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JP5223821B2 - Multilayer electronic components - Google Patents

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JP5223821B2
JP5223821B2 JP2009198780A JP2009198780A JP5223821B2 JP 5223821 B2 JP5223821 B2 JP 5223821B2 JP 2009198780 A JP2009198780 A JP 2009198780A JP 2009198780 A JP2009198780 A JP 2009198780A JP 5223821 B2 JP5223821 B2 JP 5223821B2
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coil
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lead
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JP2011049492A (en
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章彦 生出
由也 大島
真 吉野
和広 海老名
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TDK Corp
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Description

本発明は、積層型電子部品に関する。   The present invention relates to a multilayer electronic component.

従来の積層型電子部品として、複数の矩形状の絶縁体層を積層することによって形成される素体と、素体内に形成されるコイルと、素体の積層方向における両端部にそれぞれ形成される一対の外部電極とを備えるものが知られている(例えば、特許文献1参照)。この積層型電子部品では、直流抵抗を下げるために、コイルが、並列接続された一対のコイル導体の組を積層方向に複数直列接続することによって構成されている。また、コイル端と引出導体とを接続する一対の接続導体が、略L字状の形状をなしている。具体的には、接続導体は、図6(a)に示すように、絶縁体層の角部から絶縁体層の縁部に沿って中央位置まで延び、中央位置で90°屈曲して絶縁体層の中心まで延びている。   As a conventional multilayer electronic component, an element body formed by laminating a plurality of rectangular insulator layers, a coil formed in the element body, and both ends in the element stacking direction are formed. An apparatus including a pair of external electrodes is known (see, for example, Patent Document 1). In this multilayer electronic component, in order to lower the direct current resistance, a coil is configured by connecting a plurality of pairs of coil conductors connected in parallel in series in the stacking direction. Further, a pair of connection conductors connecting the coil ends and the lead conductors have a substantially L-shape. Specifically, as shown in FIG. 6A, the connection conductor extends from the corner of the insulator layer to the center position along the edge of the insulator layer, and bends by 90 ° at the center position. Extends to the center of the layer.

特開2001−44038号公報JP 2001-44038 A

ここで、従来の積層型電子部品の直流抵抗を一層下げることが求められており、そのために、接続導体をL字状の形状から、例えば図6(b)に示すように直線状の形状にすることが考えられる。しかしながら、接続導体が略L字状である場合、図6(a)においてAに示す部分は内層側のコイル導体に支持されるため、積層圧着時に引出導体やスルーホール導体を介して大きな力が作用する位置と、内層側のコイル導体で支持される位置との間の距離は、絶縁体層の一辺の約半分の長さとなる(図6中L1で示される)。一方、接続導体が直線状である場合、積層圧着時に引出導体やスルーホール導体を介して大きな力が作用する位置と、内層側のコイル導体で支持される位置との間の距離は、絶縁体層の対角線の約半分の長さとなり(図6中L2で示される)、L1よりも長くなる。従って、接続導体が直線状である場合、図5(b)に示すように、積層圧着時に引出導体や接続導体が内層側に大きく沈み易くなる。これによって、接続導体がコイルの内周側の領域に入り込んで、コイル特性に影響を与える可能性があった。   Here, it is required to further reduce the DC resistance of the conventional multilayer electronic component. For this purpose, the connection conductor is changed from an L shape to a linear shape as shown in FIG. 6B, for example. It is possible to do. However, when the connection conductor is substantially L-shaped, the portion indicated by A in FIG. 6 (a) is supported by the coil conductor on the inner layer side, so that a large force is exerted through the lead conductor and through-hole conductor during lamination crimping. The distance between the acting position and the position supported by the coil conductor on the inner layer side is about half the length of one side of the insulator layer (indicated by L1 in FIG. 6). On the other hand, when the connecting conductor is a straight line, the distance between the position where a large force acts via the lead conductor or through-hole conductor during lamination crimping and the position supported by the coil conductor on the inner layer side is the insulator The length is about half the diagonal of the layer (indicated by L2 in FIG. 6) and is longer than L1. Therefore, when the connecting conductor is linear, as shown in FIG. 5B, the lead conductor and the connecting conductor are likely to sink greatly to the inner layer side during lamination and crimping. As a result, the connection conductor may enter the region on the inner peripheral side of the coil, which may affect the coil characteristics.

本発明は、直流抵抗を下げつつも、接続導体がコイルの内周側の領域に入り込むことを抑制し、信頼性が向上された積層型電子部品を提供することを目的とする。   An object of the present invention is to provide a multilayer electronic component with improved reliability by suppressing the connection conductor from entering the region on the inner peripheral side of the coil while reducing the direct current resistance.

本発明に係る積層型電子部品は、複数の矩形状の絶縁体層を積層することによって形成される素体と、絶縁体層を挟んで並列接続される複数のコイル導体の組を、積層方向に複数組直列接続することによって、素体内部で螺旋状に形成されるコイルと、積層方向における素体の両端部にそれぞれ形成される一対の外部電極と、少なくとも一方の外部電極とコイルのコイル端との間に積層され、コイル端を積層方向に引き出して外部電極とコイルとを電気的に接続する引出導体と、引出導体とコイルのコイル端との間に積層され、コイルの周回中心線側に配置される引出導体と絶縁体層の角部側に配置されるコイル端とを電気的に接続する第一接続導体と、第一接続導体とコイル端との間に積層され、第一接続導体と互いに平行をなすと共に並列接続される第二接続導体と、引出導体と第一接続導体の一端部とを電気的に接続する引出導体用スルーホール導体と、第一接続導体の一端部と第二接続導体の一端部とを電気的に接続する第一並列接続用スルーホール導体と、第一接続導体の他端部と第二接続導体の他端部とを電気的に接続する第二並列接続用スルーホール導体と、第二接続導体の他端部とコイル端とを電気的に接続する直列接続用スルーホール導体と、を備え、第一接続導体及び第二接続導体は、絶縁体層の角部側から周回中心線側へ直線状に延び、第一並列接続用スルーホール導体は、引出導体用スルーホール導体よりも大きい直径を有することを特徴とする。   The multilayer electronic component according to the present invention includes a combination of an element body formed by laminating a plurality of rectangular insulator layers and a plurality of coil conductors connected in parallel with the insulator layers interposed therebetween. A plurality of sets of coils connected in series to form a spiral coil inside the element body, a pair of external electrodes formed at both ends of the element body in the stacking direction, and at least one external electrode and coil coil Laminated between the ends, the coil conductor is led out in the laminating direction to electrically connect the external electrode and the coil, and is laminated between the lead conductor and the coil end of the coil. A first connection conductor that electrically connects the lead conductor disposed on the side and the coil end disposed on the corner side of the insulator layer, and is laminated between the first connection conductor and the coil end, Parallel to and parallel to the connecting conductor A second connection conductor to be connected; a through-hole conductor for a lead conductor that electrically connects the lead conductor and one end of the first connection conductor; one end of the first connection conductor and one end of the second connection conductor; A first parallel connection through-hole conductor, and a second parallel connection through-hole conductor that electrically connects the other end of the first connection conductor and the other end of the second connection conductor; A through-hole conductor for series connection that electrically connects the other end of the second connection conductor and the coil end, and the first connection conductor and the second connection conductor are centered around the corner of the insulator layer. The first parallel connection through-hole conductor extends linearly to the line side, and has a larger diameter than the lead-out conductor through-hole conductor.

