JP4804959B2 - Method and apparatus for positioning printed circuit board - Google Patents

Description

  The present invention relates to a printed circuit board alignment method and apparatus therefor, and particularly when the two FPCs as two printed circuit boards or the respective layers at the time of manufacturing a multilayer printed circuit board are overlapped and connected. The present invention relates to a printed circuit board alignment method and apparatus for aligning layers.

  Conventionally, as shown in Patent Document 1, when an FPC is manufactured by bonding a copper-clad laminate and a translucent plastic film, the copper-clad laminate and the translucent plastic film are aligned. A method for manufacturing a laminate in which these are laminated at predetermined positions has been developed. In this case, the copper clad laminate is provided with an alignment mark made of, for example, a substantially circular conductor foil punched hole, and the semitransparent plastic film has a substantially circular shape larger than, for example, the punched hole of the conductor foil. An alignment mark made of a punched hole is provided.

  And, the semi-transparent plastic film overlaid on the copper-clad laminate is irradiated with illumination from the side of the translucent plastic film, and an alignment mark provided on the copper-clad laminate, and the translucent plastic film The position of the alignment mark is measured by an imaging means such as a CCD camera provided on the side of the semi-transparent plastic film by the reflected light from the copper-clad laminate and the semi-transparent plastic film. The alignment mark on the laminate and the alignment mark on the translucent plastic film are observed and aligned.

At this time, even if the alignment mark of the copper-clad laminate is hidden behind the alignment mark of the translucent plastic film, the position of the copper-clad laminate is adjusted by appropriately adjusting the amount of illumination light. Since the alignment marks can be seen, the above alignment marks can be aligned.
JP 2004-314436 A

  By the way, conventionally, as shown in Patent Document 1, in the method of manufacturing an FPC by bonding a copper-clad laminate and a semitransparent plastic film, the copper-clad laminate and the translucent plastic film are used. Because the reflected light illuminates the alignment mark on the copper-clad laminate and the alignment mark on the translucent plastic film with the imaging means, the illumination is adjusted to increase the contrast of the alignment mark on the translucent plastic film. Since it is necessary to increase the amount of illumination so that the alignment mark of the copper clad laminate hidden in the translucent plastic film can be seen while suppressing the amount of light, it is difficult to adjust the amount of illumination properly, and more clearly There was a problem of obtaining a clear image.

  Patent Document 1 aligns a copper-clad laminate and a translucent plastic film, and does not align the two FPCs in order to connect the two FPCs.

  The present invention has been made to solve the above-described problems.

In order to achieve the problem to be solved by the above invention, the printed circuit board alignment method according to the present invention provides a position between the two printed circuit boards when the two printed circuit boards are overlaid and connected. In a printed circuit board alignment method for performing alignment, transmitted light that passes through the two printed circuit board bases to align the two printed circuit boards with each other to the bases of the two printed circuit boards Two non-transparent alignment marks are provided at predetermined intervals, and transmitted light is irradiated from one side of the two printed circuit boards to the two printed circuit boards. by imaging the pre-Symbol position location mark on the other side of the substrate, the alignment marks of the two printed circuit boards, pre-aligned on the Is offset to the offset at the set distance position is characterized in that aligning the printed circuit boards.

Further, the printed circuit board alignment method of the present invention is a printed circuit board that performs alignment of the layers at the time of manufacturing the multilayer printed circuit board when the layers at the time of manufacturing the multilayer printed circuit board are overlapped and connected. In this alignment method, the base material of each layer at the time of manufacturing the multilayer printed circuit board is transmitted through the base material of each layer at the time of manufacturing the multilayer printed circuit board to the base material of each layer at the time of manufacturing the multilayer printed circuit board. Two alignment marks that are not transmissive to transmitted light are provided at predetermined intervals, and transmitted light is transmitted from one side of each layer when the multilayer printed circuit board is manufactured to each layer when the multilayer printed circuit board is manufactured. irradiating the, by imaging an alignment mark of the layers on the other side of each layer of the multilayer printed circuit board during manufacturing, the position if the layers The mark was, in which is offset at a position shifted at a preset distance in a straight line, characterized in that aligning between the respective layers.

