JP4515331B2 - Substrate processing system - Google Patents

Description

  The present invention relates to a substrate processing system for processing a substrate.

  Conventionally, for example, a process for a substrate such as a semiconductor wafer is often performed over a plurality of processes, and the process is continuously performed using a plurality of processing units. Therefore, the substrate processing is usually performed in a substrate processing system in which a plurality of processing units are collectively mounted.

  For example, a substrate processing system that performs a photolithography process includes a loader / unloader unit that loads and unloads a substrate, and a processing station that processes the substrate. A central transfer device is provided in the central portion of the processing station, and a plurality of processing unit groups are arranged in a circle around the central transfer device. The processing unit group is configured by stacking a plurality of processing units of different types or the same type in multiple stages. Then, a plurality of substrates sequentially loaded from the loader / unloader unit are sequentially transferred to a predetermined processing unit of a plurality of processing unit groups by a central transfer device, and substrates are processed continuously over a plurality of steps. . The substrate that has been processed in a plurality of steps is returned to the loader / unloader section. According to such a substrate processing system, it is possible to flexibly cope with various substrate processing recipes by changing the type and order of processing units in which the substrate is transferred by the central transfer device (see, for example, Patent Document 1). .

Japanese Patent No. 2919925

  However, according to the substrate processing system described above, since a large number of substrates are transferred using one central transfer device, another substrate can be transferred while one substrate is transferred. May not be possible. For this reason, it is difficult to always carry out the substrate from the processing unit at an ideal timing, and the residence time of some of the substrates in the processing unit becomes long, and a processing time difference may occur between the substrates. For example, the heat treatment time difference has a great influence on the processing result of the substrate and may cause variations in quality. Further, if the substrate transfer waiting time is increased, the time required for the entire substrate processing is increased correspondingly, which may cause a reduction in throughput.

  Further, in the conventional substrate processing system, a large central transfer device is arranged at the center of the processing unit, and each processing unit group is arranged around the transfer unit so as to secure a working space for the transfer arm. For this reason, a relatively large space is required in the processing station, and the entire substrate processing system is large.

  The present invention has been made in view of the above points, and is capable of flexibly responding to various substrate processing recipes without including a conventional central transfer device, and is also capable of processing time differences between substrates and waiting for substrate transfer. It is an object of the present invention to provide a substrate processing system that can reduce the time and further reduce the size.

According to the present invention , there are provided a first unit and a second unit that can accommodate a substrate, and at least one of the first unit or the second unit is provided in a plurality, and the first unit or At least one of the second units includes a processing unit for processing a substrate, and at least one of the first unit and the second unit includes the first unit and the second unit. A substrate transporting device between the first unit and the second unit, wherein the substrate can be transported by the transporting device by moving at least one of the first unit and the second unit. A processing system is provided.

  Either the first unit or the second unit may be horizontally movable, and either the first unit or the second unit may be arranged in parallel in the horizontal direction.

  Either the first unit or the second unit may be vertically movable, and either the first unit or the second unit may be stacked in the vertical direction.

  The first unit may include a thermal processing unit that performs thermal processing of the substrate, and the second unit may include a liquid processing unit that performs liquid processing of the substrate.

  The heat treatment unit may include a heating plate for heating the substrate, a cooling plate for cooling the substrate, and the transfer device.

  A plurality of the heat treatment units may be provided, and the plurality of heat treatment units may include an adhesion treatment unit for performing an adhesion treatment of the substrate.

  A plurality of or a single third unit capable of accommodating a substrate, wherein the third unit is configured to transfer a substrate to and from the second unit; In the case of providing a transfer device, at least one of the second unit and the third unit moves, and the transfer device transfers the substrate between the second unit and the third unit. And when the second unit does not include the transfer device, the third unit transfers another substrate between the second unit and the third unit. A transport device, wherein at least one of the second unit and the third unit moves, and the substrate is transported between the second unit and the third unit by the other transport device. Can do Good.

  When the second unit moves horizontally, either the second unit or the third unit may be arranged in parallel in the horizontal direction.

  When the second unit moves up and down, either the second unit or the third unit may be stacked in the vertical direction.

  The third unit may include a heat treatment unit for heat treating the substrate.

  The heat treatment unit may include a heating plate for heating the substrate, a cooling plate for cooling the substrate, and the transfer device.

  A plurality of the heat treatment units may be provided, and the plurality of heat treatment units may include an adhesion treatment unit for performing an adhesion treatment of the substrate.

  According to the present invention, it is possible to flexibly deal with various substrate processing recipes. In addition, the processing time difference between the substrates is reduced, and quality variations can be reduced. Furthermore, the waiting time for transporting the substrate is reduced, and the throughput can be improved. It is possible to reduce the size of the substrate processing system.

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is a plan view showing an outline of the configuration of a substrate processing system 1 according to the present embodiment.

  As shown in FIG. 1, the substrate processing system 1 includes, for example, a loader for loading / unloading 25 wafers W into / from the substrate processing system 1 from the outside and loading / unloading wafers W into / from the cassette C. A cassette station 2 serving as an unloader section, a processing station 3 serving as a processing section provided adjacent to the cassette station 2 and performing various processes during the photolithography process, and the processing station 3 And an interface unit 4 for transferring the wafer W to and from an exposure apparatus (not shown). The cassette station 2, the processing station 3, and the interface unit 4 are connected in series in the Y direction (left-right direction in FIG. 1).