本発明に係る積層型電子部品においては、第一接続導体及び第二接続導体は、絶縁体層の角部側から周回中心線側へ直線状に延び、第一並列接続用スルーホール導体は、引出導体用スルーホール導体よりも大きい直径を有する構成とされている。従って、引出導体用スルーホール導体に比して、第一並列接続用スルーホール導体の直径が大きくされているため、第一並列接続用スルーホール導体が、積層圧着時に引出導体用スルーホール導体の食い込みを受け止める支持部材として機能する。これによって、小さい直径を有する第一並列接続用スルーホール導体を適用した場合に比して、積層圧着時における第一接続導体及び第二接続導体の沈みを抑制することができる。更に、第一並列接続用スルーホール導体が第二接続導体に対して当接する部分の面積が大きくなることによって第二接続導体に作用する圧力を分散させることができる。従って、小さい直径を有する第一並列接続用スルーホール導体を適用した場合に比して、第二接続導体に対する第一並列接続用スルーホール導体の食い込み量を低減することができる。以上によって、本発明に係る積層型電子部品によれば、接続導体を直線状とすることで直流抵抗を下げつつも、接続導体がコイルの内周側の領域に入り込むことを抑制し、信頼性を向上することができる。   In the multilayer electronic component according to the present invention, the first connection conductor and the second connection conductor extend linearly from the corner portion side of the insulator layer to the circumferential center line side, and the first parallel connection through-hole conductor is The lead conductor has a larger diameter than the through-hole conductor for the lead conductor. Therefore, since the diameter of the first parallel connection through-hole conductor is larger than that of the lead-through conductor through-hole conductor, the first parallel connection through-hole conductor is It functions as a support member that catches the bite. Thereby, compared with the case where the first parallel connection through-hole conductor having a small diameter is applied, it is possible to suppress sinking of the first connection conductor and the second connection conductor at the time of stacking and crimping. Furthermore, the pressure acting on the second connection conductor can be dispersed by increasing the area of the portion where the first parallel connection through-hole conductor abuts against the second connection conductor. Therefore, the amount of biting of the first parallel connection through-hole conductor with respect to the second connection conductor can be reduced as compared with the case where the first parallel connection through-hole conductor having a small diameter is applied. As described above, according to the multilayer electronic component according to the present invention, the connection conductor is reduced in direct current resistance by making the connection conductor linear, and the connection conductor is prevented from entering the region on the inner peripheral side of the coil. Can be improved.

また、本発明に係る積層型電子部品において、第一並列接続用スルーホール導体は、引出導体用スルーホール導体の厚みよりも薄くされていることが好ましい。このように、第一並列接続用スルーホール導体の厚みを薄くすることによって、第一並列接続用スルーホール導体を扁平な形状とすることができ、これによって、第一並列接続用スルーホール導体が積層圧着時に第二接続導体に食い込みにくくなるため、第二接続導体がコイルの内周側の領域に入り込むことを一層抑制することができる。   In the multilayer electronic component according to the present invention, it is preferable that the first parallel connection through-hole conductor is thinner than the thickness of the lead conductor through-hole conductor. Thus, by reducing the thickness of the first parallel connection through-hole conductor, the first parallel connection through-hole conductor can be formed into a flat shape. Since it becomes difficult to bite into the second connection conductor at the time of laminated crimping, it is possible to further suppress the second connection conductor from entering the region on the inner peripheral side of the coil.

本発明によれば、直流抵抗を下げつつも、接続導体がコイルの内周側の領域に入り込むことを抑制し、積層型電子部品の信頼性を向上させることができる。   ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a connection conductor enters into the area | region of the inner peripheral side of a coil, reducing DC resistance, and can improve the reliability of a multilayer electronic component.

本実施形態に係る積層型電子部品の斜視図である。1 is a perspective view of a multilayer electronic component according to an embodiment. 本実施形態に係る積層型電子部品の素体の展開斜視図である。It is an expansion | deployment perspective view of the element | base_body of the multilayer electronic component which concerns on this embodiment. 図1に示すIII−III線に沿った断面図である。It is sectional drawing along the III-III line | wire shown in FIG. 引出導体、第一接続導体、第二接続導体、引出導体用スルーホール導体、第一並列接続用スルーホール導体及び第二並列接続用スルーホール導体を積層方向と直交する方向から見た図である。It is the figure which looked at the extraction conductor, the 1st connection conductor, the 2nd connection conductor, the through-hole conductor for extraction conductors, the 1st parallel connection through-hole conductor, and the 2nd parallel connection through-hole conductor from the direction orthogonal to the lamination direction. . 従来の積層型電子部品及び従来の積層型電子部品の接続導体を直線状にしたものの積層圧着時における引出導体、接続導体及び各スルーホール導体の様子を示す概略図である。It is the schematic which shows the mode of the extraction conductor at the time of lamination | stacking crimping | compression-bonding, and each through-hole conductor of the conventional multilayer electronic component and the connection conductor of the conventional multilayer electronic component made linear. 従来の略L字状の接続導体及び直線状の接続導体の形状を示す斜視図である。It is a perspective view which shows the shape of the conventional substantially L-shaped connection conductor and the linear connection conductor. 積層圧着時における引出導体用スルーホール導体、第一接続導体、第一並列接続用スルーホール導体、及び第二接続導体の様子を示す概略図である。It is the schematic which shows the mode of the through-hole conductor for lead conductors, the 1st connection conductor, the through-hole conductor for 1st parallel connection, and the 2nd connection conductor at the time of lamination | stacking crimping | compression-bonding. 変形例に係る積層型電子部品の構成を示す図であって、図4に対応する図である。It is a figure which shows the structure of the multilayer electronic component which concerns on a modification, Comprising: It is a figure corresponding to FIG.

以下、図面を参照しながら、本発明に係る積層型電子部品の好適な実施形態について詳細に説明する。   Hereinafter, preferred embodiments of a multilayer electronic component according to the present invention will be described in detail with reference to the drawings.

図1は、本実施形態に係る積層型電子部品の斜視図である。図2は、本実施形態に係る積層型電子部品の素体の展開斜視図である。図3は、図1に示すIII−III線に沿った断面図である。   FIG. 1 is a perspective view of the multilayer electronic component according to the present embodiment. FIG. 2 is an exploded perspective view of an element body of the multilayer electronic component according to the present embodiment. FIG. 3 is a cross-sectional view taken along line III-III shown in FIG.

本実施形態に係る積層型電子部品1は、回路基板(不図示)の表面に実装される積層型チップインダクタであり、図1〜図3に示すように、複数の絶縁体層を積層することによって形成される直方体状の素体2と、積層方向に向かって周回中心線RLが延びるように素体2内で巻回されたコイル3と、絶縁体層の積層方向における素体2の両端部にそれぞれ形成される一対の外部電極4,5とを備えて構成されている。   The multilayer electronic component 1 according to this embodiment is a multilayer chip inductor mounted on the surface of a circuit board (not shown), and a plurality of insulator layers are laminated as shown in FIGS. A rectangular parallelepiped element body 2 formed by the above, a coil 3 wound in the element body 2 so that the circumferential center line RL extends in the stacking direction, and both ends of the element body 2 in the stacking direction of the insulator layers It comprises a pair of external electrodes 4 and 5 formed respectively on the part.

外部電極4は、素体2の一方の端面2aを覆うように設けられている。また、外部電極4は、端面2aからまわりこんで、端面2aに隣接する四方の側面2c,2d,2e,2fの一部も覆うように形成されている。外部電極5は、素体2の一方の端面2bを覆うように設けられている。また、外部電極5は、端面2bからまわりこんで、端面2bに隣接する四方の側面2c,2d,2e,2fの一部も覆うように形成されている。外部電極4の端面2aから側面2c,2d,2e,2fへまわりこんだ部分、及び外部電極5の端面2bから側面2c,2d,2e,2fへまわりこんだ部分は、回路基板の端子部分と接触して半田付けが行われる部分である。これによって、側面2c,2d,2e,2fのいずれかが回路基板の表面と対向するように配置され、コイル3の周回中心線RLが回路基板の表面と平行になる。外部電極4,5は、素体2の焼成後、ディップ法などによってAgやガラスを主成分とした導電性ペーストを塗布し、焼成後、メッキ処理を施すことによって形成される。   The external electrode 4 is provided so as to cover one end surface 2 a of the element body 2. Further, the external electrode 4 is formed so as to cover a part of the four side surfaces 2c, 2d, 2e, 2f adjacent to the end surface 2a so as to go around from the end surface 2a. The external electrode 5 is provided so as to cover one end surface 2 b of the element body 2. Further, the external electrode 5 is formed so as to cover a part of the four side surfaces 2c, 2d, 2e, 2f adjacent to the end surface 2b so as to go around from the end surface 2b. The portion of the external electrode 4 that extends from the end surface 2a to the side surfaces 2c, 2d, 2e, and 2f and the portion of the external electrode 5 that extends from the end surface 2b to the side surfaces 2c, 2d, 2e, and 2f This is the part where contact is made and soldering is performed. Thus, any one of the side surfaces 2c, 2d, 2e, and 2f is disposed so as to face the surface of the circuit board, and the circumferential center line RL of the coil 3 is parallel to the surface of the circuit board. The external electrodes 4 and 5 are formed by applying a conductive paste containing Ag or glass as a main component by a dipping method or the like after the element body 2 is fired, followed by plating.