Positioning a printed circuit board of this invention is a method of aligning the printed circuit board, wherein the predetermined distance is the same distance in each other the two printed circuit boards, the position between the printed circuit board For the alignment, it is preferable to align the printed circuit boards by offsetting the alignment marks of the two printed circuit boards to a position shifted by a predetermined distance on a straight line .
Further, in the printed circuit board alignment method of the present invention, in the printed circuit board alignment method, the predetermined interval is the same interval between the layers, and the alignment between the layers is performed by the layers. It is preferable to align the respective layers by offsetting the alignment mark to a position shifted by a predetermined distance on a straight line.

Positioning a printed circuit board of this invention is a method of aligning the printed circuit board, wherein the shape of the alignment mark of the two printed circuit board, is preferably different for each of the printed circuit board.
In the printed circuit board alignment method according to the present invention, the alignment mark shape of each layer is preferably different for each layer in the printed circuit board alignment method.

In the printed circuit board alignment method of the present invention, the wavelength of the transmitted light is preferably 0.46 to 1.0 μm in the printed circuit board alignment method.

The printed circuit board alignment apparatus according to the present invention is the printed circuit board alignment apparatus that performs alignment between the two printed circuit boards when the two printed circuit boards are connected to each other. Alignment marks provided on the bases of the two printed circuit boards so as to be non-transmissive to transmitted light that passes through the bases of the two printed circuit boards and to align the two printed circuit boards with each other When imaging for imaging an illumination device, a pre-Symbol position location mark on the other side of the two printed circuit board for irradiating light transmitted from one side of the two printed circuit boards to the two printed circuit boards A driving unit that moves one of the two printed circuit boards relative to the other, and an image data captured by the imaging unit. And a control unit which gives an instruction to align the front Symbol position location marks based on data on the drive unit, the alignment marks in each two by a predetermined interval for each of the two printed circuit boards The control device is provided with a command for aligning the alignment mark based on the image data captured by the imaging unit to the driving unit, and the alignment marks of the two printed circuit boards are aligned on a straight line. The printed circuit boards are aligned with each other by being offset to a position shifted by a preset distance .

According to the printed circuit board alignment apparatus of the present invention, when the layers at the time of manufacturing the multilayer printed circuit board are overlapped and connected, the positions of the printed circuit boards for performing alignment between the layers at the time of manufacturing the multilayer printed circuit board are described. In the alignment apparatus, the base material of each layer at the time of manufacturing the multilayer printed circuit board is non-transmissive to transmitted light that passes through the base material of each layer at the time of manufacturing the multilayer printed circuit board, and at the time of manufacturing the multilayer printed circuit board An alignment mark provided for aligning each of the layers with each other, and an illuminating device for irradiating each layer at the time of manufacturing the multilayer printed circuit board from one side of the layer at the time of manufacturing the multilayer printed circuit board with transmitted light An imaging unit that images the alignment mark of each layer on the other side of each layer when the multilayer printed circuit board is manufactured; and the multilayer printed circuit board A drive unit that moves one of the layers during fabrication relative to the other, and a command for positioning the alignment marks of the layers based on image data captured by the imaging unit. And two alignment marks are provided at predetermined intervals for each of the layers, and the control apparatus uses the alignment marks based on image data captured by the imaging unit. A command for aligning the printed circuit boards is given to the drive unit, and the printed circuit boards are aligned by offsetting the alignment marks of the respective layers to positions shifted on a straight line by a preset distance. Is.

Positioning device of the printed circuit board of this invention is the positioning device of the printed circuit board, wherein the predetermined distance is the same distance in each other the two printed circuit boards, the position between the printed circuit board For the alignment, it is preferable to align the printed circuit boards by offsetting the alignment marks of the two printed circuit boards to a position shifted by a predetermined distance on a straight line .
In the printed circuit board alignment apparatus according to the present invention, in the printed circuit board alignment apparatus, the predetermined interval is the same interval between the layers, and the alignment between the layers is performed by the layers. It is preferable to align the respective layers by offsetting the alignment mark to a position shifted by a predetermined distance on a straight line.

In the printed circuit board alignment apparatus according to the present invention, it is preferable that the alignment marks of the two printed circuit boards have different shapes for the printed circuit boards .
In the printed circuit board alignment apparatus according to the present invention, the alignment mark shape of each layer is preferably different for each layer in the printed circuit board alignment apparatus.

In the printed circuit board alignment apparatus according to the present invention, the wavelength of the transmitted light is preferably 0.46 to 1.0 μm in the printed circuit board alignment apparatus.

