JP5105915B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a semiconductor device and a manufacturing method thereof. Note that in this specification, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics.

  With the arrival of the ubiquitous society, the information society is developing more and more. The basic technology that supports the information society is a semiconductor technology represented by LSI (Large Scale Integration). For example, semiconductor technology is widely used such as information communication devices such as mobile phones and personal computers, and systems that support society such as wireless communication networks. In addition, with the development of the information society, demands for higher speed, larger capacity, smaller size, lighter weight, etc. of various information communication devices are increasing. As a result, higher integration, higher speed, and lower consumption of LSIs. Electricity is required.

  In order to realize high integration of LSI, miniaturization of individual elements (for example, transistors) constituting the LSI is essential. However, when the element size is reduced in order to miniaturize a transistor, a problem called a short channel effect becomes remarkable. When the short channel effect occurs, the reliability of the element decreases, such as a decrease in threshold voltage and an increase in leakage current.

An LDD (Lightly Doped Drain) structure is known as one of the structures that suppress the short channel effect. For example, when forming a circuit that requires two different performances on the same substrate, the present applicant forms a desired LDD region by a sidewall formed on a side surface of a gate electrode of a transistor constituting each circuit. This is described in Patent Document 1.
JP-A-11-097705

  Over-etching tends to be a problem when sidewalls are formed on the side surfaces of the gate electrode. In particular, when the performance of an element is improved and the semiconductor layer forming the channel formation region is thinned, there is a problem that variation in the thickness of the semiconductor layer due to overetching or partial disappearance of the semiconductor layer becomes remarkable. If the film thickness of the semiconductor layer varies, the characteristics of the completed semiconductor device also vary, and the reliability tends to decrease. In addition, the yield is lowered, for example, the semiconductor layer disappears.

  In view of the above problems, it is an object of the present invention to provide a structure of a semiconductor device and a manufacturing technique that can be manufactured with high yield and can suppress variation in characteristics.

  The present invention is a semiconductor device having a so-called SOI (Silicon on Insulator) structure in which an element is formed by a semiconductor layer on an insulating surface. One feature of the present invention is that a sidewall insulating layer is provided on a side surface of the gate electrode, and an insulating layer including a nitride film is provided between the sidewall insulating layer and the semiconductor layer. Specifically, in the gate insulating layer formed between the semiconductor layer and the gate electrode, the semiconductor layer side is formed using an oxide film, and the side provided with the sidewall insulating layer is formed using a nitride film. Features. Preferably, an insulating layer that can function as an etching stopper when forming the sidewall insulating layer is formed by performing high-density plasma treatment in an atmosphere containing nitrogen.

  According to a specific configuration of the present invention, an island-shaped semiconductor layer is formed, a first insulating layer is formed using an oxide film on the semiconductor layer, and a second insulating layer is formed using a nitride film on the first insulating layer. And forming a gate electrode on the semiconductor layer via the first insulating layer and the second insulating layer, forming a third insulating layer using an oxide film so as to cover the gate electrode, and forming a third insulating layer. Is selectively etched to form a sidewall insulating layer on the side surface of the gate electrode.

  In another structure of the present invention, an island-shaped semiconductor layer is formed, and a high-density plasma treatment is performed in an atmosphere containing oxygen, whereby a first insulating layer is formed on the semiconductor layer and an atmosphere containing nitrogen is formed. A second insulating layer is formed on the first insulating layer by performing high-density plasma treatment below, a gate electrode is formed on the semiconductor layer via the first insulating layer and the second insulating layer, and the gate A third insulating layer is formed using an oxide film so as to cover the electrode, and the third insulating layer is selectively etched to form a sidewall insulating layer on a side surface of the gate electrode.

  In the above configuration, when the first insulating layer and the second insulating layer are formed using high-density plasma treatment, it is preferable to perform the continuous treatment.

  In another structure of the present invention, an island-shaped semiconductor layer is formed, a first insulating layer is formed over the semiconductor layer, a gate electrode is formed over the semiconductor layer via the first insulating layer, and nitrogen is added. By performing high-density plasma treatment in an atmosphere containing nitrogen, a part of the first insulating layer in a region that does not overlap with the gate electrode is nitrided, and a third insulating layer is formed using an oxide film so as to cover the gate electrode. Then, the third insulating layer is selectively etched to form a sidewall insulating layer on the side surface of the gate electrode.

  In the above structure, the oxide film can be formed using a film containing silicon oxide, silicon oxynitride, or aluminum oxide. As the nitride film, a film containing silicon nitride, silicon nitride oxide, or aluminum nitride can be used.

  In addition, the structure of the semiconductor device according to the present invention includes a semiconductor layer that overlaps with a gate electrode, an impurity region is formed outside the overlapping region, a sidewall insulating layer provided on a side surface of the gate electrode, and a gate electrode And a gate insulating layer provided between the side wall insulating layer and the semiconductor layer, and the side of the gate insulating layer in contact with the side wall insulating layer as compared with the side in contact with the semiconductor layer. The concentration is high.

  In the above structure, the region where the gate insulating layer is in contact with the sidewall insulating layer preferably has a higher nitrogen concentration than the sidewall insulating layer.

  By applying the present invention, it is possible to prevent a variation in film thickness from occurring in the semiconductor layer. Therefore, a semiconductor device in which variation in characteristics is suppressed can be manufactured with high yield.

  Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following description, and various modifications can be made without departing from the spirit and scope of the present invention. It is not to be interpreted as. Note that in the structures of the present invention described below, the same reference numerals may be used in common in different drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view and a top view for explaining a main configuration of a semiconductor device according to the present invention. 1A and 1B particularly illustrate a structure of a thin film transistor, in which FIG. 1A is a cross-sectional view and FIG. 1B is a top view. 1A corresponds to a cross-sectional view between broken lines OP in the top view in FIG. Note that the drawing shown here is an example and can be appropriately changed depending on a desired layout.

  The semiconductor device illustrated in FIG. 1 includes a thin film transistor provided over a substrate 100 with an insulating layer 102 and an insulating layer 104 interposed therebetween. The thin film transistor includes a semiconductor layer 106 provided in an island shape, an insulating layer 118 provided over the semiconductor layer 106, and a gate electrode 124 provided over the semiconductor layer 106 with the insulating layer 118 interposed therebetween. .

  The gate electrode 124 is formed with a stacked structure of the conductive layer 120 and the conductive layer 122. A sidewall insulating layer 126 is formed on the side surface of the gate electrode 124. Here, the gate electrode 124 is provided so as to cross the island-shaped semiconductor layer 106.

  Note that FIG. 1 illustrates an example in which the gate electrode 124 is formed to have a two-layer structure of conductive layers 120 and 122; however, the present invention is not particularly limited. For example, a single layer structure or a stacked structure of three or more layers may be used. Further, the side surface of the conductive layer formed as the gate electrode may be tapered, or the taper angle may be different in each layer as a stacked structure of two or more conductive layers. In addition, in the case where the gate electrode is formed using a stacked structure of conductive layers, the width of each layer (the length in the direction parallel to the direction in which carriers flow in the channel formation region (the direction connecting the source region and the drain region)) substantially matches. Alternatively, it may be formed so that the width of the lower conductive layer is larger than that of the upper layer.

  The sidewall insulating layer 126 is formed of a substantially triangular oxide film in contact with the side surface of the gate electrode. As the oxide film, a film containing silicon oxide (SiOx), silicon oxynitride (SiOxNy) (x> y> 0), or the like may be formed.

  An insulating layer 118 is formed between the semiconductor layer 106 and the gate electrode 124 and the sidewall insulating layer 126. The insulating layer 118 functions as a gate insulating layer. One feature of the present invention is that, in the insulating layer 118, the semiconductor layer 106 side is formed of an oxide film and the sidewall insulating layer 126 side is formed of a nitride film. Specifically, the insulating layer 118 is formed using a stacked structure of a first insulating layer 114 formed using an oxide film and a second insulating layer 116 formed using a nitride film.

  As the oxide film forming the first insulating layer 114, silicon oxide (SiOx), silicon oxynitride (SiOxNy), hafnium oxide (HfOx), aluminum oxide (AlxOy) (x> y> 0), tantalum oxide (TaxOy) A film containing (x> y> 0) or the like can be formed. As the nitride film for forming the second insulating layer 116, a film including silicon nitride (SiNx), silicon nitride oxide (SiNxOy) (x> y> 0), aluminum nitride (AlN), or the like can be formed. .

  Note that the thickness of the insulating layer 118 is set to 1 nm to 110 nm, preferably 2 nm to 20 nm, including the thicknesses of the first insulating layer 114 and the second insulating layer 116. It is preferable to reduce the thickness of the gate insulating layer because the transistor can be operated at high speed with low voltage. In this embodiment mode, the first insulating layer 114 is formed with a thickness of 5 nm and the second insulating layer 116 is formed with a thickness of about 2 nm.

  The semiconductor layer 106 includes a channel formation region 108, a pair of impurity regions 110 that function as LDD regions, and a pair of impurity regions 112 that function as a source region or a drain region. Hereinafter, in this specification, an impurity region functioning as an LDD region is also referred to as a low concentration impurity region. An impurity region functioning as a source region or a drain region is also referred to as a high concentration impurity region. In this embodiment mode, the low concentration impurity region 110 and the high concentration impurity region 112 are used. Specifically, the channel formation region 108 is located between the pair of high concentration impurity regions 112, and the low concentration impurity region 110 is located between the channel formation region 108 and the high concentration impurity region 112. That is, the channel formation region 108 is located between the pair of high concentration impurity regions 112 and the pair of low concentration impurity regions 110. The high concentration impurity region 112 is added with an impurity element imparting one conductivity type at a higher concentration than the low concentration impurity region 110.

  The thickness of the semiconductor layer 106 is 5 nm to 150 nm, preferably 10 nm to 25 nm. In this embodiment, the semiconductor layer 106 has a thickness of 10 nm. The end portion of the semiconductor layer 106 can be tapered. For example, the taper angle may be 45 ° or more and less than 95 °, preferably 60 ° or more and less than 95 °, or may be a gentle shape with a taper angle of less than 45 °. Note that the taper angle indicates an inclination angle formed between the side surface and the bottom surface of a layer having a taper shape. In this embodiment mode, the taper shape has a taper angle close to 90 °.

  In the semiconductor layer 106, the channel formation region 108 is formed in a region overlapping with the gate electrode 124 (a stacked structure of the conductive layer 120 and the conductive layer 122). Note that an impurity element imparting one conductivity type for controlling the threshold voltage of the transistor may be added to the channel formation region 108. The high concentration impurity region 112 is formed in a region not overlapping with the gate electrode 124 and the sidewall insulating layer 126. The low concentration impurity region 110 is formed in a region overlapping with the sidewall insulating layer 126.

  Note that by forming the low-concentration impurity region 110 between the channel formation region 108 and the high-concentration impurity region 112, an electric field in the vicinity of the drain region can be reduced, and as a result, generation of hot carriers can be suppressed. . The generation of hot carriers causes a phenomenon called a short channel effect and causes the threshold voltage to change in an unstable manner, which may significantly reduce the operating characteristics and reliability. In particular, when the element is miniaturized, for example, when the channel length (the length in a direction parallel to the direction in which carriers flow in the channel formation region (the direction connecting the source region and the drain region)) is shortened, the vicinity of the drain region increases the electric field. Therefore, it is very effective to form a low-concentration impurity region that functions as an LDD region.

  In addition, since the LDD region (low-concentration impurity region 110) is formed in a self-aligning manner using the sidewall insulating layer 126 in the present invention, the LDD region can be formed with high accuracy even when the element is miniaturized. On the other hand, when an LDD region is formed by forming a resist mask layer by a photolithography process, high accuracy is required for mask alignment. Therefore, it becomes very difficult to form a resist mask layer as the miniaturization progresses and the element size decreases. If the position of the resist mask layer is shifted, an LDD region, a source region, or a drain region cannot be formed in a desired region, and the element characteristics vary.

  Further, in the present invention, the insulating layer 118 functioning as a gate insulating layer is formed with a stacked structure of an oxide film and a nitride film, and the surface side (second insulating layer 116) in contact with the sidewall insulating layer 126 is formed with a nitride film. is doing. Since the sidewall insulating layer 126 is formed using an oxide film, the second insulating layer 116 functions as an etching stopper, and the lower layer can be protected to prevent the semiconductor layer or the like from being etched. In particular, when the semiconductor layer is thinned in order to reduce the size and performance of the element, the semiconductor layer near the edge of the sidewall insulating layer is easily lost when forming the sidewall insulating layer. The configuration of the invention is very effective. In addition, by forming the surface side (first insulating layer 114) in contact with the semiconductor layer 106 with an oxide film, it is possible to prevent poor interface characteristics.

  Next, an example of a method for manufacturing the semiconductor device illustrated in FIG. 1 is described with reference to drawings.