  The cassette station 2 is provided with a cassette mounting table 10 on which a plurality of cassettes C can be mounted in the X direction (vertical direction in FIG. 1). The cassette C can accommodate a plurality of wafers W arranged in the vertical direction. On the processing station 3 side of the cassette station 2, a wafer transfer body 11 that transfers the wafer W between the cassette C and the processing station 3 is provided. The wafer transport body 11 is movable on a transport path 12 formed along the X direction, for example. The wafer carrier 11 includes, for example, a holding unit 11a that holds the wafer W, and the holding unit 11a is movable in the vertical direction and is extendable in the horizontal direction. Thereby, the wafer transport body 11 can access the cassettes C arranged in the X direction and the unit of the first block B1 of the processing station 3 to be described later and transport the wafer W.

  The processing station 3 adjacent to the cassette station 2 includes, for example, three blocks B1, B2, and B3 including a plurality of units. For example, in the processing station 3, a first block B1, a second block B2, and a third block B3 are arranged in parallel from the cassette station 2 side to the interface unit 4 side.

  In the first block B1, for example, two unit groups G1 and G2 arranged in parallel along the X direction are arranged.

  As shown in FIG. 2, in the first unit group G1, for example, a plurality of heat treatment units as first units are stacked. For example, the first unit group G1 includes, for example, heating / cooling units 20, 21, 22, 23, and 24 that perform heating processing and cooling processing for the wafer W, and an adhesion and cooling unit that performs adhesion processing and cooling processing for the wafer W. 25 are stacked in six steps from the bottom. For example, two units adjacent in the vertical direction, that is, the heating / cooling units 20 and 21, the heating / cooling units 22 and 23, the heating / cooling unit 24, and the adhesion / cooling unit 25 are integrated into a set. Yes.

  In the second unit group G2, as in the first unit group G1, for example, as shown in FIG. 3, heating / cooling units 30, 31, 32, 33, 34 as the first unit, adhesion / cooling are provided. Units 35 are stacked in six steps in order from the bottom.

  Here, the configuration of the heating / cooling unit 20 of the first unit group G1 will be described. As shown in FIG. 4, the heating / cooling unit 20 includes a heating unit 41 that heats the wafer W and a cooling unit 42 that cools the wafer W in the housing 40. The heating unit 41 and the cooling unit 42 are juxtaposed along the X direction. For example, as shown in FIG. 1, the cooling unit 42 is arranged inside the processing station 3 (X direction positive direction side), and the heating unit 41 performs processing. It is arranged outside the station 3 (X direction negative direction side).

  As shown in FIG. 4, the heating unit 41 is located on the upper side and can be moved up and down, and on the lower side, the heating unit 41 is formed integrally with the lid 50 to form the processing chamber S. It has. The lid 50 is formed in a substantially cylindrical shape with an open bottom surface, and an exhaust part 50 a is formed at the center of the lid 50.

  A heating plate 52 for placing and heating the wafer W is provided at the center of the hot plate housing 51. The heating plate 52 has a substantially disk shape with a thickness. Inside the heating plate 52, a heater 53 that generates heat by power feeding is incorporated. The wafer W on the heating plate 52 can be heated by the heat of the heater 53. The heating plate 52 is supported by an annular support ring 54 and is fixed to the hot plate accommodating portion 51 through the support ring 54.

  On the upper surface of the support ring 54, for example, a blow-out port 54 a for injecting an inert gas into the processing chamber S is formed.

  A through-hole 55 that penetrates in the thickness direction is formed near the center of the heating plate 52. A first elevating pin 57 that is raised and lowered by an elevating drive mechanism 56 such as a cylinder is disposed in the through-hole 55, and the first elevating pin 57 can protrude above the heating plate 52.

  In the cooling unit 42 adjacent to the heating unit 41, for example, a cooling plate 60 for mounting and cooling the wafer W is provided. The cooling plate 60 has, for example, a substantially square flat plate shape as shown in FIG. 5, and the end surface on the heating unit 41 side is curved in an arc shape. A cooling member (not shown) such as a Peltier element is built in the cooling plate 60, and the cooling plate 60 can be adjusted to a predetermined set temperature.

  As shown in FIG. 4, the cooling plate 60 is attached to a rail 61 that extends toward the heating unit 41. The cooling plate 60 can be moved on the rail 61 by the driving unit 62. The cooling plate 60 can reciprocate between the heating plate 52 and the cooling unit 42.

  In the cooling plate 60, for example, as shown in FIG. 5, two slits 63 along the X direction are formed. The slit 63 prevents interference between the cooling plate 60 moved to the heating unit 41 side and the first elevating pin 57, and the first elevating pin 57 can protrude above the cooling plate 60. Thus, the wafer W on the cooling plate 60 can be transferred to the first lifting pins 57 and the wafer W can be placed on the heating plate 52 from the first lifting pins 57. Further, the wafer W on the heating plate 52 can be transferred to the first raising / lowering pins 57, and the wafer W can be placed on the cooling plate 60 from the first raising / lowering pins 57.

