JP2018206987A - Application device and airflow control unit - Google Patents

Abstract

To provide an application device capable of suppressing the deposition of a coating liquid to the side and rear surfaces of the substrate resulting from the coating liquid infiltrating into the side and rear surfaces of the substrate without using a complicated structure and preventing particles from being generated due to the deposit, and an airflow control unit used for the application device.SOLUTION: An application device 100 comprises: a holding part 1 for holding a substrate W; a supply mechanism 6 for supplying a coating liquid on the substrate W; a rotary drive part 50 for rotating the holding part 1; an upper plate 11 arranged through a space from a peripheral edge portion C of the substrate W; a lower plate 12 arranged to face the lower surface of the upper plate 11; a first flow passage 10 formed between the upper plate 11 and the lower plate 12 and having an introduction port 13 and an exhaust port 15; a blade 7 arranged to face the upper surface of the upper plate 11; a second flow passage 20 formed between the blade 7 and the upper plate 11; and an airflow control part 5 rotatably arranged integrally with the holding part 1 in the outer periphery of the substrate W.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a coating apparatus and an airflow control unit.

Conventionally, the coating device provided with the airflow control unit is known (refer patent document 1). The airflow control unit includes an upper plate, a lower plate integrally fixed to the upper plate, a radial channel formed between the upper plate and the lower plate, and a discharge port located at an end of the radial channel. And.
Such a coating apparatus applies a coating solution such as a photoresist to the substrate by centrifugal force while rotating the substrate. The coating liquid flows around the lower surface of the upper plate through the gap of the airflow control unit, and is discharged from the discharge port by the action of centrifugal force and air flowing through the radial flow path while sticking to the lower surface of the upper plate due to surface tension. . Thereby, adhesion of the coating liquid to the back surface of the substrate due to the coating solution flowing around to the back surface side of the substrate is suppressed.

JP 2011-14588 A

In recent years, there has been a strict requirement to reduce the generation of particles due to photoresist residue on the substrate. Specifically, when a coating liquid such as a resist adheres to the side surface of the substrate and is dried, it remains on the side surface of the substrate as a deposit. Thereafter, for example, when the substrate is transported, particles are generated when the deposits are separated from the substrate or the deposits are destroyed. In order to prevent the generation of such particles, it is required to suppress adhesion of the coating liquid to the side surface of the substrate, which is caused by the coating liquid flowing around the side surface of the substrate.
However, the coating apparatus disclosed in Patent Document 1 has a problem that such a request cannot be satisfied.

As a function required for a coating apparatus, it is required to be able to freely adjust the film thickness of a coating solution applied on a substrate. For example, there is a demand for a coating apparatus that can not only reduce the thickness of the coating solution applied on the substrate by high-speed rotation but also increase the thickness of the coating solution applied on the substrate by low-speed rotation. In other words, there is a demand for a coating apparatus that has a high degree of freedom in the number of rotations and can freely adjust the film thickness of the coating solution.
However, the coating apparatus disclosed in Patent Document 1 has a problem in that adhesion of the coating liquid to the substrate cannot be suppressed at a low speed rotation of 1200 rpm or less.

  The present invention has been made in consideration of such circumstances, and without using a complicated configuration, the coating liquid adheres to the side surface and back surface of the substrate due to the coating solution flowing around the side surface and back surface of the substrate. An object of the present invention is to provide a coating apparatus that can suppress and prevent the generation of particles due to the deposits, and an airflow control unit used in the coating apparatus.

  In order to solve the above problems, a coating apparatus according to a first aspect of the present invention includes a holding unit that holds a substrate, a supply mechanism that supplies a coating liquid onto the substrate held by the holding unit, and the holding A rotation driving unit that rotates a portion, an upper plate that is disposed through a gap from a peripheral portion of the substrate that is held by the holding unit, a lower plate that is opposed to the lower surface of the upper plate, and the upper plate Formed between the lower plate and the first flow path having the inlet and the outlet, the blade disposed opposite to the upper surface of the upper plate, and formed between the blade and the upper plate And an airflow control unit arranged to be rotatable integrally with the holding unit on the outer periphery of the substrate.

