JP5501687B2 - Organic EL light source unit - Google Patents

Description

  The present invention relates to an organic EL light source unit including an organic electroluminescence (hereinafter referred to as EL) light emitting element.

  In a conventional organic EL light emitting element (hereinafter referred to as a light emitting element), the light emitting layer emits heat during light emission, so that temperature spots are generated in the light emitting layer, and luminance spots are likely to occur. Therefore, in order to solve this problem, an organic EL light source unit (hereinafter referred to as a unit) including a light emitting element and a heat radiating sheet for radiating heat generated by the light emitting layer is known (for example, Patent Document). 1).

  6 and 7 show the configuration of such a unit 100. FIG. The unit 100 includes a light emitting element 11, a power feeding unit 12 that supplies power to the light emitting element 11, front and rear side element cases 13 a and 13 b that hold the light emitting element 11, and a heat dissipation sheet 14 that is attached to the light emitting element 11. Prepare. The light emitting element 11 includes an element substrate 16 provided with a light emitting layer 15, a sealing substrate 17 that seals the light emitting layer 15 and the like, a plus electrode 18a and a minus electrode 18b for supplying power to the light emitting layer 15, and a minus electrode 18b. And an aluminum electrode 33 for connecting the light emitting layer 15.

  The element cases 13 a and 13 b overlap to hold the power feeding unit 12 and the element substrate 16. The heat radiating sheet 14 is adhered and adhered to the sealing substrate 17 and the back side element case 13b. Since the unit 100 emits the heat generated by the light emitting layer 15 to the outside by the heat dissipation sheet 14, the occurrence of luminance spots can be suppressed. However, if the unit 100 is used for a long period of time, the heat radiating sheet 14 deteriorates. Therefore, the heat radiating sheet 14 must be replaced with a new one. When the heat radiating sheet 14 is peeled off from the sealing substrate 17, the sealing substrate 17 There is a possibility that the end portion is pulled together with the heat radiation sheet 14 and peeled off from the light emitting element 11.

JP 2006-228455 A

  The present invention has been made to solve the above problem, and an organic EL light source unit capable of preventing a sealing substrate from being peeled off from a light emitting element together with a heat dissipation sheet when a deteriorated heat dissipation sheet is replaced. The purpose is to provide.

In order to achieve the above object, an invention according to claim 1 includes an element substrate provided with a light emitting layer having a light emitting surface, and a sealing substrate disposed opposite to the element substrate on the opposite side of the light emitting surface. An organic EL light-emitting element having an element electrode led to the outer periphery of the sealing substrate and disposed on the element substrate, a power feeding unit that feeds power to the element electrode, and the organic EL light-emitting element and the power feeding unit are electrically connected An organic EL light source unit comprising: an element case that is mechanically connected and mechanically fixed; and a heat radiating sheet that is attached on the sealing substrate to dissipate heat generated by the light emitting layer, The element case has a structure having an opening in a case wall facing the sealing substrate and holding an end of at least one side of the sealing substrate, and the heat dissipation sheet has an adhesive surface on one surface. Has its adhesive strength Thus the affixed to the sealing substrate so as to cover a region corresponding to the light emitting layer in plan view, it is those and disposed in the opening of the device case.

  According to a second aspect of the present invention, in the organic EL light source unit according to the first aspect, the light emitting layer of the organic EL light emitting element is configured to be disposed in the opening of the element case in a plan view. is there.

  According to the first aspect of the invention, when the deteriorated heat dissipation sheet is peeled off from the sealing substrate, the element case suppresses the force applied to the end portion of the sealing substrate. Peeling from the element can be prevented.

  According to the second aspect of the present invention, since the heat radiation sheet disposed in the opening of the element case in a plan view can cover the entire light emitting layer serving as the heat generating part, the sealing substrate is peeled off from the organic EL light emitting element. It is possible to dissipate more heat generated by the light emitting layer while preventing the above.

Sectional drawing of the lighting fixture using the organic electroluminescent light source unit which concerns on one Embodiment of this invention. The exploded view of the lighting fixture. Exploded view of the unit. Sectional drawing of the modification of the unit. Exploded view of the unit. Sectional drawing of the conventional organic EL light source unit. Exploded view of the unit.

