JP5298273B2 - Stage and ball mounting apparatus using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage capable of mounting and transferring a substrate and then overlaying a mask on the substrate in a good condition. <P>SOLUTION: This device includes: a substrate supporting table 42 having a substrate supporting surface 41 supporting a substrate; a first driving mechanism 44 vertically moving the substrate supporting table 42; a frame 52 which has an upper end surface 51 positioned at the periphery of the substrate supporting surface 41 and has a profile of rectangular form; and a second driving mechanism 54 vertically moving the frame 52. A thin plate-like mask is fixed above the place of moving end of a stage 10. A plurality of first suction holes 58, suction-adsorbing the mask when the frame 52 is moved upward with the second driving mechanism 54 under the mask and the upper end surface 51 is brought into contact with the mask, are provided along a pair of facing sides of the upper end surface 51 of the frame 52. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention uses a stage suitable for supporting a substrate when a conductive microball is mounted on the substrate via a mask, or when a flux is applied on the substrate via a mask, and the stage is used. The present invention relates to a ball mounting device.

  Patent Document 1 discloses a ball mounter (microparticle placement device) having a screen printing unit that prints (applies) flux on a workpiece and a ball mounting unit that mounts balls (microparticles) on the workpiece printed with flux. Is disclosed. In the screen printing unit, the flux is applied to the work through a printing mask. In the ball mounting unit, the ball is mounted on the workpiece through the filling mask. In this ball mounter, the screen printing unit and the ball mounting unit are arranged in order in the transport direction, and all processes including flux printing and ball mounting are performed while moving the table on which the workpiece is mounted in the transport direction. Do it automatically.

Patent Document 2 discloses a stage suitable for a ball filling device (ball mounting unit). The stage includes a substrate support surface that supports the other surface of the substrate, and an upper end surface that is positioned around the substrate support surface and that is in contact with the mask and that is variable in a vertical direction with respect to the substrate support surface. Have. According to this stage, since the upper end surface which can be changed in the vertical direction with respect to the substrate support surface is provided around the substrate support surface, even if the outer periphery of the mask is distorted, the influence of the distortion overlaps the substrate. It can be prevented from reaching the area.
JP 2006-173195 A JP 2007-88344 A

  In recent years, devices having electrodes, such as semiconductor devices, tend to have higher-density and miniaturized circuits to be mounted with increasing processing speed and multifunctionality. For this reason, in the process of manufacturing such a device, the conductive balls (conductive particles, fine particles) for electrode formation mounted on the substrate (work) tend to be fine. An example of a conductive ball currently being considered for mounting is a solder ball having a diameter of about 10 to 500 μm.

  A large number of openings formed in a mask for mounting conductive balls on a substrate are used to control the positions at which the conductive balls are mounted (arranged) on the substrate one by one. It is. Therefore, the size of the opening depends on the diameter (diameter) of the conductive ball to be mounted (arranged) on the substrate. At the same time, the thickness of the mask also depends on the diameter of the conductive balls to be placed. The smaller the diameter of the conductive balls to be placed, the thinner the mask for mounting the conductive balls on the substrate. The same applies to the mask for applying the flux on the substrate.

  As these masks become thinner, handling becomes more difficult. When the mask is set on the substrate, distortion occurs in a portion corresponding to the substrate of the mask (a portion overlapping the substrate), which causes various problems. For example, when distortion occurs in a mask for mounting conductive balls on a substrate, a gap is formed between the mask and the substrate, and the conductive balls enter the gap. These balls may become lost balls and may cause problems such as being arranged at a position shifted from a desired position on the substrate or being arranged at an unnecessary position (becomes a double ball). . Further, when distortion occurs in the mask for applying the flux on the substrate, the flux may be applied at a position shifted from a desired position on the substrate.

  One embodiment of the present invention is a stage on which a substrate can be mounted and transferred. This stage has a substrate support table having a substrate support surface for supporting the substrate, a first drive mechanism for moving the substrate support table up and down, and a rectangular outer shape with an upper end surface positioned around the substrate support surface. A shaped frame and a second drive mechanism for moving the frame up and down. In this stage, the frame is moved upward by the second driving mechanism under the thin plate-like mask fixed above the movement destination of the stage so that the upper end surface is in contact with the mask, and at that time, the mask is sucked and sucked to the frame. A plurality of first suction holes are provided along a pair of opposite sides of the upper end surface of the frame.

  According to this stage, the mask fixed in advance to the movement destination is supported by the upper end surface of the frame provided around the substrate support base outside the periphery of the substrate. For this reason, the occurrence of mask distortion inside the frame can be suppressed, and even if the mask contains distortion factors such as minute slack due to the fixed state or temperature change, It is possible to suppress the influence from reaching the area overlapping the substrate.

  Further, according to this stage, a plurality of first suction holes are provided on the upper end surface of the frame located around the substrate support base. Therefore, the mask can be sucked and adsorbed to the stage frame outside the portion corresponding to the substrate. By doing so, in addition to supporting the mask on the upper end surface of the frame outside the periphery of the substrate, the mask is adsorbed to the upper end surface, and the inside of the frame of the mask, that is, the portion corresponding to the substrate, The tension, extension, or inclination can be finely adjusted with reference to the upper end surface of the frame. Therefore, even if there is inclination, distortion, deflection, etc. in the mask in a fixed state, adjustment (readjustment, resetting, or fine adjustment) can be performed with reference to the upper end surface of the stage-side frame. For this reason, the part corresponding to the substrate of the mask fixed to the stage movement destination can be set to a state more closely matched to the substrate conveyed by the stage on the basis of the stage. Therefore, before and after the frame is moved upward by the second drive mechanism, the substrate support is moved upward by the first drive mechanism to bring the substrate into a predetermined position (height, separation position) with respect to the mask. By setting, the substrate can be processed using a portion (a portion overlapping the substrate) corresponding to the substrate of the mask in which the distortion is further suppressed.

  A plurality or a plurality of first suction holes may be provided along each side (four sides) of the frame. According to the observation of the inventors of the present application, rather than providing the first suction holes on the four sides of the frame and adsorbing the mask on the upper end surface of the frame in all four sides, one pair of opposite sides of the upper end surface of the frame ( If one or more rows of first suction holes are provided along two sides and the mask is mainly adsorbed along one pair of sides, distortion will appear in the portion corresponding to the substrate of the mask. Can be suppressed. Therefore, it is preferable to provide the plurality of first suction holes only in a portion along one pair of sides.

Further, according to this stage, the plurality of grooves extending so as to reach the edge of the upper end surface in the direction intersecting the pair of sides provided with the first suction holes are further formed on the upper end surface of the frame. It is provided at a position that does not overlap with the 1 suction hole. When the frame is moved upward by the second driving mechanism under the thin plate-shaped mask fixed above the stage movement destination, and the upper end surface contacts the mask, the mask is sucked and sucked by the plurality of first suction holes. can do. Further, when the frame is moved downward by the second drive mechanism and the upper end surface is separated from the mask, air flows from the plurality of grooves along the plurality of grooves between the upper end surface and the mask. Can be easily removed.

  Furthermore, according to this stage, it is preferable to provide a plurality of second suction holes for supporting the substrate by suction suction on the substrate support surface of the substrate support base. The substrate can be held on the stage with little warpage.

  This stage can be suitably used for a ball mounting apparatus. That is, another aspect of the present invention includes a stage as described above, a flux coating apparatus including a squeegee, a ball filling apparatus on which conductive balls are mounted, a stage, a flux coating mask and a ball filling of the flux coating apparatus. And a moving mechanism that sequentially moves to a lower side of the ball mounting mask of the apparatus. The flux application device applies flux to the substrate through a thin plate-like flux application mask having a plurality of first openings by moving the squeegee. The ball filling apparatus fills a large number of second openings of a thin plate-shaped ball mounting mask having a large number of second openings with conductive balls on the substrate via the ball mounting mask. Is installed. In this ball mounting apparatus, the stage moves the frame upward by the second driving mechanism with respect to each of the flux application mask and the ball mounting mask at the movement destination, and uses the plurality of first suction holes. The operation of adsorbing the masks and moving the frame downward by the second drive mechanism to separate the masks from each mask is repeated.

