JP4734697B2 - Surface treatment equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface treatment apparatus for performing surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, and more particularly to an R-Fe-B permanent magnet, particularly a ring-shaped bond magnet and a cylindrical bond magnet. The present invention relates to a surface treatment apparatus useful when electroplating is performed.
[0002]
[Prior art]
Rare-earth permanent magnets such as R-Fe-B typified by Nd-Fe-B permanent magnets are made of resource-rich and inexpensive materials and have high magnetic properties. Is used in various fields today. However, rare earth permanent magnets contain R and Fe that are susceptible to oxidative corrosion in the atmosphere, so when used without any surface treatment, they are corroded from the surface due to the presence of slight acid, alkali, moisture, etc. As the process proceeds, rust is generated, and accordingly, there is a problem in that the magnetic characteristics are deteriorated and varied.
[0003]
In order to solve the above problems, conventionally, a method of applying a metal plating film or a resin coating as an oxidation-resistant film on the magnet surface has been adopted, for example, by electroplating the surface of an R-Fe-B permanent magnet. As a method of forming a corrosion-resistant film, a member to be plated is put in a mesh cage and plating is performed while rotating the mesh mesh (barrel method), or a conductive support member in which the plated member is connected to a negative electrode. A method of carrying out plating with support (rack method) or the like is employed.
[0004]
[Problems to be solved by the invention]
Although the above-described barrel plating and rack plating are excellent in versatility, the former method may cause cracking or chipping of the magnet when applied to a bonded magnet whose strength is not necessarily high. There is a problem that there is. In the latter method, since the position of the magnet during the plating process is constant, the distance from the anode differs depending on the position, and the film thickness varies. In recent years, in the electronics industry and household electrical appliance industry in which rare earth permanent magnets are used, parts are becoming smaller and more precise, and the magnets themselves are required to be smaller. In particular, in the case of a bonded magnet having an inner peripheral surface such as a ring shape, it is very difficult to perform surface treatment of a small ring-shaped magnet with high dimensional accuracy and at low cost efficiently.
For example, Japanese Patent Application Laid-Open No. 60-190599 proposes a method of plating small members by a typical barrel method. However, in this method, not only is the magnet easily cracked or chipped as described above, but since the magnet is small and light, it is difficult to always ensure continuity for all the magnets during the plating process, and the plating efficiency is poor. .
On the other hand, Japanese Patent Application Laid-Open No. 61-52367 proposes a plating apparatus in which a workpiece is rotated by passing the shaft through a hole in a plate-shaped workpiece and rotating the shaft. However, in this apparatus, in order to rotate the workpiece, a shaft having a large diameter must be used. Therefore, the plating solution wraps around the contact point between the workpiece and the shaft, and the plating efficiency on the inner surface is poor. Has the problem.
[0005]
Therefore, the present invention can be applied to a surface-treated member that is light and does not necessarily have high strength such as a bond magnet, and an object thereof is to perform a uniform surface treatment without a contact mark.
[0006]
[Means for Solving the Problems]
The surface treatment apparatus of the present invention according to claim 1 includes a rotating member for revolving the support member, and the support member includes a surface treatment member having an inner peripheral surface such as a cylindrical shape on the inner peripheral surface side. The surface treatment member is rotated by rotating the contact position of the support member and the surface treatment member along with the revolution of the support member. A surface treatment apparatus for performing a surface treatment on the inner peripheral surface, wherein the support member is composed of a conductive member, the support member is connected to a negative electrode, and a positive electrode is parallel to the axis of the support member characterized that you place a.
According to a second aspect of the present invention, in the surface treatment apparatus according to the first aspect , the support member is disposed so that an axis of the support member is substantially horizontal, and a plurality of the surface-treated members are provided. It arrange | positions along with the said supporting member, It is characterized by the above-mentioned.
According to a third aspect of the invention, the surface treatment apparatus according to claim 1, the insulating spacer to the support member is provided, and wherein placing the object to be surface treated member between the insulating spacers.
According to a fourth aspect of the present invention, in the surface treatment apparatus according to the third aspect , the insulating spacers are arranged so that the surface treated members are arranged at equal intervals.