  FIG.1 and FIG.2 shows the structure of the lighting fixture 2 which uses the organic electroluminescent light source unit 1 (henceforth a unit) which concerns on one Embodiment of this invention. FIG. 3 shows the configuration of the unit 1. The unit 1 is a light source that irradiates light in the present embodiment, and constitutes one component of the lighting fixture 2. The luminaire 2 includes a unit 1, front and rear housings 3 a and 3 b that hold the unit 1, a front panel 4 that emits light emitted from the unit 1, and a power supply line 5 that supplies power to the unit 1. And comprising. The front-side housing 3a is formed in a frame shape, and the back-side housing 3b is formed in a lid shape with a lower surface opening. The casings 3a and 3b are overlapped to hold the unit 1. The front side housing 3a has a groove 7 for passing a power supply line 5 such as a conductor lead wire or a connector in a peripheral edge portion 6 in contact with the side wall of the back side housing 3b. A plate-like front panel 4 having light properties is installed.

  The unit 1 includes an organic EL light emitting element 11 (hereinafter referred to as a light emitting element), a power feeding unit 12 that feeds power to the light emitting element 11, and front and rear side element cases 13a and 13b that hold the light emitting element 11 and the power feeding unit 12. And a heat dissipation sheet 14 attached to the light emitting element 11.

  The light emitting element 11 is a transparent rectangular element substrate 16 provided with a light emitting layer 15 of organic EL, a sealing substrate 17 for sealing the light emitting layer 15 and the like, and an element electrode for supplying power to the light emitting layer 15. An electrode 18a and a negative electrode 18b are provided and configured as a light emitting panel. The light emitting element 11 is supplied with power to the light emitting layer 15 by the pair of power supply portions 12 to which the power supply line 5 is attached contacting the plus electrode 18a and the minus electrode 18b.

  The front side element case 13 a is composed of a case wall 21 and a case side wall 22, and the back side element case 13 b is composed of a case wall 23 and a case side wall 24. The element cases 13a and 13b are formed of a resin such as acrylic, and are overlapped so that the case side wall 22 and the case side wall 24 are in contact with each other, thereby forming a rectangular parallelepiped box shape, and electrically connecting the light emitting element 11 and the power feeding unit 12 to each other. And mechanically fix.

  The front element case 13 a includes an irradiation part 25 that is an opening for emitting light to the case wall 21 that faces the element substrate 16, and a groove part 26 for holding the power feeding part 12 on the case side wall 22. The back-side element case 13 b has a structure in which an opening 27 for attaching the heat dissipation sheet 14 is provided in the case wall 23 facing the sealing substrate 17 and the end portions of the four sides of the sealing substrate 17 are held. In addition, the back side element case 13b should just be a structure holding the edge part of at least 1 side of the sealing substrate 17. FIG.

  The heat dissipation sheet 14 dissipates heat generated by the light emitting layer 15. Further, one surface is an adhesive surface, and is adhered on the sealing substrate 17 by the adhesive force, or is adhered on the sealing substrate 17 by an adhesive, and the back side element case 13b in a plan view. It arrange | positions in the opening part 27 of this. When the unit 1 is held by the housings 3a and 3b, the heat radiating sheet 14 dissipates the heat absorbed by the light emitting layer 15 in close contact with the back side housing 3b to the housings 3a and 3b. Since the temperature distribution in the 15 planes is made uniform, the occurrence of luminance spots in the unit 1 can be suppressed.

  When the unit 1 peels off the deteriorated heat dissipation sheet 14 from the sealing substrate 17, the force applied to the end of the sealing substrate 17 is suppressed by the back side element case 13 b, so that the sealing substrate 17 is attached together with the heat dissipation sheet 14. Separation from the light emitting element 11 can be prevented.

  The element substrate 16 derives light emitted from the light emitting layer 15 and is made of a transparent member such as glass or transparent resin. On the element substrate 16, a plus electrode 18 a and a minus electrode 18 b serving as electrodes for feeding power to the light emitting layer 15 are provided. The light emitting layer 15 is formed on the plus electrode 18a and the minus electrode 18b. The opposite surface side (back surface side) on which the light emitting layer 15 of the element substrate 16 is formed is a light emission surface for EL light emission.