  In the coating apparatus according to the first aspect of the present invention, the blade includes a blade lower surface facing the upper surface of the upper plate, a tip portion located near the peripheral portion of the substrate, and extends from the tip portion. And an inclined surface inclined at an acute angle with respect to the lower surface of the blade.

  An airflow control unit according to a second aspect of the present invention is an airflow control unit used in the coating apparatus according to the first aspect, and includes an upper plate, a lower plate disposed to face a lower surface of the upper plate, A first flow path formed between the upper plate and the lower plate and having an inlet and an outlet, a blade disposed opposite to the upper surface of the upper plate, and between the blade and the upper plate And a second flow path formed in the.

  In the airflow control unit according to the second aspect of the present invention, the blades extend from the blade lower surface facing the upper surface of the upper plate, the tip portion, and the tip portion, and have an acute angle with respect to the blade lower surface. And may have an inclined surface inclined at.

  According to the above aspect of the present invention, the coating liquid is applied onto the substrate from the supply mechanism, and the holding unit that holds the substrate is rotated by driving the rotation driving unit. At this time, the coating liquid flows from the substrate toward the outer peripheral side of the airflow control unit (airflow control unit), and an air flow is generated above the coating liquid. Since the flow velocity of air in the second flow path formed between the blades and the upper plate is increased, the fluidity of the coating liquid that flows with the air in the second flow path is promoted. For this reason, it can suppress that a coating liquid wraps around the side surface of a board | substrate, and adheres. Moreover, it can also suppress that a coating liquid adheres to the back surface of a board | substrate.

It is sectional drawing which shows schematic structure of the coating device and airflow control unit which concern on embodiment of this invention. It is a figure for demonstrating the effect | action of the coating device and airflow control unit which concern on embodiment of this invention, Comprising: It is an expanded sectional view which shows the location shown with the code | symbol A of FIG. It is a table | surface which shows the experimental result explaining the Example of this invention. It is a table | surface which shows the experimental result explaining the Example of this invention. It is a figure explaining the Example of this invention, Comprising: It is a figure explaining the height between a board | substrate and a blade | wing, and the distance between the edge part of an upper board, and the front-end | tip part of a blade | wing. It is a figure explaining the Example of this invention, Comprising: It is a figure explaining the shape of a blade | wing.

Hereinafter, configurations of the coating apparatus and the airflow control unit according to the present embodiment will be described with reference to FIGS. 1 and 2.
In each drawing used for explanation of the present embodiment, the scale of each member is appropriately changed in order to make each member a recognizable size.

(Coating device)
The coating apparatus according to the present embodiment is an apparatus that applies a coating solution such as a photoresist to a substrate by centrifugal force while rotating the substrate (processed plate).
As shown in FIG. 1, the coating apparatus 100 includes, for example, a holding head 1 (holding unit) that holds the substrate W, a rotation driving unit 50 that rotates the holding head 1, and a resist solution 31 (coating solution) on the substrate W. ) And an airflow control unit 5 (airflow control unit) that is rotatably arranged integrally with the holding head 1 on the outer periphery of the substrate W.

  The holding head 1 holds the substrate W mechanically or by vacuum suction, and can be rotated by driving the rotation driving unit 50. The holding head 1 can be moved up and down by a lifting mechanism (not shown). Accordingly, when the substrate W is loaded into the coating apparatus 100 and when the substrate W is unloaded from the coating apparatus 100, the holding head 1 can move up and down to deliver the substrate W.

The rotation drive unit 50 is configured by a motor or the like, and diffuses the coating liquid supplied by the supply mechanism 6 on the substrate W using centrifugal force.
The dispenser 6 includes a pipe 2 connected to a resist solution tank (not shown) and a pump for pumping the resist solution, and a nozzle 4 attached to the tip of the pipe 2.
The substrate W is a mask substrate for photolithography for forming a fine circuit pattern, and for example, a square glass substrate is used.

(Airflow control unit)
As shown in FIG. 2, the airflow control unit 5 has substantially the same thickness as the thickness of the substrate W.
The airflow control unit 5 includes an upper plate 11 (resist adsorption blade), a lower plate 12, and a blade 7 (airflow adjustment blade). A first flow path 10 is formed between the upper plate 11 and the lower plate 12. A second flow path 20 is formed between the blade 7 and the upper plate 11.