  As can be understood from the means for solving the above problems, according to the printed circuit board alignment method of the present invention, one of the two printed circuit boards to be overlaid or one of the respective layers when the multilayer printed circuit board is manufactured. Each of the layers when the printed circuit board or the multilayer printed circuit board is manufactured on the other side of the two layers when the two printed circuit boards or the multilayer printed circuit board is manufactured. Since the transmitted light transmitted through the substrate is observed, the alignment marks of the respective layers at the time of manufacturing two printed circuit boards or multilayer printed circuit boards more clearly than in the case of imaging reflected light as in the past An image can be obtained. Based on this image data, one side of each layer at the time of manufacturing two printed circuit boards or a multilayer printed circuit board can be moved relative to the other side so that the alignment marks can be efficiently and reliably aligned.

  Further, according to the printed circuit board alignment apparatus of the present invention, two printed circuit boards or multilayer printed circuit boards can be illuminated by an illuminating device from one side of each layer when two printed circuit boards or multilayer printed circuit boards to be superimposed are manufactured. Irradiate the transmitted light that passes through the base material of each layer at the time of manufacturing, and observe the transmitted light that has passed through the base material of the two printed circuit boards on the other side of each of the two printed circuit boards or multilayer printed circuit boards Since the imaging unit is arranged, it is possible to obtain two more clear images of the alignment marks on the printed circuit board as compared with the conventional case of imaging the reflected light. Based on the image data of the imaging unit that captured this image, one side of each layer at the time of manufacturing two printed circuit boards or a multilayer printed circuit board is moved relative to the other side according to a command from the control device. Marks can be aligned efficiently and reliably.

  Embodiments of the present invention will be described below with reference to the drawings.

  As a printed circuit board according to this embodiment, there is a flexible printed circuit board (hereinafter simply referred to as “FPC”), and this FPC is, for example, an insulating film as a base material made of a resin such as polyimide or polyethylene terephthalate (PET). A wiring pattern is formed by, for example, printing a foil-like conductive material made of copper, and an over resist is laminated on the wiring pattern as a circuit protection member. Further, no over resist is formed on the terminal portion, and a plurality of the conductive materials are exposed.

  Referring to FIG. 1, for example, an FPC alignment apparatus 1 as a printed circuit board alignment apparatus according to this embodiment is configured such that when two first and second FPCs 3 and 5 are connected to each other in an overlapping manner, This is an apparatus for performing alignment between the first and second FPCs 3 and 5. For example, when the terminal portions (not shown) of the first and second FPCs 3 and 5 are connected by soldering, the terminal portions of the first and second FPCs 3 and 5 are aligned.

  In order to align the first and second FPCs 3 and 5 with each other, an alignment mark 7 is provided on the upper surface of the base material 9 of the first FPC 3 and the alignment mark 11 is provided on the second FPC 5. It is provided on the lower surface of the base material 13 of the second FPC 5. Each of the alignment marks 7 and 11 is non-transmissive to the transmitted light 15 that passes through the base materials 9 and 13 of the first and second FPCs 3 and 5, and is made of, for example, a metal foil such as a copper foil. Is done. If each of the alignment marks 7 and 11 is a copper foil, when the first and second FPCs 3 and 5 are manufactured, as described above, when a wiring pattern is formed by printing the conductive material made of the copper foil. In addition, the alignment marks 7 and 11 can be simultaneously formed on the base materials 9 and 13 at locations other than the wiring pattern.

  In this embodiment, as shown in FIGS. 2A to 2C, the alignment marks 7 and 11 are concentric circles. That is, the alignment mark 11 of the second FPC 5 is a circular mark as shown in FIG. 2A, and the alignment mark 7 of the first FPC 3 is an alignment mark as shown in FIG. This is a circular donut mark concentric with eleven circular marks. In this case, when the circular mark of the alignment mark 11 of the second FPC 5 is positioned at the center of the circular donut mark of the alignment mark 7 of the first FPC 3 as shown in FIG. It is set in advance so that the second FPCs 3 and 5 are aligned.

  In addition, when the alignment marks 7 and 11 are concentric circles as described above, the first and second FPCs 3 and 5 are displaced in the direction of rotation on a plane when the corresponding alignment marks 7 and 11 are at one place. Therefore, it is desirable to provide at least two corresponding alignment marks 7 and 11 in addition to the alignment marks 7 and 11 shown by the two-dot chain line in FIG.

