JP4706668B2 - Electronic component mounting apparatus and substrate receiving method in electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus used in an electronic component mounting line for mounting an electronic component on a substrate to manufacture a mounting substrate, and a substrate receiving method for receiving and supporting the substrate in the electronic component mounting apparatus. Is.

In an electronic component mounting apparatus used in an electronic component mounting line, such as an electronic component mounting apparatus or a screen printing apparatus, the lower surface of the substrate is supported by a substrate receiving device provided in each device, such as a receiving pin or a receiving block. The work operation such as the component mounting operation and the screen printing operation is executed in the state supported by (see Patent Document 1, for example). In the prior art example shown in this patent document, the lower surface of the substrate is supported by a plurality of backup pins erected on a backup plate that is raised and lowered by an air cylinder, and the edge of the substrate is clamped to forcibly cause downward warping. The adhesion of the substrate to the backup pin is improved. As a result, the height position and flatness of the upper surface of the substrate to be worked can be kept good, and it is possible to reduce mounting defects due to height variations and flatness defects.
JP 2003-86997 A

  By the way, the substrate which is the work object of the same electronic component mounting apparatus is not a single type, and the work object is not only a planar shape / size but also various forms having different thickness dimensions. For this reason, the substrate receiving apparatus is also required to be able to cope with a plurality of types of substrates having different thicknesses. However, in the conventional apparatus including the above-mentioned prior art examples, there are many cases where some work such as mechanical adjustment for correcting the difference in thickness in the substrate receiving apparatus or setting change on the control data is required. This contributed to an increase in the work load at the time of switching.

  Furthermore, in an actual production line, the thickness of a substrate to be supplied may vary from production lot to production lot even when continuous production is performed for the same product type. In such a case, work such as component mounting is performed in a state where the board is not held at a correct height and good flatness, which causes a reduction in the quality of mounting work. As described above, the conventional electronic component mounting apparatus has a problem that it is difficult to support the substrate at a correct height position with good flatness without requiring an operation for switching the product type.

  Therefore, the present invention provides an electronic component mounting apparatus capable of supporting a substrate at a correct height position with good flatness without requiring work at the time of product switching even when the thickness of the substrate is different, and It is an object of the present invention to provide a substrate receiving method in an electronic component mounting apparatus.

The electronic component mounting apparatus of the present invention is an electronic component mounting apparatus used in an electronic component mounting line for manufacturing a mounting substrate by mounting an electronic component on a substrate, and the electronic component mounting apparatus includes: The substrate receiving portion that receives and supports the substrate that is the target of the work operation from the lower surface side is a planar position where both side edges of the substrate contact from below, and the height position of the lower surface is the work height in the work operation. A pair of fixed clamp members arranged in accordance with the position, an elevating member arranged to be movable up and down below the fixed clamp member, and an elevating drive means for elevating and lowering the elevating member according to a height control parameter And can be moved relative to the elevating member and urged upward by the urging means, and is lifted together with the elevating member and is formed on the lower surfaces of both side edges of the substrate. A pair of movable clamp members sandwiching both side edges of the substrate between the fixed clamp member and the fixed clamp member; The substrate is sandwiched between a lower contact member for receiving the substrate, the movable clamp member and the fixed clamp member, and an offset in which a relative vertical position of the movable clamp member with respect to the lifting member is set in advance. Clamp detecting means for detecting that the position is reached and outputting a detection signal, and the upper surface of the movable clamp member and the lower abutting member at the detection timing when the clamp detection means outputs the detection signal. A storage unit that stores the difference in height from the upper surface as a base height offset that is inherent to the apparatus, and the substrate receiving unit supports the substrate by receiving it. In order to raise the elevating member in order to raise the elevating member, the elevating member is raised by controlling the elevating driving means until it is detected that the offset position is reached, and then the lower height of the lower elevating member is detected. Ascending / descending control means for raising the raising / lowering member only to reach the lower receiving height position where the upper surface of the lowering contact member contacts the lower surface of the substrate is provided.