The present invention is claimed in claim 5, wherein, in the front surface processing device of the mounting serial to claim 2, a plurality of said support members, each of the axes of the support members are arranged in parallel, each of said support members It is characterized by having a common rotation axis.
According to a sixth aspect of the present invention, in the surface treatment apparatus according to the fifth aspect , each of the support members is arranged at an equal distance from the rotation shaft.
The present invention according to claim 7, Te surface treatment apparatus smell of claim 1 or claim 2, wherein the surface treated member is a bonded magnet, wherein said surface treatment is an electroplating process .
An R—Fe—B permanent magnet according to an eighth aspect of the present invention is characterized in that an electroplating treatment is performed by the surface treatment apparatus according to the seventh aspect to form a corrosion-resistant film on the surface.
The surface-treated member of the present invention according to claim 9 is characterized in that a film is formed on the surface by the surface treatment apparatus according to claim 1 or claim 2.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Surface treatment apparatus according to the first embodiment of the present invention constitutes a supporting member with conductive members, the support members connected to the negative electrode, shall be placed parallel to the positive electrode to the axis of the support member It is. According to the present embodiment, the surface-treated member performs a revolution operation together with the support member. Therefore, for example, in the case of electroplating treatment, there is an effect of stirring the plating solution by the revolving operation, so that a fresh plating solution is always supplied to the periphery of the surface treatment member, and efficient plating can be performed. At the same time, since the plating solution can be made to wrap around the inner peripheral surface of the surface-treated member, surface treatment with a uniform film thickness can be efficiently performed on the inner peripheral surface side. Further, since the surface-treated member is rotatably supported from the inner peripheral surface side, the surface-treated member rotates by the revolution of the support member, and the contact position with the support member moves. . Therefore, uniform surface treatment can be performed without leaving any trace of contact with the support member. Furthermore, since the surface-treated member is supported by the support member at one point from the inner peripheral surface side, the diameter of the surface-treated member that can be treated is limited, and a small ring that has been very difficult with the prior art The uniform surface treatment can be efficiently performed on the shaped member so that the film thickness is uniform and no contact mark remains. Moreover, the electroplating process can be performed effectively. In particular, even when a plurality of surface-treated members are plated at the same time, electricity can be reliably supplied to all the surface-treated members. Moreover, since all the surface-treated members suspended are equal in distance from the electrodes, all the surface-treated members can be uniformly subjected to electroplating without variation in film thickness.
[0008]
According to a second embodiment of the present invention, in the surface treatment apparatus according to the first embodiment, the support member is disposed such that the shaft is substantially horizontal, and a plurality of surface treatment members are arranged side by side on the support member. It is to be established. According to the present embodiment, a plurality of surface treated members can be revolved together with the support member. Therefore, uniform surface treatment can be performed on many surface treated members at the same time.
[0009]
According to the third embodiment of the present invention, in the surface treatment apparatus according to the first embodiment, an insulating spacer is provided on the support member, and the surface-treated member is disposed between the insulating spacers. According to the present embodiment, since the insulating spacers can prevent contact between the surface-treated members, it is possible to prevent non-uniform electroplating from being caused by the contact.
[0010]
In the fourth embodiment of the present invention, in the surface treatment apparatus according to the third embodiment, insulating spacers are arranged so that the surface treatment members are arranged at equal intervals. According to the present embodiment, the electric force applied to the edge portion of the surface treatment member is adjusted by adjusting the position of the spacer or the width dimension in the axial direction so that the intervals between the surface treatment members are equal to each other with a predetermined size. The concentration of lines can be relaxed and the uniformity of plating can be improved. It is desirable to select an appropriate value for each interval so that the concentration of electric lines of force on the edge portion of the surface treatment member is reduced and the film thickness of the edge portion becomes uniform. In addition, the spacer may be adjusted in advance to have a predetermined distance and integrated with the support member, or may be adjustable in position.
[0011]
Fifth embodiment of the present invention, the front surface processing apparatus that by the second embodiment, a plurality of support members, arranged so that the respective axes of the support member are parallel, each The rotation axis of the support member is common. According to the present embodiment, the surface-treated member suspended on each support member changes its distance from the electrode with time by performing a revolving operation around the rotation axis, but all have the same position history. Since it moves, the electroplating process can be performed uniformly without causing variations in film thickness depending on the position, and many surface treated members can be processed simultaneously.
