JP2024070264A - Wiring structure of electronic component and connection method of electronic component - Google Patents

Abstract

To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: In a wiring structure of electronic components, a flexible wiring element 4 having conductive wiring portions formed on the surface of a heat transfer portion 68 provided above an active element 311 and on the surface of a protrusion protruding in a different direction from the height direction on the side surface below the active element 311 among the surfaces of a first electronic component including the active element 311 installed on the substrate and electrically connected to the substrate, is arranged apart from the substrate, and the wiring portion in the flexible wiring element 4 is thermally connected to the first electronic component on the surface of the heat transfer portion 68 and electrically connected on the surface of the protrusion.SELECTED DRAWING: Figure 5

Description

The present invention relates to a wiring structure for electronic components and a method for connecting electronic components used in electrical equipment, electronic devices, computers, communication devices, etc., and in particular to a wiring structure for electronic components and a method for connecting electronic components that are suitable for reducing transmission loss in high-speed, large-capacity transmission systems and for improving the heat dissipation of the board.

Conventionally, electronic components such as semiconductor elements and devices, integrated circuits, etc., used in electrical equipment, electronic equipment, computers, communication equipment, etc., have been mounted on printed wiring boards (hereinafter referred to as substrates). Conventionally, it was also possible to use substrates made of copper-clad laminates using epoxy resins or E-glass fibers.

However, with the demand for faster, larger capacity, and lower latency transmission systems, as typified by the fifth generation mobile communication system (5G), it is becoming difficult for the conventional boards described above to meet the required transmission loss performance requirements. In addition, as a result of further miniaturization of semiconductor circuit wiring, it will become increasingly necessary to address the heat dissipation properties of boards, especially for 5G and beyond. In particular, for 5G and beyond, measures to prevent failures due to thermal stress and measures to dissipate heat will become important due to the increase in heat generated by the larger scale, higher speed, and higher integration of electronic components. With ordinary boards, it is difficult to dissipate heat because the GND (ground) layer, which has good thermal conductivity, cannot be placed sufficiently on the outermost layer. In particular, measures to prevent failures due to thermal stress and measures to dissipate heat will become urgent issues due to the increase in heat generated by the larger scale, higher speed, and higher integration of electronic components.

For this reason, in recent years, the following improvements have been attempted to meet the required characteristics of transmission loss and heat dissipation required for such high-speed transmission systems.

In order to reduce transmission loss, improvements have been made to the circuit design of semiconductors and the wiring circuit design of boards. Various improvements have also been made to the materials used in boards. In addition to the improvements to board materials mentioned above, attempts have been made to improve heat dissipation, such as installing ventilation fans, attaching heat sinks to semiconductor packages, and providing air-cooling or water-cooling mechanisms.

However, in order to further improve the low transmission loss and high heat dissipation, it is necessary to improve the board material and conduct reliability verification tests, which takes a long time to achieve. In particular, in order to further reduce the transmission loss of the board material and improve the heat dissipation, the difficulty of product design increases significantly, and the costs of the board material and development of the board also increase.

In addition, transmission loss increases significantly in the high frequency band, which places more restrictions on circuit design for the board. Also, while E-glass cloth, which is commonly used as a board material, is suitable from the standpoint of preventing thermal expansion of the board and ensuring mechanical strength, it can also be a factor in reducing the electrical properties required for the board, such as the dielectric constant and dielectric dissipation factor, as well as the surface smoothness.

In addition, in multilayer wiring boards, X-Y wiring is often used to switch wiring layers using vias in order to increase wiring density. However, this has the disadvantage that vias have a negative effect on transmission loss, and the longer the wiring, the greater the transmission loss.

In order to avoid the deterioration of electrical characteristics and wiring density caused by vias, IVH (Interstitial Via Hole) and back drilling are used in multilayer boards to connect only the necessary layers without drilling holes, but this increases the cost of the board and places restrictions on the board circuit design.

On the other hand, rather than improving the material or structure of the board itself, it is also possible to electrically connect electronic components directly via a connector rather than via the board. However, this method requires that the connector be attached to the electronic component or in the vicinity of the electronic component. It is often difficult to secure an area for attaching a connector to smaller electronic components, and transmission loss may occur in the connector.

The following technologies have been proposed to solve the above-mentioned problems in the past: Patent Documents 1 and 2. The technology disclosed in Patent Document 1 directly connects integrated circuit packages mounted on a board via a direct connect cable. The technology disclosed in Patent Document 2 thermally connects circuit boards on which semiconductor elements are mounted via a member.

JP 2010-192918 A JP 2016-213361 A

However, the technologies disclosed in the above-mentioned Patent Documents 1 and 2 are not intended to improve transmission loss or heat dissipation. For this reason, there is no specific mention of electrically connecting electronic components mounted on a substrate via wiring other than the substrate.

The present invention was devised in consideration of the above-mentioned problems, and its purpose is to provide a wiring structure for electronic components and a method for connecting electronic components that are suitable for reducing transmission loss and improving the heat dissipation of the board in a high-speed, large-capacity transmission system.

The wiring structure of the electronic component according to the first invention is characterized in that a flexible wiring body having a conductive wiring portion formed thereon is disposed at a distance from the substrate on the surface of a first electronic component including an active element that is mounted on a substrate and electrically connected to the substrate, on the surface of a heat transfer portion provided above the active element and on the surface of a protruding portion that protrudes in a direction different from the height direction of the side surface below the active element, and the wiring portion of the flexible wiring body is thermally connected to the first electronic component on the surface of the heat transfer portion and electrically connected to the surface of the protruding portion.

The wiring structure of the electronic component according to the second invention is characterized in that in the first invention, the first electronic component is placed on the substrate and electrically connected to the substrate via the substrate and the flexible wiring body, and outputs a signal to another electronic component that is directly and electrically connected to the wiring portion of the flexible wiring body.

The wiring structure of the electronic component according to the third invention is characterized in that in the first or second invention, a second electronic component is placed on the first electronic component via the flexible wiring body, and the wiring portion of the flexible wiring body is electrically connected to the second electronic component.

The wiring structure of the electronic component according to the fourth invention is the first or second invention, characterized in that the flexible wiring body is stacked in multiple layers, and the wiring portion of each flexible wiring body is electrically connected to one of the first electronic components.

The wiring structure of the electronic component according to the fifth invention is the third invention, characterized in that the flexible wiring body is stacked in multiple layers, and the wiring portion of each flexible wiring body is electrically connected to one of the second electronic components.

The wiring structure of the electronic component according to the sixth invention is the first or second invention, characterized in that the wiring portion of the flexible wiring body electrically connects two or more electronic components mounted on one of the substrates, or electrically connects electronic components mounted on each of the two or more substrates.

The wiring structure of the electronic component according to the seventh invention is the first or second invention, characterized in that the wiring portion of the flexible wiring body is formed in each layer of the conductor portion arranged in two or more layers in the flexible wiring body.

The method for connecting electronic components according to the eighth aspect of the invention is characterized in that a flexible wiring body having conductive wiring parts formed on the surface of a first electronic component including an active element that is installed on a substrate and electrically connected to the substrate, the flexible wiring body being spaced from the substrate and having a conductive wiring part formed on the surface of a heat transfer part provided above the active element and on the surface of a protruding part that protrudes in a direction different from the height direction of the side surface below the active element, is arranged so that the wiring part of the flexible wiring body and the first electronic component are thermally connected on the surface of the heat transfer part and electrically connected on the surface of the protruding part.

The ninth aspect of the present invention is a method for connecting electronic components according to the eighth aspect of the present invention, characterized in that the first electronic component outputs a signal to another electronic component that is placed on the substrate and electrically connected to the substrate via the substrate and the flexible wiring body, and that is also directly and electrically connected to a wiring portion of the flexible wiring body.

According to the first to seventh inventions, the flexible wiring body is disposed on the surface of the heat transfer section and on the surface of the protruding section at a distance from the substrate, and is thermally connected to the first electronic component on the surface of the heat transfer section and electrically connected to the first electronic component on the surface of the protruding section. Therefore, input/output signals of the first electronic component are transmitted via the flexible wiring body. This makes it possible to reduce transmission loss in the wiring structure. In addition, heat generated from the first electronic component is conducted to the flexible wiring body. Therefore, it is possible to easily dissipate heat conducted from the first electronic component to the flexible wiring body into the space between the substrate and the flexible wiring body. This makes it possible to improve the heat dissipation properties of the wiring structure. Furthermore, heat is further easily conducted from the first electronic component to the flexible wiring body. This makes it possible to improve the heat dissipation properties of the wiring structure.

In particular, according to the second invention, the first electronic component can output a signal to another electronic component via the substrate and the flexible wiring body. This makes it possible to reduce transmission loss without requiring improvements to the substrate. This makes it possible to reduce the cost of the wiring structure while also reducing the transmission loss of the wiring structure.

In particular, according to the third invention, the flexible wiring body is interposed between the first electronic component and the second electronic component and is electrically connected to the second electronic component. Therefore, input/output signals of the second electronic component are transmitted via the flexible wiring body. This makes it possible to further reduce the transmission loss of the wiring structure.

According to the third invention, the flexible wiring body is interposed between the first electronic component and the second electronic component and is electrically connected to the second electronic component. That is, heat generated from the first electronic component and the second electronic component is conducted to the flexible wiring body. Therefore, heat conducted to the flexible wiring body from multiple electronic components can be dissipated via the flexible wiring body. This can further improve the heat dissipation properties of the wiring structure.

In particular, according to the fourth invention, the flexible wiring body is stacked in multiple layers and electrically connected to one first electronic component. That is, heat generated from the first electronic component is conducted to the multiple flexible wiring bodies. Therefore, compared to a case in which multiple flexible wiring bodies are not stacked, the heat conducted to the flexible wiring body can be dispersed by heat transfer between the multiple flexible wiring bodies. This can further improve the heat dissipation properties of the wiring structure.

In particular, according to the fifth invention, the flexible wiring body is stacked in multiple sheets and interposed between the first electronic component and the second electronic component, and is electrically connected to the second electronic component. That is, heat generated from the first electronic component and the second electronic component is conducted to the multiple flexible wiring bodies. Therefore, the heat conducted from the multiple electronic components to the flexible wiring body can be dispersed by heat transfer between the multiple flexible wiring bodies. This can further improve the heat dissipation properties of the wiring structure.

In particular, according to the sixth aspect of the invention, the flexible wiring body electrically connects electronic components on the same substrate or electronic components mounted on two or more substrates. This allows for more freedom in selecting the placement of electronic components connected by the flexible wiring body. This allows for further improvement in the heat dissipation properties of the wiring structure.

In particular, according to the seventh aspect of the present invention, the wiring portion of the flexible wiring body is formed in each layer of the conductor portion having two or more layers. Therefore, it is easier to reduce transmission loss compared to when multiple flexible wiring bodies each having a single layer of wiring portion are used. This makes it possible to further reduce the transmission loss of the wiring structure.

According to the eighth to ninth inventions, the flexible wiring body is arranged so as to be separated from the substrate on the surface of the heat transfer portion and on the surface of the protrusion, and to be thermally connected to the first electronic component on the surface of the heat transfer portion and electrically connected to the first electronic component on the surface of the protrusion. Therefore, input/output signals of the first electronic component are transmitted through the flexible wiring body. This makes it possible to provide an electronic component including a wiring structure with reduced transmission loss. In addition, heat generated from the first electronic component is conducted to the flexible wiring body. Therefore, it is possible to easily dissipate heat conducted from the first electronic component to the flexible wiring body into the space between the substrate and the flexible wiring body. This makes it possible to provide an electronic component including a wiring structure with improved heat dissipation. Furthermore, heat is further easily conducted from the first electronic component to the flexible wiring body. This makes it possible to provide an electronic component including a wiring structure with improved heat dissipation.