  The substrate receiving method in the electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus used in an electronic component mounting line for manufacturing a mounting substrate by mounting an electronic component on a substrate. A substrate receiving method in an electronic component mounting apparatus for receiving and supporting a substrate to be received from a lower surface side by a substrate receiving portion, wherein both side edges of the substrate abut from below. A pair of fixed clamp members disposed in a planar position in accordance with the height position of the lower surface in accordance with the work height position in the work operation; and a lift member disposed to be movable up and down below the fixed clamp member; Elevating drive means for elevating the elevating member according to a height control parameter, and being held in a state in which the elevating member can be moved relative to the elevating member and urged upward by the urging means, A pair of movable clamp members that are in contact with the lower surfaces of both side edge portions of the substrate and sandwich the both side edge portions of the substrate with the fixed clamp member in a state of being raised integrally with the descending member, and provided on the elevating member The substrate is sandwiched between a lower contact contact member that contacts the lower surface of the substrate and receives the substrate in the raised state, and the movable clamp member and the fixed clamp member. And clamp detection means for detecting that the relative vertical position of the movable clamp member relative to the lifting member is a preset offset position and outputting a detection signal, wherein the clamp detection means outputs the detection signal. The difference in height between the upper surface of the movable clamp member and the upper surface of the lower contact member at the output detection timing is used as the lower height of the lower support unique to the device. It is remembered that in the substrate receiving operation for raising the elevating member to receive and support the substrate by the substrate receiving portion, the elevating driving means is controlled to be in the offset position. A lower receiving height position where the upper surface of the lower contact member contacts the lower surface of the substrate by raising the elevating member until it is detected and then raising the elevating member by an amount corresponding to the lower height offset. To reach.

  According to the present invention, the detection signal is detected by detecting that the substrate is sandwiched between the movable clamp member and the fixed clamp member, and that the relative vertical position of the movable clamp member with respect to the lifting member is a preset offset position. A clamp detection means for outputting is provided, and the height difference between the upper surface of the movable clamp member and the upper surface of the lower contact member at the detection timing is stored as a lower height offset unique to the apparatus, and in the substrate lowering operation. Even if the thickness of the board is different by controlling the operation to raise the elevating member until it is detected that the offset position has been detected, and then raise the elevating member by the offset height offset, The substrate can be supported at a correct height position with good flatness without requiring any work at the time of switching.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a substrate receiving portion in the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a partial cross-sectional view of a substrate receiving portion in the electronic component mounting apparatus according to the embodiment. FIG. 4 is an explanatory diagram of detection of abnormal substrate thickness in the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 8 is an operation explanatory diagram of the substrate underlaying method in the electronic component mounting apparatus according to the embodiment of the present invention.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. This electronic component mounting apparatus is an electronic component mounting apparatus used in an electronic component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate. In FIG. 1, a transport path 2 is disposed on a base 1 in the X direction. A substrate support 3 is provided in the transport path 2, and a substrate 4 supplied from an upstream device and subjected to a mounting operation by the device is transported to the substrate support 3 by the transport path 2. The transported substrate 4 is supported by being supported from the lower surface side by the substrate receiving portion 3, and in this state, a component mounting operation is performed by a work operation mechanism described below, and the substrate 4 that has completed the component mounting operation is again It is conveyed downstream by the conveyance path 2 and is carried out to the downstream apparatus.

  Component supply units 5 are provided on both sides of the conveyance path 2, and a plurality of tape feeders 6 are attached to the component supply unit 5. A Y-axis moving table 8 provided with a linear drive mechanism is disposed horizontally in the Y direction at one end of the base 1 in the X direction. The Y-axis moving table 8 is mainly composed of a beam member 8a provided in an elongated shape in the horizontal direction, and linear rails 9 are arranged in the horizontal direction on the beam member 8a. Two linear coupling brackets 11 are mounted on the linear rail 9 via a linear block 10 so as to be slidable in the Y direction. Similar to the Y-axis movement table 8, the two coupling brackets 11 are coupled to an X-axis movement table 12 having a linear drive mechanism, and the mounting head 13 moves in the X direction on each X-axis movement table 12. It is installed freely.

  The mounting head 13 is a multiple head including a plurality (eight in this case) of unit mounting heads 14. At the lower end of each unit mounting head 14, a suction nozzle 14 a that sucks and holds electronic components is provided. It is installed. The suction nozzle 14a is moved up and down individually by a nozzle lifting mechanism built in the unit mounting head 13. By driving the Y-axis moving table 8 and the X-axis moving table 12, the mounting head 13 moves in the X direction and the Y direction, whereby each unit mounting head 14 is moved from the tape feeder 6 of the component supply unit 5 to the electronic component. Is taken out and mounted on the substrate 4 positioned in the transport path 2 and received by the substrate receiving portion 3.

  Therefore, the Y-axis movement table 8, the first X-axis movement table 12, and the mounting head 13 take out electronic components from the component supply unit 5, transfer them onto the substrate 4, and mount them on the substrate 4, that is, electronic An electronic component mounting apparatus as a component mounting apparatus is a work operation mechanism for executing a work operation of the apparatus. A component recognition device 7 is disposed between the component supply unit 5 and the conveyance path 2, and when the mounting head 13 that has taken out an electronic component from the component supply unit 5 moves above the component recognition device 7, The component recognition device 7 captures and recognizes the electronic component held by the mounting head 13.

