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JP2597155Y2 - Reflective optical coupler - Google Patents

Reflective optical coupler

Info

Publication number
JP2597155Y2
JP2597155Y2 JP1991039438U JP3943891U JP2597155Y2 JP 2597155 Y2 JP2597155 Y2 JP 2597155Y2 JP 1991039438 U JP1991039438 U JP 1991039438U JP 3943891 U JP3943891 U JP 3943891U JP 2597155 Y2 JP2597155 Y2 JP 2597155Y2
Authority
JP
Japan
Prior art keywords
light
emitting element
light emitting
light receiving
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1991039438U
Other languages
Japanese (ja)
Other versions
JPH04131956U (en
Inventor
啓一 蓮仏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1991039438U priority Critical patent/JP2597155Y2/en
Publication of JPH04131956U publication Critical patent/JPH04131956U/en
Application granted granted Critical
Publication of JP2597155Y2 publication Critical patent/JP2597155Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は発光素子の検出物体によ
る反射光を受光素子で受光する反射型光結合器に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflection type optical coupler for receiving light reflected by a detection object of a light emitting element by a light receiving element.

【0002】[0002]

【従来の技術】従来より、発光素子と受光素子とを略同
一方向に向けて配置し、発光素子の検出物体による反射
光を受光素子で受光する反射型光結合器においては特開
昭60−214573号公報等に記載されているよう
に、発光素子と受光素子との間に遮光性の隔壁を設け、
これらを樹脂で覆っていた。
2. Description of the Related Art Heretofore, a reflection type optical coupler in which a light emitting element and a light receiving element are arranged substantially in the same direction and light reflected by an object detected by the light emitting element is received by the light receiving element has been disclosed in Japanese Patent Application Laid-Open No. 60-1985. As described in 214573 and the like, a light-shielding partition is provided between the light-emitting element and the light-receiving element,
These were covered with resin.

【0003】[0003]

【考案が解決しようとする課題】ところが近年、OA機
器の小型化などに伴って、この様な反射型光結合器で検
出する物体が小さくなったり検出する場所が狭くなった
りするので反射型光結合器も小さくする様求められる
が、遮光性の隔壁は樹脂成形品や金属板からなるもの
の、これを薄くすると隔壁や樹脂の加工が困難であるば
かりか遮光性が悪くなり検出誤差を生じるようになっ
た。一方実開昭58−148954号公報に示される様
に、受光素子の中央に透孔を設けてその内側面を傾斜さ
せ、更にその傾斜させた内側面に反射被膜を設け、その
受光素子の透孔に背の低い発光素子を配置したものがあ
る。背の低い発光素子の光は傾斜した内側面で反射され
検出する物体に反射して周辺の受光素子に入射する。し
かしながら受光素子の感度を上げるためには発光素子の
全周に受光面を形成して受光面積を広く取らなければな
らず、このため光放出部と受光部が直線上に並ぶように
配置して方向性を検出することができない。又何よりも
受光素子に透孔を設ける事自体が容易でないのに、その
内側面を傾斜させ、更に反射被膜を設けるなどは極めて
煩雑な作業で現実的でない。
However, in recent years, as the size of OA equipment has been reduced, the size of an object detected by such a reflection type optical coupler or the location of detection has been reduced, and therefore, the reflection type light has been reduced. Although the coupler is required to be small, the light-shielding partition is made of a resin molded product or a metal plate, but if the partition is made thin, not only the processing of the partition and resin is difficult, but also the light-shielding property deteriorates and a detection error occurs. Became. On the other hand, as shown in Japanese Utility Model Application Laid-Open No. 58-148954, a through hole is provided in the center of the light receiving element, the inner surface thereof is inclined, and a reflection coating is further provided on the inclined inner surface. There is one in which a short light emitting element is arranged in a hole. The light of the short light emitting element is reflected by the inclined inner surface, reflected by the object to be detected, and incident on the surrounding light receiving element. However, in order to increase the sensitivity of the light receiving element, it is necessary to form a light receiving surface on the entire periphery of the light emitting element to increase the light receiving area. Therefore, the light emitting section and the light receiving section are arranged in a straight line. The direction cannot be detected. Above all, it is not easy to provide a through hole in the light receiving element itself. However, it is extremely complicated and impractical to incline the inner surface and further provide a reflective coating.

