JP5149878B2 - 透明樹脂積層板 - Google Patents
透明樹脂積層板 Download PDFInfo
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- JP5149878B2 JP5149878B2 JP2009196485A JP2009196485A JP5149878B2 JP 5149878 B2 JP5149878 B2 JP 5149878B2 JP 2009196485 A JP2009196485 A JP 2009196485A JP 2009196485 A JP2009196485 A JP 2009196485A JP 5149878 B2 JP5149878 B2 JP 5149878B2
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- resin
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- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
- Non-Insulated Conductors (AREA)
Description
(1)表面に透明導電膜が形成される透明樹脂積層板であって、ポリカーボネート樹脂層と、該ポリカーボネート樹脂層の前記透明導電膜が形成される側の片面と反対側の他面に積層されるアクリル樹脂層と、を備え、ポリカーボネート樹脂層とアクリル樹脂層とを、共押出成形で積層一体化することによりなることを特徴とする透明樹脂積層板。
(2)前記ポリカーボネート樹脂層の厚みが全体の厚みの50%以上である前記(1)記載の透明樹脂積層板。
(3)前記アクリル樹脂層がメタクリル樹脂およびゴム状重合体からなる層である前記(1)または(2)記載の透明樹脂積層板。
(4)ポリカーボネート樹脂層の前記片面にアクリル樹脂層を積層した前記(1)〜(3)のいずれかに記載の透明樹脂積層板。
(5)タッチパネルにおける透明導電体の透明基板として使用される前記(1)〜(4)のいずれかに記載の透明樹脂積層板。
(6)タッチパネルにおける下部電極の透明基板として使用される前記(1)〜(4)のいずれかに記載の透明樹脂積層板。
特に、前記(6)のように、加工時において物理的な衝撃を受ける下部電極の透明基板として好適である。
押出機32:スクリュー径45mm、一軸、ベント付き(日立造船(株)製)。
フィードブロック:2種3層および2種2層分配(日立造船(株)製)。
ダイ33:Tダイ、リップ幅1400mm、リップ間隔1mm(日立造船(株)製)。
冷却ロール35:横型、面長1400mm、径300mmφの冷却ロール2本。
(1番ロール36)
軸ロールの外周面を覆うように金属製薄膜を配置し、軸ロールと金属製薄膜との間に流体を封入した金属弾性ロールを1番ロール36とした。軸ロール、金属製薄膜および流体は、次の通りである。
金属製薄膜:厚さ2mmのステンレス鋼製の鏡面金属スリーブ。
流体:油であり、この油を温度制御することによって、金属弾性ロールを温度制御可能にした。より具体的には、温度調節機のON−OFF制御により前記油を加熱、冷却して温度制御可能にし、軸ロールと金属製薄膜との間に循環させた。
表面状態を鏡面にしたステンレス鋼製のスパイラルロール(金属ロール)を2番ロール37とした。
なお、1番ロール36,2番ロール37が溶融樹脂34を介して接触する接触長さは、4mmにした。
1番ロール36,2番ロール37を、いずれも表面状態を鏡面にしたステンレス鋼製のスパイラルロールとした。
樹脂1:芳香族ポリカーボネートのみの重合体(住友ダウ(株)製の「カリバー301−10」)。
樹脂2: メタクリル酸メチル/アクリル酸メチル=98/2(重量比)の共重合体。
樹脂3:メタクリル酸メチル/アクリル酸メチル=96/4(重量比)の共重合体91重量%に下記参考例で得たアクリル系多層構造重合体を9重量%含有させたアクリル樹脂系組成物。
樹脂4:メタクリル酸メチル/アクリル酸メチル=96/4(重量比)の共重合体79重量%に下記参考例で得たアクリル系多層構造重合体を21重量%含有させたアクリル樹脂系組成物。
(ゴム状重合体の製造)
特公昭55−27576号の実施例に記載の方法に準拠して、3層構造からなるアクリル系多層構造重合体を製造した。具体的には、まず、内容積5Lのガラス製反応容器に、イオン交換水1700g、炭酸ナトリウム0.7g、過硫酸ナトリウム0.3gを仕込み、窒素気流下で撹拌後、ペレックスOT−P((株)花王製)4.46g、イオン交換水150g、メチルメタクリレート150g、アリルメタクリレート0.3gを仕込んだ後、75℃に昇温し150分間撹拌を続けた。
<透明樹脂積層板の作製>
樹脂層Aとして、表1に示す種類の樹脂を押出機31にて溶融混練し、フィードブロックに供給した。一方、樹脂層Bとして、表1に示す種類の樹脂を押出機32にて溶融混練し、フィードブロックに供給した。押出機31からフィードブロックに供給される樹脂層Aが主層となり、押出機32からフィードブロックに供給される樹脂層Bが表層(2番ロール37側)となるように、共押出成形を行った。
樹脂層Aとして、表1に示す種類の樹脂を押出機31にて溶融混練し、フィードブロックに供給した。一方、樹脂層Bとして、表1に示す種類の樹脂を押出機32にて溶融混練し、フィードブロックに供給した。押出機31からフィードブロックに供給される樹脂層Aが中間層となり、押出機32からフィードブロックに供給される樹脂層Bが両表層となるように、共押出成形を行った。
