JP4685560B2 - Rotary blade polishing equipment - Google Patents

Description

  The present invention relates to a rotary blade polishing apparatus, and more specifically, for example, polishing a rotary blade that chamfers the blade tips of a plurality of circular rotary blades stacked in the direction of the rotation axis for cutting a thin sheet-shaped workpiece. It relates to the device.

  A slitter apparatus that cuts a wide sheet-like web into a plurality of narrow tapes having a constant width is used for manufacturing various products. Among them, a magnetic sheet having at least a magnetic layer on one main surface on a plastic support such as polyester and having a back layer on the other surface is cut to a certain width and used in a process of manufacturing a magnetic tape. In the slitter device, a remarkably high accuracy is required for the cutting width, the shape of the cut surface, and the like.

  For this reason, various ideas have been made for the cutter of the slitter device. For example, Patent Document 1 discloses that the sharpness of the blade is improved by performing a specific chamfering process on the outer peripheral side surface portion of the round blade (rotating blade). Moreover, the method of the said chamfering process of a rotary blade is also proposed (for example, patent document 2, 3).

Japanese Examined Patent Publication No. 7-121515 JP 2003-94298 A JP 2003-127050 A

  However, the chamfering of this rotary blade is on the order of several μm to 10 and several μm in the radial direction of the rotary blade and several μm in the thickness direction, requiring extremely high precision technology, and adjusting and measuring the blades one by one. It is necessary to perform polishing while repeating the above, and it takes a long time to process a large number of blades, resulting in poor work efficiency and high cost. In the above-described conventional technologies (Patent Documents 2 and 3), it is disclosed that polishing is performed by pressing a polishing body that performs chamfering processing against the rotating blade while absorbing the vibration and position of the rotating blade. The polishing start position when polishing a large number of rotary blades sequentially is set while observing with a tool microscope, and the slitter device for magnetic tape is usually composed of several tens or more rotary blades. It was not enough to improve efficiency and processing cost.

  When trying to continue and automate the polishing operation, the polishing unit of the polishing apparatus can be moved in a plurality of axial directions with respect to the plurality of rotary blades assembled to the blade rotation shaft of the slitter device. A continuous automatic polishing apparatus that sequentially contacts and polishes a plurality of blades can be considered. For example, it is conceivable to program the amount of movement of the polishing part in each axial direction, the polishing time, etc. to perform continuous polishing operation, but only by programming control with numerical values will cause variation in the assembly accuracy of the rotary blade. In addition, it is extremely difficult to polish the outer peripheral side surface of the rotary blade with the aforementioned accuracy. This is because although the rotary blades are assembled at regular intervals (each interval accuracy is 1 μm or less), as shown in FIG. 4, the blade is composed of several tens of blades 6 and its blade holder 7. This is because it is difficult to suppress the distance between the blades at both ends of the blade shaft to an error of several μm or less.

  In view of the above problems, an object of the present invention is to provide a polishing apparatus capable of continuously polishing a rotary blade with high accuracy.

  As a result of intensive studies to achieve the above object, the present inventors have found that if the polishing apparatus has the following configuration, it is relatively simple and good polishing accuracy can be obtained. It came to.

That is, a plurality of rotary blades held at regular intervals in the axial direction on the same axis as the rotary shaft.
A polishing section comprising a polishing means for contacting the rotary blade and polishing the rotary blade, and a driving means for driving the polishing means;
In a rotary blade polishing apparatus comprising: a moving unit including a plurality of moving platforms capable of moving the polishing unit in a plurality of axial directions; and when the polishing unit moves and contacts the rotary blade to polish the rotary blade On the first movable table that moves, a movable table that is movable in the moving direction of the first movable table and is urged by an elastic body in a direction approaching the rotary blade is disposed. The polishing unit is disposed, and the amount of movement of the first moving table after the first moving table moves and the polishing means contacts the rotary blade further becomes the amount of backward movement of the movable table. And measuring means for measuring the backward movement amount is provided.

  Further, the rotation of the rotating shaft and the operation of each moving table of the moving unit are continuously and automatically controlled, and polishing with respect to a plurality of rotating blades is performed by controlling the backward movement amount to thereby polish a plurality of rotating blades. Can be polished continuously with high accuracy.