  Referring to FIG. 1 again, the FPC alignment apparatus 1 will be described in detail. When the first and second FPCs 3 and 5 are overlaid, the first FPC 3 is fixed to a fixed base provided on the apparatus main body (not shown). The second FPC 5 is located above the first FPC 3 and is mutually connected in the horizontal plane by, for example, the FPC moving device 17 as a drive unit that moves one of the first and second FPCs 3 and 5 relative to the other. It is configured to move in the θ-axis direction that rotates in the X-axis, Y-axis, and XY planes orthogonal to each other and the Z-axis direction that is perpendicular to the X-axis and Y-axis directions. The FPC moving device 17 is connected to a control device 19 described in detail later as shown in FIG.

  In this embodiment, the driving unit is configured such that the first FPC 3 is fixed and the second FPC 5 is moved. Conversely, the second FPC 5 is fixed, and the first FPC 3 includes the X axis, the Y axis, the θ axis, It may be configured to move in the Z-axis direction, or may be configured to move both the first and second FPCs 3 and 5 independently in the X-axis, Y-axis, θ-axis, and Z-axis directions. .

  As described above, the two first and second FPCs 3 and 5 are arranged on one side of the first and second FPCs 3 and 5 that are arranged one above the other in FIG. On the other hand, an illuminating device 23 provided with a light source 21 for irradiating transmitted light 15 transmitted through the base materials 9 and 13 of the first and second FPCs 3 and 5 is provided. The illumination device 23 is connected to the control device 19 to adjust the wavelength of the transmitted light 15.

  The wavelength of the transmitted light 15 of the light source 21 is 460 to 1000 nm (0.46 to 1.0 μm) in this embodiment. The light having a wavelength of 460 to 1000 nm passes through, for example, polyimide as the base materials 9 and 13, but does not pass through, for example, the copper foil as the alignment marks 7 and 11. In addition, when the wavelength of the transmitted light 15 is smaller than 460 nm, it does not transmit the base materials 9 and 13, and when the wavelength of the transmitted light 15 is larger than 1000 nm, an image is taken with the sensitivity of, for example, a CCD camera 25 as an imaging unit described later. I can't.

  Further, in FIG. 1, the illuminating device 23 of the first and second FPCs 3 and 5 to be superposed is opposite to the side where the lighting device 23 is arranged below the first FPC 3 in FIG. In FIG. 5, the transmitted light 15 that has passed through the vicinity of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 is observed above the second FPC 5 and imaged to capture the shadow of the alignment marks 7 and 11. For example, a CCD camera 25 is provided as a unit, and the CCD camera 25 is connected to the control device 19 via an image processing device 27 for processing a captured image.

  Note that the image processing device 27 determines the positions of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 from the image captured by the CCD camera 25. It is determined whether or not 11 is in a preset alignment position, and if there is a deviation, in which direction the deviation is shifted.

  In this embodiment, the illumination device 23 is provided on the lower side of the first FPC 3 to be overlaid and the CCD camera 25 is provided on the upper side of the second FPC 5. On the contrary, the illumination device 23 is provided. The CCD camera 25 may be provided above the second FPC 5 and the CCD camera 25 may be provided below the first FPC 3.

  Referring to FIG. 3, the control device 19 includes a CPU 29 as a central processing unit. The CPU 29 includes an input device 31 such as a keyboard and a touch panel for inputting various data and programs, a CRT, A display device 33 such as a liquid crystal and a memory 35 for storing a program input from the input device 31 and image data captured by the CCD camera 25 are provided.

  Further, the CPU 29 determines the position of the first and second FPCs 3 and 5 based on the images of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 obtained by imaging with the CCD camera 25. An arithmetic unit 37 that calculates the amount of deviation and an FPC moving unit 17 that aligns the positions of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 based on the amount of deviation calculated by the arithmetic unit 37. A command unit 39 that gives commands is connected.

  A method of aligning by observing the positions of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 by using the FPC alignment apparatus 1 of this embodiment with the above configuration will be described.

  First, the first FPC 3 is fixed to a fixed base (not shown). Next, the second FPC 5 is arranged by the FPC moving device 17 on the overlap of the first and second FPCs 3 and 5 with a gap G in the Z-axis direction as shown in FIG. 1 and shown in FIG. As described above, the alignment mark 11 of the second FPC 5 is moved in the X-axis, Y-axis, and θ-axis directions so as to be aligned with a predetermined position with the alignment mark 7 of the first FPC 3.