1A to 1D are schematic cross-sectional views showing an example of a wiring structure of an electronic component according to a first embodiment. FIG. 2 is a schematic cross-sectional view showing an example of a detailed structure of the first electronic component in the first embodiment. FIG. 3(a) is a schematic cross-sectional view showing a first modified example of the detailed structure of the first electronic component in the first embodiment, FIG. 3(b) is a schematic cross-sectional view showing a second modified example of the detailed structure of the first electronic component in the first embodiment, and FIG. 3(c) is a schematic cross-sectional view showing a third modified example of the detailed structure of the first electronic component in the first embodiment. FIG. 4(a) is a schematic cross-sectional view showing a fourth modified example of the detailed structure of the first electronic component in the first embodiment, FIG. 4(b) is a schematic cross-sectional view showing a fifth modified example of the detailed structure of the first electronic component in the first embodiment, FIG. 4(c) is a schematic cross-sectional view showing a sixth modified example of the detailed structure of the first electronic component in the first embodiment, and FIG. 4(d) is a schematic cross-sectional view showing a seventh modified example of the detailed structure of the first electronic component in the first embodiment. FIG. 5( a ) is a schematic cross-sectional view showing an eighth modified example of the detailed structure of the first electronic component in the first embodiment, and FIG. 5( b ) is a schematic cross-sectional view showing a ninth modified example of the detailed structure of the first electronic component in the first embodiment. 6A and 6B are schematic cross-sectional views showing modified examples of the wiring structure of the electronic component in the first embodiment. 7A to 7E are plan views showing examples of the arrangement of flexible wiring bodies included in the wiring structure of the electronic component in the first embodiment. 8A and 8B are plan views showing an example of a configuration in which a plurality of electronic components are connected to one electronic component by flexible wiring, in the wiring structure of the electronic component according to the first embodiment. FIG. 9 is a plan view showing an example of a wiring portion of a flexible wiring body in the wiring structure of the electronic component in the first embodiment. FIG. 10 is a plan view showing a modified example of the wiring portion of the flexible wiring body in the wiring structure of the electronic component in the first embodiment. 11A to 11C are schematic cross-sectional views of the first cross section in FIG. 9 of the wiring structure of the electronic component according to the first embodiment. 12A to 12D are schematic cross-sectional views showing an example of details of a wiring portion of a flexible wiring body in the wiring structure of an electronic component in the first embodiment. FIG. 13 is a schematic cross-sectional view showing a modification of the details of the wiring portion of the flexible wiring body in the wiring structure of the electronic component in the first embodiment. FIG. 14 is a plan view showing an example of a configuration in which a plurality of flexible wiring bodies are stacked, in the wiring structure of the electronic component according to the first embodiment. FIG. 15( a ) is a schematic cross-sectional view showing an example of a configuration for electrically connecting a plurality of flexible wiring bodies to a first electronic component in the wiring structure of an electronic component in the first embodiment, and FIG. 15( b ) is a schematic cross-sectional view showing an example of a configuration for electrically connecting one flexible wiring body to a first electronic component. FIG. 16 is a schematic cross-sectional view showing an example of a configuration in which, in the wiring structure of the electronic component according to the first embodiment, the wiring structure is provided on a housing as a substitute for a substrate. FIG. 17 is a schematic cross-sectional view showing an example of a configuration in which the region between the flexible wiring body and the first electronic component is held across a predetermined gap by a gap holder, in the wiring structure of the electronic component in the first embodiment. 18A and 18B are schematic cross-sectional views showing an example of a wiring structure of an electronic component according to the second embodiment. 19A to 19C are schematic cross-sectional views showing an example of details of a wiring portion of a flexible wiring body in the wiring structure of an electronic component according to the second embodiment. FIG. 20( a ) is a schematic cross-sectional view showing an example of a configuration in the wiring structure of an electronic component in the second embodiment, in which a plurality of flexible wiring bodies are electrically connected to a first electronic component and a second electronic component, and FIG. 20( b ) is a schematic cross-sectional view showing an example of a configuration in which one flexible wiring body is electrically connected to a first electronic component and a second electronic component. FIG. 21 is a schematic cross-sectional view showing an example of a configuration in the wiring structure of an electronic component in the second embodiment, in which the areas between the flexible wiring body and the first electronic component and between the flexible wiring body and the second electronic component are held across a predetermined gap by a gap retainer. 22A to 22C are schematic cross-sectional views showing a first modified example of the details of the wiring portion of the flexible wiring body in the wiring structure of the electronic component in the second embodiment. FIG. 23 is a schematic cross-sectional view showing a second modified example of the details of the wiring portion of the flexible wiring body in the wiring structure of the electronic component in the second embodiment. 24(a) and 24(b) are schematic cross-sectional views showing a third modified example of the details of the wiring portion of the flexible wiring body in the wiring structure of the electronic component in the second embodiment. 25(a) to 25(c) are schematic cross-sectional views showing an example of a wiring structure of an electronic component according to the third embodiment. FIG. 26(a) is a schematic cross-sectional view showing a first modified example of the detailed structure of the first electronic component in the third embodiment, FIG. 26(b) is a schematic cross-sectional view showing a second modified example of the detailed structure of the first electronic component in the first embodiment, FIG. 26(c) is a schematic cross-sectional view showing a third modified example of the detailed structure of the first electronic component in the first embodiment, and FIG. 26(d) is a schematic cross-sectional view showing a fourth modified example of the detailed structure of the first electronic component in the first embodiment. 27(a) and 27(b) are schematic cross-sectional views showing an example of a wiring structure of an electronic component according to the fourth embodiment.

Below, an example of a wiring structure of an electronic component according to an embodiment of the present invention will be described in detail with reference to the drawings. In each figure, the height direction is Z, the left-right direction is X, and the direction that intersects with the height direction Z, for example, perpendicular to it, is Y. The configurations in each figure are shown diagrammatically for the purpose of explanation, and the size of each component and the size comparison between the components may differ from those shown in the figures.

(First embodiment: Wiring structure 1)
An example of the configuration of the wiring structure 1 in this embodiment and an example of the flexible wiring body 4 included in the wiring structure 1 will be described with reference to Figures 1 to 8. Figures 1(a) to 1(d) are schematic cross-sectional views showing an example of the wiring structure 1 in this embodiment. Figure 2 is a schematic cross-sectional view showing an example of a detailed structure of a first electronic component 31 included in the wiring structure 1 in this embodiment. Figure 3(a) is a schematic cross-sectional view showing a first modified example of the detailed structure of the first electronic component 31 in this embodiment, Figure 3(b) is a schematic cross-sectional view showing a second modified example of the detailed structure of the first electronic component 31 in the first embodiment, and Figure 3(c) is a schematic cross-sectional view showing a third modified example of the detailed structure of the first electronic component 31 in the first embodiment. FIG. 4(a) is a schematic cross-sectional view showing a fourth modified example of the detailed structure of the first electronic component 31 in the present embodiment, FIG. 4(b) is a schematic cross-sectional view showing a fifth modified example of the detailed structure of the first electronic component 31 in the first embodiment, FIG. 4(c) is a schematic cross-sectional view showing a sixth modified example of the detailed structure of the first electronic component 31 in the first embodiment, and FIG. 4(d) is a schematic cross-sectional view showing a seventh modified example of the detailed structure of the first electronic component 31 in the first embodiment. FIG. 5(a) is a schematic cross-sectional view showing an eighth modified example of the detailed structure of the first electronic component 31 in the present embodiment, and FIG. 5(b) is a schematic cross-sectional view showing a ninth modified example of the detailed structure of the first electronic component 31 in the first embodiment. FIGS. 6(a) to 6(b) are schematic cross-sectional views showing modified examples of the wiring structure 1 in the present embodiment. FIGS. 7(a) to 7(e) are plan views showing an example of the arrangement of the flexible wiring body 4 included in the wiring structure 1 in the present embodiment. 8A and 8B are plan views showing an example of a configuration in which a plurality of electronic components are connected to one electronic component by a flexible wiring body 4, in the wiring structure 1 of this embodiment.

<Wiring structure 1>
1(a), the wiring structure 1 includes a substrate 2, a first electronic component 31 (31a, 31b) placed on the substrate 2, and a flexible wiring body 4 arranged on a surface of the first electronic component 31 at a distance from the substrate 2. The wiring structure 1 electrically connects, for example, the first electronic component 31a and the first electronic component 31b to each other via one or both of the substrate 2 and the flexible wiring body 4.

<Substrate 2>
The substrate 2 is, for example, a printed wiring board, and is provided with wiring of an insulator and a conductor. The substrate 2 is, for example, arranged along a plane direction perpendicular to the height direction Z. The substrate 2 may be, for example, a substrate to which a plurality of printed wiring boards are attached. The substrate 2 may be, for example, a single-sided board (one wiring layer), a double-sided board (two wiring layers), or a multi-layer board (three or more wiring layers) of a printed wiring board.

<First Electronic Component 31>
The first electronic component 31 is composed of an active element (active component) that exhibits an active function, such as amplifying, rectifying, or converting energy supplied from the outside. In particular, the first electronic component 31 is preferably an element, module, or the like having many input/output signals such as high speed, low speed, and power supply signals. The first electronic component 31 may be electrically connected directly to the substrate 2, or may be electrically connected to the flexible wiring body 4, for example.

Examples of active elements configured in the first electronic component 31 include, for example, logic LSIs, memory LSIs, system LSIs, MCM/MCPs, hybrid ICs, transistors, diodes, photodiodes, small signal transistors, power transistors, LEDs, semiconductor lasers, semiconductor elements such as light emitting diodes, analog ICs, digital ICs, DRAMs, microcontrollers, integrated circuits such as CCDs, hybrid integrated circuits such as thick-film hybrids and thin-film hybrid ICs, or modules.

Examples of electronic components that do not fall under the category of first electronic component 31 include passive components such as resistors, capacitors, inductors, transformers, variable resistors, and variable capacitors; functional components such as crystal oscillators, LC filters, ceramic filters, delay lines, and SAW filters; connecting components such as switches, connectors, relays, and fuses; and conversion components such as speakers, microphones, magnetic heads, optical heads, various sensors, and small motors.

As shown in FIG. 2, the first electronic component 31 is formed by stacking two wiring sections 312 (312A, 312B) and a molded section 313. A conductor section 310A is provided on the surface of wiring section 312A, and a conductor section 310B is provided on the surface of wiring section 312B. An active element 311 is provided inside the molded section 313. Each conductor section 310 (including 310A, 310B, 310C to 310G below) is a terminal of a conductive material exposed on one of the surfaces of the first electronic component 31, such as a metal. The molded section 313 is made of a resin material such as epoxy or silicon, or an inorganic material such as ceramic.

The active element 311 is sealed by the molded part 313 because measures such as protection from scratches, external forces, and moisture and prevention of electrostatic breakdown are necessary. The active element 311 is electrically connected to each of the conductor parts 310A and 310B via the conductor part 314 provided inside the wiring part 312 (312A, 312B) and the conductor part 66 provided inside the molded part 313 in order to input and output power and electrical signals to electronic components other than the first electronic component 31. Of the conductor parts 314, the solid lines indicate the conductor parts present on the cross section shown in the schematic cross-sectional view, and the dashed lines indicate the conductor parts present on a cross section different from the cross section, and the same applies below. The conductor parts 314 and the conductor parts 66 are, for example, conductive materials (metals, etc.), and similar materials may be used for each. Since the conductor portion 66 is embedded in the molded portion 313 and molded, it is preferable that the conductor portion 66 is rod-shaped and long enough that the upper and lower ends are exposed from the molded portion 313.

The first electronic component 31 has upper and lower surfaces and side surfaces, and may be, for example, a rectangular parallelepiped shape, or may be a polygonal prism shape that is polygonal when viewed from above, or may have a shape with a protruding portion that protrudes from the surface as described below. The first electronic component 31 has conductors 310a, 310b provided on, for example, two or more different surfaces of the first electronic component 31. The first electronic component 31 can input and output signals to and from a connection surface different from the connection surface of the substrate 2 by inputting and outputting signals to and from the multiple conductors 310.

The first electronic component 31 is placed on the substrate 2, for example, as shown in FIG. 1(a). The first electronic component 31 (31a, 31b) is connected to the substrate 2, for example, via the conductor 51 (51a, 51b). As shown in FIG. 2, the conductor 310B provided on the surface of the wiring portion 312B of the first electronic component 31 is electrically connected to the substrate 2 via the conductor 51. That is, of the surfaces of the first electronic component 31, the surface on which the wiring portion 312B is provided is the surface that is connected to the substrate 2. In addition, the conductor 310A provided on the surface of the wiring portion 312A is electrically connected to the conductor 63 of the flexible wiring body 4, which is different from the substrate 2, via the conductor 65 described below.

The conductor portion 51 is formed, for example, between the first electronic component 31 and the substrate 2, and electrically connects the first electronic component 31 and the substrate 2. The conductor portion 51 may be made of, for example, solder, or any other conductive material.

The first electronic component 31 may have a conductor portion 310C provided on the surface of the molded portion 313, as shown in FIG. 3(a), for example. In this case, the active element 311 that does not have a conductor portion 314 in the molded portion 313 and is not electrically connected to the conductor portion 66 provided inside the molded portion 313 is not electrically connected to the conductor portion 310C and cannot input or output a signal to or from the conductor portion 310C. However, the conductor portion 310C in this case may function as a mark or a support member for providing the conductor portion 65. Note that the molded portion 313 may have a shape that covers at least the active element 311, and the conductor portion 66 may be exposed to the outside of the molded portion 313. That is, the conductor portion 66 may support a part of the wiring portion 312A instead of the molded portion 313, or may support a part of the flexible wiring body 4 via the conductor 65. In this case, the first electronic component 31 easily dissipates heat into the space between the conductor portion 66 and the molded portion 313.

The first electronic component 31 may not include the wiring portion 312A, as shown in FIG. 3(b), for example. In this case, the active element 311 is electrically connected to the conductor portion 310C via the conductor portion 314 and the conductor portion 66. This allows the active element 311 to input and output signals to and from the conductor portion 310C.