素体2は、複数の矩形状の絶縁体層10を積層することによって構成されている。具体的には、Fe、Ni、Cu、Znを主成分としたフェライト材からなるフェライトグリーンシートの表面にコイル導体などの所定の導体パターンを印刷すると共にスルーホールを形成する。その後、複数のフェライトグリーンシートを積層すると共に積層方向に圧力をかけることによって圧着し、シート積層体を得る。そして、当該シート積層体を素体2の単位形状にカットした後、焼成することによって素体2が形成される。素体2の焼成後の大きさは、積層方向における長さが0.90〜0.95mmとされ、積層方向と直交する辺の大きさが0.45〜0.50mmとされている。また、焼成後の絶縁体層10の厚みは、0.010〜0.015mmとされている。   The element body 2 is configured by laminating a plurality of rectangular insulator layers 10. Specifically, a predetermined conductor pattern such as a coil conductor is printed and a through hole is formed on the surface of a ferrite green sheet made of a ferrite material mainly composed of Fe, Ni, Cu, and Zn. Thereafter, a plurality of ferrite green sheets are laminated and pressure-bonded by applying pressure in the laminating direction to obtain a sheet laminate. And the element | base_body 2 is formed by baking after the said sheet | seat laminated body is cut into the unit shape of the element | base_body 2. As shown in FIG. As for the size of the element body 2 after firing, the length in the stacking direction is 0.90 to 0.95 mm, and the size of the side perpendicular to the stacking direction is 0.45 to 0.50 mm. Moreover, the thickness of the insulator layer 10 after baking is set to 0.010 to 0.015 mm.

図2及び図3に示すように、素体2の内部には、フェライトグリーンシート上に印刷された導体パターンが積層されることによってコイル3、コイル端3a,3bを積層方向に引き出して外部電極4,5とコイル3とを電気的に接続する引出導体11,12,13及び引出導体14,15,16と、コイル端3a,3bと引出導体13,16とをそれぞれ電気的に接続する第一接続導体21,22と、第一接続導体21,22とそれぞれ並列接続される第二接続導体23,24とが構成されている。また、各導体同士は積層方向にスルーホール導体によって接続されている。   As shown in FIGS. 2 and 3, a conductor pattern printed on a ferrite green sheet is laminated inside the element body 2 to draw out the coil 3 and the coil ends 3a and 3b in the laminating direction. 4, 5 and the lead conductors 11, 12, 13 and lead conductors 14, 15, 16 electrically connecting the coil 3 and the coil ends 3a, 3b and the lead conductors 13, 16 are respectively electrically connected. One connection conductors 21 and 22 and second connection conductors 23 and 24 connected in parallel to the first connection conductors 21 and 22 are configured. The conductors are connected to each other by through-hole conductors in the stacking direction.

コイル3は、絶縁体層10を挟んで並列接続される一対のコイル導体の組を、積層方向に複数組直列接続することによって、素体2内部で螺旋状に形成されるコイルである。このように、コイルを二重構造とすることによって、直流抵抗を下げることができる。具体的には、コイル3は、並列接続される一対のコイル導体30,31の組41、並列接続される一対のコイル導体32,33の組42、並列接続される一対のコイル導体34,35の組43、並列接続される一対のコイル導体36,37の組44、並列接続される一対のコイル導体38,39の組45を積層方向に直列接続することによって構成されている。なお、絶縁体層10は、四方に縁部10a,10b,10c,10dを有しており、図2においては、最も上端側の絶縁体層10と最も下端側の絶縁体層10にのみ、縁部10a,10b,10c,10dの符号を示しているが、他の絶縁体層10の縁部も、縁部10a,10b,10c,10dに対応しているものとして以下の説明を行う。   The coil 3 is a coil formed in a spiral shape inside the element body 2 by connecting a plurality of sets of a pair of coil conductors connected in parallel across the insulator layer 10 in the stacking direction. Thus, the direct current resistance can be lowered by making the coil have a double structure. Specifically, the coil 3 includes a pair 41 of a pair of coil conductors 30 and 31 connected in parallel, a pair 42 of a pair of coil conductors 32 and 33 connected in parallel, and a pair of coil conductors 34 and 35 connected in parallel. , A pair of coil conductors 36 and 37 connected in parallel, and a pair 45 of a pair of coil conductors 38 and 39 connected in parallel are connected in series in the stacking direction. The insulator layer 10 has edges 10a, 10b, 10c, and 10d in four directions. In FIG. 2, only the insulator layer 10 on the uppermost side and the insulator layer 10 on the lowermost side are only Although the reference numerals of the edge portions 10a, 10b, 10c, and 10d are shown, the following description will be made assuming that the edge portions of the other insulator layers 10 also correspond to the edge portions 10a, 10b, 10c, and 10d.

組41を構成する一方のコイル導体30は、絶縁体層10の縁部10a,10b,10cに沿って延在すると共に縁部10dで開口するコ字状の導体パターンである。組41を構成する他方のコイル導体31は、コイル導体30の一枚下側の絶縁体層10に形成されており、積層方向から見てコイル導体30と同一形状を有している。すなわち、コイル導体31は、絶縁体層10の縁部10a,10b,10cに沿って延在すると共に縁部10dで開口するコ字状の導体パターンである。絶縁体層10の縁部10aと縁部10dとの間の角部側に位置する導体端部30a、及び縁部10cと縁部10dとの間の角部側に位置する導体端部30bにはそれぞれスルーホールが形成されており、これらの導体端部30a,30bは、他方のコイル導体31の導体端部31a,31bと、並列接続用スルーホール導体51,52を介してそれぞれ電気的に接続されている。これによって、組41を構成する一方のコイル導体30と他方のコイル導体31とは積層方向に並列接続される。更に、他方のコイル導体31の導体端部31bにはスルーホールが形成されており、導体端部31bは、組42のコイル導体32の導体端部32aと、直列接続用スルーホール導体53を介して電気的に接続されている。これによって、組41と組42とは積層方向に直列接続される。なお、組41のコイル導体30の導体端部30aは、コイル3自体のコイル端3aを構成する。   One coil conductor 30 constituting the set 41 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The other coil conductor 31 constituting the set 41 is formed on the insulator layer 10 on the lower side of the coil conductor 30 and has the same shape as the coil conductor 30 when viewed from the stacking direction. That is, the coil conductor 31 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The conductor end 30a located on the corner side between the edge 10a and the edge 10d of the insulator layer 10 and the conductor end 30b located on the corner side between the edge 10c and the edge 10d. Each of the conductor end portions 30a and 30b is electrically connected to the conductor end portions 31a and 31b of the other coil conductor 31 through the parallel connection through-hole conductors 51 and 52, respectively. It is connected. Thereby, one coil conductor 30 and the other coil conductor 31 constituting the set 41 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end 31 b of the other coil conductor 31, and the conductor end 31 b passes through the conductor end 32 a of the coil conductor 32 of the set 42 and the through-hole conductor 53 for series connection. Are electrically connected. Thereby, the set 41 and the set 42 are connected in series in the stacking direction. The conductor end 30a of the coil conductor 30 of the set 41 constitutes the coil end 3a of the coil 3 itself.

組42を構成する一方のコイル導体32は、絶縁体層10の縁部10a,10b,10dに沿って延在すると共に縁部10cで開口するコ字状の導体パターンである。組42を構成する他方のコイル導体33は、コイル導体32の一枚下側の絶縁体層10に形成されており、積層方向から見てコイル導体32と同一形状を有している。すなわち、コイル導体33は、絶縁体層10の縁部10a,10b,10dに沿って延在すると共に縁部10cで開口するコ字状の導体パターンである。絶縁体層10の縁部10cと縁部10dとの間の角部側に位置する導体端部32a、及び縁部10bと縁部10cとの間の角部側に位置する導体端部32bにはそれぞれスルーホールが形成されており、これらの導体端部32a,32bは、他方のコイル導体33の導体端部33a,33bと、並列接続用スルーホール導体54,55を介してそれぞれ電気的に接続されている。これによって、組42を構成する一方のコイル導体32と他方のコイル導体33とは積層方向に並列接続される。更に、他方のコイル導体33の導体端部33bにはスルーホールが形成されており、導体端部33bは、組43のコイル導体34の導体端部34aと、直列接続用スルーホール導体56を介して電気的に接続されている。これによって、組42と組43とは積層方向に直列接続される。   One coil conductor 32 constituting the set 42 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10d of the insulator layer 10 and opens at the edge 10c. The other coil conductor 33 constituting the set 42 is formed in the insulator layer 10 on the lower side of the coil conductor 32 and has the same shape as the coil conductor 32 when viewed from the stacking direction. That is, the coil conductor 33 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10d of the insulator layer 10 and opens at the edge 10c. The conductor end 32a located on the corner side between the edge 10c and the edge 10d of the insulator layer 10 and the conductor end 32b located on the corner side between the edge 10b and the edge 10c. Each of the conductor end portions 32a and 32b is electrically connected to the other coil conductor 33 via the conductor end portions 33a and 33b and the parallel connection through-hole conductors 54 and 55, respectively. It is connected. As a result, one coil conductor 32 and the other coil conductor 33 constituting the set 42 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 33 b of the other coil conductor 33, and the conductor end portion 33 b is connected to the conductor end portion 34 a of the coil conductor 34 of the set 43 and the series connection through hole conductor 56. Are electrically connected. Thereby, the set 42 and the set 43 are connected in series in the stacking direction.

