JP3242858B2 - Connector and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector using a high melting point metal ball and a method for manufacturing the same.

[0002]

2. Description of the Related Art As electronic devices have become smaller, lighter, and more sophisticated, there has been an increasing demand for packages that can be mounted on semiconductors with high density. QFP (Quad Flat Package) is a package that realizes high-density mounting.
e) was developed. In this QFP, a solder paste is printed on a lead connection portion on a printed circuit board, the QFP is accurately mounted by a mounting device, and then the solder connection is performed by passing through a reflow furnace.

With the birth of QFP, lead pitch 0.5
mm and 0.4 mm have been commercialized.
mm pitch ones are being considered.

However, with the fine pitch of the leads, a new problem of defective mounting on a printed circuit board has arisen. That is, the package may not be reliably mounted on the printed circuit board due to the so-called bending of the lead (the leading end of the lead faces upward or downward).

In recent years, a BGA (Bump Grid Array) package has been developed as a package that overcomes this problem. The BGA package is a package in which a chip is mounted on a substrate, and after molding, solder balls (bumps) as electrodes are formed in a grid on the opposite surface of the substrate.

In order to manufacture a BGA package, a flux is transferred onto a substrate having copper foil, and then solder balls are placed thereon.
Reflow. Thus, the solder balls are fixed on the substrate.

According to this BGA package, since the electrode portion is formed on the bottom surface, the pitch of the solder balls can be increased (for example, 1.0 mm). Further, since there is no lead, the size can be reduced, and the lead can be bent. Since it is not necessary to take into account the above, mounting on a printed circuit board can be reliably performed.

[0008]

By the way, with the miniaturization of the semiconductor package for high-density mounting, there is an increasing demand for miniaturization of the connector.

In order to meet this demand, the present inventor has proposed a BGA
I came up with the idea of applying package technology to connectors.

That is, the contacts are arranged in a lattice pattern on the bottom surface of the insulator, and solder balls as electrodes are fixed to the connection portions of the contacts by reflow.

However, the height of the solder ball welded to the connection part of the contact (the diameter of the solder ball in a direction perpendicular to the bottom surface of the insulator) varies due to the cause of uneven temperature distribution in the reflow furnace and the like, and the connector When mounted on a printed circuit board, a connection failure may occur between the contact and the conductor pattern of the printed circuit board.

The present invention has been made in view of such circumstances, and an object thereof is to reliably mount a connector using a high melting point metal ball on a printed circuit board.

[0013]

According to a first aspect of the present invention, there is provided a connector comprising: an insulator;
A connector comprising a plurality of contacts held by the insulator, wherein the pin contact comprises a pin contact pressed into the insulator, and a socket contact held by the insulator and in contact with the pin contact; A high melting point metal ball to be fused to the conductor pattern of the printed circuit board is fixed to the connection portion.

Since the plurality of contacts are each composed of a pin contact and a socket contact, and a refractory metal ball is fixed to a connection portion of each pin contact, a plurality of pin contacts are punched on an insulator in assembling the connector. At the same time,
The distance from the bottom surface of the insulator to the top of the refractory metal ball can be made substantially constant.

According to a second aspect of the present invention, in the connector according to the first aspect, the high melting point metal ball is a solder ball.

Since the solder ball is used as the high melting point metal ball, the connection between the contact and the conductor pattern is facilitated and the connection reliability is improved.

According to a third aspect of the present invention, there is provided a method of manufacturing a connector including an insulator and a plurality of contacts held by the insulator. And a second step of simultaneously pressing the plurality of contacts into the insulator with a punch after the first step.

After the refractory metal balls are fixed to the connecting portions of the plurality of contacts, respectively, the contacts are simultaneously pressed into the insulator by a punch, so that the distance from the bottom surface of the insulator to the apex of the refractory metal ball is substantially constant. Become.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a connector according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a bottom view thereof, FIG. 4 is a side view thereof, and FIG. FIG.

The connector 1 comprises an insulator 10, contacts 90 (FIG. 5), and solder balls (high melting point metal balls) 30. The contact 90 includes the pin contact 20 and the socket contact 40, as shown in FIG.

The insulator 10 has a rectangular bottom portion 10.
a and an insertion portion 10b provided integrally with the bottom portion 10a.

A socket contact 40 is accommodated in the insulator 10, and one end and the other end of the socket contact 40 face the pin contact insertion holes 11 and 12, respectively.

A rod-shaped pin contact 2 is inserted into one end of the socket contact 40 through a pin contact insertion hole 11.
0 is inserted. The socket contact 40 is preferably formed of a spring material that is sufficiently longer than the pin contact 20 to reduce stress relaxation so that a stable holding force can be obtained for a long period of time.

Dish-shaped connecting portion 24 of pin contact 20
Are arranged in a grid on the bottom surface 10a of the insulator 10. A solder ball 30 is fixed to the connection portion 24 of the pin contact 20.

In order to mount the connector 1 on a printed circuit board, the connector 1 is mounted on a conductive pattern on a printed circuit board (not shown) by a colorless mounting device, and the solder balls 30 are melted by reflow. Thus, the pin contact 20 is fixed to the printed board (soldering).

As the solder ball 30, eutectic solder (for example, Sn: Pb = 63: 37 (weight ratio), melting point 183)
° C). However, if it is not desired to melt the solder ball 30, a high melting point solder (for example, Sn: Pb = 5: 95)
(Weight ratio), melting point: 315 ° C.) A ball is used. In this case, solder paste is printed on the printed circuit board 40 in advance, and only the solder is melted after the connector 1 is mounted.

FIG. 6 is a perspective view for explaining the relationship between the contact and the solder ball.

The pin contact 20 includes a rod-shaped contact portion 21 that contacts the socket contact 40 and a solder ball 30.
Connecting portion 24 having a curved surface on which
And a plurality of protrusions 23 protruding radially outward of the contact portion 21.

FIG. 7 is a sectional view of the mating connector 2 fitted with the connector 1.

The mating connector 2 has an insulator 60 having a concave portion 61 into which the insertion portion 10b is inserted, and a pin extending through the bottom portion 62 of the insulator 60 to near the opening of the concave portion 61 and contacting the socket contact 40. And a contact 50.

FIG. 8 is a sectional view showing a fitting state between the connector 1 and the connector 2.

When the connector 1 and the connector 2 are fitted, the pin contact 50 is inserted into the other end of the socket contact 40 through the pin contact insertion hole 12, so that the pin contact 20 and the pin contact 50 are connected. It becomes conductive through the socket contact 40.

According to the connector 1 of the above embodiment, the contact 90 is constituted by the pin contact 20 and the socket contact 40, and the solder ball 30 is fixed to the connecting portion of each pin contact 20. The contact 20 is punched 70 into the insulator 10 (FIG. 9).
Press-fit) at the same time.
The distance from the bottom surface 10a of the zero to the top of the solder ball 30 can be made substantially constant. Therefore, it is possible to reduce the size of the connector without causing a connection failure between the contact 90 and the printed board.

The pin contact 20 can be used in combination with various socket contacts other than the socket contact 40. However, the pin contact 20
Is required to be equal to the pitch of the socket contacts.

Further, since the solder ball 30 is used as the high melting point metal ball, the connection between the pin contact 20 and the conductor pattern is easy, and the connection reliability is improved.

FIG. 9 is a diagram for explaining a method of manufacturing a connector.

[0038] The insulator receiving surface 13 of the insulator 10 in which the socket contact 40 is accommodated is mounted on a flat surface 81 of the press-fit receiving table 80.

Above the bottom surface 10a of the insulator 10, a press-fitting punch 70 movable in a direction perpendicular to the bottom surface 10a is arranged. The press-fitting punch 70 is attached to the bottom 10
It has a flat surface 71 parallel to a.

First, the solder balls 30 are fixed to the connection portions 24 of the plurality of pin contacts 20 by reflow in advance (first step).

After the first step, a plurality of pin contacts 20 are arranged at the same pitch as the socket contacts 40 using a jig (not shown).