  According to this ball mounting device, the portions of the flux application mask and the ball mounting mask that face the stage can be reset with respect to the stage frame. Therefore, in the flux application mask, since the influence of the distortion can be suppressed, the flux can be applied to a desired position on the substrate. In addition, since the influence of the distortion can be suppressed in the ball mounting mask, the conductive ball can be mounted on the substrate satisfactorily without causing a stray ball or the like.

  In this ball mounting apparatus, the plurality of first suction holes of the stage are preferably arranged along a direction intersecting with the moving direction of the squeegee of the flux applying apparatus. Compared to the case where conductive balls are mounted on a substrate via a ball mounting mask in a ball filling device, when flux is applied to a substrate via a flux coating mask in a flux coating device, flux application is performed using a squeegee. The mask is pressed strongly. For this reason, when a plurality of first suction holes are arranged along the direction intersecting the moving direction of the squeegee so that tension is applied to the flux applying mask in substantially the same direction as the moving direction of the squeegee, Mask distortion can be efficiently suppressed.

The stage described above , a plurality of processing units for processing the substrate via a thin plate-like mask having a large number of openings, and a moving mechanism for sequentially moving the stage to the lower side of the masks of the plurality of processing units A substrate processing apparatus. The stage moves each of the plurality of processing units by moving the frame upward by the second drive mechanism and sucking it by using the plurality of first suction holes, and moving the frame downward by the second drive mechanism and releasing it. repeat.

One of the different aspects of the present invention is a method of processing a substrate by a substrate processing apparatus. The substrate processing apparatus can be controlled by a control device such as a microcomputer according to the processing method. The substrate processing apparatus includes a stage on which a substrate is mounted, a flux coating apparatus or a ball filling apparatus that processes the substrate through a thin plate-like mask having a large number of openings, and a stage. And a moving mechanism that moves to the lower side of the mask. The stage includes a frame having an upper end surface positioned around the substrate, and a drive mechanism for moving the frame up and down. The frame is provided with a plurality of first sides provided along a pair of opposite sides of the upper end surface. A plurality of grooves extending so as to reach the edge of the upper end surface in a direction intersecting with the pair of sides, and a plurality of grooves provided at positions not overlapping with the plurality of first suction holes; .

  The stage includes a substrate support base having a substrate support surface for supporting the substrate, and a first drive mechanism for moving the substrate support base up and down, and the method is interlocked with moving the frame upward, At the same time or back and forth, the substrate support may be moved upward to place the substrate at a predetermined position (height, separation position) with respect to the mask. According to the method, flux can be applied to the substrate through the mask, or balls can be arranged on the substrate through the mask. Thereafter, the method may include preparing to move the substrate support table downward and move the substrate away from the mask and move to the next processing unit in conjunction with moving the frame downward or simultaneously or back and forth. good.

In the case of including a flux coating apparatus that applies a flux to a substrate via a thin plate-shaped flux coating mask having a plurality of first openings, a method of processing a substrate using the substrate processing apparatus moves a stage. The mechanism moves the flux coating mask to the lower side, and the flux coating mask moves the frame upward by the drive mechanism to attract the flux coating mask using the plurality of first suction holes. And releasing the flux coating mask by moving the frame downward by the driving mechanism to allow air to flow along the plurality of grooves .

In the case of including a ball filling device for mounting conductive balls on a substrate through a thin plate-shaped ball mounting mask having a plurality of second openings, a method for processing a substrate using the substrate processing apparatus includes: The moving mechanism moves the lower side of the ball mounting mask, and the driving mechanism shifts the frame upward with respect to the ball mounting mask to suck the ball mounting mask using the plurality of first suction holes. And releasing the ball mounting mask by moving the frame downward by the driving mechanism to allow air to flow along the plurality of grooves .

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an example of a ball mounting device (mounting device, ball mounting system, ball mounter) 1 in an XY plan view (top view). FIG. 2 schematically shows a part of the ball mounting apparatus 1 of FIG. 1 in an XZ plan view (front view).

  A ball mounting apparatus 1 shown in FIGS. 1 and 2 is an example of a substrate processing apparatus that processes a substrate using a mask, and a predetermined position (desired position) on a substrate (work, workpiece, target) 100. Is a device for mounting a conductive ball B (see FIG. 14C). The ball mounting apparatus 1 of the present example uses a substrate having a nominal 8-inch or 12-inch circular semiconductor wafer (hereinafter simply referred to as a wafer) provided with a plurality of electrodes in a two-dimensional matrix as a substrate 100. A plurality of conductive balls B are two-dimensionally arranged in a matrix on a plurality of electrodes of a wafer 100 to manufacture a substrate to which the conductive balls B are attached.

  The conductive ball B mounted on the electrode of the wafer 100 is used to obtain electrical connection between chips or between a chip and a wiring and / or a printed circuit board when the wafer 100 is cut to form a chip. It functions. The diameter of the conductive ball (conductive ball to be arranged) B mounted by this apparatus is, for example, 1 mm or less, specifically, about 10 to 500 μm. Such a conductive ball B is sometimes referred to as a microball, a microball, a microparticle, or a microparticle. Examples of the conductive ball B include solder balls (balls made of tin (Sn) as a main component, including silver (Ag) and copper (Cu)), metal balls such as gold or silver, and ceramics. This includes balls or plastic balls that have been subjected to a treatment such as conductive plating. In this example, solder balls having a diameter of about 90 μm are arranged (mounted) on the wafer 100 as the conductive balls B.

  The ball mounting apparatus 1 includes a loader / unloader apparatus 2 for loading (supplying) and unloading (accommodating) a wafer 100, a transfer robot 3 for transferring the wafer 100, and a stage 10 for mounting and transferring the wafer 100. A transfer system 4; a pre-alignment device 5 that performs rough alignment (pre-alignment) of the wafer 100; a correction device 6 that corrects the warp of the wafer 100; and a flux application device (flux printing device, screen printing device) that applies flux. ) 7 and a ball filling device 8 on which a plurality of conductive balls B are mounted (arranged). The flux application device 7 is a unit that applies a flux, which is a material for bonding the wafer 100 and the conductive balls B, onto the plurality of electrodes of the wafer 100 via the flux application mask 21. Is a substrate processing unit that processes a substrate through a mask. The ball filling device 8 is a unit for mounting (arranging) a plurality of conductive balls B on a plurality of electrodes of a wafer 100 via a ball mounting mask 31, and a substrate via a mask having a large number of openings. This is one of the substrate processing units for processing. The correction device 6, the flux application device 7, and the ball filling device 8 are arranged side by side in one direction (X direction, transport direction). Operations of the transfer system 4, the correction device 6, the flux application device 7, the ball filling device 8, and the like are controlled by the control unit 200.

  The loader / unloader apparatus 2 includes a first package 2 a for loading (supplying) the wafer 100 and a second package 2 b for unloading (accommodating) the wafer 100. Note that the loader / unloader device 2 may include one package. The transfer robot 3 carries the wafer 100 from the first package 2a of the loader / unloader apparatus 2 above the pre-alignment apparatus 5, conveys the wafer 100 from the pre-alignment apparatus 5 onto the stage 10 of the transfer system 4, The wafer 100 is unloaded from the stage 10 onto the second package 2 b of the loader / unloader apparatus 2.

  The transfer system 4 includes a stage 10 and a stage moving device (moving mechanism) 11. The stage 10 is an XYZθ stage that mounts and holds the wafer 100, moves the wafer 100 up and down in the Z direction, and further rotates the XY plane to adjust in the θ direction. The moving device 11 moves the stage 10 mainly in the X direction. The stage moving device 11 may include a Y-axis table and a Z-axis table in addition to the X-axis table. The stage moving device 11 moves the stage 10 sequentially below the flux application mask 21 and the ball mounting mask 31. In this ball mounting apparatus 1, the moving device 11 mounts the wafer 100 on the stage 10 on the stage 10, and the wafer 100 is mounted on the correction device 6, the flux coating device 7, the ball filling device 8, and the space between them. It can be transferred to any position.

