JP4290918B2 - Photocurable composition and plasma display panel formed with black pattern using the same - Google Patents
Photocurable composition and plasma display panel formed with black pattern using the same Download PDFInfo
- Publication number
- JP4290918B2 JP4290918B2 JP2002038277A JP2002038277A JP4290918B2 JP 4290918 B2 JP4290918 B2 JP 4290918B2 JP 2002038277 A JP2002038277 A JP 2002038277A JP 2002038277 A JP2002038277 A JP 2002038277A JP 4290918 B2 JP4290918 B2 JP 4290918B2
- Authority
- JP
- Japan
- Prior art keywords
- black
- photocurable composition
- composition
- acid
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 claims description 38
- 239000011230 binding agent Substances 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 21
- 239000002002 slurry Substances 0.000 claims description 15
- 239000000178 monomer Substances 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 13
- 150000007524 organic acids Chemical class 0.000 claims description 9
- VJFCXDHFYISGTE-UHFFFAOYSA-N O=[Co](=O)=O Chemical compound O=[Co](=O)=O VJFCXDHFYISGTE-UHFFFAOYSA-N 0.000 claims description 8
- 239000010419 fine particle Substances 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 42
- 239000010408 film Substances 0.000 description 35
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 27
- 239000011521 glass Substances 0.000 description 24
- 239000000049 pigment Substances 0.000 description 24
- 238000011161 development Methods 0.000 description 17
- 230000018109 developmental process Effects 0.000 description 17
- 238000010304 firing Methods 0.000 description 16
- 239000000843 powder Substances 0.000 description 16
- -1 phosphate ester Chemical class 0.000 description 15
- 238000003860 storage Methods 0.000 description 13
- 229910017052 cobalt Inorganic materials 0.000 description 11
- 239000010941 cobalt Substances 0.000 description 11
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 150000008065 acid anhydrides Chemical class 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 239000010452 phosphate Substances 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000012719 thermal polymerization Methods 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000004135 Bone phosphate Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SNZYOYGFWBZAQY-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methyloxirane Chemical compound CC1CO1.CCC(CO)(CO)CO SNZYOYGFWBZAQY-UHFFFAOYSA-N 0.000 description 1
- RSROEZYGRKHVMN-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.CCC(CO)(CO)CO RSROEZYGRKHVMN-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ASUIPYBNVVERJG-UHFFFAOYSA-N CCC1=CC=CC(O[PH2]=O)=C1C(=O)C1=C(C)C=C(C)C=C1C Chemical compound CCC1=CC=CC(O[PH2]=O)=C1C(=O)C1=C(C)C=C(C)C=C1C ASUIPYBNVVERJG-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- VNACESCBYXLGBN-UHFFFAOYSA-N acetic acid;1-methoxypropan-2-yl acetate Chemical class CC(O)=O.COCC(C)OC(C)=O VNACESCBYXLGBN-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- QPOIJJUKCPCQIV-UHFFFAOYSA-N diphenylmethanone Chemical class C=1C=CC=CC=1C(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 QPOIJJUKCPCQIV-UHFFFAOYSA-N 0.000 description 1
- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- MOWNZPNSYMGTMD-UHFFFAOYSA-N oxidoboron Chemical class O=[B] MOWNZPNSYMGTMD-UHFFFAOYSA-N 0.000 description 1
- LXTZRIBXKVRLOA-UHFFFAOYSA-N padimate a Chemical compound CCCCCOC(=O)C1=CC=C(N(C)C)C=C1 LXTZRIBXKVRLOA-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229930000044 secondary metabolite Natural products 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 1
- XSIXARXPTLGAOD-UHFFFAOYSA-M tetrasodium;hydroxide Chemical compound [OH-].[Na+].[Na+].[Na+].[Na+] XSIXARXPTLGAOD-UHFFFAOYSA-M 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G3/00—Scaffolds essentially supported by building constructions, e.g. adjustable in height
- E04G3/28—Mobile scaffolds; Scaffolds with mobile platforms
- E04G3/30—Mobile scaffolds; Scaffolds with mobile platforms suspended by flexible supporting elements, e.g. cables
- E04G3/305—Mobile scaffolds; Scaffolds with mobile platforms suspended by flexible supporting elements, e.g. cables specially adapted for tanks, silos or similar vessels
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G23/00—Working measures on existing buildings
- E04G23/02—Repairing, e.g. filling cracks; Restoring; Altering; Enlarging
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G3/00—Scaffolds essentially supported by building constructions, e.g. adjustable in height
- E04G3/28—Mobile scaffolds; Scaffolds with mobile platforms
- E04G2003/286—Mobile scaffolds; Scaffolds with mobile platforms mobile vertically
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials For Photolithography (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、プラズマディスプレイパネル(以下、PDPと略称する)の前面基板に精細な電極回路、ブラックパターンを形成するのに有用なアルカリ現像型でかつ光硬化型の組成物、及びそれを用いて白黒二層構造を有するバス電極の下層(黒層)、ブラックマトリックスを形成した前面基板を備えるPDPに関するものである。
【0002】
【従来の技術】
PDPはプラズマ放電による発光を利用して映像や情報の表示を行う平面ディスプレイであり、パネル構造、駆動方法によってDC型とAC型に分類される。PDPによるカラー表示の原理は、リブ(隔壁)によって離間された前面ガラス基板と背面ガラス基板に形成された対向する両電極間のセル空間(放電空間)内でプラズマ放電を生じさせ、各セル空間内に封入されているHe、Xe等のガスの放電により発生する紫外線で背面ガラス基板内面に形成された蛍光体を励起し、3原色の可視光を発生させるものである。各セル空間は、DC型PDPにおいては格子状のリブにより区画され、一方、AC型PDPにおいては基板面に平行に列設されたリブにより区画されるが、いずれにおいてもセル空間の区画は、リブによりなされている。以下、添付図面を参照しながら簡単に説明する。
【0003】
