JP4912281B2 - Circuit board soldering jig - Google Patents

Description

  The present invention relates to a circuit board soldering jig for holding a circuit board and masking portions other than a part to be soldered when dip soldering to the circuit board.

  The circuit board is configured by mounting a plurality of electronic components on the substrate, and electronic components such as lead components are connected by soldering as necessary. Soldering is performed by dip soldering by immersing a board on which electronic components are mounted in molten solder. In that case, the part which is not soldered among the electronic components mounted in the board | substrate is covered with a mask. For example, the dip soldering is performed by attaching a circuit board to a frame-shaped jig. The jig exposes only the part to be soldered and masks the other parts. Such a technique is disclosed in Patent Document 1, Patent Document 2, and Patent Document 3, for example.

  Patent Document 1 discloses a technique in which a surface to be soldered (a solder dip surface) of a circuit board is covered with a metal thin plate, and a portion to be soldered such as a lead is passed through a through hole provided in the thin plate. Has been. Patent Document 2 discloses a technique in which an opening that allows solder to enter is provided in a part of a mask plate so that a lead portion faces the opening. Patent Document 3 discloses a jig having a mask portion that covers a chip component and an opening portion that contacts only a necessary portion with solder.

Japanese Patent No. 2872715 Japanese Patent Publication No. 7-87266 Japanese Utility Model Publication No. 4-123574

The jigs and the like described in Patent Document 1 to Patent Document 3 are all dedicated to the circuit board to be soldered, and if the circuit board changes, a jig or the like corresponding to the circuit board is required. Further, it cannot cope with a change in soldering location (dip location), that is, a change in the arrangement of electronic components. Furthermore, since the used jigs and the like cannot be applied to other circuit boards, they are not reusable.
A large number of jigs are required for the flow soldering operation, and as described above, it is not possible to cope with changes in different circuit boards and soldering positions. It must be prepared, which is not preferable in terms of cost and recycling.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a soldering jig that can cope with different circuit boards and different solder dip positions and can be recycled.

Soldering jig circuit board according to the invention comprises a frame body, a plurality of pieces like mask components are combined in the frame body constituting the substrate mounting portion for holding the circuit board, the thickness by combining different said mask part of is, forming a circuit board mounting part for fitting the circuit board, and a storage portion for storing the components mounted on the circuit board, an opening for exposing a portion soldered Do it.

According to the soldering jig circuit board according to the present invention, it is not necessary to prepare an entirely new jig they change structure and size of the circuit board, cost reduction, recycling of resources attained.

Embodiment 1 FIG.
Hereinafter, a circuit board soldering jig according to Embodiment 1 of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view during assembly of the soldering jig, and FIGS. 2 to 5 are partial perspective views thereof. 6 is a perspective view of a soldering jig and a circuit board (the circuit board shows the front and back surfaces thereof), and FIG. 7 is a perspective view of the circuit board held by the soldering jig during soldering. It is.

  In FIG. 6, the circuit board 2 shown together with the circuit board soldering jig 1 according to the first embodiment has a lead component 5, 6, and a surface mount type on the component mounting surface 4 on the front side of the substrate body 3. IC 18 and chip parts 8 and 9 are mounted, and lead 12 and 13 and lands 14 and 15 of lead parts 5 and 6 that require soldering are provided on the solder dip surface 11 on the back side of the substrate body 3. . A chip component 10 and an IC 7 are provided on the solder dip surface 11. In order to solder the leads 12, 13 and lands 14, 15, a certain range including them is contacted (immersed), that is, dipped, into the molten solder. In FIG. 6, the solder dip regions 16 and 17 are indicated by alternate long and short dash lines.

  The circuit board soldering jig 1 has a structure in which a large number of mask parts that can be divided are combined in, for example, a lattice shape and fixed from four sides by a frame body 21. The frame body 21 includes left and right vertical frame members 22 and horizontal frame members 23 respectively provided above and below them. The vertical frame member 22 and the horizontal frame member 23 that are adjacent to each other at right angles are connected to each other by angle-shaped fasteners 24 and By being fastened by the fastening screw 25, it is assembled into a rectangular frame shape. On the inner side surfaces 22a and 23a of the vertical frame member 22 and the horizontal frame member 23 that are the inside when the frame body 21 is formed, grooves (recesses) 26 and 27 for coupling mask components are formed. . The vertical frame member 22 and the horizontal frame member 23 are formed of a heat resistant material such as glass epoxy resin or stainless steel.