  As shown in FIG. 4, the second elevating pin 64 is provided in the slit 63 of the cooling plate 60. The second raising / lowering pin 64 can be raised and lowered by the raising / lowering driving unit 65 and protrude above the cooling plate 60. With the second lift pins 64, the wafer W of the cooling plate 60 can be lifted and transferred to the transfer device 80 described later.

  For example, as shown in FIG. 5, loading / unloading ports 70 for loading and unloading the wafer W are formed on both side surfaces in the Y direction of the casing 40 with the cooling plate 60 interposed therebetween.

  On the opposite side of the heating plate 52 across the cooling plate 60, there is provided a transfer device 80 for transferring the wafer W between the cooling plate 60 and a unit in the second block B2, which will be described later. The transport device 80 is disposed, for example, at a position closer to the positive side in the Y direction than the center, that is, closer to the second block B2. The transfer device 80 is, for example, an articulated transfer robot. For example, the transport device 80 includes two arms 80a that can expand and contract in the horizontal direction, and a rotation drive shaft 80b to which the arms 80a are attached. The transfer device 80 holds the wafer W by the two arms 80a, directs the wafer W in the direction of the transfer destination by the rotation drive shaft 80b, and advances and retracts the wafer W in the horizontal direction by the arm 80a. Can be transported to the transport destination.

  The other heating / cooling units 21, 22, 23, 24 of the first unit group G1 have, for example, the same configuration as the heating / cooling unit 20 described above. The adhesion / cooling unit 25 has, for example, substantially the same configuration as the heating / cooling unit 20 described above. For example, the adhesion / cooling unit 25 includes a supply port for supplying an adhesion enhancing agent for improving the adhesion of the resist solution, for example, HMDS vapor, into the processing chamber S, instead of the exhaust port 50a of the lid 50. Yes. Further, the adhesion / cooling unit 25 includes an exhaust port for exhausting the atmosphere in the processing chamber S in place of the blowing port 54 a of the support ring 54. The other portions are the same as those of the heating / cooling unit 20, and the adhesion / cooling unit 25 includes a heating plate 52, a cooling plate 60, a transport device 80, and the like. In addition, the same name and code | symbol as the above-mentioned heating / cooling unit 20 are used for the structural member of the heat processing unit of the 1st unit group G1.

  For example, as shown in FIG. 6, the heat treatment units in the first unit group G1 are each set (heating / cooling unit 20, 21 / heating / cooling unit 22, 23 / heating / cooling unit 24 and adhesion / cooling unit 25). Each time, it is held by a holding member 90 and attached to a guide 91 extending in the vertical direction. Each unit set can be moved in the vertical direction along the guide 91 by a drive mechanism 92, for example. Thereby, each heat treatment unit of the first unit group G1 can move up and down to a predetermined height with respect to the liquid processing unit in the second block B2. Note that the movable range of the heat treatment units of the first unit group G1 is set so that each liquid treatment unit of the second block B2, which will be described later, can transfer the wafer W to a plurality of heat treatment units in the vertical direction.

  The heating / cooling units 30 to 34 and the adhesion / cooling unit 35 of the second unit group G2 have the same configuration as the heat treatment unit of the first unit group G1 described above. Further, each heat treatment unit of the second unit group G2 has the moving mechanism shown in FIG. 6 similar to the first unit group G1, and is held by the holding member 90 for every two adjacent units. The drive mechanism 92 can be moved up and down to a predetermined height along the guide 91. In addition, the same name and code | symbol as the above-mentioned heating / cooling unit 20 are used for the structural member of the heat processing unit of 2nd unit group G2.

  The heat treatment units of the first unit group G1 and the second unit group G2 are arranged such that the cooling plates 60 are close to each other and face each other in the vicinity of the center of the processing station 3 as shown in FIG.

  In the second block B2 of the processing station 3, for example, three unit layers H1, H2, and H3 stacked in the vertical direction are arranged as shown in FIG. In each of the unit layers H1 to H3, a plurality of liquid processing units as second units that perform liquid processing on the wafer W are provided.

  For example, in the first unit layer H1 at the lowest level, as shown in FIG. 7, development processing units 100, 101, and 102 for supplying a developing solution to the wafer W for development processing are arranged side by side in the horizontal direction of the X direction. It has been. In the second unit layer H2 in the middle stage, for example, top coating units 110, 111, and 112 for forming an antireflection film on the resist film are arranged side by side in the horizontal direction of the X direction. The uppermost third unit layer H3 includes, for example, a resist coating unit 120 for coating a resist solution on the wafer W, a bottom coating unit 121 for forming an antireflection film below the resist film, and a resist coating unit 122. They are arranged side by side in the horizontal direction. Each liquid processing unit of the second block B2 is provided with a cup P that accommodates the wafer W and prevents the liquid from scattering.

  The development processing units 100 to 102 of the first unit layer H1 are accommodated in one housing 130 as shown in FIGS. 1 and 7, for example. The housing 130 is placed on a rail 132 formed on the base 131 in the X direction, for example. The housing 130 is movable on the rail 132 by a drive mechanism 133, for example. As a result, each development processing unit 100 to 102 of the first unit layer H1 has a horizontal direction in the X direction relative to the heat treatment units of the adjacent first block B1 and third block B3 as shown in FIG. Can be moved to. The movable range of the development processing units 100 to 102 is set so that, for example, each heat treatment unit of the first and third blocks B1 and B3 can transport the wafer W to a plurality of development processing units. In addition, loading / unloading ports (not shown) for the wafer W are formed on both sides in the Y direction of the housing 130.

