JP4031107B2

JP4031107B2 - Electronic component mounting apparatus and method

Info

Publication number: JP4031107B2
Application number: JP14492798A
Authority: JP
Inventors: 晃岸田
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 1998-05-27
Filing date: 1998-05-27
Publication date: 2008-01-09
Anticipated expiration: 2018-05-27
Also published as: JPH11340692A

Description

【０００１】
【産業上の利用分野】
本発明は、基板への電子部品の装着に際して、事前の装着準備の高効率化と、電子部品の装着時間の短縮化を図ることができる電子部品装着装置およびその方法に関する。
【０００２】
【従来の技術】
プリント基板へ、チップ部品やＩＣ部品等の電子部品を装着する業界等において、その処理は、連続した自動化が一般的となっており、また、プリント基板には、多数品種で複数個の前記電子部品が吸着ノズルによって装着されている。
【０００３】
この電子部品は、その種類が変わるごとに該電子部品を吸着する吸着ノズルもそれに応じたものが選定されて、装着ヘッドへ交換取り付けされる。
【０００４】
したがって、この吸着ノズルは、吸着孔の内径や吸着先端形状が異なる種々のものが装着される電子部品の種類に合わせて、あらかじめノズル交換機等に多数用意されている。
【０００５】
しかしながら、このノズル交換機８０は、図１２に示すように、電子部品装着装置８１の定められた位置において、例えば、電子部品ｂの供給部ｍとプリント基板ｃの搬送部（装着部）ｎとの間に固定された状態で配置されている。
【０００６】
また、このノズル交換機８０は、電子部品装着装置における機体の比較的込み入った狭い場所に固定されているため、該ノズル交換機８０の保守や据え付け交換作業はもちろんのこと、装着ヘッドや基板搬送部，部品供給部等の保守・点検等の頻繁に行われる作業時に、このノズル交換機８０が邪魔となって多大な時間が費やされて、主たる電子部品装着処理に支障を来す。
【０００７】
更に、固定式のノズル交換機は、その取り付けに大きな領域が占領されて、装置全体が大型化する。等の様々な問題点を有するものであった。
【０００８】
そのため、図１２（ａ）において、移動経路の矢印ｐに示すように、電子部品ｂを収容した供給部ｍの位置によっては、一旦、交換予定のノズル交換機８０へ移動してこの吸着ノズル８３を受け取り、この吸着ノズル８３が装着部ｎを跨いで、該ノズル交換機８０とは遠い位置に設けられた供給部ｍへ一旦移動して希望する電子部品ｂを吸着保持し、その後、プリント基板ｃへ戻って装着するという大きな移動距離が必要となるものであり、これによって、電子部品の装着時間が長くなるという欠点があった。
【０００９】
【発明が解決しようとする課題】
本発明は前記した問題点を解決するためになされたもので、装着ヘッドの移動経路を可及的に短縮させて、電子部品の装着時間を短縮することができる電子部品装着装置およびその方法を提供することを目的としている。
【００１０】
【課題を解決するための手段】
前記した目的を達成するための本発明の手段は、機体に、基板を移送する移送部材を設けるとともに、この移送部材の側方に位置するように複数の電子部品供給機からなる電子部品供給機集合体を設け、この電子部品供給機集合体から電子部品を運び基板に実装する装着ヘッドと、この装着ヘッドに装着する吸着ノズルを保持する吸着ノズル保持体とを備えた電子部品装着装置であって、
前記機体における前記移送部材の側方の部位と、この部位に着脱可能に構成された移動体とのうち少なくとも一方に、複数の電子部品供給機を取り付ける取付部を設け、
この取付部に、前記電子部品供給機を着脱手段によって着脱自在に載置させるとともに、前記吸着ノズル保持体を取付手段によって着脱自在に取り付けてなり、
前記着脱手段は、前記電子部品供給機に設けられた係合部材と、基板移送方向の位置決めされた複数位置において前記係合部材が係合するように前記取付部に設けられた被係合部とによって構成し、
前記取付手段は、前記被係合部と、前記吸着ノズル保持体に前記被係合部に係合するように設けられた係合部材とによって構成し、
前記複数の取付部に対し、前記複数の電子部品供給機をそれぞれ取り付けるとともに、電子部品供給機が取付けられていない空きスペースに前記吸着ノズル保持体を取り付けた電子部品装着装置の構成にある。
【００１１】
請求項２に記載した発明に係る電子部品装着装置は、請求項１に記載した電子部品装着装置において、前記吸着ノズル保持体は、前記取付部に取り付けられた状態において、複数個の吸着ノズルを前記基板の移送方向と直交する方向に１列あるいは２列に並べて保持する受部を備えているものである。
請求項３に記載した発明に係る電子部品装着装置は、請求項１または請求項２に記載した電子部品装着装置において、前記取付部は、前記移送部材の両側方に設けられているものである。
【００１２】
請求項４に記載した発明に係る電子部品装着装置は、請求項１ないし請求項３のうちいずれか一つに記載した電子部品装着装置において、前記被係合部は、前記取付部に基板の移送方向に所定間隔で設けられた多数個の受孔と、前記取付部に設けられた係止受け段部とによって構成され前記係合部材は、前記電子部品供給機と前記吸着ノズル保持体とにそれぞれ前記受孔に係脱自在に係合するように設けた係合子と、前記電子部品供給機と前記吸着ノズル保持体とにそれぞれ前記係止受け段部に係脱自在に係合するように設けた着脱部材とによって構成され、前記電子部品供給機と吸着ノズル保持体とは、前記受孔と係止受け段部とを共用して取付部に取付けられているものである。
【００１３】
請求項５に記載した発明に係る電子部品装着方法は、請求項１に記載した電子部品装着装置を用いた電子部品装着方法であって、前記複数位置のうち基板の移送方向中間部と対応する位置に設けられた吸着ノズル保持体の吸着ノズルを装着ヘッドに取り付けた後、前記電子部品供給機の電子部品を装着ヘッドによって吸着し、その後、装着ヘッドを基板が位置する装着部に移動させて前記電子部品を基板に実装することにより実施する。
【００１４】
【実施例】
次に、本発明に関する電子部品装着装置およびその方法の実施の一例を図面に基づいて説明する。
【００１５】
図１，図２および図７〜図９においてＡは、チップ部品やＩＣ部品等の電子部品ｂを、その供給部ｍより受け取って装着部ｎへ移送し、プリント基板ｃ上の所定位置へ装着する電子部品装着装置であって、本体１と、電子部品供給機集合体２と、吸着ノズル保持体３とにより基本的に構成される。
【００１６】
なお、前記した電子部品装着装置Ａは、本体１における機体４において、その一側または両側にテープ式やトレイ式等の電子部品供給機ｄにおいて待機する電子部品ｂの供給部ｍが、また、機体４内において移送部材ｅによりプリント基板ｃが搬入出される装着部ｎが設けられている。
【００１７】
そして、前記した電子部品装着装置Ａの構成は、図１，図２に示すように、本体１における機体４へ取り付けて、進退手段５により前後方向（Ｙ軸方向）へ任意に移動する進退体６と、この進退体６に取り付けて移動手段７により左右方向（Ｘ軸方向）へ任意に移動する可動体８と、この可動体８へ昇降手段９により装着ヘッド１０を縦軸方向（Ｚ軸方向）へ昇降自在に係合させてあると共に、この装着ヘッド１０は、回転手段１１によりＺ軸方向を中心として回転自在としてあるもので、それぞれの手段５および７，９，１１は数値制御可能なサーボモータ等により高精度で作動される。
【００１８】
なお、この装着ヘッド１０は、電子部品ｂの上面を吸着する吸着パット式等が用いられるもので、４ヘッドあるいは６ヘッド等の複数個からなるヘッドに構成されているものであって、該装着ヘッド１０の下端部には吸着ノズル１０ａが取り付けられる。
【００１９】
また、供給部ｍにおいて、吸着ノズル１０ａにより吸着保持された電子部品ｂは、装着部ｎにおいてプリント基板ｃ上へ装着される前に、本体１の適所に設けた電子部品認識手段３５により認識された信号に基づいて、制御手段３４にあらかじめ入力されたデータとの演算処理によって、その吸着状態がＸＹ方向および所定の回転角が補正されている。
【００２１】
前記した電子部品供給機集合体２は、例えば、複数個のテープ式の電子部品供給機ｄからなるものであって、図１に示すように、電子部品装着装置Ａ本体１に対して固定状態に取り付けられる場合は、本体１の取付部２３へ着脱手段ｈにより着脱自在に載置される。
【００２２】
また、固定手段ｆにより着脱自在に設けられる場合は、電子部品供給機ｄが、図３および図４に示すように、複数個が並列した状態で、移動体２０の取付部２３へ着脱手段ｈにより着脱自在に載置されている。
【００２３】
なお、図４において、一方の電子部品供給機集合体２（Ｒ）は、本体１に対して移動体２０が離隔された状態で、他方の電子部品供給機集合体２は、本体１に対して取り付けられた状態を示す。
【００２４】
そして、前記した移動体２０は、図３および図４に示すように、下部に移動車輪２１を取り付けてハンドル２２の操作により移動自在としてあって、その横幅を電子部品装着装置Ａ本体１幅に見合う大きさに形成してある。
【００２５】
また、上部には、各部材の駆動用流体や電源の接続・離脱を行う着脱手段ｈに対応する取付部２３が設けられている。
【００２６】
この電子部品供給機ｄの取付部２３への取付にあって、前記着脱手段ｈは、図７に示すように、位置決め部材５０と取付部材５１とからなり、位置決め部材５０は、取付部２３に設けた受孔５２，５３へ電子部品供給機ｄの機枠２４に突設した係合子５４，５５を係脱自在に係合することで、その位置決めがなされるものであり、この受孔５２，５３は、取付部２３の幅方向に対して所定間隔で多数個配設してある。
【００２７】
また、取付部材５１は、機枠２４に軸支されている操作部材５６の作動により係止受け段部５７に係脱自在となる着脱部材５８を設けてあって、前記受孔５２，５３に係合子５４，５５が係合したとき、操作部材５６を操作して着脱部材５８により係止受け段部５７をクランプするものであり、ワンタッチの電子部品供給機ｄの着脱が行えるもので、取付部２３のどの受孔５２，５３の位置であっても同様の操作により行える。前記受孔５２，５３と前記係止受け段部５７とによって本発明でいう被係合部が構成され、前記係合子５４，５５と取付部材５１とによって本発明でいう係合部材が構成されている。
【００２８】
また、この電子部品供給機ｄの取付部２３への脱着に際して、コネクタとチャック５９により各部材の駆動用流体の接続・離脱が行なわれ、電気接続手段６０により電源や信号の接続・離脱が行なわれる。
【００２９】
なお、電子部品供給機ｄは、電子部品ｂを所定ピッチで多数収容してテープリールｇに巻き付けられたテーピング部材ｔを、機枠２４へ繰り出し自在に取り付けてある。
【００３０】
また、通常、移動体２０に対しての幅方向中央部付近に、最も装着頻度が高い電子部品ｂを供給する電子部品供給機ｄが取り付けられる。
【００３１】
前記した移動体２０の固定手段ｆは、まず、移動体２０を移動車輪２１の転動により電子部品装着装置Ａ本体１に対応させると、移動体２０に設けた転動子２５が本体１側に設けたガイド２６に沿って該本体１に隣接する。
【００３２】
すると、本体１側に設けた係合突体２７と移動体２０の前部に設けた受体２８の係合により、Ｘ軸（左右）方向の位置決めと固定がなされる。
【００３３】
次に、本体１側に設けた流体シリンダ等の操作部材２９によって繰り出される操作子３０が、本体１側に設けたローラ３１に当接することで、本体１側の一端部を軸支したクランプアーム３２を操作子３０が下方へ押える。
【００３４】
この下方押圧により、クランプアーム３２の傾斜当接面３２ａが移動体２０側に設けたピボットピン３３に当接して、移動体２０におけるＺ軸（縦軸）およびＹ軸（前後）方向の位置決めと固定がなされる。
【００３５】
前記した吸着ノズル保持体３は、電子部品供給機集合体２の適所へ、取付手段３９により着脱自在に取り付けるもので、この電子部品供給機集合体２に対して一個または複数個が設けられるものである。
【００３６】
なお、吸着ノズル１０ａは、装着される電子部品の種類に合わせて、吸着孔の内径や吸着先端形状が異なる種々のものが用意されている。
【００３７】
更に、この吸着ノズル保持体３にあって、図１１に示すように、複数個の吸着ノズル１０ａを保持収納し得る受部４０を設けた保持収納部材４１と、該保持収納部材４１に収納された吸着ノズル１０ａを係止させる覆体４２と、該覆体４２に連係させて該覆体４２による吸着ノズル１０ａへの係脱を電磁弁等４５等により自在に行う流体シリンダ等の移動手段４３と、この吸着ノズル保持体３を移動体２０に設けられた取付部２３に対して着脱自在とする取付手段３９とから構成される。
【００３８】
なお、受部４０は、一プリント基板ｃへの電子部品装着に必要な吸着ノズル１０ａの数以上が設けられており、また、覆体４２は、受部４０内の吸着ノズル１０ａの妄動を防止する。
【００３９】
取付手段３９は、例えば、図２に示すような、構成が用いられるもので、前記した着脱手段ｈと同様の構成で取付部２３を共用使用することが可能なものであって、共用される部材は着脱手段ｈの構成と同一符号を付して説明する。
【００４０】
この取付手段３９は、位置決め部材６１と取付部材６２とからなり、位置決め部材６１は、取付部２３に設けた受孔５２，５３へ吸着ノズル保持体３の基台６３に突設した係合子６４，６５を係脱自在に係合することで、その位置決めがなされるものであり、この受孔５２，５３は、取付部２３の幅方向に対して所定間隔で多数個配設してある。
【００４１】
また、取付部材６２は、基台６３に軸支されている操作部材６６の作動により係止受け段部６７に係脱自在となる着脱部材６８を設けてあって、前記受孔５２，５３に係合子６４，６５が係合したとき、操作部材６６を操作して着脱部材６８により係止受け段部６７をクランプするものであり、ワンタッチで吸着ノズル保持体３の着脱が行えるもので、取付部２３のどの受孔５２，５３の位置であっても同様の操作により行える。前記受孔５２，５３と係止受け段部６７とによって本発明でいう被係合部が構成され、前記係合子６４，６５と取付部材６２とによって本発明でいう係合部材が構成されている。
【００４２】
前記した制御手段３４は、吸着ノズル保持体３および前記したそれぞれの手段５および７，９，１１等に連係させて、吸着ノズル１０ａのＸ，Ｙ，Ｚ軸位置（前後左右および上下位置）およびＺ軸を中心とする回転角度を制御したり、画像の処理を行うもので、記憶部や演算部等を備えた慣用のコンピュータが用いられるものであって、部品装着に必要なプログラムがあらかじめ入力されている。
【００４３】
したがって、前記のように構成される本発明実施例の電子部品装着装置Ａは、電子部品供給機集合体２が電子部品装着装置Ａにおける本体１の取付部２３へ固定状態で取り付けられていて、この電子部品供給機集合体２に吸着ノズル保持体３が設けられている。
【００４４】
そして、図８あるいは図９に示すように、該吸着ノズル保持体３の吸着ノズル１０ａの交換点（１）と、この吸着ノズル１０ａによる電子部品ｂの吸着点（２）との装着ヘッド１０の移動距離が、最短となる位置にこの吸着ノズル保持体３が取り付けられている。
【００４５】
そのため、吸着ノズル１０ａの交換にあっては、装着ヘッド１０は吸着ノズル保持体３へ移動し、所定の吸着ノズル１０ａを受け取った後、装着部ｎのプリント基板ｃ上へ移動して所定の装着点（３）において装着が行われる。
【００４６】
このとき、装着ヘッド１０の移動経路は、図８に示すように、動きの無駄が少ない最短経路を取ることとなるので、これにより、電子部品ｂの装着時間が可及的に短縮される。
【００４７】
そして、この最短経路は、制御手段３４へあらかじめ入力された各種のデータやプログラムによって演算されて、逐次その処理信号が装着ヘッド１０等に与えられる。
【００４８】
この電子部品供給機集合体２に設けられた吸着ノズル保持体３は、該電子部品供給機集合体２が本体１に対してその前後に取り付けられている場合は、図１，図８に示すように、それぞれの電子部品供給機集合体２にそれぞれ備えさせることが好ましい。
【００４９】
また、吸着ノズル保持体３は、図９に示すように、取付手段３９により電子部品供給機集合体２に対して任意の位置に移動取り付けができるもので、電子部品供給機ｄの取付状態や条件等に合わせて適宜移動調整する。
【００５０】
次に、電子部品供給機集合体２が電子部品装着装置Ａの本体１に対して着脱自在に設けられる場合は、図３に示すように、移動体２０に電子部品供給機ｄを多数個載置して電子部品供給機集合体２を構成する。
【００５１】
この場合も同様に、吸着ノズル保持体３が取付手段３９により電子部品供給機集合体２（移動体２０）に対して着脱自在に設けられるものであり、その取付位置も、電子部品供給機集合体２（移動体２０）の幅方向に対して任意位置に取り付けることができるものであって、前記した固定式と同様の作用，効果を発揮することができる。
【００５２】
また、この複数個の電子部品供給機集合体２は、図１０（ａ）に示すように、全て電子部品装着装置Ａの本体１へ固定する場合、図１０（ｂ）に示すように、全て電子部品装着装置Ａの本体１へ着脱自在とする場合、図１０（ｃ），（ｄ）に示すように、一部を電子部品装着装置Ａの本体１へ固定し、他のものを電子部品装着装置Ａの本体１へ着脱自在とする場合等の電子部品ｂの装着処理に合わせて任意な組み合わせが可能である。
【００５３】
更に、本発明実施例方法にあって、電子部品供給機集合体２に取り付けられる電子部品供給機ｄと吸着ノズル保持体３とは、移動体２０における取付部２３に対して、それぞれ任意位置に設置することができるものである。
【００５４】
したがって、プリント基板ｃへ装着する電子部品ｂの種類や必要個数等の装着条件に基づいて、あらかじめ取付部２３に対する電子部品供給機ｄと吸着ノズル保持体３とのそれぞれの取付位置を算出することで、装着ヘッド１０のより最適な移動経路を得ることができる。
【００５５】
この場合、必ずしも、吸着ノズル保持体３を、取付部２３に取り付けられた電子部品供給機ｄに対応して、その取付位置の選定するだけではなく、取付部２３に取り付けられた吸着ノズル保持体３に対応して、電子部品供給機ｄの取付位置を選定しても良い。
【００５６】
更に、電子部品供給機ｄと吸着ノズル保持体３との相対的な最も装着効率の良い取付位置を、該電子部品供給機ｄと吸着ノズル保持体３それぞれに対して設定し得るもので、電子部品認識手段３５の取付位置と、プリント基板ｃにおける電子部品ｂの装着点との算出によっても行われる。
【００５７】
また、取付部２３に対する吸着ノズル保持体３の取付手段３９は、電子部品供給機ｄの着脱手段ｈと共用使用することはもちろんのこと、電子部品認識手段３５もこの取付部２３を共用して取付手段３９により着脱自在とすれば、電子部品認識手段３５の着脱用の特別な手段が不要となって、構成がコンパクトになり製造コストを一層軽減させることができると共に、取付部２３に対する前記電子部品供給機ｄ，電子部品認識手段３，電子部品認識手段３５の総合的で連係的な取付位置の算出の基に各ｄ，３，３５の理想的な取り付けが行える。
【００５８】
【発明の効果】
前述したように本願に係る発明は、機体に、基板を移送する移送部材を設けるとともに、この移送部材の側方に位置するように複数の電子部品供給機からなる電子部品供給機集合体を設け、この電子部品供給機集合体から電子部品を運び基板に実装する装着ヘッドと、この装着ヘッドに装着する吸着ノズルを保持する吸着ノズル保持体とを備えた電子部品装着装置であって、
前記機体における前記移送部材の側方の部位と、この部位に着脱可能に構成された移動体とのうち少なくとも一方に、複数の電子部品供給機を取り付ける取付部を設け、
この取付部に、前記電子部品供給機を着脱手段によって着脱自在に載置させるとともに、前記吸着ノズル保持体を取付手段によって着脱自在に取り付けてなり、
前記着脱手段は、前記電子部品供給機に設けられた係合部材と、基板移送方向の位置決めされた複数位置において前記係合部材が係合するように前記取付部に設けられた被係合部とによって構成し、
前記取付手段は、前記被係合部と、前記吸着ノズル保持体に前記被係合部に係合するように設けられた係合部材とによって構成し、
前記複数の取付部に対し、前記複数の電子部品供給機をそれぞれ取り付けるとともに、電子部品供給機が取付けられていない空きスペースに前記吸着ノズル保持体を取り付けたことにより、吸着ノズル保持体から電子部品供給機へ装着ヘッドの移動経路が効率の良い経路の選択ができて、移動距離の短縮に伴って電子部品の装着時間が短縮される。
【００５９】
また、この吸着ノズル保持体は、電子部品装着装置における本体から離隔されるため、吸着ノズル保持体の保守や調整作業はもちろんのこと、他の装着ヘッドや基板搬送部および部品供給部等の保守・点検等の頻繁に行われる作業時であっても、該吸着ノズル保持体が邪魔となることがなく、その作業が円滑に行われ、主たる電子部品装着処理に支障を来すことがない。
【００６０】
更に、吸着ノズル保持体は、その取り付けに大きな領域が占領されることがないので、装置全体をコンパクトに形成することができる。
【００６１】
あらかじめ、電子部品供給機集合体へ、電子部品供給機とこの電子部品を吸着する吸着ノズルを収容した吸着ノズル保持体とを一セットにしておけば、これらを一括して電子部品装着装置本体へ取り付けることができるので、装着準備の段取り性が向上する。
【００６２】
また、取付部に対する吸着ノズル保持体の取付手段は、電子部品供給機の着脱手段と共用使用することにより、吸着ノズル保持体の着脱用の特別な手段が不要となって、構成がコンパクトになり製造コストを軽減させることができる。
等の格別な効果を奏するものである。
【図面の簡単な説明】
【図１】本発明に関する電子部品装着装置の一実施例を示す概略の平面図で、電子部品供給機集合体が本体に対して固定状態の例を示す。
【図２】図１における電子部品装着装置の吸着ノズル保持体を示す説明図である。
【図３】本発明に関する電子部品装着装置の一実施例における可動式の電子部品供給機集合体を示す斜視図である。
【図４】図３における電子部品供給機集合体を用いた電子部品装着装置の一実施例を示す概略の平面図である。
【図５】図３における電子部品供給機集合体の取付前を示す説明図である。
【図６】図３における電子部品供給機集合体の取付後を示す説明図である。
【図７】図１および図３における電子部品供給機の着脱手段を示す説明図である。
【図８】図１および図３における電子部品装着装置の装着状態を示す概略の平面図である。
【図９】図１および図３における電子部品装着装置の他の装着状態を示す概略の平面図である。
【図１０】図１および図３における電子部品供給機集合体の本体への取付パターンの各例を示す説明図である。
【図１１】図１および図３における電子部品装着装置の流着ノズルの他の例を示す概略的な斜視図である。
【図１２】従来の電子部品装着装置による電子部品装着状態を示す説明図である。
【符号の説明】
Ａ電子部品装着装置
ｂ電子部品
ｃ基板
ｄ電子部品供給機
ｆ固定手段
ｈ着脱手段
１本体
２電子部品供給機集合体
３吸着ノズル保持体
１０装着ヘッド
１０ａ吸着ノズル
３９取付手段
４０受部
４１保持収納部材
４２覆体
４３移動部材[0001]
[Industrial application fields]
The present invention relates to an electronic component mounting apparatus and method that can increase the efficiency of preliminary mounting preparation and shorten the mounting time of electronic components when mounting electronic components on a substrate.
[0002]
[Prior art]
In the industry where electronic parts such as chip parts and IC parts are mounted on a printed circuit board, the processing is generally continuously automated. In addition, a plurality of types of electronic devices are used for printed circuit boards. The part is mounted by a suction nozzle.
[0003]
Each time the type of the electronic component changes, a suction nozzle that picks up the electronic component is selected according to the selected type, and is replaced and attached to the mounting head.
[0004]
Therefore, a large number of suction nozzles are prepared in advance in a nozzle changer or the like according to the type of electronic component to which various types having different suction hole inner diameters and suction tip shapes are mounted.
[0005]
However, as shown in FIG. 12, the nozzle changer 80 has, for example, an electronic component b supply unit m and a printed circuit board c transport unit (mounting unit) n at a predetermined position of the electronic component mounting apparatus 81. Arranged in a fixed state.
[0006]
In addition, since the nozzle changer 80 is fixed in a relatively complicated and narrow place of the electronic component mounting apparatus, not only maintenance and installation replacement work of the nozzle changer 80, but also a mounting head, a substrate transfer unit, During frequent operations such as maintenance / inspection of the component supply unit, the nozzle changer 80 is obstructed and a great deal of time is spent, which hinders the main electronic component mounting process.
[0007]
Furthermore, the fixed nozzle changer occupies a large area for installation, and the entire apparatus becomes large. Etc. have various problems.
[0008]
Therefore, in FIG. 12A, as indicated by the arrow p of the movement path, depending on the position of the supply unit m that accommodates the electronic component b, the suction nozzle 83 is temporarily moved to the nozzle exchanger 80 to be replaced. The suction nozzle 83 straddles the mounting portion n and temporarily moves to the supply portion m provided at a position far from the nozzle exchanger 80 to suck and hold the desired electronic component b, and then to the printed circuit board c. This requires a large movement distance for returning and mounting, and this has a drawback that the mounting time of the electronic component becomes long.
[0009]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described problems, and provides an electronic component mounting apparatus and method for reducing the mounting time of an electronic component by shortening the moving path of the mounting head as much as possible. It is intended to provide.
[0010]
[Means for Solving the Problems]
The means of the present invention for achieving the above-described object is to provide an electronic component feeder comprising a plurality of electronic component feeders so as to be provided on a side of the transport member, and a transport member for transporting the substrate. An electronic component mounting apparatus provided with an assembly, a mounting head that carries electronic components from the electronic component feeder assembly and mounts them on a substrate, and a suction nozzle holder that holds suction nozzles mounted on the mounting head. And
And the site of the side of the transfer member in the machine body, to at least one of a moving body that is detachably attached to this site, a mounting portion for mounting a plurality of electronic components feeder provided,
The electronic component feeder is detachably mounted on the attachment portion by an attachment / detachment means, and the suction nozzle holding body is detachably attached by the attachment means,
The attachment / detachment means includes an engagement member provided in the electronic component feeder and an engaged portion provided in the attachment portion so that the engagement member engages at a plurality of positions positioned in the substrate transfer direction. And composed by
The attachment means includes the engaged portion and an engagement member provided on the suction nozzle holding body so as to engage with the engaged portion,
The plurality of electronic component feeders are respectively attached to the plurality of attachment portions, and the electronic component mounting apparatus is configured such that the suction nozzle holder is attached to an empty space where the electronic component feeder is not attached.
[0011]
An electronic component mounting apparatus according to a second aspect of the present invention is the electronic component mounting apparatus according to the first aspect, wherein the suction nozzle holding body includes a plurality of suction nozzles in a state of being attached to the mounting portion. A receiving portion is provided that holds the substrates arranged in one or two rows in a direction orthogonal to the substrate transfer direction.
An electronic component mounting apparatus according to a third aspect of the present invention is the electronic component mounting apparatus according to the first or second aspect, wherein the attachment portion is provided on both sides of the transfer member. .
[0012]
An electronic component mounting apparatus according to a fourth aspect of the present invention is the electronic component mounting apparatus according to any one of the first to third aspects, wherein the engaged portion is a substrate mounted on the mounting portion. The engaging member is composed of a large number of receiving holes provided at predetermined intervals in the transfer direction, and a locking receiving step portion provided in the mounting portion. The engaging member includes the electronic component feeder, the suction nozzle holder, and the like. And an engaging member provided to be detachably engaged with the receiving hole, and the electronic component feeder and the suction nozzle holder to be detachably engaged with the latch receiving step portion. The electronic component feeder and the suction nozzle holder are attached to the mounting portion in common with the receiving hole and the locking receiving stepped portion.
[0013]
An electronic component mounting method according to a fifth aspect of the present invention is an electronic component mounting method using the electronic component mounting device according to the first aspect, and corresponds to an intermediate portion in the substrate transfer direction among the plurality of positions. After the suction nozzle of the suction nozzle holder provided at the position is attached to the mounting head, the electronic component of the electronic component feeder is sucked by the mounting head, and then the mounting head is moved to the mounting portion where the substrate is located. it carried out by mounting the electronic components on a substrate.
[0014]
【Example】
Next, an embodiment of the electronic component mounting apparatus and method according to the present invention will be described with reference to the drawings.
[0015]
1, FIG. 2 and FIG. 7 to FIG. 9A, A indicates that an electronic component b such as a chip component or an IC component is received from the supply unit m, transferred to the mounting unit n, and mounted at a predetermined position on the printed circuit board c. An electronic component mounting apparatus that basically includes a main body 1, an electronic component feeder assembly 2, and a suction nozzle holder 3.
[0016]
In the electronic component mounting apparatus A described above, in the body 4 of the main body 1, the supply part m of the electronic component b waiting in the electronic component supply machine d such as a tape type or a tray type is provided on one side or both sides thereof. A mounting portion n in which the printed circuit board c is carried in and out by the transfer member e in the machine body 4 is provided.
[0017]
The configuration of the electronic component mounting apparatus A described above is as shown in FIGS. 1 and 2, which is attached to the machine body 4 in the main body 1 and is moved forward and backward by the forward / backward means 5 and arbitrarily moved in the front-rear direction (Y-axis direction). 6, a movable body 8 that is attached to the advancing / retracting body 6 and arbitrarily moves in the left-right direction (X-axis direction) by the moving means 7, and the mounting head 10 is moved vertically to the movable body 8 by the lifting / lowering means 9 The mounting head 10 is freely rotatable about the Z-axis direction by a rotating means 11, and each means 5, 7, 9, and 11 can be numerically controlled. It is operated with high accuracy by a simple servo motor.
[0018]
The mounting head 10 uses a suction pad type that sucks the upper surface of the electronic component b, and is constituted by a plurality of heads such as four or six heads. A suction nozzle 10 a is attached to the lower end of the head 10.
[0019]
In addition, the electronic component b sucked and held by the suction nozzle 10a in the supply unit m is recognized by the electronic component recognition means 35 provided at a proper position of the main body 1 before being mounted on the printed circuit board c in the mounting portion n. Based on the received signal, the suction state is corrected in the XY direction and the predetermined rotation angle by a calculation process with data input in advance to the control means 34.
[0021]
The electronic component feeder assembly 2 described above includes, for example, a plurality of tape-type electronic component feeders d , and is fixed to the electronic component mounting apparatus A main body 1 as shown in FIG. Is attached to the attachment portion 23 of the main body 1 detachably by the attaching / detaching means h.
[0022]
Further, when the electronic component feeder d is provided so as to be detachable by the fixing means f, as shown in FIGS. Is detachably mounted.
[0023]
In FIG. 4, one electronic component supplier assembly 2 (R) is in a state where the moving body 20 is separated from the main body 1, and the other electronic component supplier assembly 2 is connected to the main body 1. The attached state is shown.
[0024]
As shown in FIGS. 3 and 4, the moving body 20 has a moving wheel 21 attached to the lower portion and can be moved by operating the handle 22, and its lateral width is set to the width of the electronic component mounting apparatus A main body 1. It is formed in a suitable size.
[0025]
In addition, an attachment portion 23 corresponding to attachment / detachment means h for connecting / disconnecting the driving fluid and power supply of each member is provided on the upper portion.
[0026]
As shown in FIG. 7, the attachment / detachment means h includes a positioning member 50 and an attachment member 51, and the positioning member 50 is attached to the attachment portion 23. The engaging holes 54 and 55 projecting from the machine frame 24 of the electronic component feeder d are removably engaged with the receiving holes 52 and 53 provided so that the positioning can be performed. , 53 are arranged at a predetermined interval in the width direction of the mounting portion 23.
[0027]
The mounting member 51 is provided with a detachable member 58 that can be freely engaged with and disengaged from the latch receiving stepped portion 57 by the operation of the operation member 56 that is pivotally supported by the machine frame 24. When the engaging elements 54 and 55 are engaged, the operation member 56 is operated to clamp the latch receiving stepped portion 57 by the detachable member 58, and the one-touch electronic component feeder d can be attached and detached. Any position of the receiving holes 52 and 53 of the portion 23 can be performed by the same operation. The receiving holes 52 and 53 and the locking receiving step 57 constitute an engaged portion referred to in the present invention, and the engaging members 54 and 55 and the mounting member 51 constitute an engaging member referred to in the present invention. ing.
[0028]
Further, when the electronic component feeder d is attached to and detached from the mounting portion 23, the drive fluid of each member is connected / disconnected by the connector and the chuck 59, and the power supply / signal is connected / disconnected by the electrical connecting means 60. It is.
[0029]
The electronic component feeder d has a taping member t, which accommodates a large number of electronic components b at a predetermined pitch and is wound around a tape reel g, attached to the machine frame 24 so as to be freely drawn out.
[0030]
Further, an electronic component feeder d that supplies the electronic component b having the highest mounting frequency is usually attached near the center in the width direction with respect to the moving body 20.
[0031]
First, when the moving body 20 is caused to correspond to the electronic component mounting apparatus A main body 1 by rolling of the moving wheel 21, the rolling element 25 provided on the moving body 20 moves the main body 1 side. It is adjacent to the main body 1 along a guide 26 provided on the main body 1.
[0032]
Then, the positioning and fixing in the X-axis (left-right) direction are performed by the engagement of the engaging protrusion 27 provided on the main body 1 side and the receiving body 28 provided on the front portion of the moving body 20.
[0033]
Next, a clamp arm that pivotally supports one end portion on the main body 1 side by abutting a roller 31 provided on the main body 1 side with a manipulator 30 that is fed out by an operation member 29 such as a fluid cylinder provided on the main body 1 side. The operator 30 presses 32 downward.
[0034]
By this downward pressing, the inclined contact surface 32a of the clamp arm 32 comes into contact with the pivot pin 33 provided on the moving body 20 side, and positioning of the moving body 20 in the Z-axis (vertical axis) and Y-axis (front-rear) directions is performed. Fixed.
[0035]
The suction nozzle holder 3 described above is detachably attached to an appropriate position of the electronic component feeder assembly 2 by an attachment means 39, and one or more are provided for the electronic component feeder assembly 2 It is.
[0036]
Various suction nozzles 10a having different suction hole inner diameters and suction tip shapes are prepared in accordance with the type of electronic component to be mounted.
[0037]
Furthermore, in this suction nozzle holder 3, as shown in FIG. 11, a holding storage member 41 provided with a receiving portion 40 capable of holding and storing a plurality of suction nozzles 10a, and the holding storage member 41. A cover 42 that locks the suction nozzle 10a, and a moving means 43 such as a fluid cylinder that is linked to the cover 42 and freely engages / disengages the suction nozzle 10a by the solenoid valve 45 or the like. And attachment means 39 for making the suction nozzle holding body 3 detachable with respect to the attachment portion 23 provided on the moving body 20.
[0038]
In addition, the receiving part 40 is provided with more than the number of suction nozzles 10a necessary for mounting electronic components on one printed circuit board c, and the cover 42 prevents the suction nozzle 10a in the receiving part 40 from being loosened. To do.
[0039]
For example, the attachment means 39 is configured as shown in FIG. 2, and the attachment portion 23 can be shared and used in the same configuration as the above-described attachment / detachment means h. The members will be described with the same reference numerals as those of the attaching / detaching means h.
[0040]
The attachment means 39 includes a positioning member 61 and an attachment member 62, and the positioning member 61 is an engaging member 64 that projects from the base 63 of the suction nozzle holder 3 in the receiving holes 52 and 53 provided in the attachment portion 23. , 65 are detachably engaged with each other, and the positioning is made. A large number of the receiving holes 52, 53 are arranged at predetermined intervals in the width direction of the mounting portion 23.
[0041]
The attachment member 62 is provided with a detachable member 68 that can be freely engaged with and disengaged from the latch receiving step portion 67 by the operation of the operation member 66 pivotally supported by the base 63. When the engaging elements 64 and 65 are engaged, the operation member 66 is operated to clamp the locking receiving stepped portion 67 by the attaching / detaching member 68, and the suction nozzle holder 3 can be attached and detached with one touch. Any position of the receiving holes 52 and 53 of the portion 23 can be performed by the same operation. The receiving holes 52 and 53 and the locking receiving step portion 67 constitute an engaged portion referred to in the present invention, and the engaging members 64 and 65 and the mounting member 62 constitute an engaging member referred to in the present invention. Yes.
[0042]
The control means 34 described above is linked to the suction nozzle holding body 3 and the respective means 5, 7, 9, 11, etc., and the X, Y, Z axis positions (front and rear, right and left and up and down positions) of the suction nozzle 10a and Controls the rotation angle around the Z axis and performs image processing. A conventional computer equipped with a storage unit, arithmetic unit, etc. is used, and programs necessary for component mounting are input in advance. Has been.
[0043]
Therefore, in the electronic component mounting apparatus A according to the embodiment of the present invention configured as described above, the electronic component feeder assembly 2 is fixedly attached to the mounting portion 23 of the main body 1 in the electronic component mounting apparatus A. A suction nozzle holder 3 is provided in the electronic component feeder assembly 2.
[0044]
Then, as shown in FIG. 8 or FIG. 9, the mounting head 10 is connected to the replacement point (1) of the suction nozzle 10a of the suction nozzle holder 3 and the suction point (2) of the electronic component b by the suction nozzle 10a. The suction nozzle holder 3 is attached at a position where the moving distance is the shortest.
[0045]
Therefore, when replacing the suction nozzle 10a, the mounting head 10 moves to the suction nozzle holder 3, receives the predetermined suction nozzle 10a, and then moves onto the printed circuit board c of the mounting portion n to perform the predetermined mounting. Mounting is performed at point (3) .
[0046]
At this time, as shown in FIG. 8, the moving path of the mounting head 10 is the shortest path with less waste of movement, so that the mounting time of the electronic component b is shortened as much as possible.
[0047]
The shortest path is calculated by various data and programs input in advance to the control means 34, and the processing signal is sequentially given to the mounting head 10 and the like.
[0048]
The suction nozzle holder 3 provided in the electronic component feeder assembly 2 is shown in FIGS. 1 and 8 when the electronic component feeder assembly 2 is attached to the main body 1 before and after. As described above, it is preferable that each electronic component feeder assembly 2 is provided.
[0049]
Further, as shown in FIG. 9, the suction nozzle holder 3 can be moved and attached to an arbitrary position with respect to the electronic component feeder assembly 2 by the attaching means 39. Move and adjust appropriately according to the conditions.
[0050]
Next, when the electronic component feeder assembly 2 is detachably provided to the main body 1 of the electronic component mounting apparatus A, a large number of electronic component feeders d are mounted on the moving body 20 as shown in FIG. The electronic component feeder assembly 2 is configured.
[0051]
Similarly, in this case, the suction nozzle holding body 3 is detachably provided to the electronic component feeder assembly 2 (moving body 20) by the attachment means 39, and the attachment position thereof is also the electronic component feeder assembly. It can be attached at an arbitrary position with respect to the width direction of the body 2 (moving body 20), and can exhibit the same operations and effects as the fixed type described above.
[0052]
Further, when all of the plurality of electronic component feeder assemblies 2 are fixed to the main body 1 of the electronic component mounting apparatus A as shown in FIG. 10A, as shown in FIG. When making it detachable from the main body 1 of the electronic component mounting apparatus A, as shown in FIGS. 10C and 10D, a part is fixed to the main body 1 of the electronic component mounting apparatus A, and the others are electronic components. Arbitrary combinations are possible according to the mounting process of the electronic component b in the case where the mounting apparatus A is detachable from the main body 1.
[0053]
Further, in the method according to the embodiment of the present invention, the electronic component feeder d and the suction nozzle holder 3 attached to the electronic component feeder assembly 2 are respectively located at arbitrary positions with respect to the attachment portion 23 of the moving body 20. It can be installed.
[0054]
Accordingly, the respective attachment positions of the electronic component feeder d and the suction nozzle holder 3 with respect to the attachment portion 23 are calculated in advance based on the attachment conditions such as the type and required number of electronic components b to be attached to the printed circuit board c. Thus, a more optimal movement path of the mounting head 10 can be obtained.
[0055]
In this case, the suction nozzle holder 3 is not necessarily selected according to the electronic component feeder d attached to the attachment portion 23, but the suction nozzle holder 3 attached to the attachment portion 23 is selected. 3, the attachment position of the electronic component feeder d may be selected.
[0056]
Further, the mounting position with the highest relative mounting efficiency between the electronic component feeder d and the suction nozzle holder 3 can be set for each of the electronic component feeder d and the suction nozzle holder 3. This is also performed by calculating the mounting position of the component recognition means 35 and the mounting point of the electronic component b on the printed circuit board c.
[0057]
Further, the attachment means 39 of the suction nozzle holder 3 with respect to the attachment portion 23 is used in common with the attachment / detachment means h of the electronic component feeder d, and the electronic component recognition means 35 also shares this attachment portion 23. If the attachment means 39 is detachable, a special means for attaching and detaching the electronic component recognition means 35 is not required, the configuration can be made compact and the manufacturing cost can be further reduced, and the electronic device with respect to the attachment portion 23 can be reduced. Based on the comprehensive and coordinated calculation of the mounting positions of the component feeder d, the electronic component recognizing means 3 and the electronic component recognizing means 35, each d, 3, 35 can be ideally mounted.
[0058]
【The invention's effect】
As described above, in the invention according to the present application, the airframe is provided with a transfer member for transferring a substrate, and an electronic component feeder assembly composed of a plurality of electronic component supply machines is provided on the side of the transfer member. An electronic component mounting apparatus comprising a mounting head for carrying electronic components from the electronic component feeder assembly and mounting the electronic components on a substrate, and a suction nozzle holder for holding a suction nozzle mounted on the mounting head,
And the site of the side of the transfer member in the machine body, to at least one of a moving body that is detachably attached to this site, a mounting portion for mounting a plurality of electronic components feeder provided,
The electronic component feeder is detachably mounted on the attachment portion by an attachment / detachment means, and the suction nozzle holding body is detachably attached by the attachment means,
The attachment / detachment means includes an engagement member provided in the electronic component feeder and an engaged portion provided in the attachment portion so that the engagement member engages at a plurality of positions positioned in the substrate transfer direction. And composed by
The attachment means includes the engaged portion and an engagement member provided on the suction nozzle holding body so as to engage with the engaged portion,
The plurality of electronic component feeders are attached to the plurality of attachment portions, respectively, and the suction nozzle holder is attached to an empty space where the electronic component feeder is not attached. An efficient route for moving the mounting head to the feeder can be selected, and the mounting time of the electronic component is shortened as the moving distance is shortened.
[0059]
In addition, since the suction nozzle holder is separated from the main body of the electronic component mounting apparatus, not only maintenance and adjustment work of the suction nozzle holder but also maintenance of other mounting heads, substrate transport units, component supply units, etc. Even when the work is frequently performed such as inspection, the suction nozzle holder does not get in the way, the work is performed smoothly, and the main electronic component mounting process is not hindered.
[0060]
Furthermore, since the suction nozzle holder does not occupy a large area for attachment, the entire apparatus can be formed compactly.
[0061]
If the electronic component feeder and the suction nozzle holder that contains the suction nozzle that sucks the electronic component are set in advance to the electronic component feeder assembly, these are collectively put into the electronic component mounting device main body. Since it can be attached, the setup of the preparation for installation is improved.
[0062]
In addition, the attachment means for attaching the suction nozzle holder to the attachment portion is used in common with the attachment / detachment means for the electronic component feeder, so that no special means for attaching / detaching the suction nozzle holder is required, resulting in a compact configuration. Manufacturing cost can be reduced.
It has a special effect such as.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing an embodiment of an electronic component mounting apparatus according to the present invention, showing an example in which an electronic component feeder assembly is fixed to a main body.
2 is an explanatory view showing a suction nozzle holder of the electronic component mounting apparatus in FIG. 1; FIG.
FIG. 3 is a perspective view showing a movable electronic component feeder assembly in one embodiment of the electronic component mounting apparatus according to the present invention.
4 is a schematic plan view showing an embodiment of an electronic component mounting apparatus using the electronic component feeder assembly in FIG. 3. FIG.
FIG. 5 is an explanatory view showing the state before the electronic component feeder assembly shown in FIG. 3 is attached.
6 is an explanatory view showing a state after attachment of the electronic component feeder assembly in FIG. 3; FIG.
7 is an explanatory view showing an attaching / detaching means for the electronic component feeder in FIGS. 1 and 3. FIG.
8 is a schematic plan view showing a mounting state of the electronic component mounting apparatus in FIGS. 1 and 3. FIG.
9 is a schematic plan view showing another mounting state of the electronic component mounting apparatus in FIGS. 1 and 3. FIG.
10 is an explanatory view showing each example of an attachment pattern to the main body of the electronic component feeder assembly in FIGS. 1 and 3. FIG.
11 is a schematic perspective view showing another example of a casting nozzle of the electronic component mounting apparatus in FIGS. 1 and 3. FIG.
FIG. 12 is an explanatory view showing an electronic component mounting state by a conventional electronic component mounting apparatus.
[Explanation of symbols]
A Electronic component mounting apparatus b Electronic component c Substrate d Electronic component feeder f Fixing means h Detaching means 1 Main body 2 Electronic component feeder assembly 3 Suction nozzle holder 10 Mounting head 10a Suction nozzle 39 Mounting means 40 Receiving portion 41 Holding storage Member 42 Cover 43 Moving member

Claims

The machine body is provided with a transfer member for transferring the substrate, and an electronic component supply machine assembly including a plurality of electronic component supply machines is provided so as to be located on the side of the transfer member. An electronic component mounting apparatus including a mounting head for carrying components and mounting on a substrate, and a suction nozzle holder for holding a suction nozzle to be mounted on the mounting head,
And the site of the side of the transfer member in the machine body, to at least one of a moving body that is detachably attached to this site, a mounting portion for mounting a plurality of electronic components feeder provided,
The electronic component feeder is detachably mounted on the attachment portion by an attachment / detachment means, and the suction nozzle holding body is detachably attached by the attachment means,
The attachment / detachment means includes an engagement member provided in the electronic component feeder and an engaged portion provided in the attachment portion so that the engagement member engages at a plurality of positions positioned in the substrate transfer direction. And composed by
The attachment means includes the engaged portion and an engagement member provided on the suction nozzle holding body so as to engage with the engaged portion,
An electronic component mounting apparatus, wherein the plurality of electronic component feeders are respectively attached to the plurality of attachment portions, and the suction nozzle holder is attached to an empty space where the electronic component feeder is not attached.

2. The electronic component mounting apparatus according to claim 1, wherein the suction nozzle holder is attached to the attachment portion so that the plurality of suction nozzles are arranged in one or two rows in a direction orthogonal to the substrate transfer direction. An electronic component mounting apparatus comprising: a receiving portion that holds side by side.

3. The electronic component mounting apparatus according to claim 1, wherein the attachment portion is provided on both sides of the transfer member. 4.

4. The electronic component mounting apparatus according to claim 1, wherein the engaged portion includes a plurality of receiving holes provided in the mounting portion at predetermined intervals in a substrate transfer direction. And a latch receiving step provided in the mounting portion,
The engaging member includes an engaging element that is detachably engaged with the receiving hole in the electronic component feeder and the suction nozzle holder, and the electronic component feeder and the suction nozzle holder. And a detachable member provided so as to be detachably engaged with the latch receiving step portion.
The electronic component mounting apparatus, wherein the electronic component feeder and the suction nozzle holder are attached to an attachment portion using the receiving hole and the latch receiving step portion in common.

2. An electronic component mounting method using the electronic component mounting apparatus according to claim 1, wherein a suction nozzle of a suction nozzle holder provided at a position corresponding to an intermediate portion in the substrate transfer direction among the plurality of positions is used as a mounting head. After mounting, the electronic component of the electronic component feeder is adsorbed by a mounting head, and then the electronic component is mounted on the substrate by moving the mounting head to a mounting portion where the substrate is located Method.