  Next, the structure of the substrate receiving portion 3 will be described with reference to FIG. In FIG. 2, two transport rails 2a constituting the transport path 2 are arranged in parallel on the upper surface of the base 1, and the height of the upper inner surface of the transport rail 2a is adjusted to the substrate transport level. A conveyor mechanism 20 is provided. The conveyor mechanism 20 is configured to reciprocate the conveyor belt 20b along the upper and lower surfaces of the conveyor rail 20a. The loaded substrate 4 is guided at the side edge by the conveyor rail 2a and is conveyed by the conveyor belt 20b. .

At the upper end of the transport rail 2a, a pair of flat fixed clamp members 21 extending inward are provided at planar positions where both side ends of the substrate 4 abut from below. The fixed clamp member 21 is arranged so that the height position of the lower surface is aligned with the work height position in the component mounting operation in which the electronic component P is mounted on the mounting surface of the substrate 4 by the work operation by the above-described work operation mechanism, that is, the suction nozzle 14a. It is installed. That is, here, in the configuration in which the substrate 4 to be mounted is sandwiched and clamped from above and below, the clamp member on the side of the upper surface of the substrate is fixed, and the substrate 4 is pressed against the lower surface of the fixed clamp member 21, thereby Is held at a predetermined working height position.

  An elevating member 24 is disposed below the fixed clamp member 21 so as to be movable up and down. The elevating member 24 is configured to drive the elevating screw 32 by a rotational drive mechanism 31 capable of numerical control such as a servo motor. It goes up and down by means. That is, by controlling the rotation drive mechanism 31 according to the height control parameter by the control unit 34, the elevating member 24 can be stopped at an arbitrary height position according to the height control parameter, and can be moved up and down at an arbitrary speed. It is possible.

  On the upper surface of the elevating member 24, a pair of movable clamp members 22 positioned below the fixed clamp member 21 are supported by elastic support portions 23. The elastic support portion 23 includes a shaft sliding portion 25 coupled to the lower surface of the movable clamp member 22, a shaft member 26 slidably fitted in a sliding hole 25a provided in the shaft sliding portion 25 in the vertical direction, and A compression spring 27 is interposed between the upper surface of the elevating member 24 and the lower surface of the shaft sliding portion 25. When the shaft member 26 moves up and down in the sliding hole 25a, the movable clamp member 22 moves up and down relative to the elevating member 24. At this time, the compression spring 27 always applies an upward biasing force to the shaft sliding portion 25. give. The urging force clamps the substrate 4 from above and below by the fixed clamp member 21 and the movable clamp member 22.

  By raising the elevating member 24, the movable clamp member 22 is also raised integrally with the elevating member 24, whereby the movable clamp member 22 pushes up the lower surface of the substrate 4, and between both sides of the substrate 4 between the lower surface of the fixed clamp member 21. Insert the end. That is, the movable clamp member 22 is held in a state in which the movable clamp member 22 can be moved up and down relative to the elevating member 24 and is urged upward by the compression spring 27 as an urging means, and is lifted integrally with the elevating member 24. 2 has a function of being in contact with the lower surfaces of both side edges of the substrate 4 and sandwiching both side edges of the substrate 4 between the fixed clamp member 21.

  A plurality of lower receiving pins 30 are erected on the upper surface of the elevating member 24, and the upper surface 30 a of the lower receiving pin 30 contacts the lower surface of the substrate 4 by raising the elevating member 24 to a predetermined height position. Touch. In other words, the lower receiving pin 30 is provided on the elevating member 24 and is integrally moved up and down, and is a lower abutting member for receiving the substrate 4 by contacting the lower surface of the substrate 4 in the raised state. As the lower contact member, various forms other than the lower support pins 30 that support the substrate 4 at a plurality of points can be used. For example, when the lower surface of the substrate 4 is supported by a surface, a rectangular block-shaped receiving block in which an upper surface is provided with a receiving surface that abuts the lower surface of the substrate 4 and supports the surface can be used.

  Here, the movable clamp member 22 and the lower receiving pin 30 have different functions with respect to the substrate 4, and the movable clamp member 22 abuts against the lower surface of the substrate 4 to force the substrate 4 against the fixed clamp member 21 and the biasing force of the compression spring 27. It has the function to press and clamp by. On the other hand, the lower receiving pin 30 has only a function of contacting the lower surface of the substrate 4 and supporting it from below. Therefore, in order to realize a correct receiving state in the substrate receiving operation in which the elevating member 24 is lifted together with the movable clamp member 22 and the lower receiving pin 30 to receive the substrate 4, the movable clamping member 22 is attached to the substrate 4. It is necessary to clamp the substrate 4 with an appropriate clamping force by contacting the lower surface and raise the elevating member 24 to a position where the upper surface of the lower receiving pin 30 correctly contacts the lower surface of the substrate 4.

