JP2587089B2 - Method of transporting semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a technology effective for transporting a semiconductor device as an electronic component.

[Conventional technology]

As a conventional technique, Japanese Patent Application Laid-Open No. Sho 59-32155 describes a container for transporting electronic components.
The outline is a storage container of an electronic component having a plurality of storage portions, a stackable protruding frame portion that defines the periphery of the storage portion, and a bottom portion of the electronic component to be stored in the bottom portion of the storage portion. The electronic component is placed in a storage container provided with a protruding portion for supporting and a pressing portion that protrudes below the bottom of the storing portion and presses the upper portion of the electronic component located at the bottom when stacked with a predetermined force. It was stored and transported.

[Problems to be solved by the invention]

The present inventor has clarified that the following problems are encountered when electronic components are transported using the same storage container as the above storage container.

That is, in a state where the storage containers are stacked, the movement of the electronic components is restricted, and unnecessary movement of the electronic components in the storage container is reduced, and the lead bending and the like can be reduced, but the storage containers are separated individually. In such a case, since the electronic component is not pressed down from above, the electronic component has a problem that the lead is deformed in the storage container due to an impact.

The present inventors have also revealed that the electronic component comes into contact with and is pressed against the bottom of the stacked storage containers, so that the package is rubbed and the mark printed on the main surface of the package is peeled off. Was.

An object of the present invention is to provide a component transfer technique that can reduce lead deformation of an electrical component regardless of whether a storage container that stores electronic components is stacked.

It is another object of the present invention to provide a component transfer technique capable of reducing lead bending without pressing a package of an electronic component.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[Means for solving the problem]

The outline of a representative invention among the inventions disclosed in the present application will be briefly described as follows.

That is, the leads of the electronic component are covered with a brazing material so as to be thicker than the package and higher than the main surface, solidified, placed in a storage container in that state, and transported.

[Action]

According to the above-described means, the lead of the electronic component is covered with solidified brazing material, and even if the electronic component moves by any external impact in the storage container, the impact on the lead is The lead material is absorbed not only by the brazing material but also by the surrounding lead group (meaning a large number of leads), and it is possible to reduce the possibility of the impact being concentrated on a specific lead, thereby reducing the lead deformation. Therefore, stack the storage containers,
The lead deformation can be reduced without holding down the electronic component at the bottom of the absorption container.

Even if the storage containers containing the electronic components are stacked in multiple stages and the electronic components are pressed at the bottom of the storage container, since the solidified brazing material reaches a position higher than the main surface of the package, The material and the bottom of the storage container will be rubbed, reducing the rubbing of the package,
Peeling of the mark on the main surface of the package can be reduced.

〔Example〕

FIG. 1 is a schematic diagram showing a state in which a semiconductor device (a kind of electronic component) as a component is stored in one pocket in a tray as a storage container in the method of transporting a semiconductor device according to one embodiment of the present invention. It is sectional drawing.

FIG. 2 is a schematic cross-sectional view showing a state in which a semiconductor device as a component is covered with a brazing material in the component transport method according to one embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing a part of a stack of trays as storage containers in which semiconductor devices as components are stored in the method for transporting semiconductor devices according to one embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes a semiconductor device as a component covered with a brazing material (hereinafter referred to as a packaged semiconductor device 1).
Reference numeral 2 denotes a semiconductor device (electronic component) as a component. In this embodiment, leads protrude from four sides of a package described later. 1 shows a QF (quad flat) type semiconductor device. Reference numeral 3 denotes a package, which is a semiconductor element (not shown), which can be said to be the heart of the semiconductor device, and a quadrangular resin body that covers the periphery thereof. Reference numeral 4 denotes a lead for conducting between a semiconductor element (not shown) and the outside thereof, and protrudes from four sides (only three sides in the figure) of the package 3. Reference numeral 5 denotes a braze, which is a solidified brazing material. In this embodiment, the lead 4 has a rectangular parallelepiped shape covering from the base of the package 3 to the tip thereof, and extends to a position higher than the main surface of the package 3. What is covered. 6 is a tray as a storage container,
The pockets 7 into which the packaging semiconductor device 1 can be inserted are plate-like objects formed in a plurality of rows and a plurality of columns in the XY direction (not shown) and can be stacked. Reference numeral 8 denotes a bottom, which indicates the bottom of the pocket 7 of the tray 6.