  When chamfering the outer peripheral side surfaces of a plurality of rotary blades held on the same axis in the axial direction on the same axis as the rotary shaft, on the moving table that moves the polishing portion having the polishing means closer to the rotary blade in the axial direction. Since the movable base urged by the elastic body in the direction approaching the rotary blade is disposed, the amount of movement of the movable base after the polishing means comes into contact with the rotary blade is regarded as the retreat amount of the movable base. The amount of overlap with respect to the rotating blade of the polishing means can be reduced even if the axial position of the rotating blade on the rotating shaft is slightly deviated from the design value by evaluating the retreat amount by the measuring means and controlling it to a constant amount. Since it can be controlled to a certain amount, the polishing amount of the plurality of rotary blades can be controlled to a predetermined amount with high accuracy.

  Hereinafter, description will be given with reference to the drawings.

  FIG. 1 is a perspective view showing the overall configuration of a polishing apparatus according to an example of the present invention. The polishing apparatus 17 of this example includes a rotary shaft 5, a plurality of rotary blades 6 held on the same axis in the axial direction on the same axis as the rotary shaft 5, and a first movement that can move parallel to the rotary shaft 5. A first moving table 1, a second moving table 2 disposed on the first moving table 1 and perpendicular to the rotating shaft 5 and movable in a direction approaching and moving away from the rotary blade in the previous period; and a second moving table 2 and a polishing table 10 disposed on the turntable 4 and a turntable 4 that can swing in the direction of the rotation axis perpendicular to the second moving table.

  FIG. 3 is a detailed view showing the configuration of the polishing unit 10 in more detail. In the polishing unit 10, a polishing plate 14 that is a polishing unit that contacts the rotary blade 6 and polishes it, and a motor 16 that is a driving unit that drives the polishing plate 10 are disposed on the movable table 15. It is movable in the direction of the rotation axis, is connected to the polishing part base 3 via a linear motion guide 11, and is urged in the left direction by a compression spring 12 (elastic body). For this reason, when the polishing plate 14 approaches the rotary blade 6 due to the movement of the first moving table 1 and further moves the first moving table 1 after the contact, the movable table moves the first moving table 1. It moves backward with the amount. The backward movement amount is measured by a linear gauge 13 which is a means for measuring the movement amount, and is displayed and controlled by a display / control unit 13a of the linear gauge.

  In this example, the polishing unit is exemplified by the rotating polishing plate 14 that is a polishing means and the motor 16 that is a driving means that drives the polishing plate. A conventionally known polishing method capable of polishing the rotary blade, such as contacting with the substrate, can be used.

  FIG. 2 is an explanatory diagram showing an operation sequence of an example of a polishing unit of an example polishing apparatus according to the present invention. Based on this figure, the operation of the polishing apparatus of this example will be described.

  The polishing portion set at a predetermined angle θ with respect to the rotary shaft 5 by the rotary table 4 is moved from a predetermined position (starting position) with respect to the rotary shaft 5 by (1) moving the second moving table 2. In the direction perpendicular to the rotation axis, it moves by a predetermined amount and moves to a position slightly closer to the rotation axis (polishing standby position) between the blade edges 6a of the rotary blades where the outer peripheral portion of the polishing plate 14 is rotating. Next, (2) the first moving table 1 is moved to move in a direction parallel to the rotation axis and in a direction approaching the blade edge 6a of the rotary blade, and the polishing plate 14 contacts the blade edge 6a of the rotary blade. The movable table 15 on which the polishing plate 14 is disposed is connected to the polishing unit base 3 via the linear guide 11 and is biased in the direction of the cutting edge 6a of the rotary blade by the compression spring 12 (elastic body). The further movement amount of the first moving table 1 after the contact appears as a corresponding amount to the moving amount of the movable table 15 on the polishing unit base 3, and the moving amount is detected by the linear gauge 13. This detected amount of movement is the amount of overlap between the rotary blade 6 and the polishing plate 14, and by stopping the moving operation of the first moving table 1 at a position (polishing position) where the detected amount of movement reaches a predetermined value. The overlap amount can be controlled to a predetermined amount. After the polishing plate 14 rotated by the motor 16 is brought into contact with the rotary blade 6 for a predetermined time, (3) the polishing plate 14 is separated from the rotary blade 6 by the moving operation of the first moving table 1 and moved by a predetermined amount for polishing. The part 10 returns to the polishing standby position. By making the overlap amount and the contact time between the polishing plate 14 and the rotary blade 6 constant, the polishing amount can be controlled to a predetermined amount. Thereafter, (4) the polishing unit 10 is moved away from the rotating shaft 5 by the moving operation of the second moving table 2, moved by a predetermined amount, and returned to the start position. By this series of operations, polishing of one rotary blade 6 is completed, and in order to polish the next rotary blade 6, (5) the first moving table 1 moves a predetermined amount to polish the next rotary blade. Move to the next starting position to start.