組43を構成する一方のコイル導体34は、絶縁体層10の縁部10a,10c,10dに沿って延在すると共に縁部10bで開口するコ字状の導体パターンである。組43を構成する他方のコイル導体35は、コイル導体34の一枚下側の絶縁体層10に形成されており、積層方向から見てコイル導体34と同一形状を有している。すなわち、コイル導体35は、絶縁体層10の縁部10a,10c,10dに沿って延在すると共に縁部10bで開口するコ字状の導体パターンである。絶縁体層10の縁部10bと縁部10cとの間の角部側に位置する導体端部34a、及び縁部10aと縁部10bとの間の角部側に位置する導体端部34bにはそれぞれスルーホールが形成されており、これらの導体端部34a,34bは、他方のコイル導体35の導体端部35a,35bと、並列接続用スルーホール導体57,58を介してそれぞれ電気的に接続されている。これによって、組43を構成する一方のコイル導体34と他方のコイル導体35とは積層方向に並列接続される。更に、他方のコイル導体35の導体端部35bにはスルーホールが形成されており、導体端部35bは、組44のコイル導体36の導体端部36aと、直列接続用スルーホール導体58を介して電気的に接続されている。これによって、組43と組44とは積層方向に直列接続される。   One coil conductor 34 constituting the set 43 is a U-shaped conductor pattern that extends along the edges 10a, 10c, and 10d of the insulator layer 10 and opens at the edge 10b. The other coil conductor 35 constituting the set 43 is formed on the insulator layer 10 on the lower side of the coil conductor 34 and has the same shape as the coil conductor 34 when viewed from the stacking direction. That is, the coil conductor 35 is a U-shaped conductor pattern that extends along the edges 10a, 10c, and 10d of the insulator layer 10 and opens at the edge 10b. The conductor end 34a located on the corner side between the edge 10b and the edge 10c of the insulator layer 10 and the conductor end 34b located on the corner side between the edge 10a and the edge 10b. Each of the conductor end portions 34a and 34b is electrically connected to the other coil conductor 35 via the conductor end portions 35a and 35b and the parallel connection through-hole conductors 57 and 58, respectively. It is connected. As a result, one coil conductor 34 and the other coil conductor 35 constituting the set 43 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 35b of the other coil conductor 35. The conductor end portion 35b is connected to the conductor end portion 36a of the coil conductor 36 of the set 44 and the through-hole conductor 58 for series connection. Are electrically connected. Thereby, the set 43 and the set 44 are connected in series in the stacking direction.

組44を構成する一方のコイル導体36は、絶縁体層10の縁部10b,10c,10dに沿って延在すると共に縁部10aで開口するコ字状の導体パターンである。組44を構成する他方のコイル導体37は、コイル導体36の一枚下側の絶縁体層10に形成されており、積層方向から見てコイル導体36と同一形状を有している。すなわち、コイル導体37は、絶縁体層10の縁部10b,10c,10dに沿って延在すると共に縁部10aで開口するコ字状の導体パターンである。絶縁体層10の縁部10aと縁部10bとの間の角部側に位置する導体端部36a、及び縁部10aと縁部10dとの間の角部側に位置する導体端部36bにはそれぞれスルーホールが形成されており、これらの導体端部36a,36bは、他方のコイル導体37の導体端部37a,37bと、並列接続用スルーホール導体59,60を介してそれぞれ電気的に接続されている。これによって、組44を構成する一方のコイル導体36と他方のコイル導体37とは積層方向に並列接続される。更に、他方のコイル導体37の導体端部37bにはスルーホールが形成されており、導体端部37bは、組45のコイル導体38の導体端部38aと、直列接続用スルーホール導体61を介して電気的に接続されている。これによって、組44と組45とは積層方向に直列接続される。   One coil conductor 36 constituting the set 44 is a U-shaped conductor pattern that extends along the edges 10b, 10c, and 10d of the insulator layer 10 and opens at the edge 10a. The other coil conductor 37 constituting the set 44 is formed on the insulator layer 10 on the lower side of the coil conductor 36 and has the same shape as the coil conductor 36 when viewed from the stacking direction. That is, the coil conductor 37 is a U-shaped conductor pattern that extends along the edges 10b, 10c, and 10d of the insulator layer 10 and opens at the edge 10a. The conductor end 36a located on the corner side between the edge 10a and the edge 10b of the insulator layer 10 and the conductor end 36b located on the corner side between the edge 10a and the edge 10d. Each of the conductor end portions 36a and 36b is electrically connected to the other coil conductor 37 through the conductor end portions 37a and 37b and the parallel connection through-hole conductors 59 and 60, respectively. It is connected. As a result, one coil conductor 36 and the other coil conductor 37 constituting the set 44 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 37 b of the other coil conductor 37, and the conductor end portion 37 b passes through the conductor end portion 38 a of the coil conductor 38 of the set 45 and the series connection through hole conductor 61. Are electrically connected. As a result, the set 44 and the set 45 are connected in series in the stacking direction.

組45を構成する一方のコイル導体38は、絶縁体層10の縁部10a,10b,10cに沿って延在すると共に縁部10dで開口するコ字状の導体パターンである。組45を構成する他方のコイル導体39は、コイル導体38の一枚下側の絶縁体層10に形成されており、積層方向から見てコイル導体38と同一形状を有している。すなわち、コイル導体39は、絶縁体層10の縁部10a,10b,10cに沿って延在すると共に縁部10dで開口するコ字状の導体パターンである。絶縁体層10の縁部10aと縁部10dとの間の角部側に位置する導体端部38a、及び縁部10cと縁部10dとの間の角部側に位置する導体端部38bにはそれぞれスルーホールが形成されており、これらの導体端部38a,38bは、他方のコイル導体39の導体端部39a,39bと、並列接続用スルーホール導体62,63を介してそれぞれ電気的に接続されている。これによって、組45を構成する一方のコイル導体38と他方のコイル導体39とは積層方向に並列接続される。なお、組45のコイル導体39の導体端部39bは、コイル3自体のコイル端3bを構成する。   One coil conductor 38 constituting the set 45 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The other coil conductor 39 constituting the set 45 is formed on the lower insulator layer 10 of the coil conductor 38 and has the same shape as the coil conductor 38 when viewed from the stacking direction. That is, the coil conductor 39 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The conductor end 38a located on the corner side between the edge 10a and the edge 10d of the insulator layer 10 and the conductor end 38b located on the corner side between the edge 10c and the edge 10d. Each of the conductor end portions 38a and 38b is electrically connected to the conductor end portions 39a and 39b of the other coil conductor 39 via the parallel connection through-hole conductors 62 and 63, respectively. It is connected. As a result, one coil conductor 38 and the other coil conductor 39 constituting the set 45 are connected in parallel in the stacking direction. The conductor end 39b of the coil conductor 39 of the set 45 constitutes the coil end 3b of the coil 3 itself.