  A photo sensor 29 is disposed at one end of the elevating member 24, and a light shielding dog 28 extending downward from the outer end of one movable clamp member 22 is located above the photo sensor 29. ing. The light shielding dog 28 is provided so as to be able to enter the detection gap of the photo sensor 29, and as the lifting member 24 is lowered, the light shielding dog 28 is lowered in the detection gap and the lower end portion is at the detection position 29 a of the photo sensor 29. At the coincidence timing, the photo sensor 29 outputs a detection signal.

  In the present embodiment, the detection position at which this detection signal is output is such that the relative vertical position of the movable clamp member 22 relative to the lifting member 24 is a predetermined offset dimension from the normal position for receiving the substrate 4 (FIG. 3). It has an implication as an offset position indicating that it is in a state separated by ΔH shown in (a). Here, the normal position for receiving the substrate 4 is such that the upper surface 22a of the movable clamp member 22 and the upper surface 30a of the lower receiving pin 30 are at the same level (see FIG. 3C). The relative positional relationship between the member 22 and the elevating member 24 is referred to.

  A detection signal detected by the photosensor 29 is transmitted to the control unit 34, and the control unit 34 performs a lifting operation control to be described later based on the detection signal. The control unit 34 controls the nozzle lifting mechanism 33 that lifts and lowers the suction nozzle 14a, and monitors the pulse signal of the encoder provided in the drive motor of the nozzle lifting mechanism 33, whereby the height position of the lower end portion of the suction nozzle 14a. Can be detected. That is, the height position of the height detection target portion can be measured by bringing the lower end portion of the suction nozzle 14a into contact with the height detection target. In the present embodiment, this height measurement function is used to measure a later-described receiving height offset.

  A storage unit 35 and a notification unit 36 are attached to the control unit 34, and the storage unit 35 stores various control programs and data necessary for the component mounting operation. The data stored here is data on the detection reference height (described later) that is set to detect the value of the bearing height offset and the thickness abnormality in which the thickness of the work target substrate 4 is different from the normal thickness. Is included. The notification unit 36 performs various notifications in the process of executing the component mounting operation. This notification includes a thickness abnormality notification when the thickness of the substrate 4 is different from the normal thickness.

  Next, the substrate clamping operation by the fixed clamp member 21 and the movable clamp member 22, the substrate 4 receiving operation by the lower receiving pin 30, and the detection signal output by the photosensor 29 will be described with reference to FIG. 3. As described above, in the substrate receiving portion 3 shown in the present embodiment, when a plurality of types of substrates 4 having different thicknesses are to be received, the substrate 4 is pressed against the fixed clamp member 21 from below to increase the height. A so-called upper surface reference is used to adjust the position.

  For this reason, the height position of the lower surface of the substrate 4 in the receiving state varies depending on the thickness of the target substrate 4, and the movable clamp member 22 and the lower receiving pin 30 that contact the lower surface of the substrate 4 in the receiving state are provided. It is necessary to correctly set the height position of the elevating member 24 to be raised individually according to the thickness of each substrate 4. In other words, a plurality of types of height control parameters for the control unit 34 to control the rotation drive mechanism 31 are set according to the thickness of each substrate, and the operation operation for changing the height control parameter every time the product type is switched. Needed.

In the present embodiment, in order to avoid such a trouble of changing the height control parameter, the relative vertical movement between the movable clamp member 22 and the elevating member 24 at the detection timing at which the detection signal of the photosensor 29 is output. The position (in other words, the height difference between the upper surface 22a of the movable clamp member 22 and the upper surface 30a of the lower receiving pin 30 provided on the elevating member 24) is measured in advance as an offset value (lower receiving height offset) unique to each device. In the substrate receiving operation for raising the elevating member 24, the elevating operation control of the elevating member 24 is performed by combining the detection timing of the photo sensor 29 and the lower height of the receiving member. .

  Next, with reference to FIG. 3, an operation for obtaining the bearing height offset will be described. FIG. 3 shows an example in which a dummy substrate 40 having a width narrower than that of the actual substrate 4 and convenient for work is used for teaching for teaching a base height offset unique to each apparatus. First, the elevating member 24 is raised with the dummy substrate 40 placed on the upper surface of the movable clamp member 22, and the dummy substrate 40 is sandwiched between the fixed clamp member 21 and the movable clamp member 22. At this time, as long as the clamp state is weak and the movable clamp member 22 pushes the compression spring 27 downward is small, the lower end of the light shielding dog 28 has not yet reached the detection position 29 a of the photosensor 29, and detection from the photosensor 29 No signal is output.