  The wafer 100 is held on the stage 10 (XY plane in this example) in a state in which the warp is corrected by a method such as vacuum suction. An example of a method for holding the wafer 100 on the stage 10 is vacuum suction. However, the mechanism for holding the wafer 100 on the stage 10 is not limited to vacuum suction (suction adsorption), but an electrostatic chuck or the like. It may be a thing, and it is also possible to use a some mechanism together.

  The flux applying device 7 is a screen printing device including a squeegee 22 and a squeegee moving device 23. In this flux coating device 7, a thin plate-shaped flux coating mask 21 having a large number of first openings is superimposed on the wafer 100, and the squeegee 22 is moved to move the wafer through the flux coating mask 21. A flux is applied to 100. The plurality of first openings of the flux application mask 21 are for applying flux to predetermined locations on the wafer 100, and the diameter of each opening corresponds to the size of the conductive ball B to be mounted. It is.

  The ball filling apparatus 8 superimposes a thin plate-like ball mounting mask 31 having a plurality of second openings 31a (see FIG. 12) on the wafer 100, and conducts electricity to the plurality of second openings 31a of the ball mounting mask 31. By filling the conductive ball B, the conductive ball B is mounted on the wafer 100 via the ball mounting mask 31. The plurality of second openings 31 a of the ball mounting mask 31 are for arranging the conductive balls B at predetermined positions on the wafer 100, and the diameters of the respective openings correspond to the sizes of the conductive balls B. It is a thing.

  Specifically, the ball filling device 8 includes two rotary heads 32 and a head moving device 33 that moves these heads 32. These heads 32 move while rotating on the surface (upper surface, XY plane) of the ball mounting mask 31. A large number of conductive balls B are surrounded by the head 32 by the rotation of the head 32 and held on a limited portion of the surface of the ball mounting mask 31. Accordingly, these two heads 32 form two independent portions (moving areas) where the conductive balls B are concentrated on the mask 31.

  The two heads 32 are moved by the head moving device 33 in a state where the distance between them is kept at a predetermined interval. More specifically, the two heads 32 are moved by a predetermined route so that the two moving areas cover the entire region of the surface of the ball mounting mask 31 that is filled with the conductive balls B. (It is moved to make a predetermined trajectory). When the two moving areas formed by the two heads 32 pass through the second opening 31 a of the ball mounting mask 31, the conductive ball B is filled in the second opening 31 a of the ball mounting mask 31, The conductive ball B is mounted on the electrode of the wafer 100 through the mask 31.

  By filling the second opening 31 a of the ball mounting mask 31 with the conductive ball B, the conductive ball B held by the head 32 is consumed. For this reason, the ball filling device 8 may include a ball replenishing device so that the conductive balls B are replenished into the moving area through the head 32 while the head 32 is moved. Further, the number of heads 32 provided in the ball filling device 8 is not limited to two, and may be one or three or more. Furthermore, the head 32 provided in the ball filling device 8 is not limited to the rotary type. The head 32 only needs to be able to move the conductive ball B on the surface of the ball mounting mask 31.

  In this ball mounting apparatus 1, the wafer 100 taken out from the first package 2 a is θ-corrected by the pre-alignment apparatus 5, and then the wafer 100 is moved to the stage 10, and subsequently the warping of the wafer 100 is corrected by the correction apparatus 6. Then, the wafer 100 is fixed to the stage 10. Thereafter, the stage 10 moves to the flux applying device 7 to apply the flux to a predetermined position of the wafer 100, and the stage 10 moves to the ball filling device 8, and the conductive balls B are mounted on the wafer 100. Thereafter, the stage 10 returns to the position of the transfer robot 3, and the wafer 100 on which the conductive balls B are mounted is stored in the second package 2b. A series of these processes are performed fully automatically.

  FIG. 3 shows an example of the stage 10 provided in the ball mounting apparatus 1 of FIG. 1 by an XY plan view (top view). FIG. 4 shows the stage 10 of FIG. 3 in an exploded perspective view. The stage 10 supports (supports) the wafer 100 and moves the wafer 100 up and down in the Z direction, and the base unit 50 that supports the substrate support unit 40 and has a function as a θ table. Have The base unit 50 further includes a frame 52 that supports (supports) the mask (the flux application mask 21 and the ball mounting mask 31), and a function of moving the frame 52 up and down in the Z direction. Also works.

  The substrate support unit 40 includes a substrate suction jig (wafer suction jig, substrate support base) 42 having a flat substrate support surface 41 that supports the wafer 100, and a substrate suction jig base on which the substrate suction jig 42 is mounted. 43, a first drive mechanism 44 that moves the substrate suction jig 42 up and down by moving the substrate suction jig base 43 up and down, and a first support member to which the first drive mechanism 44 is fixed (First support frame) 45 and lift pins 46 fixed to the first support frame 45 are provided. The lift pins 46 are formed with suction holes 46a for sucking the wafer 100 therein. The suction hole 46a is connected (communication) with a vacuum pump (vacuum generator, not shown). The hollow lift pins (wafer suction pins, substrate suction pins) 46 can separate (lift relatively) the wafer 100 from the substrate support surface 41 and can support the wafer 100 by suction.

  The substrate suction jig 42 functions as a platform (platform) for mounting and supporting the wafer 100. The substrate suction jig 42 has a disk shape, and its upper surface serves as a substrate support surface 41 that supports the lower surface of the wafer 100. The substrate suction jig 42 has an open end on the substrate support surface 41 and is provided with a plurality of suction holes (second suction holes) 47 for holding (supporting) the wafer 100 by suction suction. Each of the plurality of second suction holes 47 is connected (communicated) with a first vacuum pump (vacuum generator, not shown). A negative pressure is applied between the substrate support surface 41 processed flat by the vacuum generator and the lower surface of the wafer 100 through the plurality of second suction holes 47, and the lower surface of the wafer 100 is brought into close contact with the substrate support surface 41. By this suction and suction, the movement of the wafer 100 can be synchronized with the movement of the stage 10, and the flatness of the upper surface of the wafer 100 can be increased. Further, near the center of the substrate support surface 41 of the substrate suction jig 42, there are provided a plurality of openings 48 into which a plurality of lift pins 46 arranged at positions symmetrical with respect to the center project and sink.

  The substrate suction jig 42 is formed of a magnetic material at least in the center. The substrate suction jig 42 is magnetically placed on the substrate suction jig base 43 by a magnet 81 (see FIGS. 7 and 8). Is held in. In the center of the substrate suction jig base 43, a central hole 43a into which the protrusion 42a (see FIG. 11) of the substrate suction jig 42 enters is provided. The lift pin 46 is disposed so as to protrude upward from the center hole 43a. Therefore, when the substrate suction jig 42 is lowered in conjunction with the substrate suction jig base 43, the lift pins 46 protrude upward from the substrate support surface 41 through the openings 48.

  In the substrate support unit 40, the substrate suction jig base 43 moves up and down by operating the first drive mechanism 44, and the substrate suction jig 42 moves in synchronization with the substrate suction jig base 43. Move up and down. When the substrate suction jig base 43 and the substrate suction jig 42 are lowered, the lift pins 46 protrude upward, and the wafer 100 held by the robot arm 3 can be mounted on the lift pins 46. When the substrate suction jig base 43 and the substrate suction jig 42 are raised to a predetermined height (the height at which the lift pins 46 do not protrude from the substrate suction jig 42), the wafer 100 is placed on the substrate support surface 41 of the substrate suction jig 42. Can be installed. Further, by sucking air from the plurality of second suction holes 47, the wafer 100 can be sucked and sucked to the substrate support surface 41 of the substrate suction jig 42 with little warpage. Further, when the substrate suction jig base 43 and the substrate suction jig 42 are lowered, the lift pins 46 protrude above the substrate support surface 41 through the center hole 43a and the opening 48 of the substrate suction jig 42, and the lift pins 46 cause the wafer to move. 100 is supported. Therefore, the wafer 100 can be removed from the substrate suction jig 42 and removed by the robot arm 3.