コイル3のコイル導体30の外層側の絶縁体層10には、第一接続導体21及び第二接続導体23が形成されている。第一接続導体21は、絶縁体層10の縁部10aと縁部10dとの間の角部側の導体端部(他端部)21aから、絶縁体層10の中央位置、すなわちコイル3の周回中心線RL上の導体端部(一端部)21bへ向かって直線状に延びる導体パターンである。第二接続導体23は、第一接続導体21とコイル導体30との間に一枚ずつ絶縁体層10を挟んで配置されており、積層方向から見て第一接続導体21と同一形状を有している。すなわち、第二接続導体23は、絶縁体層10の縁部10aと縁部10dとの間の角部側の導体端部(他端部)23aから、絶縁体層10の中央位置、すなわちコイル3の周回中心線RL上の導体端部(一端部)23bへ向かって直線状に延びる導体パターンである。第一接続導体21の導体端部21bにはスルーホールが形成されており、第二接続導体23の導体端部23bと、第一並列接続用スルーホール導体65を介して電気的に接続されている。また、第一接続導体21の導体端部21aにはスルーホールが形成されており、第二接続導体の導体端部23aと、第二並列接続用スルーホール導体66を介して電気的に接続されている。これによって、第一接続導体21と第二接続導体23とが積層方向に並列接続される。また、第二接続導体23の導体端部23aにはスルーホールが形成されており、コイル3のコイル端3aと、直列接続用スルーホール導体67を介して電気的に接続されている。これによって、第一接続導体21及び第二接続導体23とコイル3とが直列接続される。   A first connection conductor 21 and a second connection conductor 23 are formed on the insulator layer 10 on the outer layer side of the coil conductor 30 of the coil 3. The first connection conductor 21 extends from the conductor end (other end) 21a on the corner side between the edge 10a and the edge 10d of the insulator layer 10 to the center position of the insulator layer 10, that is, the coil 3 This is a conductor pattern extending linearly toward the conductor end (one end) 21b on the circuit center line RL. The second connection conductors 23 are disposed one by one between the first connection conductor 21 and the coil conductor 30, and have the same shape as the first connection conductor 21 when viewed from the stacking direction. doing. In other words, the second connection conductor 23 is connected to the central position of the insulator layer 10, that is, the coil, from the conductor end (other end) 23 a on the corner portion between the edge 10 a and the edge 10 d of the insulator layer 10. 3 is a conductor pattern that extends linearly toward the conductor end (one end) 23b on the third center line RL. A through hole is formed in the conductor end portion 21b of the first connection conductor 21, and is electrically connected to the conductor end portion 23b of the second connection conductor 23 via the first parallel connection through hole conductor 65. Yes. Also, a through hole is formed in the conductor end 21a of the first connection conductor 21, and is electrically connected to the conductor end 23a of the second connection conductor via the second parallel connection through hole conductor 66. ing. Thereby, the first connection conductor 21 and the second connection conductor 23 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end 23 a of the second connection conductor 23, and is electrically connected to the coil end 3 a of the coil 3 through a series connection through hole conductor 67. Thus, the first connection conductor 21 and the second connection conductor 23 and the coil 3 are connected in series.

コイル3のコイル導体39の外層側の絶縁体層10には、第一接続導体22及び第二接続導体24が形成されている。第一接続導体22は、絶縁体層10の縁部10cと縁部10dとの間の角部側の導体端部(他端部)22aから、絶縁体層10の中央位置、すなわちコイル3の周回中心線RL上の導体端部(一端部)22bへ向かって直線状に延びる導体パターンである。第二接続導体24は、第一接続導体22とコイル導体39との間に一枚ずつ絶縁体層10を挟んで配置されており、積層方向から見て第一接続導体22と同一形状を有している。すなわち、第二接続導体24は、絶縁体層10の縁部10cと縁部10dとの間の角部側の導体端部(他端部)24aから、絶縁体層10の中央位置、すなわちコイル3の周回中心線RL上の導体端部(一端部)24bへ向かって直線状に延びる導体パターンである。第二接続導体24の導体端部24bにはスルーホールが形成されており、第一接続導体22の導体端部22bと、第一並列接続用スルーホール導体68を介して電気的に接続されている。また、第二接続導体24の導体端部24aにはスルーホールが形成されており、第一接続導体の導体端部22aと、第二並列接続用スルーホール導体69を介して電気的に接続されている。これによって、第一接続導体22と第二接続導体24とが積層方向に並列接続される。また、コイル3のコイル端3bにはスルーホールが形成されており、第二接続導体24の導体端部24aと直列接続用スルーホール導体70を介して電気的に接続されている。これによって、第一接続導体22及び第二接続導体24とコイル3とが直列接続される。   A first connection conductor 22 and a second connection conductor 24 are formed on the insulator layer 10 on the outer layer side of the coil conductor 39 of the coil 3. The first connection conductor 22 extends from the conductor end (other end) 22a on the corner portion between the edge 10c and the edge 10d of the insulator layer 10 to the center position of the insulator layer 10, that is, the coil 3. This is a conductor pattern extending linearly toward the conductor end (one end) 22b on the circuit center line RL. The second connecting conductors 24 are disposed one by one between the first connecting conductor 22 and the coil conductor 39, and have the same shape as the first connecting conductor 22 when viewed from the stacking direction. doing. In other words, the second connection conductor 24 is connected to the central position of the insulator layer 10, that is, the coil from the conductor end (other end) 24 a on the corner portion between the edge 10 c and the edge 10 d of the insulator layer 10. 3 is a conductor pattern that extends linearly toward the conductor end (one end) 24b on the third center line RL. A through hole is formed in the conductor end 24b of the second connection conductor 24, and is electrically connected to the conductor end 22b of the first connection conductor 22 via the first parallel connection through hole conductor 68. Yes. A through hole is formed in the conductor end 24a of the second connection conductor 24, and is electrically connected to the conductor end 22a of the first connection conductor via the second parallel connection through hole conductor 69. ing. Thus, the first connection conductor 22 and the second connection conductor 24 are connected in parallel in the stacking direction. Further, a through hole is formed in the coil end 3 b of the coil 3, and is electrically connected to the conductor end 24 a of the second connection conductor 24 through the series connection through hole conductor 70. Thus, the first connection conductor 22 and the second connection conductor 24 and the coil 3 are connected in series.

第一接続導体21の外層側の絶縁体層10には、それぞれ引出導体11,12,13が形成される。この引出導体11,12,13は、それぞれの絶縁体層10の中央位置、すなわちコイル3の周回中心線RL上に配置される。最外層の絶縁体層10に設けられる引出導体11は、外部電極4と接触する。引出導体11,12,13にはそれぞれスルーホールが形成され、引出導体用スルーホール導体71を介して、第一接続導体21の導体端部21bと電気的に接続される。これによって、外部電極4と引出導体11,12,13、第一接続導体21、第二接続導体23及びコイル3とが電気的に接続される。   Lead conductors 11, 12, and 13 are formed on the insulator layer 10 on the outer layer side of the first connection conductor 21, respectively. The lead conductors 11, 12, and 13 are arranged at the center position of each insulator layer 10, that is, on the rotation center line RL of the coil 3. The lead conductor 11 provided on the outermost insulator layer 10 is in contact with the external electrode 4. A through hole is formed in each of the lead conductors 11, 12, and 13 and is electrically connected to the conductor end portion 21 b of the first connection conductor 21 via the lead conductor through hole conductor 71. Thereby, the external electrode 4 and the lead conductors 11, 12, 13, the first connection conductor 21, the second connection conductor 23, and the coil 3 are electrically connected.

第一接続導体22の外層側の絶縁体層10には、それぞれ引出導体14,15,16が形成される。この引出導体14,15,16は、それぞれの絶縁体層10の中央位置、すなわちコイル3の周回中心線RL上に配置される。最外層の絶縁体層10の下面に設けられる引出導体14は、外部電極5と接触する。引出導体15,16及び第一接続導体22の導体端部22bにはそれぞれスルーホールが形成され、引出導体用スルーホール導体72を介して、第一接続導体22の導体端部22bと引出導体14,15,16とが電気的に接続される。これによって、外部電極5と引出導体14,15,16、第一接続導体22、第二接続導体24及びコイル3とが電気的に接続される。   In the insulator layer 10 on the outer layer side of the first connection conductor 22, lead conductors 14, 15, and 16 are formed, respectively. The lead conductors 14, 15, and 16 are arranged at the center position of each insulator layer 10, that is, on the circumferential center line RL of the coil 3. The lead conductor 14 provided on the lower surface of the outermost insulator layer 10 is in contact with the external electrode 5. Through-holes are formed in the lead conductors 15 and 16 and the conductor end portions 22b of the first connection conductors 22, respectively, and the conductor end portions 22b of the first connection conductors 22 and the lead-out conductors 14 through the lead-through conductor through-hole conductors 72. , 15, 16 are electrically connected. Thereby, the external electrode 5 and the lead conductors 14, 15, 16, the first connection conductor 22, the second connection conductor 24, and the coil 3 are electrically connected.

各導体パターン及びスルーホール導体は、Agを主成分とした導電性ペーストをフェライトグリーンシート上に印刷して焼成することによって形成される。各導体パターンの焼成後の厚みは、5〜20μm、より好ましくは10〜15μmに設定される。   Each conductor pattern and through-hole conductor are formed by printing and baking a conductive paste mainly composed of Ag on a ferrite green sheet. The thickness of each conductor pattern after firing is set to 5 to 20 μm, more preferably 10 to 15 μm.