3(c), the first electronic component 31 may have conductor 310D provided on at least one of the side surfaces of each wiring body 312A, 312B and the side surface of the molded part 313, with the surfaces on which the conductors 310A, 310B are provided being the top and bottom surfaces of the first electronic component 31. In this case as well, the active element 311 is electrically connected to the conductor 310D via the conductor 314 and the conductor 66. This allows the active element 311 to input and output signals to and from the conductor 310D.

As shown in FIG. 4(a), the first electronic component 31 may have a wiring portion 312B having a protruding portion that protrudes from the wiring portion 312A and the molded portion 313 in a planar direction perpendicular to the direction in which the wiring portions 312A, 312B and the molded portion 313 are stacked, and a conductor portion 310E (310E-1, 310E-2) may be provided on the surface of the protruding portion of the wiring portion 312B. In this case, the active element 311 can input and output signals to and from the conductor portion 310E via the conductor portion 314 in the wiring portion 312B. Note that the conductor portion 310B is electrically connected to the substrate 2, while the conductor portion 310E is electrically connected to the flexible wiring body 4. The end of the flexible wiring body 4b connected to the conductor portion 310E-2 is separated from the substrate 2. The active element 311 may output two or more different signals to the flexible wiring body 4 (4a) via the conductor portion 310E (310E-1) and the conductor portion 65. The active element 311 may output two or more identical signals to the flexible wiring body 4 (4b) via the conductor portion 310E (310E-2) and the conductor portion 65.

The first electronic component 31 may also have an auxiliary wiring portion 67 electrically connected to the conductor portion 310A provided on the wiring portion 312A, as shown in FIG. 4B, for example. In this case, the active element 311 can input and output signals to and from the conductor portions 310A, 310B, and 310E provided on three different surfaces of the first electronic component 31. The signal output to the conductor portion 310A is output to the flexible wiring body 4 via the conductor portion 674 provided inside the auxiliary wiring portion 67, the conductor portion 670 provided on the surface of the auxiliary wiring portion 67, and the conductor portion 65.

As shown in FIG. 4(c), the first electronic component 31 may have a protrusion (which may be a cutout of the wiring part 312A based on the length of the molded part 313) that protrudes from the wiring part 312A in a planar direction perpendicular to the direction in which the wiring parts 312A, 312B and the molded part 313 are stacked, and a conductor part 310F may be provided on the upper surface (the surface facing the wiring part 312A) of the protrusion of the molded part 313. In this case, the active element 311 can input and output signals to and from the conductor part 310F via the conductor part 314 in the wiring part 312B and the conductor part 66 in the molded part 313.

As shown in FIG. 4(d), the first electronic component 31 may have a wiring portion 312A having a protruding portion protruding from the wiring portion 312B and the molded portion 313 in a planar direction perpendicular to the direction in which the wiring portions 312A, 312B and the molded portion 313 are stacked, and a conductor portion 310G (310G-1, 310G-2) may be provided on the surface of the protruding portion of the wiring portion 312A. In this case, the active element 311 can input and output signals to and from the conductor portion 310G via the conductor portion 314 in the wiring portion 312B, the conductor portion 66 in the molded portion 313, and the conductor portion 314 in the wiring portion 312A. Note that the conductor portion 310B is electrically connected to the substrate 2, while the conductor portion 310G is electrically connected to the flexible wiring body 4. The end of the flexible wiring body 4a connected to the conductor portion 310G-1 is separated from the substrate 2. The active element 311 may output two or more different signals to the flexible wiring body 4 (4a) via the conductor portion 310G (310G-1) and the conductor portion 65. The active element 311 may output two or more identical signals to the flexible wiring body 4 (4b) via the conductor portion 310G (310G-2) and the conductor portion 65.

As shown in FIG. 5(a), the first electronic component 31 may not include the wiring portion 312A, but may have a conductor portion 310C provided on the surface of the molded portion 313, and a heat transfer portion 68 provided on the same surface as the conductor portion 310C. In this case, the first electronic component 31 can easily transfer heat to the flexible wiring body 4 via the heat transfer portion 68 while inputting and outputting signals from the active element 311 to the flexible wiring body 4 via the conductor portion 310C. This can improve the heat dissipation of the wiring structure 1. The heat transfer portion 68 may be made of, for example, an adhesive with high thermal conductivity, such as a conductive paste or silicon.

5(b), the first electronic component 31 may not include the wiring portion 312A, but may have a heat transfer portion 68 on the upper surface of the molded portion 313, the wiring portion 312B may have a protruding portion protruding from the wiring portion 312A and the molded portion 313, and a conductor portion 310E may be provided on the upper surface (opposing the molded portion 313) of the protruding portion of the wiring portion 312B. In this case, the first electronic component 31 may transmit heat from one surface to the heat transfer portion 68, while inputting and outputting signals from the active element 311 to each of the conductor portions 310B and 310E provided on two surfaces of the first electronic component 31 that are different from the surface on which the heat transfer portion 68 is provided. In this case, the installation of the conductor portion 66 inside the molded portion 313 may be omitted.

<Flexible wiring body 4>
The flexible wiring body 4 is disposed, for example, on the surface of the first electronic component 31. The flexible wiring body 4 is electrically connected to the first electronic component 31, for example. The flexible wiring body 4 has a conductor portion 41. The flexible wiring body 4 has a conductive wiring portion 411 formed, for example, by processing the conductor portion 41. Details of the conductor portion 41 and the wiring portion 411 will be described later. The flexible wiring body 4 is electrically connected to the first electronic component 31 by electrically connecting the wiring portion 411 to the conductor portion 310 of the first electronic component 31. That is, the flexible wiring body 4 is arbitrarily disposed so that the wiring portion 411 and the conductor portion 310 are in contact with each other. In this respect, the flexible wiring body 4 is distinguished from the flexible wiring body 4 in that the above-mentioned connector (see paragraph 0010 of this specification) has a mounting member disposed in advance and the position where it can be disposed is limited. Details of the conductor portion 310 will be described later.

That is, the flexible wiring body 4 is disposed on the surface of the first electronic component 31 installed on the substrate 2, and is electrically connected to the first electronic component 31. In this case, for example, in the case of FIG. 1(a), a part of the signal output from the first electronic component 31a and input to the first electronic component 31b via the substrate 2 is input to the first electronic component 31b via the flexible wiring body 4. Here, if the input/output signal of the first electronic component 31 is transmitted only via the substrate 2, improvement of the substrate 2 is required to reduce the transmission loss. However, if it is transmitted via the flexible wiring body 4, the input/output signal of the first electronic component 31 is divided and transmitted to the substrate 2 and the flexible wiring body 4, so that the transmission loss can be reduced without the need to improve the substrate 2. This makes it possible to reduce the development cost, material cost, etc. required for improving the substrate 2. Therefore, by transmitting the input/output signal of the first electronic component 31 via the flexible wiring body 4, it is possible to reduce the transmission loss of the wiring structure 1 while suppressing the cost of the wiring structure 1.

The wiring structure 1 may use the substrate 2 and the flexible wiring body 4 depending on, for example, the type of input/output signal of the electronic component. The wiring structure 1 can reduce the transmission loss of the entire wiring structure 1 by, for example, transmitting input/output signals that require high-speed transmission via the flexible wiring body 4 and transmitting input/output signals such as power signals that do not require high-speed transmission via the substrate 2.

The flexible wiring body 4 is also directly connected to the first electronic component 31, which includes an active element 311. That is, the flexible wiring body 4 transmits the output signal of the first electronic component 31 without passing through passive components, functional components, connection components, conversion components, etc. In this case, no transmission loss occurs due to passing through passive components, functional components, connection components, or conversion components. This makes it possible to reduce the transmission loss of the entire wiring structure 1. In addition, in this case, there is no need to secure an area for mounting passive components, functional components, connection components, conversion components, etc. This makes it possible to miniaturize the wiring structure 1.

The flexible wiring body 4 is disposed on the surface of the first electronic component 31 placed on the substrate 2, spaced apart from the substrate 2, and electrically connected to the first electronic component 31. That is, heat generated from the first electronic component 31 is conducted to the flexible wiring body 4. In this case, in addition to dissipating heat from the first electronic component 31 to the surrounding space, it is possible to easily dissipate heat from the flexible wiring body 4 to the space between the substrate 2 and the flexible wiring body 4. This can improve the heat dissipation of the wiring structure 1. The flexible wiring body 4 may dissipate heat to the space around the flexible wiring body 4 from at least one of the main surfaces, for example, one of the main surfaces facing the substrate 2 and the other main surface located opposite the main surface. The flexible wiring body 4 may dissipate heat to the space around the flexible wiring body 4 from both the one main surface and the other main surface. This can further improve the heat dissipation of the wiring structure 1.

The flexible wiring body 4 is connected, for example, to the first electronic component 31 (31a, 31b) via the conductor portion 65 (65a, 65b).

The conductor portion 65 is formed, for example, between the flexible wiring body 4 and the first electronic component 31, and electrically connects the flexible wiring body 4 and the first electronic component 31. The conductor portion 65 may be made of solder, for example, like the conductor portion 51, or may be made of any conductive material. The conductor portion 65 is formed, for example, in contact with the conductor portion 310 of the first electronic component 31.

The conductor portion 65 may be, for example, an anisotropic conductive film (ACF), as shown in FIG. 1(b). In this case, the ACF 65 is interposed between the flexible wiring body 4 and the first electronic component 31 in advance, and they can be connected to each other by crimping.

As shown in FIG. 1(c), for example, one end of the flexible wiring body 4 may be disposed on the surface of the first electronic component 31, spaced apart from the substrate 2, and the other end may be interposed between the substrate 2 and another electronic component placed on the substrate 2. As shown in FIG. 1(d), for example, one end of the flexible wiring body 4 may be disposed on the first electronic component 31, and the other end may be electrically connected to another electronic component spaced apart from the substrate 2.

As shown in FIG. 6(a), for example, one end of the flexible wiring body 4 may be disposed on the surface of the first electronic component 31 at a distance from the substrate 2, and the other end may be connected to the connector 60. As shown in FIG. 6(b), for example, one end of the flexible wiring body 4 may be disposed on the surface of the first electronic component 31 at a distance from the substrate 2, and the connector 60 may be disposed on one surface of the other end.

The flexible wiring body 4, for example, directly electrically connects multiple first electronic components 31 together, so that when extracting a signal from the first electronic components 31, it is not necessary to provide a connector on the first electronic components 31 or in the vicinity of the first electronic components 31. In other words, it is not necessary to provide an extraction wiring from the first electronic components 31 to the connector. In this case, it is possible to reduce the volume required to install the connector and the increase in transmission loss associated with installing the connector. This allows for greater freedom in circuit design.

The flexible wiring body 4 may be freely connected according to the planar arrangement of the first electronic component 31a and the first electronic component 31b to be electrically connected, as shown in, for example, Figures 7(a) to 7(d). The flexible wiring body 4 may be electrically connected to the first electronic component 31a and the first electronic component 31b that are arranged linearly horizontally in a planar manner, as shown in, for example, Figure 7(a). The flexible wiring body 4 may be electrically connected to the first electronic component 31a and the first electronic component 31b that are arranged diagonally in a planar manner, as shown in, for example, Figures 7(b) to (d).

The flexible wiring body 4 may be freely connected according to the planar arrangement of the first electronic components 31a, 31b, and 31c to be electrically connected, as shown in FIG. 7(e), for example. The flexible wiring body 4 may electrically connect three or more first electronic components 31 arranged in a row. The flexible wiring body 4 may connect these first electronic components 31 by elastically deforming in an oblique direction or by elastically twisting the flexible wiring body 4 itself.

The flexible wiring body 4 may electrically connect a plurality of first electronic components 31a, 31c, and 31d to one first electronic component 31b, as shown in FIG. 8(a), for example. The flexible wiring body 4 may electrically connect, for example, the first electronic component 31b installed on the substrate 2 to at least one of the first electronic component 31a and the first electronic component 31c installed on the substrate 2. The flexible wiring body 4 may electrically connect, for example, the first electronic component 31b installed on the substrate 2 to the first electronic component 31d installed on a substrate 2' different from the substrate 2. In this case, the flexible wiring body 4 may electrically connect a plurality of first electronic components 31a, 31b, 31c, and 31d to one other electronic component 31b', with another electronic component 31b' disposed thereon, as shown in FIG. 8(b), for example. Note that the dashed portion in FIG. 8(b) indicates a portion of the flexible wiring body 4 that is interposed between the first electronic component 31b and the other electronic component 31b'. The flexible wiring body 4 may be integrally formed with, for example, a flexible wiring body electrically connecting the first electronic component 31a and the first electronic component 31b (the other electronic component 31b'), a flexible wiring body electrically connecting the first electronic component 31c and the first electronic component 31b (the other electronic component 31b'), and a flexible wiring body electrically connecting the first electronic component 31d and the first electronic component 31b (the other electronic component 31b').