  At this time, since the alignment marks 7 and 11 of the first and second FPCs 3 and 5 are irradiated with the transmitted light 15 from the lower side illumination device 23, they are shown in FIGS. 2 (A) and 2 (B). Thus, clear images of the alignment marks 7 and 11 are obtained. This image is picked up by the CCD camera 25, and the picked-up image is sent to the image processing device 27 for image processing.

  The image processing device 27 observes the positions of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 in the above image, and positions of the alignment marks 7 and 11 of the first and second FPCs 3 and 5. It is determined whether or not there is a deviation from a preset position of the alignment mark, and if there is a deviation, it is determined in which direction the deviation is shifted. Based on the determination of the image processing device 27, the shift amount is calculated by the calculation device 37.

  Since the wavelength of the transmitted light 15 of the light source 21 is 0.46 to 1.0 μm (460 to 1000 nm) as described above, the light is, for example, polyimide as the base materials 9 and 13 of the first and second FPCs 3 and 5. 2, but, for example, the copper foil as the alignment marks 7 and 11 does not transmit. Therefore, in the CCD camera 25, the alignment marks 7 and 11 of the first and second FPCs 3 and 5 are shown in FIGS. Therefore, the above-mentioned deviation amount becomes clear and can be easily calculated.

  If the amount of deviation is almost 0 (zero), it is not necessary to correct the alignment. If the amount of deviation is present, a command is given from the command unit 39 to the FPC moving device 17 to move in that direction. To be aligned.

  In this embodiment, since the alignment marks 7 and 11 are concentric circles, two corresponding positions are shown in the first and second FPCs 3 and 5 as shown by a solid line and a two-dot chain line in FIG. Alignment marks 7 and 11 are provided, and the alignment marks 7 and 11 at any location are aligned in the same manner as described above.

  As described above, after the alignment marks 7 and 11 of the first and second FPCs 3 and 5 are accurately aligned, the second FPC 5 is lowered in the Z-axis direction by the gap G, whereby the first and second FPC3 , 5 are in contact with each other and overlapped with each other. Next, the terminal portions of the first and second FPCs 3 and 5 are connected by soldering, for example. In addition to the connection by soldering, an ACF connection or an ultrasonic connection may be used.

  From the above, the illumination device 23 irradiates the transmitted light 15 that passes through the base materials 9 and 13 of the first and second FPCs 3 and 5 from one side of the superimposed first and second FPCs 3 and 5, and Since the CCD camera 25 for observing the transmitted light 15 transmitted through the base materials 9 and 13 of the first and second FPCs 3 and 5 is arranged on the other side of the second FPCs 3 and 5, the alignment marks 7 of the first and second FPCs 3 and 5 are arranged. 11, clear images can be obtained, and the first and second FPCs 3, 5 can be aligned efficiently and reliably. That is, the images of the alignment marks 7 and 11 of the first and second FPCs 3 and 5 can be obtained more clearly than in the case where the reflected light is imaged as in the prior art. Based on the image data of the CCD camera 25 that has picked up the image, the second FPC 5 can be moved by a command from the control device 19 to reliably align the alignment marks 7 and 11.

  As the alignment marks 7 and 11 of the first and second FPCs 3 and 5 of the other embodiments, the alignment marks 7 and 11 are rectangular as shown in FIGS. As shown in FIGS. 5A to 5C, the alignment marks 7 and 11 are triangular. Alternatively, other polygons can be used.

  That is, the alignment mark 11 of the second FPC 5 is a square mark as shown in FIG. 4A, and the alignment mark 7 of the first FPC 3 is aligned as shown in FIG. 4B. This is a rectangular donut mark concentric with the rectangular mark 11. In this case, when the square mark of the alignment mark 11 of the second FPC 5 is positioned at the center of the square donut mark of the alignment mark 7 of the first FPC 3 as shown in FIG. It is set in advance so that the 2FPCs 3 and 5 are aligned. The same applies to the triangles in FIGS. 5A to 5C and the other polygons.

  When the alignment marks 7 and 11 are polygons as described above, the first and second FPCs 3 and 5 are rotated in a plane direction even if the corresponding alignment marks 7 and 11 are one place. It is more preferable than the case of the concentric circles shown in FIGS. 2 (A) to 2 (C) in that the deviation can be restricted.

  Further, as the alignment marks 7 and 11 of the first and second FPCs 3 and 5 of other embodiments, the alignment marks 7 and 11 are straight as shown in FIGS. It is offset at a position shifted on the line by a preset distance.