  According to the rotary blade polishing apparatus of the present invention, the amount of movement by the second moving table 2 in (1) and (4) can be set to a predetermined amount, and by changing this, the rotary blade of the polishing plate 14 is changed. The radial position where 6 hits can be controlled, and the blade can always be prevented from hitting the same place. The amount of movement by the first moving table 1 in (2) may not be set as a predetermined amount, and the amount of overlap from the contact of the polishing plate 14 with the blade edge 6a of the rotary blade by movement is set as the predetermined amount. . Therefore, even if the amount of movement of the first moving table 1 in (3) and (5) is a predetermined amount, even if there is an integrated error in the mounting interval of the rotary blade to the rotary shaft, the polishing amount of each blade is accurately constant. It becomes possible to be kept at.

  Further, the chamfering angle of the polishing surface of the blade edge 6 a of the rotary blade can be controlled by changing the swing angle θ of the rotary table 4.

The polishing apparatus of the present invention automatically operates a series of operations from the polishing of the first rotary blade to the final rotary blade by computer control by setting each predetermined movement amount, the number of blades, etc. be able to.

1 is a perspective view showing an overall configuration of a polishing apparatus according to an example of the present invention. It is explanatory drawing which shows the operation | movement order of an example of the grinding | polishing part of the grinding | polishing apparatus of an example of this invention. It is detail drawing which shows the detailed structure of the grinding | polishing part of the grinding | polishing apparatus of an example of this invention. It is sectional drawing which shows the structure of a rotary blade.

Explanation of symbols

1 First moving table (moving in the direction parallel to the rotation axis)
2 Second moving table (moves in a direction perpendicular to the rotation axis)
DESCRIPTION OF SYMBOLS 3 Polishing part base 4 Rotating base 5 Rotating shaft 6 Rotating blade 6a Rotating blade edge 7 Blade holder 10 Polishing part 11 Linear motion guide 12 Compression spring (elastic body)
13 Linear Gauge 13a Linear Gauge Display / Control Unit 14 Polishing Plate 15 Movable Stand 16 Motor 17 Polishing Device

Claims (2)

A plurality of rotary blades that are coaxial with the rotary shaft and held at regular intervals in the axial direction, a polishing means that contacts the rotary blade and polishes the rotary blade, and a drive means that drives the polishing means A rotary blade polishing apparatus comprising: a polishing unit comprising: a moving unit including a plurality of moving bases capable of moving the polishing unit in a plurality of axial directions;
The polishing unit is moved closer to the rotary blade from the starting position, on a first movable carriage that moves when polishing the contact the rotary blade, movable in the moving direction of the first movable carriage, said rotary blade A movable base urged by an elastic body is arranged in the approaching direction,
The polishing section is disposed on the movable table,
The amount of movement of the first moving table after the first moving table moves and the polishing means contacts the rotary blade is further configured to be the amount of backward movement of the movable table,
A measuring means for measuring the amount of backward movement is provided ;
When the amount of backward movement measured by the measuring means reaches a predetermined numerical value, the moving operation of the first moving table is stopped, and the moving position returns to the start position.
An apparatus for polishing a rotary blade, characterized by moving to a starting position of the next rotary blade.



The rotation of the rotating shaft and the operation of each moving table of the moving unit are continuously and automatically controlled, and polishing with respect to a plurality of rotating blades is performed by controlling the backward movement amount. The rotary blade polishing apparatus described.

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