[0012]
According to a sixth embodiment of the present invention, in the surface treatment apparatus according to the fifth embodiment, each support member is arranged at an equal distance from the rotation axis. According to the present embodiment, the surface-treated member suspended from any supporting member is uniformly electroplated without variation in film thickness.
[0013]
According to a seventh embodiment of the present invention, in the surface treatment apparatus according to the first or second embodiment, the surface treatment member is a bond magnet, and the surface treatment is an electroplating treatment. According to the present embodiment, it is possible to uniformly perform electroplating on the inner peripheral surface of the bonded magnet without variation in film thickness.
[0014]
The R—Fe—B permanent magnet according to the eighth embodiment of the present invention is subjected to electroplating treatment by the surface treatment apparatus according to the seventh embodiment. According to the present embodiment, it is possible to obtain an R—Fe—B permanent magnet in which a corrosion-resistant film is uniformly formed on the inner peripheral surface without variation in film thickness.
[0015]
The surface-treated member according to the ninth embodiment of the present invention is obtained by forming a film on the surface by the surface treatment apparatus according to the first or second embodiment. According to the present embodiment, it is possible to obtain a surface-treated member in which a film is uniformly formed on the inner peripheral surface without variation in film thickness.
[0016]
【Example】
A surface treatment apparatus according to an embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a conceptual configuration diagram of an electroplating apparatus for a bonded magnet according to the present embodiment, FIG. 2 is an enlarged perspective view of a main part of FIG. 1, and FIG. 3 is a configuration diagram for explaining the movement of a support member and a bonded magnet.
FIG. 1 shows a positive electrode plate 10 disposed in an electrolytic plating solution in a plating tank and a surface treatment jig 30 that holds a ring-shaped bonded magnet 20 as a surface treatment member.
The surface treatment jig 30 includes a support member 40 that rotatably supports the ring-shaped bonded magnet 20 from the inner peripheral surface side, and a rotating member 50 that causes the support member 40 to revolve.
As shown in FIG. 1, the two positive electrode plates 10 connected to the positive electrode 11 are arranged in parallel so as to face each other, and the surface treatment jig 30 has the axis of the support member 40 and the anode electrode 10. It arrange | positions between these anode electrodes 10 so that it may become parallel.
The surface treatment jig 30 includes a gear 32 for transmitting the power of a motor 31 installed outside to the rotating member 50.
[0017]
In particular, as shown in FIG. 2, the support member 40 includes a metal support shaft 41 and a resin insulating spacer 42 disposed on the support shaft 41 at a predetermined interval.
The rotating member 50 is connected to a pair of rotating plates 51 rotatably provided on the surface treatment jig 30, and the pair of rotating plates 51, and is connected to the shaft of the gear 32 to be a rotation center. The shaft 52 is constituted. The rotating member 50 is made of an insulating material, or has an insulating surface.
The rotating plate 51 includes bearing portions 53 at equal distances from the rotating shaft 52 and at equal intervals. The support member 40 is held by the bearing portion 53. In this embodiment, eight support members 40 are provided. Further, the rotating plate 51 includes therein a negative electrode joint 54 connected to the negative electrode 33, and the support member 40 is connected to the negative electrode 33 through the negative electrode joint 54.
The negative electrode joint portions 54 are provided radially from the center portion of the rotation shaft 52 toward the respective bearing portions 53. The negative electrode joint 54 may not be provided in a radial manner as in the present embodiment, but may be provided with a disk-shaped conductive member.
[0018]
Next, the usage method and operation | movement of the electroplating apparatus of the bond magnet by a present Example are demonstrated.
First, the ring-shaped bonded magnet 20 is disposed between the insulating spacers 42 of the support member 40. Thus, the support member 40 in which the ring-shaped bonded magnet 20 is disposed is installed on the surface treatment jig 30. Although FIG. 1 shows a structure in which one ring-shaped bonded magnet 20 is disposed, the ring-shaped bonded magnet 20 can be disposed between the insulating spacers 42.