In other words, the flexible wiring body 4 electrically connects electronic components on the same substrate or electronic components mounted on two or more substrates. In this case, the arrangement of electronic components connected by the flexible wiring body 4 can be more freely selected. This can further improve the heat dissipation properties of the wiring structure 1.

In this way, by using the flexible wiring body 4, it is possible to electrically connect the first electronic components 31 to each other, regardless of whether they are installed on one substrate 2 or on each of two or more substrates 2, 2'.

Next, referring to FIG. 9 to FIG. 13, the correspondence between the wiring portion 411 formed in the flexible wiring body 4 and the first electronic component 31 will be described. FIG. 9 is a plan view showing an example of the wiring portion 411 of the flexible wiring body 4 in the wiring structure 1 in this embodiment. FIG. 10 is a plan view showing a modified example of the wiring portion 411 of the flexible wiring body 4 in the wiring structure 1 in this embodiment. FIG. 11(a) to FIG. 11(c) are schematic cross-sectional views of the first cross section in FIG. 9 in the wiring structure 1 in this embodiment. FIG. 12(a) to FIG. 12(d) are schematic cross-sectional views showing an example of the details of the wiring portion 411 of the flexible wiring body 4 in the wiring structure 1 in this embodiment. FIG. 13 is a schematic cross-sectional view showing a modified example of the details of the wiring portion 411 of the flexible wiring body 4 in the wiring structure 1 in this embodiment.

As shown in FIG. 11, the flexible wiring body 4 has a substrate 40, conductor parts 41 (41-1, 41-2) formed on the surface of the substrate 40, and a conductor part 63 electrically connected to the conductor part 41. The flexible wiring body 4 may have, for example, a coating layer 43.

<<Substrate 40>>
The substrate 40 may be made of, for example, a flexible insulating material. The flexible insulating material may be, for example, an organic substrate, such as polyimide, modified polyimide, polyethylene terephthalate, liquid crystal polymer, polyethylene naphthalate, fluorine-based polymer, phenol, epoxy, polyphenylene oxide (PPO), polyphenylene ether (PPE), polyetherimide, polyesterimide, etc. The organic material used for the organic substrate may be either thermosetting or thermoplastic.

The substrate 40 may be, for example, an inorganic substrate, a glass sheet or an insulating sheet made of other inorganic materials, ceramics, etc.

The glass material or other inorganic material that constitutes the substrate 40 may be in any shape, such as a sheet, fiber, short fiber, or filler (granular, powder, etc.). They may also be processed into any shape, such as paper, mat, cloth, etc.

The substrate 40 may be made of an organic-inorganic composite material, for example, as long as it has flexibility. Substrate 40 made of such a material is configured to be elastically deformable.

<<Conductor portion 41>>
The conductor portion 41 is, for example, a layer that constitutes a wiring portion of the wiring structure 1. The conductor portion 41 is made of, for example, copper, but any material having electrical conductivity may be used. The conductor portion 41 is processed into the wiring portion 411 by conductor formation, for example, as shown in Figures 9 and 10. The conductor portion 41 is processed into the wiring portion 411 by, for example, an etching process, but may also be processed by any other forming method including a subtractive method, an additive method, a printing method, or the like.

As shown in FIG. 11(a), the conductor portion 41 has a two-layer structure including a conductor portion 41-1 formed on the upper surface of the substrate 40 and a conductor portion 41-2 formed on the lower surface of the substrate 40. The upper surface of the conductor portion 41-1 and the lower surface of the conductor portion 41-2 are at least partially covered by a covering layer 43. Each of the conductor portions 41-1 and 41-2 is processed into wiring portions 411-1 and 411-2 by, for example, an etching process.

<<Wiring portion 411>>
The wiring portion 411 enables electrical connection between, for example, two or more first electronic components 31 placed on the substrate 2 .

The wiring portion 411 is made of the same material as the conductor portion 41, such as copper. The wiring portion 411 may be spread over a wide area in the flexible wiring body 4, for example. In this case, the heat dissipated from the first electronic component 31 can be efficiently conducted and diffused to the flexible wiring body 4 due to the high thermal conductivity of copper. This can improve the heat dissipation properties of the wiring structure 1.

The wiring portion 411 may be formed, for example, by processing the unprocessed conductor portion 41 provided on the surface of the substrate 40 using a method such as the above-mentioned edging process. The wiring portion 411 may be formed, for example, by depositing a conductor (e.g., a material similar to that of the conductor portion 41) on the surface of the substrate 40 using a method such as plating.

Connection points are provided on both ends of the wiring portion 411. The connection points are formed into holes such as through holes, and a conductor is provided in the holes. In this way, by electrically connecting an electronic component to the connection points, the electronic component is electrically connected to the wiring portion 411.

The wiring portion 411 has connection points 412, 413 formed at both ends, as shown in FIG. 9, for example. The wiring portion 411 is formed in a line shape, for example, so that the conductor portions provided at the connection points 412, 413 can be electrically connected to each other. The conductor portion provided at the connection point 412 is electrically connected to the first electronic component 31a, for example. The conductor portion provided at the connection point 413 is electrically connected to the first electronic component 31b, for example. The conductor portion provided at each connection point 412, 413 corresponds to the conductor portion 63 shown in FIG. 11(a), for example.

The wiring portion 411 may further be provided with a connection point 414, for example, as shown in FIG. 10. The wiring portion 411 may be formed in a linear shape, for example, so that the conductor portions provided at the connection points 412, 413, and 414 can be electrically connected to each other. The conductor portions provided at the connection points 412, 413, and 414 are electrically connected to the first electronic components 31a, 31b, and 31c, for example. The conductor portion provided at the connection point 414 corresponds to the conductor portion 63 shown in FIG. 11(a), for example.

The conductor portion 63 provided at each connection point 412, 413, 414 is electrically connected to, for example, the conductor portion 310 of the first electronic component 31. The conductor portion 310 can be classified into conductor portion 310-1 (310a-1, 310b-1, 310c-1), conductor portion 310-2 (310a-2, 310b-2, 310c-2), conductor portion 310-3 (310a-3, 310b-3, 310c-3), and conductor portion 310-4 (310a-4, 310b-4, 310c-4), depending on the connection method with the wiring portion 411, as shown in, for example, Figures 9 and 10.

Note that, although Figures 9 and 10 show a case where the conductor portion 310 is arranged on the top and bottom surfaces (e.g., two surfaces perpendicular to the shortest side among the sides constituting the rectangular parallelepiped) of the substantially rectangular parallelepiped first electronic component 31, this configuration is not limited. For example, even if the conductor portion 310 is arranged on any of the side surfaces (four surfaces excluding the top and bottom surfaces) of the substantially rectangular parallelepiped first electronic component 31, the flexible wiring body 4 may be arranged so that the conductor portion 310 is electrically connected to the conductor portion 63 or the wiring portion 411.

As shown in FIG. 11(a), the wiring portion 411 has a two-layer structure including a wiring portion 411-1 formed on the upper surface of the substrate 40 and a wiring portion 411-2 formed on the lower surface of the substrate 40. The conductor portion 310-1 is a terminal or bump electrically connected to both the wiring portion 411-1 and the wiring portion 411-2. The conductor portion 310-1 is electrically connected to both the wiring portion 411-1 and the wiring portion 411-2, for example, via the conductor portion 63-2 (63) of each connection point 412, 413. The conductor portion 310-1 may be electrically connected to both the wiring portion 411-1 and the wiring portion 411-2, for example, via the conductor portion 63-2 (63) of either one of the connection points 412, 413.

The conductor portion 310-2 is a terminal or bump that is electrically connected to the wiring portion 411-1 and is not electrically connected to the wiring portion 411-2. The conductor portion 310-2 is electrically connected to the wiring portion 411-1, for example, via the conductor portion 63-1 (63) of each of the connection points 412, 413. The conductor portion 310-1 may be electrically connected to both the wiring portion 411-1 and the wiring portion 411-2, for example, via the conductor portion 63-1 (63) of either one of the connection points 412, 413.

The conductor portion 310-3 is a terminal or bump that is electrically connected to the wiring portion 411-2 and is not electrically connected to the wiring portion 411-1. The conductor portion 310-3 is electrically connected to the wiring portion 411-2 directly, for example, without going through the conductor portion 63. Therefore, the conductor portion 310-3 can be connected to the wiring portion 411-2, for example, without forming a hole in the substrate 40.

The conductor portion 310-4 is a terminal or bump that is not electrically connected to either the wiring portion 411-1 or the wiring portion 411-2. Here, the conductor portion 310-4 may be used as a spacer, for example, by being in physical contact with the wiring portion 411-2, as long as it is a portion of the wiring portion 411-2 that is not electrically connected to anything other than the conductor portion 310-4 and does not conduct electricity.

As shown in FIG. 11(a), the surface of the wiring portion 411 is covered with a covering layer 43. The wiring portion 411 is covered with a covering layer 43 on the surfaces other than the surface on which the electronic components are arranged. The wiring portion 411 may be configured as a single-layer structure of only the wiring portion 411-1 formed on the upper surface of the substrate 40, as shown in FIG. 11(b), for example. In this case, since the wiring portion 411-2 does not exist, the conductor portion 63 corresponding to the conductor portion 63-2 in FIG. 11(a) is connected in the same manner as the conductor portion 63-1. That is, the conductor portion 310 corresponding to the conductor portion 310-1 in FIG. 9 is connected in the same manner as the conductor portion 310-2. In this case, the formation of the covering layer 43 on the lower surface of the substrate 40 can be omitted. In this case, the conductor portion 63 may be adjusted to be flush with the lower surface of the substrate 40. For example, as shown in FIG. 11(c), the entire surface of the wiring portion 411-1 formed on the upper surface of the substrate 40 may be covered with, for example, a sheet-like covering layer 43. In this case, the wiring portion 411-1 is less likely to come into contact with the outside air. This makes it possible to protect the wiring, for example by preventing deterioration over time and external damage, and also to maintain insulation with the outer surface member. Regardless of whether the wiring portion 411 has a one-layer structure or a two-layer structure, it is not necessary for it to be covered with a covering layer 43, and the formation of the covering layer 43 on the upper and lower surfaces of the flexible wiring body 4 may be omitted.

The wiring section 411 may be configured, for example, in a structure of three or more layers. The flexible wiring body 4 is easier to reduce transmission loss and improve heat dissipation in a double-sided board in which the wiring section 411 is in two layers, or in a multi-layer board in which the wiring section 411 is in three or more layers, compared to a single-sided board in which the wiring section 411 is in one layer.

For example, when the substrate 40 is configured to be elastically deformable, the wiring section 411 and the covering layer 43 may be configured to be elastically deformable to follow the substrate 40. In this case, the flexible wiring body 4 may be deformed into a folded state as shown in FIG. 1(c), or may be fixed in a folded state. Similarly, the conductor section 41 that is not processed into the wiring section 411 may be configured to be elastically deformable to follow the substrate 40.

<<Covering layer 43>>
The covering layer 43 is formed so as to cover the surface of the conductor 41 formed on the upper and lower surfaces of the flexible wiring body 4. In this case, the conductor 41 can be configured not to be directly exposed. This can suppress the occurrence of scratches, damage, and rust on the conductor 41. However, there are also cases where a covering layer is not provided on the flexible wiring body 4, or where a covering layer is provided only on a part of the flexible wiring body 4 so that a part of the conductor 41 is exposed. In this case, the heat conducted to the flexible wiring body 4 can be dissipated through the conductor 41 into the space in the direction in which the conductor 41 is exposed. This can further improve the heat dissipation of the wiring structure 1.

The coating layer 43 may be, for example, a film type using a polyimide base, a PET base, or other material, or a print type using an epoxy resin, a urethane resin, or other material. The coating layer 43 may also be, for example, a photosensitive type using a photosensitive film or photosensitive ink.

<<Conductor portion 63>>
12(a) to 12(b), the conductor 63 electrically connects the wiring portion 411 of the flexible wiring body 4 and the conductor portion 310 of the first electronic component 31 via the conductor portion 65. The conductor portion 63 is formed, for example, by plating or embedding a conductor in a hole such as a through hole formed in the base material 40, and can become each of the above-mentioned connection points 412, 413, 414. The conductor portion 63 can also become each of the connection points 412, 413, 414 by forming the conductor portion 63 on the surface of the flexible wiring body 4, for example, without providing a hole such as a through hole in the flexible wiring body 4.

As shown in FIG. 12(a), for example, the conductor portion 63 is arranged so that one end is in contact with the wiring portion 411-1 and the other end is spaced apart from the wiring portion 411-2. The other end of the conductor portion 63 is removed without forming the covering layer 43, for example, and is directly exposed to the outside. The conductor portion 63 is electrically connected to the conductor 310 of the first electronic component 31, for example, via a conductor portion 65 formed between the flexible wiring body 4 and the first electronic component 31. The conductor portion 65 is arranged so as to be spaced apart from the wiring portion 411-2, for example, similar to the conductor portion 63. In this case, the first electronic component 31 and the wiring portion 411-1 are electrically connected, and the first electronic component 31 and the wiring portion 411-2 are not electrically connected.

As shown in FIG. 12(b), for example, the conductor portion 63 is arranged so that one end contacts the wiring portion 411-1 and the other end contacts the wiring portion 411-2. The conductor portion 65 may be arranged so that it contacts the wiring portion 411-2, for example, like the conductor portion 63. In this case, the first electronic component 31, the wiring portion 411-1, and the wiring portion 411-2 can be configured to be electrically connected.

The conductor portion 63 is formed on the substrate 40 so that one end contacts the substrate 40, as shown in FIG. 12(c), and the other end is arranged so as to be spaced apart from the wiring portion 411-2. The conductor portion 65 is arranged so as to be spaced apart from the wiring portion 411-2, as in the case of the conductor portion 63. In this case, the first electronic component 31, the wiring portion 411-1, and the wiring portion 411-2 may not be electrically connected. Also, as shown in FIG. 12(d), the first electronic component 31 and the wiring portion 411-2 may be electrically connected by arranging the same portion 65 so as to be in contact with the wiring portion 411-2.

The conductor portion 63 may be formed in a so-called multi-layer flexible wiring body 4, which is configured by alternately stacking two layers of substrates 40-1, 40-2 and three layers of wiring portions 411-1, 411-2, 411-3, as shown in FIG. 13, for example. In this case, by selecting which of the wiring portions 411-1, 411-2, 411-3 the conductor portion 63 is in contact with and which one is separated from, it is possible to select one or more wiring portions 411 to be electrically connected to the first electronic component 31.

According to the above configuration, the wiring section 411 in the flexible wiring body 4 is formed in each of two or more layers of the conductor section 41. In this case, it is easier to reduce transmission loss compared to when multiple flexible wiring bodies 4 each having a single layer of wiring section 411 are used. This makes it possible to further reduce the transmission loss of the wiring structure 1.

(First embodiment: modified example of wiring structure 1)
A modified example of the wiring structure 1 in this embodiment will be described with reference to Figs. 14 to 17. Fig. 14 is a plan view showing an example of a configuration in which a plurality of flexible wiring bodies 4 are stacked in the wiring structure 1 of the electronic component in this embodiment. Fig. 15(a) is a schematic cross-sectional view showing an example of a configuration in which a plurality of flexible wiring bodies 4 and a first electronic component 31 are electrically connected in the wiring structure 1 of the electronic component in this embodiment, and Fig. 15(b) is a schematic cross-sectional view showing an example of a configuration in which one flexible wiring body 4 and a first electronic component 31 are electrically connected. Fig. 16 is a schematic cross-sectional view showing an example of a configuration in which the wiring structure 1 of the electronic component in this embodiment is provided on a housing as a substitute for the substrate 2. Fig. 17 is a schematic cross-sectional view showing an example of a configuration in which the region between the flexible wiring body 4 and the first electronic component 31 is held over a predetermined gap by a gap holder 55 in the wiring structure 1 of the electronic component in this embodiment.

As shown in FIG. 14, for example, the flexible wiring body 4 is laminated in multiple sheets on the first electronic component 31g side so as to electrically connect two or more first electronic components 31e and 31f to one first electronic component 31g. In this case, as shown in FIG. 15(a), for example, the flexible wiring body 4 may be laminated with the flexible wiring body 4a connected to the first electronic component 31e and the flexible wiring body 4b connected to the first electronic component 31f, and the first electronic component 31g and the conductor portion 63a may be electrically connected via the conductor portion 65a, and the conductor portion 63a and the conductor portion 63b may be electrically connected via the conductor portion 65b. This allows the first electronic component 31g, the first electronic component 31e, and the first electronic component 31f to be electrically connected, respectively. In this way, when the first electronic component 31 and the multiple flexible wiring bodies 4a and 4b are electrically connected, this can be achieved by adjusting the positions at which the conductor portions 63 are formed at the respective connection points provided on the flexible wiring bodies 4a and 4b.

The flexible wiring body 4 is laminated in multiple sheets and electrically connected to one first electronic component 31. That is, heat generated from the first electronic component 31 is conducted to multiple flexible wiring bodies 4. In this case, compared to the case where multiple flexible wiring bodies 4 are not laminated, the heat conducted to the flexible wiring body 4 can be dispersed by heat transfer between the flexible wiring bodies 4. This can further improve the heat dissipation of the wiring structure 1. Note that the electronic component connected to the first electronic component 31g is not limited to the first electronic component 31, and may be, for example, another electronic component shown in FIG. 1 or a connector shown in FIG. 6. The flexible wiring body 4a and the flexible wiring body 4b may be directly electrically connected and laminated, or may be electrically connected via another electronic component and laminated.

The flexible wiring body 4 may electrically connect two or more electronic components to one first electronic component 31 via wiring portions 411 provided on one side, both sides, or in multiple layers of one flexible wiring body 4, as shown in FIG. 15(b), for example.

The wiring structure 1 may further include a housing 7, as shown in FIG. 16, for example. At least one end of the flexible wiring body 4 may be disposed on a first electronic component 31b installed on the housing 7 as a substitute for the substrate 2, and may be electrically connected to the first electronic component 31b.

The wiring structure 1 may further include a gap retainer 55 interposed between the first electronic component 31 and the flexible wiring body 4, as shown in FIG. 17, for example. The gap retainer 55 includes a base portion 56, a pin 57 protruding above the base portion 56, and a pin 58 protruding below the base portion 56. The gap retainer 55 may be made of any material, such as resin, metal, or ceramics.

The pin 58 is fixed, for example, by being inserted into a part of the first electronic component 31. The base 56 is placed, for example, on the first electronic component 31. The flexible wiring body 4 is placed, for example, on the base 56, and fixed by inserting the pin 57. This makes it possible for the flexible wiring body 4 to be held across a predetermined gap relative to the first electronic component 31 via the base 56. That is, the flexible wiring body 4 can be held with any gap between the first electronic component 31 and the flexible wiring body 4. In this case, the heat transferred to the flexible wiring body 4 can be dissipated into the space between the first electronic component 31 and the flexible wiring body 4. This can further improve the heat dissipation properties of the wiring structure 1.

When providing the gap retainer 55, first, the pin 58 of the gap retainer 55 is inserted into the first electronic component 31. Next, the inserted pin 58 and the pin 57 protruding upward from the base portion 56 are cut to the desired length. Next, the flexible wiring body 4 is placed on the base portion 56. Before placing the flexible wiring body 4, a conductor portion 65 may be formed on the first electronic component 31 so as to contact the conductor portion 310 of the first electronic component 31.

According to this embodiment, the flexible wiring body 4 is disposed on the surface of the first electronic component 31, which is placed on the substrate 2, at a distance from the substrate 2, and is electrically connected to the first electronic component 31. Therefore, input/output signals of the first electronic component 31 are transmitted via the flexible wiring body 4. This makes it possible to reduce the transmission loss of the wiring structure 1.

According to this embodiment, the flexible wiring body 4 is disposed on the surface of the first electronic component 31 that is placed on the substrate 2, and is electrically connected to the first electronic component 31. That is, heat generated from the first electronic component 31 is conducted to the flexible wiring body 4. This makes it easier to dissipate heat conducted from the first electronic component 31 to the flexible wiring body 4 into the space between the substrate 2 and the flexible wiring body 4. This improves the heat dissipation properties of the wiring structure 1.

Furthermore, according to this embodiment, the flexible wiring body 4 is stacked in multiple sheets and electrically connected to one first electronic component 31. That is, heat generated from the first electronic component 31 is conducted to the multiple flexible wiring bodies 4. Therefore, compared to a case where multiple flexible wiring bodies 4 are not stacked, the heat conducted to the flexible wiring body 4 can be dispersed by heat transfer between the multiple flexible wiring bodies 4. This can further improve the heat dissipation properties of the wiring structure 1.

In addition, according to this embodiment, the flexible wiring body 4 electrically connects between electronic components on the same substrate or between electronic components mounted on two or more substrates. This allows for more freedom in selecting the placement of electronic components connected by the flexible wiring body 4. This allows for further improvement in the heat dissipation properties of the wiring structure 1.

In addition, according to this embodiment, the wiring portion 411 in the flexible wiring body 4 is formed in each of two or more layers of the conductor portion 41. Therefore, it is easier to reduce transmission loss compared to using multiple flexible wiring bodies 4 with single-layer wiring portions 411. This makes it possible to further reduce the transmission loss of the wiring structure 1.

Furthermore, according to this embodiment, the flexible wiring body 4 is disposed on the surface of the first electronic component 31 mounted on the substrate 2, spaced apart from the substrate 2, so as to be electrically connected to the first electronic component 31. Therefore, input/output signals of the first electronic component 31 are transmitted via the flexible wiring body 4. This makes it possible to provide an electronic component including the wiring structure 1 with reduced transmission loss.

Furthermore, according to this embodiment, the flexible wiring body 4 is disposed on the surface of the first electronic component 31 placed on the substrate 2, spaced apart from the substrate 2, so as to be electrically connected to the first electronic component 31. That is, heat generated from the first electronic component 31 is conducted to the flexible wiring body 4. Therefore, the heat conducted from the first electronic component 31 to the flexible wiring body 4 can be dissipated into the space between the substrate 2 and the flexible wiring body 4. This makes it possible to provide an electronic component including a wiring structure 1 with improved heat dissipation properties.

(Second embodiment: Wiring structure 1)
An example of the wiring structure 1 in this embodiment will be described with reference to FIG. 18 to FIG. 20. FIG. 18(a) to FIG. 18(b) are schematic cross-sectional views showing an example of the wiring structure 1 in this embodiment. FIG. 19(a) to FIG. 19(c) are schematic cross-sectional views showing an example of the details of the wiring part of the flexible wiring body 4 in the wiring structure 1 in this embodiment. FIG. 20(a) is a schematic cross-sectional view showing an example of a configuration in which a plurality of flexible wiring bodies 4 are electrically connected to the first electronic component 31 and the second electronic component 32 in the wiring structure 1 in this embodiment, and FIG. 20(b) is a schematic cross-sectional view showing an example of a configuration in which one flexible wiring body 4 is electrically connected to the first electronic component 31 and the second electronic component 32. The wiring structure 1 in this embodiment differs from the first embodiment in that the second electronic component 32 is disposed on the first electronic component 31 via the flexible wiring body 4. Note that the description of the same configuration as the above content will be omitted.

<Wiring structure 1>
The wiring structure 1 further includes a second electronic component 32 disposed, for example, on the first electronic component 31 .

<Second Electronic Component 32>
The second electronic component 32 is, for example, the same type of electronic component as the first electronic component 31 .

The second electronic component 32 is disposed on the first electronic component 31 via the flexible wiring body 4, for example, as shown in FIG. 18(a). The second electronic component 32 is electrically connected to, for example, the wiring portion 411 of the flexible wiring body 4.

The second electronic component 32 is installed, for example, on the flexible wiring body 4. The second electronic component 32 (32a, 32b) is connected, for example, to the flexible wiring body 4 via the conductor portion 52 (52a, 52b).

The conductor portion 52 is formed, for example, between the flexible wiring body 4 and the second electronic component 32, and electrically connects the flexible wiring body 4 and the second electronic component 32. The conductor portion 52 may be made of any conductive material, such as solder. The conductor portion 52 is formed in contact with the conductor portion 320 of the second electronic component 32, as shown in FIG. 19, for example. Details of the conductor portion 320 will be described later.

The second electronic component 32 may be electrically connected to one or more other electronic components arranged thereon, for example as shown in FIG. 18(b). The second electronic component 32 may be electrically connected to one or more other flexible wiring bodies arranged thereon, for example.

<Flexible wiring body 4>
The flexible wiring body 4 is interposed between the first electronic component 31 and the second electronic component 32. The wiring portion 411 in the flexible wiring body 4 is electrically connected to the second electronic component 32. In this case, the input/output signal of the second electronic component 32 is transmitted through the flexible wiring body 4. Here, when the input/output signal of the second electronic component 32 is transmitted only through the substrate 2, the transmission path is via the first electronic component 31, so the transmission path is long and the transmission loss is likely to increase. However, when the input/output signal is transmitted through the flexible wiring body 4 electrically connected to the second electronic component 32, it is not necessary to pass through the first electronic component 31. Therefore, by transmitting the input/output signal of the second electronic component 32 through the flexible wiring body 4, the transmission loss of the wiring structure 1 can be further reduced.

Furthermore, heat generated from the first electronic component 31 and the second electronic component 32 is conducted to the flexible wiring body 4. In this case, in addition to heat dissipation from the first electronic component 31 and the second electronic component 32 to the surrounding space, heat conducted from multiple electronic components to the flexible wiring body 4 can be dissipated via the flexible wiring body 4. This can further improve the heat dissipation properties of the wiring structure 1.

<<Wiring portion 411>>
18(a), the wiring portion 411 can electrically connect each of the second electronic components 32 arranged on a first electronic component 31 installed on the substrate 2. For example, as shown in Fig. 18(b), the wiring portion 411 may electrically connect a second electronic component 32 arranged on a first electronic component 31 installed on the substrate 2 to the first electronic component 31 or another electronic component.

The connection points 412, 413, and 414 formed at both ends of the wiring portion 411 are electrically connected to, for example, the second electronic components 32a and 32b.

The conductor portion 63 provided at each connection point 412, 413, 414 is electrically connected to, for example, the conductor portion 320 of the second electronic component 32.

<<Conductor portion 63>>
The conductor 63 electrically connects the wiring portion 411 of the flexible wiring body 4 and the conductor portion 320 of the second electronic component 32 via, for example, the conductor 52 .

As shown in FIG. 19(a), the conductor portion 63 is arranged to be separated from both the wiring portion 411-1 and the wiring portion 411-2 and to be connected to the conductor portion 52 and the conductor portion 65. Both ends of the conductor portion 63 are removed without forming the coating layer 43, for example, and are directly exposed to the outside. The conductor portion 63 is electrically connected to the conductor 320 of the second electronic component 32, for example, via the conductor portion 52. The conductor portion 63 is electrically connected to the conductor 310 of the first electronic component 31, for example, via the conductor portion 65. The conductor portion 52 is arranged to be separated from the wiring portion 411-1, for example, similar to the conductor portion 63. The conductor portion 65 is arranged to be separated from the wiring portion 411-2, for example, similar to the conductor portion 63. In this case, the second electronic component 32 and the first electronic component 31 are electrically connected, and the second electronic component 32, the wiring portion 411-1, and the wiring portion 411-2 are not electrically connected.

As shown in FIG. 19B, for example, the conductor portion 63 is arranged so that one end is separated from the wiring portion 411-1 and the other end is connected to the wiring portion 411-2, the conductor portion 52, and the conductor portion 65. The conductor portion 63 is electrically connected to the conductor 320 of the second electronic component 32, for example, via the conductor portion 52. The conductor portion 63 is electrically connected to the conductor 310 of the first electronic component 31, for example, via the conductor portion 65. The conductor portion 52 is arranged so as to be separated from the wiring portion 411-1, for example, similar to the conductor portion 63. The conductor portion 65 is arranged so as to be in contact with the wiring portion 411-2, for example, similar to the conductor portion 63. In this case, the second electronic component 32, the first electronic component 31, and the wiring portion 411-2 are electrically connected, and the second electronic component 32 and the wiring portion 411-1 are not electrically connected.

The conductor portion 63 is formed on the substrate 40 so as to be in contact with the substrate 40, as shown in FIG. 19(c), for example, and is arranged so as to be spaced apart from the wiring portion 411-2. The conductor portion 52 is arranged so as to be in contact with the wiring portion 411-1, for example. The conductor portion 65 is arranged so as to be spaced apart from the wiring portion 411-2, for example, similar to the conductor portion 63. In this case, the second electronic component 32 and the wiring portion 411-1 are electrically connected, and the second electronic component 32, the first electronic component 31, and the wiring portion 411-2 can be configured not to be electrically connected.

The flexible wiring body 4 is laminated in multiple sheets on the second electronic component 32 side so as to electrically connect multiple first electronic components 31 to one second electronic component 32. In this case, as shown in FIG. 20(a), the flexible wiring body 4 may be laminated with each other, and the conductor portion 320 and the conductor portion 63b of the flexible wiring body 4b may be electrically connected via the conductor portion 51, the conductor portion 63b and the conductor portion 63a of the flexible wiring body 4a may be electrically connected via the conductor portion 65c, and the conductor portion 63a and the conductor portion 310 may be electrically connected via the conductor portion 65d. This allows one second electronic component 32 to be electrically connected to multiple first electronic components 31. In this way, when electrically connecting one second electronic component 32 to multiple flexible wiring bodies 4a, 4b, this can be achieved by adjusting the positions at which the conductors 63a, 63b are formed at each connection point provided on each flexible wiring body 4a, 4b.

The flexible wiring body 4 is laminated in multiple sheets and interposed between the first electronic component 31 and the second electronic component 32, and is electrically connected to the second electronic component 32. That is, heat generated from the first electronic component 31 is conducted to the multiple flexible wiring bodies 4. In this case, the heat conducted from the multiple electronic components to the flexible wiring body 4 can be dispersed by heat transfer between the multiple flexible wiring bodies 4. This can further improve the heat dissipation of the wiring structure 1. Note that the electronic component connected to the second electronic component 32 is not limited to the first electronic component 31, and may be, for example, the second electronic component 32, another electronic component shown in FIG. 1, or a connector shown in FIG. 6.

The flexible wiring body 4 may electrically connect two or more electronic components to one first electronic component 31 via wiring portions 411 provided on one or both sides of one flexible wiring body 4, for example as shown in FIG. 20(b).

Second embodiment: modified example of wiring structure 1
Modifications of the wiring structure 1 in this embodiment will be described with reference to Figs. 21 to 24. Fig. 21 is a schematic cross-sectional view showing an example of a configuration in which the regions between the flexible wiring body 4 and the first electronic component 31 and between the flexible wiring body 4 and the second electronic component 32 in the wiring structure 1 in this embodiment are held across a predetermined gap by a gap holder 56. Figs. 22(a) to 22(c) are schematic cross-sectional views showing a first modification of the details of the wiring portion 411 of the flexible wiring body 4 in the wiring structure 1 in this embodiment. Fig. 23 is a schematic cross-sectional view showing a second modification of the details of the wiring portion of the flexible wiring body 4 in the wiring structure in this embodiment. Figs. 24(a) to 24(b) are schematic cross-sectional views showing a third modification of the details of the wiring portion 411 of the flexible wiring body 4 in the wiring structure 1 in this embodiment.

The wiring structure 1 may further include a gap retainer 55 interposed between the second electronic component 32 and the first electronic component 31, as shown in FIG. 21 for example. The gap retainer 55 includes a base portion 56, a pin 57 protruding above the base portion 56, and a pin 58 protruding below the base portion 56.

The pin 58 is fixed, for example, by being inserted into a part of the first electronic component 31. The base 56 is placed, for example, on the first electronic component 31. The flexible wiring body 4 is placed, for example, on the base 56 and fixed by inserting the pin 57. The second electronic component 32 is placed, for example, on the upper end of the pin 57 that penetrates the flexible wiring body 4. This makes it possible to hold the flexible wiring body 4 over a predetermined gap relative to the first electronic component 31 via the base 56 and relative to the second electronic component 32 via the pin 57. That is, the flexible wiring body 4 can be held with any gap between the first electronic component 31, the second electronic component 32, and the flexible wiring body 4. In this case, the heat transferred to the flexible wiring body 4 can be dissipated to the space between the first electronic component 31 and the flexible wiring body 4, and to the space between the second electronic component 32 and the flexible wiring body 4. This makes it possible to further improve the heat dissipation of the wiring structure 1.

As shown in Figures 22(a) to 22(c), for example, not all of the conductors 52, 63, and 65 of the flexible wiring body 4 may be electrically connected to the flexible wiring body 4, and some of the conductors 52, 63, and 65 may be directly electrically connected to the first electronic component 31 and the second electronic component 32. In this case, the flexible wiring body 4 does not have to extend to the areas of the conductors 52, 63, and 65 where the first electronic component 31 and the second electronic component 32 are directly electrically connected.

The conductor portion 63 may be formed of a conductive film formed on the side end surface of the substrate 40, as shown in FIG. 23, for example. This film-like conductor portion 63 is configured to cover the side end surface and the top and bottom surfaces of the substrate 40, but is configured to be electrically disconnected by separating the conductor portions 41-1 and 41-2 from each other. By configuring the conductor portion 63 in this film-like form, a hole 61 penetrating vertically is formed in the center of the conductor portion 63. If the conductor portion 320 of the second electronic component 32 includes a pin-shaped terminal, it may be inserted through the hole 61 formed in the conductor portion 63.

The conductor portion 65 may be formed at a distance from the conductor portion 310 of the first electronic component 31, for example, as shown in Figures 24(a) to 24(b). In this case, the conductor portion 320 of the second electronic component 32 includes a pin-shaped terminal, is electrically connected to the first electronic component 31, and is separated from the wiring portion 411 provided on the surface of each flexible wiring body 4. The conductor portion 65 is formed to connect the conductor portion 320 and the wiring portion 411, so that each electronic component 31, 32 is electrically connected to the wiring portion 411.

According to this embodiment, the flexible wiring body 4 is interposed between the first electronic component 31 and the second electronic component 32, and is electrically connected to the second electronic component 32. Therefore, input/output signals of the second electronic component 32 are transmitted via the flexible wiring body 4. This makes it possible to reduce the transmission loss of the wiring structure 1.

Furthermore, according to this embodiment, the flexible wiring body 4 is interposed between the first electronic component 31 and the second electronic component 32, and is electrically connected to the second electronic component 32. That is, heat generated from the first electronic component 31 and the second electronic component 32 is conducted to the flexible wiring body 4. Therefore, heat conducted from multiple electronic components to the flexible wiring body 4 can be dissipated via the flexible wiring body 4. This can further improve the heat dissipation properties of the wiring structure 1.

In addition, according to this embodiment, the flexible wiring body 4 is stacked in multiple sheets and interposed between the first electronic component 31 and the second electronic component 32, and is electrically connected to the second electronic component 32. That is, heat generated from the first electronic component 31 and the second electronic component 32 is conducted to the multiple flexible wiring bodies 4. Therefore, the heat conducted from the multiple electronic components to the flexible wiring body 4 can be dispersed by heat transfer between the multiple flexible wiring bodies 4. This can further improve the heat dissipation properties of the wiring structure 1.

(Third embodiment: Wiring structure 1)
An example of the wiring structure 1 in this embodiment will be described with reference to FIG. 25 to FIG. 26. FIG. 25(a) to FIG. 25(c) are schematic cross-sectional views showing an example of the wiring structure 1 of the electronic component in this embodiment. FIG. 26(a) is a schematic cross-sectional view showing a first modified example of the detailed structure of the first electronic component 31 in this embodiment, FIG. 26(b) is a schematic cross-sectional view showing a second modified example of the detailed structure of the first electronic component 31 in the first embodiment, FIG. 26(c) is a schematic cross-sectional view showing a third modified example of the detailed structure of the first electronic component 31 in the first embodiment, and FIG. 26(d) is a schematic cross-sectional view showing a fourth modified example of the detailed structure of the first electronic component 31 in the first embodiment. The wiring structure 1 in this embodiment is different from the first embodiment in that it further includes a surface third electronic component 33 of a third electronic component included in any one of the one or more electronic components, which is further stacked and installed on the first electronic component 31 installed on the substrate. Note that the description of the same configuration as the above content will be omitted.

<Wiring structure 1>
The wiring structure 1 includes a third electronic component 33 included in one or more electronic components, which is further stacked on a first electronic component 31 placed on a substrate 2, for example.

<Third Electronic Component 33>
The third electronic component 33 is, for example, the same type of electronic component as the first electronic component 31. The third electronic component 33 corresponds to, for example, each configuration of the first electronic component 31 shown in FIG. 2. That is, the third electronic component 33 is configured by stacking two wiring parts 332 (332A, 332B) and a molded part 333. A conductor part 330A is provided on the surface of the wiring part 332A, and a conductor part 330B is provided on the surface of the wiring part 332B. An active element 331 is provided inside the molded part 313. Each conductor part 330 (including 330A, 330B, and the following 330D to 310G) is a terminal of a conductive material exposed on any one of the surfaces of the third electronic component 33, and for example, a metal is used. For example, a resin material such as epoxy or silicon, or an inorganic material such as ceramic is used for the molded part 333. The active element 331 is electrically connected to each of the conductor portions 330A, 310B via the wiring portion 332 and the conductor portion 334 provided inside the molded portion 333 in order to input and output power and electrical signals to and from electronic components other than the third electronic component 33.

As shown in FIG. 25(a), the third electronic component 33 is the topmost electronic component among the electronic components included in one or more electronic components that are further stacked on the first electronic component 31 installed on the substrate 2. The first electronic component 31 is electrically connected to the third electronic component 33 through each conductor 65 (65a, 65b), the other electronic components 35 (35a, 35b), and each conductor 59 (59a, 59b). The conductor 59 is, for example, the same type of conductive material as the conductor 53. The conductor 59 and the conductor 65 are formed in contact with the conductor of the other electronic component 35, for example. The third electronic component 33 is electrically connected to, for example, the wiring portion 411 in the flexible wiring body 4. The third electronic component 33 may be disposed on the first electronic component 31 and electrically connected to the first electronic component 31.

The laminate including the third electronic component 33a and the laminate including the third electronic component 33b may be formed by stacking different numbers of electronic components. The laminate including the third electronic component 33a and the laminate including the third electronic component 33b may be formed by stacking different heights along the height direction with the substrate 2 as a reference. Even in this case, the flexible wiring body 4 can electrically connect the third electronic component 33a and the third electronic component 33b by elastically deforming.

The third electronic component 33 (33a, 33b) is connected to, for example, the flexible wiring body 4 via the conductor portion 65 (65a, 65b). The third electronic component 33 (33a, 33b) is connected to, for example, the lower electronic component via the conductor portion 53 (53a, 53b).

The conductor portion 53 is formed, for example, between the third electronic component 33 and an electronic component arranged below the third electronic component 33, and electrically connects the third electronic component 33 to the electronic component arranged below the third electronic component 33. The conductor portion 53 may be made of, for example, solder, or any other material that is conductive. The conductor portion 53 is formed, for example, in contact with the conductor portion of the third electronic component 33.

A flexible wiring body 4 may be disposed on any surface of the third electronic component 33.

The third electronic component 33 is not limited to the top electronic component among the electronic components included in one or more electronic components that are further stacked on the first electronic component 31 installed on the substrate 2, as shown in FIG. 26(a), for example. The third electronic component 33 may have conductor 330D provided on at least one or more of the side surfaces of each wiring body 332A, 332B and molded part 333, with the surfaces on which each conductor 330A, 330B is provided being the upper and lower surfaces of the third electronic component 33. In this case, the active element 331 can input and output signals to and from conductor 330D in addition to conductor 330A and conductor 330B via conductor 334 and conductor 66.

26(b), the third electronic component 33 may have a wiring portion 332B having a protruding portion protruding from the wiring portion 332A and the molded portion 333 in a planar direction perpendicular to the direction in which the wiring portions 332A, 332B and the molded portion 333 are stacked, and a conductor portion 330E may be provided on the surface of the protruding portion of the wiring portion 332B. In this case, the active element 331 can input and output a signal to and from the conductor portion 330E via the conductor portion 334 in the wiring portion 332B. Note that the end of the flexible wiring body 4b connected to the conductor portion 330E-2 is separated from the substrate 2. The active element 331 may output two or more different signals to the flexible wiring body 4 (4a) via the conductor portion 310E (310E-1) and the conductor portion 65. The active element 311 may output two or more identical signals to the flexible wiring body 4 (4b) via the conductor portion 310E (310E-2) and the conductor portion 65. In addition, the conductor portion 310B is electrically connected to the conductor portion 350 of another electronic component 35 via the conductor portion 53 and the conductor portion 65.

26(c), the third electronic component 33 may have a protrusion that protrudes from the wiring part 332A in a planar direction perpendicular to the direction in which the wiring parts 332A, 332B and the molded part 333 are stacked, and a conductor part 330F may be provided on the upper surface (the surface facing the wiring part 332A) of the protrusion of the molded part 333. In this case, the active element 331 can input and output signals to and from the conductor part 330F via the conductor part 334 in the wiring part 332B and the conductor part 66 in the molded part 333.

26(d), the third electronic component 33 may have a wiring portion 332A having a protruding portion protruding from the wiring portion 332B and the molded portion 333 in a planar direction perpendicular to the direction in which the wiring portions 332A, 332B and the molded portion 333 are stacked, and a conductor portion 330G may be provided on the surface of the protruding portion of the wiring portion 332A. In this case, the active element 331 can input and output signals to and from the conductor portion 330G via the conductor portion 334 in the wiring portion 332B, the conductor portion 66 in the molded portion 333, and the conductor portion 334 in the wiring portion 332A. Note that the end of the flexible wiring body 4a connected to the conductor portion 330G-1 is separated from the substrate 2. The active element 311 may output two or more different signals to the flexible wiring body 4 (4a) via the conductor portion 310G (310G-1) and the conductor portion 65. The active element 311 may output two or more identical signals to the flexible wiring body 4 (4b) via the conductor portion 310G (310G-2) and the conductor portion 65.

<Flexible wiring body 4>
The flexible wiring body 4 is disposed, for example, on any surface of the third electronic component 33 (33a, 33b), for example, on the upper surface (the surface on which the conductor portion 330A is provided) of the third electronic component 33. The wiring portion 411 of the flexible wiring body 4 is electrically connected to the third electronic component 33.

<<Wiring portion 411>>
The wiring portion 411, for example, can electrically connect the third electronic components 33 placed on the substrate 2. For example, as shown in Figures 25(b) to 25(c), the wiring portion 411 may electrically connect the third electronic components 33 placed on the substrate 2 to the first electronic components 31 or other electronic components.

That is, the flexible wiring body 4 is disposed on the surface of the third electronic component 33 included in one or more electronic components that are further stacked on the first electronic component 31 installed on the substrate 2, at a distance from the substrate 2, and is electrically connected to the third electronic component 33. In this case, the input/output signal of the third electronic component 33 is transmitted through the flexible wiring body 4. Here, when the input/output signal of the third electronic component 33 is transmitted only through the substrate 2, in the example of FIG. 25(a), the output signal of the third electronic component 33a is input to the third electronic component 33b via the other electronic component 35a, the first electronic component 31a, the substrate 2, the first electronic component 31b, and the other electronic component 35b, so the transmission path is long and transmission loss is likely to increase. However, when the input/output signals of the third electronic component 33 are transmitted through the flexible wiring body 4 that electrically connects the third electronic component 33a and the third electronic component 33b, the path passing through the other electronic components 35a, 35b and the first electronic components 31a, 31b is shortened, making it easier to suppress transmission loss. Therefore, by transmitting the input/output signals of the third electronic component 33 through the flexible wiring body 4, it is possible to reduce the transmission loss of the wiring structure 1.

In addition, in this case, the space between the flexible wiring body 4 and the substrate 2 is larger than when the flexible wiring body 4 is disposed on the surface of the first electronic component 31, and the heat conducted from the third electronic component 33 to the flexible wiring body 4 can be more easily dissipated into that space. This improves the heat dissipation properties of the wiring structure 1.

The flexible wiring body 4 can be arranged by replacing the first electronic component 31 with a laminate of multiple electronic components including the third electronic component 33 in the configuration shown in, for example, FIG. 14-FIG. 15. That is, multiple sheets are laminated on the third electronic component 33g side so that two or more third electronic components 33e, 33f are electrically connected to one third electronic component 33g. That is, the heat generated from the third electronic component 33 is conducted to the multiple flexible wiring bodies 4. In this case, compared to the case where multiple flexible wiring bodies 4 are not laminated, the heat conducted to the flexible wiring body 4 can be dispersed by heat transfer between the multiple flexible wiring bodies 4. This can further improve the heat dissipation of the wiring structure 1. Note that the electronic component connected to the third electronic component 33g is not limited to the third electronic component 33, and may be, for example, another electronic component shown in FIG. 1 or a connector shown in FIG. 6.

According to this embodiment, the flexible wiring body 4 is disposed on the surface of a third electronic component 33 included in one or more electronic components that is further stacked on top of a first electronic component 31 that is disposed on a substrate 2, and is electrically connected to the third electronic component 33. Therefore, input/output signals of the third electronic component 33 are transmitted via the flexible wiring body 4. This makes it possible to reduce the transmission loss of the wiring structure 1.

Furthermore, according to this embodiment, the flexible wiring body 4 is disposed on the surface of a third electronic component 33 included in one or more electronic components, which is further stacked and disposed on a first electronic component 31 disposed on the substrate 2, at a distance from the substrate 2, and is electrically connected to the third electronic component 33. Therefore, compared to when the flexible wiring body 4 is disposed on the surface of the first electronic component 31, the space between the flexible wiring body 4 and the substrate 2 is larger, making it easier to dissipate heat conducted to the flexible wiring body 4 into that space. This can improve the heat dissipation properties of the wiring structure 1.

Furthermore, according to this embodiment, the flexible wiring body 4 is stacked in multiple sheets and electrically connected to one third electronic component 33. That is, heat generated from the third electronic component 33 is conducted to the multiple flexible wiring bodies 4. Therefore, compared to a case where multiple flexible wiring bodies 4 are not stacked, the heat conducted to the flexible wiring body 4 can be dispersed by heat transfer between multiple flexible wiring bodies 4. This can further improve the heat dissipation properties of the wiring structure 1.

In addition, according to this embodiment, the flexible wiring body 4 is arranged on the surface of a third electronic component 33 included in one or more electronic components that is further stacked on the first electronic component 31 that is installed on the substrate 2, and is spaced apart from the substrate 2 so as to be electrically connected to the third electronic component 33. Therefore, input/output signals of the third electronic component 33 are transmitted via the flexible wiring body 4. This makes it possible to provide an electronic component that includes a wiring structure 1 with reduced transmission loss.

Furthermore, according to this embodiment, the flexible wiring body 4 is disposed on the surface of a third electronic component 33 included in one or more electronic components, which is further stacked on the first electronic component 31 disposed on the substrate 2, so as to be spaced apart from the substrate 2 and electrically connected to the third electronic component 33. That is, heat generated from the third electronic component 33 is conducted to the flexible wiring body 4. Therefore, compared to when the flexible wiring body 4 is disposed on the surface of the first electronic component 31, the space between the flexible wiring body 4 and the substrate 2 is larger, and the heat conducted from the third electronic component 33 to the flexible wiring body 4 can be more easily dissipated into the space. This makes it possible to provide an electronic component including a wiring structure 1 with improved heat dissipation properties.

(Fourth embodiment: Wiring structure 1)
An example of the wiring structure 1 in this embodiment will be described with reference to Figures 27(a) to 27(b). Figures 27(a) to 27(b) are schematic cross-sectional views showing an example of the wiring structure 1 of an electronic component in this embodiment. The wiring structure 1 in this embodiment differs from the first embodiment in that it further includes a fourth electronic component 34 disposed on a third electronic component 33 via a flexible wiring body 4. Note that a description of the same configuration as described above will be omitted.

<Wiring structure 1>
The wiring structure 1 further includes a fourth electronic component 34 disposed, for example, on the third electronic component 33 .

<Fourth Electronic Component 34>
The fourth electronic component 34 is, for example, the same type of electronic component as the first electronic component 31. The fourth electronic component 34 is disposed on the third electronic component 33. Here, the relationship between the fourth electronic component 34 and one or more electronic components further stacked and installed on the first electronic component 31 installed on the substrate 2 is, for example, such that when the top layer of the stacked structure is the third electronic component 33, the fourth electronic component is not included in the one or more electronic components and is provided separately from the one or more electronic components. Also, when the top layer of the stacked structure is not the third electronic component 33, the fourth electronic component is included in the one or more electronic components.

The fourth electronic component 34 is disposed on the third electronic component 33 via the flexible wiring body 4, as shown in FIG. 27(a), for example. The fourth electronic component 34 is electrically connected to, for example, the wiring portion 411 of the flexible wiring body 4.

The fourth electronic component 34 is installed, for example, on the flexible wiring body 4. The fourth electronic component 34 (34a, 34b) is connected, for example, to the flexible wiring body 4 via the conductor portion 54 (54a, 54b).

The conductor portion 54 is formed, for example, between the flexible wiring body 4 and the fourth electronic component 34, and electrically connects the flexible wiring body 4 and the fourth electronic component 34. The conductor portion 54 may be made of, for example, solder, or any other material that is conductive. The conductor portion 54 is formed, for example, in contact with the conductor portion of the fourth electronic component 34.

The fourth electronic component 34 may be electrically connected to one or more other electronic components arranged thereon, for example, as shown in FIG. 27(b). The fourth electronic component 34 may be electrically connected to one or more other flexible wiring bodies arranged thereon, for example.

<Flexible wiring body 4>
The flexible wiring body 4 is interposed between the third electronic component 33 and the fourth electronic component 34. The wiring portion 411 in the flexible wiring body 4 is electrically connected to the fourth electronic component 34. In this case, the input/output signal of the fourth electronic component 34 is transmitted through the flexible wiring body 4. Here, in the case where the input/output signal of the fourth electronic component 34 is transmitted only through the substrate 2, in the example of FIG. 27(a), the output signal of the fourth electronic component 34a is input to the fourth electronic component 34b via the third electronic component 33a, the other electronic component 35a, the first electronic component 31a, the substrate 2, the first electronic component 31b, the other electronic component 35b, and the third electronic component 33b, so that the transmission path is long and transmission loss is likely to increase. However, when the input/output signals of the fourth electronic component 34 are transmitted via the flexible wiring 4 that electrically connects the fourth electronic components 34a and 34b, the path passing through the third electronic components 33a and 33b, the other electronic components 35a and 35b, and the first electronic components 31a and 31b is shortened, making it easier to suppress transmission loss. Therefore, by transmitting the input/output signals of the fourth electronic component 34 via the flexible wiring 4, it is possible to reduce the transmission loss of the wiring structure 1.

In addition, heat generated from the third electronic component 33 and the fourth electronic component 34 is conducted to the flexible wiring body 4. In this case, the heat conducted from the multiple electronic components to the flexible wiring body 4 can be dissipated via the flexible wiring body 4. This can further improve the heat dissipation properties of the wiring structure 1.

<<Wiring portion 411>>
The wiring portion 411, for example, enables electrical connection between each of the multiple fourth electronic components 34 arranged on the third electronic component 33 installed on the substrate 2. The wiring portion 411 may, for example, enable electrical connection between the fourth electronic component 34 arranged on the third electronic component 33 installed on the substrate 2 and the third electronic component 33 or another electronic component.

The flexible wiring body 4 can be arranged by replacing the first electronic component 31 with a stack of multiple electronic components including the third electronic component 33 in the configuration shown in FIG. 20, and the second electronic component 32 with the fourth electronic component 34. The flexible wiring body 4 is stacked in multiple sheets and interposed between the third electronic component 33 and the fourth electronic component 34, and is electrically connected to the fourth electronic component 34. That is, heat generated from the third electronic component 33 and the fourth electronic component 34 is conducted to the multiple flexible wiring bodies 4. Therefore, the heat conducted from the multiple electronic components to the flexible wiring body 4 can be dispersed by heat transfer between the multiple flexible wiring bodies 4. This can further improve the heat dissipation of the wiring structure 1. Note that the electronic component connected to the fourth electronic component 34 is not limited to the third electronic component 33, and may be, for example, the fourth electronic component 34, another electronic component shown in FIG. 1, or a connector shown in FIG. 6.

According to this embodiment, the flexible wiring body 4 is interposed between the third electronic component 33 and the fourth electronic component 34, and is electrically connected to the fourth electronic component 34. Therefore, input/output signals of the fourth electronic component 34 are transmitted via the flexible wiring body 4. This makes it possible to reduce the transmission loss of the wiring structure 1.

In addition, according to this embodiment, the flexible wiring body 4 is interposed between the third electronic component 33 and the fourth electronic component 34, and is electrically connected to the fourth electronic component 34. That is, heat generated from the third electronic component 33 and the fourth electronic component 34 is conducted to the flexible wiring body 4. Therefore, heat conducted from multiple electronic components to the flexible wiring body 4 can be dissipated via the flexible wiring body 4. This can further improve the heat dissipation properties of the wiring structure 1.

In addition, according to this embodiment, the flexible wiring body 4 is stacked in multiple sheets and interposed between the third electronic component 33 and the fourth electronic component 34, and is electrically connected to the fourth electronic component 34. That is, heat generated from the third electronic component 33 and the fourth electronic component 34 is conducted to the multiple flexible wiring bodies 4. Therefore, the heat conducted from the multiple electronic components to the flexible wiring body 4 can be dispersed by heat transfer between the multiple flexible wiring bodies 4. This can further improve the heat dissipation properties of the wiring structure 1.

Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims.

1 Wiring structure 2 Substrate (printed wiring board)
31 First electronic component 310 Conductor portion 311 Active element 312 Wiring portion 313 Molded portion 314 Conductor portion 32 Second electronic component 320 Conductor portion 33 Third electronic component 330 Conductor portion 331 Active element 332 Wiring portion 333 Molded portion 334 Conductor portion 34 Fourth electronic component 35 Other electronic component 4 Flexible wiring body 40 Substrate 41 Conductor portion 411 Wiring portion 412 Connection point 413 Connection point 414 Connection point 43 Covering layer 51 Conductor portion 52 Conductor portion 53 Conductor portion 54 Conductor portion 55 Spacer 56 Base portion 57 Pin 58 Pin 59 Conductor portion 60 Connector 61 Hole 63 Conductor portion 65 Conductor portion 66 Conductor portion 67 Auxiliary wiring portion 670 Conductor portion 674 Conductor portion 68 Heat transfer portion 7 Housing

The wiring structure of an electronic component according to a first invention is characterized in that a flexible wiring body having a conductive wiring portion formed thereon is arranged at a distance from the substrate on a surface of a first electronic component including an active element that is installed on a substrate and electrically connected to the substrate, on a surface of a heat transfer portion provided above the active element and on a surface of a protrusion that protrudes in a direction different from the height direction of a side surface below the active element , the wiring portion in the flexible wiring body being thermally connected to the first electronic component on the surface of the heat transfer portion and electrically connected to the surface of the protrusion, and the first electronic component outputs a signal via the substrate and the flexible wiring body to another electronic component that is installed on the substrate and electrically connected to the substrate and is directly and electrically connected to the wiring portion in the flexible wiring body .

The wiring structure of an electronic component according to a second invention is characterized in that, in the first invention, a second electronic component is placed on top of the first electronic component via the flexible wiring body, and the wiring portion of the flexible wiring body is electrically connected to the second electronic component.

The wiring structure of an electronic component according to a third invention is characterized in that, in the first or second invention, the flexible wiring body is stacked over a plurality of sheets, and the wiring portion of each flexible wiring body is electrically connected to one of the first electronic components.

The wiring structure of an electronic component according to a fourth invention is characterized in that, in the second invention, the flexible wiring body is stacked over multiple sheets, and the wiring portion of each flexible wiring body is electrically connected to one of the second electronic components.

The wiring structure of an electronic component according to the fifth invention is characterized in that, in the first or second invention, the wiring portion of the flexible wiring body electrically connects two or more electronic components mounted on one of the substrates, or electrically connects two or more electronic components mounted on each of the two or more substrates.

The wiring structure of an electronic component according to the sixth aspect of the present invention is characterized in that, in the first or second aspect of the present invention, the wiring portion in the flexible wiring body is formed in each layer of a conductor portion arranged in two or more layers in the flexible wiring body.

A method for connecting electronic components according to a seventh aspect of the present invention includes the steps of: providing a flexible wiring body having conductive wiring portions formed on a surface of a first electronic component including an active element that is installed on a substrate and electrically connected to the substrate, the flexible wiring body being spaced from the substrate such that the wiring portions in the flexible wiring body and the first electronic component are thermally connected on the surface of the heat transfer portion and electrically connected on the surface of the protrusion ; and the first electronic component outputs a signal, via the substrate and the flexible wiring body, to another electronic component that is installed on the substrate and electrically connected to the substrate and that is also directly and electrically connected to the wiring portion in the flexible wiring body .

According to the first to sixth inventions, the flexible wiring body is disposed on the surface of the heat transfer portion and on the surface of the protruding portion at a distance from the substrate, and is thermally connected to the first electronic component on the surface of the heat transfer portion and electrically connected to the first electronic component on the surface of the protruding portion. Therefore, input/output signals of the first electronic component are transmitted through the flexible wiring body. This makes it possible to reduce transmission loss in the wiring structure. In addition, heat generated from the first electronic component is conducted to the flexible wiring body. Therefore, it is possible to easily dissipate heat conducted from the first electronic component to the flexible wiring body into the space between the substrate and the flexible wiring body. This makes it possible to improve the heat dissipation properties of the wiring structure. Furthermore, heat is further easily conducted from the first electronic component to the flexible wiring body. This makes it possible to improve the heat dissipation properties of the wiring structure.

In particular, according to the first to sixth aspects of the present invention, the first electronic component can output a signal to one other electronic component via the substrate and the flexible wiring. This makes it possible to reduce transmission loss without requiring improvements to the substrate. This makes it possible to reduce the cost of the wiring structure while reducing the transmission loss of the wiring structure.

In particular, according to the second aspect of the present invention, the flexible wiring body is interposed between the first electronic component and the second electronic component and is electrically connected to the second electronic component. Therefore, input/output signals of the second electronic component are transmitted via the flexible wiring body. This makes it possible to further reduce transmission loss in the wiring structure.

According to the second invention, the flexible wiring body is interposed between the first electronic component and the second electronic component and is electrically connected to the second electronic component. That is, heat generated from the first electronic component and the second electronic component is conducted to the flexible wiring body. Therefore, heat conducted to the flexible wiring body from the multiple electronic components can be dissipated via the flexible wiring body. This can further improve the heat dissipation properties of the wiring structure.

In particular, according to the third aspect of the present invention, a plurality of flexible wiring bodies are stacked and electrically connected to one first electronic component. That is, heat generated from the first electronic component is conducted to the plurality of flexible wiring bodies. Therefore, compared to a case where a plurality of flexible wiring bodies are not stacked, the heat conducted to the flexible wiring body can be dispersed by heat transfer between the plurality of flexible wiring bodies. This can further improve the heat dissipation property of the wiring structure.

In particular, according to the fourth aspect of the present invention, a plurality of flexible wiring bodies are stacked and interposed between the first electronic component and the second electronic component, and are electrically connected to the second electronic component. That is, heat generated from the first electronic component and the second electronic component is conducted to the plurality of flexible wiring bodies. Therefore, the heat conducted from the plurality of electronic components to the flexible wiring body can be dispersed by heat transfer between the plurality of flexible wiring bodies. This can further improve the heat dissipation property of the wiring structure.

In particular, according to the fifth aspect of the present invention, the flexible wiring electrically connects electronic components on the same substrate or electronic components mounted on two or more substrates, allowing more freedom in selecting the layout of electronic components to be connected by the flexible wiring, thereby further improving the heat dissipation of the wiring structure.

In particular, according to the sixth aspect of the present invention, the wiring portion of the flexible wiring body is formed in each of two or more layers of the conductor portion. Therefore, it is easier to reduce transmission loss compared to when multiple flexible wiring bodies each having a single layer of wiring portion are used. This makes it possible to further reduce the transmission loss of the wiring structure.

According to the seventh invention, the flexible wiring body is arranged on the surface of the heat transfer portion and on the surface of the protruding portion at a distance from the substrate, and is thermally connected to the first electronic component on the surface of the heat transfer portion and electrically connected to the first electronic component on the surface of the protruding portion. Therefore, input/output signals of the first electronic component are transmitted through the flexible wiring body. This makes it possible to provide an electronic component including a wiring structure with reduced transmission loss. In addition, heat generated from the first electronic component is conducted to the flexible wiring body. Therefore, it is possible to easily dissipate heat conducted from the first electronic component to the flexible wiring body into the space between the substrate and the flexible wiring body. This makes it possible to provide an electronic component including a wiring structure with improved heat dissipation. Furthermore, heat is further easily conducted from the first electronic component to the flexible wiring body. This makes it possible to provide an electronic component including a wiring structure with improved heat dissipation.

Claims (9)

a flexible wiring body having a conductive wiring portion formed thereon is disposed at a distance from the substrate on a surface of a heat transfer portion provided above the active element and on a surface of a protruding portion protruding in a direction different from a height direction on a side surface below the active element, the flexible wiring body being disposed at a distance from the substrate, the flexible wiring body having a conductive wiring portion formed thereon;
a wiring portion of the flexible wiring body that is thermally connected to the first electronic component on a surface of the heat transfer portion and electrically connected to the first electronic component on a surface of the protrusion. 2. The wiring structure of electronic components according to claim 1, wherein the first electronic component is mounted on the substrate and electrically connected to the substrate via the substrate and the flexible wiring body, and outputs a signal to another electronic component that is directly and electrically connected to a wiring portion in the flexible wiring body. A second electronic component is disposed on the first electronic component via the flexible wiring body;
3. The wiring structure of an electronic component according to claim 1, wherein the wiring portion of the flexible wiring body is electrically connected to the second electronic component. The flexible wiring body is laminated in a plurality of layers,
3. The wiring structure for electronic components according to claim 1, wherein the wiring portion of each flexible wiring body is electrically connected to one of the first electronic components. The flexible wiring body is laminated in a plurality of layers,
4. The wiring structure for electronic components according to claim 3, wherein the wiring portion of each flexible wiring body is electrically connected to one of the second electronic components. 3. The wiring structure of electronic components according to claim 1 or 2, wherein the wiring portion of the flexible wiring body electrically connects two or more electronic components mounted on one of the substrates, or electrically connects two or more electronic components mounted on each of the two or more substrates. 3. The wiring structure of an electronic component according to claim 1, wherein the wiring portion of the flexible wiring body is formed in each layer of conductor portions arranged in two or more layers in the flexible wiring body. a first electronic component including an active element that is mounted on a substrate and electrically connected to the substrate, the first electronic component having a conductive wiring portion formed on a surface of the first electronic component, the conductive wiring portion being formed on a surface of a heat transfer portion that is provided above the active element and on a surface of a protrusion that is protruding in a direction different from the height direction of a side surface below the active element, the first electronic component being disposed away from the substrate such that the wiring portion of the flexible wiring portion and the first electronic component are thermally connected on the surface of the heat transfer portion and electrically connected on the surface of the protrusion. 9. The method for connecting electronic components according to claim 8, wherein the first electronic component outputs a signal to another electronic component that is placed on the substrate and electrically connected to the substrate via the substrate and the flexible wiring, and that is directly and electrically connected to a wiring portion in the flexible wiring.

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