. The second side 2c is adjacent to the first side 2b and is the side closer to the outer edge of the substrate 4 out of the two sides parallel to the front-rear direction of the bottom surface 2a.

  The other electronic component 3 may be an IC chip similar to the IC chip 2 or a passive element such as a capacitor element or an inductor element. These electronic components 3 are typically mounted on lands formed for each component 3 on the mounting surface 4a of the substrate 4 by surface mounting. The land for the electronic component 3 is an example of the planar conductor 7.

  By connecting the IC chip 2 and the electronic component 3 by using the land 6, the planar conductor 7, the wiring conductor 8, the wiring / protective conductor 9, and the like, for example, for 13.56 MHz band RFID (Radio Frequency IDentification) A transmission / reception circuit is configured.

  The substrate 4 is preferably a multilayer substrate and is made of an insulating material. The substrate 4 is, for example, a rigid substrate such as FR-4. In addition, the substrate 4 may be a flexible substrate made of polyimide or LCP (liquid crystal polymer).

  The substrate 4 has a bottom surface and a mounting surface 4a that face each other in the vertical direction. First, a plurality of external electrodes 5 made of a conductive material such as copper are formed on the bottom surface so as to match the land position on the mother substrate. The plurality of external electrodes 5 are electrically connected to the input / output ends of the transmission / reception circuit by via conductors (not shown) formed in the substrate 4.

  On the mounting surface 4a, a land 6, a planar conductor 7, a wiring conductor 8, and a wiring / protective conductor 9 are formed. These are made of a conductive material such as copper.

  The plurality of lands 6 are formed corresponding to the plurality of protruding terminals 21 provided on the IC chip 2. Among these lands 6, the land closest to the first side 4b of the mounting surface 4a and along the first side 4b is referred to as a first adjacent land 6a. Further, the one closest to the second side 4c of the mounting surface 4a and along the second side 4c is referred to as a second adjacent land 6b. First and second proximity terminals 21a and 21b are joined to the first and second proximity lands 6a and 6b. Of the plurality of lands 6, one that is neither the first adjacent land 6a nor the second adjacent land 6b is referred to as a non-adjacent land 6c. The non-proximity terminal 21c is joined to the non-proximity land 6c.

  Here, in FIG. 1D, the outline of the IC chip 2 projected from the normal direction onto the mounting surface 4a is indicated by a dotted line. The first side 4b is a side closer to the projected first side 2b of the IC chip 2 out of two sides parallel to the horizontal direction of the mounting surface 4a. The second side 4c is adjacent to the first side 4b, and is the side closer to the projected second side 2c of the IC chip 2 out of the two sides parallel to the front-rear direction of the mounting surface 4a. .

  Further, as illustrated in FIG. 1D, the planar conductor 7 is exemplified by a via receiving electrode (in other words, via receiving land) and a ground conductor in addition to the land for the electronic component 3.

  At one end and the other end of the wiring conductor 8, for example, either the non-proximity land 6 c or the planar conductor 7 is provided. A high-frequency signal or the like output from the IC chip 2 or the electronic component 3 propagates to the wiring conductor 8.

  FIG. 1D illustrates two wiring / protective conductors 9. These wiring / protective conductors 9 are formed thicker than the wiring conductor 8. Further, from the viewpoint of efficiently using the limited space on the mounting surface 4a, each side 2b, 2c of the IC chip 2 overlaps each wiring / protective conductor 9 in plan view from the normal direction. It is preferable.

  With respect to one wiring / protective conductor 9, a first adjacent land 6a is provided at one end, and a land for an electronic component 3 (in other words, an example of a planar conductor 7) is provided at the other end. . The wiring / protective conductor 9 extends in the front-rear direction between the first side 4b and the first adjacent land 6a in a plan view from the normal direction (that is, the vertical direction) of the mounting surface 4a. ing.

  Further, no electronic component or conductor pattern is formed between the one wiring / protective conductor 9 and the first side 4b, and between the wiring / protective conductor 9 and the first adjacent land 6a. In other words, on the mounting surface 4a, no electronic components or conductors other than the wiring / protective conductor 9 are provided between the first adjacent land 6a and the first side 4b.

  Further, with respect to the other wiring / protective conductor 9, a second adjacent land 6b is provided at one end, and a land for another electronic component 3 is provided at the other end (in other words, another example of the planar conductor 7). Is provided. The wiring / protective conductor 9 extends in the left-right direction mainly between the second side 4c and the second adjacent land 6b in a plan view from the normal direction. The wiring / protective conductor 9 is also provided with a portion extending between the first side 4b and the second adjacent land 6b from the viewpoint of protecting the second adjacent land 6b adjacent to the corner of the mounting surface 4a. It has been. Thereby, this wiring / protective conductor 9 is opposed to the corner second adjacent land 6b from two directions.

  A high-frequency signal or the like output from the IC chip 2 or the electronic component 3 propagates on the wiring conductor 8 and the wiring / protection conductor 9 described above.

