JP3213379B2 - Test contact for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact of a test contact of a handler for testing electrical characteristics of semiconductor electronic components such as integrated circuits and transistors.

[0002]

2. Description of the Related Art When such an electrical characteristic test of an electronic component is continuously and automatically performed on an inspection line, a current is applied to the electronic component or a voltage is applied by pressing a contactor against a lead of the electronic component. (See, for example, JP-A-58-73875).

As a conventional type of a stylus, a needle-shaped stylus is pressed vertically to a lead to be measured. However, in this case, an oxide film on a solder plating surface of the lead is hard to be broken, and an electrical contact is made. There is a problem that a test cannot be performed due to a defect.

On the other hand, at the same time, the solder is clamped in a symmetrical shape with a narrow plate-shaped tentacle, and at the same time, the soldering film is broken by a movement (wiping) of rubbing the contact portion with the lead by using the bending of the tentacle. There is a method (for example, see Japanese Utility Model Publication No. 58-10967). However, this method has a problem that a stylus cannot be formed with a hanging pin type transistor due to its structure.

Further, in the case of the type in which the contact portion is rubbed, a problem such that a solder cas or its oxide film easily adheres to the contact portion of the contactor, and the solder cas forms a bridge between adjacent leads and short-circuits, leading to erroneous measurement. was there. Furthermore, since the contactor is made of iron or copper spring material,
There was a problem that the life of the contact portion was short.

[0006]

The problem to be solved by the present invention is that a solder oxide film at a contact portion of an electronic component can be broken, a contact can be formed even with a hanging pin type transistor, and solder scum is hardly generated. Another object of the present invention is to provide a test contact for a test contact of an electronic component in which a contact contact portion has a long life.

[0007]

To solve SUMMARY OF THE INVENTION This object, probe test contacts of the electronic component of the present invention, electrostatic
Touch the tip of the stylus to the lead of the
Then, the tentacle base flexes, and its deformation causes
The blade-shaped contact portion is displaced, and this displacement causes the lead of the electronic component to move.
Testing of electronic components by wiping the part to break the oxide film
In the test contact of the test contact , a blade-like contact portion is provided at the tip of a spring-like plate-like touch probe base having one end fixed to the probe contact mount, and the direction of the blade edge of the blade-like contact portion is provided . To
Set the wipe direction in the same direction as the longitudinal direction of the
Set the same direction as the direction of the blade edge of the contact
The oxide film on the metal surface is cut off .

[0008] In this contactor, the contactor base is preferably made of a cemented carbide.

[0009]

When the tip of the tentacle is brought into contact with the lead of the electronic component and further pressed against the lead, the tentacle base is bent, and the blade-shaped contact portion at the tip of the tentacle base is displaced by the deformation. Due to this displacement, the contact portion of the electronic component with the lead portion is wiped, but the wiping direction is the same as the direction of the blade edge of the blade-shaped contact portion, so that the solder oxide film on the lead surface is cut off, and the electrical contact is made. Becomes possible. Since this wiping operation is not an operation of scratching the solder oxide film with a needle but an operation of cutting with a blade, solder scum is unlikely to occur.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments.

FIG. 1 is a front view of an embodiment of the present invention. In this figure, reference numeral 1 denotes a stylus mounting base made of an insulating material, which can be moved up and down. 2 is a product guide rail which is fixed on the armature mounting base 1 and supports and guides electronic components (parts remaining on the frame by hanging pins) P; This is a product presser for holding the component P.

FIG. 2 is a plan view of the armature mount 1, and FIG.
In addition, the structure will be described. The base end 11 of a plate-shaped tentacle body 10 made of cemented carbide is fixed together with the terminal plate 4 on both sides of the tentacle mount 1. It is formed thick. The tip of the touch base 10 is bent upward, and the upper end thereof is formed with a blade-shaped contact portion 12 which is sharpened like a blade as shown in FIG. The blade edge of the blade-like contact portion 12 is in the same direction as the longitudinal direction of the tentacle base 10. In FIG. 2, reference numeral 5 denotes an insulating plate that insulates the base end 11 of each of the probe bases 10. A conducting wire 6 connected to a measuring instrument is connected to the terminal plate 4.

This embodiment shows a case in which two rows of electronic components are formed in a frame, and shows an apparatus for inspecting four electronic components simultaneously.

When the contact holder 1 is raised from the state shown in FIG. 1 and the product presser 3 is simultaneously lowered, the head of the electronic component P is pressed by the product presser 3 as shown in FIGS. The blade-shaped contact portion 1 at the tip of the probe base 10 on the lead L of the component P
2 abuts. When the tentacle mount 1 is further raised, the base end portion 11 of the tentacle base 10 is raised, but the blade-shaped contact portion 12 at the tip cannot be raised any more. Then, as shown by the dashed line in FIG. 4, the blade-shaped contact portion 12 is inclined, and at this time, the contact portion between the blade-shaped contact portion 12 and the lead L of the electronic component P moves. Since the movement direction is the direction of the blade edge of the blade-shaped contact portion 12, the movement of the contact portion cuts the oxide film of the solder plating on the surface of the lead L, and the two are electrically contacted.

An electrical test can be performed in this state.

The cutting force of the oxide film can be set according to the thickness and width of the contact base 10 made of a hard metal.

In the above-described embodiment, an example is shown in which two tentacles are in contact with one electronic component. However, it is needless to say that the number of tentacles can be changed according to the number of leads.

[0018]

As described above, according to the present invention, the following effects can be obtained.

The conventional type can cope with product shapes and structures that are difficult to measure.

The effect of breaking the solder oxide film is high, and there is almost no erroneous measurement.

By using a cemented carbide as the material of the contact, solder scum is difficult to adhere. By using a cemented carbide for the contact, the wear of the tip contact portion is small, and the life can be extended.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a plan view of a stylus mount according to the present invention.

FIG. 3 is an enlarged side view of a tip portion of a touch element.

FIG. 4 is an enlarged front view of a tip portion of a touch element.

[Explanation of symbols]

1: Touch base, 2: Product guide rail, 3: Product holder, 4: Terminal plate, 5: Insulating plate, 6: Conductive wire, 10: Touch base, 11: Base end, 12: Blade-shaped contact portion , P: electronic components,
L: Lead

Claims (2)

(57) [Claims] 1. A tip of a stylus is brought into contact with a lead portion of an electronic component.
And further press, the probe base flexes, and its deformation
The blade-shaped contact portion at the tip of the probe base is displaced, and this displacement causes
Wiping the lead part of the child part to break the oxide film
The contact of the test contact to test the child parts
A blade-like contact portion is provided at the tip of a plate-like spring-like base member having one end fixed to the contactor mounting base, and the blade-like contact portion is provided with a blade-like contact portion.
Make the direction of the blade edge almost the same as the longitudinal direction of the probe base
Make the wipe direction the same as the direction of the blade edge of the blade-shaped contact part,
A contact for a test contact of an electronic component, wherein an oxide film on a lead surface of the electronic component is cut off . 2. The test contact of an electronic component according to claim 1, wherein the contact base is made of a cemented carbide.