表1に示す種類の樹脂を押出機31にて溶融混練し、フィードブロックおよびダイ33の順に供給した。そして、ダイ33から押出された溶融樹脂34を、表1に示すロール構成の1番ロール36および2番ロール37で挟持しながら製膜し、表1に示す厚さの単層構造からなる透明樹脂板を得た。
得られた各透明樹脂積層板および透明樹脂板(実施例1〜22および比較例1〜4)について、鉛筆硬度および全光線透過率の評価を行った。各評価方法を以下に示すと共に、その結果を表1に併せて示す。
JIS K5600に準拠して測定した。なお、実施例1〜11の透明樹脂積層板における測定面は、樹脂層Bである。
JIS K7361−1:1997に準拠し、ヘイズメーターHM−150((株)村上色彩技術研究所製)を用いて測定した。なお、実施例1〜11は、樹脂層Bを光源に対向させて測定した。
1a 片面
1b 他面
2,3 アクリル樹脂層
10,11 透明樹脂積層板
10a,11a 表面
10b,11b 裏面
20 透明導電体
21 透明導電膜
31,32 押出機
33 ダイ
34 溶融樹脂
35 冷却ロール
36 1番ロール
37 2番ロール
Claims (6)
- 表面に透明導電膜が形成される透明樹脂積層板であって、ポリカーボネート樹脂層と、該ポリカーボネート樹脂層の前記透明導電膜が形成される側の片面と反対側の他面に積層されるアクリル樹脂層と、を備え、ポリカーボネート樹脂層とアクリル樹脂層とを、共押出成形で積層一体化することによりなることを特徴とする透明樹脂積層板。
- 前記ポリカーボネート樹脂層の厚みが全体の厚みの50%以上である請求項1記載の透明樹脂積層板。
- 前記アクリル樹脂層がメタクリル樹脂およびゴム状重合体からなる層である請求項1または2記載の透明樹脂積層板。
- ポリカーボネート樹脂層の前記片面にアクリル樹脂層を積層した請求項1〜3のいずれかに記載の透明樹脂積層板。
- タッチパネルにおける透明導電体の透明基板として使用される請求項1〜4のいずれかに記載の透明樹脂積層板。
- タッチパネルにおける下部電極の透明基板として使用される請求項1〜4のいずれかに記載の透明樹脂積層板。
Priority Applications (5)
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JP2009196485A JP5149878B2 (ja) | 2009-08-27 | 2009-08-27 | 透明樹脂積層板 |
KR1020100080200A KR20110022533A (ko) | 2009-08-27 | 2010-08-19 | 투명 수지 적층판 |
TW099127952A TWI601639B (zh) | 2009-08-27 | 2010-08-20 | Transparent resin laminate |
CN2010102627141A CN102001206A (zh) | 2009-08-27 | 2010-08-23 | 透明树脂层叠板 |
KR1020180029340A KR102139854B1 (ko) | 2009-08-27 | 2018-03-13 | 투명 수지 적층판 |
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KR (2) | KR20110022533A (ja) |
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TW (1) | TWI601639B (ja) |
Cited By (2)
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JP2015132691A (ja) * | 2014-01-10 | 2015-07-23 | 大日本印刷株式会社 | 樹脂積層板及びタッチパネル |
JP2017129868A (ja) * | 2017-02-27 | 2017-07-27 | 大日本印刷株式会社 | 樹脂積層板及びタッチパネル |
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JP5525390B2 (ja) * | 2010-09-03 | 2014-06-18 | 住友化学株式会社 | 熱可塑性樹脂押出板 |
JP2013020130A (ja) * | 2011-07-12 | 2013-01-31 | Keiwa Inc | ハードコートフィルム及びこれを用いたタッチパネル |
JP6128830B2 (ja) * | 2012-12-21 | 2017-05-17 | 住友化学株式会社 | 積層板 |
CN103902117B (zh) * | 2012-12-31 | 2018-10-02 | 昆山维信诺显示技术有限公司 | 一种电容式触摸屏及其制备方法 |
JP6040081B2 (ja) * | 2013-03-28 | 2016-12-07 | 日東電工株式会社 | 透明導電性積層体の製造方法 |
JP5860837B2 (ja) * | 2013-05-16 | 2016-02-16 | デクセリアルズ株式会社 | 静電容量型タッチパネル |
EP3073100B1 (en) * | 2013-11-18 | 2018-06-27 | Kawasaki Jukogyo Kabushiki Kaisha | Engine |
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JP2019206738A (ja) * | 2018-05-30 | 2019-12-05 | Dowaエレクトロニクス株式会社 | 銀ナノワイヤインクおよび透明導電膜の製造方法並びに透明導電膜 |