  On the inner side of the frame body 21, an adjustment mask component 31 that adjusts the space between the inner side surfaces 22 a and 23 a of the frame body 21 and the outer side portion of the circuit board 2 is provided. The adjustment mask component 31 is provided along the inside of the frame body 21. On the four end faces of the adjustment mask part 31, the coupling convex part 32 and the other mask parts fitted to the vertical frame member 22 of the frame body 21 or the groove part 26 or 27 of the horizontal frame member 23 are fitted. A coupling recess 33 is formed. The inner side surface of the arranged adjustment mask parts 31 is slightly larger than the outer shape of the circuit board 2.

  A circuit board mounting portion 34 is formed by a large number of mask components as a substrate mounting portion for housing the circuit board 2 inside a rectangular frame formed by a large number of adjustment mask components 31. In the first embodiment, as a mask component, a soldering portion mask component 35 for forming openings corresponding to the solder dip regions 16 and 17 of the circuit board 2 (in the figure, reference numerals 35a, 35b and 35c are used as will be described later). And a mask part 36 for the entire surface covering the other parts. Since the circuit board mounting portion 34 is a portion on which the circuit board 2 is mounted, the circuit board mounting portion 34 is formed low with a step with respect to the adjustment mask component 31. Therefore, the thickness of the soldering part mask part 35 and the entire surface mask part 36 is smaller than that of the adjustment mask part 31. When the circuit board of the maximum size is held, the mask part 36 for the entire surface may be directly fitted into the groove portion of the frame body 21 without using the mask part 31 for adjustment. Similarly to the frame body 21, the soldering part mask part 35 and the entire surface mask part 36 are also formed of a heat resistant material such as glass epoxy resin or stainless steel.

  On each end face (four end faces) of the mask part 36 for the entire surface, a coupling convex part 37 for coupling with the mask part 31 for adjustment, the other mask part 36 for the entire surface, and the mask part 35 for the soldering part is formed. Further, a coupling recess 38 is formed for coupling to the other mask part 36 for the entire surface and the mask part 35 for the soldering part. The full-surface mask component 36 is connected to other full-surface mask components 36 and soldered portion mask components 35 on the entire peripheral surface thereof, like the full-face mask component indicated by reference numeral 36a in FIG. 37 may be formed, or in order to be combined with another full-face mask part 36 or a soldered part mask part 35 on the entire peripheral surface thereof, such as the full-face mask part indicated by reference numeral 36b in FIG. The concave portion 38 for coupling may be formed.

  The circuit board mounting portion 34 needs a portion for housing and covering the surface mount type IC 7 and the chip component 10 protruding from the solder dip surface 11 of the circuit board 2. As shown by the reference numeral 36c in FIG. 1, the mask part for the entire surface is thinner. By combining this thin overall mask part 36c with the other full face mask part 36 and the soldered part mask part 35, a housing part (counterbore part) 39 for the IC 7 and the chip part 10 is formed. .

  The soldering partial mask component 35 is combined with the entire surface mask component 36 or another soldering partial mask component 35 to form a linear opening 40 corresponding to the solder dip region 16 and a U-shape corresponding to the solder dip region 17. In addition, the opening 41 is rounded, and has a curved portion that forms a part of the shape of the solder dip region 17 as indicated by reference numerals 35a and 35b in FIG. As shown by reference numeral 35c in FIG. 1, the end surface on the solder dip region 16 side is configured to have a flat shape without a connecting convex portion or concave portion. The soldering partial mask component 35 is also provided with a coupling convex portion 37 and a coupling concave portion 38 for coupling with the adjacent mask component. The linear opening 40 may be formed by not using the mask part having a flat end face and not providing the mask part 36 for the entire surface.

  The circuit board mounting portion 34 is coupled by fitting a large number of mask components 31, 35, 36 as described above, and the strength is achieved by fitting the coupling convex portions 37 and the coupling concave portions 38 of the mask components to a certain extent. Can be issued. In this embodiment, the support member 42 is passed between the left and right vertical frame members 22 in order to reinforce the combined circuit board mounting portion 34. The support member 42 may be one or a plurality, and the direction in which the support member 42 is stretched is not limited to the horizontal direction. As shown in FIG. 3, slight gaps 43 and 44 for absorbing thermal expansion are provided between the mask parts to be fitted and joined.