  That is, as shown in FIG. 6A, the alignment mark 11 of the second FPC 5 is provided with two round dot marks on a straight line with an interval S1 of, for example, 2000 μm, and the alignment mark 7 of the first FPC 3 is As shown in FIG. 6B, two square point marks are provided on a straight line at an interval S2 of 2000 μm, for example. In this case, as shown in FIG. 6C, the two square point marks of the alignment mark 7 of the first FPC 3 and the two round point marks of the alignment mark 11 of the second FPC 5 are positioned on a straight line. In addition, the first and second FPCs 3 and 5 are aligned when the distance S3 between the square dot mark of the alignment mark 7 of the first FPC 3 and the round dot mark of the alignment mark 11 of the second FPC 5 is shifted by 1000 μm. Is set in advance.

  In the above-described embodiments of the invention, the alignment method and apparatus for connecting two printed circuit boards in an overlapping manner have been described. However, the alignment method for connecting each layer in manufacturing a multilayer printed circuit board is described. Also, the apparatus can be replaced with each layer in manufacturing the multilayer printed circuit board instead of the two printed circuit boards, and can be performed with the same configuration and operation as described above. Since the detailed description is duplicated, it will be omitted.

1 is a schematic front view of a printed circuit board alignment apparatus according to an embodiment of the present invention. (A) is a plan view of the alignment mark of the second FPC, (B) is a plan view of the alignment mark of the first FPC, and (C) is a position where the alignment marks of (A) and (B) are located at predetermined positions. It is a top view of the state put together. It is a block block diagram of a control apparatus. 4A and 4B show alignment marks according to other embodiments, in which FIG. 5A is a plan view of a second FPC alignment mark, FIG. 5B is a plan view of a first FPC alignment mark, and FIG. FIG. 6 is a plan view of a state in which the alignment marks of) and (B) are aligned at a predetermined position. 4A and 4B show alignment marks according to other embodiments, in which FIG. 5A is a plan view of a second FPC alignment mark, FIG. 5B is a plan view of a first FPC alignment mark, and FIG. FIG. 6 is a plan view of a state in which the alignment marks of) and (B) are aligned at a predetermined position. 4A and 4B show alignment marks according to other embodiments, in which FIG. 5A is a plan view of a second FPC alignment mark, FIG. 5B is a plan view of a first FPC alignment mark, and FIG. FIG. 6 is a plan view of a state in which the alignment marks of) and (B) are aligned at a predetermined position.

Explanation of symbols

1 FPC alignment device (printed circuit board alignment device)
3 First FPC
5 Second FPC
7 Alignment mark (1st FPC)
9 Base material (1st FPC)
11 Alignment mark (2nd FPC)
13 Substrate (second FPC)
15 Transmitted light 17 FPC moving device (drive unit)
19 Control device 21 Light source 23 Illumination device 25 CCD camera (imaging part)
27 Image processing device

Claims (14)

In the printed circuit board alignment method for performing alignment between the two printed circuit boards when connecting the two printed circuit boards in an overlapping manner,
The base material of the two printed circuit boards, wherein each of the two printed circuit alignment marks of the non-transparent for light transmitted through the base material of the two printed circuit board in order to align the substrates together 2 Provided at predetermined intervals one by one ,
By the transmitted light is irradiated from one side of two printed circuit boards to the two printed circuit board, imaging the pre Symbol position location mark on the other side of the two printed circuit board,
A printed circuit board alignment method comprising: aligning the printed circuit boards by offsetting the alignment marks of the two printed circuit boards to a position shifted on a straight line by a preset distance . In the alignment method of the printed circuit board for performing alignment between the layers at the time of manufacturing the multilayer printed circuit board, when connecting the layers at the time of manufacturing the multilayer printed circuit board,
In order to align each layer at the time of manufacturing the multilayer printed circuit board with the base material of each layer at the time of manufacturing the multilayer printed circuit board, the transmitted light transmitted through the base material of each layer at the time of manufacturing the multilayer printed circuit board Two non-transparent alignment marks are provided at predetermined intervals for each two ,
Each layer at the time of manufacturing the multilayer printed circuit board is irradiated with transmitted light from one side of each layer at the time of manufacturing the multilayer printed circuit board, and the alignment mark of each layer at the other side of each layer at the time of manufacturing the multilayer printed circuit board By imaging
A printed circuit board alignment method comprising: aligning the respective layers by offsetting the alignment marks of the respective layers to positions shifted on a straight line by a preset distance . The predetermined interval is the same interval between the two printed circuit boards,
The printed circuit boards are aligned with each other by aligning the printed circuit boards by offsetting the alignment marks of the two printed circuit boards to a position shifted by a predetermined distance on a straight line. The printed circuit board alignment method according to claim 1, wherein the printed circuit board is aligned. The predetermined interval is the same interval in each of the layers,
The alignment of the respective layers is performed by offsetting the alignment marks of the respective layers to positions shifted by equal distances set in advance on a straight line, and aligning the respective layers. Printed circuit board alignment method. 4. The printed circuit board alignment method according to claim 1, wherein the alignment marks of the two printed circuit boards have different shapes for each printed circuit board. 5. The printed circuit board alignment method according to claim 2, wherein a shape of the alignment mark of each layer is different for each layer. Wherein the wavelength of the transmitted light, a method of aligning a printed circuit board according to any one of claims 1 6, characterized in that the 0.46～1.0Myuemu. In the printed circuit board alignment apparatus that aligns the two printed circuit boards when the two printed circuit boards are connected to each other,
A position provided on the base material of the two printed circuit boards so as not to transmit light transmitted through the base material of the two printed circuit boards and for aligning the two printed circuit boards with each other Alignment mark,
An illumination device that irradiates the two printed circuit boards with transmitted light from one side of the two printed circuit boards;
An imaging unit that captures a pre-Symbol position location mark on the other side of the two printed circuit board,
A drive unit for moving one of the two printed circuit boards relative to the other;
A control device for providing a command to align the front Symbol position location marks based on the image data captured by the imaging unit to the drive unit,
Equipped with a,
The alignment mark is provided at a predetermined interval for each of the two printed circuit boards.
The control device gives a command for aligning the alignment mark to the drive unit based on image data captured by the imaging unit, and sets the alignment marks of the two printed circuit boards in a straight line in advance. An apparatus for aligning printed circuit boards, wherein the printed circuit boards are aligned with each other by being offset to a position shifted by a specified distance . In the printed circuit board alignment apparatus for aligning the layers at the time of manufacturing the multilayer printed circuit board, when connecting the layers at the time of manufacturing the multilayer printed circuit board,
The base material of each layer at the time of manufacturing the multilayer printed circuit board is non-transmissive to transmitted light that passes through the base material of each layer at the time of manufacturing the multilayer printed circuit board, and the layers at the time of manufacturing the multilayer printed circuit board are mutually connected. An alignment mark provided for alignment;
An illumination device that irradiates each layer at the time of manufacturing the multilayer printed circuit board from one side of the layers at the time of manufacturing the multilayer printed circuit board,
An imaging unit that images the alignment mark of each layer on the other side of each layer when the multilayer printed circuit board is manufactured;
A drive unit that moves one of the layers at the time of manufacturing the multilayer printed circuit board relative to the other; and
A control device that gives an instruction to the drive unit to align the alignment marks of the layers based on image data captured by the imaging unit;
Equipped with a,
The alignment marks are provided at predetermined intervals of two for each layer,
The control device gives a command for aligning the alignment mark to the driving unit based on image data captured by the imaging unit, and aligns the alignment mark of each layer at a preset distance on a straight line. An apparatus for aligning printed circuit boards, wherein the printed circuit boards are aligned at offset positions. The predetermined interval is the same interval between the two printed circuit boards,
The printed circuit boards are aligned with each other by aligning the printed circuit boards by offsetting the alignment marks of the two printed circuit boards to a position shifted by a predetermined distance on a straight line. 9. The printed circuit board alignment apparatus according to claim 8, wherein The predetermined interval is the same interval in each of the layers,
The alignment between the layers is performed by offsetting the alignment marks of the layers to positions shifted by a predetermined distance on a straight line to align the layers. Printed circuit board alignment device. 11. The printed circuit board alignment apparatus according to claim 8, wherein the alignment marks of the two printed circuit boards have different shapes for each printed circuit board. 12. The printed circuit board alignment apparatus according to claim 9 or 11, wherein the shape of the alignment mark of each layer is different for each layer. Wherein the wavelength of the transmitted light, the alignment apparatus of the printed circuit board according to any one of claims 8 13, characterized in that a 0.46～1.0Myuemu.