  An island-shaped semiconductor layer 106 is formed over the substrate 100 with the insulating layer 102 and the insulating layer 104 interposed therebetween (see FIG. 2A).

  As the substrate 100, a substrate having an insulating surface can be used. For example, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate with an insulating layer formed on the surface, or a semiconductor substrate such as a silicon substrate can be used.

  The insulating layer 102 and the insulating layer 104 are formed by CVD, sputtering, ALD, or the like using silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon nitride oxide (SiNxOy), or the like. To do. The insulating layer 102 and the insulating layer 104 function as a base insulating layer. Specifically, it functions as a blocking layer that prevents alkali metal or the like from diffusing from the substrate 100 to the semiconductor layer and contaminating the semiconductor layer. Further, when the surface of the substrate 100 is uneven, the substrate 100 can function as a planarization layer. Note that the insulating layer 102 and the insulating layer 104 are not necessarily formed if impurity diffusion from the substrate 100 or unevenness on the surface of the substrate 100 is not a problem. Although the base insulating layer has a two-layer structure here, it may have a single-layer structure or a three-layer structure or more. For example, when the base insulating layer has a two-layer structure, a silicon nitride oxide layer can be formed as the first layer, and a silicon oxynitride layer can be formed as the second layer. Alternatively, a silicon nitride layer may be formed as the first layer and a silicon oxide layer may be formed as the second layer.

  The semiconductor layer 106 is preferably formed using a single crystal semiconductor or a crystalline semiconductor. The semiconductor layer 106 is formed with a thickness of 5 nm to 150 nm, preferably 10 nm to 25 nm.

  For example, after the semiconductor layer formed over the entire surface of the substrate 100 is crystallized by a CVD method or a sputtering method, the island-shaped semiconductor layer 106 which is a crystalline semiconductor layer can be formed by selective etching. . As a semiconductor material for forming the semiconductor layer 106, a material containing silicon as a main component is preferably used. Specifically, silicon, silicon germanium, or the like can be used. Alternatively, germanium may be used. As the crystallization method of the semiconductor layer, a laser crystallization method, a thermal crystallization method using a rapid thermal annealing (RTA) or a furnace annealing furnace, a crystallization method using a metal element that promotes crystallization, or a combination of these methods is used. It can be performed by a method or the like.

In the case of applying a laser crystallization method, a laser beam obtained from a continuous wave laser (hereinafter also referred to as a CW laser) or a pulsed laser (hereinafter also referred to as a pulsed laser) can be used. Examples of lasers that can be used here include Ar laser, Kr laser, excimer laser, gas laser such as copper vapor laser or gold vapor laser, single crystal YAG, YVO ₄ , forsterite (Mg ₂ SiO ₄ , YAlO ₃ , GdVO ₄ ), or polycrystalline (ceramic) YAG, Y ₂ O ₃ , YVO ₄ , YAlO ₃ , GdVO ₄ , and Nd, Yb, Cr, Ti, Ho, Er, Tm, Ta as dopants Examples thereof include a laser using a seed or a material to which a plurality of kinds are added, a glass laser, an alexandrite laser, a ruby laser, or a solid laser such as a Ti: sapphire laser. In the case of a solid-state laser, irradiation can be performed by appropriately selecting from the fundamental wave to the fourth harmonic of the oscillated laser beam. For example, a second harmonic (532 nm) or a third harmonic (355 nm) of an Nd: YVO ₄ laser (fundamental wave 1064 nm) can be used. When an Nd: YVO ₄ laser is used as a CW laser, the power density of the laser needs to be about 0.01 MW / cm ^{2 to} 100 MW / cm ² (preferably 0.1 MW / cm ^{2 to} 10 MW / cm ² ). Irradiation is performed at a scanning speed of about 10 cm / sec to 2000 cm / sec. The second harmonic is superior to higher harmonics in terms of energy efficiency, and it is preferable to use the second harmonic (532 nm) here.

When laser crystallization is performed using a CW laser, energy can be continuously applied to the semiconductor layer. Therefore, once the semiconductor layer is in a molten state, the molten state can be continued. Therefore, it is preferable because the solid-liquid interface of the semiconductor layer can be moved by scanning the CW laser, and crystal grains that are long in one direction can be formed along this moving direction. At this time, it is more preferable to use a solid-state laser because the output stability is higher than that of a gas laser or the like and stable processing is expected. Note that the same effect can be expected when a pulse laser having a repetition frequency of 10 MHz or higher is used in addition to the CW laser. If a pulse laser with a high repetition frequency is used, the semiconductor layer can be kept in a molten state at all times if the laser pulse oscillation interval is shorter than the time from when the semiconductor layer melts until it solidifies. A semiconductor layer composed of crystal grains that are long in one direction can be formed by movement. Further, it is preferable to emit a laser beam by oscillating in TEM ₀₀ (single transverse mode) because energy uniformity of a linear beam spot obtained on the irradiated surface can be improved.

The semiconductor layer 106 can be formed in an island shape by selectively covering a semiconductor layer formed over the entire surface of the substrate with a resist mask and etching the semiconductor layer not covered with the resist mask. As a method for etching the semiconductor layer, a dry etching method or a wet etching method can be used. When dry etching is performed, an etching gas having a sufficient etching selectivity with respect to the base insulating layer is used. That is, here, a material having a low etching rate for the insulating layer 104 and a high etching rate for the semiconductor layer 106 may be used. As the etching gas, for example, a chlorine-based gas such as Cl ₂ , BCl ₃ , or SiCl ₄ , a fluorine-based gas such as CF ₄ , NF ₃ , or SF ₆ , or an HBr gas can be used. Further, an inert gas such as He, Ar, or Xe may be added as appropriate. Moreover, the O ₂ gas may be appropriately added to the fluorine-based gas. After processing into a desired shape, the resist mask remaining on the semiconductor layer is removed. Note that etching of the semiconductor layer may be performed after crystallization of the semiconductor layer or may be performed before crystallization.

  In addition, the semiconductor layer 106 may be formed so that the end portion has a tapered shape close to vertical, or may be formed to have a gentle tapered shape. For example, the taper angle may be 45 ° or more and less than 95 °, preferably 60 ° or more and less than 95 °, or may be a gentle shape with a taper angle of less than 45 °. The shape of the end portion of the semiconductor layer 106 can be selected as appropriate by changing etching conditions and the like.

In the case where the thickness of the semiconductor layer 106 is 50 nm or less, after the semiconductor layer is formed with a thickness of 50 nm or more, the semiconductor layer may be etched to be thinned. For example, when the semiconductor layer is thinned using a dry etching method, a chlorine-based gas such as Cl ₂ , BCl ₃ , or SiCl ₄ , a fluorine-based gas such as CF ₄ , NF ₃ , or SF ₆ , or an HBr gas Can be used. Further, an inert gas such as He, Ar, or Xe may be added as appropriate. Further, O ₂ gas may be added to the fluorine-based gas. Further, the semiconductor layer can be partially altered, and the altered region can be selectively etched. The alteration of the semiconductor layer refers to, for example, oxidation treatment, nitridation treatment, etc. of the semiconductor layer, and the region to be etched may be altered by performing a desired treatment.

  In this embodiment, a crystalline silicon layer with a thickness of 10 nm is formed as the semiconductor layer 106.

  Note that an SOI substrate in which a single crystal semiconductor layer is provided over an insulating surface may be used as the semiconductor layer instead of a thin film process using various crystallization methods. In this case, the semiconductor layer 106 can be formed using a single crystal semiconductor layer provided over an insulating surface.

Further, an impurity element imparting one conductivity type for controlling the threshold voltage of the transistor may be added to the semiconductor layer. By adding an impurity element having a predetermined concentration to a semiconductor layer which later forms a channel formation region, the threshold voltage of the transistor can be forcibly shifted to a desired threshold voltage. As an impurity element imparting one conductivity type, an element imparting p-type such as boron (B), aluminum (Al), or gallium (Ga), or n-type such as phosphorus (P) or arsenic (As) is imparted. Elements can be used. In the case of this embodiment mode, an element imparting p-type, such as boron, can be added at a concentration of about 1 × 10 ¹⁶ cm ^{−3 to} 1 × 10 ¹⁸ cm ⁻³ . Note that the impurity element for controlling the threshold voltage of the transistor may be added before the gate electrode is formed.

  Next, the insulating layer 118 is formed over the semiconductor layer 106. The insulating layer 118 functions as a gate insulating layer (see FIG. 2B).

  Here, the insulating layer 118 is formed of an oxide film on the semiconductor layer 106 side and a nitride insulating film side of a sidewall insulating layer to be formed later. In this embodiment mode, the first insulating layer 114 is formed using an oxide film and the second insulating layer 116 is formed using a nitride film.

  As the oxide film, a film containing silicon oxide, silicon oxynitride, hafnium oxide, aluminum oxide, tantalum oxide, or the like is preferably formed. As the nitride film, a film containing silicon nitride, silicon nitride oxide, aluminum nitride, or the like is preferably formed. Here, the first insulating layer 114 is formed using the oxide film as described above, and the second insulating layer 116 is formed using the nitride film as described above.

  The insulating layer 118 can be formed by a CVD method, a sputtering method, an ALD method, or the like, but preferably a dense and thin insulating layer can be obtained easily by forming by solid phase oxidation and solid phase nitridation by plasma treatment. Good. In addition, after an oxide film is formed over the semiconductor layer 106 using a CVD method, a sputtering method, or an ALD method, the oxide film is formed by solid-phase oxidation or solid-phase oxidation and solid-phase nitridation by plasma treatment. Also good. In addition, after forming an oxide film on the semiconductor layer 106 by solid-phase oxidation treatment by plasma treatment, a nitride film may be formed using a CVD method or a sputtering method.

The solid-phase oxidation treatment or solid-phase nitridation treatment is preferably performed using plasma excited by a high frequency such as a microwave (typically 2.45 GHz). Specifically, plasma with an electron density of 1 × 10 ¹¹ cm ⁻³ or more and 1 × 10 ¹³ cm ⁻³ or less and an electron temperature of 0.5 eV or more and 1.5 eV or less excited using high frequency is used. It is preferable to perform plasma treatment. This is for forming a dense insulating layer and obtaining a practical reaction rate at a temperature of 500 ° C. or lower in the solid-phase oxidation treatment or solid-phase nitridation treatment.

In the case of oxidizing the surface of the semiconductor layer 106 by plasma treatment, an atmosphere containing oxygen (for example, oxygen (O ₂ ), ozone (O ₃ ), nitrous oxide (N ₂ O), or nitric oxide (NO) ) Or nitrogen dioxide (NO ₂ ) and a noble gas (including at least one of helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe)), or An atmosphere containing oxygen (O ₂ ), ozone (O ₃ ), nitrous oxide (N ₂ O), nitrogen monoxide (NO) or nitrogen dioxide (NO ₂ ), hydrogen (H ₂ ), and a rare gas. Below). In the case where the surface of the first insulating layer 114 is nitrided by plasma treatment, in an atmosphere containing nitrogen (for example, at least one of nitrogen (N ₂ ) and a rare gas (He, Ne, Ar, Kr, Xe) In an atmosphere containing nitrogen, hydrogen, and a rare gas, or an atmosphere containing NH ₃ and a rare gas). For example, Ar is preferably used as the rare gas. A gas in which Ar and Kr are mixed may be used.

  Here, FIG. 5 shows a configuration example of a plasma processing apparatus 1080 for performing plasma processing. The plasma processing apparatus 1080 includes a support 1088, a gas supply unit 1084 for supplying gas, an exhaust port 1086 connected to a vacuum pump for exhausting gas, an antenna 1098, a dielectric plate 1082, and a plasma generating unit. A high frequency supply unit 1092 for inputting a high frequency is included. The object to be processed 1010 is held by a support base 1088. In addition, the temperature of the object to be processed 1010 can be controlled by providing the support base 1088 with the temperature controller 1090. The object to be processed 1010 is a base body that performs plasma treatment, and corresponds to a substrate in which insulating layers 102 and 104 and an island-shaped semiconductor layer 106 are sequentially stacked over a substrate 100 in this embodiment. Alternatively, this corresponds to a structure in which an oxide film is formed over the island-shaped semiconductor layer 106.

  Hereinafter, a specific example in which an insulating layer is formed on the surface of a semiconductor layer using the plasma processing apparatus 1080 shown in FIG. 5 will be described. Note that plasma treatment includes, in its category, oxidation treatment, nitridation treatment, oxynitridation treatment, hydrogenation treatment, and surface modification treatment for a substrate, a semiconductor layer, an insulating layer, and a conductive layer. In these processes, a gas supplied from the gas supply unit 1084 may be selected according to the purpose.