  The plus electrode 18a and the minus electrode 18b are formed on the element substrate 16 as a transparent electrode by ITO (indium tin oxide), for example, in a planar shape, and are separated from two rectangular patterns separated by a rectangular insulating separation layer therebetween. Thus, the area of the plus electrode 18a is larger than the area of the minus electrode 18b.

  On the plus electrode 18a, for example, a light emitting layer 15 made of an organic thin film containing a fluorescent organic compound is formed as a light emitter. A submicron-thick aluminum electrode 33 is formed on the top surface of the light emitting layer 15 by vapor deposition, and the aluminum electrode 33 is connected to the negative electrode 18b. The light emitting layer 15 and the aluminum electrode 33 are sealed with a sealing substrate 17 made of silicon resin. The plus electrode 18 a and the minus electrode 18 b are led out to the outer periphery of the sealing substrate 17, and are in direct contact with the power feeding unit 12 at the lead-out portions along the pair of opposing side directions of the element substrate 16 or conductive. Contact indirectly through a thin film.

  Note that the light emitting element 11 has a hole transport layer for improving the hole injection property to the light emitting layer 15 between the light emitting layer 15 and the plus electrode 18 a, and the light emitting layer 15 between the light emitting layer 15 and the aluminum electrode 33. It may have an electron transport layer for improving the electron injection property. Further, the minus electrode 18b is not necessarily a transparent electrode, and may be an electrode made of aluminum, for example.

  The power feeding unit 12 is made of a metal conductor such as copper or stainless steel, and is formed into a rectangle by punching a plate-like metal conductor, for example. In addition, since the power feeding unit 12 has an extremely low resistance value as compared with ITO which is a material of the plus electrode 18a and the minus electrode 18b, the influence of the resistance of the plus electrode 18a and the minus electrode 18b is minimized. That is, the voltage drop phenomenon applied to the plus electrode 18a and the minus electrode 18b is minimized, and the luminance unevenness of the unit 1 can be reduced. The power feeding unit 12 may be, for example, a linear metal conductor formed in a coil shape other than a rectangular plate-shaped metal conductor.

  4 and 5 show a unit 1 according to a modification of the present embodiment. The unit 1 is configured such that the light emitting layer 15 is disposed in the opening 27 of the back side element case 13b in plan view, and the other configurations are the same as described above. In the unit 1, since the heat radiation sheet 14 disposed in the opening 27 of the back side element case 13 b in the plan view can cover the entire light emitting layer 15 serving as a heat generating part, the sealing substrate 17 is peeled off from the light emitting element 11. It is possible to dissipate more heat generated by the light emitting layer 15 while preventing this.

  In addition, this invention is not restricted to the structure of said embodiment, A various deformation | transformation is possible in the range which does not change the summary of invention. For example, in the above-described embodiment, the unit is rectangular, but it may be circular. In that case, the opening of the element case may be circular according to the shape of the unit.

1 unit (organic EL light source unit)
11 Light Emitting Element (Organic EL Light Emitting Element)
12 Feeder 13a Front side element case (element case)
13b Rear side element case (element case)
14 heat dissipation sheet 15 light emitting layer 16 element substrate 17 sealing substrate 18a plus electrode (element electrode)
18b Negative electrode (element electrode)
23 Case wall 27 Opening

Claims (2)

An element substrate provided with a light emitting layer having a light emission surface, a sealing substrate disposed opposite to the element substrate on the opposite side of the light emission surface, and an outer periphery of the sealing substrate led to the element substrate An organic EL light emitting device having a device electrode disposed;
A power feeding section for feeding power to the element electrode;
An element case for electrically connecting the organic EL light emitting element and the power feeding unit and mechanically fixing the element,
An organic EL light source unit comprising: a heat-dissipating sheet attached on the sealing substrate to dissipate heat generated by the light-emitting layer,
The element case has a structure having an opening in a case wall facing the sealing substrate and holding an end of at least one side of the sealing substrate.
The heat-dissipating sheet has an adhesive surface on one surface, is attached to the sealing substrate by the adhesive force , covers an area corresponding to the light emitting layer in a plan view , and within the opening of the element case An organic EL light source unit, which is disposed in   The organic EL light source unit according to claim 1, wherein the light emitting layer of the organic EL light emitting element is configured to be disposed in an opening of the element case in a plan view.

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