【0004】[0004]

【課題を解決するための手段】本考案は上述の点を考慮
してなされたもので、発光素子と受光素子とを光放出部
と受光部が直線上に並ぶように略同一方向に向けて配置
し、発光素子の検出物体による反射光を受光素子で受光
する反射型光結合器において、受光素子は、表面に拡散
層からなる受光面を有すると共に発光素子よりも厚く、
受光素子の発光素子に対向する側面は前記発光素子の直
接光を遮光するような略垂直な面と受光面までの距離を
有しており、発光素子と受光素子は略同一面に近接配置
したものである。
SUMMARY OF THE INVENTION The present invention has been made in consideration of the above points, and has a light emitting element and a light receiving element oriented substantially in the same direction so that a light emitting part and a light receiving part are arranged in a straight line. Arrange, in a reflective optical coupler that receives light reflected by a detection object of the light emitting element with a light receiving element, the light receiving element has a light receiving surface formed of a diffusion layer on the surface and is thicker than the light emitting element,
The side surface of the light-receiving element facing the light-emitting element has a distance between a substantially vertical surface and a light-receiving surface so as to block direct light of the light-emitting element, and the light-emitting element and the light-receiving element are arranged close to substantially the same surface. Things.

【0005】[0005]

【作用】これにより、受光素子の側面自体が遮光性の隔
壁の役目を行う。
As a result, the side surface itself of the light receiving element functions as a light shielding partition.

【0006】[0006]

【実施例】図1は本考案実施例の反射型光結合器の平面
断面図で、図2はその側面断面図であり、1は発光素子
であり、2は受光素子であって両素子は略同一方向に向
けて配置され、発光素子1の検出物体(図示せず)によ
る反射光を受光素子2で受光する。
1 is a plan sectional view of a reflection type optical coupler according to an embodiment of the present invention, FIG. 2 is a side sectional view thereof, 1 is a light emitting element, 2 is a light receiving element, and both elements are formed. The light-receiving elements 2 are arranged in substantially the same direction, and the light-receiving element 2 receives light reflected by a detection object (not shown) of the light-emitting element 1.

【0007】発光素子1は例えばGaAlAsシングル
ヘテロ発光ダイオードとかGaAs発光ダイオードから
なり、成長基板(GaAsウエハ部分)を除去するなど
して厚みが200μm、底面が800×800μmの大
きさをなし、底面から180μmのところに底面に平行
な発光接合がある。
The light emitting element 1 is made of, for example, a GaAlAs single hetero light emitting diode or a GaAs light emitting diode, and has a thickness of 200 μm and a bottom surface of 800 × 800 μm by removing a growth substrate (a GaAs wafer portion). There is a light emitting junction parallel to the bottom at 180 μm.

【0008】一方受光素子2は、プレーナ型PINフォ
トダイオードで、図から明らかなように発光素子の光放
出部と受光部が直線上に並ぶように略同一方向に向けて
配置してある。そしてこの受光素子2の厚みは300μ
mと発光素子1より厚く、表面のほぼ中央部発光素子1
と離れた方に寄せて、選択拡散により受光面21となる
P領域が形成されている。この受光面21は、発光素子
に対向する側面22から少なくとも50μm、好ましく
は70〜300μm離れている。つまり、受光素子2
は、表面に拡散層からなる受光面21を有すると共に発
光素子1よりも厚く、受光素子2の発光素子1に対向す
る側面22は発光素子1の直接光を遮光するような略垂
直な面と受光面21までの距離を有している。この距離
が、受光素子の基板材料における発光素子1の発光波長
に対する拡散長に近い場合は、側面22と受光面21と
の間に空乏層の広がりを防ぐ拡散防止層(P+層)が設
けられていることが好ましい。
On the other hand, the light receiving element 2 is a planar type PIN photodiode, and as shown in the figure, the light emitting part and the light receiving part of the light emitting element are arranged in substantially the same direction so that they are arranged in a straight line. The light receiving element 2 has a thickness of 300 μm.
m, which is thicker than the light emitting element 1 and is substantially the center of the surface.
A P region that becomes the light receiving surface 21 is formed by selective diffusion. This light receiving surface 21 is at least 50 μm, preferably 70 to 300 μm, away from the side surface 22 facing the light emitting element. That is, the light receiving element 2
Has a light-receiving surface 21 made of a diffusion layer on the surface and is thicker than the light-emitting element 1, and a side surface 22 of the light-receiving element 2 facing the light-emitting element 1 has a substantially vertical surface for blocking direct light of the light-emitting element 1. It has a distance to the light receiving surface 21. If this distance is close to the diffusion length of the light emitting element 1 in the substrate material of the light receiving element with respect to the emission wavelength, a diffusion preventing layer (P + layer) is provided between the side surface 22 and the light receiving surface 21 to prevent the depletion layer from spreading. Preferably.