  First, the processing chamber of the plasma processing apparatus 1080 shown in FIG. Then, a gas containing a rare gas, oxygen, or nitrogen is supplied from the gas supply unit 1084. The object to be processed 1010 is heated at room temperature or in the range of 100 ° C. to 550 ° C. by the temperature control unit 1090. An interval between the object to be processed 1010 and the dielectric plate 1082 (hereinafter also referred to as an electrode interval) is about 20 mm to 200 mm (preferably 20 mm to 60 mm).

  Next, a high frequency is input from the high frequency supply unit 1092 to the antenna 1098. Here, a microwave (frequency: 2.45 GHz) is input as a high frequency. Then, a microwave is input from the antenna 1098 through the dielectric plate 1082 into the processing chamber, thereby generating plasma 1094. The plasma 1094 generates oxygen radicals (which may include OH radicals) or nitrogen radicals (when NH radicals are included). Is also generated. At this time, the plasma 1094 is generated by the supplied gas.

When the plasma 1094 is generated by high-frequency input such as microwaves, plasma with a low electron temperature (3 eV or less, preferably 1.5 eV or less) and a high electron density (1 × 10 ¹¹ cm ⁻³ or more) can be generated. . Specifically, it is preferable to generate plasma having an electron temperature of 0.5 eV to 1.5 eV and an electron density of 1 × 10 ¹¹ cm ^{−3 to} 1 × 10 ¹³ cm. Note that in this specification, plasma having a low electron temperature and a high electron density generated by input of microwaves is also referred to as high-density plasma. In addition, performing plasma processing using high-density plasma is also referred to as high-density plasma processing.

  The surface of the semiconductor layer formed on the object to be processed 1010 is oxidized by oxygen radicals (which may include OH radicals) or nitrogen radicals (which may include NH radicals) generated by the plasma 1094, so that the insulating layer is formed. It is formed. Alternatively, the surface of the insulating layer formed on the semiconductor layer or the vicinity of the surface is oxidized or nitrided. At this time, when a rare gas such as argon is mixed with the supplied gas, oxygen radicals or nitrogen radicals can be efficiently generated by the excited species of the rare gas. Note that. In the case where a rare gas is used as the supply gas, the formed insulating layer may contain a rare gas. In this method, active radicals excited by plasma can be effectively used to perform oxidation and nitridation by solid phase reaction at a low temperature of 500 ° C. or lower.

  In this embodiment, an example of a preferable manufacturing method in which the insulating layer 118 is formed by plasma treatment is performed in such a manner that the semiconductor layer 106 is subjected to plasma treatment in an atmosphere containing oxygen to form a silicon oxide layer, and then is contained in an atmosphere containing nitrogen. The surface of the silicon oxide layer is subjected to nitriding plasma treatment to form a second insulating layer 116 made of a nitrogen plasma treated layer and a first insulating layer 114 made of a silicon oxide layer. Specifically, first, plasma treatment is performed in an atmosphere containing oxygen, so that a silicon oxide layer (corresponding to the first insulating layer 114) is formed over the semiconductor layer 106 with a thickness of 3 nm to 6 nm. Subsequently, plasma treatment is performed in an atmosphere containing nitrogen to form a nitrogen plasma treatment layer (corresponding to the second insulating layer 116) having a high nitrogen concentration on or near the surface of the silicon oxide layer. At this time, the remaining silicon oxide layer corresponds to the first insulating layer 114. Note that the vicinity of the surface means a depth of approximately 0.25 nm to 1.5 nm from the surface of the silicon oxide layer. For example, after forming a silicon oxide layer, nitrogen treatment is performed in an atmosphere containing nitrogen, so that nitrogen is contained at a ratio of 20 atomic% to 50 atomic% at a depth of approximately 1 nm from the surface of the silicon oxide layer. A plasma treatment layer (second insulating layer 116) can be formed. The nitrogen plasma treatment layer is formed of silicon nitride or silicon nitride oxide depending on plasma treatment conditions.

  In any case, by using the solid phase oxidation treatment or solid phase nitridation treatment by the plasma treatment as described above, even if a glass substrate having a heat resistant temperature of 700 ° C. or less is used, it is formed in a range of 950 ° C. to 1050 ° C. An insulating layer equivalent to the thermal oxide film can be obtained. That is, a highly reliable insulating layer can be formed as an insulating layer functioning as a gate insulating layer of a semiconductor element, particularly a thin film transistor or a nonvolatile memory element.

  Note that in the case where the insulating layer 118 is formed by solid-phase oxidation or solid-phase nitridation by plasma treatment, the first insulating layer 114 and the second insulating layer 116 may be difficult to distinguish clearly, but at least in the film When the nitrogen content is compared, the nitrogen content on the side wall insulating layer side (here, the second insulating layer 116) is high. Here, the boundary between the first insulating layer 114 and the second insulating layer 116 is illustrated by a dotted line. The insulating layer 118 is not limited to a two-layer structure, and may be a film in which the nitrogen content is gradually decreased from the side wall insulating layer side, or may be a three-layer structure or more. However, in the insulating layer functioning as the gate insulating layer, the side closest to the sidewall insulating layer is formed of a nitride film. When the insulating layer 118 is formed by solid-phase oxidation or solid-phase nitridation by plasma treatment, silicon oxide or silicon oxynitride is formed as the first insulating layer 114 (oxide film), and the second insulating layer 116 (nitride film) ), Silicon nitride or silicon nitride oxide is formed.

  The insulating layer 118 may be formed to have a thickness in the range of 1 nm to 110 nm, preferably 2 nm to 20 nm, including the first insulating layer 114 and the second insulating layer 116. Since the insulating layer 118 forms a gate insulating layer of a completed transistor, a thinner one is preferable because high-speed operation can be performed at a low voltage.

  Next, a conductive layer is formed over the insulating layer 118. Here, a stacked structure of a conductive layer 119 and a conductive layer 121 is formed as the conductive layer (see FIG. 2C).

  The conductive layers 119 and 121 are formed using a conductive material by a CVD method or a sputtering method. As the conductive material, metal elements such as tantalum (Ta), tungsten (W), titanium (Ti), molybdenum (Mo), chromium (Cr), aluminum (Al), copper (Cu), or niobium (Nb), Alternatively, an alloy material or a compound material containing the metal element can be used. Alternatively, a semiconductor material such as polycrystalline silicon to which an impurity element imparting one conductivity type such as phosphorus is added can be used. Note that although an example in which a stacked structure of the conductive layers 119 and 121 is formed is shown here, the conductive layer formed over the insulating layer 118 may have a single-layer structure. The conductive layer (a stacked structure of the conductive layer 119 and the conductive layer 121) is formed with a thickness of 50 nm to 1000 nm, preferably 100 nm to 800 nm, more preferably 200 nm to 500 nm.

  In this embodiment, a tantalum nitride layer with a thickness of 30 nm is formed as the conductive layer 119, and a tungsten layer with a thickness of 170 nm is formed as the conductive layer 121.

  Next, the conductive layer 119 and the conductive layer 121 are selectively etched to form a gate electrode. Here, an example in which the conductive layer 121 and the conductive layer 119 are sequentially etched to form a gate electrode is shown.

  First, the conductive layer 121 is selectively etched to form the conductive layer 122 (see FIG. 2D). The conductive layer 122 can be formed by selectively covering the conductive layer 121 formed over the entire surface of the substrate with a resist mask and etching a portion not covered with the resist mask.

  Next, the conductive layer 119 is selectively etched using the conductive layer 122 as a mask, so that the conductive layer 120 is formed. The stacked structure of the conductive layer 120 and the conductive layer 122 forms the gate electrode 124 (see FIG. 3A).

As a method for etching the conductive layer 121 and the conductive layer 119, a dry etching method or a wet etching method can be used. Note that in this embodiment mode, the conductive layer 121 and the conductive layer 119 having a stacked structure are preferably formed using a layer having a sufficient etching selectivity. By doing so, the conductive layer 119 can function as an etching stopper when the conductive layer 121 is etched. Here, an example in which the conductive layer 119 is formed using a tantalum nitride layer and the conductive layer 121 is formed using a tungsten layer is shown. For example, tantalum nitride and tungsten are etched by dry etching using a mixed gas such as CF ₄ , Cl ₂ , and O _2, and tantalum nitride is etched using a mixed gas such as NF ₃ and SiCl _4. Thus, etching can be performed with a sufficient selectivity.

Next, an impurity element 132 imparting one conductivity type is selectively added to the semiconductor layer 106 at a first concentration, so that a pair of low-concentration impurity regions 109 and a channel formation region 108 are formed (FIG. 3 ( B)). Here, an impurity element is added using the gate electrode 124 (the conductive layers 122 and 120) as a mask, and a pair of low-concentration impurity regions 109 and a channel located between the pair of low-concentration impurity regions 109 are formed in a self-aligned manner. Region 108 is formed. A part of the low concentration impurity region 109 formed here forms an LDD region later. As an impurity element imparting one conductivity type, an element imparting n-type such as phosphorus (P) or arsenic (As), or p-type such as boron (B), aluminum (Al), or gallium (Ga) is imparted. Elements can be used. In this embodiment mode, phosphorus which is an element imparting n-type conductivity as an impurity element is added so as to have a peak concentration of about 1 × 10 ¹⁸ cm ⁻³ .

  Next, a sidewall insulating layer is formed on the side surface of the gate electrode 124 (the conductive layers 122 and 120).

  First, an insulating layer 125 that covers the gate electrode 124 is formed so that the gate electrode 124 (the conductive layers 122 and 120) is embedded (see FIG. 3C).

  As the insulating layer 125, an oxide film such as silicon oxide or silicon oxynitride is formed by a CVD method or a sputtering method. Note that although the insulating layer 125 may have a stacked structure with a nitride film such as silicon nitride or silicon nitride oxide, a region serving as an outermost layer of the sidewall insulating layer 126 formed by etching the insulating layer 125 later is an oxide film. Shall be formed.

  Next, the insulating layer 125 is selectively etched to form sidewall insulating layers 126 on side surfaces of the gate electrode 124 (see FIG. 3D).

  The sidewall insulating layer 126 can be formed by selectively etching the insulating layer 125 by anisotropic etching mainly in the vertical direction. At this time, since the insulating layer 118 according to the present invention is formed of a nitride film on the side in contact with the sidewall insulating layer 126, the insulating layer 118 can function as an etching stopper. Specifically, when the insulating layer 125 made of an oxide film is selectively etched, the second insulating layer 116 made of a nitride film functions as an etching stopper. Therefore, etching of the lower semiconductor layer 106 can be prevented.

For example, when the second insulating layer 116 is a silicon nitride oxide layer formed by solid-phase nitridation and the insulating layer 125 is formed of a silicon oxynitride layer, a mixed gas such as C ₄ F ₈ or Ar is used by a dry etching method. The sidewall insulating layer 126 can be formed with a sufficient selection ratio by etching.

  In particular, when the semiconductor layer is thinned to 10 nm to 25 nm, the influence of the semiconductor layer disappearing due to over-etching when forming the sidewall insulating layer or the thickness of the semiconductor layer varies becomes significant. Therefore, the configuration as in the present invention is very effective. Variation in the thickness of the semiconductor layer leads to variation in characteristics of a completed semiconductor device such as a transistor. Therefore, by using the structure of the present invention, a highly reliable semiconductor device can be manufactured with high yield. Note that depending on the etching conditions for forming the sidewall insulating layer 126, part of the upper layer of the insulating layer 118 may be etched to reduce the film thickness (referred to as film reduction) (see FIG. 6).

  The shape of the sidewall insulating layer 126 is not particularly limited, but is approximately triangular. Here, an example in which the sidewall insulating layer 126 is formed in a curved shape on the side not in contact with the side surface of the gate electrode 124 is shown. The sidewall insulating layer 126 can be used as a doping mask when an LDD region is formed later.

Next, an impurity element 134 imparting one conductivity type is selectively added to the semiconductor layer 106 at a second concentration, so that a pair of high-concentration impurity regions 112 and a pair of low-concentration impurity regions 110 are formed ( (See FIG. 4A). Here, an impurity element is added using the gate electrode 124 (the conductive layers 122 and 120) and the sidewall insulating layer 126 formed on the side surface as a mask, and a pair of high-concentration impurity regions 112 and a pair of low-concentration regions are self-aligned. A concentration impurity region 110 is formed. The high concentration impurity region 112 formed here functions as a source region or a drain region, and the low concentration impurity region 110 functions as an LDD region. As the impurity element imparting one conductivity type, an impurity element having the same conductivity type as the element added when the low-concentration impurity region 109 is formed can be used. Note that the impurity element is added at a higher second concentration than the first concentration. Therefore, an impurity element having a higher concentration than that of the low concentration impurity region 110 is added to the high concentration impurity region 112. In this embodiment mode, phosphorus which is an element imparting n-type conductivity as an impurity element is added so as to have a peak concentration of about 1 × 10 ²¹ cm ⁻³ .