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JP2667686B2 (ja) * | 1988-11-07 | 1997-10-27 | 日東電工株式会社 | 透明導電性積層体 |
JPH07205385A (ja) | 1994-01-12 | 1995-08-08 | Teijin Chem Ltd | ポリカーボネート樹脂積層板 |
JP3953161B2 (ja) * | 1997-11-14 | 2007-08-08 | 藤森工業株式会社 | 透明導電性シートの製造法 |
KR100420775B1 (ko) | 1998-06-17 | 2004-03-02 | 미쯔비시 레이온 가부시끼가이샤 | 내충격성 아크릴계 중합체 펠렛 및 그의 제조 방법 |
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JP2003151357A (ja) * | 2001-11-16 | 2003-05-23 | Bridgestone Corp | 透明導電板、その製造方法及びタッチパネル |
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JP4069997B2 (ja) * | 2001-11-22 | 2008-04-02 | 日東電工株式会社 | 透明導電性フィルムの表面保護方法 |
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JP2006134872A (ja) * | 2004-10-06 | 2006-05-25 | Toray Ind Inc | 透明導電性フィルム及びタッチパネル |
ATE555483T1 (de) * | 2007-01-16 | 2012-05-15 | Teijin Ltd | Transparenter leitfähiger mehrschichtiger körper und daraus hergestellter berührungsschirm |
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JP4992561B2 (ja) | 2007-06-08 | 2012-08-08 | Tdk株式会社 | インモールド用金型、タッチパネル用中間体製造方法、タッチパネル用中間体およびタッチパネル |
JP2009110842A (ja) * | 2007-10-31 | 2009-05-21 | Sumitomo Chemical Co Ltd | ボタンスイッチ被覆用積層樹脂体 |
JP2009129375A (ja) * | 2007-11-27 | 2009-06-11 | Fujitsu Component Ltd | パネル型入力装置 |
JP5620644B2 (ja) * | 2009-02-09 | 2014-11-05 | 住友化学株式会社 | タッチパネル用積層押出樹脂板およびタッチパネル用表面塗工板 |
JP2013543138A (ja) | 2010-09-02 | 2013-11-28 | 日東電工株式会社 | 電解質を利用することによってフォトリフラクティブデバイスの性能を改良するためのシステムおよび方法 |
KR101579354B1 (ko) | 2013-06-19 | 2015-12-21 | 주식회사 엘지화학 | 다층 코어-쉘 구조의 고무질 중합체 라텍스, 이의 제조방법 및 이를 포함하는 아크릴로니트릴-부타디엔-스티렌 그라프트 공중합체 |
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- 2010-08-20 TW TW099127952A patent/TWI601639B/zh not_active IP Right Cessation
- 2010-08-23 CN CN2010102627141A patent/CN102001206A/zh active Pending
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- 2018-03-13 KR KR1020180029340A patent/KR102139854B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015132691A (ja) * | 2014-01-10 | 2015-07-23 | 大日本印刷株式会社 | 樹脂積層板及びタッチパネル |
JP2017129868A (ja) * | 2017-02-27 | 2017-07-27 | 大日本印刷株式会社 | 樹脂積層板及びタッチパネル |
Also Published As
Publication number | Publication date |
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KR20110022533A (ko) | 2011-03-07 |
TW201130655A (en) | 2011-09-16 |
KR102139854B1 (ko) | 2020-07-30 |
CN102001206A (zh) | 2011-04-06 |
TWI601639B (zh) | 2017-10-11 |
KR20180030408A (ko) | 2018-03-22 |
JP2011046098A (ja) | 2011-03-10 |
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