図4は、引出導体11,12,13、第一接続導体21、第二接続導体23、引出導体用スルーホール導体71、第一並列接続用スルーホール導体65及び第二並列接続用スルーホール導体66を積層方向と直交する方向から見た図である。図4では、絶縁体層10が省略されている。図4に示すように、各スルーホールはレーザーなどによって形成されるため、引出導体用スルーホール導体71、第一並列接続用スルーホール導体65及び第二並列接続用スルーホール導体66は、積層方向に向かってテーパーをなすような形状となる。また、本実施形態において、引出導体用スルーホール導体71、第一並列接続用スルーホール導体65の中心軸線は、コイル3の周回中心線RLと一致する。すなわち、引出導体用スルーホール導体71の中心軸線と第一並列接続用スルーホール導体65の中心軸線は一致している。なお、図示されない引出導体用スルーホール導体72、第一並列接続用スルーホール導体68の中心軸線もコイル3の周回中心線RLと一致する。   4 shows the lead conductors 11, 12, 13, the first connection conductor 21, the second connection conductor 23, the lead conductor through-hole conductor 71, the first parallel connection through-hole conductor 65, and the second parallel connection through-hole conductor. It is the figure which looked at 66 from the direction orthogonal to the lamination direction. In FIG. 4, the insulator layer 10 is omitted. As shown in FIG. 4, since each through hole is formed by a laser or the like, the lead conductor through hole conductor 71, the first parallel connecting through hole conductor 65, and the second parallel connecting through hole conductor 66 are arranged in the stacking direction. It becomes the shape which makes a taper toward. In the present embodiment, the center axes of the lead conductor through-hole conductor 71 and the first parallel connection through-hole conductor 65 coincide with the center line RL of the coil 3. That is, the central axis of the lead-through conductor 71 and the first parallel connection through-hole conductor 65 coincide with each other. The center axes of the lead conductor through-hole conductor 72 and the first parallel connection through-hole conductor 68 (not shown) also coincide with the center line RL of the coil 3.

引出導体用スルーホール導体71の直径はφ30〜60μmに設定することができ、本実施形態ではφ50μmに設定されている。一方、第一並列接続用スルーホール導体65の直径は、引出導体用スルーホール導体71の直径よりも大きくされており、直径はφ40〜90μmに設定することができる。本実施形態では、φ75μmに設定されている。なお、第一並列接続用スルーホール導体65の直径は、引出導体用スルーホール導体71の直径が小さく設定されたときは、引出導体用スルーホール導体71の直径よりも大きいという関係を満たすならば、本実施形態における寸法よりも小さく設定できる。また、引出導体用スルーホール導体71の直径と第一並列接続用スルーホール導体65の直径は、各コイル導体の導体幅よりも大きく設定される。第二並列接続用スルーホール導体66の直径は、引出導体用スルーホール導体71、第一並列接続用スルーホール導体65の直径よりも小さくされており、直径はφ20〜40μmに設定することができ、本実施形態ではφ30μmに設定されている。なお、本実施形態におけるスルーホール導体の直径とは最狭部(コイル側の端面の直径)の位置における直径を示している。また、本実施形態では、第一接続導体21と第二接続導体23との間の第一並列接続用スルーホール導体65の厚み(図中t1で示される)と、引出導体13と第一接続導体21との間の引出導体用スルーホール導体71の厚み(図中t2で示される)とは、同一の厚さとされており、10〜40μm、より好ましくは20〜30μm程度に設定することができる。なお、図4に示されていない引出導体用スルーホール導体72、第一並列接続用スルーホール導体68及び第二並列接続用スルーホール導体69についても、同様の関係がなりたつ。   The diameter of the through-hole conductor 71 for the lead conductor can be set to φ30 to 60 μm, and in this embodiment is set to φ50 μm. On the other hand, the diameter of the first parallel connection through-hole conductor 65 is larger than the diameter of the lead conductor through-hole conductor 71, and the diameter can be set to 40 to 90 μm. In this embodiment, it is set to φ75 μm. If the diameter of the first parallel connection through-hole conductor 65 is larger than the diameter of the lead conductor through-hole conductor 71 when the diameter of the lead-through conductor 71 is set to be small, the first parallel connection through-hole conductor 65 is satisfied. It can be set smaller than the dimension in the present embodiment. Moreover, the diameter of the through-hole conductor 71 for lead conductors and the diameter of the first parallel connection through-hole conductor 65 are set larger than the conductor width of each coil conductor. The diameter of the second parallel connection through-hole conductor 66 is smaller than the diameter of the lead conductor through-hole conductor 71 and the first parallel connection through-hole conductor 65, and the diameter can be set to 20 to 40 μm. In this embodiment, it is set to φ30 μm. In addition, the diameter of the through-hole conductor in this embodiment has shown the diameter in the position of the narrowest part (diameter of the end surface on the coil side). Further, in the present embodiment, the thickness of the first parallel connection through-hole conductor 65 between the first connection conductor 21 and the second connection conductor 23 (indicated by t1 in the figure), the lead conductor 13 and the first connection The thickness of the through-hole conductor 71 for the lead conductor (indicated by t2 in the figure) between the conductor 21 and the conductor 21 is the same, and can be set to about 10 to 40 μm, more preferably about 20 to 30 μm. it can. The same relationship applies to the lead-through conductor 72, the first parallel connection through-hole conductor 68, and the second parallel connection through-hole conductor 69, which are not shown in FIG.

次に、本実施形態に係る積層型電子部品1の作用・効果を図5、図6、図7を参照して説明する。   Next, operations and effects of the multilayer electronic component 1 according to the present embodiment will be described with reference to FIGS. 5, 6, and 7.

図5は、従来の積層型電子部品100及び従来の積層型電子部品100の接続導体を直線状にした積層型電子部品200の積層圧着時における引出導体、接続導体及び各スルーホール導体の様子を示す概略図であり、(a)は従来の積層型電子部品100についての積層圧着時の様子を示し、(b)は接続導体を直線状にした積層型電子部品200についての積層圧着時の様子を示している。図6は、従来の略L字状の接続導体101及び直線状の接続導体21の形状を示す斜視図であり、(a)が従来の積層型電子部品100の第一接続導体101の形状を示し、(b)が積層型電子部品200及び本実施形態に係る積層型電子部品1の第一接続導体21の形状を示している。図7は、積層圧着時における引出導体用スルーホール導体、第一接続導体、第一並列接続用スルーホール導体、及び第二接続導体の様子を示す概略図であり、(a)は積層型電子部品200の積層圧着時の様子を示し、(b)は本実施形態に係る積層型電子部品1の積層圧着時の様子を示している。なお、図5及び図7は概略図であるため、本発明の作用・効果や従来の積層型電子部品との差異を明確にすると共に説明の理解を容易にするために、各導体の沈み量や食い込み量などは一部誇張ないし省略して示されている。   FIG. 5 shows a state of the lead conductor, the connection conductor, and each through-hole conductor at the time of stacking and pressing of the conventional multilayer electronic component 100 and the multilayer electronic component 200 in which the connection conductor of the conventional multilayer electronic component 100 is linear. FIG. 2A is a schematic diagram illustrating a state in which the multilayer electronic component 100 according to the related art is laminated and crimped, and FIG. Is shown. FIG. 6 is a perspective view showing the shapes of the conventional substantially L-shaped connection conductor 101 and the straight connection conductor 21, and FIG. 6A shows the shape of the first connection conductor 101 of the conventional multilayer electronic component 100. (B) has shown the shape of the 1st connection conductor 21 of the multilayer electronic component 200 and the multilayer electronic component 1 which concerns on this embodiment. FIG. 7 is a schematic view showing a state of the through-hole conductor for the lead conductor, the first connection conductor, the first parallel-connection through-hole conductor, and the second connection conductor at the time of laminated crimping, and (a) is a laminated electron The state at the time of the lamination | stacking crimping | compression-bonding of the component 200 is shown, (b) has shown the mode at the time of the lamination | stacking crimping | compression-bonding of the multilayer electronic component 1 which concerns on this embodiment. 5 and 7 are schematic diagrams, and in order to clarify the operation and effect of the present invention and the difference from the conventional multilayer electronic component, and to facilitate the understanding of the explanation, the sinking amount of each conductor And the amount of bite are partially exaggerated or omitted.