  In this manner, a channel formation region 108, a pair of low-concentration impurity regions 110, and a pair of high-concentration impurity regions 112 are formed in the semiconductor layer 106. A channel formation region 108 is located between the pair of high concentration impurity regions 112, and a low concentration impurity region 110 is formed between the high concentration impurity region 112 and the channel formation region 108. The channel formation region 108 is formed in a region where the semiconductor layer 106 overlaps with the gate electrode 124 (conductive layers 122 and 120). The high concentration impurity region 112 is formed in a region not overlapping with the gate electrode 124 and the sidewall insulating layer 126. The low concentration impurity region 110 is formed in a region overlapping with the sidewall insulating layer 126.

  As described above, in the present invention, the nitride film functioning as an etching stopper is formed below the sidewall insulating layer 126. For this reason, it is possible to prevent the semiconductor layer from being etched by over-etching when forming the sidewall insulating layer and causing variations in film thickness. Therefore, variation in characteristics due to variation in film thickness, for example, variation in resistance (also referred to as sheet resistance) of an impurity region functioning as a source region or a drain region can be prevented. Further, when the impurity region functioning as the LDD region, the source region, or the drain region is formed, the impurity element is added through the insulating layer, so that damage to the semiconductor layer can be reduced.

  Note that after the impurity element imparting one conductivity type is added to the semiconductor layer 106, heat treatment is preferably performed to activate the added impurity element. The heat treatment can be performed using laser beam irradiation, an RTA, or a furnace annealing furnace. Specifically, it may be performed in a temperature range of 400 ° C. to 700 ° C., preferably 500 ° C. to 650 ° C. The heat treatment is preferably performed in a nitrogen atmosphere. For example, activation can be performed by heating at 550 ° C. for 4 hours. For example, FIG. 4B illustrates the case where the impurity element is activated by laser beam irradiation.

  As shown in FIG. 4A, an impurity element 134 is added to form a channel formation region 108, a low concentration impurity region 110, and a high concentration impurity region 112 in the semiconductor layer 106, and then irradiation with a laser beam 136 is performed (FIG. 4A). 4 (B)). As the laser beam 136, for example, a laser beam obtained from an excimer laser can be used. By irradiation with the laser beam 136, the impurity element can be activated and plasma damage of the insulating layer 118 functioning as a gate insulating layer and plasma damage at the interface between the gate insulating layer and the semiconductor layer can be recovered. Become. Note that by reducing the film thickness variation of the semiconductor layer using the present invention, it is possible to easily set the irradiation condition of the laser beam when the activation is performed by the laser beam irradiation.

  Through the above, a thin film transistor which is a semiconductor device according to the present invention can be formed. Note that the structure of the transistor described in this embodiment is an example and is not limited to the structure illustrated.

  By applying the present invention, a variation in characteristics due to the formation of the sidewall insulating layer can be suppressed, and a semiconductor device can be manufactured with high yield.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 2)
In this embodiment, an example of a semiconductor device having a structure different from that in the above embodiment is described with reference to drawings. Specifically, an example in which the structure of the gate electrode is different from the structure of the first embodiment described above. Note that the description of the same structure as that of the first embodiment is simplified and partly omitted.

  An example of a method for manufacturing a semiconductor device according to this embodiment will be described with reference to FIGS.

  An island-shaped semiconductor layer 206 is formed over the substrate 200 with the insulating layer 202 and the insulating layer 204 interposed therebetween. Next, the insulating layer 218 is formed over the semiconductor layer 206. The insulating layer 218 has a stacked structure of a first insulating layer 214 formed using an oxide film and a second insulating layer 216 formed using a nitride film. Next, a conductive layer is formed with the insulating layer 218 interposed therebetween. Here, a stacked structure of a conductive layer 219 and a conductive layer 221 is formed (see FIG. 7A). Until the conductive layer 222 is formed, the substrate 100, the insulating layers 102 and 104, the semiconductor layer 106, the insulating layer 118 (the first insulating layer 114 and the second insulating layer 116), and the conductive layer 119 described in Embodiment Mode 1 are used. , 121, etc.

  Next, the conductive layers 219 and 221 are selectively etched to form gate electrodes.

  First, the conductive layer 221 is selectively etched to form the conductive layer 222 (see FIG. 7B). For the conductive layer 222, the conductive layer 221 formed over the entire surface of the substrate is selectively covered with a resist mask, and a portion not covered with the resist mask is etched so that the side surface is tapered.

  Next, the conductive layer 219 is selectively etched using the conductive layer 222 as a mask, so that the conductive layer 220 is formed. Here, the conductive layer 220 is formed to have a width larger than that of the upper conductive layer 222. One feature of this embodiment is that, when the gate electrode has a stacked structure, the width of the conductive layer on the lower layer (the side in contact with the gate insulating layer) is larger than that of the upper layer. The side surface of the conductive layer 220 is formed to have a tapered shape. The taper angle is preferably smaller than that of the conductive layer 222. As a method for etching the conductive layers 221 and 219, a dry etching method or a wet etching method can be used. The stacked structure of the conductive layer 220 and the conductive layer 222 formed as above forms the gate electrode 224 (see FIG. 7C).

  Next, an impurity element imparting one conductivity type with the first concentration is added using the gate electrode 224 as a mask, and then a sidewall insulating layer 226 is formed on a side surface of the gate electrode 224. Next, an impurity element imparting one conductivity type of the second concentration is added using the gate electrode 224 and the sidewall insulating layer 226 as a mask, and a pair of high concentration impurity regions 212 and a pair of low concentration are self-aligned. An impurity region 210 and a channel formation region 208 are formed. Here, the impurity element of the first concentration and the impurity element of the second concentration are added with an impurity element of the same conductivity type. For example, phosphorus (P), arsenic (As), which are impurity elements imparting n-type conductivity, Boron (B), aluminum (Al), gallium (Ga), or the like which is an impurity element imparting p-type conductivity can be added. Also, the second concentration is set higher than the first concentration. Through the above, a thin film transistor which is a semiconductor device according to the present invention can be formed (see FIG. 7D). Note that after the gate electrode 224 is formed, the sidewall insulating layer 226 is formed, and the channel formation region 208, the low concentration impurity region 210, and the high concentration impurity region 212 are formed in the semiconductor layer 206. The description of the sidewall insulating layer 126, the channel formation region 108, the low-concentration impurity region 110, the high-concentration impurity region 112, and the like shown in FIG.

  In the present invention, a nitride film functioning as an etching stopper is formed below the sidewall insulating layer 226. Therefore, over-etching when forming the sidewall insulating layer 226 can be stopped by the nitride film. Therefore, it is possible to prevent the semiconductor layer under the nitride film from being etched and the thickness of the semiconductor layer from varying. In over-etching when forming the sidewall insulating layer 226, the semiconductor layer forming the source region or the drain region is easily etched. By adopting the structure of the present invention which prevents this, it is possible to suppress variation in characteristics of a completed semiconductor device such as variation in resistance of a source region or a drain region. In addition, when the impurity element is added to the semiconductor layer 206, the insulating layer 218 is provided over the semiconductor layer 206; therefore, damage to the semiconductor layer 206 can be reduced.

  Note that in this embodiment, the gate electrode is formed to have a stacked structure, and the lower conductive layer (side in contact with the gate insulating layer) is formed to have a large width. With such a structure, a fine LDD region can be formed more easily. Although an example in which the side surface of the conductive layer forming the gate electrode is tapered is described here, a shape close to a vertical shape may be used.

  In addition, after adding an impurity element imparting one conductivity type to the semiconductor layer 206, heat treatment is preferably performed to activate the added impurity element. The heat treatment can be performed using laser beam irradiation, an RTA, or a furnace annealing furnace. Specifically, it may be performed in a temperature range of 400 ° C. to 700 ° C., preferably 500 ° C. to 650 ° C. The heat treatment is preferably performed in a nitrogen atmosphere. For example, activation can be performed by heating at 550 ° C. for 4 hours. In the case of activation by laser beam irradiation, for example, an excimer laser can be used. In the case of laser beam irradiation, it is possible to recover plasma damage at an insulating layer functioning as an upper gate insulating layer and an interface between the insulating layer and the semiconductor layer, along with activation of the impurity element. Note that by applying the present invention to reduce the variation in the thickness of the semiconductor layer, the laser beam irradiation conditions can be easily set.

  Note that the structure of the transistor described in this embodiment is an example and is not limited to the structure illustrated.

  By applying the present invention, a variation in characteristics due to the formation of the sidewall insulating layer can be suppressed, and a semiconductor device can be manufactured with high yield. In addition, a fine LDD region can be formed.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 3)
In this embodiment, an example of a semiconductor device having a structure different from that in the above embodiment is described with reference to drawings. Specifically, an example in which part of the semiconductor layer is silicided in the structure of Embodiment 1 or Embodiment 2 is described. Note that the description of the same structure as that of the first embodiment is simplified and partly omitted.

  An example of a method for manufacturing a semiconductor device according to this embodiment will be described with reference to FIGS.

  An island-shaped semiconductor layer 506 is formed over the substrate 500 with the insulating layer 502 and the insulating layer 504 interposed therebetween. Next, the insulating layer 518 is formed over the semiconductor layer 506. The insulating layer 518 has a stacked structure of a first insulating layer 514 formed using an oxide film and a second insulating layer 516 formed using a nitride film. Next, a stacked structure of a conductive layer 520 and a conductive layer 522 which form the gate electrode 524 is formed over the semiconductor layer 506 with the insulating layer 518 provided therebetween. Next, an impurity element imparting one conductivity type with the first concentration is added using the gate electrode 524 as a mask, and then a sidewall insulating layer 526 is formed on a side surface of the gate electrode 524. Next, an impurity element imparting one conductivity type of the second concentration is added using the gate electrode 524 and the sidewall insulating layer 526 as a mask, and a pair of high concentration impurity regions 512 and a pair of low concentration are self-aligned. An impurity region 510 and a channel formation region 508 are formed. Here, the impurity element of the first concentration and the impurity element of the second concentration are added with an impurity element of the same conductivity type. For example, phosphorus (P), arsenic (As), which are impurity elements imparting n-type conductivity, Boron (B), aluminum (Al), gallium (Ga), or the like which is an impurity element imparting p-type conductivity can be added. In addition, the second concentration is set higher than the first concentration (see FIG. 8A). Note that until the high-concentration impurity regions 512 and the like are formed in the semiconductor layer, the substrate 100, the insulating layers 102 and 104, the island-shaped semiconductor layer 106, and the insulating layer 118 (first insulating layer 114, The second insulating layer 116) is omitted because it conforms to the description of the gate electrode 124 (conductive layers 122, 120), the sidewall insulating layer 126, and the like. Note that the gate electrode 524 may be formed so that the width of the lower conductive layer is increased as described in Embodiment Mode 2.

  Next, using the sidewall insulating layer 526 and the gate electrode 524 as a mask, the insulating layer 518 in a region which does not overlap with the sidewall insulating layer 526 and the gate electrode 524 is removed, and a part of the semiconductor layer 506 (here, a high concentration) Impurity region 512) is exposed. Note that the insulating layer 519 remains between the sidewall insulating layer 526 and the gate electrode 524 and the semiconductor layer 506. The insulating layer 519 has a stacked structure of a third insulating layer 515 formed of an oxide film and a fourth insulating layer 517 formed of a nitride film. The insulating layer 518 may be removed using a wet etching method or a dry etching method. For example, when the insulating layer 518 is removed by a wet etching method, an etching solution such as hydrofluoric acid can be used. In the case of using hydrofluoric acid, the surface of the exposed semiconductor layer can be cleaned along with the removal of the insulating layer 518.

  Next, a metal layer 530 is formed over the semiconductor layer 506 (see FIG. 8C). Note that in the case where a natural oxide film is formed over the exposed semiconductor layer 506 when the metal layer 530 is formed, the metal layer 530 is formed after the natural oxide film is removed.

  For the metal layer 530, a material that reacts with the semiconductor layer to be silicided by a sputtering method, an evaporation method, a plating method, or the like, for example, a metal element such as nickel, titanium, cobalt, or platinum, or an alloy material containing the metal element is used. Form. The metal layer 530 is formed with a thickness of 1 nm to 50 nm, preferably 3 nm to 10 nm. In this embodiment, a nickel layer is formed with a thickness of 5 nm as the metal layer 530.

  Next, part of the semiconductor layer 506 is silicided. Here, a high-concentration impurity region 536 in which the upper layer of the high-concentration impurity region 512 is partially silicided is formed (see FIG. 8D). The high concentration impurity region 536 includes a silicided region 534 in the upper layer.