In FIG. 2, reference numeral 9 denotes a packing jig, which is a tray for packing the semiconductor device 2 with a brazing material, and is formed with a plurality of pockets 10 into which the semiconductor device 2 is inserted. only). Reference numeral 11 denotes a side plate which constitutes the pocket 10, and extends to a position higher than the main surface of the package 2 of the semiconductor device 2 in the pocket 10. Reference numeral 12 denotes a nozzle for pouring a brazing filler metal. Reference numeral 13 denotes a brazing material which is molten. Reference numeral 14 denotes a first mask for preventing the brazing material from adhering to an undesired portion (such as a package portion) when the lead 4 of the semiconductor device 2 is covered with the brazing material. Cover the upper side. Reference numeral 15 denotes a second mask, which is a semiconductor device 2
In order to prevent the brazing material from adhering to an undesired portion (eg, a package portion) when the lead 4 is covered with the brazing material, it covers the lower side of the package 3.

In FIG. 3, the trays of FIG. 1 are stacked in two stages, and are denoted by the same reference numerals and the description thereof is omitted, but the bottom 8 of the upper tray 6 and the packing in the lower tray 6 are provided. The gap between the upper surface of the solder 5 of the semiconductor device 1 is set to 16.

The operation of the embodiment of the present invention having the above-described configuration will be described below.

First, to cover the leads 4 of the semiconductor device 2 with brazing material,
As shown in FIG. 2, after the first mask 14 is set to cover the upper side of the package 3 of the semiconductor device 2 and the second mask 15 is set to cover the lower side thereof, a packing jig is provided. 9 pockets 10 In that state, the nozzle
The molten brazing material is poured into the pocket 10 from 12 and the brazing material is solidified.

Packaging semiconductor device 1 covered with its lead 4 by wax 5
As shown in FIG. 1, the tray 6 is accommodated in a pocket 7 in the tray 6 and transported by one tray 6 or transported by a plurality of trays 6 (only two trays in FIG. 3). In the case of a single tray, no matter what impact is applied during transportation,
The packaged semiconductor device 1 moves within the pocket 7 of the tray 6, and the solder 5 contacts the side of the pocket 7 or the bottom of the pocket 7, so that the impact causes the wax 5 to cover the lead 4.
And it will be absorbed by the lead 4 group (the meaning of many leads 4) in it, and compared with the lead 4 which does not cover at all,
It is possible to reduce the impact of a specific lead on the semiconductor device and reduce the bending of the lead, thereby transporting the semiconductor device.

As shown in FIG. 3, when the trays 6 are conveyed in an overlapping manner, the package semiconductor device 1 sandwiched between the bottom 8 of the tray 6 and the pocket 7 receives any impact. In this case, the wax 5 contacts the side surface of the pocket 7, the bottom of the pocket 7, and the bottom 8 of the upper tray 6, and the impact is applied to the wax 5 covering the lead 4 as described above. It will be absorbed by 4 groups of leads inside,
As compared with the case where the leads 4 are not covered at all, it is possible to reduce the impact applied to a specific lead, to reduce the lead bending, and to transport the semiconductor device. Therefore, even when the trays are stacked and conveyed, the deformation of the leads 4 can be prevented without pressing the main surface of the package 3 of the semiconductor device 2 below on the bottom surface 8 of the upper tray 6. Further, even when a plurality of trays 6 are stacked, the wax 5 is provided to a position higher than the main surface of the package 3,
There is no need to hold down the package 3 itself (it is sufficient to hold down the wax 5). That is, the contact between the bottom 8 of the tray 6 and the package 3 of the semiconductor device 2 can be reduced, and the disappearance of marks (not shown) on the main surface of the package 3 can be reduced.

By the way, when mounting the packaging semiconductor device covered with the leads 4 with the solder 5 as described above on a printed circuit board or the like, the packaging semiconductor device is simply heated (the solder 5) and melted. In comparison with a method in which a tape or the like is attached to prevent deformation of the lead, the tape or the like can be easily mounted without giving an impact to the lead by peeling off the tape or the like.

