JP3139860B2 - Resin molding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus used for resin molding of a TAB tape or the like.

[0002]

2. Description of the Related Art In manufacturing a resin-molded type semiconductor device using a lead frame or a TAB tape, a semiconductor chip is mounted on a lead frame or a TAB tape, and then these are set in a mold and the resin is placed in a cavity. Fill and seal with resin. These TA
Conventionally, when resin molding a B tape or a lead frame, a resin is molded by a side gate method in which a gate is provided on a side surface of a cavity and a resin is injected into the cavity from the side in the thickness direction. The side gate method is a method commonly used in the manufacture of a resin mold type semiconductor device because the mold structure is simplified and the working efficiency is good.

[0003]

However, in recent semiconductor devices, the thickness of the resin mold portion has become extremely thin, and the area of the resin mold portion has become large. Is not filled with the resin, and unfilled resin or voids are generated, which causes a problem in moldability of the package portion. In particular,
In the case where the TAB tape is directly resin-molded with a molding die, the side gate method has a problem that the semiconductor chip is tilted due to the resin pressure at the time of resin injection, or the semiconductor chip is displaced from a proper position and is molded.

In addition, in the side gate method, the resin is injected from the side surface of the cavity, so that the injection distance of the resin is increased, so that the filling property of the resin is reduced, and the volume ratio occupied by the semiconductor chip in the package is increased. Since the leads have a large number of pins and the leads are formed at a high density, there is a problem that the filling property of the resin into the cavity opposite to the gate is reduced. For this reason, there is a conventional resin molding apparatus in which gates are separately provided in each of the cavities of the upper mold and the lower mold to prevent the resin from being unfilled.

However, providing a gate on each of the upper and lower surfaces of a molded article has a problem that gate breakage is difficult, and a problem that the side gate method is low in resin filling property. It cannot be suitably applied to a resin mold of a TAB tape or the like. Also, in the case of the side gate method, since the gate adheres to and remains on the molded article after resin molding, if the TAB tape or the like is resin molded, the product is damaged when the gate is peeled off from the base film. There were also points. Therefore, the present invention has been made to solve these problems.
It is an object of the present invention to provide a resin molding apparatus that can suitably perform resin molding even on a product such as a tape or the like that is difficult to accurately perform resin molding.

[0006]

The present invention has the following arrangement to achieve the above object. That is, in the resin molding apparatus for resin molding by clamping the TAB tape in <br/> mold, on the inner bottom surface of the cavity over which is provided in the mold, the semiconductor chip being set in the cavity
The gate end is opened at the through hole position provided for the resin flow between the upper cavity and the lower cavity with the TAB tape having the tape mounted thereon, and the gate end and the resin are charged. wherein the vertical gate to contact between the pot T
A plunger is provided perpendicularly to the chip surface of the semiconductor chip mounted on the AB tape , and a plunger for feeding resin melted in the pot into the cavity through the vertical gate is provided. An opening position of a gate end of the vertical gate is set to a position near a corner of a semiconductor chip mounted on the TAB tape .

[0007]

The resin melted in the pot is pressed by the plunger and fed into the cavity through the vertical gate. Since the gate end of the vertical gate is open at the inner bottom surface of the upper cavity, the resin is injected in the thickness direction of the cavity. Vertical gate with TAB tape
To achieve resin flow between the upper and lower cavities
The resin is efficiently filled from the upper cavity to the lower cavity because the resin is arranged in accordance with the position of the provided through-hole , and the resin is reliably filled.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The resin molding apparatus according to the present invention is characterized in that a gate is not provided on a side surface of a cavity provided in a molding die, but a gate is opened on an inner bottom surface of the cavity, and the resin is filled in a thickness direction of the cavity. FIG.
1 shows the configuration of an embodiment of the resin molding apparatus according to the present invention. In the figure, 10 is a TAB tape as a molded article, and 12 is TA
This is a carrier that supports the periphery of the B tape 10 by sandwiching it between upper and lower surfaces. The resin molding device of the embodiment is a TAB tape 1
Resin molding is carried out while the carrier 0 is supported by the carrier 12.

Reference numerals 14a and 14b denote an upper cavity block and a lower cavity block for clamping the TAB tape 10, respectively having an upper cavity 16a and a lower cavity 16b at positions facing each other with the TAB tape 10 interposed therebetween.
18a and 18b are an upper chase block and a lower chase block which support the upper cavity block 14a and the lower cavity block 14b, respectively. On the outer edge of the lower chase block 18b, there is provided a heat insulating material 20 for setting the carrier 12 in a heat-insulated manner.

Reference numeral 22 denotes a pot chase that supports the upper chase block 18a, 24 denotes an upper base that supports the pot chase 22, and 26 denotes a lower base that supports the lower chase block 18b. The pot chase 22 is provided with a pot 30 into which a resin tablet is to be inserted penetrating in the thickness direction of the chase, and a vertical gate extending from a lower portion of the pot 30 to an inner bottom surface of the upper cavity 16a through the upper chase block 18a and the upper cavity block 14a. 32 is provided. The vertical gate 32 is provided in parallel with the mold opening and closing direction as shown in the figure, and is formed in a tapered shape in which the upper cavity 16a side is tapered. Above the pot 30, a plunger 34 for feeding the molten resin into the cavity is disposed. The plunger 34 is provided so as to be able to move in and out of the pot 30, and the pressing end face for pressing the resin has a groove 3 as shown in the figure.
4a is provided.

The vertical gate 32 communicates between the pot 30 and the upper cavity 16a as described above. In this embodiment, the vertical gate 32 connects the pot 30 and the upper cavity 16a. FIG. 3 is a plan view of an embodiment of a TAB tape that can be suitably molded with the present resin molding apparatus to show the arrangement position of the vertical gate 32. In the figure, 40 is a semiconductor chip, 42 is a resin mold part, and 44 is an outer lead. In the same figure, the position of the gate end connected to the upper cavity 16a in the vertical gate 32 is shown in the figure near the four corners of the semiconductor chip 10, that is, in the vicinity of the tip of the corner of the semiconductor chip 10 on the base film of the TAB tape 10. It is set at the position of the hole 50. Since one vertical gate 32 is provided at each corner, the pot 30 and the upper cavity 16a are connected by four vertical gates 32.

As described above, the vertical gate 3 is aligned with the through hole 50 provided near the corner of the semiconductor chip 40.
2 is arranged such that the resin is injected from the through-hole 50 so that the upper cavity 16a is
This is because the resin can be more reliably penetrated into 6b and the resin can be reliably filled. When a semiconductor chip is mounted on a normal TAB tape, inner leads are connected to four sides of the semiconductor chip, respectively, but the vicinity of a corner of the semiconductor chip is an empty space where no leads are connected.
Therefore, it is possible to easily provide the resin-filled through-hole 50 in this empty space. The semiconductor chip 40 is chamfered at its corner,
Further, the empty space can be expanded, and the filling property of the resin can be improved.

Next, TA
A processing method of resin-molding the B tape will be described. First, the TAB tape 10 is placed on the lower cavity block 14b.
Is positioned and set together with the carrier 12, and clamped between the upper cavity block 14a. On the other hand, a resin tablet is put into the pot 30, and the resin tablet is heated and melted. The resin tablet is a thermosetting resin. When the resin tablet is charged into the pot 30, the plunger 34 is pulled out above the pot 30, and after the resin tablet is charged, the plunger 34 is advanced into the pot 30.

When the resin tablet is melted, the plunger 34 is pushed down, and the resin is injected into the cavity through the vertical gate 32. FIG. 1 shows a state in which the plunger 34 is pushed down and the upper cavity 16a and the lower cavity 16b are filled with resin. Since the vertical gate 32 is provided with four gates corresponding to the positions of the through holes 50 provided in the TAB tape 10 as described above, resin is injected into the upper cavity 16a and the lower cavity 16b from each gate end. You. The resin is injected in the thickness direction of the cavity, and the resin is filled from the upper cavity 16a to the lower cavity 16b to complete the filling.

After the resin is filled, the TAB tape 10 is clamped by the upper cavity block 14a and the lower cavity block 14b for a certain period of time to cure the resin. Then, the plunger 34 is pulled up to cut the gate, and the inside of the vertical gate 32 is cut. An operation of discharging the cured spool 36 out of the mold is performed. Since the vertical gate 32 is formed in a tapered shape as described above, the gate is separated and cut at a position where the vertical gate 32 is connected to the package by pulling up the spool 36. When the plunger 34 is pulled up, the resin cured in the pot 30 is locked by the groove 34a, and by pulling up the plunger 34, the spool 36 is peeled off from the vertical gate 32 and pulled out. FIG. 2 shows a state in which the plunger 34 is pulled up and the spool 36 is pulled out of the pot 30.

[0016] As shown in FIG.
0, and is removed from the plunger 34 by piercing with a pin from the side parallel to the dovetail groove 34a. On the other hand, the resin mold product is attached to the lower mold side by lowering the lower base 26 and the mold is opened. Since the TAB tape 10 is supported by the carrier 12 and molded with resin, the lower cavity block 1 is
Take out the resin mold product from 4b. After taking out the resin molded product, the TAB tape to be subsequently resin molded is set on the lower cavity block 14b, and the next resin molding operation is started. Thus, resin molding can be performed continuously.

In the resin molding apparatus of this embodiment, the vertical gate is provided in one of the molds for clamping the molded article, and the position of the gate opening of the vertical gate in the cavity is determined so that the resin flow between the upper and lower cavities is good. By setting it near the corner of the semiconductor chip, effective resin filling is achieved. By providing the vertical gate at a position where the resin filling property can be more effectively achieved, the upper and lower cavities are isolated by the molded article, such as a multi-pin TAB tape, so that the resin filling is difficult. However, reliable resin molding becomes possible.
Further, by filling the resin with a plurality of vertical gates as in the above embodiment, the resin flow distance at the time of filling the resin can be shortened, and the filling property of the resin can be improved. Further, since a plurality of vertical gates can be used to reduce the size of each vertical gate, there is an advantage that gate break after resin molding is facilitated.

Further, by opening a vertical gate on the inner bottom surface of the cavity and injecting the resin perpendicularly to the semiconductor chip mounting surface of the molded article, the resin pressure at the time of resin injection is perpendicular to the molded article. To prevent the semiconductor chip from being tilted or displaced by the resin pressure. In particular, by providing the vertical gate at a portion where resin pressure is not directly applied to the semiconductor chip, such as a corner portion of the semiconductor chip, resin molding can be performed without adversely affecting the semiconductor chip. Also,
By providing the vertical gate in one of the upper and lower molds, there is an advantage that the structure of the mold is simplified and the installation of a pot or a plunger becomes easy.

In the above embodiment, a TAB tape which is difficult to mold with resin is described as a molded article. However, the present invention can be similarly applied to a normal lead frame. Further, in the above embodiment, as shown in FIG. 3, the through hole 50 is provided in the TAB tape near the corner of the semiconductor chip 40 so as to improve the filling property of the resin. The vertical gate is arranged at a position where the flowability of the resin in the cavity is good for the molded product,
When there is a portion where the fluidity of the resin is good in the design of the B tape, it is possible to provide no through hole or the like separately. Also,
The through-hole is not limited to a circular hole, and may be a slit-shaped hole. If chamfering the corners of the semiconductor chip allows good resin flow between the upper and lower cavities, chamfering alone is effective.

In the above embodiment, the semiconductor chip is resin-molded so as to be buried in the cavity. However, when the semiconductor chip is resin-molded so that the back surface is exposed to the outer surface of the package, the semiconductor chip is The chip is arranged so as to be in contact with the inner bottom surface of the cavity on the side opposite to the side where the vertical gate is installed, and is resin-molded. Since the resin pressure during resin injection from the vertical gate acts to press the semiconductor chip in the thickness direction,
It is possible to effectively prevent the resin from wrapping around the back surface of the semiconductor chip during resin molding, and it is possible to prevent the occurrence of resin burrs and reliably manufacture a good product.

[0021]

According to the resin molding apparatus of the present invention, as described above , the upper cavity and the lower cavity have T
Is isolated by AB tape, the flow of the resin in the cavity is rather low, be reliably resin mold can be a difficult product filling of the resin is thin package improves the filling property of the resin It is possible. Further, when a plurality of vertical gates are provided and the resin is filled, the distance of the resin flow can be shortened, and the filling property of the resin can be improved. Further, by not injecting resin from directly above the semiconductor chip, it is possible to prevent excessive resin pressure from being applied to the semiconductor chip. Further, after the resin molding, the gate does not adhere to the molded article and does not remain, thereby providing a remarkable effect that damage during gate break can be prevented.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a state where a resin is filled from a vertical gate into a cavity by a resin molding apparatus.

FIG. 2 is an explanatory view showing a state in which a gate is cut and a spool is drawn out after filling a cavity with resin.

FIG. 3 is a plan view of a resin molded product formed by resin molding with the resin molding device of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 TAB tape 12 Carrier 14a Upper cavity block 14b Lower cavity block 16a, 16b Cavity 18a Upper chase block 18b Lower chase block 22 Pot chase 24 Upper base 26 Lower base 30 Pot 32 Vertical gate 34 Plunger 34a Groove 36 Spool 40 Semiconductor chip 42 resin mold part 50 through-hole

Claims (2)

(57) [Claims] 1. A clamping the TAB tape in the molding die a resin molding apparatus for a resin mold, the inner bottom surface of the cavity over which is provided in the mold, the T provided with a semiconductor chip set in the cavity
A gate end is opened in accordance with a through hole position provided for the resin flow between the upper cavity and the lower cavity with an AB tape, and a vertical gate communicating between the gate end and a pot into which the resin is charged is provided. A resin molding apparatus, comprising: a plunger provided vertically to a chip surface of a semiconductor chip mounted on the TAB tape , and a plunger for feeding resin melted in the pot into the cavity through the vertical gate. 2. The resin molding apparatus according to claim 1, wherein an opening position of a gate end of the vertical gate is set at a position near a corner of a semiconductor chip mounted on the TAB tape .