  Silicidation occurs when a region in contact with the semiconductor layer 506 and the metal layer 530 reacts by performing heat treatment. For example, when nickel is formed as the metal layer 530, a high concentration impurity region 536 including a nickel silicide region is formed. Similarly, when titanium, cobalt, or platinum is formed as the metal layer 530, a high-concentration impurity region 536 including a titanium silicide region, a cobalt silicide region, and a platinum silicide region is formed.

  The heat treatment can be performed using an RTA or a furnace annealing furnace. Specifically, it may be performed in a temperature range of 300 ° C. to 700 ° C. for 10 seconds to 1 hour, preferably in a range of 20 seconds to 30 minutes. In this embodiment, heat treatment is performed at 600 ° C. for 30 seconds to form a high-concentration impurity region 536 including a nickel silicide region.

  The shape, film thickness, and the like of the silicidation region can be selected by appropriately controlling the film thickness of the metal layer 530 to be reacted, the heat treatment temperature, the heat treatment time, and the like. Note that although an example in which the high concentration impurity region 536 including a partially silicided region is formed is described in this embodiment mode, the present invention is not particularly limited, and the entire high concentration impurity region is silicided. It is good. 8 shows an example where the silicide under the sidewall insulating layer 526 is not silicided; however, the present invention is not particularly limited, and the semiconductor layer 506 under the sidewall insulating layer 526 (however, the channel formation region 508 is excluded). May be silicided.

  If the unreacted metal layer 530 remains after silicidation of the semiconductor layer 506, it is removed. Specifically, the metal layer 530 formed over the sidewall insulating layer 526, the gate electrode 524, and the insulating layer 504 is removed. In the case where an unreacted metal layer remains on the high-concentration impurity region 536 including the silicided region, the remaining metal layer is also removed. To remove the unreacted metal layer, a wet etching method or a dry etching method can be used. At this time, as an etching gas or an etching solution, an unreacted metal layer and another layer (for example, a sidewall insulating layer 526, a conductive layer 522, an insulating layer 504, and a high-concentration impurity region 536 including a silicided region) The etching selectivity ratio is sufficient. In other words, a material having a high etching rate for the metal layer and a low etching rate for other layers may be used. For example, when a nickel layer is formed as the metal layer 530, it can be removed by wet etching using a solution of sulfuric acid, nitric acid, or the like.

  Through the above, a thin film transistor which is a semiconductor device according to the present invention can be formed (see FIG. 8D).

  In the present invention, when the sidewall insulating layer 526 is formed, a nitride film (second insulating layer 516) functioning as an etching stopper is formed. Therefore, overetching at the time of forming the sidewall insulating layer 526 can be stopped by the nitride film, and the lower semiconductor layer 506 can be prevented from being etched to vary the film thickness. In particular, when the sidewall insulating layer 526 is formed, the semiconductor layer forming the source region or the drain region is easily etched, but can be prevented by forming a nitride film that functions as an etching stopper. Therefore, variation in characteristics of the completed semiconductor device such as variation in resistance of the source region or drain region can be suppressed.

  In this embodiment mode, part or all of the high-concentration impurity regions are silicided. Therefore, contact resistance between a source or drain electrode to be formed later and the source or drain region can be reduced. In addition, by applying the present invention, variation in the thickness of the semiconductor layer is suppressed when the silicidation process is performed, so that the silicide conditions can be easily controlled.

  Note that heat treatment may be performed to activate the impurity element added to the semiconductor layer 506. The heat treatment can be performed using laser beam irradiation, an RTA, or a furnace annealing furnace. Specifically, it may be performed in a temperature range of 400 ° C. to 700 ° C., preferably 500 ° C. to 650 ° C. The heat treatment is preferably performed in a nitrogen atmosphere. For example, activation can be performed by heating at 550 ° C. for 4 hours. In the case of activation by laser beam irradiation, for example, an excimer laser can be used. In the case of laser beam irradiation, it is possible to recover plasma damage at an insulating layer functioning as an upper gate insulating layer and an interface between the insulating layer and the semiconductor layer, along with activation of the impurity element. Note that by applying the present invention to reduce the variation in the thickness of the semiconductor layer, the laser beam irradiation conditions can be easily set.

  The structure of the transistor described in this embodiment is an example and is not limited to the illustrated structure.

  By applying the present invention, a variation in characteristics due to the formation of the sidewall insulating layer can be suppressed, and a semiconductor device can be manufactured with high yield.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 4)
In this embodiment, an example of a semiconductor device having a structure different from that in the above embodiment is described with reference to drawings. First, an example of a thin film transistor according to this embodiment will be described with reference to FIGS. Note that FIG. 9A illustrates an example of a cross-sectional view, and FIG. 9B illustrates an example of a top view. FIG. 9A corresponds to a cross-sectional view taken along the broken line OP in the top view in FIG. 9B. Note that the drawing shown here is an example and can be appropriately changed depending on a desired layout.

  The semiconductor device illustrated in FIG. 9 includes a thin film transistor provided over a substrate 300 with an insulating layer 302 and an insulating layer 304 interposed therebetween. The thin film transistor includes a semiconductor layer 306 provided in an island shape, an insulating layer 318 provided over the semiconductor layer 306, and a gate electrode 324 provided over the semiconductor layer 306 with the insulating layer 318 provided therebetween. .

  The gate electrode 324 is formed with a stacked structure of a conductive layer 320 and a conductive layer 322. A sidewall insulating layer 326 is formed on the side surface of the gate electrode 324. Here, the gate electrode 324 is provided so as to cross the island-shaped semiconductor layer 306.

  In this embodiment, the gate electrode 324 is formed to have a two-layer structure of a conductive layer 320 and a conductive layer 322, and the width of the lower conductive layer 320 (the insulating layer 318 side) is larger than that of the upper conductive layer 322. An example is shown in which it is formed so as to be large. In addition, an example is shown in which the side surfaces of the conductive layer 322 and the conductive layer 320 forming the gate electrode 324 are close to a vertical shape. Needless to say, the present invention is not particularly limited, and the gate electrode structure described in any of Embodiments 1 to 3 may be employed. In addition, the gate electrode may have a single layer structure or a stacked structure including three or more layers. In the case of a laminated structure of two or more conductive layers, the layers may be formed so that the widths of the layers are approximately the same. In addition, the side surface of the conductive layer forming the gate electrode may be tapered, and when the gate electrode has a stacked structure, the taper angle may be different for each layer.

  The sidewall insulating layer 326 is formed of a substantially triangular oxide film on the side surface of the gate electrode. As the oxide film, a film containing silicon oxide (SiOx), silicon oxynitride (SiOxNy) (x> y> 0), or the like may be formed.

  An insulating layer 318 is formed between the semiconductor layer 306, the gate electrode 324, and the sidewall insulating layer 326. The insulating layer 318 functions as a gate insulating layer. One feature of this embodiment is that a region of the insulating layer 318 which does not overlap with the gate electrode 324 is formed using a nitride film on the side where the sidewall insulating layer 326 is provided. Note that other regions (for example, a region overlapping with the gate electrode 324 and a region where the semiconductor layer 306 is provided) are preferably formed using an oxide film. Specifically, an insulating layer 318 including a region 316 formed of a nitride film is formed.

  As the nitride film for forming the region 316, a film containing silicon nitride (SiNx), silicon nitride oxide (SiNxOy), or the like can be formed. The other region of the insulating layer 318 is preferably formed using an oxide film containing silicon oxide (SiOx), silicon oxynitride (SiOxNy), aluminum oxide (AlxOy), or the like.

  Note that the thickness of the insulating layer 318 is 1 nm to 110 nm, preferably 2 nm to 20 nm. It is preferable to reduce the thickness of the gate insulating layer because the transistor can be operated at high speed with low voltage. In this embodiment, the insulating layer 318 is formed with a thickness of about 7 nm.

  The semiconductor layer 306 includes a channel formation region 308, a pair of low-concentration impurity regions 310 that function as LDD regions, and a pair of high-concentration impurity regions 312 that function as source or drain regions. The channel formation region 308 is located between the pair of high concentration impurity regions 312, and the low concentration impurity region 310 is located between the channel formation region 308 and the high concentration impurity region 312. That is, the channel formation region 308 is located between the pair of high concentration impurity regions 312 and the pair of low concentration impurity regions 310. The high concentration impurity region 312 is doped with an impurity element imparting one conductivity type at a higher concentration than the low concentration impurity region 310.

  The thickness of the semiconductor layer 306 is 5 nm to 150 nm, preferably 10 nm to 25 nm. In this embodiment, the semiconductor layer 306 has a thickness of 10 nm. Note that an end portion of the semiconductor layer 306 may have a tapered shape or a shape close to a vertical shape.

  In the semiconductor layer 306, the channel formation region 308 is formed in a region overlapping with the gate electrode 324 (a stacked structure of the conductive layer 320 and the conductive layer 322). Note that the channel formation region 308 may be doped with an impurity element imparting one conductivity type for controlling the threshold voltage of the transistor. The high concentration impurity region 312 is formed in a region that does not overlap with the gate electrode 324 and the sidewall insulating layer 326. The low concentration impurity region 310 is formed in a region overlapping with the sidewall insulating layer 326.

  By forming the low-concentration impurity region 310 between the channel formation region 308 and the high-concentration impurity region 312, the electric field in the vicinity of the drain region can be relaxed, and as a result, generation of hot carriers can be suppressed. As described above, the generation of hot carriers causes a phenomenon called a short channel effect, so that it is effective to form a low-concentration impurity region that functions as an LDD region. In addition, when the element is miniaturized and the channel length is shortened, the electric field in the vicinity of the drain region is increased and hot carriers are easily generated. As a result, short channel effects such as a decrease in threshold voltage and an increase in subthreshold coefficient appear. Since it becomes easy, it is very effective to set it as the structure like this invention.

  In addition, since the LDD region (low-concentration impurity region 310) is formed in a self-aligning manner using the sidewall insulating layer 326, the LDD region can be formed with higher accuracy than when the resist mask layer is used even when the element is miniaturized. can do. This is because when a resist mask layer is formed by a photolithography process, a high degree of accuracy is required for mask alignment, and the difficulty increases as the size of the device decreases and the size decreases. If the position of the resist mask layer is shifted, an LDD region, a source region, or a drain region cannot be formed in a desired region, resulting in a variation in element characteristics.

  In the present invention, in the insulating layer 318 functioning as a gate insulating layer, a region in contact with the sidewall insulating layer 326 is formed using a nitride film (region 316). Since the sidewall insulating layer 326 is formed using an oxide film, the region 316 formed using a nitride film functions as an etching stopper, so that the lower layer can be protected and the semiconductor layer or the like can be prevented from being etched. In particular, in the case of thinning the semiconductor layer in order to miniaturize and improve the performance of the element, it is highly possible that the semiconductor layer is etched and partially disappeared by overetching when forming the sidewall insulating layer. The configuration of the present invention is very effective. In addition, by forming the interface side with the semiconductor layer with an oxide film, it is possible to prevent the interface from being defective.

  Next, an example of a method for manufacturing the semiconductor device illustrated in FIG. 9 is described with reference to drawings. Note that the description of the same configuration as that in the above embodiment is simplified and partly omitted.

  An island-shaped semiconductor layer 306 is formed over the substrate 300 with the insulating layer 302 and the insulating layer 304 interposed therebetween (see FIG. 10A).

  As the substrate 300, a substrate having an insulating surface may be used. For example, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate with an insulating layer formed on the surface, or a semiconductor substrate such as a silicon substrate can be used.

  The insulating layer 302 and the insulating layer 304 are formed using silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon nitride oxide (SiNxOy), or the like by a CVD method, a sputtering method, an ALD method, or the like. do it. The insulating layers 302 and 304 function as a base insulating layer. Specifically, the insulating layers 302 and 304 can function as a blocking layer that prevents the alkali metal or the like from diffusing from the substrate 300 to the semiconductor layer to contaminate the semiconductor layer. In the case where the surface of the substrate 300 is uneven, the substrate 300 can also function as a planarization layer. Note that the insulating layer 302 and the insulating layer 304 are not necessarily formed if impurity diffusion from the substrate 300 or unevenness on the surface of the substrate 300 is not a problem. Although the base insulating layer has a two-layer structure here, it may have a single-layer structure or a three-layer structure or more. For example, when the base insulating layer has a two-layer structure, a silicon nitride oxide layer can be formed as the first layer, and a silicon oxynitride layer can be formed as the second layer. Alternatively, a silicon nitride layer may be formed as the first layer and a silicon oxide layer may be formed as the second layer.

  The semiconductor layer 306 is preferably formed using a single crystal semiconductor or a crystalline semiconductor. The semiconductor layer 306 is formed with a thickness of 5 nm to 150 nm, preferably 10 nm to 25 nm. Note that a method for manufacturing the semiconductor layer 306 may be similar to that of the semiconductor layer 106 in Embodiment 1.