【0009】これらの発光素子1と受光素子2はコモン
リード線31の同一面に載置され、各々リード線32、
33にワイヤボンド法等で配線が施されている。発光素
子1と受光素子2とはその極性により別々のリード線に
載置されていてもよいが、両素子は略同一面に発光素子
と近接配置されていることが好ましい。それは受光素子
2の側面における半導体基板が、発光素子から放射され
た光が受光面に直接到達するのを避ける効果を持つばか
りでなく、光束の不必要な拡大を防ぐ効果も持つからで
ある。これらの素子や配線は必要に応じて遮光性基板樹
脂41や透光性樹脂42で所定形状にモールドされてい
る。
The light-emitting element 1 and the light-receiving element 2 are mounted on the same surface of a common lead 31 and lead wires 32,
33 is provided with wiring by a wire bonding method or the like. The light emitting element 1 and the light receiving element 2 may be mounted on different lead wires depending on their polarities, but it is preferable that both elements are disposed close to the light emitting element on substantially the same surface. This is because the semiconductor substrate on the side surface of the light receiving element 2 not only has an effect of preventing light emitted from the light emitting element from directly reaching the light receiving surface, but also has an effect of preventing unnecessary expansion of a light beam. These elements and wirings are molded into a predetermined shape with a light-shielding substrate resin 41 and a light-transmitting resin 42 as necessary.

【0010】なお、上述の説明において、発光素子は発
光接合がその表面より低い位置にあるので発光接合の位
置が受光素子表面より低ければよいが、多くの発光素子
に於て発光接合よりも表面側の半導体部分は光透過性を
示すので、発光素子の表面が受光素子より薄いことが好
ましい。また受光素子は上述のPINフォトダイオード
に限られるものではなく、フォトトランジスタなどでも
よい。
In the above description, since the light emitting element is located at a position lower than the surface of the light emitting element, it is sufficient that the position of the light emitting element is lower than the surface of the light receiving element. Since the semiconductor portion on the side shows optical transparency, the surface of the light emitting element is preferably thinner than the light receiving element. The light receiving element is not limited to the PIN photodiode described above, but may be a phototransistor or the like.

【0011】[0011]

【考案の効果】本考案は上述のように受光素子の側面を
発光素子からの直接光を遮る遮光性の隔壁として利用す
るものであるから、両素子は近接すればするほど直接光
は受講面に到達しなくなり、かつ遮光性の隔壁としての
樹脂成形品や金属板などは不要なので反射型光結合器は
小さくすることができる。
[Effect of the Invention] As described above, the present invention uses the side surface of the light receiving element as a light-shielding partition for directly blocking the light from the light emitting element. , And the need for a resin molded product or a metal plate as a light-shielding partition is unnecessary, so that the size of the reflection type optical coupler can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の反射型光結合器の平面断面図である。FIG. 1 is a plan sectional view of the reflection type optical coupler of the present invention.

【図2】本考案の反射型光結合器の側面断面図である。FIG. 2 is a side sectional view of the reflection type optical coupler of the present invention.

【符号の説明】[Explanation of symbols]

1 発光素子 2 受光素子 1 light emitting element 2 light receiving element

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01L 31/12 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 31/12

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 発光素子と受光素子とを光放出部と受光
部が直線上に並ぶように略同一方向に向けて配置し、発
光素子の検出物体による反射光を受光素子で受光する反
射型光結合器において、前記受光素子は、表面に拡散層
からなる受光面を有すると共に発光素子よりも厚く、
光素子の発光素子に対向する側面は前記発光素子の直接
光を遮光するような略垂直な面と受光面までの距離を有
しており、発光素子と受光素子は略同一面に近接配置さ
れていることを特徴とする反射型光結合器。
1. A light receiving and light emitting portion a light emitting element and a light receiving element
Part is disposed toward the substantially same direction so as to be aligned in a straight line, in the reflection type optical coupler for receiving the light reflected by the detection object of the light emitting element in the light receiving element, the light receiving element, the diffusion layer on the surface
Thicker than the light-emitting element which has a light receiving surface made, received
The side of the optical element facing the light emitting element is the direct side of the light emitting element.
There is a distance between the substantially vertical surface that blocks light and the light-receiving surface.
A reflection type optical coupler , wherein the light emitting element and the light receiving element are arranged in close proximity to substantially the same surface.
JP1991039438U 1991-05-29 1991-05-29 Reflective optical coupler Expired - Fee Related JP2597155Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991039438U JP2597155Y2 (en) 1991-05-29 1991-05-29 Reflective optical coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991039438U JP2597155Y2 (en) 1991-05-29 1991-05-29 Reflective optical coupler

Publications (2)

Publication Number Publication Date
JPH04131956U JPH04131956U (en) 1992-12-04
JP2597155Y2 true JP2597155Y2 (en) 1999-06-28

Family

ID=31920718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991039438U Expired - Fee Related JP2597155Y2 (en) 1991-05-29 1991-05-29 Reflective optical coupler

Country Status (1)

Country Link
JP (1) JP2597155Y2 (en)

Also Published As

Publication number Publication date
JPH04131956U (en) 1992-12-04

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