JP5506806B2 - 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 - Google Patents
電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 Download PDFInfo
- Publication number
- JP5506806B2 JP5506806B2 JP2011532878A JP2011532878A JP5506806B2 JP 5506806 B2 JP5506806 B2 JP 5506806B2 JP 2011532878 A JP2011532878 A JP 2011532878A JP 2011532878 A JP2011532878 A JP 2011532878A JP 5506806 B2 JP5506806 B2 JP 5506806B2
- Authority
- JP
- Japan
- Prior art keywords
- mass
- copper alloy
- crystal grain
- grain size
- electronic materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 40
- 239000012776 electronic material Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910018598 Si-Co Inorganic materials 0.000 title description 18
- 229910008453 Si—Co Inorganic materials 0.000 title description 18
- 239000013078 crystal Substances 0.000 claims description 60
- 230000032683 aging Effects 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 33
- 238000005097 cold rolling Methods 0.000 claims description 21
- 238000005098 hot rolling Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 16
- 238000000137 annealing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052787 antimony Inorganic materials 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 description 38
- 229910045601 alloy Inorganic materials 0.000 description 33
- 239000000956 alloy Substances 0.000 description 33
- 239000000243 solution Substances 0.000 description 30
- 230000000694 effects Effects 0.000 description 28
- 230000035882 stress Effects 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000005452 bending Methods 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 239000002244 precipitate Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000011159 matrix material Substances 0.000 description 11
- 238000001556 precipitation Methods 0.000 description 10
- 239000006104 solid solution Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 6
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 238000004881 precipitation hardening Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 238000005482 strain hardening Methods 0.000 description 4
- 229910020711 Co—Si Inorganic materials 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000003483 aging Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000014616 translation Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/066794 WO2011036804A1 (fr) | 2009-09-28 | 2009-09-28 | Alliage cu-ni-si-co pour matériel électronique et son procédé de production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2011036804A1 JPWO2011036804A1 (ja) | 2013-02-14 |
| JP5506806B2 true JP5506806B2 (ja) | 2014-05-28 |
Family
ID=43795574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011532878A Active JP5506806B2 (ja) | 2009-09-28 | 2009-09-28 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2484787B1 (fr) |
| JP (1) | JP5506806B2 (fr) |
| KR (1) | KR20120054099A (fr) |
| CN (1) | CN102549180A (fr) |
| WO (1) | WO2011036804A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8784337B2 (en) | 2010-03-31 | 2014-07-22 | Boston Scientific Scimed, Inc. | Catheter with an improved flexural rigidity profile |
| US8795254B2 (en) | 2008-12-10 | 2014-08-05 | Boston Scientific Scimed, Inc. | Medical devices with a slotted tubular member having improved stress distribution |
| US8821477B2 (en) | 2007-08-06 | 2014-09-02 | Boston Scientific Scimed, Inc. | Alternative micromachined structures |
| US9901706B2 (en) | 2014-04-11 | 2018-02-27 | Boston Scientific Scimed, Inc. | Catheters and catheter shafts |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6246454B2 (ja) * | 2011-11-02 | 2017-12-13 | Ｊｘ金属株式会社 | Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法 |
| JP5770113B2 (ja) * | 2012-01-13 | 2015-08-26 | Jx日鉱日石金属株式会社 | 金属箔複合体、並びに成形体及びその製造方法 |
| JP6310004B2 (ja) * | 2016-05-27 | 2018-04-11 | Ｊｘ金属株式会社 | 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金 |
| CN106244849A (zh) * | 2016-10-13 | 2016-12-21 | 龙岩学院 | 一种超声波强化高性能铜合金的制备方法 |
| CN108642419A (zh) * | 2018-05-31 | 2018-10-12 | 太原晋西春雷铜业有限公司 | 一种折弯性优良的铜镍硅合金带材及其制备方法 |
| JP7451964B2 (ja) * | 2019-01-16 | 2024-03-19 | 株式会社プロテリアル | Ｃｕ合金板およびその製造方法 |
| CN110195166A (zh) * | 2019-04-17 | 2019-09-03 | 宁波兴业盛泰集团有限公司 | 一种引线框架用抗折弯CuNiCoSi系合金及其制造方法 |
| CN112410646A (zh) * | 2020-10-16 | 2021-02-26 | 扬州千裕电气有限公司 | 一种电子复合材料 |
| CN113234958A (zh) * | 2021-04-25 | 2021-08-10 | 江苏青益金属科技股份有限公司 | 适用于石油输送管道恒温包套的合金线材及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266783A (ja) * | 2007-03-26 | 2008-11-06 | Furukawa Electric Co Ltd:The | 電気・電子機器用銅合金およびその製造方法 |