  For example, an island-shaped semiconductor layer 306 that is a crystalline semiconductor layer can be formed by crystallizing a semiconductor layer formed over the entire surface of the substrate 300 by a CVD method or a sputtering method and then selectively etching the semiconductor layer. . The semiconductor layer 306 is preferably formed using a semiconductor material containing silicon as a main component. The semiconductor layer is crystallized by a laser crystallization method, a thermal crystallization method using rapid thermal annealing (RTA) or a furnace annealing furnace, a crystallization method using a metal element that promotes crystallization, or a combination of these methods. Can be performed. Preferably, when laser crystallization is performed using a CW laser, crystal grains that are long in one direction can be formed. In the case where the thickness of the semiconductor layer 506 is 50 nm or less, after forming a crystalline semiconductor layer with a thickness of 50 nm or more, the semiconductor layer may be etched to be thinned. In this embodiment, a crystalline silicon layer with a thickness of 10 nm is formed as the semiconductor layer 506.

  Note that an SOI substrate in which a single crystal semiconductor layer is provided over an insulating surface may be used as the semiconductor layer instead of a thin film process using various crystallization methods. In this case, the semiconductor layer 506 can be formed using a single crystal semiconductor layer provided over an insulating surface.

Further, an impurity element imparting one conductivity type for controlling the threshold voltage of the transistor may be added to the semiconductor layer. By adding an impurity element having a predetermined concentration to a semiconductor layer which later forms a channel formation region, the threshold voltage of the transistor can be forcibly shifted to a desired threshold voltage. As an impurity element imparting one conductivity type, an element imparting p-type such as boron (B), aluminum (Al), or gallium (Ga), or n-type such as phosphorus (P) or arsenic (As) is imparted. Elements can be used. In the case of this embodiment mode, an element imparting p-type, such as boron, can be added at a concentration of about 1 × 10 ¹⁶ cm ^{−3 to} 1 × 10 ¹⁸ cm ⁻³ . Note that the impurity element for controlling the threshold voltage of the transistor may be added before the gate electrode is formed.

  Next, the insulating layer 313 is formed over the semiconductor layer 306 (see FIG. 10B).

  As the insulating layer 313, an oxide film containing silicon oxide, silicon oxynitride, aluminum oxide, or the like is formed by a CVD method, a sputtering method, an ALD method, or the like. Alternatively, the semiconductor layer 306 may be solid-phase oxidized by plasma treatment to form an oxide film. The thickness of the insulating layer 313 is 1 nm to 110 nm, preferably 2 nm to 20 nm. Since the insulating layer 313 forms a gate insulating layer of a completed transistor, a thinner one is preferable because high speed operation can be performed at a low voltage.

  Next, a conductive layer is formed over the insulating layer 313. Here, a stacked structure of a conductive layer 319 and a conductive layer 321 is formed as the conductive layer (see FIG. 10C).

  The conductive layers 319 and 321 are formed using a conductive material by a CVD method or a sputtering method. As the conductive material, metal elements such as tantalum (Ta), tungsten (W), titanium (Ti), molybdenum (Mo), chromium (Cr), aluminum (Al), copper (Cu), or niobium (Nb), Alternatively, an alloy material or a compound material containing the metal element can be used. Alternatively, a semiconductor material such as polycrystalline silicon to which an impurity element imparting one conductivity type such as phosphorus is added can be used. Note that although an example in which a stacked structure of the conductive layers 319 and 321 is formed is shown here, a single layer structure may be used. The conductive layer (a stacked structure of the conductive layer 319 and the conductive layer 321) is formed with a thickness of 50 nm to 1000 nm, preferably 100 nm to 800 nm, more preferably 200 nm to 500 nm.

  In this embodiment, a tantalum nitride layer with a thickness of 30 nm is formed as the conductive layer 319 and a tungsten layer with a thickness of 170 nm is formed as the conductive layer 321.

  Next, the conductive layer 319 and the conductive layer 321 are selectively etched to form a gate electrode. Here, an example is shown in which the conductive layer 321 and the conductive layer 319 are sequentially etched to form the gate electrode.

  First, the conductive layer 321 is selectively etched to form the conductive layer 322 (see FIG. 10D). The conductive layer 322 can be formed by selectively covering the conductive layer 321 formed over the entire surface of the substrate with a resist mask and etching a portion not covered with the resist mask. Here, an example is shown in which the side surface of the conductive layer 322 has a shape close to vertical.

  Next, the conductive layer 319 is selectively etched using the conductive layer 322 as a mask, so that the conductive layer 320 is formed. The stacked structure of the conductive layer 320 and the conductive layer 322 forms a gate electrode 324 (see FIG. 11A). Here, an example is shown in which the side surface of the conductive layer 320 has a shape close to vertical. In addition, an example is shown in which the conductive layer 320 which is the lower layer (the insulating layer 313 side) is formed to have a larger width than the conductive layer 322.

  As a method for etching the conductive layer 321 and the conductive layer 319, a dry etching method or a wet etching method can be used. Note that in this embodiment, it is preferable to form the conductive layer 321 and the conductive layer 319 having a stacked structure using a layer having a sufficient etching selectivity. Thus, when the conductive layer 321 is etched, the conductive layer 319 can function as an etching stopper. Here, an example in which the conductive layer 319 is formed using a tantalum nitride layer and the conductive layer 321 is formed using a tungsten layer is shown.

  Next, solid-phase nitriding treatment by plasma treatment is performed on the insulating layer 313, so that the insulating layer 318 including a region 316 formed of a nitride film is formed (see FIG. 11A).

The solid phase nitridation by plasma treatment is in accordance with the description of the first embodiment. For example, a plasma processing apparatus 1080 as shown in FIG. 5 is used, and a high-density plasma 350 excited by a high frequency such as a microwave is used. In this embodiment, since solid-phase nitridation is performed, an atmosphere containing nitrogen (for example, an atmosphere containing nitrogen (N ₂ ) and a rare gas (containing at least one of He, Ne, Ar, Kr, and Xe)) Plasma treatment may be performed in an atmosphere containing nitrogen, hydrogen, and a rare gas, or an atmosphere containing NH ₃ and a rare gas. By performing plasma treatment, the surface of the insulating layer 313 or the vicinity of the surface is nitrided to form a nitrogen plasma treatment layer (corresponding to the region 316) having a high nitrogen concentration. Note that a gate electrode 324 is formed over the insulating layer 313, and the insulating layer 313 in a region overlapping with the gate electrode 324 is not solid-phase nitrided. Accordingly, as shown in FIG. 11A, a region 316 formed of a nitride film is formed in the vicinity of the surface of the insulating layer 313 in a region that does not overlap with the gate electrode 324. The region 316 is formed using silicon nitride or silicon nitride oxide depending on plasma treatment conditions.

  By using the solid-phase nitriding treatment by plasma treatment as described above, a region 316 that is a dense film and can function as an etching stopper when forming the sidewall insulating layer is formed at a treatment temperature of 500 ° C. or lower. can do. In addition, a thin region near the surface can be nitrided, and the other region can be an oxide film. Therefore, the interface with the semiconductor layer 306 can be formed using an oxide film, and the interface characteristics can be improved.

  Note that in the case where the region 316 is formed by performing solid-phase nitridation by plasma treatment, it may be difficult to distinguish a clear boundary from other regions (regions formed by an oxide film) in which the insulating layer 318 is formed. When comparing at least the nitrogen content in the film, the side wall insulating layer side is assumed to be high. Here, the boundary of the region 316 is indicated by a dotted line.

Next, an impurity element 332 imparting one conductivity type is selectively added to the semiconductor layer 306 at a first concentration, so that a pair of low-concentration impurity regions 309 and a channel formation region 308 are formed (FIG. 11 ( B)). Here, an impurity element is added using the gate electrode 324 (the conductive layers 322 and 320) as a mask, and a pair of low-concentration impurity regions 309 and a channel located between the pair of low-concentration impurity regions 309 are formed in a self-aligning manner. Region 308 is formed. A part of the low concentration impurity region 309 formed here forms an LDD region later. As an impurity element imparting one conductivity type, an element imparting n-type such as phosphorus (P) or arsenic (As), or p-type such as boron (B), aluminum (Al), or gallium (Ga) is imparted. Elements can be used. In this embodiment mode, phosphorus which is an element imparting n-type conductivity as an impurity element is added so as to have a peak concentration of about 1 × 10 ¹⁸ cm ⁻³ .

  Note that the solid-phase nitriding treatment by plasma treatment on the insulating layer 313 may be performed after adding an impurity element imparting one conductivity type at the first concentration.

  Next, after the sidewall insulating layer 326 is formed on the side surface of the gate electrode 324 (the conductive layers 322 and 320), the impurity element 334 which imparts one conductivity type to the semiconductor layer 306 is selectively selected at the second concentration. By adding, a pair of high-concentration impurity regions 312 and a pair of low-concentration impurity regions 310 are formed (see FIG. 11C).

  The sidewall insulating layer 326 can be formed by first covering the gate electrode 324 so that the gate electrode 324 is embedded, forming an insulating layer by a CVD method or a sputtering method, and then selectively etching the insulating layer. Specifically, the sidewall insulating layer 326 having a substantially triangular shape can be formed by anisotropic etching mainly in the vertical direction. The sidewall insulating layer 326 can be used as a doping mask when an LDD region is formed later.

  Since the insulating layer 318 according to the present invention has a region 316 formed of a nitride film on the side in contact with the sidewall insulating layer 326, the insulating layer formed of an oxide film is selectively etched to form the sidewall insulating layer 326. In doing so, the region 316 can function as an etching stopper. Therefore, etching to the lower semiconductor layer 306 due to over-etching can be prevented.

For example, in the case where the region 316 is a silicon nitride oxide layer formed by solid phase nitridation and the sidewall insulating layer 326 is formed of a silicon oxynitride layer, a dry etching method is performed using a mixed gas such as C ₄ F ₈ or Ar. By etching, the region 316 can sufficiently function as an etching stopper.

  In particular, when the semiconductor layer is thinned to 10 nm to 25 nm, the influence of the semiconductor layer disappearing due to over-etching when forming the sidewall insulating layer or the thickness of the semiconductor layer varies becomes significant. Therefore, the configuration as in the present invention is very effective. Variation in the thickness of the semiconductor layer leads to variation in characteristics of a completed semiconductor device such as a transistor. Therefore, by using the structure of the present invention, a highly reliable semiconductor device can be manufactured with high yield. Note that depending on the etching conditions for forming the sidewall insulating layer 326, part of the upper layer of the insulating layer 318 may be etched to reduce the film thickness (referred to as film reduction).

The high-concentration impurity region 312 and the low-concentration impurity region 310 are formed in a self-aligned manner using the gate electrode 324 and the sidewall insulating layer 326 formed on the side surface as a mask. The high concentration impurity region 312 formed here functions as a source region or a drain region, and the low concentration impurity region 310 functions as an LDD region. As the impurity element imparting one conductivity type, an impurity element having the same conductivity type as the element added when the above-described low-concentration impurity region 309 is formed can be used. Note that the impurity element is added at a higher second concentration than the first concentration. Therefore, an impurity element having a higher concentration than that of the low concentration impurity region 310 is added to the high concentration impurity region 312. In this embodiment mode, phosphorus which is an element imparting n-type conductivity as an impurity element is added so as to have a peak concentration of about 1 × 10 ²¹ cm ⁻³ .

  In this manner, a channel formation region 308, a pair of low concentration impurity regions 310, and a pair of high concentration impurity regions 312 are formed in the semiconductor layer 306. A channel formation region 308 is located between the pair of high concentration impurity regions 312, and a low concentration impurity region 310 is formed between the high concentration impurity region 312 and the channel formation region 308, respectively. The channel formation region 308 is formed in a region where the semiconductor layer 306 overlaps with the gate electrode 324 (conductive layers 322 and 320). The high concentration impurity region 312 is formed in a region that does not overlap with the gate electrode 324 and the sidewall insulating layer 326. The low concentration impurity region 310 is formed in a region overlapping with the sidewall insulating layer 326.

  Note that after the impurity element imparting one conductivity type is added to the semiconductor layer 306, heat treatment is preferably performed to activate the added impurity element. The heat treatment can be performed using laser beam irradiation, an RTA, or a furnace annealing furnace. Specifically, it may be performed in a temperature range of 400 ° C. to 700 ° C., preferably 500 ° C. to 650 ° C. The heat treatment is preferably performed in a nitrogen atmosphere. For example, activation can be performed by heating at 550 ° C. for 4 hours. In the case of activation by laser beam irradiation, for example, an excimer laser can be used. In the case of laser beam irradiation, it is possible to recover plasma damage at an insulating layer functioning as an upper gate insulating layer and an interface between the insulating layer and the semiconductor layer, along with activation of the impurity element.