  Thereafter, in the process in which the rotary drive mechanism 31 is driven to raise the elevating member 24 gradually and the movable clamp member 22 pushes the compression spring 27 further downward, as shown in FIG. The photosensor 29 outputs a detection signal to the control unit 34 at the timing when the lower end portion coincides with the detection position 29a, that is, at the timing when the height position of the elevating member 24 reaches the clamp detection height position H0. The height difference ΔH between the upper surface of the lower receiving pin 30 and the upper surface of the movable clamp member 22 at this detection timing becomes the lower height of the target to be obtained.

  In the present embodiment, since the height measurement is performed by the height detection function of the suction nozzle 14a, the height measurement by the suction nozzle 14a is made as easy as possible for the receiving pin 30 serving as a measure. Height measurement is performed in a state where the elevating member 24 is further raised by a fixed height dimension (for example, 2 mm) from the clamp detection height position H0 shown in FIG. That is, as shown in FIG. 3B, the elevating member 24 is stopped in a state where it is raised by the fixed height dimension C, and measurement of the lower height offset is performed.

  In this measurement, the suction nozzle 14a is sequentially lowered to the exposed upper surface 40a and the upper surface 30a of the receiving pin 30 without being sandwiched at the end of the dummy substrate 40, and the height measurement of the nozzle lifting mechanism 33 and the control unit 34 is performed. Use the function to measure the height. Then, by subtracting the known thickness t of the dummy substrate 40 from the measured height difference (height difference between the upper surface 40a of the substrate 40 and the upper surface 30a of the receiving pin 30), the height difference ΔH is calculated. A dimension (ΔH−C) obtained by subtracting the fixed height dimension C is obtained. Then, by adding the fixed height dimension C to the obtained dimension (ΔH−C), a height difference ΔH between the upper surface 30a of the receiving pin 30 and the upper surface 22a of the movable clamp member 22 at the detection timing by the photosensor 29, That is, the bearing height offset can be obtained.

  This base height offset ΔH is an offset value inherent to the base base part 3 and will be described below using the same base height offset ΔH regardless of the thickness of the target base 4 as will be described later. The receiving operation can be controlled correctly. That is, as shown in FIG. 3C, by raising the elevating member 24 further by the lower support height offset ΔH from the clamp detection height position H0 of the elevating member 24 at the detection timing detected by the photosensor 29, Similarly, the receiving pin 30 rises by ΔH from the state shown in FIG. 3A, whereby the upper surface 30 a of the lower receiving pin 30 rises to a position where it correctly contacts the lower surface of the dummy substrate 40. The height position H1 of the elevating member 24 at this time is stored in the storage unit 35 as a height control parameter that indicates the height position of the support when the substrate 4 having a thickness equal to the thickness t of the dummy substrate 40 is targeted. The

In the above configuration, the photo sensor 29 combined with the light shielding dog 28 is located between the movable clamp member 22 and the fixed clamp member 21 whose relative vertical positions are set in advance in the relative vertical movement of the movable clamp member 22 with respect to the lift member 24. The clamp 4 functions as a clamp detection means for detecting that the substrate 4 is sandwiched between the movable clamp member 22 and the relative vertical position of the movable clamp member 22 with respect to the lift member 24 is a preset offset position and outputs a detection signal.

  In addition, the storage unit 35 calculates the difference in height between the upper surface 22a of the movable clamp member 22 and the upper surface 30a of the lower receiving pin 30 at the detection timing when the clamp detection means outputs the detection signal, as a base height offset ΔH unique to the device. As well as the receiving height position H1 shown in FIG. 3C, that is, the receiving height position H1 set corresponding to the thickness of the target substrate 4.

  Next, a method for detecting an abnormality in the thickness of the substrate 4 using a difference in detection timing of the photosensor 29 will be described with reference to FIG. FIG. 4A shows that a regular substrate 4 having a correct specified thickness to for a specific type of substrate 4 is clamped by a fixed clamp member 21 and a movable clamp member 22, and a detection signal is output by a photo sensor 29. The state is shown schematically. At this time, the height position of the elevating member 24 at the detection timing is the detection reference height position Hs corresponding to the specified thickness t0. This detection reference height position Hs corresponds to the clamp detection height position when the thickness of the substrate 40 is t0 in the example shown in FIG.

  The detection reference height position Hs is obtained by actually clamping the substrate and executing the substrate receiving operation each time a new substrate type is targeted. That is, the height position of the elevating member 24 at the detection timing at which the detection signal from the photosensor 29 is output is obtained by detecting the rotation drive mechanism 31 and the control unit 34, and the obtained detection reference height position Hs. Is stored in the storage unit 35 as a reference detection height position corresponding to the board type.