図1は、フルカラー表示の3電極構造の面放電方式PDPの構造例を部分的に示している。前面ガラス基板1の下面には、放電のための透明電極3a又は3bと該透明電極のライン抵抗を下げるためのバス電極4a又は4bとから成る一対の表示電極2a、2bが所定のピッチで多数列設されている。これらの表示電極2a、2bの上には、電荷を蓄積するための透明誘電体層5(低融点ガラス)が印刷、焼成によって形成され、その上に保護層(MgO)6が蒸着されている。保護層6は、表示電極の保護、放電状態の維持等の役割を有している。一方、背面ガラス基板11の上には、放電空間を区画するストライプ状のリブ(隔壁)12と各放電空間内に配されたアドレス電極(データ電極)13が所定のピッチで多数列設されている。また、各放電空間の内面には、赤(14a)、青(14b)、緑(14c)の3色の蛍光体膜が規則的に配され、フルカラー表示においては、前記のように赤、青、緑の3原色の蛍光体膜14a、14b、14cで1つの画素が構成される。
さらに、放電空間を形成する一対の表示電極2a、2bの両側部には、画像のコントラストをさらに高めるために、同様にストライプ状のブラックマトリックス10が形成されている。
なお、上記構造のPDPでは、一対の表示電極2a、2bの間に交流のパルス電圧を印加し、同一基板上の電極間で放電させるので、「面放電方式」と呼ばれている。
また、上記構造のPDPでは、放電により発生した紫外線は背面基板11の蛍光体膜14a、14b、14cを励起し、発生した可視光を前面基板1の透明電極3a、3bを透かして見る構造となっている。
【0004】
このような構造のPDPにおいて、前記バス電極4a、4bの形成は、従来、Cr−Cu−Crの3層を蒸着やスパッタリングにより成膜した後、フォトリソグラフィー法でパターニングが行なわれてきた。
しかし、工程数が多く高コストとなるため、最近では、銀ペースト等の導電性ペーストをスクリーン印刷した後、焼成する方法、あるいは150μm以下の線幅とするためには、感光性導電性ペーストを塗布し、パターンマスクを通して露光した後、現像し、次いで焼成する方法が行なわれている。
【0005】
このようにしてバス電極4a、4bが形成されるPDPの前面基板においては、近年、画面のコントラストを向上させるために、バス電極を形成する際に、表示側となる下層(透明電極3a、3bと接触する層)に黒色ペーストの黒層を印刷し、その上に導電性の銀ペーストの白層を印刷して、白黒二層構造の電極を形成することが行なわれている。この場合、黒色ペーストとしては、銅―鉄系、銅―クロム系等の黒色複合酸化物、四三酸化コバルトなどの耐熱性黒色顔料を配合した樹脂組成物が用いられている。
【0006】
また、前記ブラックマトリックスの形成は、従来、CRTディスプレイや液晶ディスプレイパネル等のブラックマトリックスの形成に使用されている遮光膜形成用感光性樹脂組成物を転用することが試みられてきた。
しかし、PDPの製造においては高温焼成工程があり、この工程で遮光膜形成用感光性樹脂組成物中に含有されるカーボンブラックが分解し、満足できるブラックマトリックスの形成は困難であった。
そこで、光重合性組成物、光重合開始剤及び遮光性材料を含有する遮光膜形成用感光性樹脂組成物においても、上記遮光性材料として、銅−鉄系、銅−クロム系等の黒色複合酸化物、四三酸化コバルトなどの耐熱性黒色顔料を配合した樹脂組成物が用いられている。
【0007】
しかしながら、銅―鉄系、銅―クロム系等の黒色複合酸化物、四三酸化コバルトなどの耐熱性黒色顔料を配合した樹脂組成物は、ペーストとしての保存安定性が悪く、特に光重合性モノマー及び光重合開始剤と共に配合して光硬化性組成物に構成した場合、光重合性モノマーの重合が開始してゲル化してしまう。そのため、かかる樹脂組成物は低温で保管する必要があり、またゲル化や流動性の低下により塗布作業性が悪く量産性に対応できないという問題があった。
【0008】
また、高精細なパターン形成の要求に伴い、耐熱性黒色顔料は、その粒径を小径化する必要があった。しかしながら、耐熱性黒色顔料は、その粒径を小さくすると、ペースト中での分散時に二次凝集を招きやすくなり、ひいては塗膜層に突起として存在しライン形状の欠陥を招くといった問題を引き起こす。
【0009】
【発明が解決しようとする課題】
そこで本発明は、このような従来技術が抱える課題を解決するためになされたものであり、その主たる目的は、耐熱性黒色顔料の二次凝集を招くことなくペースト化でき、しかも保存安定性に優れ、乾燥、露光、現像、焼成の各工程においては、基板に対する優れた密着性、解像性、焼成性を損なうことがなく、焼成後においても充分な黒さを有する焼成皮膜を形成できる光硬化性組成物を提供することにある。
本発明の他の目的は、このような光硬化性組成物から高精細の黒色パターン、特に前面基板に形成される白黒二層構造のバス電極において充分な層間導電性(透明電極とバス電極白層との層間導通)と黒さを同時に満足し得る黒層(下層)電極回路、ならびにブラックマトリックスを形成したPDPを提供することにある。
【0010】
【課題を解決するための手段】
前記目的を達成するために、本発明の光硬化性組成物の基本的な態様は、白黒二層構造のバス電極を構成する黒色層用光硬化性組成物であって、(A)最大粒径が5μm以下の四三酸化コバルト黒色微粒子が溶剤に分散してなるスラリー、(B)有機バインダー、(C)光重合性モノマー、(D)光重合開始剤、(E)有機酸、および(F)重合禁止剤を含有することを特徴としている。
このような本発明の光硬化性組成物は、ペースト状形態であってもよく、また予めフィルム状に製膜したドライフィルムの形態であってもよい。
さらに本発明によれば、このような光硬化性組成物の焼成物から前面基板の電極回路(黒層)が形成されてなるPDPが提供される。
【0011】
【発明の実施の形態】
発明者らは、前記目的の実現に向け鋭意研究した結果、最大粒径が5μm以下の耐熱性黒色顔料を溶剤に均一に分散したスラリーを用いた点に特徴がある。 これにより、本発明の光硬化性組成物は、容易に二次凝集物のないペーストとすることができる。その結果、高精細の電極回路、ならびにブラックマトリックスを形成したPDPを提供することができる。
【0012】
一方、耐熱性黒色顔料などのフィラーを含む光硬化性組成物は、安定剤なしでは室温で増粘してしまうという欠点があった。そのため、光重合性モノマーの重合や耐熱性黒色顔料と有機バインダー中のカルボキシル基との反応に起因すると思われる光硬化性組成物のゲル化を抑制するために、従来から安定剤としてリン酸エステルが用いられている。しかしながら、本発明の光硬化性組成物では、リン酸エステルを安定剤として用いると、スラリー中の耐熱性黒色顔料の沈降を招き、粉体凝集を引き起こし易く、却ってペーストの保存安定性に悪影響を及ぼすという問題があった。
これに対し、本発明者らはさらに研究を重ねた結果、安定剤として有機酸、好ましくは有機酸と熱重合禁止剤を配合することで室温においても保存安定性に極めて優れ、量産性にも充分対応可能な光硬化性組成物を提供し得ることを見出した。
【0013】
また本発明の光硬化性組成物によれば、前記耐熱性黒色顔料として四三酸化コバルト黒色微粒子を用いると、形成される黒色皮膜が緻密なものとなり、薄膜でも充分な黒さを呈することができ、その結果、乾燥、露光、現像、焼成の各工程において基板に対する優れた密着性、解像性、焼成性を損なうことなく、焼成後において充分な層間導電性(透明電極とバス電極白層との層間導通)及び黒さを同時に満足し得るパターンを得ることができる。
【0014】
従って、このような光硬化性組成物をPDP前面基板に形成される白黒二層構造のバス電極の黒層材料として用いれば、バス電極は、黒層がITOやネサなどの透明電極と白層の間に挟持されたサンドイッチ構造を有するため、透明電極と白層との層間導通、並びに画面側から見たときの黒さを共に充分満足させることができるようになる。
しかも、本発明の光硬化性組成物は、前記したように保存安定性に優れ、かつ、薄い膜厚で充分なコントラストが得られることから、PDPの量産性、低コスト化にとって極めて有用なものである。
【0015】
以下、本発明の光硬化性組成物について具体的に説明する。
まず、最大粒径が5μm以下の耐熱性黒色顔料を溶剤に均一に分散したスラリー(A)は、従来公知の方法に従って溶剤中に耐熱性黒色顔料を均一に分散させることによって調製することができる。例えば、溶剤と分散剤と耐熱性黒色顔料をボールミル等の混合機を用いて十分に混合分散させ調製する。
【0016】
ここで、耐熱性黒色顔料としては、PDPの基板作製工程においては500〜600℃という高温焼成を伴うため、高温での色調安定性を有する無機顔料を用いることができる。具体的には、Cr、Co、Cu、Ni、Fe、Mnなどの酸化物及び複合酸化物などがあるが、これらに限定されるものではなく、これらを単独で又は2種以上を組合わせて用いることができる。特に本発明では、銅−クロム系黒色複合酸化物、銅−鉄系黒色複合酸化物、四三酸化コバルトなどが、焼成後に形成される黒色皮膜が緻密なものとなり、かつ色調に優れることから、好適に用いられる。
【0017】
この耐熱性黒色顔料は、平均粒径が2μm以下、好ましくは0.01μm以上1μm以下の微粒子を用いることが望ましい。この理由は、平均粒径が2μm以下とすると、少量の添加でも密着性等を損なうことなく緻密な焼成皮膜を形成でき、充分な層間導電性(透明電極とバス電極白層との層間導通)及び黒さを同時に満足し得る下層(黒層)電極用の樹脂組成物を提供することができるからである。一方、耐熱性黒色顔料の平均粒径が2μmよりも大きくなると、焼成皮膜の緻密性が悪くなり、形成される下層電極膜の黒色度が低下し易い。また、0.01μmより小さくなると隠ぺい力が低下し透明感が現れることがあり、適当ではない。
【0018】
また、耐熱性黒色顔料は、比表面積が1.0〜20m2/gの範囲にある四三酸化コバルト微粒子を用いることが好ましい。この理由は、その比表面積が1.0m2/g未満では、露光による回路パターン形成の精度が低下し、ラインエッジの直線性、あるいは充分な黒さの焼成皮膜が得られ難くなるためである。一方、20m2/gを超えると、粒子の表面積が大きくなり過ぎて現像の際にアンダーカットを生じやすくなる。
【0019】
このスラリー中の耐熱性黒色顔料の配合量は、有機バインダー(B)100質量部当り1〜100質量部、好ましくは5〜50質量部の範囲となるように調整するのが適当である。この理由は、耐熱性黒色顔料の配合量が上記範囲よりも少ないと、焼成後に充分な黒さが得られず、一方、上記範囲を超える配合量では、光の透過性が劣化して解像性が低下する他に、コスト高となり好ましくないからである。
【0020】
前記スラリーに用いる溶剤は、任意に選択できるが、ソルベントショックを防ぐためにペースト中に用いられる溶剤と種類を同一にしたほうが望ましい。また、スラリーの濃度は任意に選択できるが、作業性などを考慮すると50〜80%が好ましい。
【0021】
また、前記スラリーに用いる分散剤は、耐熱性黒色顔料を均一に分散できるものであれば特に限定されるものではなく、例えば、日本油脂製マリアリムシリーズなどの高分子分散剤が挙げられる。
【0022】
次に、前記有機バインダー(B)としては、カルボキシル基を有する樹脂、具体的にはそれ自体がエチレン性不飽和二重結合を有するカルボキシル基含有感光性樹脂及びエチレン性不飽和二重結合を有さないカルボキシル基含有樹脂のいずれも使用可能である。好適に使用できる樹脂(オリゴマー及びポリマーのいずれでもよい)としては、以下のようなものが挙げられる。
(1)(a)不飽和カルボン酸と(b)不飽和二重結合を有する化合物を共重合させることによって得られるカルボキシル基含有樹脂
(2)(a)不飽和カルボン酸と(b)不飽和二重結合を有する化合物の共重合体にエチレン性不飽和基をペンダントとして付加させることによって得られるカルボキシル基含有感光性樹脂
(3)(c)エポキシ基と不飽和二重結合を有する化合物と(b)不飽和二重結合を有する化合物の共重合体に、(a)不飽和カルボン酸を反応させ、生成した2級の水酸基に(d)多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂
(4)(e)不飽和二重結合を有する酸無水物と(b)不飽和二重結合を有する化合物の共重合体に、(f)水酸基と不飽和二重結合を有する化合物を反応させて得られるカルボキシル基含有感光性樹脂