  Further, as shown in Embodiment Mode 3, part of the semiconductor layer 306 may be silicided. For example, after manufacturing the structure shown in FIG. 11C, the semiconductor layer 306 (high-concentration impurity region) is removed by removing the gate electrode 324 and the insulating layer 313 which does not overlap with the sidewall insulating layer 326 formed on the side surface thereof. 312) is exposed. Then, after forming a metal layer on the exposed semiconductor layer, heat treatment is performed to silicide the region in contact with the metal layer and the semiconductor layer in the vicinity thereof. The shape, film thickness, and the like of the silicided region can be selected by appropriately controlling the film thickness of the metal layer to be reacted, the temperature and time of the heat treatment, and the like. After silicidation of a desired region, the remaining metal layer may be removed using a wet etching method or the like.

  In the present invention, when the sidewall insulating layer 326 is formed, the insulating layer 313 including the nitride film (region 316) functioning as an etching stopper is formed. Therefore, overetching at the time of forming the sidewall insulating layer 326 can be stopped by the nitride film, and the lower semiconductor layer 306 can be prevented from being etched to vary the film thickness. In particular, when the sidewall insulating layer 326 is formed, the semiconductor layer forming the source region or the drain region is easily etched, but can be prevented by forming a nitride film functioning as an etching stopper. Therefore, variation in characteristics of the completed semiconductor device such as variation in resistance of the source region or drain region can be suppressed.

  In this embodiment, when part or all of the high-concentration impurity regions are silicided, contact resistance between a source electrode or a drain electrode to be formed later and the source region or the drain region can be reduced. it can. In addition, since the film thickness variation of the semiconductor layer is suppressed when the silicidation process is performed, the control of the silicide conditions is facilitated. In addition, when the impurity element added to the semiconductor layer is activated by laser beam irradiation, variation in the thickness of the semiconductor layer is suppressed, so that it is easy to set the laser beam irradiation conditions.

  The structure of the transistor described in this embodiment is an example and is not limited to the illustrated structure.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 5)
The semiconductor device according to the present invention can be applied to an integrated circuit such as a CPU (Central Processing Unit). In this embodiment, an example of a CPU to which the semiconductor device described in any of Embodiments 1 to 4 is applied is described below with reference to drawings.

  The CPU 3660 shown in FIG. 12 includes an arithmetic circuit (ALU) 3601, an arithmetic circuit control circuit unit (ALU Controller) 3602, an instruction analysis unit (Instruction Decoder) 3603, an interrupt control unit (Interrupt Controller) on the substrate 3600. 3604, timing controller 3605, register 3606, register controller 3607, bus interface (bus I / F) 3608, rewritable ROM 3609, ROM interface (ROM I / F) 3620 It has mainly. The ROM 3609 and the ROM interface 3620 may be provided in separate chips. Various circuits included in the CPU 3660 can be formed using the thin film transistor described in any of Embodiments 1 to 4, a CMOS circuit in which the thin film transistor is combined, an nMOS circuit, a pMOS circuit, or the like.

  The CPU 3660 illustrated in FIG. 12 is merely an example in which the configuration is simplified, and an actual CPU has various configurations depending on the application. Therefore, the configuration of the CPU to which the present invention is applied is not limited to that shown in FIG.

  An instruction input to the CPU 3660 via the bus interface 3608 is input to the instruction analysis unit 3603 and decoded, and then is input to the arithmetic circuit control circuit unit 3602, the interrupt control unit 3604, the register control unit 3607, and the timing control unit 3605. Entered.

  The arithmetic circuit control circuit portion 3602, the interrupt control portion 3604, the register control portion 3607, and the timing control portion 3605 perform various controls based on the decoded instruction. Specifically, the arithmetic circuit control circuit portion 3602 generates a signal for controlling driving of the arithmetic circuit 3601. The interrupt control unit 3604 determines and processes an interrupt request from an external input / output device or a peripheral circuit from the priority or mask state during execution of the program of the CPU 3660. The register control unit 3607 generates an address of the register 3606, and reads and writes the register 3606 according to the state of the CPU.

  In addition, the timing control unit 3605 generates a signal for controlling the driving timing of the arithmetic circuit 3601, the arithmetic circuit control circuit unit 3602, the instruction analysis unit 3603, the interrupt control unit 3604, and the register control unit 3607. For example, the timing control unit 3605 includes an internal clock generation unit that generates an internal clock signal CLK2 (3622) based on the reference clock signal CLK1 (3621), and supplies the clock signal CLK2 to the various circuits.

  Here, an example of a CMOS circuit which can be applied to the CPU 3660 is shown (see FIG. 13). In the CMOS circuit shown here, an n-channel transistor 810 and a p-channel transistor 820 are formed over a substrate 800 with insulating layers 802 and 804 interposed therebetween. In addition, an insulating layer 830 is formed so as to cover the n-channel transistor 810 and the p-channel transistor 820, and a conductive layer 840 electrically connected to the transistor 810 or the transistor 820 through the insulating layer 830 is formed. In addition, the transistor 810 and the transistor 820 are electrically connected by a conductive layer 840.

  As the substrate 800, a substrate having an insulating surface may be used. For example, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate having an insulating layer formed on the surface, or the like can be used.

  The insulating layers 802 and 804 are formed using a material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide by a CVD method, a sputtering method, or an ALD method. The insulating layers 802 and 804 function as blocking layers that prevent alkali metal and the like from diffusing from the substrate 800 to the transistors 810 and 820 and being contaminated. In the case where the surface of the substrate 800 is uneven, the substrate 800 can function as a planarization layer. Note that the insulating layers 802 and 804 are not necessarily formed if impurity diffusion from the substrate 800 or unevenness on the surface of the substrate 800 is not a problem. Although the base insulating layer has a two-layer structure here, a single-layer structure or a stacked structure of three or more layers may be used.

  The transistors described in any of Embodiments 1 to 4 may be applied to the transistors 810 and 820. Note that the transistors 810 and 820 have different conductivity types. For example, the transistor 810 may be an n-channel transistor and the transistor 820 may be a p-channel transistor. Here, an example in which the transistor described in Embodiment 1 is applied is illustrated.

  The insulating layer 830 can be formed by CVD, sputtering, ALD, coating, or the like, an inorganic insulating material containing oxygen or nitrogen, such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide, or DLC (diamond-like carbon). An insulating material containing carbon such as epoxy, polyimide, polyamide, polyvinylphenol, benzocyclobutene, and an organic insulating material such as acrylic, or a siloxane material such as a siloxane resin. Note that the siloxane material corresponds to a material including a Si—O—Si bond. Siloxane has a skeleton structure formed of a bond of silicon (Si) and oxygen (O). As a substituent, an organic group containing at least hydrogen (for example, an alkyl group or an aromatic hydrocarbon) is used. A fluoro group can also be used as a substituent. Alternatively, an organic group containing at least hydrogen and a fluoro group may be used as a substituent. The insulating layer 830 may be formed by forming an insulating layer using a CVD method, a sputtering method, or an ALD method, and then performing high-density plasma treatment on the insulating layer in an oxygen atmosphere or a nitrogen atmosphere. . Here, the insulating layer 830 shows an example of a single layer structure; however, it may have a stacked structure of two or more layers. Moreover, you may form combining an inorganic insulating layer and an organic insulating layer.

  The conductive layer 840 is formed using a CVD method or a sputtering method using aluminum (Al), tungsten (W), titanium (Ti), tantalum (Ta), molybdenum (Mo), nickel (Ni), platinum (Pt), copper A metal element such as (Cu), gold (Au), silver (Ag), manganese (Mn), neodymium (Nd), carbon (C), silicon (Si), or an alloy material or a compound material containing the metal element Used to form a single layer structure or a laminated structure. Examples of the alloy material containing aluminum include a material containing aluminum as a main component and nickel, or an alloy material containing aluminum as a main component and containing nickel and one or both of carbon and silicon. The conductive layer 840 has, for example, a stacked structure of a barrier layer, an aluminum silicon (Al—Si) layer, and a barrier layer, or a stacked structure of a barrier layer, an aluminum silicon (Al—Si) layer, a titanium nitride (TiN) layer, and a barrier layer. Can be adopted. Note that the barrier layer corresponds to a thin film formed of titanium, a nitride of titanium, molybdenum, or a nitride of molybdenum. Aluminum and aluminum silicon are optimal materials for forming the conductive layer 840 because they have low resistance and are inexpensive. Further, it is preferable to provide an upper barrier layer and a lower barrier layer because generation of hillocks of aluminum or aluminum silicon can be prevented.

  The conductive layer 840 functions as a source electrode or a drain electrode. The conductive layer 840 is electrically connected to the transistors 810 and 820 through an opening formed in the insulating layer 830. Specifically, the conductive layer 840 is electrically connected to the source or drain region of the transistor 810 and the source or drain region of the transistor 820. Further, the source region or the drain region of the transistor 810 is electrically connected to the source region or the drain region of the transistor 820 with the conductive layer 840 interposed therebetween. As described above, a CMOS circuit can be formed.

  FIG. 14 shows a display device in which a pixel portion, a CPU, and other circuits are formed over the same substrate, a so-called system-on-panel. Over a substrate 3700, a pixel portion 3701, a scan line driver circuit 3702 for selecting a pixel included in the pixel portion 3701, and a signal line driver circuit 3703 for supplying a video signal to the selected pixel are provided. A CPU 3704 and other circuits such as a control circuit 3705 are connected to each other by wiring drawn from the scan line driver circuit 3702 and the signal line driver circuit 3703. The control circuit includes an interface. Then, a connection portion with an FPC terminal is provided at an end portion of the substrate, and exchange with an external signal is performed.

  As other circuits, a video signal processing circuit, a power supply circuit, a gradation power supply circuit, a video RAM, a memory (DRAM, SRAM, PROM) and the like can be provided in addition to the control circuit 3705. These circuits may be formed by an IC chip and mounted on a substrate. Further, the scan line driver circuit 3702 and the signal line driver circuit 3703 are not necessarily formed over the same substrate. For example, only the scan line driver circuit 3702 is formed over the same substrate, and the signal line driver circuit 3703 is formed using an IC chip. May be implemented.

  Note that although an example in which the semiconductor device according to the present invention is applied to a CPU has been described in this embodiment, the present invention is not particularly limited. For example, the semiconductor device according to the present invention can be applied to a pixel portion, a driver circuit portion, and the like of a display device including an organic light emitting element, an inorganic light emitting element, a liquid crystal display element, or the like. In addition, by applying the present invention, a digital camera, a sound reproducing device such as a car audio, a notebook personal computer, a game machine, a portable information terminal (mobile phone, portable game machine, etc.), a home game machine, etc. It is also possible to manufacture an image reproducing device provided with a recording medium.

  A semiconductor device to which the present invention is applied can suppress variation in characteristics of a semiconductor device such as a transistor. Thus, a highly reliable semiconductor device with high yield can be provided.

  In addition, when a transistor having a metal silicide region as described in the above embodiment is applied, contact resistance (contact resistance between a conductive layer and a semiconductor layer) can be reduced, so that signal delay or the like can be prevented. Therefore, circuit driving at high speed is possible.

(Embodiment 6)
In this embodiment, an example of usage of the semiconductor device described in the above embodiment is described. Specifically, application examples of a semiconductor device capable of inputting and outputting data without contact will be described below with reference to the drawings. A semiconductor device that can input and output data without contact is also referred to as an RFID tag, an ID tag, an IC tag, an IC chip, an RF tag, a wireless tag, an electronic tag, or a wireless chip, depending on the application.

  An example of a top structure of the semiconductor device described in this embodiment will be described with reference to FIG. A semiconductor device 2180 illustrated in FIG. 15 includes a thin film integrated circuit 2131 provided with a plurality of elements such as thin film transistors included in a memory portion and a logic portion, and a conductive layer 2132 functioning as an antenna. The conductive layer 2132 functioning as an antenna is electrically connected to the thin film integrated circuit 2131. The thin film transistor according to the present invention described in any of Embodiments 1 to 3 can be applied to the thin film integrated circuit 2131.

  FIGS. 15B and 15C are schematic views of the cross section of FIG. The conductive layer 2132 functioning as an antenna may be provided above the elements included in the memory portion and the logic portion. For example, the insulating layer 2130 is provided above the thin film integrated circuit 2131 including the thin film transistor described in the above embodiment mode. A conductive layer 2132 which functions as an antenna can be provided through (see FIG. 15B). In addition, after the conductive layer 2132 functioning as an antenna is provided over the substrate 2133, the substrate 2133 and the thin film integrated circuit 2131 can be attached to each other so that the conductive layer 2132 is positioned therebetween (FIG. 15). (See (C)). In FIG. 15C, a conductive layer 2136 provided over the insulating layer 2130 and a conductive layer 2132 functioning as an antenna are electrically connected to each other through conductive particles 2134 contained in a resin 2135 having adhesiveness. An example is shown.