  The upper plate 11 is disposed via a gap 33 from the peripheral edge C of the substrate W held by the holding head 1. Specifically, a corner portion 11 c (end portion) having a sharp tip is formed on the portion of the upper plate 11 facing the substrate W, and the corner portion 11 c is formed on the side surface Ws of the substrate W via the gap 33. Are arranged opposite to each other. The upper surface 11 a of the upper plate 11 is provided to be horizontal at substantially the same height as the upper surface of the substrate W. Specifically, in the example shown in FIG. 2, a corner portion 11 c is formed by an inclined surface extending obliquely downward from the upper surface 11 a of the upper plate 11 and an inclined surface extending obliquely upward from the lower surface 11 b of the upper plate 11. Has been.

  Here, in the case where the corner portion 11c having a sharp tip is not formed, that is, in the case where a parallel surface facing and parallel to the side surface Ws is formed at the end portion of the upper plate 11, the gap 33 is vertical. It is formed between the side surface Ws and the plane so as to extend downward in the direction. In such a shape, when the resist reaches the upper portion of the gap 33 (the portion between the upper end portion of the upper surface of the upper plate 11 and the upper end portion of the upper surface of the substrate W), the resist is moved into the gap 33 by capillary action. The resist flows toward the lower side of the substrate W through the gap 33. Further, the resist flows toward the back surface of the substrate W. For this reason, when the corner portion 11c is not formed, the resist adheres to the side surface Ws and the back surface of the substrate W, and the generation of particles due to the resist residue cannot be suppressed. In particular, as the area of the region facing the side surface Ws on the parallel surface increases, the capillary phenomenon is more likely to occur, and more resist adheres to the side surface Ws of the substrate W.

On the other hand, in the present embodiment, since the corner portion 11c having a sharp tip is formed in the portion of the upper plate 11 facing the substrate W, the capillary phenomenon as described above hardly occurs, and the capillary phenomenon. This prevents the resist from adhering to the side surface Ws.
Note that the shape of the corner 11c is not limited to the example shown in FIG. For example, a corner may be formed at the end of the lower surface 11b by intersecting an inclined surface extending obliquely downward from the upper surface 11a of the upper plate 11 and the lower surface 11b. Moreover, a corner | angular part may be formed in the edge part of the upper surface 11a because the inclined surface extended diagonally upward from the lower surface 11b of the upper board 11 and the upper surface 11a cross | intersect.
Moreover, the edge part of the upper board 11 which opposes the side surface Ws may be formed in the shape (for example, semicircle shape) which has roundness.

  The lower plate 12 is disposed so as to face the lower surface 11 b of the upper plate 11. The lower plate 12 may be in contact with the side surface Ws of the substrate W, or a predetermined gap may be provided between the lower plate 12 and the side surface Ws of the substrate W.

  The blade 7 is disposed to face the upper surface 11 a of the upper plate 11. Specifically, the blade 7 includes a blade lower surface 7b that faces the upper surface 11a of the upper plate 11, a tip portion P located near the peripheral edge C of the substrate W, and extends from the tip portion P and extends to the blade lower surface 7b. And an inclined surface 7a inclined at an acute angle. Here, the acute angle is, for example, 45 degrees. In the present embodiment, since the substrate W is a square glass substrate, the inclined surface 7a extends in the direction along the side of the glass substrate, that is, in the depth direction of the paper surface of FIG. The blade 7 has a blade upper surface 7c connected to the inclined surface 7a. The blade upper surface 7c is parallel to the blade lower surface 7b.

The outer shape of the upper plate 11, the outer shape of the lower plate 12, and the outer shape of the blade 7 are substantially the same in plan view (viewed from the vertical direction of the substrate W), but the shape of the blade 7 can be adjusted as appropriate. For example, the outer shape of the blade 7 may be slightly smaller than the outer shape of the upper plate 11.
The material of the upper plate 11, the lower plate 12, and the blades 7 is, for example, resin. As the resin material, PEEK, PP, PVDF or the like is used. A metal material can also be selected. In this case, for example, aluminum and its alloys, stainless steel, and the like can be given.