  Although the back surface of the circuit board mounting portion 34 is immersed in molten solder, disturbing the solder flow affects the soldering performance. Therefore, a rectifying unit that rectifies the flow of solder is provided on the back surface of the circuit board mounting unit 34. As shown in FIG. 3, the fin-shaped rectification part 45 may be provided in the mask components 35 and 36, and the fin-shaped rectification part 46 may be provided in the support member 42 as shown in FIG.

Next, a procedure for assembling the circuit board soldering jig 1 using the above-described many mask parts (the adjustment mask part 31, the soldering part mask part 35, and the whole face mask part 36) will be described.
First, one vertical frame member 22 and one horizontal frame member 23 are fixed by a fastener 24 and a fastening screw 25. The coupling convex portions 32 of the required adjustment mask parts 31 are fitted into the grooves 26 and 27 of the vertical frame member 22 and the horizontal frame member 23 and coupled. The required mask component 36 (36a, 36b, 36c) for the entire surface is coupled to the coupled adjustment mask component 31 by fitting the coupling convex portions 32 , 37 and the coupling concave portions 33 , 38 to each other. . Further, the other-surface mask part 36 and the soldering part mask part 35 are coupled to the entire-surface mask part 36 by fitting the coupling convex part 37 and the coupling concave part 38 to each other. The circuit board mounting portion 34 is configured by combining and combining various required mask components.

  The frame substrate 21 is formed by sandwiching the constructed circuit board mounting portion 34 with the other vertical frame member 22 and the horizontal frame member 23 and fixing with the fasteners 24 and the fastening screws 25, and the adjustment mask 31 and the circuit. The substrate mounting part 34 is sandwiched by the vertical frame member 22 in the left-right direction and is sandwiched by the horizontal frame member 23 in the vertical direction to be integrated. Thus, the soldering jig 1 shown in FIG. 6 is configured. In this way, by combining a large number of mask parts 35 and 36 like a jigsaw puzzle, a linear opening 40 corresponding to the solder dip region 16, a curved opening 41 corresponding to the solder dip region 17, the IC 7 and the chip A circuit board mounting portion 34 having an accommodating portion 39 for accommodating the component 10 is configured.

A support member 42 is passed between the vertical frame members 22 on the back side of the configured circuit board mounting portion 34 and the adjustment mask component 31, and is fixed to the vertical frame member 22 by fastening screws 25.

  The circuit board 2 is placed on the circuit board placement portion 34 of the soldering jig 1 thus configured. The solder dip regions 16 and 17 of the circuit board 2 coincide with the openings 40 and 41 formed in the circuit board mounting part 34. That is, the lead portions 12 and 13 and the lands 14 and 15 to be soldered face the openings 40 and 41. In order to prevent the circuit board 2 from being detached from the circuit board mounting portion 34, some of the adjustment mask components 31 may be provided with fasteners 51 as shown in FIG. The fastener 51 includes, for example, a knob 52 and a hook portion 53, and has a structure in which the circuit board 2 is pressed by rotating the hook portion 53 with the knob 52.

  As shown in FIG. 6, the soldering jig 1 to which the circuit board 2 is attached is moved by a conveying means such as a conveyor (the moving direction is indicated by an arrow in FIG. 6), and the lower surface is melted in the solder dip tank 61. It is immersed in the solder 62. The solder dip regions 16 and 17 are immersed in the molten solder 62 through the openings 40 and 41. Therefore, the leads 12 and 13 and the lands 14 and 15 are soldered.

Although jet 63 solder for agitating the molten solder 62 in molten solder 62 (shown in arrow in FIG. 6) is formed, preferably provided a rectification portion 45, 46 to support member 42 and the mask parts 35, 36 Thus, the solder jet 63 can be efficiently guided to the openings 40 and 41. The shapes and orientations of the rectifying sections 45 and 46 can be optimally set in consideration of the positions of the openings 40 and 41, the orientation of the solder jet 63, the soldering method, and the like.

  According to the circuit board soldering jig according to the first embodiment, the openings 40 and 41 corresponding to the solder dip regions 16 and 17 are formed by combining a large number of piece-like mask components 35 and 36. In addition, by changing the combination of the mask parts 35 and 36, it is possible to deal with circuit boards having different structures, so that it is not necessary to prepare a new jig for each circuit board, thereby reducing costs and resources. Can be recycled. Further, since the frame body 21 has a size that can cover circuit boards of all sizes that are planned, it can also accommodate circuit boards of different sizes.