  As shown in FIG. 7, the second unit layer H2 and the third unit layer H3 also have the same configuration as the first unit layer H1, and the second unit layer H2 and the third unit layer H3 have the same structure. Each of the plurality of liquid processing units is accommodated in the housing 130 and can be horizontally moved on the rail 132 in the X direction by the drive mechanism 133.

  The third block B3 of the processing station 3 is provided with two unit groups I1 and I2 arranged in parallel in the X direction. In each of the unit groups I1, I2, for example, a plurality of heat treatment units as a third unit are stacked.

  For example, in the first unit group I1, as shown in FIG. 2, heating / cooling units 140, 141, 142, 143, 144, and 145 are stacked in six stages in order from the bottom. For example, in the second unit group I2, as shown in FIG. 3, heating / cooling units 150, 151, 152, 153, 154, and 155 are stacked in six stages in order from the bottom.

  Each of the heating / cooling units 140 to 145 and 150 to 155 of the first unit group I1 and the second unit group I2 has the same configuration as the heating / cooling unit 20 of the first block B1 described above. A plate 52, a cooling plate 60, and a transfer device 80 as another transfer device are provided. By this transfer device 80, each heating / cooling unit of the first unit group I1 and the second unit group I2 can transfer the wafer W to and from the liquid processing unit of the second block B2. In addition, the same name and code | symbol as the above-mentioned heating / cooling unit 20 are used for the structural member of each heating / cooling unit of 1st unit group I1 and 2nd unit group I2.

  The heating / cooling units of the first unit group I1 and the second unit group I2 are arranged, for example, as shown in FIG.

  The heating / cooling units of the first unit group I1 and the second unit group I2 are integrated in such a way that, for example, as shown in FIGS.

  The heating / cooling units of the first unit group I1 and the second unit group I2 have the same moving mechanism as the heat treatment unit of the first block B1 as shown in FIG. Each unit is held by the holding member 90 and can be moved up and down to a predetermined height along the guide 91 by the drive mechanism 92. The movable range of the heat treatment units of the first and second unit groups I1 and I2 is set so that each liquid treatment unit of the second block B2 can transfer the wafer W to a plurality of heat treatment units in the vertical direction. .

  As described above, in the processing station 3, the heat treatment unit of the first block B1 and the heat treatment unit of the third block B3 can move up and down as shown in FIG. Further, the liquid processing unit of the second block B2 can horizontally move in the X direction in units of the casing 130 of each layer H1 to H3. The heat treatment unit of the first block B1 and the third block B3 is provided with a transfer device 80 for transferring the wafer W between the liquid processing unit of the second block B2. Thereby, the units of adjacent blocks move relatively, and within the movable range, between the first block B1 and the second block B2, and between the second block B2 and the third block B3, The wafer W can be transferred between arbitrary units.

  At the bottom of the processing station 3, as shown in FIG. 2, supply sources for various processing liquids supplied to the respective liquid processing units in the second block B2, power supplies for the respective units in the respective blocks B1 to B3, and the like are accommodated. An electrical / chemical chamber 160 is provided.

  On the processing station 3 side of the interface unit 4, for example, as shown in FIG. 1, a wafer carrier 170 is provided. On the positive side in the Y direction of the interface unit 4, peripheral exposure units 171 and 172 for selectively exposing only the edge portion of the wafer W, and a transfer cassette for transferring the wafer W to and from an exposure apparatus (not shown). 173 are arranged in the X direction. The delivery cassette 173 is provided between the peripheral exposure units 171 and 172.

  Wafer carrier 170 is movable on a conveyance path 174 extending in the X direction, for example. Wafer carrier 170 has a holding portion 170a for holding wafer W, and holding portion 170a is movable in the vertical direction and is extendable in the horizontal direction. The wafer carrier 170 can access the heat treatment unit of the third block B3 of the processing station 3, the peripheral exposure units 171 and 172, and the transfer cassette 173, and can carry the wafer W.

  Next, a wafer W processing process performed in the substrate processing system 1 configured as described above will be described.

  First, unprocessed wafers W in the cassette C are sequentially loaded into the first block B1 of the processing station 3 by the wafer carrier 11 as shown in FIG. For example, the wafer W is transferred to the adhesion / cooling unit 25 of the first unit group G1 or the adhesion / cooling unit 35 of the second unit group G2. The wafer W may be transferred to an adhesion / cooling unit that is vacant at the transfer time.

  For example, the wafer W carried into the adhesion / cooling unit 25 is first adjusted to a predetermined temperature in the cooling plate 60 and transferred from the cooling plate 60 to the heating plate 52. The wafer W is heated to a predetermined temperature on the heating plate 52, and HMDS vapor is applied to the wafer W. Thereafter, the wafer W is returned to the cooling plate 60, and is transferred by the transfer device 80 to, for example, the resist coating unit 120 of the third unit layer H3 on the upper stage of the second block B2 (shown by an arrow in FIG. 2). ). The wafer W may be transferred to the resist coating unit 122 of the same third unit layer H3. Further, the wafer W may be transferred to a resist coating unit that is empty at the time of transfer.