Among the materials described above, the PEEK material is preferably used because it is a material having strength even if it is thin. Although the weight is larger than that of the PEEK material, it is also possible to use a metal material such as aluminum and its alloy or stainless steel for the blade 7. In addition, when the material which deform | transforms with the wind pressure which arises with rotation of the board | substrate W is used for the blade | wing 7, the below-mentioned effect obtained by the blade | wing 7 will fluctuate | variate.
In consideration of the total weight of the upper plate 11, the lower plate 12, and the blades 7, the lower plate 12 may be formed of metal if there is no problem as a function of the coating apparatus 100. Aluminum, stainless steel or the like is used as the metal material.

  The material of the upper plate 11 is preferably a resin material rather than a metal material. When a resin material is used as the material of the upper plate 11, the resist solution 31 smoothly flows through the flow path surface, which is the upper surface 11 a of the upper plate 11, so that the resist solution 31 is efficiently discharged to the outer peripheral side of the airflow control unit 5. Can do. The material of the upper plate 11 is not necessarily a resin. For example, a metal is used, and a resin processing such as fluorine may be performed on the surface of the metal.

  The upper plate 11, the lower plate 12, and the blades 7 are fixed by a fixing unit (not shown). The fixing portion is provided at a position that does not affect the fluidity of the gas flowing in the first flow path 10 and the gas or liquid flowing in the second flow path 20. The fixing part is configured by a known structure such as screwing, adhesive, ultrasonic bonding or the like. The first flow path 10 is formed by fixing the upper plate 11 and the lower plate 12. The second flow path 20 is formed by fixing the upper plate 11 and the blades 7. In the second flow path 20, the upper surface 11 a of the upper plate 11 is configured as a flow path surface through which a resist solution mainly flows.

  The first flow path 10 includes an introduction port 13, a discharge port 15, a side direction flow path 16, and a radial flow path 17. The introduction port 13 opens toward the rotation direction of the substrate W, that is, opens at the end of the airflow control unit 5 in the depth direction of the paper surface of FIG. The side direction flow path 16 is provided so as to be substantially parallel to one side of the substrate W held by the holding head 1 in a plan view. The radial flow path 17 communicates with the side direction flow path 16 and extends from the side direction flow path 16 toward the outer peripheral side of the airflow control unit 5. In the cross-sectional view shown in FIG. 2, the number of the radial flow paths 17 is one, but a plurality of radial flow paths 17 are provided in the airflow control unit 5 in plan view. The plurality of radial flow paths 17 extend radially from the center of the substrate W held by the holding head 1, that is, radially outward from the center of rotation.

The bottom surface 17a (the upper surface of the lower plate 12) of the radial flow channel 17 is an inclined surface in which the height h of the radial flow channel 17 increases from the inner side of the airflow control unit 5 toward the outer peripheral side. Thereby, the radial flow path 17 is formed so that the flow-path cross-sectional area of the radial flow path 17 increases as it goes to the outer peripheral side of the airflow control unit 5.
For example, the radial flow having an inclined surface is compared to the case where the bottom surface 17a is a horizontal surface, not an inclined surface, and the width of the radial flow path 17 in the rotation direction is simply increased toward the outer peripheral side of the airflow control unit 5. In the path 17, the increasing rate of the flow path cross-sectional area in the direction toward the outer peripheral side of the airflow control unit 5 can be increased. Thereby, when the substrate W and the airflow control unit 5 are rotated, the pressure loss of the gas effectively acts on the radial flow path 17, and the air can be easily discharged from the discharge port 15.

Next, the operation of the coating apparatus 100 configured as described above will be described.
A resist solution 31 is supplied from the dispenser 6 onto the substrate W held by the holding head 1. The dispenser 6 may discharge the resist solution 31 onto the substrate W while the holding head 1 rotates the substrate W by driving the rotation driving unit 50, or the dispenser 6 has finished discharging the resist solution 31 onto the substrate W. Thereafter, the rotation of the substrate W may be started.