(5)(g)エポキシ化合物と(h)不飽和モノカルボン酸を反応させ、生成した2級の水酸基に(d)多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂
(6)(b)不飽和二重結合を有する化合物とグリシジル(メタ)アクリレートの共重合体のエポキシ基に、(i)1分子中に1つのカルボキシル基を有し、エチレン性不飽和結合を持たない有機酸を反応させ、生成した2級の水酸基に(d)多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂
(7)(j)水酸基含有ポリマーに(d)多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂
(8)(j)水酸基含有ポリマーに(d)多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂に、(c)エポキシ基と不飽和二重結合を有する化合物をさらに反応させて得られるカルボキシル基含有感光性樹脂
【0023】
前記したようなカルボキシル基含有感光性樹脂及びカルボキシル基含有樹脂は、単独で又は混合して用いてもよいが、いずれの場合でもこれらは合計で組成物全量の10〜80質量%の割合で配合することが好ましい。これらのポリマーの配合量が上記範囲よりも少な過ぎる場合、形成する皮膜中の上記樹脂の分布が不均一になり易く、充分な光硬化性及び光硬化深度が得られ難く、選択的露光、現像によるパターニングが困難となる。一方、上記範囲よりも多過ぎると、焼成時のパターンのよれや線幅収縮を生じ易くなるので好ましくない。
【0024】
また、上記カルボキシル基含有感光性樹脂及びカルボキシル基含有樹脂としては、それぞれ重量平均分子量1,000〜100,000、好ましくは5,000〜70,000、及び酸価50〜250mgKOH/g、かつ、カルボキシル基含有感光性樹脂の場合、その二重結合当量が350〜2,000、好ましくは400〜1,500のものを好適に用いることができる。上記樹脂の分子量が1,000より低い場合、現像時の皮膜の密着性に悪影響を与え、一方、100,000よりも高い場合、現像不良を生じ易いので好ましくない。また、酸価が50mgKOH/gより低い場合、アルカリ水溶液に対する溶解性が不充分で現像不良を生じ易く、一方、250mgKOH/gより高い場合、現像時に皮膜の密着性の劣化や光硬化部(露光部)の溶解が生じるので好ましくない。さらに、カルボキシル基含有感光性樹脂の場合、感光性樹脂の二重結合当量が350よりも小さいと、焼成時に残渣が残り易くなり、一方、2,000よりも大きいと、現像時の作業余裕度が狭く、また光硬化時に高露光量を必要とするので好ましくない。
【0025】
次に、本発明の光硬化性組成物における光重合性モノマー(C)は、組成物の光硬化性の促進及び現像性を向上させるために用いる。この光重合性モノマー(C)としては、例えば、2−ヒドロキシエチルアクリレート,2−ヒドロキシプロピルアクリレート、ジエチレングリコールジアクリレート、トリエチレングリコールジアクリレート、ポリエチレングリコールジアクリレート、ポリウレタンジアクリレート、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、トリメチロールプロパンエチレンオキサイド変性トリアクリレート、トリメチロールプロパンプロピレンオキサイド変性トリアクリレート、ジペンタエリスリトールペンタアクリレート、ジペンタエリスリトールヘキサアクリレート及び上記アクリレートに対応する各メタクリレート類;フタル酸、アジピン酸、マレイン酸、イタコン酸、こはく酸、トリメリット酸、テレフタル酸等の多塩基酸とヒドロキシアルキル(メタ)アクリレートとのモノ−、ジ−、トリ−又はそれ以上のポリエステルなどが挙げられるが、特定のものに限定されるものではなく、またこれらを単独で又は2種以上を組み合わせて用いることができる。これらの光重合性モノマーの中でも、1分子中に2個以上のアクリロイル基又はメタクリロイル基を有する多官能モノマーが好ましい。
【0026】
このような光重合性モノマー(C)の配合量は、前記有機バインダー(カルボキシル基含有感光性樹脂及び/又はカルボキシル基含有樹脂)(B)100質量部当り20〜100質量部が適当である。光重合性モノマー(C)の配合量が上記範囲よりも少ない場合、組成物の充分な光硬化性が得られ難くなり、一方、上記範囲を超えて多量になると、皮膜の深部に比べて表面部の光硬化が早くなるため硬化むらを生じ易くなる。
【0027】
次に、本発明の光硬化性組成物における光重合開始剤(D)としては、例えば、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル等のベンゾインとベンゾインアルキルエーテル類;アセトフェノン、2,2−ジメトキシー2−フェニルアセトフェノン、2,2−ジエトキシー2−フェニルアセトフェノン、1,1−ジクロロアセトフェノン等のアセトフェノン類;2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパン−1−オン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1等のアミノアセトフェノン類;2−メチルアントラキノン、2−エチルアントラキノン、2−t−ブチルアントラキノン、1−クロロアントラキノン等のアントラキノン類;2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2−クロロチオキサントン、2,4−ジイソプロピルチオキサントン等のチオキサントン類;アセトフェノンジメチルケタール、ベンジルジメチルケタール等のケタール類;ベンゾフェノン等のベンゾフェノン類;又はキサントン類;(2,6−ジメトキシベンゾイル)−2,4,4−ペンチルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、2,4,6−トリメチルベンゾイルジフェニルフォスフィンオキサイド、エチル−2,4,6−トリメチルベンゾイルフェニルフォスフィネイト等のフォスフィンオキサイド類;各種パーオキサイド類などが挙げられ、これら公知慣用の光重合開始剤を単独で又は2種以上を組み合わせて用いることができる。これらの光重合開始剤(D)の配合割合は、前記有機バインダー(カルボキシル基含有感光性樹脂及び/又はカルボキシル基含有樹脂)(B)100質量部当り1〜30質量部が適当であり、好ましくは、5〜20質量部である。
【0028】
また、上記のような光重合開始剤(D)は、N,N−ジメチルアミノ安息香酸エチルエステル、N,N−ジメチルアミノ安息香酸イソアミルエステル、ペンチル−4−ジメチルアミノベンゾエート、トリエチルアミン、トリエタノールアミン等の三級アミン類のような光増感剤の1種あるいは2種以上と組み合わせて用いることができる。
さらに、より深い光硬化深度を要求される場合、必要に応じて、可視領域でラジカル重合を開始するチバ・スペシャルティ・ケミカルズ社製イルガキュアー784等のチタノセン系光重合開始剤、ロイコ染料等を硬化助剤として組み合わせて用いることができる。
【0029】
本発明において、光硬化性組成物に多量の無機フィラーやガラス粉末を配合した場合、得られる組成物の保存安定性は悪く、ゲル化や流動性の低下により塗布作業性が悪くなる傾向がある。従って、本発明の組成物では、組成物の保存安定性向上のため、無機フィラーやガラス粉末の成分である金属あるいは酸化物粉末との錯体化あるいは塩形成などに効果のある化合物、即ち有機酸(E)を安定剤として添加することが好ましい。この有機酸(E)としては、マロン酸、アジピン酸、ギ酸、酢酸、アセト酢酸、クエン酸、ステアリン酸、マレイン酸、フマル酸、フタル酸等の酸が挙げられ、単独で又は2種以上を組み合わせて用いることができる。このような有機酸は、前記のガラス粉末や無機微粒子100質量部当り0.1〜10質量部の割合で添加することが好ましい。
一方、これまでコバルトの安定剤としてリン酸エステルが使用されていたが、四三酸化コバルトに対しては十分な効果がない。
【0030】
また一方で、本発明のように光硬化性組成物に光重合性モノマーを配合した場合、得られる組成物の保存安定性は悪く、ゲル化や流動性の低下により塗布作業性が悪くなる傾向がある。 従って、本発明の組成物では、組成物の保存安定性向上のため、光重合性モノマーの熱重合禁止剤(F)を添加することが好ましい。この熱重合禁止剤(F)としては、フェノチアジン、ヒドロキノン、N−フェニルナフチルアミン、クロラニール、ピロガロール、ベンゾキノン、t−ブチルカテコールなどが挙げられ、単独で又は2種以上を組み合わせて用いることができる。このような熱重合禁止剤(F)は、前記の有機バインダー(B)100質量部当り0.01〜1質量部の割合で添加することが好ましい。
【0031】
なお、本発明の光硬化性組成物は、必要に応じて軟化点400〜600℃のガラス粉末、導電性粉末を、本発明の光硬化性組成物の特性を損なわない量的割合で配合することができる。
ガラス粉末は、焼成後における導体回路の密着性向上のため、四三酸化コバルト(Co304)黒色微粒子などの耐熱性黒色顔料100質量部当り200質量部以下、好ましくは150質量部以下の割合で添加できる。このガラス粉末としては、ガラス転移点(Tg)300〜500℃、ガラス軟化点(Ts)400〜600℃のものが好ましい。また、解像度の点からは、平均粒径20μm以下、好ましくは5μm以下のガラス粉末を用いることが好ましい。
【0032】
上記のようなガラス粉末を光硬化性組成物に添加することにより、露光・現像後の皮膜は600℃以下で容易に焼成可能となる。但し、本発明の組成物では燃焼性の良好な有機バインダーが用いられ、ガラス粉末が溶融する前に脱バインダーが完了するように組成されているものの、ガラス粉末の軟化点が400℃より低いと、これよりも低い温度で溶融が生じて有機バインダーを包み込み易くなり、残存する有機バインダーが分解することによって組成物中にブリスターが生じ易くなるので好ましくない。
ガラス粉末としては、酸化鉛、酸化ビスマス、又は酸化亜鉛などを主成分とする非結晶性フリットが好適に使用できる。
【0033】
本発明においては、組成物のペースト化のための希釈剤、あるいは、各種塗布工程に応じた粘度調整のための希釈剤として、適宜の量の有機溶剤を配合することができる。具体的には、メチルエチルケトン、シクロヘキサノンなどのケトン類;トルエン、キシレン、テトラメチルベンゼンなどの芳香族炭化水素類;セロソルブ、メチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、トリエチレングリコールモノエチルエーテルなどのグリコールエーテル類;酢酸エチル、酢酸ブチル、セロソルブアセテート、ブチルセロソルブアセテート、カルビトールアセテート、ブチルカルビトールアセテート、プロピレングリコールモノメチルエーテルアセテートなどの酢酸エステル類;エタノール、プロパノール、エチレングリコール、プロピレングリコール、テルピネオールなどのアルコール類;オクタン、デカンなどの脂肪族炭化水素;石油エーテル、石油ナフサ、水添石油ナフサ、ソルベントナフサなどの石油系溶剤が挙げられ、これらを単独で又は2種以上を組み合わせて用いることができる。
【0034】
本発明の光硬化性組成物は、さらに必要に応じて、シリコーン系、アクリル系等の消泡・レベリング剤、皮膜の密着性向上のためのシランカップリング剤、等の他の添加剤を配合することもできる。さらにまた、必要に応じて、公知慣用の酸化防止剤や、焼成時における基板との結合成分としての金属酸化物、ケイ素酸化物、ホウ素酸化物などの微粒子を添加することもできる。
【0035】
本発明の光硬化性組成物は、予めフィルム状に成膜されている場合には基板上にラミネートすればよいが、ペースト状組成物の場合、スクリーン印刷法、バーコーター、ブレードコーターなど適宜の塗布方法で基板、例えばPDPの前面基板となるガラス基板に塗布し、次いで指触乾燥性を得るために熱風循環式乾燥炉、遠赤外線乾燥炉等で例えば約60〜120℃で5〜40分程度乾燥させて有機溶剤を蒸発させ、タックフリーの塗膜を得る。その後、選択的露光、現像、焼成を行なって所定のパターンの電極回路を形成する。
【0036】