  The base unit 50 includes a second support member (second support frame) 55 supported by the moving device 11 and a direct drive motor (DD motor) 56 fixed to the second support frame 55. . A first support frame 45 of the substrate support unit 40 is mounted on or connected to the direct drive motor 56. The direct drive motor 56 functions as a θ table. In other words, the θ position of the wafer 100 mounted on the substrate support unit 40 is adjusted by rotating the substrate support unit 40 by the direct drive motor 56. The base unit 50 further includes a mask support jig (frame) 52 having a rectangular outer shape having an upper end surface 51 positioned around the substrate support surface 41, and a mask support jig base on which the mask support jig 52 is mounted. 53 and a second drive mechanism 54 that moves the mask support jig (mask support frame) 52 up and down by moving the mask support jig base 53 up and down. The second drive mechanism 54 is fixed to the second support frame 55.

  The mask support frame 52 functions to support the destination mask on the stage 10 side. That is, the upper end surface 51 of the mask support frame 52 is in contact with the mask 21 and the mask 31 at the movement destination, thereby supporting the mask 21 and the mask 31 on the outside of the wafer 100, respectively. The mask support frame 52 is mechanically held (fixed) in a detachable state on the mask support jig base 53 by a mask support mounting jig 57. When the substrate suction jig 42 changes in accordance with the size and shape of the wafer 100, a mask support frame 52 that matches the shape of the substrate suction jig 42 can be mounted (replaced) on the base 53.

  The mask support frame 52 is provided with a plurality of suction holes (first suction holes) 58 whose open ends appear on the upper end surface 51. At the destination of the stage 10, the mask support frame 52 is moved upward by the second drive mechanism 54 under the thin plate-like mask 21 or 31 fixed above the stage 10, and the upper end surface 51 is in contact with the mask 21 or 31. Then, air is sucked from between the upper end surface 51 and the lower surface of the mask 21 or 31 by a plurality of suction holes (first suction holes) 58. As a result, the mask 21 or 31 can be sucked and sucked to the upper end surface 51 of the mask support frame 52.

  In the mask support frame 52, the plurality of first suction holes 58 are provided only in portions along a pair of opposite sides (one pair of sides) of the upper end surface 51 of the mask support jig 52. . In this example, the direction connecting the one pair of sides 52 a and 52 b is the moving direction (Y direction) of the squeegee 22 of the flux applying device 7. The plurality of first suction holes 58 are arranged in the direction in which one pair of sides 52a and 52b extends, that is, in the X direction. For this reason, the plurality of first suction holes 58 are arranged along a direction that intersects the moving direction (Y direction) of the squeegee 22 of the flux applying device 7, for example, a direction that intersects perpendicularly (X direction). Each of the plurality of first suction holes 58 is connected to a second vacuum pump (vacuum generator, not shown).

  Further, the mask support frame 52 is a groove recessed with respect to the upper end surface 51 and intersects with a pair of sides provided with the plurality of first suction holes 58, for example, a direction orthogonal (Y direction). In addition, a plurality of grooves (air diffusion grooves) 59 extending so as to reach the edge of the upper end surface 51 are provided at positions that do not overlap with the plurality of first suction holes 58. The air diffusion groove 59 is open upward and reaches the edges 52a and 52b. Even when the mask 21 or 31 is in close contact with the upper end surface 51, the groove 59 communicates with the outside air.

  In this stage 10, the mask support frame 52 is moved upward by the second drive mechanism 54 under the thin plate-like mask 21 fixed above the movement destination of the stage 10, and the upper end surface 51 is in contact with the mask 21. The first suction hole 58 can suck and suck the mask 21 to the upper end surface 51. At the same time or before and after, the wafer 100 can be set at a predetermined height with respect to the mask 21 by moving the substrate suction jig 42 upward by the first drive mechanism 44. The wafer 100 may be brought into close contact with the back surface of the mask 21, or the upper surface of the wafer 100 may be set at a position separated from the back surface of the mask 21 by a minute distance.

  When the processing of the wafer 100 using the mask 21 is completed, the mask support frame 52 is moved downward by the second drive mechanism 54. At this time, air flows between the upper end surface 51 and the back surface of the mask 21 from a plurality of air diffusion grooves 59 extending in the direction of the wafer 100 along the upper end surface 51. Therefore, even at a position close to the wafer 100 away from the ends 52a and 52b of the upper end surface 51, the peeling can be performed under substantially the same conditions as the ends 52a and 52b of the upper end surface 51. For this reason, the mask 21 can be easily removed from the mask support frame 52. Further, when the mask support frame 52 is lowered and removed from the mask 21, the upper end surface 51 and the mask 21 are in close contact with each other, and the mask 21 is pulled downward to apply extra stress to the mask 21 to distort the mask 21. It is possible to suppress deformation.

  When moving the mask support frame 52 downward, air may be blown out from the suction holes 58 to release the contact state. However, when sucking, the mask 21 is supported by the upper end surface 51, so even if it is deformed, it only has a shape along the upper end surface 51. On the other hand, when the air is blown out, deformation of the mask 21 cannot be predicted. Therefore, as in this example, it is desirable to provide a plurality of air introduction grooves 59 so that the mask 21 is naturally detached from the mask support frame 52. At the same time as or before or after lowering the mask support frame 52 by the second drive mechanism 54, the substrate suction jig 42 is lowered by the first drive mechanism 44 to move the wafer 100 away from the mask 21, and the stage 10 is moved. Prepare. Although the coating mask 21 has been described above, the stage 10 operates in the same manner with respect to the mounting mask 31.

  In this stage 10, the substrate suction jig 42 is moved up and down by the first drive mechanism 44, and the mask support jig 52 is moved up and down independently of the substrate suction jig 42 by the second drive mechanism 54. Move to. FIG. 5 shows the base unit 50 in an XY plan view (top view) with the mask support frame 52 removed. FIG. 6 shows the base unit 50 in a YZ plan view (side view) with the mask support frame 52 removed.

  The second drive mechanism 54 includes four slide units 61 provided at the four corners of the mask support jig base 53, and servo motors 62 for rotating and driving the four slide units 61 by the drive belt 69. . Each of the four slide units 61 includes a ball screw 65 having a screw shaft 63 and a nut 64, a pulley 66 provided at the lower end of the screw shaft 63, a slider 67 fixed to the nut 64, and a slider 67. And a slide head 68 for supporting the slide. Each slide unit 61 is fixed to the second support frame 55 via a fixing member 61a. The nut 64 is connected to the mask support jig base 53 via a slider 67. A belt 69 is stretched between the pulley 66 of each slide unit 61 and the pulley 62b connected to the rotation shaft 62a of the servo motor 62.

  One of the four slide units 61 is provided with an upper limit sensor 71, an origin sensor 72, and a lower limit sensor 73 for detecting the position of the mask support jig 52. As each of the sensors 71, 72, and 73, for example, an optical sensor that detects laser light through a slit can be used.

  When the servo motor 62 is rotated, the screw shafts 63 of the ball screws 65 of the four slide units 61 connected by the belt 69 rotate in synchronization. For this reason, the four slide units 61 arranged at the four corners move the mask support jig base 53 synchronously upward or downward at the four corners by the same amount at the same time. Therefore, the mask support jig base 53 and the mask support frame 52 are moved by the second drive mechanism 54 including the four slide units 61 and the servo motor 62 that can move the four slide units 61 in synchronization. It can move up and down without changing its posture and without tilting.