  As the holding head 1 rotates the substrate W, the resist solution 31 diffuses on the substrate W due to centrifugal force. The resist solution 31 flows into the second flow path 20 from the peripheral edge C of the substrate W due to centrifugal force and surface tension, diffuses along the upper surface 11 a of the upper plate 11, and toward the outer peripheral side of the airflow control unit 5. To flow.

  At this time, air flows above the resist solution 31 as the resist solution 31 flows from the substrate W toward the outer periphery of the airflow control unit 5. Specifically, when the air flows from the substrate W toward the outer peripheral side of the airflow control unit 5, the air F <b> 2 that flows below the tip portion P of the blade 7 and the upper side of the tip portion P of the blade 7 Flowing air F3 is generated.

The air F <b> 2 flows in the second flow path 20 and is discharged from the outer peripheral side of the airflow control unit 5. Since no projection or the like is formed in the second flow path 20, the air F2 flows in parallel to the blade lower surface 7b and the upper surface 11a.
On the other hand, the air F3 is generated when the air flowing from the substrate W toward the airflow control unit 5 collides with the inclined surface 7a. The air F3 flows toward the upper side of the blade 7 along the inclined surface 7a, and further, the air F3 flows toward the outside of the blade 7 on the blade upper surface 7c.
In other words, when the resist solution 31 flows in the first flow path 10 from the substrate W toward the outer peripheral side of the airflow control unit 5, the blade 7 flows the air flowing above the resist solution 31 into two flows. It can be said that it is divided.

  Comparing the air F2 and the air F3, the flow velocity of the air F2 flowing in the second flow path 20 without collision with the protrusions is larger than the flow velocity of the air F3 generated by the collision with the inclined surface 7a. For this reason, the fluidity | liquidity of the resist liquid 31 which flows with the air F2 in the 2nd flow path 20 is accelerated | stimulated. The resist solution 31 does not enter the first flow path 10 through the gap 33, and the resist solution 31 does not adhere to the side surface Ws of the substrate W. Further, the resist solution 31 does not adhere to the back surface of the substrate W.

  On the other hand, in the first flow path 10, air flows from the introduction port 13 into the side flow path 16 as the substrate W rotates. The air F <b> 1 passes through the side flow path 16 and the radial flow path 17 and is discharged from the discharge port 15 to the outside of the airflow control unit 5.

As described above, the coating apparatus 100 according to the present embodiment has a simple structure in which the airflow control unit 5 including the blades 7 is used without using a complicated configuration such as a solvent discharge mechanism or a vacuum suction mechanism. Thus, it is possible to suppress the resist solution 31 from flowing around and adhering to the side surface Ws of the substrate W. In addition, the resist solution 31 can be prevented from adhering to the back surface of the substrate W. As a result, generation of particles due to the residue of the resist solution 31 on the side surface Ws and the back surface of the substrate W can be prevented.
Further, as described above, since the effect obtained by forming the corner portion 11 c at the end of the upper plate 11 and the effect obtained by the blades 7 are obtained synergistically, it is caused by the residue of the resist solution 31. The effect of preventing the generation of particles can be further enhanced.

  Further, as will be described in an example described later, even when the coating apparatus 100 is driven at a low speed rotation of 1200 rpm or less, adhesion of the resist solution 31 to the side surface Ws and the back surface of the substrate W can be suppressed. . That is, it is possible to provide a coating apparatus 100 that can not only obtain the above-described effects, but also has a high degree of freedom in the number of rotations and can freely adjust the film thickness of the coating solution.

Next, an embodiment of the present invention will be described with reference to FIGS.
3 and 4 show examples A1 to A9, B1 to B9, and Comparative Examples A1, A2, B1, and B2, which will be described later, a resist solution is applied to the substrate, and the rotation speed of the substrate is 500 rpm to 1600 rpm. The result of evaluating whether or not the resist solution remains on the side surface of the substrate is shown. Two types of resist solutions were prepared. FIG. 3 shows a case where IP3500 (viscosity 2.0 cp) is used as a resist solution, and FIG. 4 shows a case where PBS (viscosity 17.0 cp) is used as a resist solution.

(Evaluation method)
3 and 4, the symbol “◯” (good) indicates the result that the resist solution did not adhere to the side surface of the substrate. The symbol “Δ” (impossible) indicates the result that the resist solution locally adheres to the side surface of the substrate. The symbol “x” (defective) indicates the result that the amount of the resist solution attached to the side surface of the substrate is large.

(Comparative Examples A1, B1)
In Comparative Examples A1 and B1, a “no jig” coating apparatus is used. Specifically, a coating apparatus that does not include the airflow control unit 5 described in the above embodiment is used.

(Comparative Examples A2, B2)
In Comparative Examples A2 and B2, a “improving jig only” coating apparatus is used. Specifically, the airflow control unit disclosed in Patent Document 1 is used, but the airflow control unit is not provided with the blades 7.

(Examples A1 to A9, B1 to B9)
In Examples A1 to A9 and B1 to B9 shown in FIGS. 3 and 4, the coating apparatus 100 including the airflow control unit 5 described in the above embodiment is used. The following three conditions are changed as conditions of the airflow control unit 5.
(Condition 1) Height between substrate and blade (0.8 mm, 1.0 mm, 1.2 mm, 2.0 mm)
(Condition 2) Distance between the end of the upper plate and the tip of the blade (0.5 mm, 1.0 mm, 1.2 mm)
(Condition 3) Shape of blade (shape shown in FIGS. 6A to 6C)

Here, “(condition 1) height between the substrate and the blade” means a height H from the upper surface of the substrate W to the lower surface 7b of the blade, as shown in FIG.
Next, “(Condition 2) The distance between the end of the upper plate and the tip of the blade” refers to the corner 11c (end) of the upper plate 11 and the blade as shown in FIG. 7 means a distance D between the front end portion P of 7.
Next, as “(condition 3) blade shape”, a shape in which an inclined surface is not formed (see FIG. 6A), a shape in which an inclined surface 7d is formed (see FIG. 6B), The shape (refer FIG.6 (c)) in which the inclined surface 7a was formed was employ | adopted.
An inclined surface 7 d shown in FIG. 6B faces the upper surface 11 a of the upper plate 11 and faces the second flow path 20. The inclined surface 7d is different from the inclined surface 7a of the above embodiment.
On the other hand, the inclined surface 7a shown in FIG. 6C is the same as the inclined surface 7a of the above embodiment.
Below, the numerical value of height H, the numerical value of distance D, and the shape of a blade | wing are demonstrated about each of Examples A1-A9 and B1-B9.

(Examples A1, B1: Installation of blade upper stage)
In Examples A1 and B1, the height H was set to 2.0 mm, the distance D was set to 0 mm, and FIG. 6A was adopted as the blade shape. Here, “distance D is 0 mm” means that the side surface position of the blade 7 and the side surface position of the upper plate 11 coincide with each other when viewed from the vertical direction.

(Example A2, B2: blade upper stage shape change)
In Examples A2 and B2, the height H was set to 2.0 mm, the distance D was set to 0 mm, and FIG. 6B was adopted as the blade shape.

(Example A3, B3: blade upper stage shape change)
In Examples A3 and B3, the height H was set to 2.0 mm, the distance D was set to 0 mm, and FIG. 6C was adopted as the blade shape.

(Example A4, B4: + height condition 1)
In Examples A4 and B4, the height H was set to 0.8 mm, the distance D was set to 0 mm, and FIG. 6C was adopted as the blade shape.

(Example A5, B5: + height condition 2)
In Examples A5 and B5, the height H was set to 1.0 mm, the distance D was set to 0 mm, and FIG. 6C was adopted as the blade shape.

(Example A6, B6: + height condition 3)
In Examples A6 and B6, the height H was set to 1.2 mm, the distance D was set to 0 mm, and FIG. 6C was adopted as the blade shape.

(Examples A7 and B7: + distance 1 (+ height condition 2))
In Examples A7 and B7, the height H was set to 1.0 mm, the distance D was set to 0.5 mm, and the blade shape shown in FIG.

(Examples A8, B8: + distance 2 (+ height condition 2))
In Examples A8 and B8, the height H was set to 1.0 mm, the distance D was set to 1.0 mm, and FIG. 6C was adopted as the blade shape.

(Examples A9, B9: + distance 3 (+ height condition 2))
In Examples A9 and B9, the height H was set to 1.0 mm, the distance D was set to 1.2 mm, and FIG. 6C was adopted as the blade shape.

(Evaluation results)
The following points became clear from FIG. 3 and FIG.
(Result 1)
In the case of Comparative Examples A1 and B1, it was revealed that the amount of the resist solution attached to the side surface of the substrate was large at all rotation speeds.
(Result 2)
In the case of Comparative Example A2, the resist solution did not adhere to the side surface of the substrate at a rotational speed exceeding 1200 rpm, but it was clear that the resist solution locally adhered to the side surface of the substrate at the rotational speed of 1120 to 1200 rpm. became. It was revealed that the resist solution adhered to the side surface of the substrate was large at a rotational speed lower than 1120 rpm.
(Result 3)
In the case of Comparative Example B2, the resist solution did not adhere to the side surface of the substrate at a rotational speed exceeding 1380 rpm, but it was clear that the resist solution locally adhered to the side surface of the substrate at a rotational speed of 1360 to 1380 rpm. became. It was revealed that the resist solution adhered to the side surface of the substrate was large at a rotational speed lower than 1360 rpm.

(Result 4)
In the case of Examples A1 to A9, it was revealed that the resist solution did not adhere to the side surface of the substrate at a lower rotation speed (for example, 1000 rpm) than in Comparative Example A2. Moreover, it became clear by adjusting the said conditions 1-3 that a resist liquid does not adhere to the side surface of a board | substrate, even if it is rotation speed lower than 1000 rpm.
(Result 5)
In the case of Examples B1 to B9, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed (for example, 1200 rpm) than in Comparative Example B2. Moreover, it became clear by adjusting the said conditions 1-3 that a resist liquid does not adhere to the side surface of a board | substrate even if it is rotation speed lower than 1200 rpm.

(Result 6)
When focusing on the shape of the blades, in particular, when comparing Example A1 (FIG. 6A), Example A2 (FIG. 6B), and Example A3 (FIG. 6C), Example A1 In Example A2, the resist solution does not adhere to the side surface of the substrate at a rotational speed exceeding 940 rpm. In Example A3, the resist solution does not adhere to the side surface of the substrate. In Example A3, the resist liquid does not adhere to the side surface of the substrate. It became clear that the liquid did not adhere to the side surface of the substrate. From this, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed by using the blade having the inclined surface 7a shown in FIG.

(Result 7)
When attention is paid to the shape of the blade, in particular, when comparing Example B1 (FIG. 6A), Example B2 (FIG. 6B), and Example B3 (FIG. 6C), Example B1 Then, the resist solution does not adhere to the side surface of the substrate at a rotational speed exceeding 1160 rpm, the resist solution does not adhere to the side surface of the substrate at a rotational speed exceeding 1200 rpm in Example B2, and the resist solution at a rotational speed exceeding 1060 rpm in Example B3. It became clear that the liquid did not adhere to the side surface of the substrate. From this, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed by using the blade having the inclined surface 7a shown in FIG.

(Result 8)
When attention is paid to the height H, when comparing Example A4 (H = 0.8 mm), Example A5 (H = 1.0 mm), and Example A6 (H = 1.2 mm), Example A4 In Example A5, the resist solution does not adhere to the side surface of the substrate at a rotational speed exceeding 800 rpm. In Example A5, the resist liquid does not adhere to the side surface of the substrate. In Example A6, the resist liquid does not adhere to the side surface of the substrate. It became clear that the liquid did not adhere to the side surface of the substrate. From this, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed by setting the height H to 1.0 mm.

(Result 9)
When attention is paid to the height H, when comparing Example B4 (H = 0.8 mm), Example B5 (H = 1.0 mm), and Example B6 (H = 1.2 mm), Example B4 In Example B5, the resist solution does not adhere to the side surface of the substrate at a rotational speed exceeding 1040 rpm. In Example B5, the resist liquid does not adhere to the side surface of the substrate. In Example B6, the resist liquid does not adhere to the side surface of the substrate. It became clear that the liquid did not adhere to the side surface of the substrate. From this, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed by setting the height H to 1.0 mm.