  The coupling of the mask parts 35, 36, etc. is a concave-convex fitting coupling that fits the concave portion and the convex portion, and can prevent entry of solder and heat from the coupling portion. In this uneven fitting connection, the strength is improved as compared with the case of a flat plate, so that deformation (warping) of the substrate due to thermal stress of the solder dip is suppressed, and solderability can be improved. In addition, the support member 42 is passed between the frame members 22 or 23 of the frame body 21 and fixed to the frame member 22 or 23 with the fastening screw 25, so that the divided and combined structure in the openings 40 and 41 and the accommodating portion 39 is achieved. Insufficient strength can be compensated.

  The frame body 21 is an assembly type, and by assembling the vertical frame member 22 and the horizontal frame member 23, a large number of mask parts 35 and 36 are fastened and fixed together, so that the mask parts can be fixed easily and reliably. .

  Furthermore, by providing the rectifying portions 45 and 46 in the support member 42 and the mask parts 35 and 36, the solder jet 63 can be efficiently guided to the openings 40 and 41, and the solderability can be improved. . That is, there is no unevenness in the soldering method, and a high quality solder can be obtained.

  The shape and dimensions of the mask component are selected so as to be applicable to a predetermined circuit structure. In the first embodiment, specially shaped mask parts such as mask parts 35a and 35b having curved portions are prepared to form the opening 41. However, in addition to the rectangular mask parts, convex and concave shapes are provided. By preparing various mask parts, it is possible to deal with openings of various shapes, and furthermore, without preparing mask parts of special shapes, even rectangular mask parts can be used for openings of various shapes. Can respond.

It is a perspective view in the middle of an assembly of the jig for circuit board soldering concerning Embodiment 1 of this invention. FIG. 3 is a perspective view of an adjustment mask component in the circuit board soldering jig according to the first embodiment. FIG. 3 is a perspective view of a full-face mask component in the circuit board soldering jig according to the first embodiment. FIG. 3 is a perspective view of a support member in the circuit board soldering jig according to the first embodiment. FIG. 3 is a perspective view of an example of a soldering part mask component in the circuit board soldering jig according to the first embodiment. 3 is a perspective view of a circuit board and a soldering jig for the circuit board according to Embodiment 1. FIG. FIG. 3 is a perspective view during soldering of the circuit board held by the soldering jig according to the first embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Soldering jig, 2 Circuit board, 3 Substrate body, 5, 6 Lead component, 7 IC, 8, 9, 10 Chip component, 12, 13 Lead, 14, 15 Land, 16, 17 Solder dip area, 21 Frame, 22 Vertical frame member, 23 Horizontal frame member, 31 Adjustment mask part, 32 Coupling convex part, 33 Coupling concave part, 34 Circuit board mounting part, 35a, 35b, 35c Mask part for soldering part, 36a 36b, 36c Mask parts for the entire surface, 39 accommodating portion, 40, 41 opening, 42 support member, 45, 46 rectifying portion, 62 molten solder, 63 solder jet.

Claims (5)

A soldering jig for holding the circuit board when soldering the circuit board,
A frame body, and a plurality of piece-shaped mask parts that are combined in the frame body and constitute a substrate mounting portion that holds the circuit board,
By combining different said mask component thicknesses, and the circuit board mounting portion for fitting the circuit board, and a storage portion for storing the components mounted on the circuit board, an opening for exposing a portion soldered A jig for soldering a circuit board, characterized by being formed.   2. The circuit board soldering jig according to claim 1, wherein the plurality of mask parts are sandwiched and fixed by a frame member constituting the frame body.   3. The circuit board soldering device according to claim 1, wherein the mask parts are coupled to each other or to the frame body by a fitting coupling structure of a concave portion and a convex portion. 4. jig.   The support member which supports the mask components combined in the frame body from the surface side immersed in the molten solder is provided in the frame body, according to any one of claims 1 to 3. Circuit board soldering jig.   5. The circuit board soldering according to claim 4, wherein a rectifying unit for rectifying the flow of the molten solder is provided on a surface immersed in the molten solder of one of the mask component and the support member. Jig.

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