図5(a)及び図6(a)に示すように、従来の積層型電子部品100は、第一接続導体101及び第二接続導体102の形状が異なる点と、第一並列接続用スルーホール導体103の直径が引出導体用スルーホール導体71の直径と同じである点で、本実施形態に係る積層型電子部品1と相違している。第一接続導体101及び第二接続導体102は、図6(a)に示すように、L字状に屈曲した形状を有しており、絶縁体層10の角部側の導体端部101aから縁部に沿って中央まで延び、90°屈曲して絶縁体層10の中央位置の導体端部101bまで延びている。また、図5(b)及び図6(b)に示すように、積層型電子部品200は、従来の積層型電子部品100の略L字状の第一接続導体101及び第二接続導体102を、本実施形態に係る積層型電子部品1と同じく直線状の第一接続導体21及び第二接続導体23に代えたものである。積層型電子部品200は、引出導体用スルーホール導体71と同じ直径を有する第一並列接続用スルーホール導体103が適用されている点で、本実施形態に係る積層型電子部品1と相違している。   As shown in FIGS. 5A and 6A, the conventional multilayer electronic component 100 is different from the first connecting conductor 101 and the second connecting conductor 102 in the shape of the first connecting conductor 101 and the first parallel connecting through hole. This is different from the multilayer electronic component 1 according to the present embodiment in that the diameter of the conductor 103 is the same as the diameter of the through-hole conductor 71 for the lead conductor. As shown in FIG. 6A, the first connection conductor 101 and the second connection conductor 102 have a shape bent in an L shape, and from the conductor end portion 101 a on the corner portion side of the insulator layer 10. It extends to the center along the edge, bends 90 °, and extends to the conductor end 101b at the center of the insulator layer 10. Further, as shown in FIGS. 5B and 6B, the multilayer electronic component 200 includes a first connection conductor 101 and a second connection conductor 102 that are substantially L-shaped in the conventional multilayer electronic component 100. As in the multilayer electronic component 1 according to this embodiment, the linear first connection conductor 21 and the second connection conductor 23 are replaced. The multilayer electronic component 200 is different from the multilayer electronic component 1 according to the present embodiment in that the first parallel connection through hole conductor 103 having the same diameter as the lead conductor through hole conductor 71 is applied. Yes.

積層型電子部品200においては、接続導体を略L字状の形状から、直線状の接続導体とすることによって、直流抵抗を下げることができる構成となっている。しかしながら、接続導体を直線状にした場合、接続導体がコイル3の内周側の領域に入り込んでしまい、コイル特性に影響を与える可能性があるという問題点が考えられる。   In the multilayer electronic component 200, the direct current resistance can be lowered by changing the connection conductor from a substantially L-shaped shape to a linear connection conductor. However, when the connecting conductor is made linear, the connecting conductor enters the region on the inner peripheral side of the coil 3, and there is a possibility that the coil characteristics may be affected.

具体的には、従来の積層型電子部品100のように、接続導体101,102が略L字状である場合、図6(a)においてAに示す部分は内層側のコイル導体に支持されるため、積層圧着時に引出導体11,12,13やスルーホール導体71,103を介して大きな力が作用する位置と、内層側の各コイル導体で支持される位置との間の距離は、絶縁体層10の一辺の約半分の長さとなる(図6中L1で示される)。一方、積層型電子部品200のように、接続導体21,23が直線状である場合、図6(b)における導体端部21aは内層側のコイル導体に支持されるため、積層圧着時に引出導体やスルーホール導体を介して大きな力が作用する位置と、内層側のコイル導体で支持される位置との間の距離は、絶縁体層10の対角線の約半分の長さとなり(図6中L2で示される)、L1よりも長くなる。従って、図5(a)に示す従来の積層型電子部品100に比して、接続導体21,23が直線状である積層型電子部品200の場合、図5(b)に示すように、積層圧着時に引出導体11,12,13や接続導体21,23やスルーホール導体71,103が内層側に大きく沈み易くなる。   Specifically, when the connection conductors 101 and 102 are substantially L-shaped as in the conventional multilayer electronic component 100, the portion indicated by A in FIG. 6A is supported by the coil conductor on the inner layer side. Therefore, the distance between the position where a large force acts via the lead conductors 11, 12, 13 and the through-hole conductors 71, 103 at the time of laminated crimping and the position supported by each coil conductor on the inner layer side is an insulator. The length is about half of one side of the layer 10 (indicated by L1 in FIG. 6). On the other hand, when the connection conductors 21 and 23 are linear like the multilayer electronic component 200, the conductor end 21a in FIG. 6B is supported by the coil conductor on the inner layer side. Further, the distance between the position where a large force acts via the through-hole conductor and the position supported by the coil conductor on the inner layer side is approximately half the length of the diagonal line of the insulator layer 10 (L2 in FIG. 6). It is longer than L1. Therefore, as compared with the conventional multilayer electronic component 100 shown in FIG. 5A, in the case of the multilayer electronic component 200 in which the connecting conductors 21 and 23 are linear, as shown in FIG. At the time of crimping, the lead conductors 11, 12, 13, the connection conductors 21, 23, and the through-hole conductors 71, 103 greatly sink to the inner layer side.

更に、積層型電子部品200においては、第一並列接続用スルーホール導体103が引出導体用スルーホール導体71と同じ直径を有しており、図7(a)に示すように、積層圧着時、第一並列接続用スルーホール導体103が第二接続導体23の導体端部23bに食い込み易くなる。この状態で焼成を行うと、第二接続導体23などが、コイル3の最外層側の位置(図中、一点鎖線CLで示す)よりも内層側に沈むことによって、コイル3の内周側の領域に入り込んだ積層型電子部品が得られる可能性がある。以上によって、従来の積層型電子部品100の接続導体を単に直線状にしただけの積層型電子部品200にあっては、接続導体などがコイル3の内周側の領域に入り込むことによって、コイル特性に影響を与える可能性があった。   Further, in the multilayer electronic component 200, the first parallel connection through-hole conductor 103 has the same diameter as the lead conductor through-hole conductor 71, and as shown in FIG. The first parallel connection through-hole conductor 103 can easily bite into the conductor end 23 b of the second connection conductor 23. When firing is performed in this state, the second connection conductor 23 and the like sink to the inner layer side from the position on the outermost layer side of the coil 3 (indicated by the alternate long and short dash line CL in the figure). There is a possibility of obtaining a multilayer electronic component that has entered the region. As described above, in the multilayer electronic component 200 in which the connection conductor of the conventional multilayer electronic component 100 is simply linear, the connection conductor or the like enters the region on the inner peripheral side of the coil 3, so that the coil characteristics are reduced. There was a possibility of affecting.

一方、本実施形態に係る積層型電子部品1においては、第一接続導体21及び第二接続導体23が、絶縁体層10の角部側の導体端部21a,23aから周回中心線RL側の導体端部21b,23bへ直線状に延びるのみならず、第一並列接続用スルーホール導体65が、引出導体用スルーホール導体71よりも大きい直径を有する構成とされている。   On the other hand, in the multilayer electronic component 1 according to the present embodiment, the first connection conductor 21 and the second connection conductor 23 are located on the circuit center line RL side from the conductor end portions 21a and 23a on the corner portion side of the insulator layer 10. In addition to extending linearly to the conductor end portions 21b and 23b, the first parallel connection through-hole conductor 65 has a larger diameter than the lead conductor through-hole conductor 71.

本実施形態に係る積層型電子部品1によれば、図7(b)に示すように、引出導体用スルーホール導体71に比して、第一並列接続用スルーホール導体65の直径が大きくされているため、第一並列接続用スルーホール導体65が、積層圧着時に引出導体用スルーホール導体71の食い込みを受け止める支持部材として機能する。これによって、図7(a)に示す第一並列接続用スルーホール導体103を適用した場合に比して、第一接続導体21の導体端部21b及び第二接続導体23の導体端部23bの沈みを抑制することができる。更に、第一並列接続用スルーホール導体65が第二接続導体23の導体端部23bに対して当接する部分の面積が大きくなることによって導体端部23bに作用する圧力を分散させることができる。従って、図7(a)に示す第一並列接続用スルーホール導体103を適用した場合に比して、第二接続導体23の導体端部23bに対する第一並列接続用スルーホール導体65の食い込み量を低減することができる。この状態で焼成すると、接続導体がコイル3の内周側の領域に食い込まない積層型電子部品1を得ることができる。以上によって、本実施形態に係る積層型電子部品1によれば、接続導体を直線状とすることで直流抵抗を下げつつも、接続導体がコイル3の内周側の領域に入り込むことを抑制し、信頼性を向上することができる。   According to the multilayer electronic component 1 according to the present embodiment, the diameter of the first parallel connection through-hole conductor 65 is made larger than that of the lead-through conductor through-hole conductor 71 as shown in FIG. Therefore, the first parallel connection through-hole conductor 65 functions as a support member that receives the bite of the lead-out conductor through-hole conductor 71 at the time of laminating and crimping. Accordingly, the conductor end 21b of the first connection conductor 21 and the conductor end 23b of the second connection conductor 23 are compared with the case where the first parallel connection through-hole conductor 103 shown in FIG. Sinking can be suppressed. Furthermore, the pressure acting on the conductor end 23b can be dispersed by increasing the area of the portion where the first parallel connection through-hole conductor 65 abuts against the conductor end 23b of the second connection conductor 23. Therefore, compared with the case where the first parallel connection through-hole conductor 103 shown in FIG. 7A is applied, the amount of penetration of the first parallel connection through-hole conductor 65 with respect to the conductor end 23b of the second connection conductor 23 is increased. Can be reduced. When fired in this state, it is possible to obtain the multilayer electronic component 1 in which the connecting conductor does not bite into the inner peripheral region of the coil 3. As described above, according to the multilayer electronic component 1 according to the present embodiment, the connection conductor is prevented from entering the region on the inner peripheral side of the coil 3 while reducing the DC resistance by making the connection conductor linear. , Reliability can be improved.