  When the positions of the resist coating unit 120 and the adhesion / cooling unit 25 at the transport destination are shifted during transport, for example, the adhesion / cooling unit 25 moves up and down as shown in FIG. As shown in FIG. 1, the adhesion / cooling unit 25 and the resist coating unit 120 relatively move so that the resist coating unit 120 moves in the horizontal direction and falls within a range in which the wafer W can be transferred by the transfer device 80. As for the relative movement between these units, only one unit may move or both units may move.

  Similarly, when the wafer W is transferred to the adhesion / cooling unit 35 of the second unit group G2, the wafer W is transferred to the resist coating unit 120 or 122 of the second block B2 after the completion of the adhesion process. .

  For example, a resist solution is applied to the wafer W transferred to the resist coating unit 120. Thereafter, as shown in FIG. 2, the wafer W is transferred from the resist coating unit 120 to, for example, the heating / cooling unit 24 on the upper side of the first unit group G1 of the first block B1. The wafer W may be another heating / cooling unit capable of transporting the wafer W to the top coating unit where the next processing is performed, such as the heating / cooling unit 23 in the middle stage of the first unit group G1, or the second It may be transported to the heating / cooling units 33, 34 of the unit group G2. Further, the wafer W may be transferred to the heating / cooling unit of the first block B1 that is vacant at the time of transfer.

  For example, the transfer of the wafer W from the resist coating unit 120 to the heating / cooling unit 24 is performed by the transfer device 80 of the heating / cooling unit 24. Further, when the positions of the heating / cooling unit 24 and the resist coating unit 120 at the transfer destination are shifted, the heating / cooling unit 24 and the resist coating unit 120 move relative to each other, so that the heating / cooling unit 24 and the resist coating unit 120 move. After the coating units 120 are brought close to each other, the wafer W is transferred by the transfer device 80.

  For example, the wafer W transferred to the heating / cooling unit 24 is transferred from the cooling plate 60 to the heating plate 52 and prebaked. The pre-baked wafer W is returned to the cooling plate 60. Thereafter, the wafer W is transferred by the transfer device 80 to, for example, the top coating unit 110 of the second unit layer H2 in the middle stage of the second block B2. The wafer W may be transferred to other top coating units 111 and 112 of the second unit layer H2. Further, the wafer W may be transferred to the top coating unit of the second block B2 that is vacant at the time of transfer.

  At the time of conveyance, the heating / cooling unit 24 descends from the height of the first unit layer H1 to the height of the second unit layer H2, for example. In the second unit layer H 2, for example, the top coating unit 110 as a transfer destination is horizontally moved to the front of the heating / cooling unit 24, and then the wafer W is transferred by the transfer device 80.

  For example, an antireflection liquid is applied to the wafer W transferred to the top coating unit 110 to form an antireflection film. Thereafter, the wafer W is transferred from the top coating unit 110 to the heating / cooling unit 142, for example, in the middle stage of the first unit group I1 of the third block B3. The wafer W is heated / cooled by another heating / cooling unit accessible to the top coating unit 110, for example, the heating / cooling unit 143 in the middle of the first unit group I1 or the second unit group I2. It may be conveyed to the cooling units 152, 153 and the like. Further, the wafer W may be transferred to the heating / cooling unit of the third block B3 which is vacant at the time of transfer.

  The transfer of the wafer W from the top coating unit 110 to the heating / cooling unit 142 is performed by the transfer device 80 of the heating / cooling unit 142. Further, when the positions of the heating / cooling unit 142 and the top coating unit 110, for example, as the transfer destination are shifted, the heating / cooling unit 142 and the top coating unit 110 move relative to each other, and the heating / cooling unit 142 The top coating units 110 are brought close to each other, and the wafer W is transferred by the transfer device 80.

  For example, the wafer W transferred to the heating / cooling unit 142 is transferred from the cooling plate 60 to the heating plate 52 and heated. The heated wafer W is returned to the cooling plate 60 and then transferred to, for example, the peripheral exposure unit 171 by the wafer transfer body 170 of the interface unit 4. In the peripheral exposure unit 171, the outer periphery of the wafer W is exposed. Thereafter, the wafer W is transferred to the delivery cassette 173 by the wafer transfer body 170, transferred to an exposure device (not shown) close to the interface unit 4, and exposed.

  The wafer W that has undergone the exposure process is returned to the delivery cassette 173, and is transferred by the wafer transfer body 170 to, for example, the heating / cooling unit 140 on the lower side of the first unit group I1 of the third block. The wafer W may be transferred to another heating / cooling unit 141, 150, 151 or the like that can transfer the wafer W to the development processing unit in which the next processing is performed. Further, the wafer W may be transferred to the heating / cooling unit of the third block B3 which is vacant at the time of transfer.

  For example, the wafer W transferred to the heating / cooling unit 140 is transferred from the cooling plate 60 to the heating plate 52 and subjected to post-exposure baking. The wafer W for which the post-exposure baking has been completed is returned to the cooling plate 60 and transferred to, for example, the development processing unit 100 of the first unit layer H1 of the second block B2 by the transfer device 80. The wafer W may be transferred to other development processing units 101 and 102 of the first unit layer H1. Further, the wafer W may be transferred to the development processing unit of the second block B2 that is vacant at the time of transfer.