  In the stage 10, the same configuration as that of the second drive mechanism 54 is adopted for the first drive mechanism 44 that moves the substrate suction jig base 43 up and down. That is, as shown in FIG. 4, the first drive mechanism 44 also includes four slide units 61, which are driven synchronously by a servo motor (not shown) via a belt 69. Therefore, the substrate suction jig base 43, the substrate suction jig 42, and the wafer 100 can be moved up and down without changing the posture and without being inclined.

  FIG. 7 shows the substrate support unit 40 in an XY plan view (top view) with the first drive mechanism 44 omitted. FIG. 7 shows a state in which the substrate suction jig 42 is fixed (locked) to the substrate suction jig base 43. FIG. 8 shows a cross-sectional view taken along line VIII-VIII in FIG. FIG. 9 shows the substrate support unit 40 in an XY plan view (top view) with the first drive mechanism 44 omitted. FIG. 9 shows a state in which the substrate suction jig 42 is free with respect to the substrate suction jig base 43. FIG. 10 shows a cross-sectional view taken along line XX in FIG. FIG. 11 is a YZ plan view (side view) showing a state in which the substrate suction jig 42 is removed from the substrate suction jig base 43 in the substrate support unit 40.

  The substrate suction jig 42 is fixed to the substrate suction jig base 43 by a magnet 81. Further, by inserting and removing a shielding plate 84a that shields magnetic force between the magnet 81 and the substrate suction jig 42, the substrate suction jig 42 can be detached from the substrate suction jig base 43 with one touch. Yes.

  A magnet 81 is fixed to the lower side of the central portion of the substrate suction jig base 43 by a magnet mounting part 82. The lower side of the magnet 81 is covered with a magnet lid 83. A protruding portion 42a protruding downward is provided at the center of the substrate suction jig 42, and the disc 42b constituting the lower end thereof is a magnetic body. When the substrate suction jig 42 is placed on the substrate suction jig base 43, the protruding portion 42 a faces the magnet 81 through the central hole 43 a at the center of the substrate suction jig base 43. Between the protrusion 42 a and the magnet 81, there is provided a slide member 84 that has a shielding plate (shielding portion) 84 a made of a magnetic material and slides with respect to the substrate suction jig base 43. A slider 85 is attached to the slide member 84 and slides in the X direction along a rail 86 attached to the substrate suction jig base 43. A lever 88 is attached to the slide member 84 via a lever attachment part 87. The slide member 84 is provided with a lift pin escape groove 84b so that the slide member 84 does not interfere with the lift pin 46 when the slide member 84 is slid to the position shown in FIGS.

  The slide member 84 is provided with a jig removal prevention part 89. By sliding the slide member 84 to the position shown in FIGS. 7 and 8, the jig removal preventing component 89 enters the lock groove 90 (see FIG. 11) provided in the substrate suction jig 42. Further, by sliding the slide member 84 to the position shown in FIGS. 9 and 10, the jig removal prevention component 89 is detached from the lock groove 90 provided in the substrate suction jig 42. Further, the substrate suction jig 42 includes a handle portion 92 for gripping when the substrate suction jig 42 is detached from the substrate suction jig base 43. The lever mounting part 87 includes a free / lock positioning pin 93 for positioning the lock position and the free position. Holes (not shown) into which the free / lock positioning pins 93 are fitted are formed at positions corresponding to the lock position and the free position of the substrate suction jig base 43.

  In the stage 10, the lever 88 is held and the slide member 84 is slid horizontally to the position shown in FIGS. 7 and 8, whereby the shielding plate 84 a of the slide member 84 is retracted from above the magnet 81. By doing so, the disc 42b and the magnet 81 constituting the protruding portion 42a of the substrate chucking jig 42 are magnetically coupled. At the same time, the jig removal preventing component 89 is inserted into the lock groove 90. Therefore, the substrate suction jig 42 is fixed (locked) to the substrate suction jig base 43 by the magnet 81, and the substrate suction jig 42 and the substrate suction jig base 43 are integrated so that they can move synchronously. .

  Holding the lever 88, the slide member 84 is horizontally slid to the position shown in FIGS. 9 and 10 in the direction opposite to that shown in FIGS. By sliding the lever 88 until it reaches the free position, the shielding plate 84 a enters between the protrusion 42 a of the substrate suction jig 42 and the magnet 81. Thereby, the magnetic force of the magnet 81 is shielded. At the same time, the jig removal preventing part 89 is detached from the lock groove 90. In this way, the substrate suction jig 42 can be removed from the substrate suction jig base 43. Therefore, the substrate suction jig 42 can be replaced.

  When the size, thickness, or shape of the wafer 100 transferred by the stage 10 is different, it is necessary to replace the substrate suction jig 42 corresponding to each wafer 100. Further, when the shape of the substrate suction jig 42 changes, it is also necessary to replace the mask support frame 52 that covers the outer peripheral portion thereof. The substrate suction jig 42 can be easily exchanged with the substrate support unit 40 of the stage 10 by one touch by the mounting mechanism of the substrate suction jig 42 as described above.

  The mask support frame 52 can be removed from the mask support jig base 53 by turning off the mask support attachment jig 57 of the base support unit 50. Then, by putting different mask support frames 52 on the mask support jig base 53 and turning on the mask support mounting jig 57, the mask support frame 52 can be fixed to the mask support jig base 53, and these can be moved together. It becomes like this.

  A method for attaching and detaching the substrate suction jig 42 and the mask support jig 52 will be described. When removing the board | substrate adsorption | suction jig | tool 42 and the mask support jig | tool 52, it carries out as follows.

  First, the lever 88 is slid until it reaches the free position, that is, the lever 88 is moved to the right side in the state shown in FIGS. 7 and 8, and the state shown in FIGS. 9 and 10 is obtained. By doing so, the jig removal prevention component 89 comes out of the lock groove 90. Further, the shielding plate 84a enters between the magnet 81 and the disc 42b, and the magnetic lines of force of the magnet 81 do not reach the disc 42b. As a result, the substrate suction jig 42 comes out of the substrate suction jig base 43, so that it has the handle 92 and moves the substrate suction jig 42 upward to remove it. Next, the mask support mounting jig 57 is turned off (free), and the mask support frame 52 is removed from the mask support jig base 53. Thus, the substrate suction jig 42 and the mask support jig 52 can be removed.

  When attaching the substrate suction jig 42 and the mask support jig 52, the following is performed. First, the mask support frame 52 having a shape suitable for the substrate suction jig 42 is placed on the mask support jig base 53, and the mask support mounting jig 57 is turned on (closed) and fixed. Next, it is confirmed that the lever 88 is in the free position. The protrusion 42 a of the substrate suction jig 42 is inserted into the center hole 43 a of the substrate suction jig base 43, and the substrate suction jig 42 is placed on the substrate suction jig base 43. At this time, since the magnet 81 is shielded by the shielding plate 84a, the substrate suction jig 42 is not inadvertently attracted. The substrate suction jig 42 is rotated, and the positions of the lock groove 90 and the jig removal prevention component 89 are aligned. The lever 88 is slid until it reaches the locked position, that is, the lever 88 is moved to the left in the state shown in FIGS. 9 and 10 to obtain the state shown in FIGS. By doing so, the jig removal prevention component 89 is related to the lock groove 90. Further, since the shielding plate 84a is retracted from between the magnet 81 and the disc 42b, the disc 42b and the magnet 81 are magnetically attracted. Thereby, the substrate suction jig 42 is fixed on the substrate suction jig base 43. Thus, the substrate suction jig 42 and the mask support jig 52 can be set.

  Next, the attachment mechanism of the ball mounting mask 31 will be described. FIG. 12 schematically shows a state in which the ball mounting mask 31 is set in the ball filling device 8 provided in the ball mounting device 1 of FIG. 1 by an XY plan view (top view). FIG. 13 schematically shows a state in which the ball mounting mask 31 is set in the ball filling device 8 provided in the ball mounting device 1 of FIG. 1 by an XZ plan view (front view).