露光工程としては、所定の露光パターンを有するネガマスクを用いた接触露光及び非接触露光が可能である。露光光源としては、ハロゲンランプ、高圧水銀灯、レーザー光、メタルハライドランプ、ブラックランプ、無電極ランプなどが使用される。露光量としては50〜1000mJ/cm2程度が好ましい。
【0037】
現像工程としてはスプレー法、浸漬法等が用いられる。現像液としては、水酸化ナトリウム、水酸化カリウム、炭酸ナトリウム、炭酸カリウム、珪酸ナトリウムなどの金属アルカリ水溶液や、モノエタノールアミン、ジエタノールアミン、トリエタノールアミンなどのアミン水溶液、特に約1.5質量%以下の濃度の希アルカリ水溶液が好適に用いられるが、組成物中のカルボキシル基含有樹脂のカルボキシル基がケン化され、未硬化部(未露光部)が除去されればよく、上記のような現像液に限定されるものではない。また、現像後に不要な現像液の除去のため、水洗や酸中和を行なうことが好ましい。
【0038】
焼成工程においては、現像後の基板を空気中又は窒素雰囲気下で約400〜600℃の加熱処理を行ない、所望の黒色パターンを形成する。なお、この時の昇温速度は、20℃/分以下に設定することが好ましい。
【0039】
【実施例】
以下に実施例及び比較例を示して本発明について具体的に説明するが、本発明が下記実施例に限定されるものでないことはもとよりである。なお、「部」及び「%」とあるのは、特に断りがない限り全て質量基準である。
【0040】
(合成例1)
温度計、攪拌機、滴下ロート、及び還流冷却器を備えたフラスコに、メチルメタクリレートとメタクリル酸を0.76:0.24のモル比で仕込み、溶媒としてジプロピレングリコールモノメチルエーテル、触媒としてアゾビスイソブチロニトリルを入れ、窒素雰囲気下、80℃で2〜6時間攪拌し、樹脂溶液を得た。この樹脂溶液を冷却し、重合禁止剤としてメチルハイドロキノン、触媒としてテトラブチルホスホニウムブロミドを用い、グリシジルメタクリレートを、95〜105℃で16時間の条件で、上記樹脂のカルボキシル基1モルに対し0.12モルの割合の付加モル比で付加反応させ、冷却後取り出し、有機バインダーAを生成した。この有機バインダーAの樹脂は、重量平均分子量が約10,000、酸価が59mgKOH/g、二重結合当量が950であった。なお、得られた共重合樹脂の重量平均分子量の測定は、(株)島津製作所製ポンプLC−6ADと昭和電工(株)製カラムShodex(登録商標)KF−804、KF−803、KF−802を三本つないだ高速液体クロマトグラフィーにより測定した。
【0041】
(合成例2)
メチルメタクリレートとメタクリル酸の仕込み比をモル比で0.87:0.13とし、グリシジルメタクリレートを付加反応させないこと以外は、上記合成例1と同様にして有機バインダーBを生成した。この有機バインダーBの樹脂は、重量平均分子量が約10,000、酸価が74mgKOH/gであった。
【0042】
このようにして得られた有機バインダーA又はBを用い、以下に示す組成比にて組成物を配合し、攪拌機により攪拌後、3本ロールミルにより練肉してペースト化を行なった。練肉条件はサンプル量1kgを室温で30分である。なお、本実施例において、最大粒径が5μm以下の耐熱性黒色顔料を溶剤に均一に分散したスラリー(A)としては、最大粒径が5μm以下で平均粒径が0.2μmの四三酸化コバルト黒色微粒子をTPM(トリプロピレングリコールモノメチルエーテル)中に濃度70%で均一に分散した四三酸化コバルトスラリーを使用した。またガラス粉末としては、PbO 60%、B203 20%、SiO2 15%、Al203 5%を粉砕し、熱膨張係数α300=70×10−7/℃、ガラス転移点445℃、平均粒径1.6μmとしたものを使用した。
【0043】
白層電極(上層)用導電ペースト;
有機バインダーA 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
トリプロピレングリコールモノメチルエーテル 80.0部
銀粉 450.0部
ガラス粉末 22.0部
リン酸エステル 1.0部
【0044】
黒層電極(下層)用ペースト;
(参考組成物例1)
有機バインダーB 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
トリプロピレングリコールモノメチルエーテル 40.0部
四三酸化コバルト(Co3O4)スラリー 50.0部
【0045】
(参考組成物例2)
有機バインダーB 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−メチル−1−[4−(メチルチオ)フェニル]−
2−モルフォリノプロパン−1−オン 7.5部
2,4−ジエチルチオキサントン 1.0部
トリプロピレングリコールモノメチルエーテル 40.0部
四三酸化コバルト(Co3O4)スラリー 50.0部
【0046】
(参考組成物例3)
有機バインダーB 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−メチル−1−[4−(メチルチオ)フェニル]−
2−モルフォリノプロパン−1−オン 7.5部
2,4−ジエチルチオキサントン 1.0部
トリプロピレングリコールモノメチルエーテル 40.0部
四三酸化コバルト(Co3O4)スラリー 50.0部
マロン酸 1.0部
【0047】
(組成物例4)
有機バインダーB 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−メチル−1−[4−(メチルチオ)フェニル]−
2−モルフォリノプロパン−1−オン 7.5部
2,4−ジエチルチオキサントン 1.0部
トリプロピレングリコールモノメチルエーテル 40.0部
四三酸化コバルト(Co3O4)スラリー 50.0部
マロン酸 1.0部
フェノチアジン 0.1部
【0048】
(比較組成物例1)
有機バインダーB 100.0部
ペンタエリスリトールトリアクリレート 50.0部
2−ベンジル−2−ジメチルアミノ−1−
(4−モルフォリノフェニル)ブタン−1−オン 5.0部
トリプロピレングリコールモノメチルエーテル 80.0部
四三酸化コバルト(Co3O4)
平均粒径;0.2μm 35.0部
リン酸エステル 1.0部
【0049】
このようにして得られた組成物例1〜4及び比較組成物例1の各ペーストについて、四三酸化コバルトの最大粒径、焼成後のライン形状、ペースト安定性、比抵抗値、層間導通、L*値を評価した。その評価方法は以下のとおりである。
【0050】
(四三酸化コバルトの最大粒径)
上記組成にて得られた黒層電極(下層)用ペーストについて、5〜25μmを2.5μm単位で測定できるグラインドゲージを用いて四三酸化コバルトの最大粒径を測定した。
【0051】
(ペースト安定性)
組成物例3,4、比較組成物例1の各ペーストを300gずつ密閉容器に入れ40℃で1ヶ月間放置したのちのペースト増粘率(%)で評価した。
【0052】
(焼成後のライン形状)
ITO膜付きガラス基板上に、評価用ペーストを300メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて90℃で20分間乾燥して指触乾燥性の良好な皮膜を形成した。次に、この皮膜上に、白層電極(上層)用導電性ペーストを300メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて90℃で20分間乾燥して指触乾燥性の良好な白黒二層の皮膜を形成した。その後、光源をメタルハライドランプとし、ライン/スペース=50/100μmとなるネガフィルムを用いて、組成物上の積算光量が300mJ/cm2となるようにパターン露光し、次いで、液温が25℃の0.5wt%Na2CO3水溶液にて現像を行い、水洗し、最後に空気雰囲気下にて5℃/分で昇温し、550℃で30分間焼成してパターン焼成基板を作製した。その後、焼成すること以外は、上記比抵抗値評価の場合と同様にしてパターン焼成基板を作成した。
こうして得られた焼成基板について、パターンを顕微鏡観察し、ラインに不規則なバラツキがなく、よれ等の有無で評価した。
【0053】
(比抵抗値、層間導通)
パターン寸法0.4cm×10cmのネガマスクをもちいて露光すること以外は、上記(焼成後のライン形状)の評価と同様にして試験基板を作製した。
こうして得られた試験基板について、ミリオームハイテスターを用いて焼成皮膜の抵抗値を測定し、次いで、サーフコーターを用いて焼成皮膜の膜厚を測定し、焼成皮膜の比抵抗値を算出した。
また、焼成皮膜の白層電極(上層)とITO膜にテスターをあて、導通の確認を行い、導通する場合を○とし、導通しない場合を×とした。
【0054】
(L*値)
パターン寸法3cm×10cmのネガマスクをもちいて露光すること以外は、上記(焼成後のライン形状)の評価と同様にして試験基板を作製した。
こうして得られた試験基板について、色彩色差計(ミノルタカメラ(株)製、CR−221)を用いてL*a*b*表色系の値をJIS−Z−8729に従って測定し、明度を表す指数であるL*値を黒色度の指標として評価した。このL*値が小さいほど黒色度に優れる。
【0055】
これらの評価結果を表1に示す。
【表1】
【0056】
この表1に示す結果から明らかなように、本発明の光硬化性組成物は、ペースト中の四三酸化コバルトの最大粒径が小さく、均一分散していることがわかる。
また、本発明の光硬化性組成物によれば、焼成後のライン形状に不規則なバラツキやよれ等がなく、高精細な電極回路が形成できることがわかる。
さらに、本発明の光硬化性組成物は、高精細な焼成パターンを形成できるにもかかわらず、保存安定性に優れ、焼成後においても、充分な層間導通性と黒さを同時に満足し得る黒層電極(下層)を形成できることがわかった。特に、有機酸と重合禁止剤を配合した場合は、保存安定性に優れることがわかる。
【0057】
なお、上記評価用ペーストについて、焼成後の密着性を評価したが、問題はなかった。この密着性は、セロハン粘着テープを用いてピーリングを行ない、パターンの剥離がないかどうかで評価した。
【0058】
【発明の効果】
以上説明したように本発明の光硬化性組成物によれば、耐熱性黒色顔料の二次凝集を招くことなくペースト化でき、しかも保存安定性に優れ、乾燥、露光、現像、焼成の各工程においては、基板に対する優れた密着性、解像性、焼成性を損なうことがなく、焼成後においても充分な黒さを有する焼成皮膜を形成することができる。
しかも、本発明の光硬化性組成物によれば、PDPの前面基板に形成される白黒二層構造のバス電極において充分な層間導電性(透明電極とバス電極白層との層間導通)と黒さを同時に満足し得る黒層(下層)電極回路など、高精細な黒色パターンを提供することができる。
このように本発明の光硬化性組成物は、ペーストの生産性が向上し、保存安定性に優れ、そして薄い膜厚で充分なコントラストが得られることから、PDPの量産性、低コスト化にとって極めて有用なものである。
【図面の簡単な説明】
【図1】面放電方式のAC型PDPの部分分解斜視図である。
【符号の説明】
1 前面ガラス基板
2a,2b 表示電極
3a,3b 透明電極
4a,4b バス電極
5 透明誘電体層
6 保護層
10 ブラックマトリックス
11 背面ガラス基板
12 リブ
13 アドレス電極
14a,14b,14c 蛍光体膜[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fine electrode circuit, an alkali development type photocurable composition useful for forming a black pattern on a front substrate of a plasma display panel (hereinafter referred to as PDP), and a composition using the same. The present invention relates to a PDP having a lower layer (black layer) of a bus electrode having a black and white two-layer structure and a front substrate on which a black matrix is formed.
[0002]
[Prior art]
A PDP is a flat display that displays images and information using light emission by plasma discharge, and is classified into a DC type and an AC type according to a panel structure and a driving method. The principle of color display by PDP is that plasma discharge is generated in the cell space (discharge space) between the opposing electrodes formed on the front glass substrate and the rear glass substrate separated by ribs (partition walls), and each cell space. The phosphor formed on the inner surface of the rear glass substrate is excited by ultraviolet rays generated by the discharge of a gas such as He or Xe enclosed therein, and three primary colors of visible light are generated. Each cell space is defined by grid-like ribs in the DC type PDP, and is defined by ribs arranged in parallel to the substrate surface in the AC type PDP. Made by ribs. Hereinafter, it will be briefly described with reference to the accompanying drawings.
[0003]
FIG. 1 partially shows a structural example of a surface discharge PDP having a three-electrode structure for full color display. On the lower surface of the front glass substrate 1, a large number of a pair of
Further, on both sides of the pair of
In the PDP having the above structure, an AC pulse voltage is applied between the pair of
In the PDP having the above structure, the ultraviolet rays generated by the discharge excite the
[0004]
In the PDP having such a structure, the
However, since the number of steps is high and the cost is high, recently, a method of baking after conductive printing such as silver paste is performed, or in order to obtain a line width of 150 μm or less, photosensitive conductive paste is used. A method of applying, exposing through a pattern mask, developing, and baking is performed.
[0005]
In the PDP front substrate in which the
[0006]
The formation of the black matrix has been attempted by diverting a photosensitive resin composition for forming a light shielding film, which has been conventionally used for forming a black matrix such as a CRT display or a liquid crystal display panel.
However, in the production of PDP, there is a high-temperature baking step, and carbon black contained in the photosensitive resin composition for forming a light-shielding film is decomposed in this step, and it is difficult to form a satisfactory black matrix.
Therefore, in the photosensitive resin composition for forming a light-shielding film containing a photopolymerizable composition, a photopolymerization initiator, and a light-shielding material, a black composite such as a copper-iron-based or copper-chromium-based material is used as the light-shielding material. Resin compositions containing heat-resistant black pigments such as oxides and cobalt tetroxide are used.
[0007]
However, resin compositions containing black complex oxides such as copper-iron and copper-chromium, and heat-resistant black pigments such as cobalt tetroxide have poor storage stability as pastes, especially photopolymerizable monomers. And when it mix | blends with a photoinitiator and it comprises in a photocurable composition, superposition | polymerization of a photopolymerizable monomer will start and it will gelatinize. Therefore, it is necessary to store such a resin composition at a low temperature, and there is a problem that the coating workability is poor due to gelation and fluidity deterioration and cannot be applied to mass production.
[0008]
In addition, with the demand for high-definition pattern formation, the heat-resistant black pigment has to be reduced in particle size. However, when the particle size of the heat-resistant black pigment is reduced, secondary aggregation tends to be caused at the time of dispersion in the paste, and as a result, it is present as a protrusion in the coating layer and causes a problem of line shape.
[0009]
[Problems to be solved by the invention]
Therefore, the present invention has been made in order to solve such problems of the prior art, and its main purpose is that it can be made into a paste without incurring secondary aggregation of the heat-resistant black pigment, and also has a storage stability. Light that can form a fired film with sufficient blackness even after firing without impairing excellent adhesion, resolution, and fireability to the substrate in each step of drying, exposure, development, and firing. The object is to provide a curable composition.
Another object of the present invention is to provide a high-definition black pattern from such a photocurable composition, particularly sufficient interlayer conductivity (transparent electrode and bus electrode white) in a black / white two-layer bus electrode formed on the front substrate. It is an object to provide a black layer (lower layer) electrode circuit that can simultaneously satisfy blackness and a black layer (PLD) in which a black matrix is formed.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the basic of the photocurable composition of the present invention State Is a photocurable composition for a black layer constituting a bus electrode having a black and white two-layer structure, (A) a slurry in which tribasic cobalt trioxide black fine particles having a maximum particle size of 5 μm or less are dispersed in a solvent, (B) Organic binder, (C) Photopolymerizable monomer , ( D) Photopolymerization initiator , (E) an organic acid, and (F) a polymerization inhibitor It is characterized by containing Have The
Such a photocurable composition of the present invention may be in the form of a paste or may be in the form of a dry film previously formed into a film.
Furthermore, according to the present invention, there is provided a PDP in which an electrode circuit (black layer) of a front substrate is formed from a fired product of such a photocurable composition.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
As a result of intensive research aimed at realizing the above object, the inventors are characterized in that a slurry in which a heat-resistant black pigment having a maximum particle size of 5 μm or less is uniformly dispersed in a solvent is used. Thereby, the photocurable composition of this invention can be easily used as the paste without a secondary aggregate. As a result, a high-definition electrode circuit and a PDP formed with a black matrix can be provided.
[0012]
On the other hand, a photocurable composition containing a filler such as a heat-resistant black pigment has a drawback of thickening at room temperature without a stabilizer. Therefore, in order to suppress the gelation of the photocurable composition, which may be caused by the polymerization of the photopolymerizable monomer or the reaction between the heat-resistant black pigment and the carboxyl group in the organic binder, a phosphate ester has been conventionally used as a stabilizer. Is used. However, in the photocurable composition of the present invention, when a phosphate ester is used as a stabilizer, the heat-resistant black pigment in the slurry is liable to settle and easily cause powder aggregation, which adversely affects the storage stability of the paste. There was a problem of affecting.
On the other hand, as a result of further research, the inventors of the present invention have excellent storage stability even at room temperature by combining an organic acid, preferably an organic acid and a thermal polymerization inhibitor as a stabilizer, and also in mass production. It has been found that a photocurable composition that can be sufficiently handled can be provided.
[0013]
Further, according to the photocurable composition of the present invention, when cobalt trioxide black fine particles are used as the heat-resistant black pigment, the formed black film becomes dense, and even a thin film exhibits sufficient blackness. As a result, sufficient interlayer conductivity (transparent electrode and bus electrode white layer after firing) without impairing excellent adhesion, resolution and firing properties to the substrate in each step of drying, exposure, development and firing. And a pattern that can satisfy the blackness at the same time.
[0014]
Therefore, if such a photocurable composition is used as a black layer material for a bus electrode having a black and white two-layer structure formed on a PDP front substrate, the bus electrode is composed of a transparent electrode such as ITO or Nesa and a white layer. Since the sandwich structure is sandwiched between the transparent electrodes, the interlayer conduction between the transparent electrode and the white layer and the blackness when viewed from the screen side can be sufficiently satisfied.
Moreover, since the photocurable composition of the present invention is excellent in storage stability as described above and has sufficient contrast with a thin film thickness, it is extremely useful for mass production of PDP and cost reduction. It is.
[0015]
Hereinafter, the photocurable composition of the present invention will be specifically described.
First, the slurry (A) in which a heat-resistant black pigment having a maximum particle size of 5 μm or less is uniformly dispersed in a solvent can be prepared by uniformly dispersing the heat-resistant black pigment in the solvent according to a conventionally known method. . For example, a solvent, a dispersant, and a heat-resistant black pigment are sufficiently mixed and dispersed using a mixer such as a ball mill.
[0016]
Here, as the heat-resistant black pigment, an inorganic pigment having color tone stability at a high temperature can be used because it is accompanied by high-temperature baking of 500 to 600 ° C. in the PDP substrate manufacturing process. Specific examples include oxides and composite oxides such as Cr, Co, Cu, Ni, Fe, and Mn, but are not limited thereto, and these may be used alone or in combination of two or more. Can be used. In particular, in the present invention, copper-chromium black composite oxide, copper-iron black composite oxide, cobalt tetroxide, and the like, the black film formed after firing becomes dense and excellent in color tone, Preferably used.
[0017]
The heat-resistant black pigment preferably uses fine particles having an average particle size of 2 μm or less, preferably 0.01 μm or more and 1 μm or less. The reason for this is that when the average particle size is 2 μm or less, a dense fired film can be formed without impairing adhesion even if added in a small amount, and sufficient interlayer conductivity (interlayer conduction between the transparent electrode and the bus electrode white layer). This is because it is possible to provide a resin composition for a lower layer (black layer) electrode that can simultaneously satisfy the blackness. On the other hand, when the average particle diameter of the heat-resistant black pigment is larger than 2 μm, the denseness of the fired film is deteriorated, and the blackness of the lower electrode film to be formed tends to be lowered. On the other hand, if it is smaller than 0.01 μm, the hiding power is lowered and a transparent feeling may appear, which is not appropriate.
[0018]
The heat-resistant black pigment has a specific surface area of 1.0 to 20 m. 2 It is preferable to use fine cobalt tetroxide particles in the range of / g. This is because the specific surface area is 1.0 m. 2 If it is less than / g, the accuracy of circuit pattern formation by exposure is reduced, and it becomes difficult to obtain a fired film having linearity of line edges or sufficient blackness. Meanwhile, 20m 2 If it exceeds / g, the surface area of the particles becomes too large, and undercut is likely to occur during development.
[0019]
The blending amount of the heat-resistant black pigment in the slurry is suitably adjusted to be in the range of 1 to 100 parts by weight, preferably 5 to 50 parts by weight per 100 parts by weight of the organic binder (B). The reason for this is that if the blending amount of the heat-resistant black pigment is less than the above range, sufficient blackness cannot be obtained after firing. On the other hand, if the blending amount exceeds the above range, the light transmittance deteriorates and the resolution is reduced. This is because, in addition to the decrease in performance, the cost increases.
[0020]
The solvent used in the slurry can be arbitrarily selected, but it is desirable to use the same type of solvent as that used in the paste in order to prevent solvent shock. Moreover, although the density | concentration of a slurry can be selected arbitrarily, when workability | operativity etc. are considered, 50 to 80% is preferable.
[0021]
The dispersant used in the slurry is not particularly limited as long as it can uniformly disperse the heat-resistant black pigment, and examples thereof include polymer dispersants such as Nippon Oil & Fats Maririm series.
[0022]
Next, as the organic binder (B), a carboxyl group-containing resin, specifically, a carboxyl group-containing photosensitive resin having an ethylenically unsaturated double bond and an ethylenically unsaturated double bond. Any carboxyl group-containing resin that is not used can be used. Examples of the resin (which may be either an oligomer or a polymer) that can be suitably used include the following.
(1) A carboxyl group-containing resin obtained by copolymerizing (a) an unsaturated carboxylic acid and (b) a compound having an unsaturated double bond
(2) A carboxyl group-containing photosensitive resin obtained by adding an ethylenically unsaturated group as a pendant to a copolymer of (a) an unsaturated carboxylic acid and (b) a compound having an unsaturated double bond
(3) (c) a secondary compound produced by reacting (a) an unsaturated carboxylic acid with a copolymer of a compound having an epoxy group and an unsaturated double bond and (b) a compound having an unsaturated double bond Carboxyl group-containing photosensitive resin obtained by reacting (d) a polybasic acid anhydride with the hydroxyl group of
(4) (e) a copolymer of an acid anhydride having an unsaturated double bond and (b) a compound having an unsaturated double bond is reacted with a compound having a hydroxyl group and an unsaturated double bond. Carboxyl group-containing photosensitive resin
(5) A carboxyl group-containing photosensitive resin obtained by reacting (g) an epoxy compound with (h) an unsaturated monocarboxylic acid and reacting the resulting secondary hydroxyl group with (d) a polybasic acid anhydride.
(6) (b) An epoxy group of a copolymer of an unsaturated double bond and a glycidyl (meth) acrylate copolymer, (i) having one carboxyl group in one molecule, and having an ethylenically unsaturated bond A carboxyl group-containing resin obtained by reacting an organic acid having no reaction and reacting the resulting secondary hydroxyl group with (d) a polybasic acid anhydride
(7) (j) A carboxyl group-containing resin obtained by reacting a hydroxyl group-containing polymer with (d) a polybasic acid anhydride
(8) (j) Obtained by further reacting a carboxyl group-containing resin obtained by reacting a hydroxyl group-containing polymer with (d) a polybasic acid anhydride, and (c) a compound having an epoxy group and an unsaturated double bond. Carboxyl group-containing photosensitive resin
[0023]
The carboxyl group-containing photosensitive resin and the carboxyl group-containing resin as described above may be used alone or in combination, but in any case, these are combined in a proportion of 10 to 80% by mass of the total amount of the composition. It is preferable to do. When the blending amount of these polymers is less than the above range, the distribution of the resin in the film to be formed tends to be non-uniform, it is difficult to obtain sufficient photocurability and photocuring depth, and selective exposure and development. Makes patterning difficult. On the other hand, if it is more than the above range, it is not preferable because the pattern during baking and the shrinkage of the line width are likely to occur.
[0024]
The carboxyl group-containing photosensitive resin and the carboxyl group-containing resin each have a weight average molecular weight of 1,000 to 100,000, preferably 5,000 to 70,000, and an acid value of 50 to 250 mgKOH / g, and In the case of a carboxyl group-containing photosensitive resin, those having a double bond equivalent of 350 to 2,000, preferably 400 to 1,500 can be suitably used. When the molecular weight of the resin is lower than 1,000, the adhesion of the film during development is adversely affected. On the other hand, when the molecular weight is higher than 100,000, development defects are liable to occur. On the other hand, when the acid value is lower than 50 mgKOH / g, the solubility in an alkaline aqueous solution is insufficient and development failure tends to occur. On the other hand, when the acid value is higher than 250 mgKOH / g, the adhesion of the film is deteriorated during development and the photocured part (exposure) Part) is not preferable. Further, in the case of a carboxyl group-containing photosensitive resin, if the double bond equivalent of the photosensitive resin is less than 350, a residue is likely to remain at the time of baking, whereas if it is greater than 2,000, a work margin at the time of development. Is narrow, and a high exposure amount is required at the time of photocuring.
[0025]
Next, the photopolymerizable monomer (C) in the photocurable composition of the present invention is used for promoting the photocurability of the composition and improving the developability. Examples of the photopolymerizable monomer (C) include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylolpropane triacrylate, Pentaerythritol triacrylate, pentaerythritol tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropane propylene oxide modified triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and each methacrylate corresponding to the above acrylate; phthalate Acid, adipic acid, maleic acid, Examples include mono-, di-, tri- or higher polyesters of polybasic acids such as conic acid, succinic acid, trimellitic acid, terephthalic acid, and hydroxyalkyl (meth) acrylate, but are limited to specific ones. These may be used alone or in combination of two or more. Among these photopolymerizable monomers, polyfunctional monomers having two or more acryloyl groups or methacryloyl groups in one molecule are preferable.
[0026]
The amount of such a photopolymerizable monomer (C) is suitably 20 to 100 parts by mass per 100 parts by mass of the organic binder (carboxyl group-containing photosensitive resin and / or carboxyl group-containing resin) (B). When the blending amount of the photopolymerizable monomer (C) is less than the above range, it is difficult to obtain sufficient photocurability of the composition. On the other hand, when the amount exceeds the above range, the surface is larger than the deep part of the film. Since the photo-curing of the part is accelerated, uneven curing is likely to occur.
[0027]
Next, examples of the photopolymerization initiator (D) in the photocurable composition of the present invention include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone, 2, Acetophenones such as 2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane- Aminoacetophenones such as 1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1; 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1 -Chloroant Anthraquinones such as quinone; thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyldimethyl ketal; benzophenone Benzophenones; or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6- Phosphine oxides such as trimethylbenzoyldiphenylphosphine oxide and ethyl-2,4,6-trimethylbenzoylphenyl phosphinate; various peroxides, and the like. The polymerization initiator may be used singly or in combination of two or more. The mixing ratio of these photopolymerization initiators (D) is suitably 1 to 30 parts by mass, preferably 100 parts by mass of the organic binder (carboxyl group-containing photosensitive resin and / or carboxyl group-containing resin) (B). Is 5 to 20 parts by mass.
[0028]
The photopolymerization initiator (D) is composed of N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine. It can be used in combination with one or more photosensitizers such as tertiary amines.
Furthermore, when a deeper photocuring depth is required, a titanocene photopolymerization initiator such as Irgacure 784 manufactured by Ciba Specialty Chemicals, which starts radical polymerization in the visible region, and leuco dyes are cured as necessary. It can be used in combination as an auxiliary agent.
[0029]
In the present invention, when a large amount of inorganic filler or glass powder is blended in the photocurable composition, the storage stability of the resulting composition is poor, and the coating workability tends to be poor due to gelation and fluidity deterioration. . Therefore, in the composition of the present invention, in order to improve the storage stability of the composition, a compound effective in complexing or forming a salt with a metal or oxide powder as a component of an inorganic filler or glass powder, that is, an organic acid. It is preferable to add (E) as a stabilizer. Examples of the organic acid (E) include acids such as malonic acid, adipic acid, formic acid, acetic acid, acetoacetic acid, citric acid, stearic acid, maleic acid, fumaric acid, and phthalic acid. They can be used in combination. Such an organic acid is preferably added at a rate of 0.1 to 10 parts by mass per 100 parts by mass of the glass powder or inorganic fine particles.
On the other hand, phosphoric acid esters have been used as cobalt stabilizers, but there is no sufficient effect on tribasic cobalt oxide.
[0030]
On the other hand, when a photopolymerizable monomer is blended in the photocurable composition as in the present invention, the storage stability of the resulting composition is poor, and the coating workability tends to be poor due to gelation and fluidity reduction. There is. Therefore, in the composition of the present invention, it is preferable to add a thermal polymerization inhibitor (F) of a photopolymerizable monomer in order to improve the storage stability of the composition. Examples of the thermal polymerization inhibitor (F) include phenothiazine, hydroquinone, N-phenylnaphthylamine, chloranil, pyrogallol, benzoquinone, t-butylcatechol and the like, and these can be used alone or in combination of two or more. Such a thermal polymerization inhibitor (F) is preferably added at a ratio of 0.01 to 1 part by mass per 100 parts by mass of the organic binder (B).
[0031]
In addition, the photocurable composition of this invention mix | blends the glass powder and electroconductive powder with a softening point of 400-600 degreeC as needed in the quantitative ratio which does not impair the characteristic of the photocurable composition of this invention. be able to.
Glass powder is used to improve the adhesion of the conductor circuit after firing. 3 0 4 ) 200 parts by mass or less, preferably 150 parts by mass or less, per 100 parts by mass of heat-resistant black pigment such as black fine particles. The glass powder preferably has a glass transition point (Tg) of 300 to 500 ° C. and a glass softening point (Ts) of 400 to 600 ° C. From the viewpoint of resolution, it is preferable to use glass powder having an average particle size of 20 μm or less, preferably 5 μm or less.
[0032]
By adding the glass powder as described above to the photocurable composition, the film after exposure and development can be easily baked at 600 ° C. or lower. However, in the composition of the present invention, a combustible organic binder is used, and the composition is such that debinding is completed before the glass powder melts, but the softening point of the glass powder is lower than 400 ° C. It is not preferable because melting occurs at a temperature lower than this and the organic binder is easily wrapped and blisters are easily formed in the composition by the decomposition of the remaining organic binder.
As the glass powder, an amorphous frit containing lead oxide, bismuth oxide, zinc oxide or the like as a main component can be preferably used.
[0033]
In the present invention, an appropriate amount of an organic solvent can be blended as a diluent for pasting the composition or a diluent for adjusting the viscosity according to various coating steps. Specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, di Glycol ethers such as propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate Acetic acid esters such as ethanol, propanol, ethylene glycol, propylene glycol And alcohols such as terpineol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha. These may be used alone or in combination of two or more. Can be used.
[0034]
The photocurable composition of the present invention may further contain other additives such as silicone-based and acrylic-based defoaming / leveling agents, silane coupling agents for improving film adhesion, and the like, if necessary. You can also Furthermore, if necessary, fine particles such as metal oxides, silicon oxides, boron oxides, and the like, which are known and commonly used antioxidants, and as binding components to the substrate during firing may be added.
[0035]
The photocurable composition of the present invention may be laminated on a substrate when it has been formed into a film in advance, but in the case of a paste-like composition, a screen printing method, a bar coater, a blade coater, etc. It is applied to a substrate, for example, a glass substrate that is a front substrate of a PDP by a coating method, and then, for example, in a hot air circulation drying furnace, a far infrared drying furnace, etc., for example, at about 60 to 120 ° C. for 5 to 40 minutes in order to obtain touch dryness The organic solvent is evaporated by drying to a certain degree to obtain a tack-free coating film. Thereafter, selective exposure, development, and baking are performed to form an electrode circuit having a predetermined pattern.
[0036]
As the exposure step, contact exposure and non-contact exposure using a negative mask having a predetermined exposure pattern are possible. As the exposure light source, a halogen lamp, a high-pressure mercury lamp, a laser beam, a metal halide lamp, a black lamp, an electrodeless lamp, or the like is used. The exposure amount is 50 to 1000 mJ / cm 2 The degree is preferred.
[0037]
As the development process, a spray method, an immersion method, or the like is used. Developers include aqueous alkali metal solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate and sodium silicate, and aqueous amine solutions such as monoethanolamine, diethanolamine and triethanolamine, especially about 1.5% by mass or less. A dilute alkaline aqueous solution having a concentration of 1 is preferably used, as long as the carboxyl group of the carboxyl group-containing resin in the composition is saponified and the uncured part (unexposed part) is removed. It is not limited to. Further, it is preferable to perform washing with water and acid neutralization in order to remove unnecessary developer after development.
[0038]
In the baking step, the substrate after development is subjected to heat treatment at about 400 to 600 ° C. in air or in a nitrogen atmosphere to form a desired black pattern. In addition, it is preferable to set the temperature increase rate at this time to 20 degrees C / min or less.
[0039]
【Example】
EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples and comparative examples, but the present invention is not limited to the following examples. “Parts” and “%” are based on mass unless otherwise specified.
[0040]
(Synthesis Example 1)
A flask equipped with a thermometer, stirrer, dropping funnel and reflux condenser is charged with methyl methacrylate and methacrylic acid in a molar ratio of 0.76: 0.24, dipropylene glycol monomethyl ether as a solvent, and azobisiso as a catalyst. Butyronitrile was added and stirred at 80 ° C. for 2 to 6 hours under a nitrogen atmosphere to obtain a resin solution. The resin solution was cooled, methylhydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and glycidyl methacrylate was added at 0.12 to 1 mol of the carboxyl group of the resin under the conditions of 95 to 105 ° C. for 16 hours. Addition reaction was carried out at an additional molar ratio of a molar ratio, and after cooling, the organic binder A was produced. The resin of the organic binder A had a weight average molecular weight of about 10,000, an acid value of 59 mgKOH / g, and a double bond equivalent of 950. In addition, the measurement of the weight average molecular weight of the obtained copolymer resin is Shimadzu Corporation pump LC-6AD, Showa Denko Co., Ltd. column Shodex (trademark) KF-804, KF-803, KF-802. Was measured by high performance liquid chromatography.
[0041]
(Synthesis Example 2)
Organic binder B was produced in the same manner as in Synthesis Example 1 except that the charge ratio of methyl methacrylate and methacrylic acid was 0.87: 0.13 in terms of molar ratio and glycidyl methacrylate was not subjected to addition reaction. This organic binder B resin had a weight average molecular weight of about 10,000 and an acid value of 74 mgKOH / g.
[0042]
Using the organic binder A or B thus obtained, the composition was blended at the composition ratio shown below, stirred with a stirrer, and then kneaded with a three-roll mill to form a paste. Kneaded meat conditions are 1 kg of sample amount at room temperature for 30 minutes. In this example, as the slurry (A) in which a heat-resistant black pigment having a maximum particle size of 5 μm or less is uniformly dispersed in a solvent, tetrasodium oxide having a maximum particle size of 5 μm or less and an average particle size of 0.2 μm. A cobalt tetroxide slurry in which cobalt black fine particles were uniformly dispersed in TPM (tripropylene glycol monomethyl ether) at a concentration of 70% was used. As the glass powder, PbO 60%, B 2 0 3 20%, SiO 2 15%, Al 2 0 3 5% crushed, thermal expansion coefficient α 300 = 70 × 10 -7 / ° C., glass transition point 445 ° C., and average particle size 1.6 μm were used.
[0043]
Conductive paste for white layer electrode (upper layer);
Organic binder A 100.0 parts
Pentaerythritol triacrylate 50.0 parts
2-Benzyl-2-dimethylamino-1-
5.0 parts of (4-morpholinophenyl) butan-1-one
Tripropylene glycol monomethyl ether 80.0 parts
450.0 parts of silver powder
Glass powder 22.0 parts
Phosphate ester 1.0 part
[0044]
Black layer electrode (lower layer) paste;
( reference Composition Example 1)
100.0 parts of organic binder B
Pentaerythritol triacrylate 50.0 parts
2-Benzyl-2-dimethylamino-1-
5.0 parts of (4-morpholinophenyl) butan-1-one
Tripropylene glycol monomethyl ether 40.0 parts
Cobalt tetroxide (Co 3 O 4 ) Slurry 50.0 parts
[0045]
( reference Composition Example 2)
100.0 parts of organic binder B
Pentaerythritol triacrylate 50.0 parts
2-Methyl-1- [4- (methylthio) phenyl]-
7.5 parts of 2-morpholinopropan-1-one
2,4-diethylthioxanthone 1.0 part
Tripropylene glycol monomethyl ether 40.0 parts
Cobalt tetroxide (Co 3 O 4 ) Slurry 50.0 parts
[0046]
( reference Composition Example 3)
100.0 parts of organic binder B
Pentaerythritol triacrylate 50.0 parts
2-Methyl-1- [4- (methylthio) phenyl]-
7.5 parts of 2-morpholinopropan-1-one
2,4-diethylthioxanthone 1.0 part
Tripropylene glycol monomethyl ether 40.0 parts
Cobalt tetroxide (Co 3 O 4 ) Slurry 50.0 parts
1.0 part of malonic acid
[0047]
(Composition Example 4)
100.0 parts of organic binder B
Pentaerythritol triacrylate 50.0 parts
2-Methyl-1- [4- (methylthio) phenyl]-
7.5 parts of 2-morpholinopropan-1-one
2,4-diethylthioxanthone 1.0 part
Tripropylene glycol monomethyl ether 40.0 parts
Cobalt tetroxide (Co 3 O 4 ) Slurry 50.0 parts
1.0 part of malonic acid
0.1 part of phenothiazine
[0048]
(Comparative composition example 1)
100.0 parts of organic binder B
Pentaerythritol triacrylate 50.0 parts
2-Benzyl-2-dimethylamino-1-
5.0 parts of (4-morpholinophenyl) butan-1-one
Tripropylene glycol monomethyl ether 80.0 parts
Cobalt tetroxide (Co 3 O 4 )
Average particle size: 0.2 μm 35.0 parts
Phosphate ester 1.0 part
[0049]
For each paste of Composition Examples 1 to 4 and Comparative Composition Example 1 thus obtained, the maximum particle size of cobalt trioxide, the line shape after firing, paste stability, specific resistance, interlayer conduction, L * The value was evaluated. The evaluation method is as follows.
[0050]
(Maximum particle size of cobalt trioxide)
About the paste for black layer electrodes (lower layer) obtained by the said composition, the largest particle size of cobalt trioxide was measured using the grind gauge which can measure 5-25 micrometers in a 2.5 micrometers unit.
[0051]
(Paste stability)
300 g of each paste of Composition Examples 3 and 4 and Comparative Composition Example 1 was put in a sealed container and allowed to stand at 40 ° C. for 1 month, and evaluated by the paste thickening rate (%).
[0052]
(Line shape after firing)
An evaluation paste is applied on the entire surface of a glass substrate with an ITO film using a 300-mesh polyester screen, and then dried at 90 ° C. for 20 minutes in a hot-air circulating drying oven to form a film with good touch drying properties. Formed. Next, a conductive paste for white layer electrode (upper layer) is applied on the entire surface using a 300-mesh polyester screen, and then dried at 90 ° C. for 20 minutes in a hot air circulating drying oven. A black and white bilayer film having good touch drying properties was formed. Then, using a negative film in which the light source is a metal halide lamp and the line / space = 50/100 μm, the integrated light quantity on the composition is 300 mJ / cm. 2 Then, pattern exposure was performed so that the solution temperature was 0.5 wt% Na with a liquid temperature of 25 ° C. 2 CO 3 Development was performed with an aqueous solution, washed with water, and finally heated at 5 ° C./min in an air atmosphere and baked at 550 ° C. for 30 minutes to prepare a pattern baked substrate. Thereafter, a pattern fired substrate was prepared in the same manner as in the specific resistance evaluation except that firing was performed.
With respect to the fired substrate thus obtained, the pattern was observed with a microscope, and there was no irregular variation in the line, and the presence or absence of warpage was evaluated.
[0053]
(Specific resistance value, interlayer conduction)
A test substrate was prepared in the same manner as in the above (line shape after firing) except that exposure was performed using a negative mask having a pattern size of 0.4 cm × 10 cm.
For the test substrate thus obtained, the resistance value of the fired film was measured using a milliohm high tester, and then the film thickness of the fired film was measured using a surf coater to calculate the specific resistance value of the fired film.
Moreover, a tester was applied to the white layer electrode (upper layer) of the fired film and the ITO film to confirm the conduction.
[0054]
(L * value)
A test substrate was prepared in the same manner as in the above (line shape after firing) except that exposure was performed using a negative mask having a pattern size of 3 cm × 10 cm.
For the test substrate thus obtained, the color difference meter (CR-221, manufactured by Minolta Camera Co., Ltd.) was used. * a * b * The value of the color system is measured according to JIS-Z-8729, and L is an index representing lightness. * The value was evaluated as an index of blackness. This L * The smaller the value, the better the blackness.
[0055]
These evaluation results are shown in Table 1.
[Table 1]
[0056]
As is apparent from the results shown in Table 1, it can be seen that the photocurable composition of the present invention has a small maximum particle size of cobalt trioxide in the paste and is uniformly dispersed.
Moreover, according to the photocurable composition of this invention, it turns out that there is no irregular variation, a twist, etc. in the line shape after baking, and a high-definition electrode circuit can be formed.
Furthermore, the photocurable composition of the present invention is excellent in storage stability despite being capable of forming a high-definition fired pattern, and is a black that can simultaneously satisfy sufficient interlayer conductivity and blackness even after firing. It was found that a layer electrode (lower layer) can be formed. In particular, it can be seen that when an organic acid and a polymerization inhibitor are blended, the storage stability is excellent.
[0057]
In addition, although the adhesiveness after baking was evaluated about the said paste for evaluation, there was no problem. The adhesion was evaluated by peeling using a cellophane adhesive tape and checking for pattern peeling.
[0058]
【The invention's effect】
As described above, according to the photocurable composition of the present invention, it is possible to form a paste without causing secondary aggregation of the heat-resistant black pigment, and it has excellent storage stability, and each step of drying, exposure, development, and baking. In the method, it is possible to form a fired film having sufficient blackness even after firing without impairing excellent adhesion, resolution, and fireability to the substrate.
In addition, according to the photocurable composition of the present invention, sufficient interlayer conductivity (interlayer conduction between the transparent electrode and the white layer of the bus electrode) and black in the black and white two-layer bus electrode formed on the front substrate of the PDP. It is possible to provide a high-definition black pattern such as a black layer (lower layer) electrode circuit that can simultaneously satisfy the above requirements.
As described above, the photocurable composition of the present invention improves paste productivity, is excellent in storage stability, and provides a sufficient contrast with a thin film thickness. It is extremely useful.
[Brief description of the drawings]
FIG. 1 is a partially exploded perspective view of a surface discharge AC type PDP.
[Explanation of symbols]
1 Front glass substrate
2a, 2b Display electrode
3a, 3b Transparent electrode
4a, 4b Bus electrode
5 Transparent dielectric layer
6 Protective layer
10 Black matrix
11 Back glass substrate
12 Ribs
13 Address electrode
14a, 14b, 14c phosphor film
Claims (2)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002038277A JP4290918B2 (en) | 2002-02-15 | 2002-02-15 | Photocurable composition and plasma display panel formed with black pattern using the same |
TW092102665A TW200303338A (en) | 2002-02-15 | 2003-02-10 | Photo curing composition and plasma display using the same in forming black pattern |
KR1020030009012A KR101005360B1 (en) | 2002-02-15 | 2003-02-13 | Photocurable Composition and Plasma Display Panel Having Black Pattern Formed by Use of the Same |
CNB031044670A CN100433228C (en) | 2002-02-15 | 2003-02-17 | Optical-solidifying composition and plasma displaying board using same to form black pattern |
KR1020090010120A KR100931139B1 (en) | 2002-02-15 | 2009-02-09 | Heat resistant black pigment slurry and method for preparing photocurable composition using thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002038277A JP4290918B2 (en) | 2002-02-15 | 2002-02-15 | Photocurable composition and plasma display panel formed with black pattern using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003238607A JP2003238607A (en) | 2003-08-27 |
JP4290918B2 true JP4290918B2 (en) | 2009-07-08 |
Family
ID=27678161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002038277A Expired - Fee Related JP4290918B2 (en) | 2002-02-15 | 2002-02-15 | Photocurable composition and plasma display panel formed with black pattern using the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4290918B2 (en) |
KR (2) | KR101005360B1 (en) |
CN (1) | CN100433228C (en) |
TW (1) | TW200303338A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100658714B1 (en) | 2004-11-30 | 2006-12-15 | 삼성에스디아이 주식회사 | Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel |
KR100927610B1 (en) * | 2005-01-05 | 2009-11-23 | 삼성에스디아이 주식회사 | Photosensitive paste composition, and plasma display panel manufactured using the same |
KR100721096B1 (en) * | 2005-08-17 | 2007-05-23 | 엘지전자 주식회사 | Black paste composite, up-board structure of plasma display panel and manufacturing method manufactured by using the same |
DE602006021468D1 (en) * | 2005-12-06 | 2011-06-01 | Corning Inc | Manufacturing process for an airtight sealed glass packaging |
JP2008226832A (en) * | 2007-02-16 | 2008-09-25 | Matsushita Electric Ind Co Ltd | Plasma display panel, its manufacturing method and its paste for display electrode |
JP2009149461A (en) * | 2007-12-19 | 2009-07-09 | Taiyo Ink Mfg Ltd | Paste composition |
US8389593B2 (en) * | 2008-12-24 | 2013-03-05 | Lg Chem, Ltd. | Composition for simultaneously forming two isolated column spacer patterns |
JP4960984B2 (en) * | 2009-03-25 | 2012-06-27 | 株式会社アルバック | Display device |
CN104040640B (en) * | 2012-01-19 | 2017-03-29 | 东丽株式会社 | The manufacture method of electrocondution slurry and conductive pattern |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10133365A (en) * | 1996-11-01 | 1998-05-22 | Dainippon Printing Co Ltd | Composition for nonconductive light shielding layer, nonconductive light shielding layer and color filter |
JP3953625B2 (en) * | 1998-03-02 | 2007-08-08 | 太陽インキ製造株式会社 | Photosensitive composition |
JP3920449B2 (en) * | 1998-03-13 | 2007-05-30 | 太陽インキ製造株式会社 | Alkali-developable photocurable composition and fired product pattern obtained using the same |
JP2000090738A (en) * | 1998-09-14 | 2000-03-31 | Taiyo Ink Mfg Ltd | Photosensitive glass paste composition and burned material pattern formation method using it |
-
2002
- 2002-02-15 JP JP2002038277A patent/JP4290918B2/en not_active Expired - Fee Related
-
2003
- 2003-02-10 TW TW092102665A patent/TW200303338A/en not_active IP Right Cessation
- 2003-02-13 KR KR1020030009012A patent/KR101005360B1/en not_active IP Right Cessation
- 2003-02-17 CN CNB031044670A patent/CN100433228C/en not_active Expired - Fee Related
-
2009
- 2009-02-09 KR KR1020090010120A patent/KR100931139B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101005360B1 (en) | 2010-12-30 |
JP2003238607A (en) | 2003-08-27 |
KR20030069068A (en) | 2003-08-25 |
KR100931139B1 (en) | 2009-12-10 |
TWI298073B (en) | 2008-06-21 |
CN100433228C (en) | 2008-11-12 |
KR20090018703A (en) | 2009-02-20 |
CN1438667A (en) | 2003-08-27 |
TW200303338A (en) | 2003-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3479463B2 (en) | Photocurable conductive composition and plasma display panel formed with electrodes using the same | |
KR100931139B1 (en) | Heat resistant black pigment slurry and method for preparing photocurable composition using thereof | |
JP4369103B2 (en) | Photosensitive conductive paste and plasma display panel formed with electrodes using the same | |
JP3986312B2 (en) | Black paste composition and plasma display panel using the black paste composition | |
JP3538408B2 (en) | Photocurable composition and plasma display panel formed with electrodes using the same | |
JP4987858B2 (en) | Photo-curable conductive paste, photo-curable black paste, and plasma display panel used for forming a two-layer bus electrode | |
JP3538387B2 (en) | Photocurable resin composition and plasma display panel formed with electrodes using the same | |
JP2004063247A (en) | Process of manufacture of plasma display panel | |
JP4849851B2 (en) | Photocurable composition and plasma display panel formed with black pattern using the same | |
JP4954650B2 (en) | Photosensitive paste composition and fired product pattern formed using the same | |
JP3548146B2 (en) | Photocurable composition and plasma display panel formed with black pattern using the same | |
JP4954647B2 (en) | Plasma display panel having photosensitive paste and fired product pattern formed from the photosensitive paste | |
JP2003100208A (en) | Formation method of electrode pattern and plasma display panel having the same formed thereupon | |
JP4771598B2 (en) | Photo-curable resin composition and plasma display panel using the same and forming a black matrix | |
JP4214005B2 (en) | Photocurable resin composition and front substrate for plasma display panel | |
JP2004190037A (en) | Photocurable resin composition | |
KR20130019379A (en) | Photocurable composition | |
JP3858005B2 (en) | Photocurable resin composition and front substrate for plasma display panel | |
JP2006030853A (en) | Photosensitive paste and baked product pattern formed using the same | |
JP5732222B2 (en) | Photosensitive resin composition | |
JP2004053628A (en) | Photosetting black composition and bus electrode formed using same | |
KR100785539B1 (en) | Photosensitive paste and calcined pattern obtained by using the same | |
JP2006337707A (en) | Photosensitive paste and baked object pattern formed by using the same | |
JP2006120568A (en) | Bus electrode and its formation method | |
JP2012073494A (en) | Photosensitive resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050203 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051006 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060124 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060327 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20060327 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060613 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061212 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070207 |
|
A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070328 |
|
A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20070420 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090402 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120410 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120410 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130410 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130410 Year of fee payment: 4 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130410 Year of fee payment: 4 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140410 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |