JP3182302B2 - Method for manufacturing resin-encapsulated semiconductor device - Google Patents

Abstract

PURPOSE: To obtain a die for manufacturing a resin-sealable semiconductor device which can prevent a defective appearance from generating by providing an adjustment means for adjusting the opening amount of an injection orifice, on the injection orifice for injecting a resin into the space of a mold. CONSTITUTION: Dies 11, 12 for manufacturing a resin-sealable semiconductor device are constituted of a movable gate 18 for adjusting the opening amount of a resin infection orifice 14, provided on the resin infection orifice for injecting a sealing resin 3 into a cavity 13. Consequently, it is possible to set the opening amount of the resin injection orifice 14 optionally. For example, if the opening amount is increased at the time of resin injection and the sealing resin 3 is semi-cured after resin injection, the opening amount can be lessened. Thus it is possible to control the thickness of a root part connected to the unnecessary part of the semiconductor device, which is formed from a track of an injection groove 15 projecting from the semiconductor device part. Thus the root part can be made thin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to a manufacturing method of the resin-sealed semiconductor device such as a power resin-sealed semiconductor device formed by transfer molding.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view showing a conventional resin-encapsulated power semiconductor device. 6A and 6B are views for explaining a manufacturing die and a manufacturing method of the power-resin-sealed semiconductor device shown in FIG. 5, wherein FIG. 6A is a side sectional view, and FIG. It is a perspective view.

In the power-resin-sealed semiconductor device (hereinafter simply referred to as "semiconductor device"), only the surface of a support plate 1a on which a semiconductor chip 2 of a lead frame 1 is mounted is formed of a sealing resin (for example, (Epoxy resin, polyimide resin, etc.) 3.

In the resin sealing technique of the semiconductor device, as shown in FIG. 6, resin sealing of the semiconductor chip 2 is performed using an upper mold die 11 and a lower mold die 12.

That is, in this method, first, a semiconductor chip 2 is bonded to a support plate 1a constituting a part of a lead frame 1 so as to be electrically conductive, and the semiconductor chip 2 is bonded to external lead terminals 1b by bonding wires 4. Connect with

Next, as shown in FIG. 6, the support plate 1a is disposed in a cavity (mold space) 13 formed by the molds 11 and 12, and a resin injection port 14 is provided.
The sealing resin 3 is pressed into the cavity 13 from above.
The size of the resin injection port 14 is in the thickness direction (both molds 1).
1 and 12) are 0.5 mm, and the width direction is 3 mm. Here, in the lead frame 1, the back side of the support plate 1 a is arranged along the surface of the lower mold die 11, and the external lead terminals 1 b are sandwiched between the two mold dies 11 and 12.

After the sealing resin 3 is cured, the resin-sealed lead frame 1 is taken out of the molds 11 and 12, and unnecessary portions of the lead frame 1 such as the strip 5 and the tie bar 6 are cut off. By removing unnecessary portions of the sealing resin 3 (traces of the injection grooves 15 due to resin injection),
A resin-sealed semiconductor device as shown in FIG. 5 is obtained.
FIG. 7 is a perspective view showing another semiconductor device. FIG.
8A and 8B are views for explaining a manufacturing die and a manufacturing method of the power resin-sealed semiconductor device shown in FIG. 7, wherein FIG. 8A is a side cross-sectional view, and FIG. .

The semiconductor device has a structure in which the entire support plate 1 a on which the semiconductor chip 2 of the lead frame 1 is mounted is resin-sealed with a sealing resin 3.

In the resin sealing technique for a semiconductor device, as shown in FIG. 8, a resin sealing of a semiconductor chip is performed using an upper mold die 11 and a lower mold die 12. The upper mold die 11 and the lower mold die 12 each include positioning pins 16 and 17 for supporting the end of the support plate 1 a in the cavity 13.

That is, in this method, first, a semiconductor chip 2 is bonded to a support plate 1a constituting a part of the lead frame 1 so as to be electrically conductive, and the semiconductor chip 2 is bonded to external lead terminals 1b by bonding wires 4. Connect with

Next, as shown in FIG. 8, the support plate 1a is placed in a cavity 13 formed by the molds 11 and 12, and
The sealing resin 3 is press-fitted therein. The size of the resin injection port 14 is 0.5 mm in the thickness direction and 3 mm in the width direction, as in the conventional example. Here, the lead frame 1 has an end portion of the support plate 1a and the positioning pins 1a.
6, 17 and the external lead terminal 1b is sandwiched between the two molds 11, 12.

After semi-curing of the sealing resin 3, the positioning pins 16 and 17 are moved to the surfaces of the molds 11 and 12, respectively.

After the sealing resin 3 is cured, the resin-sealed lead frame 1 is taken out of the molds 11 and 12, and unnecessary portions of the lead frame 1 such as tie bars 6 are cut off. By removing unnecessary portions, a resin-sealed semiconductor device as shown in FIG. 7 is obtained.

[0014]

In the above-mentioned conventional example,
As a method of removing the unnecessary portion of the sealing resin 3, for example, in the semiconductor device shown in FIG. 5, the unnecessary portion 3a is fixed and the semiconductor device portion is moved up and down as shown in FIG. 3a). FIG. 9A is a side view when the unnecessary portion 3a is fixed, and FIG. 9B is a side view when it is moved up and down.

Here, a root portion of the unnecessary portion 3a,
That is, the portion connected to the semiconductor device has a thickness of 0.5
10A, an unnecessary portion remains as shown in FIG. 10A or a chipping occurs in the semiconductor device portion as shown in FIG. 10B, resulting in defective appearance. Was. Further, due to the adhesive force between the support plate 1a and the unnecessary portion 3a of the sealing resin 3, there is a problem that the support plate 1a is deformed as shown in FIG.

In the semiconductor device shown in FIG.
As shown in FIG. 12, stress was applied to the unnecessary portion 3a of the sealing resin 3 by using the gate break roller 21 and the like, and the forced break was performed mechanically.
As shown in FIG. 12B, the unnecessary portion remains, and FIG.
As shown in (d), there was a problem that the semiconductor portion was chipped, resulting in a defective appearance. FIG. 12 (a)
(B) is a side view when an unnecessary portion remains.
3A is a perspective view of FIG. 3A, FIG. 3C is a side view of the case where chipping has occurred, and FIG. 3D is a perspective view of FIG.

In view of the above problems, an object of the present invention is to provide a method of manufacturing a resin-encapsulated semiconductor device which can prevent appearance defects and the like from occurring.

[0018]

According to a first aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device, comprising the steps of: mounting a lead frame having a semiconductor chip mounted on one end between an upper mold and a lower mold; Disposing the one end of the lead frame in a mold space formed between the upper mold and the lower mold, and clamping the other end between the upper mold and the lower mold to form the mold space. to one end of the previous SL lead frame by injecting resin to resin seal part, the mold space portion smell
Positioning pin for supporting the end of the lead frame
When, the inlet for injecting the resin into the mold space, the resin-sealed with a mold for manufacturing ∎ You can Aburafutome type semiconductor device name provided with adjusting means for adjusting the amount of opening of the infusion inlet semiconductor
In a method of manufacturing a device, a semiconductor chip is bonded to one end side.
Connected to the external lead terminal with a mounting wire
Hold one end of the lead frame between the upper mold and the lower mold.
Place it in the formed mold space and raise the other end
A step of clamping between a surface mold and a lower surface mold;
Insert the positioning pin into the space between the lead frame
Fixing the end of the inlet and increasing the opening amount of the inlet.
Resin in the mold space from the injection port
Injecting and when the resin is in a semi-cured state,
Move the positioning pin to the mold surface and
The opening amount of the inlet is adjusted by adjusting means provided at the inlet.
And a step of reducing the size .

According to a second aspect of the present invention, in the method of manufacturing a resin-sealed semiconductor device, the upper mold and the lower mold substantially overlap with one of the upper mold and the lower mold. An injection groove for guiding a resin into the mold space is provided in a part of the portion, and the adjusting means inserted into the injection groove is provided in one of the upper mold and the lower mold. It is characterized by the following.

According to a third aspect of the present invention, in the method for manufacturing a resin-encapsulated semiconductor device, the distance between the front end surface and the lower surface mold increases from the injection port side to the opposite side. It is characterized by being inclined as described above.

[0021]

According to a fourth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device, the opening amount of the injection port when the resin is in a semi-cured state is determined by juxtaposing the upper mold and the lower mold. and it is characterized in by comprising a 0.3 to 0.2 m m with respect to a direction.

