JP4595378B2 - Resin processing method - Google Patents

Description

The present invention relates to how to process the resin is irradiated with a laser beam to the resin.

As a technique for processing the resin by irradiating a laser beam, those disclosed in Patent Documents 1 to 4 are known. In the resin processing technique disclosed in Patent Document 1, in order to process a resin having a high transmittance at a laser light wavelength, a metal material is pressed against the resin, and the metal material is irradiated with a laser beam so as to control the temperature of the metal material. Resin is processed by raising.
Japanese Patent Laid-Open No. 10-235489

  In the resin processing technique disclosed in Patent Document 1, it is necessary to select an appropriate metal material when performing processing, press the metal material against the resin and irradiate the laser beam, and thus the labor for processing increases. , Flexible processing is not possible.

The present invention has been made to solve the above problems, and an object thereof is to provide a resin finishing how that can be easily flexible resin processing.

In the resin processing method according to the present invention, each of the center wavelengths is irradiated with laser beams having a plurality of wavelengths different from each other by a wavelength width or more, and the first processing object and the second processing object, each of which is resin, are welded or bonded. And a resin processing method for welding or bonding a second processing object and a third processing object, each of which is a resin, including a first wavelength and a second wavelength as a plurality of wavelengths, Among the first to third processing targets, the transmittance of the processing target on the optical path of the laser light of the first wavelength until reaching the location where the first processing target and the second processing target are welded or bonded, The second up to the point where the second processing target and the third processing target are welded or bonded to each other in the second wavelength, which is larger than the transmittance of the other processing target and at the second wavelength. The transmittance of the processing target on the optical path of the laser beam of the wavelength is The first processing object and the second processing object are welded or bonded to each other by irradiating the laser beam having the first wavelength larger than the transmittance of the processing object, and the second wavelength laser beam is irradiated to irradiate the first processing object. The second processing object and the third processing object are welded or bonded together.

The resin processing method according to the present invention includes the first resin, the second resin, and the third resin as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength is set as a plurality of wavelengths. 1 wavelength and 2nd wavelength are included, the transmittance | permeability of 1st resin is larger than the transmittance | permeability of 2nd resin in 1st wavelength, and each transmission of 1st resin and 2nd resin than the transmittance | permeability of 3rd resin in 2nd wavelength The first resin transmits the first resin through the first resin and irradiates the second resin to weld the first resin and the second resin, and the second laser beam is applied to the first resin and the first resin. It is preferable to weld the second resin and the third resin by transmitting the second resin and irradiating the third resin.

The resin processing method according to the present invention includes a first resin, a second resin, a third resin, and a fourth resin as resins to be processed, and the fourth resin, the third resin, the first resin, and the second resin are in this order. Arranged, including a first wavelength and a second wavelength as a plurality of wavelengths, wherein the first resin, the third resin, and the fourth resin have higher transmittances than the second resin at the first wavelength, and at the second wavelength, The transmittance of the fourth resin is 15% or more, the first resin, the third resin, and the fourth resin are transmitted through the first resin, and the second resin is irradiated with the first resin, the second resin, It is preferable that the first resin and the fourth resin are bonded by the third resin by welding the third resin through the fourth resin through the fourth resin.

The resin processing method according to the present invention includes the first resin, the second resin, and the third resin as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength is set as a plurality of wavelengths. Including the first wavelength and the second wavelength, the transmittance of the first resin is greater than the transmittance of the second resin at the first wavelength, the transmittance of the third resin is greater than the transmittance of the second resin at the second wavelength, The first resin is transmitted through the first resin to irradiate the second resin to weld the first resin and the second resin, and the second resin is transmitted through the third resin with the second wavelength laser light. It is preferable that the second resin and the third resin are welded by irradiating the resin.

The resin processing method according to the present invention includes a first resin, a second resin, a third resin, and a fourth resin as resins to be processed, and the fourth resin, the third resin, the first resin, and the second resin are in this order. Arranged, including a first wavelength and a second wavelength as a plurality of wavelengths, the transmittance of the second resin is larger than the transmittance of the first resin at the first wavelength, and the transmittance of the fourth resin at the second wavelength is 15%. The first resin is transmitted through the second resin and irradiated to the first resin to weld the first resin and the second resin, and the second laser beam is transmitted through the fourth resin. It is preferable that the third resin is irradiated and the first resin and the fourth resin are bonded by the third resin.

  In the resin processing method according to the present invention, it is preferable that laser light having a plurality of wavelengths is guided by a bundle fiber and irradiated onto the resin.