  FIG. 4B shows the detection timing of the photosensor 29 in a state where the substrate 4 </ b> A having a thickness t <b> 1 thicker than the specified thickness to is clamped by the fixed clamp member 21 and the movable clamp member 22. That is, since t1 is thicker than t0, before the height position of the elevating member 24 reaches the detection reference height position Hs, the lower end portion of the light shielding dog 28 coincides with the detection position 29a, and the photosensor 29 outputs a detection signal. Output. On the other hand, FIG. 4C shows the detection timing of the photosensor 29 in a state where the substrate 4B having a thickness t2 smaller than the specified thickness to is clamped by the fixed clamp member 21 and the movable clamp member 22. That is, since t1 is thinner than t0, even if the height position of the lifting member 24 reaches the detection reference height position Hs, the lower end portion of the light shielding dog 28 does not reach the detection position 29a, and the height of the lifting member 24 After the position passes the detection reference height position Hs, the lower end portion of the light shielding dog 28 coincides with the detection position 29a, and the photosensor 29 outputs a detection signal.

  In other words, by monitoring the detection timing of the photosensor 29, the thickness of the substrate clamped by the fixed clamp member 21 and the movable clamp member 22 is within a normal variation range with respect to the specified thickness at that time, or It is possible to determine whether the thickness is abnormal beyond the normal range. That is, the vertical fluctuation of the height position at the detection timing shown in FIGS. 4B and 4C is within the upper abnormal position UL and the lower abnormal position LL set in advance corresponding to the allowable error dimension d of the thickness. If not, the control unit 34 determines that the thickness of the substrate clamped at that time is abnormal, and notifies the notification unit 36 to that effect. That is, the control unit 34 and the notification unit 36 serve as an abnormality determination notification unit that determines that the thickness of the substrate is abnormal and notifies that effect.

Here, if it is determined that the thickness of the substrate is abnormal, it is determined that an error or error has occurred in any of the substrates, and a countermeasure is selected. As a countermeasure, the teaching of offset height offset is executed again and updated, and the height control parameter indicating the bearing height position H1 shown in FIG. 3C is updated. That is, in this case, the control unit 34 functions as an offset update unit that updates the bearing height offset.

  Next, referring to FIG. 5, FIG. 6, FIG. 7, and FIG. 8, in an electronic component mounting apparatus used in an electronic component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate, A substrate receiving method for receiving and supporting a substrate to be a work operation from the lower surface side by the substrate receiving portion 3 will be described.

  First, the target substrate 4 is supplied from the upstream device, and is delivered to the conveyor mechanism 20 and conveyed to the receiving position by the substrate receiving portion 3 as shown in FIG. Next, the lower support raising / lowering operation is started, and as shown in FIG. 5B, the rotary drive mechanism 31 is driven to raise the elevating member 24 together with the movable clamp member 22 and the lower receiving pin 30 with respect to the substrate 4. FIG. 6A shows a state in which the movable clamp member 22 is in contact with the lower surface of the substrate 4 in the ascending process. Thereafter, the raising / lowering member 24 is further raised, as shown in FIG. 6B. Thus, the board | substrate 4 lifts from the conveyor mechanism 20, and raises further.

  Next, as shown in FIG. 7A, the substrate 4 lifted by the movable clamp member 22 is further raised so that the upper surface of the substrate 4 contacts the lower surface of the fixed clamp member 21. As a result, both end portions of the substrate 4 are sandwiched between the fixed clamp member 21 and the movable clamp member 22. By gradually raising the elevating member 24 from this state, as shown in FIG. 7B, the lower end portion of the light shielding dog 28 coincides with the detection position 29a, whereby the photosensor 29 outputs a detection signal. . Receiving this output signal, the control unit 34 reads the backing height offset ΔH stored in the storage unit 35 and rotationally drives the raising / lowering member 24 to be raised by the backing height offset ΔH from this detection timing. The mechanism 31 is controlled.

  That is, the control unit 34 controls the rotational drive mechanism 31 as the lifting drive means to offset in the substrate receiving operation for raising the lifting member 24 to receive and support the substrate 4 by the substrate receiving unit 3. The elevating member 24 is raised until it is detected that the position has been reached, and then the elevating member 24 is raised by the lower receiving height offset ΔH, whereby the upper surface of the lower receiving pin 30 that is the lower receiving contact member becomes the substrate. Ascending / descending control means for reaching a lower receiving height position in contact with the lower surface of 4.

  When the substrate receiving operation shown in FIGS. 5 to 8 is repeated for the same type of substrate, the lifting member 24 in the state shown in FIG. 3C in the substrate receiving operation for the first substrate is used. The under support height position H1 is read by the control unit 34 and stored in the storage unit 35. Then, in the substrate receiving operation for the subsequent substrate, the elevating member 24 is raised without stopping with the target height position H1 as a target.