After the installation of the support member 40 is completed, electroplating is performed. The positive electrode 11 and the negative electrode 33 are conducted, and the motor 31 is driven. The driving force of the motor 31 is transmitted to the rotating member 50 through the gear 32, and the rotating member 50 rotates about the rotating shaft 52. Accordingly, each support member 40 performs a revolving operation around the rotation shaft 52.
In the above description, the structure having the rotating member 50 has been described. However, the rotating member is not always necessary, and the rotating plate 51 is rotated by transmitting the power of the motor 31 to one or both of the rotating plates 51 without providing the rotating member 50. The structure to be made may be sufficient. In addition, the object of the present invention is achieved by a configuration in which the support member 40 is arranged to be revolved around a predetermined rotation axis without being limited to the embodiment.
[0019]
Here, the movement of the support member 40 and the ring-shaped bonded magnet 20 will be described with reference to FIG.
As shown in FIG. 3, the support member 40 revolves in the counterclockwise direction (arrow X) about the rotation shaft 52. That is, the support member 40 at the position (a) moves to the position (b), and the support member 40 at the position (b) moves to the position (c). Here, the support member 40 does not rotate by itself. However, paying attention to the point A located on the outermost periphery from the rotation shaft 52 in the support member 40, the point A located at the uppermost position in the position (a) is counterclockwise at the position (c). At the position of 90 degrees and (e), it is rotated 180 degrees in the counterclockwise direction. And when it returns to the position of (a), it will rotate 360 degree | times. Accordingly, the ring-shaped bonded magnet 20 in contact with the support member 40 also rotates counterclockwise (arrow Y). At this time, the ring-shaped bonded magnet 20 rotates with the revolution of the support member 40. As described above, the contact position between the support member 40 and the ring-shaped bond magnet 20 moves with the revolution of the support member 40, so that the contact mark with the support member 40 remains on the ring-shaped bond magnet 20. And uniform plating treatment can be performed.
[0020]
As in the present embodiment, the support member 40 is disposed so that the axis thereof is substantially horizontal, and a plurality of ring-shaped bond magnets 20 are disposed side by side on the support member 40, whereby a large number of ring-shaped bond magnets 20 are disposed. Can be revolved together with the support member 40. Therefore, uniform surface treatment can be performed on many ring-shaped bonded magnets 20 at the same time.
Further, as in the present embodiment, the ring-shaped bonded magnet 20 is arranged at a distance from the anode electrode 10 by being arranged between the anode electrodes 10 so that the axis of the support member 40 is parallel to the anode electrode 10. Therefore, all ring-shaped bonded magnets 20 can be uniformly electroplated without variation in film thickness.
Further, as in the present embodiment, the plurality of support members 40 are arranged so that the respective axes of the support members 40 are parallel, and the rotation shafts of the respective support members 40 are made common, so that each support member 40 The ring-shaped bonded magnet 20 suspended by 40 is uniformly electroplated without variation in film thickness, and many ring-shaped bonded magnets 20 can be processed simultaneously.
Further, as in the present embodiment, by arranging the respective support members 40 at equal distances from the rotation shaft 52, the ring-shaped bonded magnets 20 suspended from any of the support members 40 are uniform without variations in film thickness. To be electroplated.
[0021]
FIG. 4 shows another embodiment. FIG. 4 is a perspective view of a support member according to another embodiment, and the other basic configuration is the same as that of FIG.
The support member 40A shown in the present embodiment is configured by a spiral member. Since the support member 40A is a spiral member in this way, the ring-shaped bond magnet 20 can be suspended for each lower portion of the spiral member, and contact between the ring-shaped bond magnets 20 can be prevented. It is possible to prevent the surface treatment from becoming uneven due to the contact.
In the above-described embodiment, the insulating spacer 42 is provided on the support member 40. However, the insulating spacer 42 may not be provided. As long as the contact between the bonded magnets 20 can be prevented, a simple protrusion may be used. Further, if the number of rotations is increased, a liquid flow can be generated and contact between the bonded magnets can be prevented, so that the spacer can be omitted.
Moreover, the surface treatment apparatus of this invention is not restricted to an electroplating process, It can also be used for the apparatus which performs an electroless-plating process, a chemical conversion process, an etching process, etc. The surface-treated member that is effectively surface-treated by the surface treatment apparatus of the present invention is an R—Fe—B ring bond magnet or an R—Fe—B cylinder bond magnet.