  During transport, for example, when the positions of the heating / cooling unit 140 and the development processing unit 100 at the transport source are shifted, the heating / cooling unit 140 and the development processing unit 100 move relative to each other in the vertical and horizontal directions. Thus, the heating / cooling unit 140 and the development processing unit 100 are brought close to each other, and the wafer W is transferred by the transfer device 80.

  For example, the wafer W transferred to the development processing unit 100 is developed. The wafer W for which the development processing has been completed is transferred to, for example, the heating / cooling unit 120 on the lower side of the first unit group G1 of the first block B1. The wafer W is another unit accessible to the development processing unit 110, for example, the heating / cooling unit 21 on the lower side of the first unit group G1 or the heating / cooling unit 21 on the lower side of the second unit group G2. It may be conveyed to the cooling units 30, 31 and the like. Further, the wafer W may be transferred to the heating / cooling unit of the first block B1 that is vacant at the time of transfer.

  The transfer of the wafer W from the development processing unit 110 to the heating / cooling unit 20 is performed by the transfer device 80 of the heating / cooling unit 20. Further, when the positions of the heating / cooling unit 20 and the development processing unit 100 at the transfer destination are shifted, the heating / cooling unit 20 and the development processing unit 100 move relative to each other, and the heating / cooling unit 20 and the development unit 100 move. The processing units 100 are close to each other, and the wafer W is transferred by the transfer device 80.

  For example, the wafer W transferred to the heating / cooling unit 20 is transferred from the cooling plate 60 to the heating plate 52 and subjected to post-baking. The wafer W that has been post-baked is returned to the cooling plate 60 and returned to the cassette C by the wafer carrier 11 of the cassette station 2. Thus, a series of photolithography steps is completed.

  According to the above embodiment, the heat treatment units of the first block B1 and the third block B3 of the treatment station 3 can move in the vertical direction, and the liquid treatment unit of the second block B2 can move in the horizontal direction, Further, the heat treatment units of the first block B1 and the third block B3 are provided with a transfer device 80 for transferring the wafer W between the units of the second block B2. By doing so, the units of the first block B1 and the second block B2 and the units of the second block B2 and the third block B3 move relatively, and a large number of combinations of adjacent blocks. The wafer W can be transferred between the units. Therefore, a transfer path for the wafer W passing through various combinations of units is formed in the processing station 3. As a result, various transfer flows of the wafer W are realized in the substrate processing system 1, and it is possible to flexibly cope with various processing recipes of the wafer W. In addition, the conventional central transfer device is eliminated, and the transfer between the units is performed flexibly and smoothly, so that the processing time difference between the wafers W and the transfer waiting time difference of the wafers W are reduced, and the wafer processing is uniformized and throughput is reduced. Improvement is achieved. Furthermore, a large space for installing the central transfer device is not required, and the substrate processing system 1 can be reduced in size accordingly.

  Since the transfer device 80 is provided in the heat treatment unit of the first block B1 and the third block B3, the wafer W of the cassette station 2 is transferred to the first block B1, the second block B2, the third block B3, and It can be conveyed linearly in the order of the interface unit 4. Further, the wafer W can be transferred to the interface unit 4 after reciprocating the wafer W between the first block B1 and the second block B2 or between the second block B2 and the third block B3. . Similarly, when returning from the interface unit 4 to the cassette station 2, the wafer W can be transferred in the order of the third block B 3, the second block B 2, the first block B 1, and the cassette station 2. Further, the wafer W can be reciprocated between the third block B3 and the second block B2 and between the second block B2 and the first block B1, and then transferred to the cassette station 2.

  In the above embodiment, since the plurality of liquid processing units are arranged in the second block B2 in the horizontal direction so that the plurality of liquid processing units can be moved in the horizontal direction, the first and third blocks Each of the heat treatment units B1 and B3 can transfer the wafer W to the plurality of liquid processing units in the horizontal direction of the second block B2. In addition, each liquid processing unit in the second block B2 can transfer the wafer W to a plurality of groups of heat treatment units in the horizontal direction in the first and third blocks B1 and B3.

  In addition, since the plurality of heat treatment units of the first and third blocks B1 and B3 are stacked one above the other so as to be able to move up and down, each liquid treatment unit of the second block B2 has the first and third blocks. The wafer W can be transferred to a plurality of heat treatment units in the vertical direction of B1 and B3. Moreover, each heat processing unit of 1st and 3rd block B1, B3 can convey the wafer W with respect to the multi-layer liquid processing unit of the up-down direction of 2nd block B2.

  The liquid processing unit of the second block B2 described in the above embodiment can move horizontally, but may move further up and down. In such a case, for example, as shown in FIG. 9, the base 131 of the housing 130 of each unit layer H <b> 1 to H <b> 3 is held by the holding member 200 and attached to a guide 201 extending in the vertical direction. The base 131 of the housing 130 can be moved up and down along the guide 201 by the drive mechanism 202. Thereby, the liquid processing units of the unit layers H1 to H3 can move up and down, respectively. When the wafer W is transferred between the first block B1 and the second block B2 or between the second block B2 and the third block B3, as shown in FIG. In this manner, the liquid processing unit in the second block B2 is moved up and down. In this way, for example, more heat treatment units in the first and third blocks B1 and B3 can access the liquid treatment unit in the second block B2, and more wafer W transfer paths are formed. Is done.