(Module effect)
In the module 1, the wiring / protective conductor 9 made of a conductive material such as copper is provided between the outer edge of the module 1 and the joint between the protruding terminal 21 and the land 6 in a plan view from the normal direction. It is formed. The wiring / protective conductor 9 has higher stress resistance than the resin substrate 4. In the manufacturing process of the module 1, cracks may occur at the outer edge of the substrate 4 due to an impact during division or the like. However, according to the module 1, even if a crack occurs on the outer edge of the substrate 4, the crack proceeds beyond the wiring / protective conductor 9 having strong stress resistance to the center side of the substrate 4. Can be reduced. Thereby, it becomes possible to protect a junction part from a crack. Here, since the wiring / protective conductor 9 is configured to be thicker than the wiring conductor 8, it is possible to reduce the occurrence of poor bonding due to cracks in the wiring / protective conductor 9 itself.

  Further, the wiring / protective conductor 9 is used not only for protecting the joint portion but also for signal transmission in practice. Further, the electronic component 3 is not mounted between the sides 2b and 2c of the IC chip 2 and the sides 4b and 4c of the mounting surface 4a in a plan view from the normal direction, and the adjacent lands 6a and 6b are not mounted. No conductors other than the wiring / protective conductor 9 are formed between the sides 4b and 4c of the mounting surface 4a. Thereby, the IC chip 2 can be arranged at the corner of the mounting surface 4a as much as possible. Thus, the limited space on the mounting surface 4a can be used efficiently.

  Further, as a preferable configuration, each side 2b, 2c of the IC chip 2 overlaps each wiring / protective conductor 9 in plan view from the normal direction. As a result, the IC chip 2 can be arranged close to the sides 4b and 4c of the mounting surface 4a, so that the limited space on the mounting surface 4a can be used efficiently. In other words, many other electronic components 3 can be mounted on the mounting surface 4 a in addition to the mounting space of the IC chip 2.

  Further, as a preferable configuration, the wiring / protective conductor 9 is opposed to the second adjacent land 6b at the corner from two directions, so that it can be well protected.

(Various modifications)
In the first embodiment, the wiring / protective conductor 9 is formed only on the mounting surface 4 a of the substrate 4. However, not limited to this, as shown in FIGS. 2A to 2C, when the substrate 4 is a multilayer substrate, the wiring / protective conductor 9 may be formed on the inner layer 4 d of the substrate 4.

  In addition, when the substrate 4 is a multilayer substrate, as shown in FIGS. 3A and 3B, at least one wiring / protective conductor 9 is formed on the mounting surface 4a of the substrate 4, and at least one other wiring / The protective conductor 9 may be formed on the inner layer 4d of the substrate.

  The electronic component module according to the present invention can protect the joint from a force applied from the outside, and is suitable for a wireless communication device or the like.

DESCRIPTION OF SYMBOLS 1 Electronic component module 2 IC chip 2a Bottom surface 2b First side 2c Second side 21 Projection terminal 21a First proximity terminal 21b Second proximity terminal 21c Non-proximity terminal 3 Electronic component 4 Substrate 4a Mounting surface 4b First side 4c Second Side 4d Inner layer 5 External electrode 6 Land 6a First adjacent land 6b Second adjacent land 6c Non-adjacent land 7 Planar conductor 8 Wiring conductor 9 Protective conductor

Claims (5)

An IC chip including a proximity terminal formed close to one side of the predetermined surface and a non-proximity terminal formed at a position different from the proximity terminal on the predetermined surface;
A mounting surface, a proximity land formed along one side of the mounting surface, to which the proximity terminal is bonded, and a non-proximity land formed at a position different from the proximity land on the mounting surface, to which the non-proximity terminal is bonded And a planar conductor formed at a position different from the adjacent land and the non-adjacent land, and a flexible substrate,
A wiring / protective conductor formed on the mounting surface so as to extend between the adjacent land and one side of the mounting surface in a plan view from the normal direction of the mounting surface;
One end of the wiring / protection conductor is connected to the proximity terminal or the non-proximity terminal via the proximity land or the non-proximity land, and the other end of the wiring / protection conductor is connected to the planar conductor. ,
In a plan view from the normal direction, no electronic component is mounted between one side of the predetermined surface and one side of the mounting surface, and between the adjacent land and one side of the mounting surface. , Orazu formed conductor other than the wiring / protective conductor,
An electronic component module , wherein one side of the IC chip overlaps the wiring / protective conductor in a plan view from the normal direction . A wiring conductor formed on the mounting surface so as not to extend between the adjacent land and one side of the mounting surface in a plan view from the normal direction;
The electronic component module according to claim 1, wherein the wiring / protective conductor is thicker than the wiring conductor.   3. The electronic component module according to claim 1, wherein another electronic component is mounted or built in a portion other than the mounting space of the IC chip in a plan view from the normal direction on the mounting surface. .   The electronic component module according to claim 1, wherein the wiring / protective conductor extends between two adjacent sides on the mounting surface and the adjacent land. The flexible substrate is a multilayer substrate,
The wiring / protective conductor, the are formed on the surface and inside of the multilayer substrate, the electronic component module according to any one of claims 1-4.

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