(Result 10)
When paying attention to the distance D, when comparing Example A7 (D = 0.5 mm), Example A8 (D = 1.0 mm), and Example A9 (D = 1.2 mm), in Example A7, The resist solution does not adhere to the side surface of the substrate at a rotation speed exceeding 740 rpm, the resist solution does not adhere to the side surface of the substrate at a rotation speed exceeding 680 rpm in Example A8, and the resist solution at a rotation speed exceeding 760 rpm in Example A9 It has become clear that does not adhere to the side surface of the substrate. From this, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed by setting the distance D to 1.0 mm. In particular, among the examples A1 to A9, it has become clear that by adopting the configuration of the example A8, it is possible to prevent the resist solution from adhering to the side surface of the substrate even at a low rotational speed.

(Result 11)
When paying attention to the distance D, when comparing Example B7 (D = 0.5 mm), Example B8 (D = 1.0 mm), and Example B9 (D = 1.2 mm), in Example B7, The resist solution does not adhere to the side surface of the substrate at a rotation speed exceeding 960 rpm, the resist solution does not adhere to the side surface of the substrate at a rotation speed exceeding 900 rpm in Example B8, and the resist solution at a rotation speed exceeding 1000 rpm in Example B9 It has become clear that does not adhere to the side surface of the substrate. From this, it became clear that the resist solution does not adhere to the side surface of the substrate at a lower rotational speed by setting the distance D to 1.0 mm. In particular, among the examples B1 to B9, it was clarified that by adopting the configuration of the example B8, it is possible to prevent adhesion of the resist solution to the side surface of the substrate even at a low rotation speed.

  While preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the invention and should not be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

  The present invention suppresses adhesion of the coating liquid to the side surface and back surface of the substrate due to the coating solution flowing around the side surface and back surface of the substrate without using a complicated configuration, and generation of particles due to the adhered matter Can be widely applied to a coating apparatus and an airflow control unit.

  DESCRIPTION OF SYMBOLS 1 Holding head (holding part), 2 Piping, 4 Nozzle, 5 Air flow control part (Air flow control unit), 6 Dispenser (supply mechanism), 7 blade | wing, 7a, 7d Inclined surface, 7b Blade lower surface, 7c Blade upper surface, 10 1st 1 channel, 11 upper plate, 11a upper surface, 11b lower surface, 11c corner, 12 lower plate, 13 inlet, 15 outlet, 16 side channel, 17 radial channel, 17a bottom surface, 20 second channel, 31 resist solution (coating solution), 33 gap, 50 rotation drive unit, 100 coating device, C peripheral portion, D distance, F1, F2, F3 air, P tip, W substrate, Ws side surface.

Claims (4)

A coating device,
A holding unit for holding the substrate;
A supply mechanism for supplying a coating liquid onto the substrate held by the holding unit;
A rotation drive unit for rotating the holding unit;
Formed between the upper plate disposed via a gap from the peripheral portion of the substrate held by the holding portion, the lower plate opposed to the lower surface of the upper plate, and the upper plate and the lower plate A first flow path having an introduction port and a discharge port, a blade disposed opposite to the upper surface of the upper plate, and a second flow channel formed between the blade and the upper plate. An airflow control unit arranged to be rotatable integrally with the holding unit on the outer periphery of the substrate;
A coating apparatus comprising:   The blade has a blade lower surface facing the upper surface of the upper plate, a tip portion located near the peripheral portion of the substrate, and extends from the tip portion and is inclined at an acute angle with respect to the blade lower surface. The coating apparatus of Claim 1 which has an inclined surface. An airflow control unit used in the coating apparatus according to claim 1,
An upper plate, a lower plate disposed opposite to the lower surface of the upper plate, a first flow path formed between the upper plate and the lower plate and having an inlet and an outlet, and the upper plate An airflow control unit comprising: a blade disposed opposite to the upper surface of the first airflow path; and a second flow path formed between the blade and the upper plate.   The said blade | wing has a blade | wing lower surface facing the said upper surface of the said upper board, a front-end | tip part, and the inclined surface which inclines at an acute angle with respect to the said wing | blade lower surface while extending from the said front-end | tip part. Airflow control unit.

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