  For example, in the above embodiment, the transfer device 80 is provided in the heat treatment units of the first block B1 and the third block B3. However, as shown in FIG. 11, the liquid processing unit of the second block B2 is provided. A conveying device 80 may be provided. In this case, it is not necessary to provide the transfer device 80 on the first block B1 and the third block B3 side. In such a case, the transfer of the wafer W between the first block B1 and the second block B2 and between the second block B2 and the third block B3 is performed by the transfer device 80 of the second block B2. It can be carried out.

  In addition, the conveying apparatus 80 may be provided in both the heat treatment unit of 1st block B1 and 3rd block B3, and the liquid processing unit of 2nd block B2. When the transport device 80 is provided in the liquid processing unit of the second block B2, the transport device 80 may not be provided in all the liquid processing units, and the transport device 80 may be provided only in a specific liquid processing unit. Similarly, with respect to the units of the first block B1 and the third block B3 described in the above embodiments, the transport device 80 may not be provided in all units, and the transport device is provided only for a specific unit. 80 may be provided.

  Further, a transfer function may be provided in the cooling plate 60 of the heat treatment unit so that the cooling plate 60 rotates and moves forward and backward with respect to the liquid processing unit of the second block B2 so that the liquid processing unit can be directly accessed.

  A partition plate 220 may be provided between adjacent blocks of the processing station 2 as shown in FIG. In such a case, the partition plate 220 has an air-cooled or water-cooled heat insulating structure. By doing so, the heat of the heat treatment units of the first and third blocks B1 and B3 does not adversely affect the liquid treatment unit of the second block B2. The partition plate 220 is provided with a wafer transfer port (not shown), and each wafer transfer port may be provided with a shutter.

  The preferred embodiment of the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to such an example. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the spirit described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  In the above embodiment, the two heat treatment units of the first and third blocks B1 and B3 are moved up and down as a set, but may be moved up and down for each heat treatment unit. Further, the liquid processing units of the respective layers of the second block B2 are moved horizontally as a unit for each housing 130, but may be moved horizontally for each liquid processing unit.

  The transfer path of the wafer W is not limited to that of the above embodiment. For example, when only the resist film is formed without forming the antireflection film on the upper layer of the resist film, after the wafer W is coated with the resist by the resist coating unit 20, the heating / cooling on the third block B3 side is performed. It may be transported to the unit and then transported to the interface unit 4 side as in the above embodiment.

  When an antireflection film is formed below the resist film, the wafer W is transferred from the cassette station 2 to the heating / cooling unit of the first block B1, and from the heating / cooling unit to the second block B2. It is conveyed to the bottom coating unit 121. The wafer W coated with the antireflection film in the bottom coating unit 121 is transferred to, for example, the heating / cooling unit of the first block B1, and then transferred to the resist coating unit of the second block B2 as in the above-described embodiment. Be transported. The wafer W that has undergone the resist coating process may be transferred to the top coating unit 110 of the second block B2, for example, via the heating / cooling unit of the first or third block B1, B3, May be transferred to the heating / cooling unit of the block B3 and transferred to the interface unit 4. Thus, the transfer path of the wafer W can be arbitrarily selected according to the processing recipe of the wafer W.

  Further, the transfer of the wafer W between the units in the first block B1 may be performed by the wafer transfer body 11 of the cassette station 2. For example, an unprocessed wafer W is transferred to the heating / cooling unit of the first block B1 by the wafer transfer body 11, and then the wafer W of the heating / cooling unit is transferred to the adhesion / cooling unit by the wafer transfer body 11. You may make it do. Further, the transfer of the wafer W between the units in the first block B3 may be performed by the wafer transfer body 170 of the interface unit 4.

  In the processing station 3 described in the above embodiment, only the processing unit for processing the wafer W is provided. However, the processing unit 3 that does not perform the processing of the wafer W, for example, performs the transfer of the wafer W. You may make it provide the alignment unit which aligns as needed.

  The processing station 3 described in the above embodiment is composed of three blocks B1 to B3, but the number can be arbitrarily selected. The number of unit groups of the first and third blocks B1 and B3 can be arbitrarily selected. Furthermore, the number of unit layers of the second block B2 can be arbitrarily selected.

  In each unit group of the first block B1 and the third block B3, six heat treatment units are stacked, but the number and type can be arbitrarily selected. In addition, although three liquid processing units are arranged in parallel in each unit layer of the second block B2, the number and type thereof can be arbitrarily selected.

  In the above embodiment, the heat treatment units of the first and third blocks B1, B3 move up and down, and the liquid treatment unit of the second block B2 moves horizontally, so that the first and third blocks B1, Although the relative movement between the heat treatment unit of B3 and the liquid processing unit of the second block B2 has been realized, the relative movement may be realized by other movements. For example, the heat treatment units of the first and third blocks B1 and B3 may move horizontally. Further, for example, a unit of a predetermined block may move in an oblique direction linearly with respect to the movement destination.