| JP2009007666A (ja) * | 2007-05-31 | 2009-01-15 | Furukawa Electric Co Ltd:The | 電気・電子機器用銅合金 |
| WO2009122869A1 (fr) * | 2008-03-31 | 2009-10-08 | 日鉱金属株式会社 | ALLIAGE À BASE DE CUIVRE Cu-Ni-Si-Co POUR MATÉRIAU ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01122264A (ja) | 1987-11-05 | 1989-05-15 | Nec Corp | 画像出力装置 |
| JP3408021B2 (ja) | 1995-06-30 | 2003-05-19 | 古河電気工業株式会社 | 電子電気部品用銅合金およびその製造方法 |
| US7182823B2 (en) | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
| EP1873267B1 (fr) | 2005-03-24 | 2014-07-02 | JX Nippon Mining & Metals Corporation | Alliage de cuivre pour materiel electronique |
| JP4068626B2 (ja) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法 |
| JP5156317B2 (ja) * | 2006-09-27 | 2013-03-06 | Ｄｏｗａメタルテック株式会社 | 銅合金板材およびその製造法 |
| US9034123B2 (en) * | 2007-02-13 | 2015-05-19 | Dowa Metaltech Co., Ltd. | Cu—Ni—Si-based copper alloy sheet material and method of manufacturing same |
| US20090183803A1 (en) * | 2007-12-21 | 2009-07-23 | Mutschler Ralph A | Copper-nickel-silicon alloys |
-
2009
- 2009-09-28 WO PCT/JP2009/066794 patent/WO2011036804A1/fr active Application Filing
- 2009-09-28 JP JP2011532878A patent/JP5506806B2/ja active Active
- 2009-09-28 KR KR1020127009709A patent/KR20120054099A/ko not_active Application Discontinuation
- 2009-09-28 CN CN2009801616889A patent/CN102549180A/zh active Pending
- 2009-09-28 EP EP09849834.8A patent/EP2484787B1/fr active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266783A (ja) * | 2007-03-26 | 2008-11-06 | Furukawa Electric Co Ltd:The | 電気・電子機器用銅合金およびその製造方法 |
| JP2009007666A (ja) * | 2007-05-31 | 2009-01-15 | Furukawa Electric Co Ltd:The | 電気・電子機器用銅合金 |
| WO2009122869A1 (fr) * | 2008-03-31 | 2009-10-08 | 日鉱金属株式会社 | ALLIAGE À BASE DE CUIVRE Cu-Ni-Si-Co POUR MATÉRIAU ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8821477B2 (en) | 2007-08-06 | 2014-09-02 | Boston Scientific Scimed, Inc. | Alternative micromachined structures |
| US8795254B2 (en) | 2008-12-10 | 2014-08-05 | Boston Scientific Scimed, Inc. | Medical devices with a slotted tubular member having improved stress distribution |
| US8784337B2 (en) | 2010-03-31 | 2014-07-22 | Boston Scientific Scimed, Inc. | Catheter with an improved flexural rigidity profile |
| US9901706B2 (en) | 2014-04-11 | 2018-02-27 | Boston Scientific Scimed, Inc. | Catheters and catheter shafts |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011036804A1 (fr) | 2011-03-31 |
| CN102549180A (zh) | 2012-07-04 |
| KR20120054099A (ko) | 2012-05-29 |
| EP2484787B1 (fr) | 2015-01-07 |
| EP2484787A1 (fr) | 2012-08-08 |
| EP2484787A4 (fr) | 2013-06-05 |
| JPWO2011036804A1 (ja) | 2013-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4596490B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| JP5506806B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| JP4708485B2 (ja) | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法 | |
| JP4937815B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| JP4677505B1 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| JP5319700B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| KR101161597B1 (ko) | 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ계 구리합금 및 그 제조 방법 | |
| JP4837697B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| JP4799701B1 (ja) | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 | |
| JP5451674B2 (ja) | 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| TWI429768B (zh) | Cu-Co-Si based copper alloy for electronic materials and method for producing the same | |
| TWI429764B (zh) | Cu-Co-Si alloy for electronic materials | |
| JP6222885B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金 | |
| JP2012229467A (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金 | |
| JP5524901B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金 | |
| JP2016183418A (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金 | |
| JP2012229469A (ja) | 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 | |
| TWI391952B (zh) | Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method | |
| JP5595961B2 (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金及びその製造方法 | |
| JP2012211355A (ja) | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131119 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140218 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140318 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5506806 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |