JP3900249B2 - Wiring board connection method, electro-optical device, manufacturing method thereof, and electronic apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wiring board connection method, an electro-optical device, a manufacturing method thereof, and an electronic apparatus.
[0002]
BACKGROUND OF THE INVENTION
In manufacturing an electro-optical device, substrates on which wirings are formed are electrically connected to each other. The electro-optical device includes a display device such as a liquid crystal device or an electroluminescence display device. In connecting the substrates, it is important to align the two with high accuracy as the number of terminals and the narrow pitch of the wiring in recent years progress.
[0003]
Connection between the substrates is performed via an adhesive. Specifically, an adhesive is provided between both substrates, and energy such as heat that develops an adhesive force is applied to the adhesive.
[0004]
However, in general, an adhesive causes a decrease in viscosity in the process of developing an adhesive force, so that the substrate may slip during bonding and cause a positional shift. In addition, the surface of the tool that pressurizes the substrate may be tilted. For example, one end of the substrate is first bonded and fixed at an appropriate position, and the other end is greatly displaced due to thermal expansion of the substrate. In some cases, the adhesive was fixed.
[0005]
By the way, in order to bond the substrates at appropriate positions, it is premised that the substrates are aligned with high accuracy. However, in the conventional alignment, the alignment is performed so that the alignment marks at both ends of the substrate overlap with each other. Therefore, the alignment cannot be properly performed when the alignment mark itself is displaced due to a dimensional change of the substrate.
[0006]
SUMMARY An advantage of some aspects of the invention is to provide a wiring board connection method, an electro-optical device, a manufacturing method thereof, and an electronic apparatus that can connect terminals of the board at accurate positions. It is to provide.
[0007]
[Means for Solving the Problems]
(1) In the wiring board connection method according to the present invention, (a) an adhesive is provided on at least one of the first and second substrates on which a wiring pattern having a plurality of terminals is formed,
(B) aligning the first and second substrates, and superimposing the plurality of terminals of the first substrate and the plurality of terminals of the second substrate via an adhesive;
(C) reacting the adhesive so as to start curing at least in a first portion located in a central portion in the arrangement direction of the plurality of terminals on which the first and second substrates are overlapped; Fixing the first and second substrates so as not to shift;
(D) The adhesive is cured at the first portion and the second portions on both sides of the first portion to electrically connect the first and second substrates.
[0008]
According to the present invention, the curing reaction of the first portion of the adhesive is started and fixed so that the first and second substrates do not shift. Therefore, when the first and second substrates are electrically connected, it is possible to prevent the first and second substrates from slipping and causing displacement. Moreover, since the 1st part of an adhesive agent is located in the center part of the arrangement | sequence direction of the several overlapped terminal, the dimensional change by expansion | swelling etc. of each board | substrate can be equally distributed right and left. For this reason, the range of positional deviation between the terminals can be minimized.
[0009]
(2) In this wiring board connection method,
In the step (c),
The width of the first portion may be about 1/3 of the width of the first and second portions.
[0010]
(3) In this wiring board connection method,
In the step (c),
The curing reaction rate of the first portion may be about 10 to 50%.
[0011]
(4) In this wiring board connection method,
In the step (c),
The curing reaction rate of the first part may be about 20% or more higher than the curing reaction rate of the second part.
[0012]
(5) In this wiring board connection method,
The adhesive is a thermosetting adhesive,
In the steps (c) and (d),
The adhesive may be cured by thermal energy.
[0013]
(6) In this wiring board connection method,
In the step (c), the first portion is pressurized with a first tool,
In the step (d), the first and second portions may be pressurized with a second tool.
[0014]
(7) In this wiring board connection method,
The adhesive is an anisotropic conductive material in which conductive particles are dispersed,
In the step (d),
The conductive particles may be interposed between the plurality of terminals of the first substrate and the plurality of terminals of the second substrate.
[0015]
(8) In this wiring board connection method,
In the step (d),
The plurality of terminals of the first substrate and the plurality of terminals of the second substrate may be brought into pressure contact with each other by the shrinkage force of the adhesive.
[0016]
(9) In this wiring board connection method,
In the step (a),
The adhesive may form a film.
[0017]
(10) In this wiring board connection method,
The first and second substrates have marks,
The step (b)
A first step of arranging the first and second substrates such that the plurality of terminals overlap;
A second step of recognizing the marks on the first and second substrates and aligning the first and second substrates at least in the extending direction of the plurality of terminals stacked;
Recognizing a terminal located in the center of the plurality of terminals overlaid on the first and second substrates, the first and second substrates are positioned in the arrangement direction of the overlaid terminals. A third step of combining,
May be included.
[0018]
According to this, the mark is recognized and aligned, and the terminal located at the center of the plurality of terminals overlaid on the first and second substrates is recognized and aligned. Therefore, even if the marks themselves are misaligned due to dimensional changes due to undulation or moisture absorption of the first and second substrates, the respective substrates can be aligned at accurate positions. In addition, since the alignment is performed by the center portions of the plurality of stacked terminals, dimensional changes due to swell and moisture absorption can be evenly distributed to the left and right. For this reason, the range of positional deviation between the terminals can be minimized.
[0019]
(11) In this wiring board connection method,
In the third step,
You may align the terminal located in the said center part of the said 1st and 2nd board | substrate so that the center of the width direction may overlap.
[0020]
Thereby, the terminals of the first and second substrates can be more accurately aligned.
[0021]
(12) In this wiring board connection method,
In the third step,
You may align so that the terminal located in the said center part of a said 1st board | substrate may not protrude from the terminal located in the said center part of a said 2nd board | substrate.
[0022]
(13) In this wiring board connection method,
In the third step,
The terminal located in the central portion of the first and second substrates may have a shape different from the left and right terminals.
[0023]
According to this, since the terminal located in the center portion can be easily recognized, it can be easily aligned.
[0024]
(14) In this wiring board connection method,
In the third step,
The terminal located at the central portion of the first and second substrates may be formed shorter than the left and right terminals.
[0025]
(15) In this wiring board connection method,
In the third step,
The terminal located at the central part of the first and second substrates may be formed narrower than the left and right terminals.
[0026]
(16) In this wiring board connection method,
At least one of the first and second substrates may be a flexible substrate.
[0027]
Accordingly, the terminals of the first and second substrates can be accurately connected even when a flexible substrate that is likely to undergo dimensional changes due to swell, expansion, or moisture absorption is used.
[0028]
(17) In this wiring board connection method,
The flexible substrate may be made of polyimide.
[0029]
(18) A method for manufacturing an electro-optical device according to the invention includes the above-described method for connecting a wiring board,
The first substrate is a flexible substrate;
The second substrate is a circuit substrate sealed with an electro-optical material.
[0030]
(19) An electro-optical device according to the present invention is manufactured by the above-described manufacturing method.
[0031]
(20) An electronic apparatus according to the invention includes the electro-optical device.
[0032]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.
[0033]
1 to 10B are diagrams showing a method for connecting wiring boards according to the present embodiment. Specifically, it is a diagram illustrating a method for manufacturing an electro-optical device to which the wiring board connection method according to the present embodiment is applied. Here, the electro-optical device is a device that controls light, and includes both a self-luminous type and a non-self-luminous type. The electro-optical device is, for example, a liquid crystal device, a plasma display device, an electroluminescence display device, or the like, and has an electro-optical material (liquid crystal, discharge gas, light emitting material, etc.). Note that the wiring board connection method according to the present embodiment may be applied to manufacture of electronic devices (such as a storage device) other than the electro-optical device.
[0034]
In the present embodiment, the first and second substrates 10 and 20 are electrically connected. FIG. 1 is a diagram illustrating the first and second substrates 10 and 20.
[0035]
The first substrate 10 has a first wiring pattern 12. The first wiring pattern 12 is formed on one side or both sides of the first substrate 10. The first wiring pattern 12 may be formed of a metal such as copper, nickel, or gold. The first wiring pattern 12 has a plurality of first terminals 14. The first terminal 14 may be formed at the end of the first substrate 10. Specifically, a plurality of first terminals 14 may be arranged along any side of the first substrate 10. The first terminals 14 are often arranged in one direction. In the example shown in FIG. 1, the pitch of the terminals 14 at the center in the arrangement direction is smaller than the pitch of the terminals 14 at the end in the arrangement direction. The terminal 14 may be plated with a metal such as tin or gold, or a brazing material such as tin-lead solder or tin-silver solder.
[0036]
The first substrate 10 has one or more (two in FIG. 1) marks 16 and 18. The marks 16 and 18 are alignment marks for aligning the first and second substrates 10 and 20. The marks 16 and 18 may be formed on one surface of the first substrate 10 or may be formed on both surfaces. As shown in FIG. 1, by forming at least two marks 16, 18, the first substrate 10 can be aligned in the vertical, horizontal, and rotational directions. The marks 16 and 18 may be patterns. In that case, the marks 16 and 18 may be the wiring pattern 12. Specifically, two terminals located at both ends of the plurality of terminals 14 may be marks. Alternatively, as shown in FIG. 1, apart from the wiring pattern 12, marks 16 and 18 may be formed outside the region of the plurality of terminals 14 at the end of the first substrate 10. The marks 16 and 18 may be patterned into a circular shape, for example. Alternatively, the marks 16 and 18 may be holes or ink.
[0037]
In the example shown in FIG. 1, the first substrate 10 is a flexible substrate. That is, the first substrate 10 may be a flexible tape-shaped (film-shaped) substrate. Examples of the flexible substrate include a polyester substrate and a polyimide substrate. The first substrate 10 may be referred to as a COF (Chip On Film) substrate or a TAB (Tape Automated Bonding) substrate. Alternatively, the first substrate 10 may be a rigid substrate.
[0038]
One or a plurality (in FIG. 1) of electronic components 40 to 48 are mounted on the first substrate 10. For example, a circuit for driving the electro-optical device is formed by the electronic components 40 to 48. The electronic components 40 to 48 are electrically connected to the first wiring pattern 12. The electronic components 40 to 48 may be mounted on the surface on which the first wiring pattern 12 is formed, or may be mounted on the opposite surface. An underfill material (for example, resin) (not shown) may be provided between the electronic components 40 to 48 and the first substrate 10. When the first substrate 10 is a flexible substrate, the flexible substrate may swell greatly due to curing shrinkage of the underfill material. Therefore, it is effective to apply the present invention.
[0039]
The second substrate 20 includes a second wiring pattern 22, a plurality of terminals 24, and marks 26 and 28. The width of the terminal 24 may be larger than the width of the terminal 14. As shown in FIG. 1, the marks 26 and 28 may be formed in a shape different from the marks 16 and 18 of the first substrate 10. For example, the marks 26 and 28 may have a shape (for example, a cross shape) in which a plurality of rectangles are combined. The shape of the marks 26 and 28 may be larger than the shape of the marks 16 and 18 on the first substrate 10.
[0040]
In addition, the content of the above-mentioned 1st wiring pattern 12, the terminal 14, and the marks 16 and 18 is applicable to the other form of the 2nd wiring pattern 22, the terminal 24, and the marks 26 and 28. FIG.
[0041]
The second substrate 20 may be a circuit substrate on which a desired circuit is formed. The second substrate 20 may be, for example, a display unit of an organic EL panel (see FIG. 2). A pixel portion (not shown) is formed on the second substrate 20, and a plurality of first electrodes 30 (for example, anodes) are formed in a region overlapping the pixel portion. A second electrode 32 (for example, a cathode) is formed on the side facing the first electrode 30, and an organic layer 34 (including a light emitting material) is provided therebetween. The second substrate 20 may be provided with a cover 36 (for example, a glass cover) made of an insulating material. The cover 36 may seal the second wiring pattern 22 and the pixel portion.
[0042]
Current can be supplied from the wiring pattern 22 to the first and second electrodes 30 and 32, and electrons and holes can be recombined in the organic layer 34 to emit light. The light may be transmitted from the first electrode 30 side. In this case, it is preferable that the first electrode 30 is a transparent electrode (for example, an ITO (Indium Tin Oxide) electrode) and the second substrate 20 is a transparent substrate (for example, a glass substrate). The display of the pixel portion may be any of multicolor, single color, or white.
[0043]
An electro-optical device is manufactured using the first and second substrates 10 and 20 described above. Specifically, as shown in FIGS. 2 to 9, the first substrate 10 is overlaid and aligned with the second substrate 20, and a plurality of terminals are arranged as shown in FIGS. 10A and 10B. 14 and 24 are fixed with an adhesive 50.
[0044]
FIG. 2 is a view showing a cross section in the extending direction of the terminals 14 and 24 of the first and second substrates 10 and 20 (direction extending from each wiring of the wiring pattern).
[0045]
An adhesive 50 is provided on at least one of the first and second substrates 10 and 20. In the example illustrated in FIG. 2, the adhesive 50 is provided in a region including the plurality of terminals 24 of the second substrate 20. The adhesive 50 may be transparent or light transmissive. In this case, even if the plurality of terminals 24 are covered with the adhesive 50, the terminals 24 can be recognized from the adhesive 50 side. The adhesive 50 may be in the form of a film or a paste. Alternatively, the adhesive 50 may be provided after completion of alignment by marks and terminals described later.
[0046]
As shown in FIG. 2, the first and second substrates 10 and 20 are arranged so that the plurality of terminals 14 of the first substrate 10 and the plurality of terminals 24 of the second substrate 20 overlap. Specifically, the plurality of terminals 14 and 24 are arranged so that one mark (for example, the mark 16) on the first substrate 10 and one mark (for example, the mark 26) on the second substrate 20 are in the same field of view. Overlapping in a rough position. If the recognition means is a camera, for example, the first and second substrates 10 and 20 are arranged so that the marks 16 and 26 are within the imaging range of the camera 60.
[0047]
Next, the marks 16 and 18 on the first substrate 10 and the marks 26 and 28 on the second substrate 20 are recognized. Thus, the first and second substrates 10 and 20 are aligned. More specifically, the alignment is performed in at least the extending direction (vertical direction in FIGS. 3 and 4) of the plurality of terminals 14 and 24 overlapped by the recognition of the mark. For example, when aligning the center of the mark at the time of alignment, the centers of the marks 16, 18, 26, 28 are positioned on the same straight line (not shown) orthogonal to the extending direction of the plurality of terminals 14, 24. Let Further, the first and second substrates 10 and 20 may be aligned in the arrangement direction of the plurality of stacked terminals 14 and 24 (lateral direction in FIGS. 3 and 4) by recognizing the mark, or The arrangement direction may not be aligned.
[0048]
For example, as shown in FIG. 3, the first and second substrates 10 and 20 may be aligned so that the centers of the marks 16 and 26 overlap and the centers of the marks 18 and 28 overlap. . In this way, the first and second substrates 10 and 20 can be aligned in the extension and arrangement direction of the plurality of terminals 14 and 24 within the accuracy range of the mark recognition.
[0049]
Alternatively, as shown in FIG. 4, if the centers of the marks 16 and 26 are overlapped, the centers of the marks 18 and 28 are greatly displaced in the arrangement direction of the terminals 14 and 24. , 20 are aligned in the extending direction of the plurality of stacked terminals 14, 24. In the case where the first substrate 10 is a flexible substrate, a dimensional change occurs due to swell or moisture absorption. Therefore, accurate alignment in the arrangement direction is often not possible with the marks 16 and 18. As shown in FIG. 4, the distance between the centers of the marks 16 and 26 and the distance between the centers of the marks 18 and 28 in the arrangement direction of the first and second substrates 10 and 20 are as follows. You may align so that it may become substantially the same distance.
[0050]
As shown in FIG. 2, the mark recognition means may be a camera, for example. Specifically, the marks 16 and 26 are imaged by the camera 60, and the marks 18 and 28 are imaged by the camera 62 (see FIG. 5).
[0051]
The cameras 60 and 62 may be disposed outside the first and second substrates 10 and 20. In that case, the cameras 60 and 62 may be arranged on the second substrate 20 side as shown in FIG. 2, or may be arranged on the first substrate 10 side. It is preferable that the substrate on the side where the cameras 60 and 62 are disposed has optical transparency. In that case, it is preferable that the mark on the side where the cameras 60 and 62 are disposed also has light transparency. In this way, the size of each recognized mark (for example, the marks 16 and 26) is not limited, and for example, the centers of the marks can be aligned. Or unlike the example shown in FIG. 2, the mark (for example, mark 26) by which the cameras 60 and 62 are arrange | positioned may be smaller than the mark (for example, mark 16) which opposes it. By doing so, it is possible to recognize the protruding portion of the mark and align the first and second substrates 10 and 20.
[0052]
Alternatively, the cameras 60 and 62 may be disposed inside the first and second substrates 10 and 20. In that case, if a prism is arranged between each mark (for example, the marks 16 and 26), two marks arranged in different directions (vertical direction in FIG. 2) can be simultaneously recognized by one camera.
[0053]
FIG. 5 is a view showing a section in the arrangement direction of the terminals 14 and 24 of the first and second substrates 10 and 20. As shown in FIG. 5, after the alignment by the mark is completed, the terminals 14 and 24 positioned at the central portion 70 of the plurality of terminals 14 and 24 on which the first and second substrates 10 and 20 are overlapped are recognized. Specifically, the terminal 14 of the central portion 70 of the first substrate 10 and the terminal 24 of the central portion 70 of the second substrate 20 connected to the terminal 14 are recognized. In that case, you may recognize the relative position with the other terminal in the range including the front-end | tip part (or cut | notch part) of any one terminal. In this way, even if one terminal does not have light transmittance, the other terminal can be recognized by a portion protruding from the one terminal. One terminal 14 and 24 may be recognized, respectively, and a plurality of terminals 14 and 24 may be recognized. The terminals 14 and 24 to be recognized preferably include the center terminal.
[0054]
Thus, the first and second substrates 10 and 20 are further aligned. Specifically, as shown in FIGS. 6 to 9, the first and second substrates 10 and 20 are aligned in the arrangement direction of the plurality of terminals 14 and 24 that are overlaid. 6 to 9 are enlarged views of the terminals 14 and 24, except for the terminals.
[0055]
The range of the central portion 70 of the plurality of terminals 14 and 24 overlapped is, for example, the number n of a pair of terminals included in the central portion 70 and the number m of a pair of all the terminals 14 and 24 overlapped. In
n ≦ m / 5
A range having the relationship of
[0056]
As shown in FIG. 6, the terminals 14 and 24 may be aligned such that the centers in the width direction overlap. In this way, the first and second substrates 10 and 20 can be aligned as accurately as possible. Moreover, since the contact area of each terminal 14 and 24 can be maximized, the contact resistance of each terminal 14 and 24 can be minimized.
[0057]
Alternatively, as shown in FIG. 7, the terminals 14 of the first substrate 10 may be aligned so as not to protrude from the terminals 24 of the second substrate 20. That is, when the widths of the terminals 14 and 24 are different, the terminal having a small width (terminal 14 in FIG. 7) is prevented from protruding from the terminal having a large width (terminal 24 in FIG. 7). In this way, the contact area between the terminals 14 and 24 can be maximized with simple work. Therefore, the contact resistance of each terminal 14 and 24 can be minimized.
[0058]
In the alignment by the mark, if the arrangement direction of the terminals 14 and 24 is also aligned, the pair of terminals 14 and 24 to be electrically connected as shown in FIGS. Often overlaps in some areas. Therefore, since the overlapping terminals 14 and 24 may be aligned in the arrangement direction, alignment by the terminals 14 and 24 in the central portion 70 is simplified.
[0059]
As shown in FIG. 8, the recognized terminals 114 and 124 of the central portion 70 may have different shapes from the left and right terminals. Specifically, the recognized terminal 114 of the central portion 70 of the first substrate 10 is formed in a shape different from the left and right terminals 14, and the recognized terminal 124 of the central portion 70 of the second substrate 20 is The terminal 24 may be formed in a different shape. Or the shape from which the terminal recognized in the center part 70 in any one board | substrate differs from the terminal on either side may be sufficient.
[0060]
By doing so, the terminals 114 and 124 located in the central portion 70 can be easily recognized, so that they can be easily aligned. Specifically, even if the pair of terminals 114 and 124 to be electrically connected do not overlap with each other, they can be reliably aligned without being mistaken for other terminals. That is, it is effective when the alignment of the terminals 14 and 24 is not performed in the alignment by the mark.
[0061]
In the example shown in FIG. 8, the terminals 114 and 124 recognized in the central portion 70 are formed shorter than the left and right terminals 14 and 24. Specifically, the terminal 114 of the first substrate 10 is formed shorter than the left and right terminals 14, and the terminal 124 of the second substrate 20 is formed shorter than the left and right terminals 24. The terminals 114 and 124 may be shortened by etching or the like. Or conversely, the terminals 114 and 124 may be formed longer than the left and right terminals 14 and 24.
[0062]
In the example shown in FIG. 9, the terminals 214 and 224 recognized at the central portion 70 are formed to be narrower than the left and right terminals 14 and 24. Specifically, the terminal 214 of the first substrate 10 is formed thinner than the left and right terminals 14, and the terminal 224 of the second substrate 20 is formed thinner than the left and right terminals 24. The terminals 214 and 224 may be partially narrowed in the width direction. Specifically, the terminals 214 and 224 may be notched in the width direction. Alternatively, the terminals 214 and 224 may all be thin in the width direction. The terminals 214 and 224 may be thinned by etching or the like.
[0063]
As shown in FIG. 5, the recognition means for the terminals 14 and 24 located in the central portion 70 may be the same as the mark recognition means, for example, a camera. For example, any one of the cameras 64 that have recognized the marks 18 and 28 may be translated to recognize the terminals 14 and 24 located in the central portion 70. The details described above can be applied to the details of recognition by the camera.
[0064]
The alignment step using the above-described marks and terminals may be performed manually based on the recognition result of the camera or the like, or may be performed automatically based on the recognition result. In any case, the relative positions of the first support (not shown) that supports the first substrate 10 and the second support (not shown) that supports the second substrate 20 are manipulated. Thus, the first and second substrates 10 and 20 are aligned.
[0065]
When the alignment of the first and second substrates 10 and 20 is finished, as shown in FIGS. 10A and 10B, the plurality of terminals 14 of the first substrate 10 and the second substrate 20 are arranged. The plurality of terminals 24 are overlapped with an adhesive 50. The adhesive 50 has a first portion 52 and second portions 54 located on both sides of the first portion 52. Then, the adhesive 50 is reacted at the first portion 52 so that at least curing starts. The first portion 52 may be one portion of the adhesive 50 as shown in FIG. 10A, or may be a plurality of portions. What is necessary is just to add energy to the 1st part 52 of the adhesive agent 50 by the method according to the hardening mechanism of the adhesive agent 50 used. Note that the terminal 14 of the first substrate 10 and the terminal 24 of the second substrate 20 may be electrically connected at the first portion 52 at the start of the curing reaction, or may not be electrically connected. Also good.
[0066]
The adhesive 50 may be a thermosetting adhesive. In that case, the adhesive force may be expressed by applying thermal energy to the adhesive 50. When the thermosetting adhesive is heated, the viscosity decreases and melts, and when further heated, the curing reaction starts.
[0067]
In the example shown in FIG. 10A, the adhesive 50 is an anisotropic conductive material. An anisotropic conductive material is a material in which conductive particles (not shown) are dispersed in a binder, and a dispersant may be added. The binder is often a thermosetting resin. The anisotropic conductive material is crushed between the terminal 14 of the first substrate 10 and the terminal 24 of the second substrate 20 so as to achieve electrical conduction between the two by the conductive particles. ing. Alternatively, the adhesive 50 may be an insulating adhesive. In that case, the terminal 14 of the first substrate 10 and the terminal 24 of the second substrate 20 are pressed against each other by the shrinkage force of the adhesive. And you may aim at electrical conduction between both.
[0068]
Here, the 1st part 52 points out the part located in the center part 72 of the some terminal 14 and 24 overlapped. In addition, the range of the central portion 72 of the overlapped terminals 14 and 24 is, for example, the number n of a pair of terminals included in the central portion 72 and the total number of the pair of terminals of the overlapped terminals 14 and 24. m and
n ≦ m / 3
A range having the relationship of The width of the first portion 52 of the adhesive 50 may be about 1/3 of the total width of the first and second portions 52 and 54.
[0069]
In the example shown in FIG. 10A, the first portion 52 of the adhesive 50 is pressurized by the first tool 80. The first tool 80 has a heater part. Since the first tool 80 is heated by the heater unit, the curing reaction of the adhesive 50 can be started in the first portion 52 pressed by the first tool 80.
[0070]
For example, you may pressurize for about 5 seconds with the pressure of about 1 MPa in the state which heated the 1st tool 80 to about 200 degreeC. In that case, the first portion 52 of the adhesive 50 is heated to about 160 ° C., resulting in a cure reaction rate of about 30%. Note that the first portion 52 of the adhesive 50 is preferably heated to at least about 130 ° C. or higher.
[0071]
The curing reaction rate of the first portion 52 only needs to exceed 0%, for example, about 10 to 50%. It is preferable that the first portion 52 is not excessively cured so as not to prevent the second portion 54 from being cured in a later step. Further, the curing reaction rate of the first portion 52 only needs to be higher than that of the second portion 54, and may be, for example, about 20% or higher.
[0072]
In this way, the first and second substrates 10 and 20 can be fixed by the first portion 52 of the adhesive 50. Next, as shown in FIG. 10B, the adhesive 50 is cured at the first and second portions 52 and 54 to electrically connect the first and second substrates 10 and 20.
[0073]
In the example shown in FIG. 10B, the first and second portions 52 and 54 of the adhesive 50 are pressed by the second tool 82. The second tool 82 has a heater part. Since the second tool 82 is heated by the heater portion, the adhesive 50 can be cured in the first and second portions 52 and 54 pressed by the second tool 82.
[0074]
For example, the second tool 82 may be pressurized at a pressure of about 3 MPa for about 20 seconds while being heated to about 250 ° C. In that case, the first and second portions 52 and 54 of the adhesive 50 are heated to about 180 ° C., and the curing reaction is completed.
[0075]
According to the present invention, the curing reaction of the first portion 52 of the adhesive 50 is started to fix the first and second substrates 10 and 20 so as not to shift. Therefore, when the first and second substrates 10 and 20 are electrically connected, it is possible to prevent the first and second substrates 10 and 20 from slipping and causing displacement. In addition, since the first portion 52 of the adhesive 50 is located at the central portion 72 in the arrangement direction of the plurality of terminals 14 and 24 that are overlapped, the dimensional change due to the expansion of the first and second substrates 10 and 20 or the like. Can be evenly distributed to the left and right. Therefore, the range of positional deviation between the terminals 14 and 24 can be minimized.
[0076]
In the present embodiment, an example in which one first substrate 10 is aligned and electrically connected to one second substrate 20 has been described, but the present invention is not limited to this. For example, a plurality of first substrates 10 may be aligned and electrically connected to one second substrate 20.
[0077]
An electro-optical device manufacturing apparatus to which the present invention is applied includes a first support (not shown) for supporting the first substrate 10 and a second support (not shown) for supporting the second substrate 20. The first cameras 60 and 62 for recognizing the positions of the marks 26 and 28 with respect to the marks 16 and 18, and the second cameras 14 and 24 for recognizing the terminals 14 and 24 located at the central portion 70 of the plurality of terminals 14 and 24 stacked. Camera 64. What is necessary is just to use the already known 1st and 2nd support body. As the second camera 64, any one of the first cameras 60 and 62 may be moved for use.
[0078]
The first and second supports are based on the recognition results of the first cameras 60 and 62, and the relative positions of the first and second substrates 10 and 20 in the extending direction of the plurality of stacked terminals 14 and 24. Move. Then, the first and second supports are based on the recognition result of the second camera 64, and the relative positions of the first and second substrates 10 and 20 in the arrangement direction of the plurality of stacked terminals 14 and 24. Move. Both the first and second supports may move, or one of them may move.
[0079]
According to the electro-optical device manufacturing apparatus, the above-described manufacturing method and its effects can be achieved.
[0080]
As an electronic apparatus having the electro-optical device according to the embodiment of the present invention, a notebook personal computer 200 is shown in FIG. 11, and a mobile phone 300 is shown in FIG.
[0081]
The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[Brief description of the drawings]
FIG. 1 is a diagram showing a wiring board according to an embodiment of the present invention.
FIG. 2 is a diagram showing a method for connecting wiring boards according to an embodiment of the present invention.
FIG. 3 is a diagram showing a method for connecting wiring boards according to an embodiment of the present invention.
FIG. 4 is a diagram showing a method for connecting wiring boards according to an embodiment of the present invention.
FIG. 5 is a diagram showing a method for connecting wiring boards according to an embodiment of the present invention.
FIG. 6 is a diagram showing a wiring board connection method according to an embodiment of the present invention.
FIG. 7 is a diagram showing a method for connecting wiring boards according to an embodiment of the present invention.
FIG. 8 is a diagram showing a wiring board connection method according to an embodiment of the present invention.
FIG. 9 is a diagram showing a wiring board connection method according to an embodiment of the present invention.
FIGS. 10A and 10B are diagrams illustrating a wiring board connection method according to an embodiment of the present invention.
FIG. 11 is a diagram showing an electronic apparatus according to an embodiment of the present invention.
FIG. 12 is a diagram showing an electronic apparatus according to an embodiment of the present invention.
[Explanation of symbols]
10 First substrate
12 Wiring pattern
14 terminals
16 mark
18 mark
20 Second substrate
22 Wiring pattern
24 terminals
26 mark
28 mark
50 Adhesive
52 First part
54 Second part
60 cameras
62 Camera
64 cameras
70 center
72 Center
80 First tool
82 Second Tool
114 terminals
124 terminals
214 terminals
224 terminals

Claims (20)

(A) providing an adhesive on at least one of the first and second substrates on which a wiring pattern having a plurality of terminals is formed;
(B) aligning the first and second substrates, and superimposing the plurality of terminals of the first substrate and the plurality of terminals of the second substrate via an adhesive;
(C) reacting the adhesive so as to start curing at least in a first portion located in a central portion in the arrangement direction of the plurality of terminals on which the first and second substrates are overlapped; Fixing the first and second substrates so as not to shift;
(D) A wiring board for electrically connecting the first and second substrates by curing the adhesive at the first portion and the second portions on both sides of the first portion. Connection method. In the connection method of the wiring board of Claim 1,
In the step (c),
The wiring board connection method, wherein the width of the first portion is about 1/3 of the width of the first and second portions. In the connection method of the wiring board of Claim 1 or Claim 2,
In the step (c),
The method for connecting wiring boards, wherein the curing reaction rate of the first portion is about 10 to 50%. In the connection method of the wiring board in any one of Claims 1-3,
In the step (c),
The wiring board connection method, wherein the curing reaction rate of the first part is about 20% or more higher than the curing reaction rate of the second part. In the connection method of the wiring board in any one of Claims 1-4,
The adhesive is a thermosetting adhesive,
In the steps (c) and (d),
A method for connecting wiring boards, wherein the adhesive is cured by thermal energy. In the connection method of the wiring board in any one of Claims 1-5,
In the step (c), the first portion is pressurized with a first tool,
In the step (d), a wiring board connection method in which the first and second portions are pressed by a second tool. In the connection method of the wiring board in any one of Claims 1-6,
The adhesive is an anisotropic conductive material in which conductive particles are dispersed,
In the step (d),
A wiring board connection method in which the conductive particles are interposed between the plurality of terminals of the first substrate and the plurality of terminals of the second substrate. In the connection method of the wiring board in any one of Claims 1-6,
In the step (d),
A wiring board connection method in which the plurality of terminals of the first board and the plurality of terminals of the second board are pressed into contact with each other by a shrinkage force of the adhesive. In the connection method of the wiring board in any one of Claims 1-8,
In the step (a),
The adhesive is a method for connecting a wiring board in the form of a film. In the connection method of the wiring board in any one of Claims 1-9,
The first and second substrates have marks,
The step (b)
A first step of arranging the first and second substrates such that the plurality of terminals overlap;
A second step of recognizing the marks on the first and second substrates and aligning the first and second substrates at least in the extending direction of the plurality of terminals stacked;
Recognizing a terminal located in the center of the plurality of terminals overlaid on the first and second substrates, the first and second substrates are positioned in the arrangement direction of the overlaid terminals. A third step of combining,
Wiring board connection method including: In the connection method of the wiring board of Claim 10,
In the third step,
A wiring board connecting method for aligning terminals located in the central portion of the first and second boards so that the centers in the width direction overlap each other. In the connection method of the wiring board of Claim 10,
In the third step,
A method of connecting a wiring board, wherein a terminal located at the central portion of the first substrate is aligned so as not to protrude from a terminal located at the central portion of the second substrate. In the connection method of the wiring board in any one of Claims 10-12,
In the third step,
A method of connecting wiring boards, wherein a terminal located at the center of the first and second substrates has a shape different from that of the left and right terminals. In the connection method of the wiring board of Claim 13,
In the third step,
A method for connecting wiring boards, wherein a terminal located in the central portion of the first and second substrates is formed shorter than left and right terminals. In the connection method of the wiring board of Claim 13 or Claim 14,
In the third step,
A method of connecting wiring boards, wherein a terminal located in the central portion of the first and second substrates is formed narrower than left and right terminals. In the connection method of the wiring board in any one of Claims 1-15,
A method for connecting wiring boards, wherein at least one of the first and second substrates is a flexible substrate. In the connection method of the wiring board of Claim 16,
The flexible substrate is a wiring substrate connection method made of polyimide. A method for connecting a wiring board according to any one of claims 1 to 15,
The first substrate is a flexible substrate;
The method of manufacturing an electro-optical device, wherein the second substrate is a circuit board sealed with an electro-optical material. An electro-optical device manufactured by the method according to claim 18. An electronic apparatus comprising the electro-optical device according to claim 19.

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