本発明は、上述した実施形態に限定されるものではない。   The present invention is not limited to the embodiment described above.

例えば、上述の実施形態では、第一並列接続用スルーホール導体65の厚みと引出導体用スルーホール導体71の厚みは、同一とされていたが、これに代えて、第一並列接続用スルーホール導体65の厚みを、引出導体用スルーホール導体71の厚みよりも薄くしてもよい。図8に示すように、図中t1で示す寸法を図中t2で示す寸法よりも小さくすることができる。このように、第一並列接続用スルーホール導体65の厚みを薄くすることによって、第一並列接続用スルーホール導体65を扁平な形状とすることができ、これによって、第一並列接続用スルーホール導体65が積層圧着時に第二接続導体23に食い込みにくくなるため、第二接続導体23がコイル3の内周側の領域に入り込むことを一層抑制することができる。なお、寸法t1及び寸法t2の範囲は上述の実施形態と同じく、10〜40μm、より好ましくは20〜30μmの範囲で設定することができ、t1<t2の関係を満たすように、各寸法が設定される。   For example, in the above-described embodiment, the thickness of the first parallel connection through-hole conductor 65 and the thickness of the lead conductor through-hole conductor 71 are the same. The thickness of the conductor 65 may be made thinner than the thickness of the lead conductor through-hole conductor 71. As shown in FIG. 8, the dimension indicated by t1 in the figure can be made smaller than the dimension indicated by t2 in the figure. Thus, by reducing the thickness of the first parallel connection through-hole conductor 65, the first parallel connection through-hole conductor 65 can be formed into a flat shape, whereby the first parallel connection through-hole conductor 65 is formed. Since the conductor 65 is less likely to bite into the second connection conductor 23 at the time of laminated crimping, it is possible to further suppress the second connection conductor 23 from entering the region on the inner peripheral side of the coil 3. In addition, the range of the dimension t1 and the dimension t2 can be set in the range of 10-40 micrometers, more preferably 20-30 micrometers similarly to the above-mentioned embodiment, Each dimension is set so that the relationship of t1 <t2 may be satisfied. Is done.

なお、上述の実施形態においては、第一並列接続スルーホール導体が引出導体用スルーホール導体よりも小さい直径を有している構成が、素体2の積層方向の両端側について適用されているが、少なくとも一方の端部側においてのみ適用されているものであっても本発明の効果を奏することができる。   In the above-described embodiment, the configuration in which the first parallel connection through-hole conductor has a smaller diameter than the through-conductor for the lead conductor is applied to both end sides of the element body 2 in the stacking direction. Even if it is applied only to at least one end side, the effect of the present invention can be obtained.

1…積層型電子部品、2…素体、3…コイル、3a,3b…コイル端、4,5…外部電極、10…絶縁体層、11,12,13,14,15,16…引出導体、21,22…第一接続導体、21a,22a…導体端部(他端部)21b,22b…導体端部(一端部)、23,24…第二接続導体、23a,24a…導体端部(他端部)、23b,24b…導体端部(一端部)、30,31,32,33,34,35,36,37,38,39…コイル導体、41,42,43,44,45…複数のコイル導体の組、65,68…第一並列接続用スルーホール導体、66,69…第二並列接続用スルーホール導体、67,70…直列接続用スルーホール導体、71,72…引出導体用スルーホール導体。   DESCRIPTION OF SYMBOLS 1 ... Laminated type electronic component, 2 ... Element body, 3 ... Coil, 3a, 3b ... Coil end, 4, 5 ... External electrode, 10 ... Insulator layer, 11, 12, 13, 14, 15, 16 ... Lead conductor 21, 22 ... first connection conductor, 21 a, 22 a ... conductor end (other end) 21 b, 22 b ... conductor end (one end), 23, 24 ... second connection conductor, 23 a, 24 a ... conductor end (Other end part), 23b, 24b ... conductor end part (one end part), 30, 31, 32, 33, 34, 35, 36, 37, 38, 39 ... coil conductor, 41, 42, 43, 44, 45 ... A set of a plurality of coil conductors, 65 and 68 ... First through-hole conductor for parallel connection, 66 and 69 ... Second through-hole conductor for parallel connection, 67 and 70 ... Through-hole conductor for series connection, 71 and 72 ... Through-hole conductor for conductor.

Claims (2)

複数の矩形状の絶縁体層を積層することによって形成される素体と、
前記絶縁体層を挟んで並列接続される複数のコイル導体の組を、積層方向に複数組直列接続することによって、前記素体内部で螺旋状に形成されるコイルと、
前記積層方向における前記素体の両端部にそれぞれ形成される一対の外部電極と、
少なくとも一方の前記外部電極と前記コイルのコイル端との間に積層され、前記コイル端を積層方向に引き出して前記外部電極と前記コイルとを電気的に接続する引出導体と、
前記引出導体と前記コイルの前記コイル端との間に積層され、前記コイルの周回中心線側に配置される前記引出導体と前記絶縁体層の角部側に配置される前記コイル端とを電気的に接続する第一接続導体と、
前記第一接続導体と前記コイル端との間に積層され、前記第一接続導体と互いに平行をなすと共に並列接続される第二接続導体と、
前記引出導体と前記第一接続導体の一端部とを電気的に接続する引出導体用スルーホール導体と、
前記第一接続導体の前記一端部と前記第二接続導体の一端部とを電気的に接続する第一並列接続用スルーホール導体と、
前記第一接続導体の他端部と前記第二接続導体の他端部とを電気的に接続する第二並列接続用スルーホール導体と、
前記第二接続導体の前記他端部と前記コイル端とを電気的に接続する直列接続用スルーホール導体と、を備え、
前記第一接続導体及び前記第二接続導体は、前記絶縁体層の前記角部側から前記周回中心線側へ直線状に延び、
前記第一並列接続用スルーホール導体は、前記引出導体用スルーホール導体よりも大きい直径を有することを特徴とする積層型電子部品。
An element body formed by laminating a plurality of rectangular insulator layers;
A plurality of sets of coil conductors connected in parallel across the insulator layer are connected in series in the stacking direction to form a coil formed in a spiral shape within the element body,
A pair of external electrodes respectively formed at both ends of the element body in the stacking direction;
A lead conductor that is laminated between at least one of the external electrodes and a coil end of the coil, and draws out the coil end in the lamination direction to electrically connect the external electrode and the coil;
The lead conductor, which is laminated between the lead conductor and the coil end of the coil and is arranged on the side of the center line of the coil, and the coil end arranged on the corner side of the insulator layer are electrically connected. A first connecting conductor that connects electrically,
A second connection conductor laminated between the first connection conductor and the coil end, parallel to the first connection conductor and connected in parallel;
A through-hole conductor for a lead conductor that electrically connects the lead conductor and one end of the first connection conductor;
A first parallel connection through-hole conductor for electrically connecting the one end of the first connection conductor and one end of the second connection conductor;
A second parallel connection through-hole conductor for electrically connecting the other end of the first connection conductor and the other end of the second connection conductor;
A series connection through-hole conductor for electrically connecting the other end of the second connection conductor and the coil end;
The first connection conductor and the second connection conductor extend linearly from the corner side of the insulator layer to the circumferential centerline side,
The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor has a larger diameter than the lead conductor through-hole conductor.
前記第一並列接続用スルーホール導体は、前記引出導体用スルーホール導体の厚みよりも薄くされていることを特徴とする請求項1記載の積層型電子部品。   2. The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor is thinner than a thickness of the lead conductor through-hole conductor.
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