Next, the plurality of pin contacts 20 are simultaneously pressed into the insulator 10 (socket contacts 40) through the pin contact insertion holes 11 by the press-fit punch 70 (second step). This press-fit causes the pin contact 20
The protrusion 23 of the pin bites into the insulator 10, and the pin contact 20 is securely fixed to the insulator 10.

According to the method of manufacturing the connector 1, the printed circuit board of the solder ball 30 from the bottom surface 10a is not affected by the apex position of the solder ball 30 with respect to the pin contact 20 and the variation in the size of the solder ball 30. Since the distance to the side vertex is almost constant, connector 1
When is mounted on a printed circuit board, the contacts 20 are securely connected to the printed circuit board, and the size of the connector can be reduced without any trouble (poor contact).

FIG. 10 is a view for explaining a connector according to another embodiment of the present invention. The same parts as those in FIG. 9 are denoted by the same reference numerals, and description thereof will be omitted.

In the above-described embodiment, the contact 90 is constituted by the pin contact 20 and the socket contact 40. In this embodiment, the contact is constituted by only the pin contact 120. Insulator 1
10 does not contain a socket contact 40,
The pin contact 120 is longer than the pin contact 20.

Therefore, when the connector of FIG. 10 is fitted to the mating connector (not shown),
Reference numeral 20 directly contacts a socket contact (not shown) of the mating connector.

The assembly of the connector is performed in the same steps as in the case of FIG. 9, and the same effects as in the above-described embodiment can be obtained.

In each of the above embodiments, the case where the solder ball 30 is used as the high melting point metal ball has been described, but a Cu ball may be used instead.

[0049]

As described above, according to the connector of the first aspect of the present invention, regardless of the contact type (pin type or socket type) of the mating connector to be fitted.
The distance from the bottom surface of the insulator to the top of the refractory metal ball can be made substantially constant.

According to the connector of the present invention, since the solder ball is used as the high melting point metal ball,
The connection between the pin contact and the conductor pattern becomes easy,
Connection reliability also increases.

According to the method of manufacturing a connector according to the third aspect of the present invention, the distance from the bottom surface of the insulator to the top of the refractory metal ball is substantially constant. The conductor pattern on the printed circuit board is securely connected, and the size of the connector can be reduced without any trouble.

[Brief description of the drawings]

FIG. 1 is a front view of a connector according to an embodiment of the present invention.

FIG. 2 is a plan view of the connector according to the embodiment of the present invention.

FIG. 3 is a bottom view of the connector according to the embodiment of the present invention.

FIG. 4 is a side view of the connector according to the embodiment of the present invention.

FIG. 5 is a sectional view taken along the line VV of FIG. 2;

FIG. 6 is a perspective view illustrating a relationship between a contact and a solder ball.

FIG. 7 is a sectional view of a mating connector fitted with the connector.

FIG. 8 is a cross-sectional view showing a fitting state between the connectors.

FIG. 9 is a diagram illustrating a method of manufacturing the connector.

FIG. 10 is a view for explaining a connector according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connector 10 Insulator 20 Pin contact 30 Solder ball (high melting point metal ball) 40 Socket contact 70 Press-fit punch

Claims (3)

(57) [Claims] 1. A connector comprising: an insulator; and a plurality of contacts held by the insulator, wherein the contact is a pin contact press-fitted into the insulator, and a socket held by the insulator and in contact with the pin contact. A connector comprising: a contact; and a high-melting metal ball for fusion to a conductor pattern on a printed circuit board fixed to a connection portion of the pin contact. 2. The connector according to claim 1, wherein said high melting point metal ball is a solder ball. 3. A method for manufacturing a connector comprising an insulator and a plurality of contacts held by the insulator, wherein a high melting point metal ball for fusing to a conductor pattern on a printed circuit board is connected to a connection portion of the plurality of contacts. A method for manufacturing a connector, comprising: a first step of fixing, and a second step of, after the first step, press-fitting the plurality of contacts into the insulator simultaneously with a punch.