  That is, in the present embodiment, the storage unit 35 stores the receiving height position H1 in the substrate receiving operation for the first substrate of the work operation, and the control unit 34 is the same type of substrate as the first substrate 4. In the subsequent substrate receiving operation for the above, the rotation drive mechanism 31 is controlled with the stored receiving height position H1 as the target position.

  Similarly, in the process of repeatedly performing the substrate receiving operation, the presence or absence of abnormality in the thickness of the substrate is monitored by the method shown in FIG. That is, the height position of the elevating member 24 at the detection timing when the detection signal of the photosensor 29 is output in a state where the target regular thickness substrate is sandwiched between the fixed clamp member 21 and the movable clamp member 22, is the detection reference. The height position Hs is stored in the storage unit 35.

  In the substrate receiving operation for raising the elevating member 24 to receive and support the substrate 4 by the substrate receiving portion 3, the height position of the elevating member 24 is a predetermined height from the detection reference height position Hs. When reaching the lower detection limit position LL set downward by the allowable error dimension d, the raising of the elevating member 24 is stopped and the signal output of the photosensor 29 is monitored. If a detection signal has already been output from the photosensor 29, the control unit 34 determines that the thickness of the substrate sandwiched between the movable clamp member 22 and the fixed clamp member 21 is abnormal at that time. The notification unit 36 notifies that fact.

  Further, even if the elevating member 24 reaches the detection reference height position Hs, the detection signal from the photo sensor 29 is not output, and the upper detection limit is set above the detection reference height position Hs by an allowable error dimension d. When the position UL is reached, the lifting of the elevating member 24 is stopped and the signal output of the photosensor 29 is monitored. Again, if the detection signal is not yet output from the photosensor 29, the controller 34 similarly determines that the thickness of the substrate sandwiched between the movable clamp member 22 and the fixed clamp member 21 is abnormal at that time. Then, the notification unit 36 notifies that effect. Such a substrate thickness abnormality presence / absence detection operation is performed using a time during which a substrate is carried into the apparatus and an operation such as imaging for position recognition by the substrate recognition camera is being performed.

  Here, if it is determined that the thickness of the substrate is abnormal, it is determined that an error or error has occurred in any of the substrates, and a countermeasure is selected. In the embodiment shown here, for the board determined to be abnormal, the height difference Δ shown in FIG. 3 is again obtained by measurement and newly stored in the storage unit 35, and the bearing height offset ΔH is updated. To do. At the same time, for the board, a new height control parameter indicating the receiving height position H1 shown in FIG. 3C is newly obtained, stored in the storage unit 35, and updated.

  As described above, in the substrate receiving portion 3 shown in the present embodiment, the substrate 4 is sandwiched between the movable clamp member 22 and the fixed clamp member 21 and the relative vertical position of the movable clamp member 22 with respect to the lifting member 24. Is provided with a clamp detection means for detecting that the offset position is set in advance and outputting a detection signal, and the height difference between the upper surface of the movable clamp member 22 and the upper surface of the receiving pin 30 at the detection timing is provided. It is memorized as a unique bearing height offset ΔH.

  Then, the raising / lowering member is raised until it is detected that the offset position is reached in the substrate receiving operation, and then the raising / lowering member 24 is raised by the amount of the receiving height offset ΔH. As a result, even if the thicknesses of multiple target board types differ, the board can be placed in the correct height position without the need for operations such as machine adjustment and change of control parameters when switching between types. It can be supported with a flatness.

  Further, in the substrate receiving operation, the detection signal is already output when the height position of the elevating member 24 reaches the lower detection limit position LL set below the reference detection height position Hs by the allowable error dimension d. If the detection signal is not yet output when reaching the upper detection limit position UL set by the allowable error dimension d from the reference detection height position Hs, the thickness of the substrate clamped at that time Is determined to be abnormal and a notification to that effect is made. As a result, even when different types of substrates with different thicknesses are brought in, or when the thickness of the substrates varies due to a thickness error between manufacturing lots, the thickness abnormality can be detected correctly. It is possible to prevent the height position error of the substrate and the flatness failure.

In the present embodiment, an example of an electronic component mounting apparatus for mounting an electronic component on a substrate is shown as an electronic component mounting apparatus used in the electronic component mounting line. However, the present invention is not limited to this. is not. For example, an apparatus used in an electronic component mounting line, such as a screen printing apparatus or an inspection apparatus, which has a substrate receiving portion configured to receive and support a substrate from the lower surface side, the present invention Applicable.

  The electronic component mounting apparatus of the present invention and the substrate receiving method in the electronic component mounting apparatus can bring the substrate to the correct height position without requiring work when switching product types even when the thickness of the substrate is different. It has the effect that it can be supported with good flatness, and can be used for the purpose of receiving a substrate in an electronic component mounting apparatus such as a screen printing apparatus or an electronic component mounting apparatus.

The perspective view of the electronic component mounting apparatus of one embodiment of this invention Sectional drawing of the board | substrate receiving part in the electronic component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the board | substrate receiving part in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the board thickness abnormality detection in the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the board | substrate underlay method in the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the board | substrate underlay method in the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the board | substrate underlay method in the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the board | substrate underlay method in the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

2 Conveying path 3 Substrate receiving part 4, 4A. 4B substrate 5 component supply unit 13 mounting head 21 fixed clamp member 22 movable clamp member 23 elastic support unit 27 compression spring 28 light shielding dog 29 photosensor 30 lower receiving pin 31 rotation drive mechanism 32 feed screw 40 dummy substrate

Claims (4)

An electronic component mounting device used in an electronic component mounting line for manufacturing a mounting substrate by mounting an electronic component on a substrate,
In the electronic component mounting apparatus, a substrate receiving part that supports and supports a substrate that is a target of work operation of the apparatus from the lower surface side,
A pair of fixed clamp members disposed in a plane position where both side edges of the substrate abut from below, and the height position of the lower surface is matched to the work height position in the work operation;
An elevating member disposed below the fixed clamp member so as to be movable up and down, and an elevating drive means for elevating the elevating member according to a height control parameter;
It is held in a state of being able to move up and down relative to the elevating member and urged upward by an urging means, and in contact with the lower surfaces of both side edges of the substrate in the state of being raised together with the elevating member. A pair of movable clamp members that sandwich both side edges of the substrate between the fixed clamp members;
A lower contact member that is provided on the elevating member and integrally moves up and down and contacts the lower surface of the substrate in the raised state to receive the substrate;
A detection signal is output by detecting that the substrate is sandwiched between the movable clamp member and the fixed clamp member and that the relative vertical position of the movable clamp member with respect to the lifting member is a preset offset position. Clamping detection means
A storage unit that stores the height difference between the upper surface of the movable clamp member and the upper surface of the lower contact member at the detection timing at which the clamp detection means outputs the detection signal, as an inherent lower height offset of the device. When,
In the substrate receiving operation for raising the elevating member to receive and support the substrate by the substrate receiving portion, the elevating driving means is controlled until the offset position is detected. Elevating control that raises the elevating member and then raises the elevating member by an amount corresponding to the lower height of the lower receiving portion to reach the lower receiving height position where the upper surface of the lower receiving contact member contacts the lower surface of the substrate And an electronic component mounting apparatus. The storage unit stores the lower height position in the substrate lowering operation for the first substrate of the work operation,
The elevating control means controls the elevating driving means in the subsequent substrate lowering operation for the same type of substrate as the first substrate, with the stored lower height position as a target position. The electronic component mounting apparatus according to claim 1. In an electronic component mounting apparatus used in an electronic component mounting line that mounts an electronic component on a board to manufacture a mounting board, the board that is the target of work operation of the apparatus is received from the lower surface side by the board receiving portion. A substrate receiving method in an electronic component mounting apparatus to be supported,
The substrate receiving portion includes a pair of fixed clamp members disposed at a planar position where both side edges of the substrate abut from below, and with the height position of the lower surface aligned with the work height position in the work operation. An elevating member disposed below the fixed clamp member so as to be movable up and down, elevating drive means for elevating the elevating member according to a height control parameter, and a vertical movement relative to the elevating member. Both sides of the substrate are held in a state of being biased upward by the biasing means and are in contact with the lower surfaces of the side edges of the substrate in a state of being lifted together with the lifting member. A pair of movable clamp members that sandwich the substrate, a lower contact contact member that is provided on the elevating member and moves up and down integrally, and in contact with the lower surface of the substrate in the raised state, and the movable clamp A clamp that outputs a detection signal by detecting that the substrate is sandwiched between a clamp member and the fixed clamp member, and that the relative vertical position of the movable clamp member with respect to the lift member is a preset offset position. Detecting means,
The difference in height between the upper surface of the movable clamp member and the upper surface of the lower contact member at the detection timing when the clamp detection means outputs the detection signal is stored as a lower height of the lower device unique to the device. ,
In the substrate receiving operation for raising the elevating member to receive and support the substrate by the substrate receiving portion, the elevating driving means is controlled until the offset position is detected. By raising the elevating member and then raising the elevating member by the lower receiving height offset, the upper surface of the lower abutting contact member reaches the lower receiving height position where it abuts the lower surface of the substrate. A substrate underlaying method in an electronic component mounting apparatus, which is characterized. Storing the height position of the support in the substrate support operation for the first substrate of the work operation;
4. The raising / lowering driving means is controlled by using the stored lower height position as a target position in a subsequent lower position operation for the same substrate as the first substrate. Substrate underlaying method for electronic component mounting apparatus.

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