  In the resin processing method according to the present invention, it is preferable to irradiate the resin simultaneously with a laser beam having at least two wavelengths out of a plurality of wavelengths.

  According to the present invention, flexible resin processing can be easily performed.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a configuration diagram of a resin processing apparatus 1 according to the present embodiment. The resin processing apparatus 1 shown in this figure includes light sources 11 and 12, lenses 21 and 22, a bundle fiber 30 and a lens 40, and processes the resin 50.

  The light source 11 outputs a laser beam L1 having a center wavelength λ1, and the light source 12 outputs a laser beam L2 having a center wavelength λ2. The center wavelength λ1 and the center wavelength λ2 are different from each other. When the wavelength width (full width at half maximum) of the laser light L1 output from the light source 11 is W1, and the wavelength width (full width at half maximum) of the laser light L2 output from the light source 12 is W2, the center wavelength λ1 and the center wavelength λ2 are They differ from each other by “W1 + W2” or more. Alternatively, the center wavelength λ1 and the center wavelength λ2 are different from each other by 100 nm or more. Each of the light sources 11 and 12 is preferably a semiconductor laser light source.

  The bundle fiber 30 is a bundle of a plurality of optical fibers. The laser beams L1 and L2 output from the light sources 11 and 12 are input to the first end face, guided, and output from the second end face. Lenses 21 and 22 are inserted between the first end face of the bundle fiber 30 and the light sources 11 and 12. The lens 21 condenses the laser light having the wavelength λ <b> 1 output from the light source 11 and makes it incident on the first end face of the bundle fiber 30. The lens 22 condenses the laser light having the wavelength λ <b> 2 output from the light source 12 and makes it incident on the first end face of the bundle fiber 30. A lens 40 is provided on the second end face side of the bundle fiber 30. The lens 40 collects the laser beams L1 and L2 emitted from the second end face of the bundle fiber 30 and irradiates the resin 50 with the condensed light.

  Next, the operation of the resin processing apparatus 1 according to the present embodiment will be described, and the resin processing method according to the present embodiment will be described. The laser light L1 having the wavelength λ1 output from the light source 11 is collected by the lens 21 and enters the first end face of the bundle fiber 30. The laser beam L2 having the wavelength λ2 output from the light source 12 is collected by the lens 22 and enters the first end face of the bundle fiber 30. The laser beams L1 and L2 incident on the first end face of the bundle fiber 30 are guided by the bundle fiber 30 and output from the second end face, and are collected by the lens 40 and applied to the resin 50. At this time, the two-wavelength laser beams may be irradiated to the resin 50 at different times, but it is preferable that the resin 50 is simultaneously irradiated for a certain time.

  In this way, the resin 50 is processed by being irradiated with laser beams having a plurality of wavelengths. By irradiating the resin 50 with laser beams having a plurality of wavelengths to process the resin 50, flexible resin processing can be easily performed. Here, the processing of the resin 50 is any of curing, heating, welding, drilling, excavation, and cutting. Further, one or two or more resins 50 to be processed are included. When the resin is irradiated with the laser beam, the bundle fiber 30 is used to facilitate the laser beam irradiation as in the present embodiment, but the bundle fiber is not necessarily used, and the laser beam is not transmitted through an appropriate optical system. The resin may be irradiated.

  Hereinafter, an embodiment in which any of curing, heating, welding, drilling, excavation, and cutting is performed as the resin processing will be described.

(First embodiment of resin processing method)
FIG. 2 is an explanatory diagram of a resin processing method according to the first embodiment. The resin processing method according to the first embodiment cures the resin 50 on the substrate 60 and uses a laser beam L1 having a wavelength λ1 and a laser beam L2 having a wavelength λ2. The resin 50 is irradiated with laser light L1 having a wavelength λ1 to increase the temperature of the resin 50, and the resin 50 is irradiated with laser light L2 having a wavelength λ2 to cure the resin 50. The laser beams L1 and L2 are applied to the entire resin 50. In addition, the temperature of the base material 60 may be raised by the laser beam L1, and the resin 50 may be indirectly heated.

  The laser beam L1 is for increasing the temperature of the resin 50 or the substrate 60. For example, the wavelength λ1 is any wavelength within the wavelength range of 800 nm to 1100 nm. The laser light L2 is for curing the resin 50, and for example, the wavelength λ2 is any wavelength of 500 nm or less. Thus, by raising the temperature of the resin 50 by the irradiation of the laser beam L1, the curing reaction of the resin 50 by the irradiation of the laser beam L2 is promoted, so that the curing can be completed in a short time, and the resin Deterioration can be reduced.

