JP5271985B2 - 集積回路構造 - Google Patents
集積回路構造 Download PDFInfo
- Publication number
- JP5271985B2 JP5271985B2 JP2010211576A JP2010211576A JP5271985B2 JP 5271985 B2 JP5271985 B2 JP 5271985B2 JP 2010211576 A JP2010211576 A JP 2010211576A JP 2010211576 A JP2010211576 A JP 2010211576A JP 5271985 B2 JP5271985 B2 JP 5271985B2
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- Prior art keywords
- metal
- integrated circuit
- circuit structure
- semiconductor substrate
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 85
- 239000002184 metal Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 230000009977 dual effect Effects 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 64
- 238000004519 manufacturing process Methods 0.000 description 35
- 238000000034 method Methods 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 15
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical group [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Description
図1を参照すると、基板10と集積回路(図示しない)を含むチップ2が提供される。チップ2はウェハの一部である。基板10は半導体基板、例えば、バルクシリコン基板(bulk silicon substrate)であるが、第III族、第IV族、及び/又は、第V族素子等の別の半導体材料を含んでいてもよい。トランジスタ(ブロック15で示される)等のアクティブ半導体装置が、基板10の前側10f上に形成される。本文中、 "背面" は、基板10がアクティブ半導体装置を有する側と反対側である。金属線とバイアス(図示しない)を含む相互接続構造12が、基板10の前側10fに形成されて、アクティブ半導体装置に接続される。金属線とバイアスは、銅、或いは、銅合金により構成され、公知のダマシンプロセス(damascene processes)により形成される。相互接続構造12は、既知の層間絶縁膜(inter-layer dielectric 、ILD) と 金属間誘電体(inter-metal dielectric 、IMD)を備える。接着パッド14が基板10の前側10fに形成される。
図13〜図23Bを用いて、第2実施形態を説明する。第2実施形態の初期段階は、図1と図2で示したのと同様である。次に、図13を参照すると、基板10が背面からエッチバックされ、TSV20が、基板10の背面を貫通する。第2実施形態においては、エッチバック深さD2は、約0.5μmより大きく、約1μmである。絶縁層22も、TSV20の頂面からエッチバックされ、TSV20の頂面より低く、例えば、約0.5μmである。従って、TSV20の側壁の一部が露出する。
図24〜図29Bは、第3実施形態を説明するための図である。第3実施形態の初期ステップは、図1と図2と同様である。次に、図24で示されるように、エッチ停止層220が形成される。第3実施形態中、エッチ停止層220は窒化ケイ素で形成され、厚さは、例えば、約750Åである。誘電層222は、エッチ停止層220上に形成される。第3実施形態中、誘電層222は、様々な化学気相蒸着方法(CVD)の一つを用いて形成され、誘電層222は、例えば、酸化物からなる。CVD誘電層222の厚さは、例えば、約8000Åである。別の第3実施形態中、誘電層222は、ポリイミドで形成され、厚さは、CVDを用いて形成するより誘電層の厚さよりも大幅に大きい。ポリイミドで形成される誘電層222の厚さは、約2μmより大きく、第3実施形態では、約5μmである。
10 基板
10b 背面
10f 前側
12 相互接続構造
14 接着パッド
15 トランジスタ
20 TSV
22 絶縁層
24 開口
25 キャリア
26、31 フォトレジスト
27 (トレンチ)開口
28 底部
30 誘電絶縁層
32、128、148、236 導電バリア層
33、136、226 開口
34 銅
36(36−1と36−2) 金属構造
38、48、222 誘電層
40 フォトレジスト
42 バンプ
46 220 エッチ停止層
50 146 ビア
52 金属線
60 付加層
124 124'誘電層
125 誘電層
126 開口
130 金属素材
132(132−1と132−2) 金属線/パッド
234 金属線
134 フォトレジスト
138 228 トレンチ開口
140 フォトレジスト
144 金属線
232 ビア
D1、D2 深さ
Claims (9)
- 集積回路構造であって、
正面と背面を有する半導体基板と、
前記半導体基板を貫通する導電ビアと、
前記半導体基板の背面上にあり、前記導電ビアを被覆し、接触する金属パッド、及び、前記導電ビア上に位置し、デュアルダマシン構造を含む金属線を具備する金属構造と、
前記金属線上のバンプと、を備えることを特徴とする集積回路構造。 - 前記金属パッドは、更に、
前記導電ビアの頂面と接触する第一底面と、
前記半導体基板の前記背面より高く、且つ、前記第一底面より低い第二底面と、
を備えることを特徴とする請求項1に記載の集積回路構造。 - 前記デュアルダマシン構造は、前記金属パッドと同じ誘電層中にあることを特徴とする請求項1又は2に記載の集積回路構造。
- 前記デュアルダマシン構造は、前記金属パッド上の誘電層中にあることを特徴とする請求項1又は2に記載の集積回路構造。
- 前記金属パッドの全水平寸法は、それぞれ、前記導電ビアの水平寸法より大きいことを特徴とする請求項1〜4のいずれか1項に記載の集積回路構造。
- 集積回路構造であって、
正面と背面を有する半導体基板と、
前記半導体基板中の導電ビアと、
前記半導体基板の背面から前記半導体基板中に延伸し、前記導電ビアと接触する第一金属構造と、
前記第一金属構造上で、且つ、前記第一金属構造に電気的に接続するバンプと、
前記第一金属構造と前記バンプ間に形成され、デュアルダマシン構造を含む第二金属構造と、
を備えることを特徴とする集積回路構造。 - 前記第一金属構造の全水平寸法は、それぞれ、前記導電ビアの水平寸法より大きいことを特徴とする請求項6に記載の集積回路構造。
- 前記第一金属構造は、前記半導体基板の前記背面と同じ高さの頂面を有することを特徴とする請求項6又は7に記載の集積回路構造。
- 前記第一金属構造は、
前記導電ビアに接触する導電バリア層と、
前記導電バリア層上の銅含有金属材料と、
からなることを特徴とする請求項6〜8のいずれか1項に記載の集積回路構造。
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US12/832,019 | 2010-07-07 |
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US9978708B2 (en) | 2018-05-22 |
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