In this embodiment, the entire lead of the semiconductor device is covered with the brazing material. However, a part of the lead (for example, a corner that is easy to bend or a part in the longitudinal direction of the lead) can be covered. The semiconductor device can be transported by reducing the amount of the brazing material used, and various covering methods are conceivable. In other words, the entire semiconductor device can be covered. In this case, even if any impact is applied during transportation, the semiconductor device and the entirety covering the semiconductor device absorb the impact, and only the lead portion is covered. It can be more resistant to shocks.

Further, in the present embodiment, the brazing material is used as a meltable material, but ice in which water is solidified can also be used. In this case, the semiconductor device is put in the pocket of the tray,
Water can be injected into the pocket, transported frozen, and baked during mounting to remove water (ice). In this case, it is possible to cope with water that is cheaper than brazing material.

Further, it is possible to cover the reed with dry ice, or to cover the reed with another medium (such as a liquid that is not heated).

(1) Cover the leads of the semiconductor device with a meltable material,
By transporting in that state, even when an impact is applied to the lead, the impact can be absorbed by the fusible material covering the lead and the lead group covered by the fusible material. As compared with the case where the leads are not covered, it is possible to reduce the impact (concentration) on a specific lead, to reduce the bending of the leads, and to carry the semiconductor device.

(2) The leads of the semiconductor device are higher than the main surface of the package and are covered with a fusible object, so that the semiconductor device is stored in a tray in that state, and even if the trays are stacked and conveyed, the fusible object remains. Since the tray protrudes from the front surface, the contact between the bottom surface of the tray and the semiconductor device package thereunder can be reduced. Therefore, it is possible to obtain the effect of reducing the displacement between the main surface of the package and the tray, and reducing the disappearance of marks on the main surface of the package and the damage to the main surface.

(3) By covering the leads of the semiconductor device with a meltable material and transporting the semiconductor device in that state, the bending of the leads can be reduced and the semiconductor device can be transported. Furthermore, when mounting a semiconductor device, a material that covers leads with heat or a medium can be melted and separated. Mounting can be performed without giving an impact to the lead such as peeling. Therefore, it is possible to reduce the possibility that the leads are deformed immediately before mounting, and furthermore, it is possible to easily mount the leads, and it is possible to obtain an effect that the mountability is improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and it can be said that various modifications can be made without departing from the gist of the invention. Not even.

〔The invention's effect〕

The effects obtained by the representative inventions among the inventions disclosed in the present application will be briefly described as follows.

In other words, the lead of the semiconductor device is covered with a meltable material, and is transported in that state, thereby mitigating the impact.
The lead bend can be reduced, and the parts covered by heat or the like can be easily melted and separated and mounted at the time of mounting.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a state in which a semiconductor device as a component is stored in one pocket in a tray as a storage container in a method of transporting a semiconductor device according to one embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing a state in which a semiconductor device as a component is covered with a brazing material in a method of transporting a semiconductor device according to an embodiment of the present invention. FIG. FIG. 7 is a schematic cross-sectional view showing a part of a tray as a storage container in which a semiconductor device as a component is stored in the transfer method of FIG. 1 ... Packing semiconductor device, 2 ... Semiconductor device, 3 ... Package, 4 ... Lead, 5 ... Wax, 6 ... Tray, 7,
10 ... pocket, 8 ... bottom, 9 ... packing jig, 11 ...
Side plate, 12 ... Nozzle, 13 ... brazing material, 14 ... first mask, 15 ... second mask, 16 ... gap.

Claims (4)

(57) [Claims] 1. A QF type semiconductor device having a plurality of leads projecting from four side surfaces of a package into a plate-like housing in which pockets into which the semiconductor device can be inserted are formed in a plurality of rows and a plurality of columns in an XY direction. A method of transporting a semiconductor device which is housed in a container and transported, wherein the plurality of leads of the semiconductor device are transported in a state where the leads are covered with a meltable material which is thicker than the package and higher than a main surface of the package. A method for transporting a semiconductor device, comprising: 2. The method according to claim 1, wherein a plurality of storage containers storing the semiconductor devices are stacked and transported. 3. The method according to claim 1, wherein the meltable material is a brazing material. 4. The method according to claim 1, wherein the meltable material is ice.