(Second Embodiment of Resin Processing Method)
FIG. 3 is an explanatory diagram of a resin processing method according to the second embodiment. The resin processing method according to the second embodiment is for drilling, excavating or cutting the resin 50, and uses a laser beam L1 having a wavelength λ1 and a laser beam L2 having a wavelength λ2. The resin 50 is irradiated with the laser beam L1 having the wavelength λ1 to increase the temperature of the resin 50, and the laser beam L2 having the wavelength λ2 is irradiated to the resin 50 to break the molecular bond of the resin 50.

  The laser beam L1 is applied to the entire resin 50. On the other hand, the laser beam L2 may be selectively applied to a processing position (or processing region) of the resin 50, the diameter of the laser beam L2 may be scanned, and the irradiation position on the resin 50 may be scanned. The resin 50 may be irradiated with the same beam shape.

  The laser beam L1 is for increasing the temperature of the resin 50. For example, the wavelength λ1 is any wavelength within the wavelength range of 800 nm to 1100 nm. The laser light L2 is used for drilling, excavating, or cutting the resin 50. For example, the wavelength λ2 is any wavelength of 500 nm or less.

  Thus, by raising the temperature of the resin 50 by irradiation with the laser light L1, the molecular bond cutting of the resin 50 by irradiation with the laser light L2 is promoted, so that the processing can be completed in a short time, Resin deterioration can be reduced, and the processing edge can be sharpened.

  Even when the transmittance of the resin 50 at the wavelength λ2 is 15% or more, the optimum processing can be performed due to the effect of promoting the molecular bond breakage due to the temperature rise.

(Third embodiment of resin processing method)
FIG. 4 is an explanatory diagram of a resin processing method according to the third embodiment. In the resin processing method according to the third embodiment, the resin 51 and the resin 52 are welded, and the laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used.

  The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 having the wavelength λ1 passes through the resin 51 and is irradiated onto the resin 52. Further, the transmittance of the resin 52 is larger than the transmittance of the resin 51 at the wavelength λ <b> 2, and the laser light L <b> 2 of the wavelength λ <b> 2 passes through the resin 52 and is irradiated to the resin 51. The transmittance of the resin 51 at the wavelength λ1 is preferably 15% or more, and the transmittance of the resin 52 at the wavelength λ2 is preferably 15% or more. The laser beams L1 and L2 are applied to the entire region where the resin 51 and the resin 52 are to be welded.

  As described above, the laser beam L1 is absorbed by the resin 52 and the laser beam L2 is absorbed by the resin 51, whereby the weld layer A is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 is welded, so uniform welding is possible.

(Fourth embodiment of resin processing method)
FIG. 5 is an explanatory diagram of a resin processing method according to the fourth embodiment. In the resin processing method according to the fourth embodiment, the resin 51 and the resin 52 are welded, and the resin 52 and the resin 53 are welded. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are welded. Is used. Resin 51, resin 52, and resin 53 are arranged in this order.

  The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 having the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that the resin 51 and the resin 52 are welded. Further, the transmittance of each of the resin 51 and the resin 52 is larger than that of the resin 53 at the wavelength λ2, and the laser light L2 having the wavelength λ2 passes through the resin 51 and the resin 52 and is irradiated to the resin 53. 53 is welded.

  As described above, the laser light L1 is absorbed by the resin 52, so that the welding layer A1 is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded. As L2 is absorbed by the resin 53, a welding layer A2 is formed between the resin 52 and the resin 53, and the resin 52 and the resin 53 are welded.

(Fifth embodiment of resin processing method)
FIG. 6 is an explanatory diagram of a resin processing method according to the fifth embodiment. In the resin processing method according to the fifth embodiment, the resin 51 and the resin 52 are welded and the resin 53 is cured, and the laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used. Resin 53, resin 51, and resin 52 are arranged in this order.

  The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that the welding layer A is formed between the resin 51 and the resin 52. The resin 51 and the resin 52 are welded. Further, the resin 53 is irradiated with the laser beam L2 having the wavelength λ2, and the resin 53 is cured. Thus, welding and hardening are performed simultaneously.

(Sixth embodiment of resin processing method)
FIG. 7 is an explanatory diagram of a resin processing method according to the sixth embodiment. In the resin processing method according to the sixth embodiment, the resin 51 and the resin 52 are welded, and the resin 51 and the resin 54 are bonded to each other. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are bonded. Is used. Resin 54, resin 53, resin 51, and resin 52 are arranged in this order.