  Note that although an example in which the conductive layer 2132 functioning as an antenna is provided in a coil shape and an electromagnetic induction method or an electromagnetic coupling method is applied is described in this embodiment mode, the semiconductor device of the present invention is not limited thereto, and a microwave method is used. It is also possible to apply. In the case of a microwave method, the shape of the conductive layer 2132 functioning as an antenna may be determined as appropriate depending on the wavelength of the electromagnetic wave used.

  For example, when a microwave method (for example, UHF band (860 MHz to 960 MHz band), 2.45 GHz band, or the like) is used as a signal transmission method in the semiconductor device 2180, the wavelength of an electromagnetic wave used for signal transmission is set to The shape such as the length of the conductive layer functioning as an antenna may be appropriately set in consideration. For example, the conductive layer functioning as an antenna has a linear shape (for example, a dipole antenna (see FIG. 16A)), a flat shape (for example, a patch antenna (see FIG. 16B)), or a ribbon shape (see FIG. 16). (See (C) and (D))). In addition, the shape of the conductive layer 2132 functioning as an antenna is not limited to a linear shape, and a curved shape, a meandering shape, or a combination thereof may be provided in consideration of the wavelength of electromagnetic waves.

  The conductive layer 2132 functioning as an antenna is formed using a conductive material by a CVD method, a sputtering method, a printing method such as screen printing or gravure printing, a droplet discharge method, a dispenser method, a plating method, or the like. Conductive materials are aluminum (Al), titanium (Ti), silver (Ag), copper (Cu), gold (Au), platinum (Pt) nickel (Ni), palladium (Pd), tantalum (Ta), molybdenum A metal element such as (Mo) or an alloy material or compound material containing the metal element is used to form a single layer structure or a stacked structure.

  For example, when the conductive layer 2132 that functions as an antenna is formed by screen printing, a conductive paste in which conductive particles having a particle size of several nanometers to several tens of micrometers are dissolved or dispersed in an organic resin is selected. Can be provided by printing. Conductor particles include silver (Ag), gold (Au), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), tantalum (Ta), molybdenum (Mo) and titanium (Ti). Any one or more metal particles, silver halide fine particles, or dispersible nanoparticles can be used. In addition, as the organic resin contained in the conductive paste, one or more selected from organic resins that function as a binder of metal particles, a solvent, a dispersant, and a coating material can be used. Typically, an organic resin such as an epoxy resin or a silicon resin can be given. In forming the conductive layer, it is preferable to fire after extruding the conductive paste. For example, in the case where fine particles containing silver as a main component (for example, fine particles having a particle diameter of 1 nm to 100 nm) are used as a conductive paste material, the conductive layer is cured by baking at a temperature range of 150 ° C. to 300 ° C. Can be formed. Further, fine particles mainly composed of solder or lead-free solder may be used. In this case, it is preferable to use fine particles having a particle diameter of 20 μm or less. Solder and lead-free solder have the advantage of low cost.

  A semiconductor device to which the present invention is applied can suppress variation in characteristics and can provide a semiconductor device with high yield and high reliability. Further, as in this embodiment mode, data can be input / output without contact, and the present invention can be applied to a small semiconductor device.

  Next, an operation example of the semiconductor device according to the present embodiment will be described.

  The semiconductor device 2180 has a function of communicating data without contact, and controls the high-frequency circuit 81, the power supply circuit 82, the reset circuit 83, the clock generation circuit 84, the data demodulation circuit 85, the data modulation circuit 86, and other circuits. A control circuit 87, a memory circuit 88, and an antenna 89 are provided (see FIG. 17A). The high frequency circuit 81 is a circuit that receives a signal from the antenna 89 and outputs the signal received from the data modulation circuit 86 from the antenna 89. The power supply circuit 82 is a circuit that generates a power supply potential from the received signal. The reset circuit 83 is a circuit that generates a reset signal. The clock generation circuit 84 is a circuit that generates various clock signals based on the reception signal input from the antenna 89. The data demodulation circuit 85 is a circuit that demodulates the received signal and outputs it to the control circuit 87. The data modulation circuit 86 is a circuit that modulates a signal received from the control circuit 87. Further, as the control circuit 87, for example, a code extraction circuit 91, a code determination circuit 92, a CRC determination circuit 93, and an output unit circuit 94 are provided. The code extraction circuit 91 is a circuit that extracts a plurality of codes included in an instruction sent to the control circuit 87, and the code determination circuit 92 compares the extracted code with a code corresponding to a reference. The CRC determination circuit 93 is a circuit that detects the presence or absence of a transmission error or the like based on the determined code. In FIG. 17A, in addition to the control circuit 87, a high-frequency circuit 81 and a power supply circuit 82 which are analog circuits are included.

  Next, an example of operation of the above-described semiconductor device will be described. First, a radio signal is received by the antenna 89. The radio signal is sent to the power supply circuit 82 via the high frequency circuit 81, and a high power supply potential (hereinafter referred to as VDD) is generated. VDD is supplied to each circuit included in the semiconductor device 2180. In addition, the signal sent to the data demodulating circuit 85 via the high frequency circuit 81 is demodulated (hereinafter referred to as a demodulated signal). Further, the signal and the demodulated signal that have passed through the reset circuit 83 and the clock generation circuit 84 via the high frequency circuit 81 are sent to the control circuit 87. The signal sent to the control circuit 87 is analyzed by the code extraction circuit 91, the code determination circuit 92, the CRC determination circuit 93, and the like. Then, information on the semiconductor device stored in the memory circuit 88 is output in accordance with the analyzed signal. The output semiconductor device information is encoded through the output unit circuit 94. Further, the encoded information of the semiconductor device 2180 passes through the data modulation circuit 86 and is transmitted on the radio signal by the antenna 89. Note that a plurality of circuits included in the semiconductor device 2180 have a common low power supply potential (hereinafter referred to as VSS), and VSS can be GND.

  In this manner, a signal is transmitted from the communication unit (for example, a reader / writer, or a unit having a function of either a reader or a writer) to the semiconductor device 2180, and the signal transmitted from the semiconductor device 2180 is received by the reader / writer. As a result, the data of the semiconductor device can be read.

  In addition, the semiconductor device 2180 may be a type in which the power supply voltage is supplied to each circuit by an electromagnetic wave without mounting the power source (battery), or each circuit is mounted by the electromagnetic wave and the power source (battery). The power supply voltage may be supplied to the type.

  Next, an example of a usage pattern of a semiconductor device capable of inputting and outputting data without contact will be described. A communication means 3200 is provided on a side surface of the portable terminal including the display portion 3210, and a semiconductor device 3230 is provided on a side surface of the article 3220 (see FIG. 17B). Note that the communication unit 3200 has a function of reading a signal and a function of transmitting a signal, such as a reader / writer, or a function of reading a signal or a function of transmitting a signal. When the communication means 3200 is placed over the semiconductor device 3230 included in the product 3220, information about the product such as the product raw material, the place of origin, the inspection result for each production process, the history of the distribution process, and the like, and the product description are displayed on the display unit 3210. The Further, when the product 3260 is conveyed by the belt conveyor, the product 3260 can be inspected using the communication unit 3240 and the semiconductor device 3250 provided in the product 3260 (see FIG. 17C). As the semiconductor device 3230 and the semiconductor device 3250, the above-described semiconductor device 2180 can be used. As described above, by utilizing the semiconductor device according to the present invention in the system, information can be easily acquired, and high functionality and high added value are realized. In addition, since the semiconductor device according to the present invention can suppress variation in characteristics, the semiconductor device has high reliability, and it is possible to reliably inspect products.

  In addition to the above, the semiconductor device according to the present invention has a wide range of uses, and is applicable to any product that can be used for production, management, etc. by clarifying information such as the history of the object without contact. can do. For example, banknotes, coins, securities, certificate documents, bearer bonds, packaging containers, books, recording media, personal belongings, vehicles, foods, clothing, health supplies, daily necessities, chemicals, etc. It can be provided and used in an electronic device or the like. These examples will be described with reference to FIG.

  Banknotes and coins are money that circulates in the market, and include those that are used in the same way as money in a specific area (cash vouchers), commemorative coins, and the like. Securities refer to checks, securities, promissory notes, and the like (see FIG. 18A). The certificate refers to a driver's license, a resident's card, etc. (see FIG. 18B). Bearer bonds refer to stamps, gift tickets, various gift certificates, and the like (see FIG. 18C). Packaging containers refer to wrapping paper for lunch boxes, plastic bottles, and the like (see FIG. 18D). Books refer to books, books, and the like (see FIG. 18E). The recording media refer to DVD software, video tapes, and the like (see FIG. 18F). The vehicles refer to vehicles such as bicycles, ships, and the like (see FIG. 18G). Personal belongings refer to bags, glasses, and the like (FIG. 18H). Foods refer to food products, beverages, and the like. Clothing refers to clothing, footwear, and the like. Health supplies refer to medical equipment, health equipment, and the like. Livingware refers to furniture, lighting equipment, and the like. Chemicals refer to pharmaceuticals, agricultural chemicals, and the like. Electronic devices refer to liquid crystal display devices, EL display devices, television devices (television receivers, thin television receivers), cellular phones, and the like.

  Forgery can be prevented by providing the semiconductor device 2180 for bills, coins, securities, certificates, bearer bonds, and the like. In addition, by providing semiconductor devices 2180 for personal items such as packaging containers, books, recording media, personal items, foods, daily necessities, electronic devices, etc., the efficiency of inspection systems and rental store systems will be improved. Can do. Forgery or theft can be prevented by providing the semiconductor device 2180 for vehicles, health supplies, medicines, and the like. Moreover, if it is chemicals, the mistake of taking a medicine can be prevented. As a method for providing the semiconductor device 2180, the semiconductor device 2180 is attached to the surface of an article or embedded in an article. For example, a book may be embedded in paper, and a package made of an organic resin may be embedded in an organic resin.

  In this way, by providing semiconductor devices in packaging containers, recording media, personal items, foods, clothing, daily necessities, electronic devices, etc., it is possible to improve the efficiency of inspection systems and rental store systems. it can. Further, forgery or theft can be prevented by providing a semiconductor device in the vehicles. Moreover, by embedding it in creatures such as animals, it is possible to easily identify individual creatures. For example, by embedding or attaching a semiconductor device equipped with a sensor to a living creature such as livestock, it is possible to easily manage the health status such as the current body temperature as well as the year of birth, gender or type.

  Note that this embodiment can be freely combined with the above embodiment.

FIG. 9 illustrates an example of a main structure of a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. The figure which shows the example of a structure of a plasma processing apparatus. FIG. 6 illustrates an example of a structure of a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. FIG. 9 illustrates an example of a main structure of a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. 8A and 8B illustrate an example of a method for manufacturing a semiconductor device according to the present invention. 1 is a block diagram illustrating an example of a semiconductor device according to the present invention. FIG. 10 is a cross-sectional view illustrating an example of a semiconductor device according to the invention. 1 is a perspective view illustrating an example of a semiconductor device according to the present invention. 4A and 4B are a top view and a cross-sectional view illustrating an example of a semiconductor device according to the invention. 4A and 4B illustrate an antenna which can be used in a semiconductor device according to the invention. 1A and 1B are a block diagram illustrating an example of a semiconductor device according to the invention and a diagram illustrating an example of a usage pattern. FIG. 10 illustrates an application example of a semiconductor device according to the invention.

Explanation of symbols

100 substrate 102 insulating layer 104 insulating layer 106 semiconductor layer 108 channel formation region 109 low concentration impurity region 110 low concentration impurity region 112 high concentration impurity region 114 first insulating layer 116 second insulating layer 118 insulating layer 119 conductive layer 120 conductive layer 121 Conductive layer 122 Conductive layer 124 Gate electrode 125 Insulating layer 126 Side wall insulating layer 132 Impurity element 134 Impurity element 136 Laser beam

Claims (4)

Forming an island-like semiconductor layer,
Forming a first insulating layer on the semiconductor layer;
Forming a gate electrode on the semiconductor layer via the first insulating layer;
By performing a high-density plasma treatment in an atmosphere containing nitrogen, a part of the first insulating layer in a region that does not overlap with the gate electrode is nitrided,
Forming a second insulating layer using an oxide film so as to cover the gate electrode;
A method for manufacturing a semiconductor device, wherein the second insulating layer is selectively etched to form a sidewall insulating layer on a side surface of the gate electrode. In claim 1 ,
The method for manufacturing a semiconductor device, wherein the part of the first insulating layer is a region in the vicinity of the surface of the first insulating layer. In claim 1 or claim 2 ,
A method for manufacturing a semiconductor device, wherein the oxide film includes a film containing silicon oxide, silicon oxynitride, or aluminum oxide. In any one of Claim 1 thru | or 3 ,
A method for manufacturing a semiconductor device, wherein an impurity region is formed in a self-aligning manner by adding an impurity element to the semiconductor layer using the gate electrode as a mask.

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