[0023]

According to the above configuration, manufacturing mold of the manufacturing method of the tree Aburafutome type semiconductor device of the present invention, the inlet for injecting the resin into the mold space, adjustment for adjusting the amount of opening of the infusion inlet Because of the configuration provided with the means, it is possible to arbitrarily set the opening amount of the injection port, for example, to increase the opening amount at the time of resin injection, and when the resin is in a semi-cured state after the resin injection It is possible to reduce the opening amount. Further
The method for manufacturing a resin-sealed semiconductor device of the present invention
In front of the mold space with the inlet opening large
The step of injecting the resin from the injection port and the resin is semi-cured
When the condition is reached, move the positioning pin to the mold surface.
And adjusting means provided at the injection port.
And reducing the amount of opening of the injection port.
Therefore, when injecting the resin,
Can be injected to shorten the injection time, and the injected resin
When the material is in a semi-cured state, cure by reducing the opening amount
As a result, the thickness of the root of the unnecessary portion of the resin is reduced.
can do.

[0024] In addition, manufacturing of the tree Aburafutome type semiconductor device of the present invention
The manufacturing method uses a manufacturing mold in which the tip end surface of the adjusting means is inclined so that the distance between the tip end surface and the lower surface mold is widened from the injection port side to the opposite side, so that the sealing formed by the injection groove mark is used . It is possible to gradually reduce the thickness of the unnecessary portion of the sealing resin in the root direction.

[0025]

[0026]

FIG. 1 is an external view of a mold for manufacturing a resin-sealed semiconductor device according to an embodiment of the present invention and a resin-sealed semiconductor device formed by a manufacturing method using the same. , (A) is a perspective view, and (b) is a side view.

A resin-sealed semiconductor device (hereinafter simply referred to as a “semiconductor device”) formed according to the present embodiment is a semiconductor device in which the back surface of the support plate 1 a of the lead frame 1 is also resin-sealed. Consists of

As shown in FIGS. 2 (a) and 2 (b), the mold for manufacturing the semiconductor device according to this embodiment comprises an upper mold mold 11 and a lower mold mold 12. Concave portions 11a and 12a are formed in the portions 11 and 12, respectively, and a cavity (mold space portion) 13 is formed by overlapping the concave portions 11a and 12a with each other.

In the upper mold 11, an injection groove 15 for guiding the sealing resin 3 to the cavity 13 is formed.
An adjusting means 18 comprising a movable gate or the like for adjusting the opening amount of the resin injection port 14 in the vicinity of the resin injection port 14 adjacent to 3
Is provided.

The movable gate 18 is provided on the upper mold 1.
The two molds 1 are located at positions corresponding to the injection grooves 15 of the first mold 1.
The through holes 19 formed in the juxtaposition direction of the first and second through holes 12 are inserted into the through holes 19, and the opening amount of the resin injection port 14 is adjusted by moving up and down in the through holes 19. The distal end surface 18a of the movable gate 18 has a structure that is inclined from the injection port side to the opposite side so that the distance between the distal end surface 18a and the lower mold 12 is increased.

Further, the two molds 11, 12
Are positioning pins 16, 1 for supporting the end of the support plate 1a of the lead frame 1 in the cavity 13, respectively.
7 is provided. As a result, the end of the support plate 1a of the lead frame 1 is held between the positioning pins 16 and 17. The positioning pins 16 and 17 are guided into the cavity 13 through through holes provided at predetermined positions of the upper mold die 11 or the lower mold die 12, respectively.
By moving up and down in the through hole, the end of the support plate 1a is not held or not.

Hereinafter, a method of manufacturing a resin-sealed semiconductor device using the above-described upper mold die 11 and lower mold die 12 will be described.

First, the semiconductor chip 2 is connected to the lead frame 1.
The semiconductor chip 2 is connected to the external lead terminal 1b by a bonding wire 4 on the supporting plate 1a so as to be electrically conductive.

Next, the lead frame 1 on which the semiconductor chip 2 is mounted is set on a lower mold 12 as shown in FIG. To hold the external lead terminal 1b. Next, the positioning pins 16 and 17 of the molds 11 and 12 are inserted into the cavity 13 to fix the end of the support plate 1a.

Thereafter, a sealing resin 3 such as an epoxy resin or a polyimide resin is press-fitted into a cavity 13 formed between the mold dies 11 and 12 from a resin injection port 14 by a transfer molding method, and injection molding is performed. I do. At this time, the movable gate 18 is disposed at a position where the tip thereof substantially coincides with the surface of the upper mold die 11, and the resin injection port 14 is largely opened. The size of the resin inlet 14 at this time is in the thickness direction (both molds 11 and 1).
2) are 0.5 mm in width and 3 mm in width.
Consists of

After semi-curing of the sealing resin 3, as shown in FIG. 2B, the positioning pins 16, 17 are moved to the surfaces of the molding dies 11, 12, and the movable gate 18 is moved to the surface. It is lowered to a position where the distance between the injection port side and the lower mold 12 is 0.2 mm. At this time, the remaining traces of the positioning pins 16 and 17
The traces of the positioning pins 16 and 17 are filled by the flow of the sealing resin 3 when pressed by the lowering of the movable gate 18.

After the sealing resin 3 is cured, the resin-sealed lead frame 1 is taken out of the molds 11 and 12, and unnecessary portions of the lead frame 1, such as tie bars and horizontal frames, are cut off, and FIG. As shown in (c), the unnecessary portion 3a of the sealing resin 3 is formed by using the gate break roller 21 or the like.
By applying stress to and mechanically removing the resin, a resin-sealed semiconductor device as shown in FIG. 1 is obtained.

As described above, in the mold for manufacturing the resin-encapsulated semiconductor device of this embodiment, the opening amount of the resin injection port 14 is adjusted to the resin injection port 14 for injecting the sealing resin 3 into the cavity 13. Since the movable gate 18 is provided, the opening amount of the resin injection port 14 can be set arbitrarily. For example, the opening amount is increased when the resin is injected, and the sealing resin is injected after the resin injection. When 3 is in a semi-cured state, the opening amount can be reduced. As a result, the unnecessary portion 3 consisting of the injection groove mark protruding from the semiconductor device portion
It is possible to control the thickness of the base portion connected to the semiconductor device of a. Therefore, the thickness of the root portion can be reduced.

The movable gate 18 has a structure in which the front end surface 18a is inclined so that the distance between the front end surface 18a and the lower mold 12 increases from the resin injection port 14 side to the opposite side. Therefore, it is possible to gradually reduce the thickness of the unnecessary portion 3a of the sealing resin 3 including the trace of the injection groove 15 in the base direction. As a result, the stress at the time of cutting the unnecessary portion 3a is applied to the thinnest root portion, and the cutting can be easily performed without causing poor appearance or the like.

Further, the method for manufacturing a resin-encapsulated semiconductor device includes a step of injecting the sealing resin 3 from the resin injection port 14 into the cavity 13 with the opening amount of the resin injection port 14 being large. When the sealing resin 3 is in a semi-cured state, a movable gate 18 provided at the resin injection port 14 is provided.
And the step of reducing the opening amount of the resin injection port 14 by the above method. Therefore, the sealing resin 3 is injected from the resin injection port 14 which is largely opened at the time of resin injection, and the injection time can be shortened. When the sealing resin 3 is in a semi-cured state, the opening amount is reduced and hardened, so that the unnecessary portion 3a including the trace of the injection groove 15 protruding from the semiconductor device portion is connected to the semiconductor device at the base of the unnecessary portion 3a. Can be reduced in thickness. Thereby, the bonding area between the semiconductor device and the unnecessary portion 3a can be reduced, and the semiconductor device is formed to be thin in the direction in which the stress at the time of cutting is applied. Unnecessary portions 3a can be removed without causing chipping or the like, and appearance defects can be prevented. FIG. 3 is an external view of a mold for manufacturing a resin-sealed semiconductor device according to another embodiment of the present invention and a resin-sealed semiconductor device formed by a manufacturing method using the same. ) Is a perspective view, and (b)
Is a side view.

The resin-encapsulated semiconductor device (hereinafter simply referred to as “semiconductor device”) formed according to this embodiment is formed by exposing the back surface of the support plate 1 a of the lead frame 1 without performing resin encapsulation. It consists of a semiconductor device.

As shown in FIGS. 4 (a) and 4 (b), the mold for manufacturing the semiconductor device according to the present embodiment comprises an upper mold mold 11 and a lower mold mold 12, both of which molds. The recesses 11a and 12a are formed in the recesses 11 and 12, respectively. The cavity 13 is formed by overlapping the recesses 11a and 12a with each other.

The lower mold 12 has an injection groove 15 for guiding the sealing resin 3 to the cavity 13.
An adjusting means 18 such as a movable gate for adjusting the opening amount of the resin injection port 14 is provided near the resin injection port 14 adjacent to the cavity 13 of the injection groove 15.

The movable gate 18 is provided in the upper mold 1.
The two molds 1 are located at positions corresponding to the injection grooves 15 of the first mold 1.
The through holes 19 formed in the juxtaposition direction of the first and second through holes 12 are inserted into the through holes 19, and the opening amount of the resin injection port 14 is adjusted by moving up and down in the through holes 19. The distal end surface 18a of the movable gate 18 has a structure that is inclined from the injection port side to the opposite side so that the distance between the distal end surface 18a and the lower mold 12 is increased.

A method for manufacturing a resin-sealed semiconductor device using the above-described upper mold die 11 and lower mold die 12 will be described below.

First, the semiconductor chip 2 is connected to the lead frame 1.
The semiconductor chip 2 is connected to the external lead terminal 1b by a bonding wire 4 on the supporting plate 1a so as to be electrically conductive.

Next, the lead frame 1 on which the semiconductor chip 2 is mounted is set on the lower mold 12 as shown in FIG. The support plate 1a is disposed in the cavity 13 while the external lead terminals 1b are sandwiched between the support plates 1a and the back surface of the support plate 1a of the lead frame 1 is aligned with the bottom surface of the concave portion 12a of the lower mold 12.

Thereafter, a sealing resin 3 such as an epoxy resin or a polyimide resin is press-fitted into a cavity 13 formed between the mold dies 11 and 12 from a resin injection port 14 by transfer molding, and injection molding is performed. I do. At this time, the movable gate 18 is disposed at a position where the tip thereof substantially coincides with the surface of the upper mold die 11, and the resin injection port 14 is largely opened.

After semi-curing of the sealing resin 3, as shown in FIG. 4 (b), the movable gate 18 is moved between the injection port side and the support plate 1 a disposed on the lower mold 12. It is lowered to a position where the distance becomes 0.2 mm.

After the sealing resin 3 is cured, the resin-sealed lead frame 1 is taken out of the molds 11 and 12, and unnecessary portions of the lead frame 1 such as tie bars and horizontal frames are cut off. As shown in FIG. 1C, the unnecessary portion 3a is removed by moving the external lead terminal 1b up and down while fixing the unnecessary portion 3a, thereby obtaining a resin-sealed semiconductor device as shown in FIG. .

As described above, in the mold for manufacturing the resin-encapsulated semiconductor device of this embodiment, the opening amount of the resin injection port 14 can be arbitrarily set, as in the above-described embodiment. It is possible to increase the opening amount and reduce the opening amount when the sealing resin 3 is in a semi-cured state after resin injection. Accordingly, it is possible to control the thickness of the root portion of the unnecessary portion 3a, which is formed by the trace of the injection groove 15 protruding from the semiconductor device portion and is connected to the semiconductor device. Therefore, the thickness of the root portion can be reduced.

The movable gate 18 has a structure in which the front end face 18a is inclined so that the distance between the front end face 18a and the lower mold 12 increases from the resin injection port 14 side to the opposite side. Therefore, it is possible to gradually reduce the thickness of the unnecessary portion 3a of the sealing resin 3 including the trace of the injection groove 15 in the base direction. As a result, the stress at the time of cutting the unnecessary portion 3a is applied to the thinnest root portion, and the cutting can be easily performed without causing poor appearance or the like.

Further, in the method of manufacturing the resin-encapsulated semiconductor device, similarly to the above embodiment, the sealing resin 3 is injected from the resin injection port 14 which is largely opened at the time of injecting the resin, so that the injection time can be shortened. When the sealing resin 3 in the semi-cured state is hardened by reducing the opening amount, the unnecessary portion 3a including the trace of the injection groove 15 protruding from the sealing portion of the semiconductor device and the sealing portion of the semiconductor device are removed. The thickness of the root portion of the unnecessary portion 3a to be connected can be reduced. Thereby, the sealing portion and the unnecessary portion 3a of the semiconductor device are formed.
The joint area can be reduced, and it is formed thin in the direction in which the stress at the time of cutting is applied. Therefore, the stress at the time of cutting can be small, and it is unnecessary without generating unnecessary resin residue or chipping on the semiconductor device. The portion 3a can be removed, and appearance defects can be prevented. In the embodiment described above, the movable gate 18
Of the tip end surface 18a of the resin injection port and the lower mold 12
, Or between the resin injection port side of the front end face 18a of the movable gate 18 and the support plate 1a of the lead frame 1 in the direction in which the molds 11 and 12 are juxtaposed. Although it was set to 2 mm, it is not limited to 0.2 mm, and the numerical value will be described below.

Generally, the mold 1 of the resin injection port 14 is used.
The smaller the opening amount in the direction in which the 1, 2 are juxtaposed, the thinner the base portion of the unnecessary portion 3a of the sealing resin 3 becomes, and the thinner the resin becomes, the weaker the strength of the resin becomes. The point is solved. Therefore, if the opening amount is smaller than the conventional opening amount of 0.5 mm, the occurrence of the problem is somewhat reduced.

Here, in order to completely solve the problem, it is desirable that the thickness is about 0.3 to 0.2 mm.

By the way, the mold 1 of the resin
When the opening amount in the direction in which 1, 12 are juxtaposed is set to be smaller than 0.2 mm, the thickness of the root portion of the unnecessary portion 3a becomes smaller than 0.2 mm corresponding to the opening amount, and becomes extremely small. When the semiconductor device is detached from the molds 11 and 12 after the sealing resin 3 is hardened, the unnecessary portion 3a becomes thin.
May fall and cause problems such as remaining in the mold. For this reason, it is not so desirable to set it smaller than 0.2 mm.

However, if the opening amount is 0 mm, that is, if the resin injection port 14 is completely closed when the sealing resin 3 is semi-cured, the unnecessary portion 3a does not occur, and the gate in the manufacturing process of the semiconductor device is eliminated. It is possible to eliminate the breaking step. This simplifies the manufacturing process.

[0058]

[Effect of the Invention] Thus, the manufacturing mold of the manufacturing method of the tree Aburafutome type semiconductor device of the present invention, the inlet for injecting the encapsulating resin into the mold space, adjusting the opening amount of the noted inlet The opening amount of the injection port can be arbitrarily set, for example, the opening amount is increased at the time of resin injection, and the sealing resin is in a semi-cured state after the resin injection. In this case, it is possible to reduce the opening amount, and thereby, it is possible to control the thickness of the root portion that is connected to the unnecessary portion of the semiconductor device, which is formed by the injection groove mark protruding from the semiconductor device portion. . Furthermore, the present invention
The method of manufacturing a resin-encapsulated semiconductor device may further include opening the injection port.
With the volume increased from the injection port into the mold space
The step of injecting the resin and the resin is in a semi-cured state
When the positioning pin is moved to the mold surface,
The opening of the inlet is adjusted by adjusting means provided at the inlet.
Because it is a configuration that includes a process to reduce the amount of mouth, resin
At the time of injection, resin is injected from the large opening
Injection time can be shortened, and injected resin is in a semi-cured state
By reducing the opening amount and curing when it becomes
Unnecessary part consisting of injection groove trace protruding from the semiconductor device part
The thickness of the root of the unnecessary part connected to the semiconductor device of
It can be thinner, which allows semiconductor devices and unnecessary parts
To reduce the bonding area and apply stress during cutting.
Is thin in the direction of
As well as unnecessary resin residue or chipping on the semiconductor device.
Unnecessary parts can be removed without producing, preventing appearance defects
it can.

[0059] In addition, manufacturing of the tree Aburafutome type semiconductor device of the present invention
According to the manufacturing method , since the leading end surface of the adjusting means is inclined so that the distance between the leading end surface and the lower surface mold is widened from the injection port side to the opposite side, the manufacturing die is used . It is possible to gradually reduce the thickness of the unnecessary portion of the sealing resin with respect to the root direction, so that the stress at the time of cutting the unnecessary portion is applied to the thinnest root portion, causing poor appearance etc. It is possible to cut easily without the need.

[0060]

[Brief description of the drawings]

FIGS. 1A and 1B are external views showing a resin-sealed semiconductor device formed according to an embodiment of the present invention, wherein FIG. 1A is a perspective view and FIG. 1B is a side view.

FIG. 2 is a side sectional view for explaining a manufacturing die and a manufacturing method of the resin-sealed semiconductor device according to one embodiment of the present invention.

3A and 3B are external views showing a resin-sealed semiconductor device formed according to another embodiment of the present invention, wherein FIG. 3A is a perspective view and FIG. 3B is a side view.

FIG. 4 is a side sectional view for explaining a manufacturing die and a manufacturing method of a resin-sealed semiconductor device according to another embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional resin-encapsulated semiconductor device.

6A and 6B are views for explaining a manufacturing die and a manufacturing method of the resin-encapsulated semiconductor device shown in FIG. 5, wherein FIG. 6A is a side sectional view, and FIG. It is.

FIG. 7 is a perspective view showing another conventional resin-encapsulated semiconductor device.

8A and 8B are views for explaining a manufacturing die and a manufacturing method of the resin-encapsulated semiconductor device shown in FIG. 7, wherein FIG. 8A is a side sectional view, and FIG. It is.

FIG. 9 is a side view for explaining a method of removing unnecessary portions of the sealing resin of the conventional example shown in FIGS. 5 and 6.

10 is a view for explaining a problem when an unnecessary portion of the sealing resin is removed by the removing method shown in FIG. 9;

FIG. 11 is a view for explaining a method of removing unnecessary portions of the sealing resin of the conventional example shown in FIGS. 7 and 8;

FIG. 12 is a view for explaining a problem when an unnecessary portion of the sealing resin is removed by the removing method shown in FIG. 11;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 1a Support plate 1b External lead terminal 2 Semiconductor chip 3 Sealing resin 3a Unnecessary part 11 Top molding die 11a Depression 12 Lower molding die 12a Depression 13 Cavity (mold space part) 14 Resin injection port 15 Injection groove 18 Movable Gate (adjustment means) 18a Tip surface

──────────────────────────────────────────────────続 き Continuation of front page (51) Int.Cl. ⁷ Identification symbol FI // B29K 105: 22 B29L 31:34 (56) References JP-A-1-123713 (JP, A) JP-A-6-326145 (JP, A) JP-A-6-124971 (JP, A) JP-A-5-237864 (JP, A) JP-A-4-249121 (JP, A) JP-A-1-105550 (JP, A) JP-A-2-168637 (JP, A) JP-A-3-259553 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29C 45/00-45/84 B29C 33/00- 33/28 H01L 21/56

Claims (4)

(57) [Claims] 1. A lead frame having a semiconductor chip mounted on one end between an upper mold and a lower mold. One end of the lead frame is formed between the upper mold and the lower mold. and clamping the other end in the upper surface mold and the lower surface mold with placing the mold space, the one end of the previous SL lead frame by injecting resin to resin sealing to the mold space
And the lead frame in the mold space.
A positioning pin for supporting the end, the inlet for injecting the resin into the mold space, a mold for manufacturing ∎ You can Aburafutome type semiconductor device name provided with adjusting means for adjusting the amount of opening of the infusion inlet In manufacturing method of resin-encapsulated semiconductor device using
The semiconductor chip on one end with a bonding wire.
Connect one end of the lead frame
Mold space formed between upper mold and lower mold
And the other end is clamped between the upper mold and the lower mold.
And inserting the positioning pin into the mold space, and
Fixing the end portion of the lead frame, and forming the mold cavity with the opening of the injection port enlarged.
A step of injecting the resin from the injection port into the space, and when the resin is in a semi-cured state, the positioning pin
To the mold surface, and
Of reducing the opening amount of the injection port by using the adjusted adjusting means
And a resin-encapsulated semiconductor device characterized by comprising:
Manufacturing method . 2. The mold of one of the upper mold and the lower mold is provided with an injection groove for guiding a resin into the mold space at a part of a portion where the upper mold and the lower mold substantially overlap. 2. The resin-encapsulated semiconductor device according to claim 1, wherein one of the upper mold and the lower mold is provided with the adjusting means inserted into the injection groove. Manufacturing method . 3. The adjusting device according to claim 2, wherein the tip end surface is inclined so that the distance between the tip end surface and the lower surface mold increases from the injection port side to the opposite side.
The manufacturing method of the resin-sealed semiconductor device according to the above. 4. The method according to claim 1 , wherein said resin is in a semi-cured state.
Set the opening amount of the inlet in the direction in which the upper mold and the lower mold are juxtaposed.
0.3 to 0.2 mm with respect to
4. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, 2 or 3 .