  The transmittance of each of the resin 51, the resin 53, and the resin 54 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 54, the resin 53, and the resin 51 and is irradiated to the resin 52. The welding layer A is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded. Further, the transmittance of the resin 54 at the wavelength λ 2 is 15% or more, and the laser light L 2 of the wavelength λ 2 passes through the resin 54 and is irradiated to the resin 53, and the resin 51 and the resin 54 are bonded by the resin 53. . Thus, welding and adhesion are performed simultaneously.

(Seventh embodiment of resin processing method)
FIG. 8 is an explanatory diagram of a resin processing method according to the seventh embodiment. In the resin processing method according to the seventh embodiment, the resin 51 and the resin 52 are welded, and the resin 51 is excavated, cut, or perforated. The laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used. Is used.

  The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that a weld layer A is formed between the resin 51 and the resin 52. Then, the resin 51 and the resin 52 are welded. In addition, the laser beam L2 having the wavelength λ2 is applied to the resin 51, and the resin 51 is excavated, cut, or perforated.

The laser beam L2 may be selectively irradiated to a processing position (or processing region) of the resin 51 to have a small beam diameter, and the irradiation position on the resin 51 may be scanned, or the same as the processing region shape. The resin 51 may be irradiated with a beam shape.
In this way, welding and excavation are performed simultaneously.

(Eighth embodiment of resin processing method)
FIG. 9 is an explanatory diagram of a resin processing method according to the eighth embodiment. In the resin processing method according to the eighth embodiment, the resin 51 and the resin 52 are welded, and the laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used.

  The transmittance of the resin 51 is greater than the transmittance of the resin 52 at each of the wavelengths λ1 and λ2. The laser beam L1 having the wavelength λ1 passes through the resin 51 and is applied to the resin 52, and the resin 52 is preheated. In addition, the laser beam L2 having the wavelength λ2 passes through the resin 51 and is irradiated onto the resin 52, and the resin 52 is heated. Thereby, the welding layer A is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded.

(Ninth embodiment of resin processing method)
FIG. 10 is an explanatory diagram of a resin processing method according to the ninth embodiment. The resin processing method according to the ninth embodiment heats the resin 50 on the substrate 60, and uses a laser beam L1 having a wavelength λ1 and a laser beam L2 having a wavelength λ2. Alternatively, the substrate 60 is heated and the resin 50 is indirectly heated. The resin 50 is preheated by the laser beam L1 having the wavelength λ1, and the resin 50 is fully heated by the laser beam L2 having the wavelength λ2. Thus, since preheating and main heating can be performed simultaneously, heating time can be shortened and resin degradation can be reduced.

(10th Embodiment of Resin Processing Method)
FIG. 11 is an explanatory diagram of a resin processing method according to the tenth embodiment. In the resin processing method according to the tenth embodiment, the resin 51 and the resin 52 are welded, and the resin 52 and the resin 53 are welded. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are welded. Is used. Resin 51, resin 52, and resin 53 are arranged in this order.

  The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 having the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that the resin 51 and the resin 52 are welded. Further, the transmittance of the resin 53 is larger than that of the resin 52 at the wavelength λ2, and the laser light L2 having the wavelength λ2 passes through the resin 53 and is irradiated to the resin 52, so that the resin 52 and the resin 53 are welded.

  As described above, the laser light L1 is absorbed by the resin 52, so that the welding layer A1 is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded. As L2 is absorbed by the resin 52, a welding layer A2 is formed between the resin 52 and the resin 53, and the resin 52 and the resin 53 are welded.

(Eleventh Embodiment of Resin Processing Method)
FIG. 12 is an explanatory diagram of a resin processing method according to the eleventh embodiment. In the resin processing method according to the eleventh embodiment, the resin 51 and the resin 52 are welded, and the resin 51 and the resin 54 are bonded to each other. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are bonded. Is used. Resin 54, resin 53, resin 51, and resin 52 are arranged in this order.

  The transmittance of the resin 52 is larger than the transmittance of the resin 51 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 52 and is irradiated to the resin 51, so that the welding layer A is formed between the resin 51 and the resin 52. The resin 51 and the resin 52 are welded. Further, the transmittance of the resin 54 at the wavelength λ 2 is 15% or more, and the laser light L 2 of the wavelength λ 2 passes through the resin 54 and is irradiated to the resin 53, and the resin 51 and the resin 54 are bonded by the resin 53. . Thus, welding and adhesion are performed simultaneously.

It is a block diagram of the resin processing apparatus 1 which concerns on this embodiment. It is explanatory drawing of the resin processing method which concerns on 1st Embodiment. It is explanatory drawing of the resin processing method which concerns on 2nd Embodiment. It is explanatory drawing of the resin processing method which concerns on 3rd Embodiment. It is explanatory drawing of the resin processing method which concerns on 4th Embodiment. It is explanatory drawing of the resin processing method which concerns on 5th Embodiment. It is explanatory drawing of the resin processing method which concerns on 6th Embodiment. It is explanatory drawing of the resin processing method which concerns on 7th Embodiment. It is explanatory drawing of the resin processing method which concerns on 8th Embodiment. It is explanatory drawing of the resin processing method which concerns on 9th Embodiment. It is explanatory drawing of the resin processing method which concerns on 10th Embodiment. It is explanatory drawing of the resin processing method which concerns on 11th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Resin processing apparatus, 11, 12 ... Light source, 21, 22 ... Lens, 30 ... Bundle fiber, 40 ... Lens, 50-54 ... Resin.

Claims (7)

Each of the central wavelengths is irradiated with laser beams having a plurality of wavelengths different from each other by a wavelength width or more, and the first processing object and the second processing object, each of which is a resin, are welded or bonded to each other, and the second each of which is a resin. A resin processing method for welding or bonding the processing object and the third processing object ,
Including a first wavelength and a second wavelength as the plurality of wavelengths;
Laser light of the first wavelength from the first to third processing objects up to the position where the first processing object and the second processing object are welded or bonded at the first wavelength. The transmittance of the processing object on the optical path of is larger than the transmittance of other processing objects,
Laser light of the second wavelength from the first to third processing objects up to the position where the second processing object and the third processing object are welded or bonded at the second wavelength. The transmittance of the processing object on the optical path of is larger than the transmittance of other processing objects,
The first processing object and the second processing object are welded or bonded by irradiating the laser light of the first wavelength,
Welding or bonding the second processing object and the third processing object by irradiating the laser light of the second wavelength;
The resin processing method characterized by the above-mentioned. The first resin, the second resin, and the third resin are included as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength and the second resin are the plurality of wavelengths. Including two wavelengths, the transmittance of the first resin is greater than the transmittance of the second resin at the first wavelength, and the first resin and the second resin are greater than the transmittance of the third resin at the second wavelength. Each transmittance is large,
The first resin is transmitted through the first resin and irradiated to the second resin to weld the first resin and the second resin;
Irradiating the third resin with the second wavelength laser light transmitted through the first resin and the second resin to weld the second resin and the third resin;
The resin processing method according to claim 1 . The resin to be processed includes a first resin, a second resin, a third resin, and a fourth resin, and the fourth resin, the third resin, the first resin, and the second resin are arranged in this order, The plurality of wavelengths includes a first wavelength and a second wavelength, and each of the first resin, the third resin, and the fourth resin has a transmittance greater than the transmittance of the second resin at the first wavelength. The transmittance of the fourth resin at 15 wavelengths is 15% or more,
The first resin, the third resin and the fourth resin are transmitted through the first resin, the second resin is irradiated to the second resin, and the first resin and the second resin are welded.
Irradiating the third resin with the laser light of the second wavelength through the fourth resin, and bonding the first resin and the fourth resin by the third resin;
The resin processing method according to claim 1 . The first resin, the second resin, and the third resin are included as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength and the second resin are the plurality of wavelengths. Including two wavelengths, the transmittance of the first resin is greater than the transmittance of the second resin at the first wavelength, and the transmittance of the third resin is greater than the transmittance of the second resin at the second wavelength. ,
The first resin is transmitted through the first resin and irradiated to the second resin to weld the first resin and the second resin;
Irradiating the second resin with laser light of the second wavelength through the third resin to weld the second resin and the third resin;
The resin processing method according to claim 1 . The resin to be processed includes a first resin, a second resin, a third resin, and a fourth resin, and the fourth resin, the third resin, the first resin, and the second resin are arranged in this order, The first wavelength and the second wavelength are included as a plurality of wavelengths, the transmittance of the second resin is larger than the transmittance of the first resin at the first wavelength, and the transmittance of the fourth resin at the second wavelength. 15% or more,
The first resin is transmitted through the second resin and irradiated to the first resin to weld the first resin and the second resin;
Irradiating the third resin with the laser light of the second wavelength through the fourth resin, and bonding the first resin and the fourth resin by the third resin;
The resin processing method according to claim 1 . Resin processing method according to claim 1, wherein the irradiating the resin with guided by a bundle fiber laser beam of the plurality of wavelengths. Resin processing method according to claim 1, wherein applying the laser beam of the at least two wavelengths simultaneously the resin over a period of time of the laser beam of the plurality of wavelengths.

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