  In the above embodiment, the processing process for one wafer W has been described. However, in the substrate processing system 1, a plurality of wafers are processed continuously at the same time. At this time, in the unit layers H1 to H3 of the second block B2, even when the wafer W is being processed in one liquid processing unit, the housing 130 moves and the wafer with respect to the other liquid processing units is moved. W may be carried in and out. Further, in the first block B1 and the second block B2, when the processing of the wafer W is performed by one heat treatment unit of the heat treatment units in pairs, the entire heat treatment unit set. May move and transfer the wafer W to another heat treatment unit.

  In the above embodiment, a plurality of units are arranged in each block of the processing station 3. However, the arrangement of the plurality of units of the present invention is not limited thereto. In the above embodiment, the present invention is applied to the substrate processing system 1 that performs the photolithography process. However, other processing, for example, cleaning processing for cleaning the wafer W, film formation on the wafer W, and the like. You may apply to the processing system of the board | substrate which performs the film | membrane process, the etching process which etches the wafer W, the test | inspection process etc. which test | inspect the film thickness on the wafer W, a line width, a particle, or a defect. That is, the unit in the present invention may be a cleaning unit, a film forming unit, an etching unit, an inspection unit, or the like. The present invention can also be applied to other substrate processing systems such as an FPD (flat panel display) other than the wafer W and a mask reticle for a photomask.

  INDUSTRIAL APPLICABILITY The present invention is useful for flexibly responding to various processing recipes in a substrate processing system, reducing a processing time difference between substrates and a substrate transfer waiting time, and further saving space.

It is a top view which shows the outline of a structure of the processing system of the board | substrate of this invention. It is a side view which shows the outline of a structure of the processing system of the board | substrate of FIG. It is a rear view which shows the outline of a structure of the processing system of the board | substrate of FIG. It is a longitudinal cross-sectional view which shows the outline of a structure of a heating / cooling unit. It is a cross-sectional view which shows the outline of a structure of a heating / cooling unit. It is explanatory drawing which shows the moving mechanism of the heat processing unit of a 1st and 3rd block. It is explanatory drawing which shows the moving mechanism of the liquid processing unit of a 2nd block. It is explanatory drawing which shows the moving direction of the unit of a 1st-3rd block. It is explanatory drawing which shows the moving mechanism of the liquid processing unit of the 2nd block which can also move to an up-down direction. It is a side view of the board | substrate processing system provided with the liquid processing unit of the 2nd block which can move up and down. It is a top view of the processing system of the board | substrate provided with the conveying apparatus in the 2nd block. It is a top view which shows the structure of the processing system of the board | substrate provided with the partition plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing system 3 Processing station B1-B3 Block W Wafer

Claims (12)

A first unit and a second unit capable of accommodating a substrate;
A plurality of at least one of the first unit and the second unit are provided,
At least one of the first unit and the second unit includes a processing unit for processing a substrate,
At least one of the first unit and the second unit includes a transfer device that transfers a substrate between the first unit and the second unit,
A substrate processing system , wherein at least one of the first unit and the second unit moves and the substrate can be transferred by the transfer device . Either the first unit or the second unit is horizontally movable;
The substrate processing system according to claim 1, wherein either the first unit or the second unit is arranged in parallel in the horizontal direction . Either the first unit or the second unit is movable up and down ,
3. The substrate processing system according to claim 1, wherein either the first unit or the second unit is stacked in a vertical direction . 4. The first unit includes a heat treatment unit for heat treating the substrate,
The substrate processing system according to claim 1, wherein the second unit includes a liquid processing unit that performs liquid processing on the substrate. 5. The substrate processing system according to claim 4 , wherein the heat treatment unit includes a heating plate for heating the substrate, a cooling plate for cooling the substrate, and the transfer device . A plurality of the heat treatment units are provided,
6. The substrate processing system according to claim 5, wherein the plurality of heat treatment units include an adhesion processing unit for performing an adhesion processing of the substrate. A plurality or a single third unit capable of accommodating a substrate;
The third unit is for transferring a substrate to and from the second unit,
When the second unit includes the transfer device, at least one of the second unit and the third unit moves, and the second unit and the third unit are moved by the transfer device. Can carry the board between
When the second unit does not include the transfer device, the third unit includes another transfer device that transfers the substrate between the second unit and the third unit. At least one of the second unit and the third unit moves, and the substrate can be transferred between the second unit and the third unit by the other transfer device. The substrate processing system according to claim 1 . The substrate processing according to claim 7 , wherein when the second unit moves horizontally, either the second unit or the third unit is arranged in parallel in the horizontal direction. system. Wherein when the second unit is vertically moving is characterized in that one of said second unit or the third unit are stacked in the vertical direction, the processing of the substrate according to claim 7 system. The substrate processing system according to claim 7, wherein the third unit includes a heat treatment unit for performing heat treatment of the substrate. The substrate processing system according to claim 10, wherein the heat treatment unit of the third unit includes a heating plate for heating the substrate, a cooling plate for cooling the substrate, and the transfer device . A plurality of the heat treatment units are provided,
The substrate processing system according to claim 11, wherein the plurality of heat treatment units include an adhesion processing unit that performs an adhesion processing of the substrate.

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