  The ball mounting mask 31 is fixed to the lower part of the mask frame 111 via a resin sheet 112 to form a mask unit 113. The space between the mask frame 111 and the sheet 112 and the space between the sheet 112 and the ball mounting mask 31 are fixed by an adhesive or the like. A handle 114 is provided on the front side (front side) of the mask frame 111. The mask unit 113 is attached to a mask table 115 provided in the ball filling device 8. The mask table 115 is fixed with respect to the base frame of the ball mounting apparatus 1, and by attaching the mask unit 113 to the mask table 115, the X, Y, and Z directions of the mask 31 of the mask unit 113 in the ball mounting apparatus 1. And the orientation of the θ direction are determined. A pair of mask frame guides 116 is provided under the mask table 115, and the mask unit 113 can move in the front-rear direction (Y direction) along the mask frame guide 116. When pulling out the mask unit 113, the handle 114 may be used to pull it to the front side (front side).

  Further, a degree stop 117 is provided on the back side of the mask frame guide 116. Since the mask unit 113 is stopped by the degree stop 117, the position of the mask unit 113 in the front-rear direction (Y direction) is determined. Note that the position of the mask unit 113 in the left-right direction (X direction) is determined by the mask frame guide 116.

  Further, in order to sufficiently fix the mask unit 113, air cylinders 118 are provided at positions corresponding to the four corners of the mask unit 113. When the air cylinder 118 is turned on, the mask frame 111 is pressed against the mask frame guide 116 by the air cylinder 118, the mask frame 111 is sandwiched between the air cylinder 118 and the mask frame guide 116, and the mask frame 111 becomes the mask table 115. Fixed against. Thereby, the position of the mask unit 113 in the vertical direction (Z direction) is determined.

  The attachment mechanism of the flux application mask 21 is basically the same as the attachment mechanism of the ball mounting mask 31. However, when applying the flux, the squeegee 22 is moved from the rear side to the front side (pressed from the Y direction plus side to the Y direction minus side) while being pressed against the flux application mask 21. The coating mask 21 easily moves to the front side (minus side in the Y direction). For this reason, the flux coating device 7 is provided with two toggle clamps on the front side of the mask frame guide, whereby the mask unit (flux coating mask 21) is fixed.

  Hereinafter, the process of mounting the conductive balls B on the wafer 100 in the ball mounting apparatus 1 will be further described.

  The wafer 100 taken out from the first package 2a of the loader / unloader apparatus 2 is transferred to the pre-alignment apparatus 5 by the transfer robot 3, and the orientation flat or notch alignment (rough alignment of θ is performed in the pre-alignment apparatus 5. ) Is performed. The wafer 100 on which the coarse alignment of θ has been performed is set on the substrate support surface 41 of the stage 10 from the pre-alignment apparatus 5 by the transfer robot 3. The first vacuum pump is operated to suck and adsorb the wafer 100 onto the substrate support surface 41 of the stage 10.

  First, the stage 10 is moved to the correction device 6. In the correction device 6, the warp correction jig 6 a (see FIGS. 1 and 2) presses the upper surface of the wafer 100 toward the substrate support surface 41. As a result, the lower surface of the wafer 100 and the substrate support surface 41 are in close contact with each other, and the warpage of the wafer 100 is corrected. However, since the warpage of the wafer 100 almost returns to the initial warpage when the vacuum suction disappears, the deformation due to the warpage correction is temporary for the ball mounting process and is not permanent. Thereafter, the stage 10 is moved to the flux application device 7 to apply the flux in a predetermined pattern on the upper surface of the wafer 100. Further, the stage 10 is moved to the ball filling device 8 and the conductive balls B are mounted on the upper surface of the wafer 100 in a predetermined pattern.

  14A to 14C show the operation of the stage 10 in the process of mounting the conductive balls B on the wafer 100 in the ball filling apparatus 8. Since the operation of the stage 10 in the process of applying the flux to the wafer 100 in the flux applying device 7 is substantially the same as the operation in the ball filling device 8, the description thereof is omitted.

  First, as shown in FIG. 14A, the stage 10 is moved under the ball mounting mask 31 of the ball filling device 8 by the moving mechanism 11. Next, as shown in FIG. 14B, the mask support frame 52 is moved upward by the second drive mechanism 54. In a state where the upper end surface 51 of the mask support frame 52 is in contact with the ball mounting mask 31, the second vacuum pump is operated to suck and adsorb the ball mounting mask 31 to the upper end surface 51 of the mask support frame 52. In this way, by setting the ball mounting mask 31 with reference to the upper end surface 51 of the mask support frame 52 (re-stretching or re-stretching), the portion surrounded by the mask support frame 52 (on the wafer 100). Corresponding portions) of the mask 31 can be prevented from being distorted, and the inclination of the mask 31 at that portion can be finely adjusted in accordance with the upper end surface 51 of the mask support frame 52. In particular, since tension is applied to the portion of the mask 31 corresponding to the wafer 100 along the Y direction, distortion of the portion of the ball mounting mask 31 corresponding to the wafer 100 (the portion overlapping the wafer 100) is corrected.

  At the same time as or before and after FIG. 14B, the substrate suction jig 42 is moved upward by the first drive mechanism 44 to set the wafer 100 at a predetermined position with respect to the ball mounting mask 31. For example, the upper surface of the wafer 100 and the back surface of the ball mounting mask 31 are overlapped, or a minute gap of about several μm to several tens of μm is opened between the upper surface of the wafer 100 and the back surface of the ball mounting mask 31. To.

  Since the ball mounting mask 31 is fixed, the value of the Z coordinate of the lower surface of the ball mounting mask 31 is known. Therefore, the amount of movement of the second drive mechanism 54 can be set in advance so that the upper end surface 51 of the mask support jig 52 moves to the value of the Z coordinate on the lower surface of the ball mounting mask 31. . Similarly, the movement amount of the first drive mechanism 44 can be set in advance so that the upper surface of the wafer 100 moves to the value of the Z coordinate of the lower surface of the ball mounting mask 31. Thereby, on the lower surface of the ball mounting mask 31, the upper surface of the wafer 100 set on the substrate support surface 41 and the upper end surface 51 of the mask support jig 52 can be matched. That is, the upper surface of the wafer 100 and the upper end surface 51 of the mask support jig 52 can theoretically be set to have no step. Therefore, although there may actually be minute errors in various parts, the step between the upper surface of the wafer 100 and the upper end surface 51 of the mask support jig 52 can be set to a minute step that does not cause a problem.

  As shown in FIG. 14C, when the mask support frame 52 and the wafer 100 are set at predetermined positions, the wafer 100 is processed through the mask 31. In this case, the conductive ball B is held on the surface of the ball mounting mask 31 by the head 32 so that the moving area covers the entire area of the surface of the ball mounting mask 31 that is filled with the conductive ball B. Then, it is moved by a predetermined route. As a result, the conductive ball B is filled in the second opening 31 a of the ball mounting mask 31 and mounted on the electrode of the wafer 100. The ball filling apparatus 8 of this example includes a rotary head 32, and the head 32 moves while rotating the surface of the mask 31 while holding a large number of conductive balls B on the lower side. Therefore, the conductive balls B are sequentially transferred into the openings (apertures, second openings) 31 a of the ball mounting mask 31 along the trajectory of the head 32 and are arranged at predetermined positions on the wafer 100.

  When the processing on the wafer 100 via the mask 31 is completed, the second vacuum pump is stopped and the mask support frame 52 is lowered. When the upper end surface 51 is separated from the ball mounting mask 31, air flows between the upper end surface 51 and the mask 31 from the plurality of air diffusion grooves 59, so that the mask support frame 52 can be easily removed from the ball mounting mask 31. In addition, the mask 31 can be peeled without unnecessarily applying a force. Simultaneously with or before and after the mask support frame 52, the substrate suction jig 42 is lowered to return to the state shown in FIG. Note that when the suction between the mask support frame 52 and the mask 31 disappears and when the mask support frame 52 descends and moves away from the mask 31, the mask 31 moves or vibrates so that the mounted conductive If there is a possibility of causing a problem such as moving the ball, it is preferable to lower the substrate suction jig 42 first, and then stop and lower the suction of the mask support frame. By separating the mask support frame 52 and the wafer 100 on which the substrate suction jig 42 is mounted from the mask 31, the stage 10 can be moved to the next processing unit.