Further, in the above-described embodiment, the case of the eight support members 40 has been described, but the number may be more or less. Moreover, in the said Example, although the eight support members 40 were arrange | positioned at equal distance from the rotating shaft 52, the surface treatment member which can be surface-treated simultaneously without making surface treatment members contact by varying distance. Can be further increased.
Further, by arranging a plurality of the surface treatment jigs 30 of the above embodiment so that the respective rotation members 50 are parallel to each other, it is possible to treat more surface treated members simultaneously. In this case, all the surface treatment jigs 30 can be moved simultaneously by one motor 31 by connecting the respective rotation shafts directly with a belt or via respective gears.
Further, as a bonded magnet that can be surface-treated by the apparatus of the present invention, a bonded magnet using liquid quenching system isotropic Nd-Fe-B magnet powder (trade name: MQP-B manufactured by MQI), An anisotropic R—Fe—B based bonded magnet as shown in Japanese Patent No. 92515, a soft magnetic phase (eg Fe3B) and a hard magnetic phase (Nd 2 —Fe 14 —B) as shown in Japanese Patent Laid-Open No. 8-203714 Nd—Fe—B-based nanocomposite magnets having an R—Fe—N-based bonded magnet disclosed in Japanese Patent Publication No. 5-82041. All of these are formed into a predetermined shape using a binder such as an epoxy resin, and then subjected to a plating treatment after the surface is subjected to a conductive treatment. Moreover, in the apparatus of this invention, it can apply also to a ring-shaped sintered magnet other than the said bond magnet.
[0022]
【The invention's effect】
According to the present invention, the surface-treated member performs a revolution operation together with the support member. Therefore, for example, in the case of electroplating treatment, the plating solution can be stirred and the plating solution can be made to flow around the inner peripheral surface of the surface-treated member, so that a uniform surface treatment can be performed. Further, since the surface-treated member is rotatably supported from the inner peripheral surface side, the surface-treated member rotates by the revolution of the support member, and the contact position with the support member moves. . Therefore, uniform surface treatment can be performed without leaving any trace of contact with the support member.
[Brief description of the drawings]
FIG. 1 is a conceptual configuration diagram of an electroplating apparatus for a bonded magnet according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view of a main part of FIG. 1. FIG. FIG. 4 is a perspective view of a main part of a support member according to another embodiment of the present invention.
20 Ring-shaped bonded magnet 40 Support member 42 Insulating spacer 50 Rotating member

Claims (9)

A rotation member for revolving the support member, the support member rotatably supporting a surface-treated member having an inner peripheral surface such as a cylindrical shape from the inner peripheral surface side; and A surface treatment apparatus for rotating the surface treatment member by moving a contact position with the surface treatment member along with the revolution of the support member, and performing surface treatment on the inner peripheral surface of the surface treatment member. The surface treatment apparatus is characterized in that the support member is made of a conductive member, the support member is connected to a negative electrode, and a positive electrode is arranged in parallel to the axis of the support member. Said supporting member, arranged so that the axis of the support member is substantially horizontal, surface according to a plurality of the object to be surface treated member, to claim 1, characterized in that arranged side by side to the support member Processing equipment . The surface treatment apparatus according to claim 1 , wherein an insulating spacer is provided on the first support member, and the surface-treated member is disposed between the insulating spacers. The surface treatment apparatus according to claim 3 , wherein the insulating spacers are arranged so that the surface treatment members are arranged at equal intervals. A plurality of said support members, said respective axes of the support member is arranged parallel, surface treatment apparatus of claim 2, characterized in that the axis of rotation of each of the support members and the common. The surface treatment apparatus according to claim 5 , wherein each of the support members is disposed at an equal distance from the rotation shaft. The surface treatment apparatus according to claim 1, wherein the surface treatment member is a bonded magnet, and the surface treatment is an electroplating treatment. An R-Fe-B permanent magnet, which is electroplated by the surface treatment apparatus according to claim 7 to form a corrosion-resistant film on the surface. A surface-treated member, wherein the surface treatment apparatus according to claim 1 or 2 forms a film on the surface.

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