  For example, in the flux application device 7 in which processing is performed prior to the ball filling device 8, the same operation as described above is performed on the mask 21, and then the stage 10 moves to the ball filling device 8, Operation is performed. That is, in the flux application device 7 that applies the flux to the wafer 100 through the thin plate-shaped flux application mask 21 having a large number of first openings, the stage 10 is moved by the moving mechanism 11 to the flux application mask 21. A step of moving downward, a step of moving the frame 52 upward by the drive mechanism 54 with respect to the flux application mask 21, and adsorbing the flux application mask 21 using the plurality of first suction holes 58; The operation including the step of moving the frame 52 downward by 54 to release the flux application mask 21 is performed, and the wafer 100 is processed. Such a processing method can be automatically controlled by the control unit 200 (see FIG. 2) mounted on the ball mounting apparatus 1. An example of the control unit 200 is a microcomputer or a personal computer.

  That is, in this ball mounting apparatus 1, the stage 10 moves the mask support jig 52 upward by the second drive mechanism 54 with respect to each of the flux application mask 21 and the ball mounting mask 31. Each of the masks 21 or 31 is sucked using the suction holes 58, and the operation of moving the mask support jig 52 downward by the second drive mechanism 54 to separate it from the respective masks 21 or 31 is repeated.

  The stage 10 is returned to the position of the correction device 6, the first vacuum pump is stopped, and the substrate suction jig 42 is lowered. Accordingly, since the lift pins 46 protrude from the substrate suction jig 42, the wafer 100 is supported by the lift pins 46 and is removed from the substrate suction jig 42. The wafer 100 on which the ball is mounted is transferred (unloaded) to the second package 2 b of the loader / unloader device 2 by the transfer robot 3. Thus, the mounting process of the conductive ball B on the wafer 100 is completed.

  As described above, according to the stage 10 of the present embodiment, the respective masks 21 and 31 are sucked and supported by the upper end surface 51 of the mask support frame 52 mounted on the stage 10 in the vicinity (periphery) of the wafer 100. The wafer 100 is again supported with reference to the stage 10 on which the wafer 100 is mounted and transferred. That is, the respective masks 21 and 31 are adsorbed and supported by the first suction holes 58 provided along a pair of opposite sides of the upper end surface 51 of the mask support frame 52, so that the mask 21 is based on the upper end surface 51. And 31 are set, and the inner portion supported by the mask support frame 52 is set so as to be substantially horizontal with respect to the wafer 100 with respect to the mask support frame 52.

  In the ball mounting apparatus 1, these masks 21 and 31 are fixed in a state where a horizontal state is maintained and there is no distortion or bending as much as possible using the mechanism described above. However, there is always a possibility that the mask is tilted or distorted in the order of a few μm or several tens of μm, and the mask is tilted or distorted due to subsequent factors such as changes in the environment including temperature and humidity. there is a possibility. In this ball mounting apparatus 1, a mask support frame 52 having an upper end surface 51 serving as a reference surface is provided on a stage 10 that conveys a wafer 100, and the masks 21 and 31 are processed each time the wafer 100 is processed by the mask 21 or 31. Is supported by suction on the upper end surface 51, and the masks 21 and 31 are stretched horizontally with respect to the upper end surface 51.

  Therefore, it is possible to prevent the occurrence of defects such as a gap between the mask and the wafer 100 due to distortion or deflection of the mask 21 or 31 at the edge of the wafer 100. By adopting this stage 10, such a slight distortion or deflection of the mask 21 or 31 can be eliminated outside the upper end surface 51 by sucking and supporting the masks 21 and 31 on the upper end surface 51. An area (center portion) corresponding to the wafer 100 inside the upper end surface 51 can hold the masks 21 and 31 in a state of being horizontal and straight with respect to the wafer 100.

  A plurality or a plurality of first suction holes 58 may be provided along each side (four sides) of the mask support frame 52 so that tension is applied from four directions. However, according to the observations of the inventors of the present application, the first suction holes 58 are provided on the four sides of the frame 52, and the mask 21 or 31 is sucked and supported on the upper end surface 51 of the frame 52 in all four sides. A plurality of first suction holes 58 are provided along one pair of opposite sides (two sides) of the upper end surface 51, and the mask 21 or 31 is mainly adsorbed along one pair of sides. It is possible to suppress distortion from appearing in the inner part of the frame 52 of 21 or 31. The movement or displacement of the masks 21 and 31 is substantially fixed by adsorbing and supporting the mask 21 or 31 along one pair of sides 52a and 52b of the frame 52, and tension is applied from two directions. By allowing the masks 21 and 31 to move and displace along the upper end surface 51 only by supporting the upper end surface 51 from the lower side without adsorbing and supporting, the distortion and deflection of the masks 21 and 31 can be prevented. This is considered to be because the masks 21 and 31 can be relieved by letting them escape to the outside and using the upper end surface 51 as a reference.

  The direction in which the mask 21 or 31 is fixed to the frame 52 is preferably the direction in which the squeegee 22 moves back and forth, and the masks 21 and 31 can be more efficiently suppressed from being irregularly distorted by the movement of the squeegee 22.

  As described above, according to the stage 10 of the present embodiment, it is possible to suppress the distortion of the portions of the masks 21 and 31 corresponding to the wafer 100 (portions overlapping the substrate 100). Therefore, the flux can be applied to the desired position on the wafer 100 with high accuracy and the conductive balls B can be mounted.

  The above-described stage 10 is effective for all apparatuses that mount the conductive balls B on the substrate 100 via a thin plate-like mask and apparatuses that apply flux or the like to the substrate 100 via a thin plate-like mask. it is conceivable that. In particular, the masks (flux application mask 21 and ball mounting mask 31) used in the ball mounting apparatus 1 for mounting the miniaturized conductive balls B on the substrate 100 are thinned and have minute distortion, deflection, inclination, and the like. Changes or displacements are likely to occur. Therefore, the above-described stage 10 is effective for an apparatus using a minute ball, for example, a ball having a diameter of 1 mm or less, and about several tens to several hundreds μm.

  The substrate 100 on which the conductive balls B are mounted is not limited to the wafer 100 that is a semiconductor substrate. The substrate 100 on which the conductive balls B are mounted may be an electronic circuit substrate such as a printed wiring board. The printed wiring board is also called a printed wiring board, a printed circuit board, a printed circuit board, a circuit board, or a printed board, and includes a semiconductor mounting board on which a semiconductor is mounted, a build-up board, a multilayer board, and the like.

  Hereinafter, the stage 10 suitable for supporting the rectangular printed wiring board 100 will be described. FIG. 15 is an XY plan view (top view) showing another example of the stage 10 (the stage 10 suitable for supporting the rectangular printed wiring board 100) provided in the ball mounting apparatus 1 of FIG. Yes. FIG. 16 shows a cross-sectional view taken along line XVI-XVI in FIG.

  In this stage 10, the substrate support unit 40 includes a rectangular substrate suction jig (substrate support base) 42 and a frame-shaped substrate guide member 120. The substrate guide member 120 is screwed to the side wall of the substrate suction jig 42 so that the upper surface (upper end surface) 121 protrudes upward from the substrate support surface 41. Since the space for mounting the printed wiring board 100 is formed by the substrate suction jig 42 and the substrate guide member 120, when mounting the printed wiring board 100 on the stage 10, the printed wiring board 100 is positioned at a certain position. Can be placed (mounted, guided).

  A notch 131 is formed in a portion corresponding to a pair of sides (two sides) of the substrate support surface 41 of the substrate suction jig 42, and a groove 132 is formed by the substrate suction jig 42 and the substrate guide member 120. Has been. The groove 132 functions as a burr escape groove of the printed wiring board 100. That is, burrs generated at the time of cutting may remain on the edge of the printed wiring board 100. Further, the printed wiring board 100 may be plated on the surface thereof. In such a case, plating may be abnormally deposited on the edge of the printed wiring board 100. By forming the burr escape groove 132, it is possible to suppress the printed wiring board 100 from floating with respect to the stage 10.

  A plurality of third suction holes 133 for sucking each of the masks 21 and 31 are provided in a portion corresponding to the burr escape groove 132 of the substrate suction jig 42. In this stage 10, each of the masks 21 and 31 is sucked and sucked by the mask support jig 52 through the first suction hole 58, and each of the masks 21 and 31 is sucked by the third suction hole 133, thereby printing. Each of the masks 21 and 31 is pulled toward the stage 10 around the wiring board 100 to suppress the distortion of the masks 21 and 31. Note that the burr escape grooves 132 may be provided in portions corresponding to the four sides of the substrate support surface 41. Since other configurations are the same as those of the above-described embodiment, the overlapping description will be omitted by attaching the same reference numerals to the drawings.

  When the conductive ball B is mounted on the substrate 100 such as a printed wiring board, the stage 10 as described above is suitable. Even if such a stage 10 is used, distortion of the portions of the masks 21 and 31 corresponding to the respective substrates 100 (portions overlapping the substrate 100) can be suppressed.

  The shape and size of the substrate suction jig (substrate support base) 42 can be changed to a polygon depending on the shape of the substrate 100 such as a wafer or a printed wiring board to be mounted thereon. The shape of the mask support jig (frame) 52 can also be changed.

The top view which shows an example of a ball mounting apparatus. The front view which shows typically a part of ball mounting apparatus of FIG. The top view which shows an example of the stage with which the ball | bowl mounting apparatus of FIG. 1 is provided. The disassembled perspective view which shows the stage of FIG. The top view which shows the mask support unit with which the stage of FIG. 3 is provided in the state which removed the mask support jig | tool. The side view which shows the mask support unit with which the stage of FIG. 3 is provided in the state which removed the mask support jig | tool. FIG. 4 is a top view showing the substrate support unit included in the stage of FIG. 3 in a state in which the first drive mechanism is omitted, and showing a state in which the substrate suction jig is locked to the substrate suction jig base. Sectional drawing cut | disconnected and shown along the VIII-VIII line in FIG. FIG. 4 is a top view showing the substrate support unit included in the stage of FIG. 3 in a state where the first drive mechanism is omitted, and showing a state in which the substrate suction jig is free with respect to the substrate suction jig base. Sectional drawing cut | disconnected and shown along the XX line in FIG. The side view which shows the state which removed the board | substrate suction jig from the board | substrate suction jig base in the board | substrate support unit with which the stage of FIG. 3 is provided. The top view which shows typically the state by which the mask for ball mounting is set to the ball filling apparatus with which the ball mounting apparatus of FIG. 1 is equipped. The front view which shows typically the state by which the mask for ball mounting is set to the ball filling apparatus with which the ball mounting apparatus of FIG. 1 is equipped. (A)-(c) is a figure for demonstrating the process in which a conductive ball is mounted in a board | substrate. The top view which shows the other example of the stage with which the ball | bowl mounting apparatus of FIG. 1 is provided. Sectional drawing cut | disconnected and shown along the XVI-XVI line | wire in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ball mounting apparatus, 7 Flux application apparatus 8 Ball filling apparatus, 10 stage, 11 Stage moving apparatus (moving mechanism)
21 Mask for flux application, 31 Ball mounting mask 41 Substrate support surface, 42 Substrate suction jig (substrate support base)
44 First drive mechanism, 47 Second suction hole 51 Upper end surface, 52 Mask support jig (frame)
54 Second drive mechanism, 58 First suction hole 59 Air diffusion groove, 100 Wafer, Printed wiring board (substrate)

Claims (7)

A flux application apparatus comprising a squeegee, wherein the flux application apparatus applies the flux to the substrate via a thin plate-shaped flux application mask having a plurality of first openings by moving the squeegee; and A conductive ball is mounted on the substrate through the ball mounting mask by filling the plurality of second openings in the thin plate-shaped ball mounting mask having a plurality of second openings. A stage on which the substrate can be mounted and transferred to at least one of the ball filling devices
A substrate support having a substrate support surface for supporting the substrate;
A first drive mechanism for moving the substrate support up and down;
A frame having a rectangular outer shape, having an upper end surface positioned around the substrate support surface;
A second drive mechanism for moving the frame up and down;
The frame is moved upward by the second driving mechanism under the flux coating mask or the ball mounting mask fixed above the moving destination of the stage, and the upper end surface is mounted on the flux coating mask or the ball mounting. a plurality of first suction holes for sucking adsorbing the flux applying masks or the ball mounting mask when in contact with the use a mask is provided along the pair of opposite sides of the upper end surface of the frame, Further, a plurality of grooves extending so as to reach the edge of the upper end surface in a direction intersecting with the pair of sides are provided on the upper end surface of the frame at positions that do not overlap the first suction holes. Yes, stage.   The stage according to claim 1, wherein the plurality of first suction holes are provided only in portions along the pair of sides. The stage according to claim 1 or 2 , wherein a plurality of second suction holes for supporting the substrate by suction suction are provided on the substrate support surface of the substrate support base. A stage according to any one of claims 1 to 3 ,
The flux applicator;
The ball filling device;
A moving mechanism that sequentially moves the stage to the lower side of the flux coating mask and the ball mounting mask;
The stage causes each of the flux application mask and the ball mounting mask to move the frame upward by the second driving mechanism and suck it using the plurality of first suction holes. A ball mounting apparatus that repeats the operation of moving the frame downward by the driving mechanism and releasing the frame. 5. The ball mounting device according to claim 4 , wherein the plurality of first suction holes of the stage are arranged along a direction intersecting a moving direction of the squeegee. A method of processing a substrate by a substrate processing apparatus,
The substrate processing apparatus includes a stage on which a substrate can be mounted and transferred,
A flux application device for applying flux to the substrate via a thin plate-shaped flux application mask having a large number of first openings ;
A moving mechanism for moving the stage to the lower side of the flux coating mask ,
The stage includes a frame having an upper end surface positioned around the substrate and a drive mechanism for moving the frame up and down, and the frame is provided along a pair of opposite sides of the upper end surface. A plurality of first suction holes and a plurality of grooves extending to reach the edge of the upper end surface in a direction intersecting the pair of sides, provided at positions that do not overlap the plurality of first suction holes. A plurality of grooves formed ,
In the method, the stage is moved to the lower side of the flux coating mask by the moving mechanism;
Moving the frame upward by the drive mechanism with respect to the flux application mask and adsorbing the flux application mask using the plurality of first suction holes;
Moving the frame downward by the drive mechanism to release the flux coating mask by allowing air to flow along the plurality of grooves . A method of processing a substrate by a substrate processing apparatus,
The substrate processing apparatus includes a stage on which a substrate can be mounted and transferred,
A ball filling device for mounting conductive balls on the substrate through a thin plate-shaped ball mounting mask having a plurality of second openings;
A moving mechanism for moving the stage to the lower side of the ball mounting mask;
The stage includes a frame having an upper end surface positioned around the substrate and a drive mechanism for moving the frame up and down, and the frame is provided along a pair of opposite sides of the upper end surface. A plurality of first suction holes and a plurality of grooves extending to reach the edge of the upper end surface in a direction intersecting the pair of sides, provided at positions that do not overlap the plurality of first suction holes. A plurality of grooves formed,
In the method, the stage is moved to the lower side of the ball mounting mask by the moving mechanism;
Moving the frame upward by the drive mechanism with respect to the ball mounting mask and sucking the ball mounting mask using the plurality of first suction holes;
Releasing the ball mounting mask by moving the frame downward by the drive mechanism to allow air to flow along the plurality of grooves .

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